Dental composite with controlled debonding capability using heat and electric field

Abstract

Disclosed herein is a dental composite with controlled debonding capability using heat and electric field. The dental composite includes a resin matrix phase, inorganic fillers, thermo-electric responsive agents, an initiator system, and coupling agents. The resin matrix phase includes an amount of bisphenol A-glycidyl methacrylate (Bis-GMA), an amount of triethylene glycol dimethacrylate (TEGDMA), and an amount of polyethylene glycol dimethacrylate (PEGDMA). The inorganic fillers include an amount of silane-modified silica particles and an amount of barium titanate (BaTiO₃). Thermo-electric responsive agents include an amount of doped polyaniline and an amount of polypyrrole. The initiator system includes an amount of benzoyl peroxide and an amount of camphorquinone. The coupling agents include an amount of γ- Methacryloxypropyltrimethoxysilane.

Description

DENTAL COMPOSITE WITH CONTROLLED DEBONDING CAPABILITY USING HEAT AND ELECTRIC FIELDTECHNICAL FIELD

[0001] The present disclosure relates to dental materials, specifically a composite with controlled debonding capability. It utilizes low voltage and high frequency sensitivity to heat and electric fields, enhancing the detachment of dental restorations while minimizing damage to the tooth structure. The composite is applicable in prosthetic and orthodontic treatments for crowns, laminates, and orthodontic brackets.BACKGROUND ART

[0002] In the field of dentistry, crowns and orthodontic brackets are among the most widely used materials for direct and indirect restorations. However, a significant challenge is the debonding of these restorations when replacement or adjustment is necessary. Traditional debonding methods often result in damage to the tooth structure or increase the time and cost of treatment. Recent research indicates that the use of materials sensitive to heat and electricity can provide an innovative solution to this problem. Some studies have utilized heat-sensitive polymers to reduce adhesion at high temperatures. However, these composites require very high temperatures, which can harm the tooth pulp. Conductive polymers such as polyaniline and polypyrrole have been used as components sensitive to electric fields in various industries. In dentistry, the use of these materials for debonding is still in the early research stages. Most existing methods require complex equipment or harsh environmental conditions. There is a lack of biocompatible materials capable of functioning at low voltages and high frequencies or at temperatures tolerable for the oral environment. This invention focuses on designing a composite that can be controlled for debonding under thermal shock or an electric field, ensuring safe detachment from the tooth surface without causing damage.SUMMARY OF THE DISCLOSURE

[0003] This summary is intended to provide an overview of the subject matter of the present disclosure, and is not intended to identify essential elements or key elements of the subject matter, nor is it intended to be used to determine the scope of the claimed implementations. The proper scope of the present disclosure may be ascertained from the claims set forth below in view of the detailed description below and the drawings.

[0010] According to one or more exemplary embodiments of the present disclosure, a dental composite with controlled debonding capability using heat and electric field is dosclosed. In an exemplary embodiment, the dental composite may include a resin matrix phase, inorganic fillers, thermo-electric responsive agents, an initiator system, and coupling agents. In an exemplary embodiment, the resin matrix phase may include an amount of bisphenol A-glycidyl methacrylate (Bis-GMA), an amount of triethylene glycol dimethacrylate (TEGDMA), and an amount of polyethylene glycol dimethacrylate (PEGDMA).

[0011] Disclosed herein also a method for preparing a dental composite with controlled debonding capability using heat and electric field. In an exemplary embodiment, the method may include steps of preparing a resin matrix, dispersing inorganic fillers in the resin matrix, adding thermo-electric responsive agents to the resin matrix, stirring the resin matrix with the amount of doped polyaniline and the amount of polypyrrole, adding an amount of y-Methacryloxypropyltrimethoxysilane to the resin matrix, and removing air bubbles from the resin matrix by subjecting the resin matrix to a vacuum.

[0012] In an exemplary embodiment, preparing a resin matrix may include preparing an initial matrix by mixing an amount of bisphenol A-glycidyl methacrylate (Bis-GMA), an amount of triethylene glycol dimethacrylate (TEGDMA), and an amount of polyethylene glycol dimethacrylate (PEGDMA) in an ultrasonic bath. In an exemplary embodiment, a temperature of the ultrasonic bath may be between 45°C and 55°C.

[0013] In an exemplary embodiment, preparing a resin matrix may further include adding an amount of benzoyl peroxide and an amount of camphorquinone to the initial matrix. In an exemplary embodiment, a weight percentage of the amount of benzoyl peroxide may be between 1% and 2%. In an exemplary embodiment, a weight percentage of camphorquinone may be between 0.5% and 1%. In an exemplary embodiment, preparing a resin matrix may further include dissolving the amount of benzoyl peroxide and the amount of camphorquinone in the initial matrix by stirring the initial matrix.

[0014] In an exemplary embodiment, dispersing inorganic fillers in the resin matrix may include adding an amount of silane-modified silica particles and an amount of barium titanate (BaTiCh) to the resin matrix. In an exemplary embodiment, a weight percentage of the amount of silane-modified silica particles may be in a range between 40% and 50%. In an exemplary embodiment, a size of the amount of silane-modified silica particles may be in a range between 0.02 microns and 0.07 microns. In an exemplary embodiment, a weight of the amount of barium titanate (BaTiCh) may be in a range between 10% and 15%. In an exemplary embodiment, a size of the amount of barium titanate (BaTiCh) may be in a range between 50 nanometers and 200 nanometers.

[0015] In an exemplary embodiment, dispersing inorganic fillers in the resin matrix may further include mixing the amount of silane-modified silica particles and the amount of barium titanate (BaTiCh) in the resin matrix by using a planetary mixer at a temperature between 55°C and 65°C.

[0016] In an exemplary embodiment, adding thermo-electric responsive agents to the resin matrix may include adding an amount of doped polyaniline to the resin matrix. In an exemplary embodiment, a weight percentage of the amount of doped polyaniline may be in a range between 5% and 10%. In an exemplary embodiment, adding thermo-electric responsive agents to the resin matrix may further include adding an amount of polypyrrole to the resin matrix. In an exemplary embodiment, a weight percentage of the amount of polypyrrole may be in a range between 3% and 5%.

[0017] In an exemplary embodiment, stirring the resin matrix with the amount of doped poly aniline and the amount of polypyrrole may be done at a temperature between 35 °C and 45 °C. In an exemplary embodiment, a weight percentage of the amount of y-Methacryloxypropyltrimethoxy silane may be between 1% and 2%. In an exemplary embodiment, removing air bubbles from the resin matrix by subjecting the resin matrix to a vacuum may be done for a time period between 25 minutes and 35 minutes.BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawing figures depict one or more implementations in accord with the present teachings, by way of example only, not by way of limitation. In the figures, like reference numerals refer to the same or similar elements.

[0019] FIG. 1 illustrates a method 100 for preparing a dental composite with controlled debonding capability using heat and electric field, consistent with one or more exemplary embodiments of the present disclosure.DESCRIPTION OF EMBODIMENTS

[0020] In the following detailed description, numerous specific details are set forth by way of examples in order to provide a thorough understanding of the relevant teachings. However, it should be apparent that the present teachings may be practiced without such details. In other instances, well known methods, procedures, components, and / or circuitry have been described at a relatively high-level, without detail, in order to avoid unnecessarily obscuring aspects of the present teachings.

[0021] The following detailed description is presented to enable a person skilled in the art to make and use the methods and devices disclosed in exemplary embodiments of the present disclosure. For purposes of explanation, specific nomenclature is set forth to provide a thorough understanding of the present disclosure. However, it will be apparent to one skilled in the art that these specific details are not required to practice the disclosed exemplary embodiments. Descriptions of specific exemplary embodiments are provided only as representative examples. Various modifications to the exemplary implementations will be readily apparent to one skilled in the art, and the general principles defined herein may be applied to other implementations and applications without departing from the scope of the present disclosure. The present disclosure is not intended to be limited to the implementations shown, but is to be accorded the widest possible scope consistent with the principles and features disclosed herein.

[0022] Disclosed herein is a dental composite with controlled debonding capability using heat and electric field. In an exemplary embodiment, the dental composite may include a resin matrix phase. In an exemplary embodiment, the resin matrix phase may include an amount of bisphenol A-glycidyl methacrylate (Bis-GMA), an amount of triethylene glycol dimethacrylate (TEGDMA), and an amount of polyethylene glycol dimethacrylate (PEGDMA). In an exemplary embodiment, a weight percentage of the amount of bisphenol A-glycidyl methacrylate (Bis-GMA) may be in a range between 35% and 40%. In an exemplary embodiment, a purity of the amount of bisphenol A-glycidyl methacrylate (Bis-GMA) may be more than 98%. In an exemplary embodiment, the amount of bisphenol A-glycidyl methacrylate (Bis-GMA) may create mechanical strength and initial adhesion.

[0023] In an exemplary embodiment, a weight percentage of the amount of triethylene glycol dimethacrylate (TEGDMA) may be in a range between 20% and 25%. In an exemplary embodiment, a purity of the amount of triethylene glycol dimethacrylate (TEGDMA) may be more than 97%. In an exemplary embodiment, the amount of triethylene glycol dimethacrylate(TEGDMA) may reduce viscosity and facilitate composite flow. In an exemplary embodiment, a weight percentage of the amount of polyethylene glycol dimethacrylate (PEGDMA) may be in a range between 10% and 15%. In an exemplary embodiment, the amount of polyethylene glycol dimethacrylate (PEGDMA) may increase flexibility and response to thermal changes.

[0024] In an exemplary embodiment, the dental composite may further include inorganic fillers. In an exemplary embodiment, the inorganic fillers may include an amount of silane-modified silica particles and an amount of barium titanate (BaTiOs). In an exemplary embodiment, a weight percentage of the amount of silane-modified silica particles may be in a range between 40% and 50%. In an exemplary embodiment, a size of the amount of silane-modified silica particles may be in a range between 0.02 microns and 0.07 microns. In an exemplary embodiment, the amount of silane-modified silica particles may increase mechanical strength and stability. In an exemplary embodiment, a weight of the amount of barium titanate (BaTiOs) may be in a range between 10% and 15%. In an exemplary embodiment, a size of the amount of barium titanate (BaTiOs) may be in a range between 50 nanometers and 200 nanometers. In an exemplary embodiment, the amount of barium titanate (BaTiOs) may help increase responsiveness to an electric field.

[0025] In an exemplary embodiment, the dental composite may further include thermo-electric responsive agents. In an exemplary embodiment, the thermo-electric responsive agents may include an amount of doped polyaniline and an amount of polypyrrole. In an exemplary embodiment, a weight percentage of the amount of doped polyaniline may be in a range between 5% and 10%. In an exemplary embodiment, the amount of doped poly aniline may cause change in adhesive properties in the presence of electric current or heat. In an exemplary embodiment, a weight percentage of the amount of polypyrrole may be in a range between 3% and 5%. In an exemplary embodiment, the amount of polypyrrole may help improving electrical conductivity and sensitivity to high frequencies.

[0026] In an exemplary embodiment, the dental composite may further include an initiator system. In an exemplary embodiment, the initiator system may include an amount of benzoyl peroxide and an amount of camphorquinone. In an exemplary embodiment, a weight percentage of the amount of benzoyl peroxide may be between 1% and 2%. In an exemplary embodiment, the amount of benzoyl peroxide may be between 1% and 2% may act as a thermal polymerization initiator. In an exemplary embodiment, a weight percentage of the amount of camphorquinone may be between 0.5% and 1%. In an exemplary embodiment, the amount ofcamphorquinone may act as photoinitiator for polymerization in the wavelength range of 460-470 nanometers.

[0027] In an exemplary embodiment, the dental composite may further include coupling agents. In an exemplary embodiment, the coupling agents may include an amount of y-Methacryloxypropyltrimethoxy silane. In an exemplary embodiment, a weight percentage of the amount of y-Methacryloxypropyltrimethoxy silane may be between 1% and 2%. In an exemplary embodiment, the amount of y-Methacryloxypropyltrimethoxysilane may help improving the bonding between the resin matrix and the inorganic filler.

[0028] Disclosed herein is also a method for preparing a dental composite with controlled debonding capability using heat and electric field. FIG. 1 shows a method 100 for preparing a dental composite with controlled debonding capability using heat and electric field, consistent with one or more exemplary embodiments of the present disclosure. As shown in FIG. 1, in an exemplary embodiment, method 100 may include a first step 101 of preparing a resin matrix, a second step 102 of dispersing inorganic fillers in the resin matrix, a third step 103 of adding thermo-electric responsive agents to the resin matrix, a fourth step 104 of stirring the resin matrix with the amount of doped polyaniline and the amount of polypyrrole, a fifth step 105 of adding an amount of y-Methacryloxypropyltrimethoxysilane to the resin matrix, and a sixth step 106 of removing air bubbles from the resin matrix by subjecting the resin matrix to a vacuum.

[0029] In an exemplary embodiment, in order to implement first step 101 of preparing a resin matrix, first an initial matrix may be prepared by mixing an amount of bisphenol A-glycidyl methacrylate (Bis-GMA), an amount of triethylene glycol dimethacrylate (TEGDMA), and an amount of polyethylene glycol dimethacrylate (PEGDMA) in an ultrasonic bath and then an amount of benzoyl peroxide and an amount of camphorquinone may be added to the initial matrix. In an exemplary embodiment, a temperature of the ultrasonic bath may be between 45 °C and 55 °C. In an exemplary embodiment, a weight percentage of the amount of benzoyl peroxide may be between 1% and 2%, a weight percentage of camphorquinone being between 0.5% and 1%. Then, in an exemplary embodiment, the amount of benzoyl peroxide and the amount of camphorquinone may be mixed in the initial matrix by stirring the initial matrix.

[0030] In an exemplary embodiment, in order to implement second step 102 of dispersing inorganic fillers in the resin matrix, an amount of silane-modified silica particles and an amount of barium titanate (BaTiOs) may be added to the resin matrix and then the amount of silane-modified silica particles and the amount of barium titanate (BaTiCh) may be mixed in the resin matrix by using a planetary mixer at a temperature between 55°C and 65°C. In an exemplary embodiment, in order to implement third step 103 of adding thermo-electric responsive agents to the resin matrix, an amount of doped polyaniline may be added to the resin matrix and then an amount of polypyrrole may be added to the resin matrix. In an exemplary embodiment, a weight percentage of the amount of doped poly aniline may be in a range between 5% and 10%. In an exemplary embodiment, a weight percentage of the amount of polypyrrole may be in a range between 3% and 5%.

[0031] In an exemplary embodiment, in order to implement fourth step 104 of stirring the resin matrix with the amount of doped polyaniline and the amount of polypyrrole, the resin matrix with the amount of doped polyaniline and the amount of polypyrrole may be stirred at a temperature between 35 °C and 45 °C. In an exemplary embodiment, in order to implement fifth step 105 of adding an amount of y-Methacryloxypropyltrimethoxysilane to the resin matrix, an amount of y-Methacryloxypropyltrimethoxysilane may be added to the resin matrix. In an exemplary embodiment, a weight percentage of the amount of y-Methacryloxypropyltrimethoxy silane may be between 1% and 2%. In an exemplary embodiment, in order to sixth step 106 of removing air bubbles from the resin matrix by subjecting the resin matrix to a vacuum, air bubbles may be removed from the resin matrix by subjecting the resin matrix to a vacuum for a time period between 25 minutes and 35 minutes.

[0032] As discussed above, in this invention, the design and fabrication of a dental composite with controlled debonding capabilities using heat and an electric field in the low voltage range (5-10 volts) and high frequency have been developed. This composite employs advanced polymer matrices, electrically sensitive inorganic fillers, and surface-active agents to enable safe and precise separation. This feature addresses clinical challenges associated with the removal of permanent cements and reduces damage to tooth tissue. The primary advantages of this design include reduced treatment time, minimized risk of dental damage, and enhanced quality in prosthetic and orthodontic treatments in dentistry.

[0033] The present invention may provide significant benefits including, but not limited to, introduction of the precise formulation of the composite with controlled debonding capability, optimized composite for heat-sensitive and electric field conditions, mechanical properties and biocompatibility of the designed composite, clinical usability in various conditions, reduced risk of damage to tooth structure, creation of controlled debonding under low voltage and safetemperature conditions, reduction in treatment costs and clinical time, feasibility of using materials in orthodontic treatments, laminates, and various types of crowns, production of a composite with safe and controlled orthodontic debonding capability for easier removal of bonded brackets from teeth, developing an innovative method for replacing dental restorations, production of dual-cure resin cements with controlled debonding capability, strong adhesion to tooth enamel under normal conditions, change in adhesive properties under the influence of heat or electric field, and biostability and tissue compatibility.

[0034] While the foregoing has described what may be considered to be the best mode and / or other examples, it is understood that various modifications may be made therein and that the subject matter disclosed herein may be implemented in various forms and examples, and that the teachings may be applied in numerous applications, only some of which have been described herein. It is intended by the following claims to claim any and all applications, modifications and variations that fall within the true scope of the present teachings.

[0035] Unless otherwise stated, all measurements, values, ratings, positions, magnitudes, sizes, and other specifications that are set forth in this specification, including in the claims that follow, are approximate, not exact. They are intended to have a reasonable range that is consistent with the functions to which they relate and with what is customary in the art to which they pertain.

[0036] The scope of protection is limited solely by the claims that now follow. That scope is intended and should be interpreted to be as broad as is consistent with the ordinary meaning of the language that is used in the claims when interpreted in light of this specification and the prosecution history that follows and to encompass all structural and functional equivalents.

[0037] Except as stated immediately above, nothing that has been stated or illustrated is intended or should be interpreted to cause a dedication of any component, step, feature, object, benefit, advantage, or equivalent to the public, regardless of whether it is or is not recited in the claims.

[0038] It will be understood that the terms and expressions used herein have the ordinary meaning as is accorded to such terms and expressions with respect to their corresponding respective spaces of inquiry and study except where specific meanings have otherwise been set forth herein. Relational terms such as first and second and the like may be used solely to distinguish one entity or action from another without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms “comprises,”“comprising,” or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by “a” or “an” does not, without further constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0039] The Abstract of the Disclosure is provided to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, it can be seen that various features are grouped together in various implementations. This is for purposes of streamlining the disclosure, and is not to be interpreted as reflecting an intention that the claimed implementations require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed implementation. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separately claimed subject matter.While various implementations have been described, the description is intended to be exemplary, rather than limiting and it will be apparent to those of ordinary skill in the art that many more implementations and implementations are possible that are within the scope of the implementations. Although many possible combinations of features are shown in the accompanying figures and discussed in this detailed description, many other combinations of the disclosed features are possible. Any feature of any implementation may be used in combination with or substituted for any other feature or element in any other implementation unless specifically restricted. Therefore, it will be understood that any of the features shown and / or discussed in the present disclosure may be implemented together in any suitable combination. Accordingly, the implementations are not to be restricted except in light of the attached claims and their equivalents. Also, various modifications and changes may be made within the scope of the attached claims.

Claims

What is claimed is:

1. A dental composite with controlled debonding capability using heat and electric field, the dental composite comprising:a resin matrix phase, the resin matrix phase comprising:an amount of bisphenol A-glycidyl methacrylate (Bis-GMA), a weight percentage of the amount of bisphenol A-glycidyl methacrylate (Bis-GMA) being in a range between 35% and 40%, a purity of the amount of bisphenol A-glycidyl methacrylate (Bis-GMA) being more than 98%;an amount of triethylene glycol dimethacrylate (TEGDMA), a weight percentage of the amount of triethylene glycol dimethacrylate (TEGDMA) being in a range between 20% and 25%, a purity of the amount of triethylene glycol dimethacrylate (TEGDMA) being more than 97%; andan amount of polyethylene glycol dimethacrylate (PEGDMA), a weight percentage of the amount of polyethylene glycol dimethacrylate (PEGDMA) being in a range between 10% and 15%;inorganic fillers, the inorganic fillers comprising:an amount of silane-modified silica particles, a weight percentage of the amount of silane-modified silica particles being in a range between 40% and 50%, a size of the amount of silane-modified silica particles being in a range between 0.02 microns and 0.07 microns; andan amount of barium titanate (BaTiOs), a weight of the amount of barium titanate (BaTiOs) being in a range between 10% and 15%, a size of the amount of barium titanate (BaTiOs) being in a range between 50 nanometers and 200 nanometers; thermo-electric responsive agents, the thermo-electric responsive agents comprising:an amount of doped polyaniline, a weight percentage of the amount of doped polyaniline being in a range between 5% and 10%; andan amount of polypyrrole, a weight percentage of the amount of polypyrrole being in a range between 3% and 5%;an initiator system, the initiator system comprising:an amount of benzoyl peroxide, a weight percentage of the amount of benzoyl peroxide being between 1% and 2%; andan amount of camphorquinone, a weight percentage of the amount of camphorquinone being between 0.5% and 1%; andcoupling agents, the coupling agents comprising:an amount of y-Methacryloxypropyltrimethoxysilane, a weight percentage of the amount of y-Methacryloxypropyl trimethoxy silane being between 1% and 2%.

2. A method for preparing a dental composite with controlled debonding capability using heat and electric field, the method comprising:preparing a resin matrix, comprising:preparing an initial matrix by mixing an amount of bisphenol A-glycidyl methacrylate (Bis-GMA), an amount of triethylene glycol dimethacrylate (TEGDMA), and an amount of polyethylene glycol dimethacrylate (PEGDMA) in an ultrasonic bath, a temperature of the ultrasonic bath being between 45 °C and 55 °C;adding an amount of benzoyl peroxide and an amount of camphorquinone to the initial matrix, a weight percentage of the amount of benzoyl peroxide being between 1% and 2%, a weight percentage of camphorquinone being between 0.5% and 1%; anddissolving the amount of benzoyl peroxide and the amount of camphorquinone in the initial matrix by stirring the initial matrix;dispersing inorganic fillers in the resin matrix, comprising:adding an amount of silane-modified silica particles and an amount of barium titanate (BaTiCh) to the resin matrix, a weight percentage of the amount of silane- modified silica particles being in a range between 40% and 50%, a size of the amount of silane-modified silica particles being in a range between 0.02 microns and 0.07 microns, a weight of the amount of barium titanate (BaTiCh) being in a range between 10% and 15%, a size of the amount of barium titanate (BaTiCh) being in a range between 50 nanometers and 200 nanometers; andmixing the amount of silane-modified silica particles and the amount of barium titanate (BaTiCh) in the resin matrix by using a planetary mixer at a temperature between 55°C and 65°C;adding thermo-electric responsive agents to the resin matrix, comprising:adding an amount of doped poly aniline to the resin matrix, a weight percentage of the amount of doped polyaniline being in a range between 5% and 10%; andadding an amount of polypyrrole to the resin matrix, a weight percentage of the amount of polypyrrole being in a range between 3% and 5%;stirring the resin matrix with the amount of doped polyaniline and the amount of polypyrrole at a temperature between 35 °C and 45°C;adding an amount of y-Methacryloxypropyltrimethoxysilane to the resin matrix, a weight percentage of the amount of y-Methacryloxypropyltrimethoxysilane being between 1 % and 2% ; andremoving air bubbles from the resin matrix by subjecting the resin matrix to a vacuum for a time period between 25 minutes and 35 minutes.

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