Array substrate, display substrate and display device
By designing a specific arrangement of bonding pads on the array substrate, staggering the first and second pads, and utilizing the space of the fourth peripheral area to arrange fan-out traces, the problem of achieving a narrow bezel on the bottom side of the display screen is solved, achieving the effects of bezel narrowing and cost reduction.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2026-01-04
- Publication Date
- 2026-07-23
AI Technical Summary
When electronic components such as driver chips or flexible circuit boards are bonded to the bottom bezel of a display, it is difficult to achieve a narrow bezel design. Existing technologies require increasing the width and area of the flexible circuit board, which increases the manufacturing difficulty and cost.
By designing a specific bonding pad arrangement on the array substrate, including the staggered arrangement of multiple first pads and second pads, fan-out traces are arranged using the space of the fourth peripheral area, reducing the bezel width while maintaining electrical connection with the driver chip.
This technology enables the narrowing of the bottom bezel of the display screen without increasing the width and area of the flexible circuit board, thereby reducing the manufacturing difficulty and cost.
Smart Images

Figure CN2026070062_23072026_PF_FP_ABST