Pressure touch-control apparatus and electronic device

Abstract

Provided in the embodiments of the present application are a pressure touch-control apparatus and an electronic device. The pressure touch-control apparatus comprises: a thin-film touch-control sensor, which is arranged on a lower surface of a cover plate, and is used for detecting a touch operation acting on an upper surface of the cover plate and generating a touch signal; a pressure sensor, which is used for detecting a pressing operation acting on the upper surface of the cover plate and generating a pressure signal; a vibration mechanism, which is used for generating vibration feedback; and a circuit board, which is electrically connected to the thin-film touch-control sensor, the pressure sensor and the vibration mechanism, is arranged on a lower surface of the thin-film touch-control sensor in a manner of being at least staggered from the vibration mechanism, and is used for processing the touch signal and the pressure signal and controlling the vibration mechanism. The pressure touch-control apparatus in the embodiments of the present application can detect touch and pressure, and generate vibration feedback; and has a small thickness and a low cost.

Description

Pressure-sensitive touch devices and electronic equipment Technical Field

[0001] This application relates to the field of touch technology, specifically to a pressure touch device and electronic device. Background Technology

[0002] As the laptop market continues to evolve, touchpads, as a crucial component of laptops, are receiving increasing demands. These demands include the addition of pressure sensors to detect finger pressure, vibration motors to provide a better user experience, and a desire for a thinner and lighter overall design. The motor area of ​​the pressure-sensitive touchpad is the thickest part of the entire module. Under pressure from the touchpad, the vibration motor position is lower, requiring even more module space. With laptops trending towards thinner designs, this presents a significant challenge to module thickness, making thinning a key area of ​​innovation for pressure-sensitive touchpads.

[0003] In related technologies, pressure-sensitive touchpads use printed circuit boards (PCBs) as the touch sensor layer. The touch sensor is located on the PCB near the cover plate, while the components are arranged on the back of the PCB using surface mount technology, forming a PCB assembly (PCBA). The shape of the PCBA is tied to the industrial design of the specific product, and the component area of ​​the PCBA is consistent with the overall structure of the device. Furthermore, a vibration motor is placed below the PCBA. As a result, the pressure-sensitive touchpads in these technologies are relatively thick and require customized design for specific product industrial designs. Summary of the Invention

[0004] In view of the above problems, this application provides a pressure touch device and electronic device to solve the above technical problems.

[0005] In a first aspect, embodiments of this application provide a pressure touch device, comprising: a thin-film touch sensor disposed on the lower surface of a cover plate, for detecting touch operations acting on the upper surface of the cover plate and generating touch signals; a pressure sensor for detecting pressing operations acting on the upper surface of the cover plate and generating pressure signals; a vibration mechanism for generating vibration feedback; and a circuit board electrically connected to the thin-film touch sensor, the pressure sensor, and the vibration mechanism, and disposed at least offset from the vibration mechanism on the lower surface of the thin-film touch sensor, for processing touch signals, pressure signals, and controlling the vibration mechanism.

[0006] In some embodiments, a circuit board is disposed in a first region on the lower surface of a thin-film touch sensor; a vibration mechanism is disposed in a second region on the lower surface of the thin-film touch sensor; wherein the second region is located outside the first region and does not overlap with the first region.

[0007] In some embodiments, the circuit board has a cutout portion through which the vibration mechanism at least partially passes and connects to the lower surface of the thin-film touch sensor.

[0008] In some embodiments, a detection electrode is arranged on the surface of the thin-film touch sensor; the circuit board is electrically connected to the detection electrode.

[0009] In some embodiments, a thin-film touch sensor includes: a film substrate; a first detection electrode disposed on the upper surface of the film substrate; a second detection electrode disposed on the lower surface of the film substrate; and a shielding layer disposed on the second detection electrode for shielding electromagnetic interference to the first detection electrode and the second detection electrode.

[0010] In some embodiments, the thin-film touch sensor further includes: a first pad portion disposed on a first side of the lower surface of the film substrate; a first connection line passing through the film substrate and connecting a first detection electrode to the first pad portion; a first connection assembly connecting the first pad portion to a side of the circuit board near the first side; a second pad portion disposed on a second side of the lower surface of the film substrate; a second connection line connecting a second detection electrode to the second pad portion; and a second connection assembly connecting the second pad portion to a side of the circuit board near the second side.

[0011] In some embodiments, the pressure touch device further includes: a bracket for fixing the pressure touch device; an elastic pad disposed on the bracket; and a pressure sensor including: one or more capacitive pressure sensing components sandwiched between the lower surface of the thin-film touch sensor and the elastic pad for detecting a pressing operation and generating a pressure signal; and an electrical connection component connecting the capacitive pressure sensing components to a circuit board for transmitting the pressure signal.

[0012] In some embodiments, the pressure sensor includes: first, second, third, and fourth capacitive pressure detection components located at the four corners of the membrane substrate, wherein the first and second capacitive pressure detection components are adjacent to each other, and the third and fourth capacitive pressure detection components are adjacent to each other; a first electrical connection component including first and second connection terminals connected to the first and second capacitive pressure detection components, and a third connection terminal connected to the circuit board; and a second electrical connection component including first and second connection terminals connected to the third and fourth capacitive pressure detection components, and a third connection terminal connected to the circuit board.

[0013] In some embodiments, the pressure sensor includes: one or more stress detection components disposed on a bracket for fixing the pressure touch device, for detecting pressing operations and generating pressure signals; an electrical connection component electrically connecting the stress detection components to a circuit board for transmitting pressure signals; the pressure touch device further includes: a bracket for fixing the pressure touch device; and an elastic pad sandwiched between the lower surface of the thin-film touch sensor and the bracket.

[0014] In some embodiments, the pressure sensor includes: first, second, third, and fourth stress detection components located at the four corners of the membrane substrate, wherein the first and second stress detection components are adjacent to each other, and the third and fourth stress detection components are adjacent to each other; a first electrical connection component including first and second connection terminals connected to the first and second stress detection components, and a third connection terminal connected to the circuit board; and a second electrical connection component including first and second connection terminals connected to the third and fourth stress detection components, and a third connection terminal connected to the circuit board.

[0015] In some embodiments, the vibration mechanism includes a linear motor disposed on the lower surface of the thin-film touch sensor.

[0016] In some embodiments, the pressure touch device further includes: a bracket for fixing the pressure touch device; a vibration mechanism including: a voice coil motor, the voice coil motor including: a coil disposed on the lower surface of the thin-film touch sensor; a magnet disposed on the bracket and located below the coil; and a gap between the coil and the magnet.

[0017] In some embodiments, the electronic components of the circuit board are arranged on the lower surface of the circuit board.

[0018] In some embodiments, the thin-film touch sensor further includes an optical processing area, below which an optical sensor is disposed.

[0019] Secondly, embodiments of this application provide an electronic device, including: the aforementioned pressure touch device; and a processing unit connected to the circuit board of the pressure touch device.

[0020] The pressure-sensitive touch device and electronic device provided in this application separate the touch sensor from the circuit board, eliminating the need for the circuit board to be tied to the industrial design of a specific product, thus reducing the material and design costs of the circuit board. The use of a thin-film touch sensor reduces thickness compared to a PCBA touch board. The circuit board and vibration mechanism are staggered on the lower surface of the touch sensor, further reducing the overall thickness of the touch device. In summary, the pressure-sensitive touch device of this application can detect touch and pressure and generate vibration feedback, while also having a smaller thickness and lower cost.

[0021] These or other aspects of this application will become more apparent from the description of the following embodiments. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 shows a schematic diagram of the structure of an electronic device to which the technical solutions of the embodiments of this application are applicable.

[0024] Figure 2 shows a schematic diagram of the structure of a touch device to which the technical solutions of the embodiments of this application can be applied.

[0025] Figure 3 shows an exploded view of a touch device according to an embodiment of this application.

[0026] Figure 4 shows a layout diagram of a touch device according to an embodiment of this application.

[0027] Figure 5 shows a layout diagram of another touch device according to an embodiment of this application.

[0028] Figure 6 shows a stacked diagram of a touch device according to an embodiment of this application.

[0029] Figure 7 shows a stacked diagram of another touch device according to an embodiment of this application.

[0030] Figure 8 shows a stacked diagram of another touch device according to an embodiment of this application. Detailed Implementation

[0031] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0032] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0033] In the embodiments of this application, it should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0034] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0035] In the description of the embodiments of this application, the words "example" or "for example" are used to indicate exemplification, illustration, or description. Any embodiment or design described as "example" or "for example" in the embodiments of this application is not to be construed as being more preferred or having more advantages than another embodiment or design. The use of the words "example" or "for example" is intended to present relative concepts in a clear manner.

[0036] Furthermore, in the embodiments of this application, "multiple" refers to two or more. Therefore, in the embodiments of this application, "multiple" can also be understood as "at least two". "At least one" can be understood as one or more, such as one, two, or more. For example, including at least one means including one, two, or more, and is not limited to which ones are included. For example, including at least one of A, B, and C, then it could include A, B, C, A and B, A and C, B and C, or A and B and C.

[0037] It should be noted that in the embodiments of this application, "and / or" describes the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In addition, the character " / ", unless otherwise specified, generally indicates that the associated objects before and after it are in an "or" relationship.

[0038] It should be noted that in the embodiments of this application, "connection" can be understood as electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.

[0039] Figure 1 illustrates a schematic diagram of the structure of an electronic device to which the technical solutions of the embodiments of this application are applicable. Referring to Figure 1, the typical hardware structure of the electronic device 100 may include: a processor 101, a memory 102, a radio device 103, an audio output unit 104, an A / V input unit 105, a display unit 106, a user input unit 107, an interface unit 108, and a power supply 109. It should be understood that Figure 1 is only an exemplary illustration of the embodiments of this application and is not intended to limit the electronic device 100.

[0040] Display unit 106 includes various types of display panels capable of displaying visual graphics, such as a graphical user interface (GUI). User input unit 107 may include a keyboard, mouse, etc. Audio output unit 104 includes speakers, etc. A / V input unit 105 includes an image processor 1051 and a microphone 1052.

[0041] The memory 102 can store data and instructions that can be executed on the processor 101, including an operating system 111, etc. Referring to Figure 1, the memory 102 stores one or more application programs 110. The one or more application programs 110 include weather, instant messaging, telephone, text messaging, email, or stock information, etc.

[0042] Please continue referring to Figure 1. In this embodiment, the electronic device 100 also includes a touchpad 120. The touchpad 120 can detect touch operations and press operations, and generate vibration feedback based on touch operations and / or press operations. Specifically, in a laptop computer, the touchpad 120 can precisely control the position of the cursor on the display unit 106 through the sliding operation of a finger or stylus. For example, when editing a document, the cursor can be moved precisely to a specified text paragraph, facilitating operations such as inserting, deleting, and modifying text; in graphic design software, the cursor can also be accurately positioned to the graphic element that needs to be drawn or modified, just as accurately as moving the cursor with a mouse, only the operation method is more direct, achieving the corresponding displacement by sliding the finger on the surface of the touchpad 120. In some implementations, the right or left click operation of a mouse can also be simulated by lightly pressing the area below the touchpad 120 or by using a single finger to click the surface of the touchpad. In daily use, operations such as opening application icons on the desktop and selecting files or folders can be completed using this simulated right-click or left-click function, achieving the same effect as clicking with a mouse.

[0043] Figure 2 shows a schematic diagram of a touch device that can be adapted to the technical solutions of this application. The touch device 200 can be an external touchpad. As shown in Figure 2, the touch device 200 includes a touch module 210 and a communication interface 220. The touch module 210 is used to detect touch operations and press operations, and generate vibration feedback based on touch operations and / or press operations. The communication interface 220 is used to communicate with external electronic devices such as personal computers and tablets to use the touch device 200 as an external touch input device for electronic devices (such as the electronic device 100 shown in Figure 1). The communication interface 220 can include, but is not limited to, wired interfaces such as Universal Serial Bus (USB) interfaces, and can also include wireless interfaces such as Bluetooth, ZigBee, and WiFi. In some implementations, the touch device 200 may also include a rechargeable battery (not shown in Figure 2) for powering the touch module 210 and the communication interface 220. In some implementations, the USB interface can transmit power from electronic devices.

[0044] In related technologies, the touch layer and device layer of the touchpad 120 and touch device 200 are integrated on a single PCB. This integrated PCBA requires customized design based on the product's industrial design and structure, which is detrimental to the universal design of multiple products, increases material preparation risks, and complicates material storage and maintenance. The relatively thick touch PCB also hinders the ultra-thin design of the overall device structure. Therefore, this application provides a pressure-sensitive touch device that can be applied to the touchpad 120 shown in Figure 1 or the touch device 200 shown in Figure 2.

[0045] Referring to Figures 3 to 8, the pressure-sensitive touch device provided in this embodiment includes: a cover plate 301, a thin-film touch sensor 310, a pressure sensor 320, a vibration mechanism 330, and a circuit board 340. The cover plate 301 may include composite materials such as glass, plastic, or glass fiber reinforced plastic. The thin-film touch sensor 310 is disposed on the lower surface of the cover plate 301 and is fixed to the lower surface of the cover plate 301 by an adhesive layer 302 such as double-sided adhesive. The thin-film touch sensor 310 is used to detect touch operations applied to the upper surface of the cover plate 301 and generate touch signals. The touch operation can be generated by a finger, stylus, etc. The shape and size of the thin-film touch sensor 310 are adapted to the cover plate 301. Specifically, if the cover plate 301 is rectangular, the length and width of the thin-film touch sensor 310 are substantially equal to those of the cover plate 301. In practical implementation, the larger the proportion of the effective touch area of ​​the cover plate 301, the better; correspondingly, the larger the proportion of the effective touch area of ​​the thin-film touch sensor 310, the better. The pressure sensor 320 is used to detect pressing operations applied to the upper surface of the cover plate 301 and generate pressure signals. The vibration mechanism 330 is used to generate vibration feedback. The circuit board 340 is electrically connected to the thin-film touch sensor 310, the pressure sensor 320, and the vibration mechanism 330, and is used to process touch signals, pressure signals, and control the vibration mechanism 330.

[0046] Referring again to Figures 3 through 8, in this embodiment, the shape and size of the thin-film touch sensor 310 are adapted to the cover plate 301 to detect touch operations applied to the upper surface of the cover plate 301 and generate touch signals. The circuit board 340 is used to process the touch signals; its shape and size are independent of the shape and size of the cover plate 301. Therefore, the shape and size of the circuit board 340 are independent of the appearance of the pressure touch device (mainly the size and shape of the touch area), and pressure touch devices with different appearances can use the same circuit board 340. In this embodiment, the area of ​​the circuit board 340 is reduced, and the pressure sensor 320 and vibration mechanism 330 are staggered and arranged on the lower surface of the thin-film touch sensor 310. Specifically, the length of the circuit board 340 is less than the length of the thin-film touch sensor 310, and the width of the circuit board 340 is less than the width of the thin-film touch sensor 310. Preferably, the length of the circuit board 340 is at least half the length of the thin-film touch sensor 310, and the width of the circuit board 340 is at least three-tenths of the width of the thin-film touch sensor 310. In a specific implementation, the length of the thin-film touch sensor 310 is between 80mm and 150mm, the length of the circuit board 340 is between 50mm and 100mm, the width of the thin-film touch sensor 310 is between 50mm and 100mm, and the width of the circuit board 340 is between 15mm and 50mm.

[0047] Furthermore, the circuit board 340 is at least offset from the vibration mechanism 330 on the lower surface of the thin-film touch sensor 310, greatly reducing the thickness of the touch module. In some implementations, the pressure sensor 320, vibration mechanism 330, and circuit board 340 can all be offset from the lower surface of the thin-film touch sensor 310. Referring to Figures 3 to 7, the pressure sensor 320 includes multiple pressure detection components, which are respectively arranged at the four corners of the lower surface of the thin-film touch sensor 310, offset from the circuit board 340.

[0048] In some embodiments, referring to Figures 3 to 8, the pressure touch device further includes a bracket 360 for fixing the pressure touch device. The bracket 360 is provided with a receiving space 361 for accommodating a vibration mechanism 300. The vibration mechanism 300 may be disposed in the receiving space 361.

[0049] In this embodiment, a detection electrode is disposed on the surface of the thin-film touch sensor 310, and the circuit board 340 is connected to the detection electrode. In a specific implementation, the thin-film touch sensor 310 may include a film substrate and a detection electrode formed on the surface of the film substrate. The detection electrode may be made of indium tin oxide (ITO) or at least one of copper, nickel, gold, silver, palladium, and their alloys. The film substrate may be made of polyethylene terephthalate (PET), polyimide (PI), or polyethylene naphthalate (PEN).

[0050] In some implementations, detection electrodes are formed on the upper surface of the film substrate (i.e., the surface of the thin-film touch sensor 310 near the cover plate 301). When there is no touch operation, the detection electrodes have a stable capacitance value. When a finger approaches or touches these detection electrodes, since the human body is also a conductor, it forms a new capacitive coupling with the detection electrodes, causing a change in the capacitance value of the detection electrodes. The circuit board 340 can detect these capacitance changes and calculate information such as the touch position using a certain algorithm.

[0051] In some implementations, detection electrodes are formed on the upper surface (the surface near the cover plate 301) and the lower surface (the surface away from the cover plate 301) of the film substrate, referred to as the first detection electrode and the second detection electrode, respectively. The projections of the first and second detection electrodes on the film substrate are interlaced, with the first detection electrodes serving as a sensing electrode array and the second detection electrodes serving as a driving electrode array. When a finger touches the substrate, the finger touches and changes the mutual capacitance between the driving electrode and the sensing electrode. The circuit board 340 can send an excitation signal to the second detection electrode and then receive the response signal generated by the change in mutual capacitance through the first detection electrode. The circuit board 340 can amplify, filter, and otherwise process the response signal before converting it into a digital signal. In some embodiments, to prevent other metal components from affecting the touch signal, a shielding layer is provided on the second detection electrode to shield it from electromagnetic interference from the circuit board 340 and other components. The shielding layer may include an indium tin oxide (ITO) film, a steel sheet, a copper foil, or other conductive thin films.

[0052] Furthermore, in some embodiments, to better fit the thin-film touch sensor 310 with the cover plate 301, a first detection electrode located on the upper surface of the thin-film touch sensor 310 (i.e., the surface near the cover plate 301) is connected to the lower surface of the thin-film touch sensor 310 (i.e., the surface away from the cover plate 301) via a first connection line (not shown in the figure). Preferably, the first connection line may include leads and metallized vias on the film substrate, with the leads connecting the first detection electrode to the metallized vias. A connection assembly 311 connects the thin-film touch sensor 310 to the circuit board 340 on the lower surface of the thin-film touch sensor 310. In specific implementations, the circuit board 340 and the thin-film touch sensor 310 can be connected via a zero-insertion-force (ZIF) connector or via a separate flexible printed circuit (FPC) board. That is, the connection assembly 311 can be a ZIF connector or an FPC board.

[0053] In a further embodiment, referring to Figures 3, 4, and 5, the thin-film touch sensor 310 may include: a first pad portion (not shown) disposed on a first side of the lower surface of the film substrate; a first connecting line (not shown) passing through the film substrate and connecting a first detection electrode to the first pad portion; a first connecting component 311a connecting the first pad portion to a side of the circuit board 340 near the first side; a second pad portion (not shown) disposed on a second side of the lower surface of the film substrate; a second connecting line (not shown) connecting a second detection electrode to the second pad portion; and a second connecting component 311b connecting the second pad portion to a side of the circuit board 340 near the second side. Specifically, the first side can be one of the long side direction and the short side direction of the film substrate, and the second side can be the other of the long side direction and the short side direction of the film substrate. Referring to Figures 3 to 5, the first pad portion and the first connecting component 311a are located in the long side direction of the film substrate, and the second pad portion and the second connecting component 311b are located in the short side direction of the film substrate. In this embodiment, the thin-film touch sensor 310 is connected to the adjacent side of the circuit board 340 through a corresponding connection component, which greatly reduces the trace length and reduces signal interference caused by trace crossing.

[0054] Preferably, as shown in Figures 3, 4, and 5, the circuit board 340 and the thin-film touch sensor 310 are electrically connected via an FPC board, i.e., the first connecting component 311a and the second connecting component 311b are FPC boards. In a specific implementation, the FPC board and the thin-film touch sensor 310 can be soldered together with solder paste, or the FPC board can be laminated to the thin-film touch sensor 310 using anisotropic conductive film (ACF). The FPC board and the circuit board 340 can be electrically connected via connectors such as ZIF connectors or board-to-board (BTB) connectors.

[0055] In some embodiments, as shown in Figures 4 and 5, the thin-film touch sensor 310 also has an optical processing area S3. An optical sensor is disposed below the optical processing area S3, and the optical processing area S3 can transmit specific light corresponding to the optical sensor. The optical sensor may include optical devices such as ultrasonic fingerprint sensors or optical fingerprint sensors with display icons. In specific implementations, as shown in Figures 4 and 5, the optical processing area S3 can be arranged on the left or right side of the vibration mechanism 330 and the circuit board 340. When the optical processing area S3 is combined with fingerprint applications, it is preferable to arrange the optical processing area S3 on the left side of the device surface, which is on the right side of the touch panel from the touch surface view, thus facilitating unlocking with the right hand.

[0056] In some embodiments, as shown in FIG4, a circuit board 340 is arranged in a first region S1 on the lower surface of the thin-film touch sensor 310, and a vibration mechanism 330 is arranged in a second region S2 on the lower surface of the thin-film touch sensor 310. The second region S2 is located outside the first region S1 and does not overlap with the first region S1. In specific implementations, as shown in FIG6, 7, and 8, the circuit board 340 can be attached to the first region S1 by means of an adhesive layer 303 such as double-sided adhesive, and the vibration mechanism 330 can be attached to the second region S2 by means of an adhesive layer 303 such as double-sided adhesive. Furthermore, in order to improve the effect of vibration feedback, the second region S2 is usually close to the center of the lower surface of the thin-film touch sensor 310.

[0057] In some embodiments, the circuit board 340 has a cutout portion, through which the vibration mechanism 330 at least partially passes and connects to the lower surface of the thin-film touch sensor 310. In a specific implementation, as shown in FIG5, the cutout portion can be located inside the circuit board 340, forming an annular opening. The shape of the annular opening can be set according to the shape of the vibration mechanism 330. In some specific implementations, the cutout portion can be located at the edge of the circuit board 340, forming an opening at the edge. The shape of the opening can be set according to the shape of the vibration mechanism 330. Specifically, as shown in FIG6, 7, and 8, the circuit board 340 can be adhered and fixed to the lower surface of the thin-film touch sensor 310 using an adhesive layer 303 such as double-sided adhesive, and the vibration mechanism 330 passes through the cutout portion and is adhered and fixed to the lower surface of the thin-film touch sensor 310 using an adhesive layer 303 such as double-sided adhesive. In this embodiment, when the touch area size is small, a small-sized vibration mechanism 330 can be used to meet the vibration feedback effect.

[0058] In some embodiments, the pressure sensor 320 may include a pressure-capacitive sensor. Specifically, as shown in Figures 6 and 7, the pressure sensor 320 includes an electrical connection assembly 321 and one or more capacitive pressure detection components 322. The capacitive pressure detection component 322 is sandwiched between the thin-film touch sensor 310 and the elastic pad 350, and is electrically connected to the electrical connection assembly 321. The capacitive pressure detection component 322 is used to detect pressing operations and generate a pressure signal. The electrical connection assembly 321 connects the capacitive pressure detection component 322 to the circuit board 340. The electrical connection assembly 321 is used to transmit the pressure signal generated by the capacitive pressure detection component 322, and may include an FPC board, etc.

[0059] Preferably, as shown in Figures 3, 4, and 5, the device may include four capacitive pressure detection components 322 located at the four corners of the thin-film touch sensor 310, namely a first capacitive pressure detection component 322a, a second capacitive pressure detection component 322b, a third capacitive pressure detection component 322c, and a fourth capacitive pressure detection component 322d. The first capacitive pressure detection component 322a is adjacent to the second capacitive pressure detection component 322b and is connected to the circuit board 340 through a first electrical connection component 321a. The first electrical connection component 321a includes a first connection terminal connected to the first capacitive pressure detection component 322a, a second connection terminal connected to the second capacitive pressure detection component 322b, and a third connection terminal connected to the circuit board 340. The third capacitive pressure detection component 322c is adjacent to the fourth capacitive pressure detection component 322d, and is connected to the circuit board 340 via the second electrical connection component 321b. The second electrical connection component 321b includes a first connection terminal connected to the third capacitive pressure detection component 322c, a second connection terminal connected to the fourth capacitive pressure detection component 322d, and a third connection terminal connected to the circuit board 340. The first electrical connection component 321a and the second electrical connection component 321b can be FPC boards.

[0060] Referring to Figures 6 and 7, the pressure-sensitive touch device also includes an elastic pad 350 and a bracket 360. The bracket 360 is used to fix the pressure-sensitive touch device. The elastic pad 350 is sandwiched between the capacitive pressure sensing component 322 and the bracket 360. The elastic pad 350 is used to provide cushioning and may include a silicone pad, a rubber pad, etc. When pressure is applied to the upper surface of the cover plate 301, the pressure is transmitted through the cover plate 301 and the thin-film touch sensor 310 to the capacitive pressure sensing component 322. The capacitive pressure sensing component 322 generates a capacitance change under the pressure. The circuit board 340 detects the capacitance change of the capacitive pressure sensing component 322 to calculate the magnitude of the pressure applied.

[0061] Furthermore, the capacitive pressure sensing assembly 322 includes a pressure-sensing element and a fixed electrode. The pressure-sensing element is typically an elastic diaphragm made of materials such as a metal film or silicon wafer. As one electrode of a capacitor, it deforms under pressure, thereby changing the capacitance parameters. An insulating layer is provided between the pressure-sensing element and the fixed electrode. This insulating layer isolates the electrode, prevents short circuits, and, as part of the dielectric, its material and thickness significantly affect the capacitance characteristics. Pressure applied to the pressure-sensing element causes displacement, resulting in changes in the distance between the electrodes, the effective area of ​​the electrodes, or the dielectric constant of the dielectric, thus altering the capacitance value. By measuring the change in capacitance, the magnitude of the pressure acting on the electrode can be calculated.

[0062] In some embodiments, the pressure sensor 320 may include a stress sensor. Specifically, as shown in FIG8, the pressure sensor 320 includes one or more stress detection components 323 and an electrical connection component 324. The stress detection component 323 is arranged in a bracket 360 for fixing the pressure touch device. As shown in FIG8, an elastic pad 350 is sandwiched between the lower surface of the thin-film touch sensor 310 and the bracket 360. The elastic pad 350 may include a silicone pad, a rubber pad, etc. When the thin-film touch sensor 310 is subjected to pressure, the pressure is transmitted to the bracket 360 through the elastic pad 350. The stress detection component 323 detects the stress generated in the bracket 360 under the pressure, and the circuit board 340 can calculate the magnitude of the pressure based on the stress. The stress detection component 323 may include a resistance strain gauge and a measuring circuit. When the bracket 360 deforms under force, the resistance strain gauge deforms accordingly, and the change in resistance is converted into a voltage or current signal output by the measuring circuit.

[0063] Preferably, similar to Figures 3, 4, and 5, four stress detection components 323 may be included, located at the four corners of the thin-film touch sensor 310. An electrical connection component 324 electrically connects the stress detection components 323 to the circuit board 340. The electrical connection component 324 may include an FPC board, etc. Specifically, the pressure sensor 320 includes: first, second, third, and fourth stress detection components located at the four corners of the membrane substrate, wherein the first and second stress detection components are adjacent, and the third and fourth stress detection components are adjacent; a first electrical connection component includes first and second connection terminals connected to the first and second stress detection components, and a third connection terminal connected to the circuit board 340; a second electrical connection component includes first and second connection terminals connected to the third and fourth stress detection components, and a third connection terminal connected to the circuit board 340.

[0064] In some embodiments, as shown in Figures 6 and 8, the vibration mechanism 330 includes a linear motor, which is arranged on the lower surface of the thin-film touch sensor. In other embodiments, as shown in Figure 7, the vibration mechanism 330 includes a voice coil motor, the coil of which is arranged on the lower surface of the thin-film touch sensor 310, and the magnet of which is arranged on a support 360 and below the coil, with a gap between the coil and the magnet. In a voice coil motor, a stable magnetic field is typically generated by the magnet. When current is applied to the coil, the coil experiences an Ampere force in the magnetic field and moves. Specifically, a linear voice coil motor is used, in which the coil moves linearly along the axial direction.

[0065] In some embodiments, as shown in Figures 6, 7, and 8, the vibration mechanism 330 has a relatively large thickness, and there is a certain gap between the lower surface of the circuit board 340 and the support 360, allowing the electronic components of the circuit board 340 to be arranged on the lower surface of the circuit board 340. The electronic components include those for processing touch signals from the thin-film touch sensor 310, those for processing pressure signals from the pressure sensor 320, and those for controlling the vibration mechanism 330 to generate vibration feedback. These electronic components may include discrete devices such as resistors and capacitors, as well as small controllers.

[0066] In some implementations, as shown in Figures 4 and 5, the circuit board 340 can be connected to the processing unit of the electronic device via an electrical connection component 370 to transmit processed touch signals and pressure signals to the processing unit for processing. The processing unit can generate feedback control signals based on the pressure signals and touch signals, and the circuit board 340 can control the vibration mechanism 330 to generate vibration feedback based on the feedback control signals. For example, in the electronic device 100, the circuit board 340 can be connected to the processor 101 via the electrical connection component 370. The processor 101 receives the touch signals and pressure signals processed by the circuit board 340, generates feedback control signals based on the pressure signals and touch signals, and the circuit board 340 can control the vibration mechanism 330 to generate vibration feedback based on the feedback control signals. In some implementations, the circuit board 340 can be connected to the embedded controller (EC) of the electronic device 100 via the electrical connection component 370, and the processor 101 is connected to the embedded controller. The embedded controller receives the touch signals and pressure signals processed by the circuit board 340, transmits the touch signals and pressure signals to the processor 101, and generates feedback control signals based on the pressure signals and touch signals. The circuit board 340 can control the vibration mechanism 330 to generate vibration feedback based on the feedback control signals.

[0067] In a typical implementation as shown in Figures 6 to 8, the cover plate 301 is glass with a thickness of approximately 0.8 mm; the adhesive layer 302 is double-sided adhesive with a thickness of approximately 0.05 mm; the thickness of the thin-film touch sensor 310 is between 0.05 mm and 0.2 mm, approximately 0.137 mm; the adhesive layer 303 is double-sided adhesive, with a thickness of approximately 0.05 mm at the connection point with the circuit board 340 and approximately 0.1 mm at the connection point with the vibration mechanism 330; the thickness of the circuit board 340 is between 0.3 mm and 0.5 mm, approximately 0.4 mm, and the maximum thickness of the electronic components on its lower surface is 1.2 mm; the thickness of the pressure sensor 310 is approximately 0.8 mm; the thickness of the vibration mechanism 330 is between 2 mm and 3 mm, approximately 2 mm if it is a linear motor (LAR), and approximately 2.3 mm if it is a voice coil motor (VCM); the thickness of the bracket 360 is approximately 0.4 mm; and the stroke of the vibration mechanism 330 and other components is approximately 0.5 mm. The overall thickness of the pressure-sensitive touch device is relatively low.

[0068] This application also provides an electronic device, including a pressure-sensitive touch device and a processing unit. The pressure-sensitive touch device is connected to the processing unit of the electronic device, and transmits processed touch signals and pressure signals to the processing unit for processing. The processing unit can generate a feedback control signal based on the pressure signals and touch signals, and the circuit board of the pressure-sensitive touch device can control a vibration mechanism to generate vibration feedback based on the feedback control signal. The electronic device may include the electronic device 100 shown in FIG1. ​​The circuit board 340 can be connected to the processor 101 through an electrical connection component. The processor 101 receives the touch signals and pressure signals processed by the circuit board 340, generates a feedback control signal based on the pressure signals and touch signals, and the circuit board 340 can control the vibration mechanism 330 to generate vibration feedback based on the feedback control signal. In some implementations, the circuit board 340 can be connected to the embedded controller (EC) of the electronic device 100 through an electrical connection component 370, and the processor 101 is connected to the embedded controller. The embedded controller receives the touch signals and pressure signals processed by the circuit board 340, transmits the touch signals and pressure signals to the processor 101, and generates a feedback control signal based on the pressure signals and touch signals. The circuit board 340 can control the vibration mechanism 330 to generate vibration feedback based on the feedback control signal.

[0069] In the embodiments of this application, the touch layer and device area of ​​the pressure touch device are designed separately. The touch layer is customized according to the product industrial design, reducing the difficulty of stackable design. The circuit board can be universally designed, making it more likely to achieve universal design for various products, reducing design difficulty, storage difficulty, and cost. The staggered layout of the circuit board and vibration mechanism under the touch layer reduces the overall thickness of the pressure touch device, thus reducing the product thickness. Special treatment is applied to the touch layer to design better light transmittance, which can meet the requirements of combining and applying it with optical devices such as ultrasonic fingerprint and optical fingerprint with logos. Since the thickness of the touch layer is reduced to a certain extent, it is easier to combine different motors, including thicker traditional motors and voice coil motors (VCM), thereby reducing costs.

[0070] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Although this application has disclosed preferred embodiments as above, it is not intended to limit this application. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this application. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A pressure-sensitive touch device, characterized in that, include: A thin-film touch sensor is disposed on the lower surface of the cover plate to detect touch operations applied to the upper surface of the cover plate and generate touch signals; A pressure sensor is used to detect pressing operations applied to the upper surface of the cover plate and generate a pressure signal; Vibration mechanism, used to generate vibration feedback; A circuit board is electrically connected to the thin-film touch sensor, the pressure sensor, and the vibration mechanism, and is arranged at least offset from the vibration mechanism on the lower surface of the thin-film touch sensor for processing the touch signal, the pressure signal, and controlling the vibration mechanism.

2. The pressure-sensitive touch device as described in claim 1, characterized in that, The circuit board is disposed in a first region on the lower surface of the thin-film touch sensor; The vibration mechanism is arranged in the second region on the lower surface of the thin-film touch sensor; The second region is located outside the first region and does not overlap with the first region.

3. The pressure-sensitive touch device as described in claim 1, characterized in that, The circuit board has a cutout portion, and the vibration mechanism passes at least partially through the cutout portion and is connected to the lower surface of the thin-film touch sensor.

4. The pressure-sensitive touch device as described in claim 1, characterized in that, The surface of the thin-film touch sensor is provided with detection electrodes; the circuit board is electrically connected to the detection electrodes.

5. The pressure-sensitive touch device as described in claim 4, characterized in that, The thin-film touch sensor includes: membrane substrate; A first detection electrode is disposed on the upper surface of the film substrate; A second detection electrode is disposed on the lower surface of the film substrate; A shielding layer disposed on the second detection electrode is used to shield the first detection electrode and the second detection electrode from electromagnetic interference.

6. The pressure-sensitive touch device as described in claim 5, characterized in that, The thin-film touch sensor also includes: The first pad portion is disposed on the first side of the lower surface of the film substrate; A first connection line passes through the film substrate and connects the first detection electrode to the first pad portion; A first connection component connects the first pad portion to a side of the circuit board near the first side; The second pad portion is disposed on the second side of the lower surface of the film substrate; The second connection line connects the second detection electrode to the second pad portion; The second connection component connects the second pad portion to the side of the circuit board near the second side.

7. The pressure-sensitive touch device as described in claim 1, characterized in that, The pressure touch device further includes: a bracket for fixing the pressure touch device; and an elastic pad disposed on the bracket. The pressure sensor includes: One or more capacitive pressure sensing components are sandwiched between the lower surface of the thin-film touch sensor and the elastic pad, for detecting the pressing operation and generating the pressure signal; An electrical connection assembly connects the capacitive pressure detection assembly to the circuit board for transmitting the pressure signal.

8. The pressure-sensitive touch device as described in claim 7, characterized in that, The pressure sensor includes: The first, second, third and fourth capacitive pressure detection components are located at the four corners of the membrane substrate, wherein the first and second capacitive pressure detection components are adjacent to each other, and the third and fourth capacitive pressure detection components are adjacent to each other. The first electrical connection assembly includes first and second connection terminals connected to the first and second capacitive pressure detection assemblies, and a third connection terminal connected to the circuit board; The second electrical connection assembly includes first and second connection terminals connected to the third and fourth capacitive pressure detection assemblies, and a third connection terminal connected to the circuit board.

9. The pressure-sensitive touch device as described in claim 1, characterized in that, The pressure sensor includes: One or more stress detection components are arranged on a bracket for fixing the pressure touch device, for detecting the pressing operation and generating the pressure signal; An electrical connection assembly connects the stress detection assembly to the circuit board for transmitting the pressure signal; The pressure touch device further includes: a bracket for fixing the pressure touch device; An elastic pad is sandwiched between the lower surface of the thin-film touch sensor and the bracket.

10. The pressure-sensitive touch device as described in claim 9, characterized in that, The pressure sensor includes: The first, second, third and fourth stress detection components are located at the four corners of the film substrate, wherein the first and second stress detection components are adjacent to each other, and the third and fourth stress detection components are adjacent to each other. The first electrical connection assembly includes first and second connection terminals connected to the first and second stress detection assemblies, and a third connection terminal connected to the circuit board; The second electrical connection assembly includes first and second connection terminals connected to the third and fourth stress detection assemblies, and a third connection terminal connected to the circuit board.

11. The pressure touch device as claimed in any one of claims 1 to 10, characterized in that, The vibration mechanism includes a linear motor disposed on the lower surface of the thin-film touch sensor.

12. The pressure touch device as claimed in any one of claims 1 to 10, characterized in that, The pressure touch device further includes: a bracket for fixing the pressure touch device; The vibration mechanism includes a voice coil motor, which includes a coil disposed on the lower surface of the thin-film touch sensor; a magnet disposed on the bracket and located below the coil; and a gap between the coil and the magnet.

13. The pressure touch device as described in any one of claims 1 to 10, characterized in that, The electronic components of the circuit board are arranged on the lower surface of the circuit board.

14. The pressure touch device according to any one of claims 1 to 10, characterized in that, The thin-film touch sensor also has an optical processing area, below which an optical sensor is disposed.

15. An electronic device, characterized in that, include: The pressure-sensitive touch device according to any one of claims 1 to 14; The processing unit is connected to the circuit board of the pressure touch device.

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