Light transmission device for optical measuring instrument, and semiconductor processing apparatus

Abstract

A light transmission device (2) for an optical measuring instrument (3), and a semiconductor processing apparatus (100), the light transmission device (2) comprising: an adapter assembly (21), used for being mounted in an upper space (141) of a coil box (14) of the semiconductor processing apparatus (100), the adapter assembly (21) being used for converting light output by the optical measuring instrument (3) in a first direction (X) into light propagating in a second direction (Y), and the first direction (X) and the second direction (Y) forming an included angle (a); and a light-shielding component (24), used for being mounted in a lower space (142) of the coil box (14) and arranged between the adapter assembly (21) and a light-transmitting window (17) located at the top of a process chamber (101) of the semiconductor processing apparatus (100), the light-shielding component (24) being provided with a light transmission channel (241) extending in the second direction (Y), and two ends of the light transmission channel (241) being respectively opposite to an outlet end of the adapter assembly (21) and the light-transmitting window (17).

Description

Optical measuring instrument light transmission device and semiconductor processing equipment Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a light transmission device for an optical measuring instrument and semiconductor processing equipment. Background Technology

[0002] With the rapid development of integrated circuits, chip size is constantly decreasing, etching process steps are increasing, and the requirements for the processing precision of semiconductor processes and the degree of control over the process are also getting higher and higher. This requires the use of real-time monitoring methods to control the key steps in the process.

[0003] The Interferometer Endpoint (IEP) in an Endpoint Detection (EPD) system uses a laser to detect changes in the thickness of a transparent thin film. The etching endpoint is determined when the thickness change stops. The IEP works by reflecting light perpendicularly onto the film surface. As the film thins during etching, the optical path difference between the two reflected beams changes. When the film thickness reaches a specific value, interference characteristics at a specific wavelength are observed in the timing signal.

[0004] However, in the prior art, the IEP is directly mounted above the nozzle at the top of the process chamber and surrounded by a coil (e.g., a three-dimensional spiral coil). Since the mounting structure used to mount the IEP is generally made of metal, the coil located above the chamber will be loaded with radio frequency power during the process, which makes the above mounting structure easy to be damaged by the high temperature of the radio frequency environment. Summary of the Invention

[0005] This application aims to solve at least one of the technical problems existing in the prior art, and proposes a light transmission device for an optical measuring instrument and a semiconductor processing equipment, which can avoid damage to components due to installation in a high-temperature environment, and at the same time ensure the normal transmission of radio frequency energy.

[0006] To achieve the purpose of this application, a light transmission device for an optical measuring instrument is provided, applied to semiconductor processing equipment, comprising:

[0007] An adapter assembly is installed in the upper space of the coil box of the semiconductor processing equipment, the adapter assembly being used to convert light output from the optical measuring instrument along a first direction into light propagating along a second direction; the first direction and the second direction form an angle; and

[0008] A light-shielding component is installed in the lower space of the coil box and disposed between the adapter assembly and the light-transmitting window located at the top of the process chamber of the semiconductor processing equipment. The light-shielding component has a light transmission channel extending along the second direction, with the two ends of the light transmission channel facing the outlet end of the adapter assembly and the light-transmitting window, respectively.

[0009] In some embodiments, the adapter assembly has a steering channel for transmitting light, the inlet end of the steering channel being disposed opposite to the light output end of the optical measuring instrument, and the outlet end of the steering channel being disposed opposite to the light transmission channel;

[0010] The steering channel is provided with a reflective component to convert light rays propagating in the steering channel along the first direction into light rays propagating in the second direction.

[0011] In some embodiments, the adapter assembly includes a channel component and a fixing component, wherein the steering channel is disposed on the channel component and an opening is formed on the outer surface of the channel component, the reflective component is disposed on the outer surface of the channel component, and the reflective surface of the reflective component is exposed in the steering channel through the opening;

[0012] The fixing component is provided at the opening, and a limiting groove is provided on the surface of the fixing component opposite to the opening, and at least a portion of the reflecting component is disposed in the limiting groove.

[0013] In some embodiments, the surface of the channel component opposite to the light output end of the optical measuring instrument is further provided with a positioning groove for accommodating part of the optical measuring instrument.

[0014] In some embodiments, the first direction is parallel to the horizontal plane; the first direction is perpendicular to the second direction.

[0015] In some embodiments, the optical transmission device further includes:

[0016] An adjustment structure is fixedly connected to the adapter assembly. The adjustment structure is used to mount the optical measuring instrument to the adapter assembly and is configured to adjust the direction of the light output by the optical measuring instrument.

[0017] In some embodiments, the adjustment structure includes a fixed bracket, a movable component, and at least three adjustment parts, wherein the fixed bracket is fixedly connected to the adapter assembly and is located on the side of the adapter assembly adjacent to the light output end of the optical measuring instrument;

[0018] The movable component is connected to the fixed bracket via at least three of the adjustment parts, and the movable component is disposed opposite to the fixed bracket. The movable component is provided with a support hole for the optical measuring instrument to pass through.

[0019] At least three of the adjustment portions are located at different positions in the circumferential direction of the support hole, and each adjustment portion is used to adjust the distance between the movable part and the fixed bracket at the location of the adjustment portion.

[0020] In some embodiments, corresponding to each of the adjustment parts, the fixed bracket is provided with a bracket mounting hole and a first threaded hole, and the movable part is provided with a second threaded hole, the second threaded hole being coaxially arranged with the bracket mounting hole;

[0021] Each of the adjustment parts includes a first adjustment screw and a second adjustment screw, wherein the first adjustment screw passes through the bracket mounting hole along the first direction and is threadedly connected to the second threaded hole; by tightening the first adjustment screw, the distance can be reduced; the second adjustment screw is threadedly connected to the first threaded hole along the first direction, and one end of the second adjustment screw abuts against the movable part; by tightening the second adjustment screw, the distance can be increased.

[0022] In some embodiments, the movable component has an outer peripheral surface in the circumferential direction of the support hole, and the movable component has a third threaded hole, one end of which is located on the outer peripheral surface and the other end is located on the hole wall of the support hole;

[0023] The adjustment structure also includes a set screw, which is threaded into the third threaded hole, and one end of the set screw is used to abut against the optical measuring instrument.

[0024] As another technical solution, this application also provides a semiconductor processing equipment, including a process chamber, an upper electrode device and an optical measuring instrument disposed above the process chamber, and the light transmission device provided in this application;

[0025] The upper electrode device includes a coil and a coil box. The coil box is located at the top of the process chamber, and the interior of the coil box is divided into an upper space and a lower space by a conductive shielding plate. The coil is located in the lower space. The optical measuring instrument is located in the upper space. The two ends of the light-shielding component in the light transmission device are respectively connected to the conductive shielding plate and the light-transmitting window. The upper end of the light transmission channel is opposite to the outlet end of the adapter component through a through hole in the conductive shielding plate.

[0026] In some embodiments, the process chamber includes a cavity, an annular support disposed on the top of the cavity, and a dielectric cover supported by the annular support; the coil box is fixedly connected to the annular support and is electrically conductive; the annular support is fixedly connected to the cavity and is electrically conductive; the cavity is grounded.

[0027] In some embodiments, the system further includes an air intake device, which includes a nozzle penetrating the top wall of the process chamber and an air intake component stacked above the nozzle. The nozzle has a first central hole and at least one air intake hole. The air intake component has a second central hole and an air intake channel. The first central hole and the second central hole are coaxially arranged, and the light-transmitting window is disposed between the first central hole and the second central hole. The air intake channel communicates with each of the air intake holes and is used to communicate with an air source.

[0028] In some embodiments, the surfaces of the nozzle and the air intake component facing each other are provided with receiving grooves, and the receiving grooves of the nozzle and the air intake component are joined to form a space for accommodating the light-transmitting window; the bottom surface of the receiving groove forms an angle with the surfaces of the nozzle and the air intake component facing each other.

[0029] In some embodiments, a fixed flange and a nozzle cover are further included, wherein an annular mounting groove is provided on the upper surface of the top wall of the process chamber, the annular mounting groove surrounds the nozzle, and a limiting recess is formed on the inner circumferential surface of the annular mounting groove;

[0030] The fixed flange is annular, and a limiting protrusion is formed on the inner circumferential surface of the fixed flange. The fixed flange is disposed in the annular mounting groove, and the limiting protrusion and the limiting recess are in a limiting fit in the vertical direction.

[0031] The nozzle cover is disposed on the upper surface of the top wall of the process chamber and covers the air intake component therein; the nozzle cover is fixedly connected to the fixed flange to press the air intake component onto the nozzle.

[0032] In some embodiments, the coil is a three-dimensional spiral coil, which surrounds the light-shielding component; the light-shielding component is made of insulating material.

[0033] This application has the following beneficial effects:

[0034] In the light transmission device of the optical measuring instrument provided in this application, the light output by the optical measuring instrument along a first direction can be converted into propagation along a second direction by an adapter component. By aligning the two ends of the light transmission channel in the light-shielding component with the outlet end of the adapter component and the light-transmitting window respectively, the light converted by the adapter component can penetrate the light-transmitting window along the second direction via the light transmission channel and be delivered to the process chamber to achieve the measurement of corresponding parameters. By using the adapter component to convert the direction of the light output by the optical measuring instrument, the optical measuring instrument can output light from a direction different from the direction in which the light penetrates the light-transmitting window (i.e., the second direction). This allows for more flexible design of the installation angle of the optical measuring instrument. Especially in applications where a three-dimensional spiral coil is placed above the process chamber, by placing the adapter component in the upper space of the coil box, damage to the components of the adapter component can be avoided by installing the adapter component in the high-temperature environment of the three-dimensional spiral coil (i.e., the lower space of the coil box). Meanwhile, by setting the optical measuring instrument in the upper space of the coil box horizontally or at an angle, the optical fiber of the optical measuring instrument can be led out from one side of the coil box without bending or with a slight bend, thus eliminating the need to reserve more vertical installation space for the optical fiber. At the same time, the horizontally or at an angle, the optical measuring instrument also reduces its own vertical space occupation, thereby preventing the upper space of the coil box from becoming too large in the vertical direction, thus ensuring the normal transmission of radio frequency energy.

[0035] The semiconductor processing equipment provided in this application, by employing the aforementioned light transmission device, can transmit the light output from the optical measuring instrument to the process chamber, while avoiding damage to the components of the adapter assembly caused by installing the adapter assembly in the high-temperature environment (i.e., the lower space of the coil box) where the three-dimensional spiral coil is located. At the same time, it will not cause the upper space of the coil box to be too large in the vertical direction, thereby ensuring the normal transmission of radio frequency energy. Attached Figure Description

[0036] Figure 1 is an installation structure diagram of the IEP mounting structure used in the relevant technology;

[0037] Figure 2 is an installation cross-sectional view of the IEP mounting structure used in the relevant technology;

[0038] Figure 3 is a cross-sectional view of the upper electrode device with a three-dimensional spiral coil set above the process chamber;

[0039] Figure 4 is a cross-sectional view of the semiconductor processing equipment provided in an embodiment of this application;

[0040] Figure 5 is a cross-sectional view of the light transmission device of the optical measuring instrument provided in the embodiment of this application on a vertical section;

[0041] Figure 6 is an exploded view of the structure of the light transmission device of the optical measuring instrument provided in the embodiment of this application;

[0042] Figure 7 is a structural diagram of the channel component used in the embodiment of this application from one view.

[0043] Figure 8 is a structural diagram of the channel component used in the embodiment of this application from another perspective;

[0044] Figure 9 is a cross-sectional view of the channel component used in the embodiment of this application;

[0045] Figure 10 is a side view of the light transmission device of the optical measuring instrument provided in the embodiment of this application from one angle;

[0046] Figure 11 is a cross-sectional view of the light transmission device of the optical measuring instrument provided in the embodiment of this application on a horizontal section;

[0047] Figure 12 is a structural diagram of the active component used in the embodiment of this application from two perspectives;

[0048] Figure 13 is a structural diagram of the fixed bracket used in the embodiment of this application from two perspectives;

[0049] Figure 14 is a side view of the light transmission device of the optical measuring instrument provided in the embodiment of this application from another perspective;

[0050] Figure 15 is an enlarged view of region I in Figure 4;

[0051] Figure 16 is a structural diagram of the air intake component used in the embodiment of this application from two perspectives;

[0052] Figure 17 is a structural diagram of the nozzle used in the embodiment of this application from two perspectives;

[0053] Figure 18 is a structural diagram of one of the semi-annular flange components in the fixed flange used in the embodiment of this application from two perspectives;

[0054] Figure 19 is an exploded view of the fixed flange, air intake component, and nozzle cover used in the embodiments of this application. Detailed Implementation

[0055] To enable those skilled in the art to better understand the technical solutions of this application, the light transmission device of the optical measuring instrument and the semiconductor processing equipment provided in this application will be described in detail below with reference to the accompanying drawings.

[0056] In related technologies, please refer to Figures 1 and 2 together. The mounting structure for installing an Interferometer Endpoint (IEP) typically includes a mounting bracket 01. This mounting bracket 01 is used to directly fix the IEP above the medium cover 05 on the top of the process chamber. Specifically, the IEP is fixed to the nozzle 02. A light-transmitting window 03 (which can be called the IEP observation window) is provided in the central hole of the nozzle 02. The light output end of the IEP is opposite to the light-transmitting window, so that the light output by the IEP passes through the light-transmitting window 03 at a preset angle to enter the process chamber, and then enters the thin film surface vertically.

[0057] The above-described method of installing an IEP is only applicable to scenarios where a planar coil is placed above the process chamber. This is because, as shown in Figures 1 and 2, the IEP and mounting bracket 01 can be located above the planar coil 06 to avoid damage to components due to high-temperature environments. However, as shown in Figure 3, for scenarios where a three-dimensional spiral coil 11 is placed above the process chamber, if the mounting bracket 01 and installation method of the IEP shown in Figures 1 and 2 are used to install the IEP on the nozzle 12 shown in Figure 3, the IEP and mounting bracket 01 will be surrounded by the three-dimensional spiral coil 11. Since the mounting bracket 01 is generally made of metal, during the process, the three-dimensional spiral coil 11 located above the chamber will be loaded with RF power, making the mounting bracket 01 easily damaged by the excessively high temperature of the RF environment where the three-dimensional spiral coil 11 is located.

[0058] Furthermore, to avoid installing the mounting bracket 01 in the high-temperature environment where the three-dimensional spiral coil 11 is located in Figure 3, although the IEP can be fixed in the space of the connecting strip 15 of the coil box 14 used to connect the matching device 13 and the three-dimensional spiral coil 11, in order for the light output of the IEP to pass through the light-transmitting window 03 at a preset angle to enter the process chamber, the light output end of the IEP faces downwards. At this time, the height of the IEP itself is about 180mm, and the bending radius of the optical fiber 04 needs to be at least 120mm. In this case, in order to have enough space to accommodate the IEP and the optical fiber 04, the height of the space where the connecting strip 15 is located needs to be no less than 300mm. This height will significantly lengthen the RF transmission path, introduce excessive impedance and power loss, and cause the RF power loaded by the matching device 13 onto the three-dimensional spiral coil 11 to be severely attenuated, ultimately affecting the etching rate of the machine. Therefore, the above method of installing the IEP is not suitable for the scenario where the three-dimensional spiral coil 11 is set above the process chamber.

[0059] To address the aforementioned issues, please refer to Figure 4. The light transmission device 2 of the optical measuring instrument 3 provided in this embodiment is applied to a semiconductor processing equipment 100 to transmit the light output from the optical measuring instrument 3 to the process chamber 101 of the semiconductor processing equipment 100 for measuring corresponding parameters. This optical measuring instrument 3 may include an IEP (Integrated Electrode Processor). The working principle of the IEP is as follows: when a laser beam is incident perpendicularly onto the surface of the wafer 103 on the base 102 in the process chamber 101, it is reflected on the upper and lower surfaces of the thin film on the wafer 103. During the etching process, the etched film layer continuously thins, and the optical path difference between the two reflected beams changes accordingly. When the film thickness changes to a specific value, interference characteristics of a specific wavelength are observed in the timing signal. Of course, in practical applications, the light transmission device 2 provided in this embodiment can also be applied to optical measuring instruments 3 with other functions, and the light output from the optical measuring instrument 3 can also enter the process chamber 101 in other directions under the transmission of the light transmission device 2. In practical applications, this direction can be set according to specific needs.

[0060] In some embodiments, the semiconductor processing equipment 100 includes a process chamber 101, an upper electrode device and an optical measuring instrument 3 disposed above the process chamber 101. The upper electrode device includes a coil and a coil housing 14. The coil is, for example, a three-dimensional spiral coil 11, which includes, for example, an inner spiral coil and an outer spiral coil. The coil housing 14 is disposed on the top of the process chamber 101, and the interior of the coil housing 14 is divided into an upper space 141 and a lower space 142 by a conductive shielding plate 16. The three-dimensional spiral coil 11 is disposed in the lower space 142. In addition, a matching device 13 is disposed on the top of the coil housing 14. The three-dimensional spiral coil 11 is electrically connected to an RF power supply (not shown) through the matching device 13. The RF power output by the RF power supply is applied to the three-dimensional spiral coil 11 through the matching device 13, which is used to achieve impedance matching. The two ends of the matching device 13 are electrically connected to one end of the inner spiral coil and one end of the outer spiral coil in the three-dimensional spiral coil 11, respectively, via two connecting strips 15. A portion of the connecting strip 15 is located in the upper space 141, and the other portion is located in the lower space 142. The other ends of the inner spiral coil and the outer spiral coil in the three-dimensional spiral coil 11 are grounded, for example, by being electrically connected to a conductive shielding plate 16.

[0061] Please refer to Figures 4, 5, and 6 together. The light transmission device 2 includes a converter assembly 21 and a light-shielding component 24. The converter assembly 21 is used to be installed in the upper space 141 of the coil box 14 of the semiconductor processing equipment 100. The optical measuring instrument 3 can also be installed in the upper space 141, for example, fixed in the upper space 141 by the converter assembly 21. The converter assembly 21 is used to convert the light output by the optical measuring instrument 3 along the first direction X into light propagating along the second direction Y. The first direction X and the second direction Y form an angle α, which is, for example, 90°. The light-shielding component 24 is used to be installed in the lower space 142 of the coil box 14 and is disposed between the converter assembly 21 and the light-transmitting window 17 located at the top of the process chamber 101. The light-shielding component 24 has a light transmission channel 241 extending along the second direction Y. The two ends of the light transmission channel 241 are respectively opposite to the exit end of the converter assembly 21 for outputting light along the second direction and the light-transmitting window 17.

[0062] In the light transmission device 2 of the optical measuring instrument provided in this application embodiment, the light output by the optical measuring instrument 3 along the first direction X can be converted by the adapter component 21 to propagate along the second direction Y. By making the two ends of the light transmission channel 241 in the light shielding component 24 face the outlet end of the adapter component 21 and the light transmission window 17 respectively, the light after the direction is converted by the adapter component 21 can pass through the light transmission channel 24 along the second direction Y through the light transmission window 17 and be delivered to the process chamber 101 to realize the measurement of the corresponding parameters. By using the adapter component 21 to convert the direction of the light output from the optical measuring instrument 3, the optical measuring instrument 3 can output light from a direction different from the direction of light penetration through the light window 17 (i.e., the second direction Y). This allows for more flexible design of the installation angle of the optical measuring instrument 3. This is especially useful for applications where a three-dimensional spiral coil is set above the process chamber 101, as shown in Figure 4. By placing the adapter component 21 in the upper space 141 of the coil box 14, damage to the components of the adapter component 21 can be avoided by installing the adapter component 21 in the high-temperature environment (i.e., the lower space 142 of the coil box 14) where the three-dimensional spiral coil 11 is located. Meanwhile, by setting the optical measuring instrument 3 in the upper space 141 of the coil box 14 horizontally or at an angle, the optical fiber 31 of the optical measuring instrument 3 can be led out from one side of the coil box 14 without bending or with slight bending, thus eliminating the need to reserve more vertical installation space for the optical fiber 31. At the same time, the horizontally or at an angle, the optical measuring instrument 3 also reduces its own vertical space occupation, thereby preventing the upper space 141 of the coil box 14 from becoming too large in the vertical direction, thus ensuring the normal transmission of radio frequency energy.

[0063] The adapter component 21 that achieves the above functions can have various structures. For example, the adapter component 21 has a steering channel 23 for transmitting light. The entrance end 23a of the steering channel 23 is arranged opposite to the light output end 32 of the optical measuring instrument 3, and the entrance end 23a abuts against the light output end 32, for example. A reflecting component 22 is provided in the steering channel 23 to convert the light propagating in the steering channel 23 along the first direction X into light propagating along the second direction Y, as shown by the arrow in Figure 5.

[0064] The light output end 32 is the end of the optical measuring instrument 3 used for outputting light. Specifically, as shown in Figures 4 and 5, the optical measuring instrument 3 includes, for example, a measuring instrument body and an optical fiber 31. The measuring instrument body is, for example, cylindrical, with the light output end 32 located at one end of the measuring instrument body along its axial direction, and the optical fiber 31 located at the other end. In this case, the measuring instrument body can be horizontally positioned, with its light output end 32 facing the adapter assembly 21. The light output from the light output end 32 can propagate in the horizontal direction (i.e., the first direction X) and enter the steering channel 23 from the entrance end 23a of the steering channel 23. The optical fiber 31 is located at the end of the measuring instrument body opposite to the adapter assembly 21 and can be led out from the coil box 14 in the horizontal direction. In this way, the optical measuring instrument 3 can occupy less space in the vertical direction, so there is no need to reserve more vertical installation space for the optical fiber 31. At the same time, the horizontally set optical measuring instrument 3 also reduces its own vertical space occupation, thus preventing the upper space 141 of the coil box 14 from being too large in the vertical direction, thereby ensuring the normal transmission of radio frequency energy.

[0065] The outlet end 23b of the deflection channel 23 is arranged opposite to the light transmission channel 241 so that the light output from the outlet end 23b of the deflection channel 23 along the second direction Y can enter the light transmission channel 241 and then propagate to the light transmission window 17 via the light transmission channel 241. The light output from the light transmission channel 241 can penetrate the light transmission window 17 along the second direction Y and enter the process chamber 101.

[0066] In some embodiments, as shown in FIG5, the first direction X is parallel to the horizontal plane, and the second direction Y forms an angle α with the first direction X, such as 90°, that is, the second direction Y and the first direction X are perpendicular to each other. Thus, the light emitted from the outlet end 23b of the deflection channel 23 enters the light transmission channel 241 vertically downwards, allowing the light to pass through the light-transmitting window 17 and vertically enter the film surface. It should be noted that the angle between the second direction Y and the light-transmitting window 17 can be 90° or less than 90°; for example, the second direction Y is parallel to the vertical direction, while the light-transmitting window 17 is inclined relative to the horizontal plane.

[0067] Specifically, by aligning the entrance end 23a of the deflection channel 23 with the light output end 32 of the optical measuring instrument 3, the light output from the light output end 32 of the optical measuring instrument 3 can enter the deflection channel 23 along the first direction X via the entrance end 23a. The light entering the deflection channel 23 can be redirected from its original propagation direction along the first direction X to propagation along the second direction Y under the reflection of the reflecting member 22, and then output via the exit end 23b before entering the light-shielding member 24. The angle α between the second direction Y and the first direction X is the same as the angle between the incident and reflected light rays of the reflecting member 22.

[0068] The light-shielding component 24 is, for example, a light-shielding barrel with open ends, the interior of which is the light transmission channel 241. The light output from the outlet end 23b of the turning channel 23 can be transmitted to the light-transmitting window 17 along the second direction Y through the light transmission channel 241 in the light-shielding component 24. For applications where the three-dimensional spiral coil 11 is set above the process chamber 101, in order to avoid installing the optical measuring instrument 3 and the adapter component 21 in the high-temperature environment of the three-dimensional spiral coil 11 (i.e., the lower space 142 of the coil box 14), the optical measuring instrument 3 and the adapter component 21 can be installed in the space of the connecting strip 15 of the coil box 14 used to connect the matching device 13 and the three-dimensional spiral coil 11 (i.e., the upper space 141 of the coil box 14). Based on this, the light-shielding component 24 can be inserted through the high-temperature environment of the three-dimensional spiral coil 11 to allow the light to pass through the high-temperature environment of the three-dimensional spiral coil 11 to reach the light-transmitting window 17, while avoiding the influence of the glow during RF ignition on the light. In this case, the light-shielding component 24 is made of an insulating material, such as a ceramic with a high breakdown voltage.

[0069] In some embodiments, referring to Figures 6 to 9, the adapter assembly 21 includes a channel component 211 and a fixing component 212. A deflection channel 23 is disposed on the channel component 211, and an opening 223 is formed on the outer surface of the channel component 211. A reflective component 22 is disposed on the outer surface of the channel component 211, and the reflective surface 221 of the reflective component 22 (as shown in Figure 6) is exposed in the deflection channel 23 through the opening 223. The fixing component 212 covers the opening 223, and a limiting groove is provided on the surface of the fixing component 212 opposite to the opening 223. At least a portion of the reflective component 22 is disposed in the limiting groove. The opening 223 is located at the position in the deflection channel 23 where light needs to be deflected. By providing this opening 223, the reflective surface 221 of the reflective component 22 can be exposed in the deflection channel 23, thereby reflecting the passing light to convert the light propagating in the deflection channel 23 along the first direction X into light propagating along the second direction Y. Based on this, the reflective component 22 can be confined at the opening 223 by means of the limiting groove of the fixing component 212. Furthermore, the combined use of the channel component 211 and the fixing component 212 makes it easier to install and remove the reflective component 22. The reflective surface 221 of the reflective component 22 is, for example, a mirror.

[0070] Further, in some embodiments, as shown in FIG9, the outer surface of the channel component 211 includes a first surface 218 and a second surface 220 at an angle d, which is, for example, equal to an angle a, specifically 90°; the first surface 218 is disposed opposite to the light output end 32 of the optical measuring instrument 3; the second surface 220 is disposed opposite to the light transmission channel 241; the channel component 211 also has a third surface 222, which forms an angle c with the direction parallel to the second surface 220 and an angle b with the direction parallel to the first surface 218. Furthermore, the turning channel 23 includes a first sub-channel 231 and a second sub-channel 232, wherein the first sub-channel 231 extends along a first direction X and the second sub-channel 232 extends along a second direction Y; one end of the first sub-channel 231 is the inlet end 23a and is located on the first surface 218, the other end of the first sub-channel 231 is connected to one end of the second sub-channel 232, and the other end of the second sub-channel 232 is the outlet end 23b and is located on the second surface 220; the ends of the first sub-channel 231 and the second sub-channel 232 that are connected to each other form an opening 223 on the third surface 222.

[0071] In this configuration, when the reflective component 22 is placed on the third surface 222, the angle of the reflective surface 221 of the reflective component 22 can be limited. That is, the reflective surface 221 of the reflective component 22 is parallel to the third surface 222. Thus, based on the principle of light refraction, when light rays traveling along the first direction X through the first sub-channel 231 are incident on the reflective surface 221, the reflected light rays will travel along the second direction Y through the second sub-channel 232 and finally exit from the outlet end 23b along the second direction Y. Therefore, the reflective component 22 can convert light rays propagating along the first direction X in the first sub-channel 231 into light rays propagating along the second direction Y in the second sub-channel 232. Furthermore, by limiting the angle of the reflective surface 221 of the reflective component 22 by the third surface 222, the desired angle can be obtained simply by placing the reflective component 22 on the third surface 222, thereby facilitating the installation of the reflective component 22.

[0072] In a specific embodiment, as shown in Figures 4, 5, and 9, the light-transmitting window 17 is disposed at the top of the process chamber 101. In order to allow the optical fiber 31 to be led out from one side of the coil box 14 without bending or with slight bending, the optical measuring instrument 3 is horizontally disposed, so that the optical fiber 31 can be led out horizontally from one side of the coil box 14. In this case, the entrance end 23a of the turning channel 23 is disposed opposite to the light output end 32 of the optical measuring instrument 3, and the first direction X is parallel to the horizontal plane; the included angle a is 90°, and the included angle c between the third surface 222 and the direction parallel to the second surface 220 and the included angle b between the third surface 222 and the direction parallel to the first surface 218 are both 45°. Specifically, the first sub-channel 231 is horizontally arranged, the second sub-channel 232 is vertically arranged, the third surface 222 forms a 45° angle with the extension direction of the first sub-channel 231, the opening 223 is arranged at the connection between the first sub-channel 231 and the second sub-channel 232, the reflective component 22 is placed on the third surface 222, and its reflective surface 221 forms a 45° angle with the extension direction of the first sub-channel 231, and is exposed to the first sub-channel 231 and the second sub-channel 232 through the opening 223.

[0073] It should be noted that the embodiments of this application are not limited to setting the light-transmitting window 17 at the top of the process chamber 101. In practical applications, it can also be set at the side or bottom of the process chamber 101 according to specific needs. The first direction X and the second direction Y can be determined according to the angle of the light-transmitting window 17, as long as light can pass through the light-transmitting window 17 at a preset angle to enter the process chamber 101.

[0074] Furthermore, in some embodiments, to facilitate the relative arrangement of the entrance end 23a of the turning channel 23 and the light output end 32 of the optical measuring instrument 3, a positioning groove 219 is provided on the surface of the channel component 211 opposite to the light output end 32 of the optical measuring instrument 3 (i.e., the first surface 218) for accommodating a portion of the optical measuring instrument 3. With the help of the positioning groove 219, when installing the optical measuring instrument 3, the relative position of the light output end 32 of the optical measuring instrument 3 and the entrance end 23a of the turning channel 23 can be defined by extending a portion of the optical measuring instrument 3 into the positioning groove 219, thereby simplifying the installation.

[0075] In some embodiments, as shown in FIG10, the light transmission device 2 further includes an adjustment structure 25, which is fixedly connected to the adapter assembly 21. The adjustment structure 25 is used to mount the optical measuring instrument 3 to the adapter assembly 21 and is configured to adjust the direction of the light output by the optical measuring instrument 3 so that it is consistent with the target direction (i.e., the set first direction X). In addition, the optical measuring instrument 3 can be mounted on the adapter assembly 21 by means of the adjustment structure 25, thereby fixing the optical measuring instrument 3 so as to assemble the optical measuring instrument 3 and the adapter assembly 21 into a whole.

[0076] The adjustment structure 25 that achieves the above functions can have various structures. For example, as shown in Figures 6, 10, and 11, the adjustment structure 25 includes a fixed bracket 251, a movable component 252, and at least three adjustment parts 253. The fixed bracket 251 is fixedly connected to the adapter assembly 21 and is located on the side of the adapter assembly 21 adjacent to the light output end 32 of the optical measuring instrument 3, that is, on the side where the entrance end 23a of the steering channel 23 is located. The movable component 252 is connected to the fixed bracket 251 through at least three adjustment parts 253, and the movable component 252 is arranged opposite to the fixed bracket 251, as shown in Figure 12. The movable component 252 is provided with a support hole 252a for the optical measuring instrument 3 to pass through. The at least three adjustment parts 253 are distributed at different positions in the circumferential direction of the support hole 252a, and each adjustment part 253 is used to adjust the distance between the movable component 252 and the fixed bracket 251 at the position of the adjustment part 253.

[0077] Specifically, the fixed bracket 251 and the adapter assembly 21 can be detachably fixed together using fasteners such as screws. In embodiments where the adapter assembly 21 includes a channel component 211 and a fixed component 212, as shown in Figures 6 to 10, a mounting portion 214 is provided on the top of the surface (i.e., the first surface 218) where the inlet end 23a of the turning channel 23 of the channel component 211 is located. This mounting portion 214 is, for example, a plate-shaped protrusion that protrudes from the first surface 218 in a direction perpendicular to the first surface 218. The mounting portion 214 is provided with a fixing hole 215, and as shown in Figure 13, a corresponding threaded hole 251a is provided on the fixed bracket 251. As shown in Figure 6, the adjustment structure 25 also includes a fastening screw 216, which passes through the fixing hole 215 on the mounting portion 214 and is threadedly connected to the threaded hole 251a on the fixed bracket 251, thereby fixing the fixed bracket 251 to the mounting portion 214. The fastening screw 216 is, for example, a countersunk screw, and the fixing hole 215 is, for example, a countersunk hole. With the help of the mounting portion 214, the fixing bracket 251 can be positioned opposite to the surface (i.e., the first surface 218) where the entrance end 23a of the turning channel 23 of the channel component 211 is located, maintaining a certain distance to provide sufficient space for the installation of the movable component 252 and at least three adjusting portions 253. Further, in some embodiments, as shown in Figures 6 and 9, to facilitate the installation of the fixing bracket 251, a positioning pin 217 is also provided on the mounting portion 214, and as shown in Figure 13, a corresponding positioning hole 251b is provided on the fixing bracket 251. When installing the fixing bracket 251, the positioning pin 217 can be inserted into the positioning hole 251b to define the relative position of the fixing bracket 251 and the mounting portion 214. For example, there are two positioning pins 217, located on both sides of the aforementioned fixing hole 215; correspondingly, the number of positioning holes 251b is the same as the number of positioning pins 217, and they are coaxially arranged in a one-to-one correspondence.

[0078] As shown in Figure 14, at least three adjustment parts 253 are distributed at different positions on the circumference of the support hole 252a (i.e., around the optical measuring instrument 3). Each adjustment part 253 is used to adjust the distance between the movable part 252 and the fixed bracket 251 at the position of the adjustment part 253. In other words, the distance between the movable part 252 and the fixed bracket 251 can be adjusted at at least three different positions, thereby enabling the adjustment of the parallelism of the movable part 252 relative to the fixed bracket 251. Specifically, the optical measuring instrument 3 is inserted into the support hole 252a of the movable component 252. The light output end 32 of the optical measuring instrument 3 is perpendicular to the axis of the support hole 252a. The axis of the support hole 252a is perpendicular to the surface of the movable component 252 relative to the fixed bracket 251. In this case, by adjusting the parallelism of the movable component 252 relative to the fixed bracket 251, the axis of the support hole 252a can be adjusted, thereby adjusting the angle of the optical measuring instrument 3 to adjust the direction of the light output by the optical measuring instrument 3. This ensures that the direction of the light output by the optical measuring instrument 3 is consistent with the target direction (i.e., the set first direction X).

[0079] Furthermore, in some embodiments, as shown in FIG13, the aforementioned fixed bracket 251 is, for example, an "L"-shaped plate, i.e., composed of two mutually perpendicular strip plates, while the movable component 252 is, for example, a rectangular plate with a chamfered bevel at one corner, as shown in FIG10 and FIG11. The "L"-shaped plate and the rectangular plate are arranged opposite each other along the first direction X, and the "L"-shaped plate is located on the side of the rectangular plate away from the channel component 211. Of course, the embodiments of this application are not limited to this. In practical applications, the "L"-shaped plate can also be located on the side of the rectangular plate closer to the channel component 211. As shown in FIG14, there are three adjustment parts 253. One adjustment part 253 is located at a position corresponding to the middle position of the "L"-shaped plate, and the other two adjustment parts 253 are respectively located at positions corresponding to the two ends of the "L"-shaped plate. By adopting an "L"-shaped flat plate, the aforementioned movable component 252 can avoid the optical measuring instrument 3 that passes through the support hole 252a of the movable component 252, thus avoiding interference with the installation of the optical measuring instrument 3.

[0080] In some embodiments, as shown in Figures 6 to 9, the channel component 211 includes, for example, an integrally formed first plate, a second plate, and a channel body. The first plate and the second plate form an angle equal to the included angle α. The first plate has the first surface 218, and the second plate has the second surface 220. The channel body is disposed between the first plate and the second plate, and together with the first plate and the second plate, forms a turning channel 23. Furthermore, in embodiments where the mounting portion 214 is a plate-shaped protrusion protruding from the first surface 218 in a direction perpendicular to the first surface 218, this plate-shaped protrusion is integrally formed with the first plate and the second plate, and together they form a Z-shaped plate. As shown in Figures 4 and 8, the second plate has multiple plate mounting holes 224, and the second plate can be mounted on the conductive shielding plate 16 of the coil box 14 by multiple fasteners passing through the multiple plate mounting holes 224.

[0081] The structure of the adjusting part 253, which can adjust the distance between the movable part 252 and the fixed bracket 251 at the location of the adjusting part 253, can be varied. For example, corresponding to each adjusting part 253, as shown in Figure 13, the fixed bracket 251 is provided with a bracket mounting hole 251c and a first threaded hole 251d. As shown in Figure 12, the movable part 252 is provided with a second threaded hole 252c, which is coaxially arranged with the bracket mounting hole 251c. As shown in Figures 11 and 14, each adjusting part 253 includes a first adjusting screw 253a and a second adjusting screw 253b. The first adjusting screw 253a passes through the bracket mounting hole 251c along the first direction X and is threadedly connected to the second threaded hole 252c. Specifically, as shown in Figure 11, the stud of the first adjusting screw 253a passes through the bracket mounting hole 251c from the left side of the fixed bracket 251 along the first direction X and is screwed into the second threaded hole 252c, thereby connecting the fixed bracket 251 and the movable part 252. When it is necessary to adjust the parallelism of the movable part 252 relative to the fixed bracket 251, by tightening the first adjusting screw 253a, that is, by rotating the first adjusting screw 253a in a direction that allows it to be screwed into the second threaded hole 252c, the movable part 252 can be moved towards the fixed bracket 251 relative to the first adjusting screw 253a, thereby reducing the distance between the movable part 252 and the fixed bracket 251 at the location of the adjusting part 253. Since the head of the first adjusting screw 253a abuts against the left side surface of the fixed bracket 251, the first adjusting screw 253a only rotates and does not move along the first direction X, thereby enabling the movement of the movable part 252 relative to the first adjusting screw 253a.

[0082] The second adjusting screw 253b is threaded into the first threaded hole 251d along the first direction X, and one end of the second adjusting screw 253b abuts against the movable part 252. Specifically, as shown in FIG11, the second adjusting screw 253b is screwed into the first threaded hole 251d from the left side of the fixed bracket 251 along the first direction X and abuts against the movable part 252. When it is necessary to adjust the parallelism of the movable part 252 relative to the fixed bracket 251, by tightening the second adjusting screw 253b, that is, by rotating the second adjusting screw 253b in the direction that allows it to be screwed into the first threaded hole 251d, the length of the part of the second adjusting screw 253b extending on the right side of the fixed bracket 251 can be increased, thereby increasing the distance between the movable part 252 and the fixed bracket 251 at the position of the adjusting part 253. Therefore, by using the first adjusting screw 253a and the second adjusting screw 253b in combination, the distance between the movable part 252 and the fixed bracket 251 at the position of the adjusting part 253 can be adjusted, thereby adjusting the parallelism of the movable part 252 relative to the fixed bracket 251. At the same time, the first adjusting screw 253a can be used to achieve a fixed connection between the movable part 252 and the fixed bracket 251.

[0083] Furthermore, in some embodiments, to confine the optical measuring instrument 3 within the support hole 252a and prevent the optical measuring instrument 3 from moving relative to the support hole 252a, as shown in FIG12, the movable component 252 has an outer peripheral surface in the circumferential direction of the support hole 252a, and the movable component 252 is provided with a third threaded hole 252b1, one end of which is located on the outer peripheral surface and the other end is located on the hole wall of the support hole 252a; as shown in FIG6, the adjusting structure 25 also includes a set screw 254, which is threadedly connected to the third threaded hole 252b1, and one end of the set screw 254 is used to abut against the optical measuring instrument 3. With the help of the set screw 254, the optical measuring instrument 3 can be clamped and fixed together with the hole wall of the support hole 252a, thereby confining the optical measuring instrument 3 within the support hole 252a. The third threaded hole 252b1 extends, for example, radially along the support hole 252a. In an embodiment where the fixed bracket 251 is a rectangular plate with a chamfered bevel at one corner, the aforementioned third threaded hole 252b1 can be provided on the chamfered bevel to provide sufficient space for the installation of the set screw 254, while also facilitating the machining of the third threaded hole 252b1.

[0084] As another technical solution, as shown in FIG4, this application embodiment also provides a semiconductor processing equipment 100, including a process chamber 101, an upper electrode device and an optical measuring instrument 3 disposed above the process chamber 101, the optical measuring instrument 3 being, for example, an interferometer endpoint (IEP) measuring instrument, and also including the light transmission device 2 provided in the above application embodiment.

[0085] The upper electrode device includes a coil and a coil box 14. The coil is, for example, a three-dimensional spiral coil 11, which includes an inner spiral coil and an outer spiral coil. The coil box 14 is located at the top of the process chamber 101, and the interior of the coil box 14 is divided into an upper space 141 and a lower space 142 by a conductive shielding plate 16. The three-dimensional spiral coil 11 is located in the lower space 142. The adapter component 21 and the optical measuring instrument 3 in the light transmission device 2 are both located in the upper space 141. The light shielding component 24 in the light transmission device 2 is located in the lower space 142, and the two ends of the light shielding component 24 are respectively connected to the conductive shielding plate 16 and the light-transmitting window 17 at the top of the process chamber 101, as shown in FIG5. The upper end of the light transmission channel 241 is opposite to the outlet end of the adapter component 21 (i.e., the outlet end 23b of the turning channel 23) through the through hole 161 in the conductive shielding plate 16.

[0086] Specifically, the coil box 14 provides a mounting base and housing space for the three-dimensional spiral coil 11 and the light transmission device 2, and can shield the radio frequency inside the coil box 14. With the help of the conductive shielding plate 16, the adapter component 21 and the optical measuring instrument 3 in the light transmission device 2 can be placed in the upper space 141 and the lower space 142 respectively, so as to separate the adapter component 21 and the optical measuring instrument 3 from the three-dimensional spiral coil 11, so that the radio frequency energy loaded on the three-dimensional spiral coil 11 can only be transmitted downwards, while avoiding the installation of the optical measuring instrument 3 and the adapter component 21 in the high temperature environment (i.e., the lower space 142) where the three-dimensional spiral coil 11 is located. In addition, a matching device 13 is provided on the top of the coil box 14. The three-dimensional spiral coil 11 is electrically connected to the radio frequency power supply (not shown in the figure) through the matching device 13. The radio frequency power output by the radio frequency power supply is loaded onto the three-dimensional spiral coil 11 through the matching device 13. The matching device 13 is used to achieve impedance matching. The two ends of the matching device 13 are electrically connected to one end of the inner spiral coil and one end of the outer spiral coil in the three-dimensional spiral coil 11, respectively, via two connecting strips 15. A portion of the connecting strip 15 is located in the upper space 141, and the other portion is located in the lower space 142. The other ends of the inner spiral coil and the outer spiral coil in the three-dimensional spiral coil 11 are grounded, for example, by being electrically connected to a conductive shielding plate 16.

[0087] In some embodiments, the grounding method of the coil box 14 and the conductive shielding plate 16 is as follows: the process chamber 101 includes a cavity 101a, an annular support 104 disposed on the top of the cavity 101a, and a dielectric cover 105 supported by the annular support 104, the dielectric cover 105 being made of ceramic, for example; the coil box 14 is fixedly connected to the annular support 104 and is electrically conductive; the annular support 104 is fixedly connected to the cavity 101a and is electrically conductive; the cavity 101a is grounded. Specifically, the annular support 104 is made of conductive material, which is used to provide a mounting base for the coil box 14, thereby fixing the coil box 14 to the top of the cavity 101a, and also to electrically connect the coil box 14 to the cavity 101a, so that the coil box 14 and the conductive shielding plate 16 can be grounded through the cavity 101a, thereby achieving the above-mentioned radio frequency shielding effect. In addition, in some embodiments, in order to ensure close contact between the two conductive contact surfaces, the conductive contact surface between the coil box 14 and the annular support 104, and the conductive contact surface between the annular support 104 and the cavity 101a are provided with induction coils.

[0088] The material of the aforementioned light-transmitting window 17 is capable of transmitting light output from the optical measuring instrument 3, such as transparent sapphire. In some embodiments, the semiconductor processing equipment 100 further includes an air intake device, as shown in FIG15. The air intake device includes a nozzle 12 penetrating the top wall of the process chamber 101 and an air intake component 310 stacked above the nozzle 12. The nozzle 12 is provided with a first central hole 121 and at least one air intake hole 122. As shown in FIG16, the air intake component 310 is provided with a second central hole 311 and an air intake channel 312. The first central hole 121 and the second central hole 311 are coaxially arranged, and the light-transmitting window 17 is disposed between the first central hole 121 and the second central hole 311. The first central hole 121 and the second central hole 311 are used to form a light channel for light output from the light-shielding component 24 to pass through. The air intake channel 312 communicates with each air intake hole 122 and is used to communicate with an air source. With the help of the nozzle 12 and the air intake component 310, both the installation of the light-transmitting window 17 and air intake can be achieved. In some embodiments, to ensure uniform air intake, there are multiple air intake holes 122, which are evenly distributed around the first central hole 121. In this case, the air intake channel 312 is used to connect the air source to each air intake hole 122. The air intake channel includes, for example, an annular channel surrounding the first central hole 121 to achieve communication with each air intake hole 122.

[0089] In some embodiments, to prevent process gas from igniting in the inlet 122, the ratio of the diameter to the length of each inlet 122 is less than or equal to 1:7.

[0090] In some embodiments, to achieve positioning of the nozzle 12 and the air intake component 310, as shown in Figures 16 and 17, two positioning holes (123, 314) are respectively provided on the opposing surfaces of the nozzle 12 and the air intake component 310, and as shown in Figure 15, positioning pins 320 are provided in the two positioning holes (123, 314). The positioning pins 320 are, for example, corrosion-resistant resin positioning pins.

[0091] In a specific embodiment, as shown in FIG15, a nozzle mounting hole is provided on the upper surface of the medium cover 105. This nozzle mounting hole is a stepped hole, and an annular mounting flange 125 is provided on the outer peripheral surface of the nozzle 12. A retaining ring 33 is provided between the mounting flange 125 and the stepped surface of the stepped hole to form a gap between the lower surface of the mounting flange 125 and the stepped surface of the stepped hole. A first sealing ring 34 is provided in this gap to achieve a seal between the lower surface of the mounting flange and the stepped surface of the stepped hole. Furthermore, a second sealing ring 35 is provided between the opposing surfaces of the nozzle 12 and the air intake component 310, and around all the air intake holes 122, to achieve a seal between the opposing surfaces of the nozzle 12 and the air intake component 310. The retaining ring 33 is, for example, a corrosion-resistant resin retaining ring.

[0092] In some embodiments, as shown in Figures 16 and 17, two receiving grooves (124, 313) are respectively provided on the opposing surfaces of the nozzle 12 and the air intake component 310. The two receiving grooves (124, 313) are joined to form a space for accommodating the light-transmitting window 17. Furthermore, the bottom surfaces of the two receiving grooves (124, 313) are parallel to each other and each forms an angle with the opposing surfaces of the nozzle 12 and the air intake component 310. This angle is, for example, greater than or equal to 3° and less than or equal to 5°. By making the bottom surfaces of the two receiving grooves (124, 313) form an angle with the opposing surfaces of the nozzle 12 and the air intake component 310, the light-transmitting window 17 can be tilted at the aforementioned angle relative to the opposing surfaces of the nozzle 12 and the air intake component 310, ensuring that light is not reflected when passing through the light-transmitting window 17, thereby ensuring the light transmittance of the light-transmitting window 17. Furthermore, in some embodiments, in order to ensure the vacuum resistance of the light-transmitting window 17 and at the same time reduce the light refracted during the process of passing through the light-transmitting window 17, the thickness of the light-transmitting window 17 is, for example, greater than or equal to 3 mm and less than or equal to 5 mm.

[0093] Furthermore, in some embodiments, as shown in FIG15, a third sealing ring 36 is provided between the bottom surface of the receiving groove 124 of the nozzle 12 and the light-transmitting window 17 for sealing the two. The third sealing ring 36 can also buffer the light-transmitting window 17, preventing it from being easily damaged under high tightening force when it directly contacts the nozzle 12. The third sealing ring 36 is, for example, a corrosion-resistant resin sealing ring. A fourth sealing ring 37 is provided between the bottom surface of the receiving groove 313 of the air intake component 310 and the light-transmitting window 17 for sealing the two.

[0094] Furthermore, in some embodiments, as shown in Figures 15, 18, and 19, the semiconductor processing equipment 100 further includes a fixed flange 42 and a nozzle cover 41. An annular mounting groove 151 is provided on the upper surface of the top wall (i.e., the dielectric cover 105) of the process chamber 101, surrounding the nozzle 12, and a limiting recess is formed on the inner circumferential surface of the annular mounting groove 151. The fixed flange 42 is annular, and a limiting protrusion 421 is formed on the inner circumferential surface of the fixed flange 42. The fixed flange 42 is disposed in the annular mounting groove 151, and the limiting protrusion 421 and the limiting recess are vertically positioned in a limiting engagement. The nozzle cover 41 is disposed on the upper surface of the top wall of the process chamber 101 and covers the air intake component 310 therein. The nozzle cover 41 is fixedly connected to the fixed flange 42, for example, by a plurality of fixing screws 43 threaded connection, to press the air intake component 310 onto the nozzle 12. Specifically, the fixed flange 42 is composed of two semi-annular flange parts, which are joined together to form a complete ring for easy installation. Furthermore, to ensure the first to fourth sealing rings are compressed for a sealing effect, the depth of the space covered by the nozzle cover 41 for the intake component 310 is less than or equal to the thickness of the intake component 310. Thus, when the nozzle cover 41 is fixedly connected to the fixed flange 42, the pressure applied by the nozzle cover 41 to the intake component 310 ensures that the lower surface of the intake component 310 is tightly fitted with the upper surface of the nozzle 12, thereby compressing the first to fourth sealing rings. Additionally, a limiting hole is provided on the nozzle cover 41, and a corresponding positioning protrusion 422 is provided on the fixed flange 42. This positioning protrusion 422 engages with the limiting hole to limit the relative position of the nozzle cover 41 and the fixed flange 42.

[0095] In some embodiments, as shown in FIG4, the coil is a three-dimensional spiral coil 11, which surrounds the light-shielding component 24. In this case, by setting the optical measuring instrument 3 horizontally or at an angle, the optical fiber 31 can be led out from one side of the coil box 14 without bending or with slight bending, thus eliminating the need to reserve more vertical installation space for the optical fiber 31. At the same time, the horizontally or at an angle, the optical measuring instrument 3 also reduces its own vertical space occupation. Furthermore, to avoid installing the optical measuring instrument 3 and the adapter component 21 in the high-temperature environment (i.e., the lower space 142) where the three-dimensional spiral coil 11 is located, the optical measuring instrument 3 and the adapter component 21 can be installed in the space (i.e., the upper space 141) of the coil box 14 where the connecting strip 15 for connecting the matching device 13 and the three-dimensional spiral coil 11 is located, without causing the vertical dimension of this space to be too large, thereby ensuring the normal transmission of radio frequency energy. Based on this, the light-shielding component 24 can be inserted into the high-temperature environment (i.e., the lower space 142) where the three-dimensional spiral coil 11 is located, so that light can pass through the high-temperature environment where the three-dimensional spiral coil 11 is located to reach the light-transmitting window 17, while avoiding the influence of the glow during radio frequency ignition on the light. In this case, the light-shielding component 24 is made of insulating material, such as ceramic with a high breakdown voltage.

[0096] The semiconductor processing equipment provided in this application embodiment, by employing the light transmission device described above, can transmit the light output from the optical measuring instrument to the process chamber, while avoiding damage to the components of the adapter assembly caused by installing the adapter assembly in the high-temperature environment (i.e., the lower space of the coil box) where the three-dimensional spiral coil is located. At the same time, it will not cause the upper space of the coil box to be too large in the vertical direction, thereby ensuring the normal transmission of radio frequency energy.

[0097] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this application, and this application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this application, and these modifications and improvements are also considered to be within the scope of protection of this application.

Claims

1. A light transmission device for an optical measuring instrument, applied to semiconductor processing equipment, characterized in that, include: An adapter assembly is installed in the upper space of the coil box of the semiconductor processing equipment. The adapter assembly is used to convert the light output by the optical measuring instrument along a first direction into light propagating along a second direction; the first direction and the second direction form an angle. as well as A light-shielding component is installed in the lower space of the coil box and disposed between the adapter assembly and the light-transmitting window located at the top of the process chamber of the semiconductor processing equipment. The light-shielding component has a light transmission channel extending along the second direction, with the two ends of the light transmission channel facing the outlet end of the adapter assembly and the light-transmitting window, respectively.

2. The optical transmission device according to claim 1, characterized in that, The adapter assembly has a steering channel for transmitting light, the entrance end of the steering channel being positioned opposite to the light output end of the optical measuring instrument, and the exit end of the steering channel being positioned opposite to the light transmission channel. The steering channel is provided with a reflective component to convert light rays propagating in the steering channel along the first direction into light rays propagating in the second direction.

3. The optical transmission device according to claim 2, characterized in that, The adapter assembly includes a channel component and a fixing component, wherein the steering channel is disposed on the channel component and an opening is formed on the outer surface of the channel component, the reflective component is disposed on the outer surface of the channel component, and the reflective surface of the reflective component is exposed in the steering channel through the opening; The fixing component is provided at the opening, and a limiting groove is provided on the surface of the fixing component opposite to the opening, and at least a portion of the reflecting component is disposed in the limiting groove.

4. The optical transmission device according to claim 3, characterized in that, The surface of the channel component opposite to the light output end of the optical measuring instrument is also provided with a positioning groove for accommodating part of the optical measuring instrument.

5. The optical transmission device according to claim 1, characterized in that, The first direction is parallel to the horizontal plane; the first direction and the second direction are perpendicular to each other.

6. The optical transmission device according to any one of claims 1-5, characterized in that, The optical transmission device further includes: An adjustment structure is fixedly connected to the adapter assembly. The adjustment structure is used to mount the optical measuring instrument to the adapter assembly and is configured to adjust the direction of the light output by the optical measuring instrument.

7. The optical transmission device according to claim 6, characterized in that, The adjustment structure includes a fixed bracket, a movable component, and at least three adjustment parts, wherein the fixed bracket is fixedly connected to the adapter assembly and is located on the side of the adapter assembly adjacent to the light output end of the optical measuring instrument; The movable component is connected to the fixed bracket via at least three of the adjustment parts, and the movable component is disposed opposite to the fixed bracket. The movable component is provided with a support hole for the optical measuring instrument to pass through. At least three of the adjustment portions are located at different positions in the circumferential direction of the support hole, and each adjustment portion is used to adjust the distance between the movable part and the fixed bracket at the location of the adjustment portion.

8. The optical transmission device according to claim 7, characterized in that, For each of the adjustment parts, the fixed bracket is provided with a bracket mounting hole and a first threaded hole, and the movable part is provided with a second threaded hole, the second threaded hole being coaxially arranged with the bracket mounting hole; Each of the adjustment parts includes a first adjustment screw and a second adjustment screw, wherein the first adjustment screw passes through the bracket mounting hole along the first direction and is threadedly connected to the second threaded hole; by tightening the first adjustment screw, the distance can be reduced; the second adjustment screw is threadedly connected to the first threaded hole along the first direction, and one end of the second adjustment screw abuts against the movable part; by tightening the second adjustment screw, the distance can be increased.

9. The optical transmission device according to claim 7, characterized in that, The movable component has an outer peripheral surface in the circumferential direction of the support hole, and the movable component has a third threaded hole, one end of which is located on the outer peripheral surface and the other end is located on the hole wall of the support hole. The adjustment structure also includes a set screw, which is threaded into the third threaded hole, and one end of the set screw is used to abut against the optical measuring instrument.

10. A semiconductor processing apparatus, comprising a process chamber, an upper electrode device disposed above the process chamber, and an optical measuring instrument, characterized in that, It also includes the optical transmission device as described in any one of claims 1-9; The upper electrode device includes a coil and a coil box. The coil box is disposed at the top of the process chamber, and the interior of the coil box is divided into an upper space and a lower space by a conductive shielding plate. The coil is disposed in the lower space. The optical measuring instrument is disposed in the upper space; the two ends of the light-shielding component in the light transmission device are respectively connected to the conductive shielding plate and the light-transmitting window, and the upper end of the light transmission channel is opposite to the outlet end of the adapter component through the through hole in the conductive shielding plate.

11. The semiconductor processing equipment according to claim 10, characterized in that, The process chamber includes a cavity, an annular support disposed on the top of the cavity, and a dielectric cover supported by the annular support; the coil box is fixedly connected to the annular support and is electrically conductive; the annular support is fixedly connected to the cavity and is electrically conductive; the cavity is grounded.

12. The semiconductor processing equipment according to claim 10, characterized in that, It also includes an air intake device, which includes a nozzle penetrating the top wall of the process chamber and an air intake component stacked above the nozzle. The nozzle has a first central hole and at least one air intake hole. The air intake component has a second central hole and an air intake channel. The first central hole and the second central hole are coaxially arranged, and the light-transmitting window is disposed between the first central hole and the second central hole. The air intake channel communicates with each of the air intake holes and is used to communicate with an air source.

13. The semiconductor processing equipment according to claim 12, characterized in that, The nozzle and the air intake component have corresponding receiving grooves on their opposing surfaces, and the receiving grooves of the nozzle and the air intake component are joined to form a space for accommodating the light-transmitting window; The bottom surface of the receiving groove forms an angle with the surfaces of the nozzle and the air intake component that are opposite to each other.

14. The semiconductor processing equipment according to claim 12, characterized in that, It also includes a fixed flange and a nozzle cover, wherein an annular mounting groove is provided on the upper surface of the top wall of the process chamber, the annular mounting groove surrounds the nozzle, and a limiting recess is formed on the inner circumferential surface of the annular mounting groove; The fixed flange is annular, and a limiting protrusion is formed on the inner circumferential surface of the fixed flange. The fixed flange is disposed in the annular mounting groove, and the limiting protrusion and the limiting recess are in a limiting fit in the vertical direction. The nozzle cover is disposed on the upper surface of the top wall of the process chamber and covers the air intake component therein; the nozzle cover is fixedly connected to the fixed flange to press the air intake component onto the nozzle.

15. The semiconductor processing equipment according to claim 10, characterized in that, The coil is a three-dimensional spiral coil, which surrounds the light-shielding component; the light-shielding component is made of insulating material.

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