Integrated radio unit (RU)

Abstract

The present disclosure relates to an integrated Radio Unit (RU) (108) and a multilayer printed circuit board (PCB) for the integrated RU (108) The integrated RU (108) includes a multilayer PCB comprising at least eighteen conductive and dielectric layers. The multilayer PCB includes a baseband section (202) and a radio frequency (RF) front-end section (204) comprising a plurality of RF chains (214-1 to 214-8). Each RF chain includes a driver power amplifier (316), a final stage power amplifier (322), and a low-noise amplifier (LNA) (342). Each RF chain is coupled to a cavity filter (216, 330) through a blind-mated RF interface. The multilayer PCB includes an embedded copper-coin structure (504) extending across multiple PCB layers and thermally coupled to at least one final stage power amplifier (322). The integrated RU (108) enables integration of RF and baseband subsystems on a single multilayer PCB with integrated thermal management.

Description

INTEGRATED RADIO UNIT (RU)RESERVATION OF RIGHTS

[0001] A portion of the disclosure of this patent document contains material, which is subject to intellectual property rights such as, but are not limited to, copyright, design, trademark, Integrated Circuit (IC) layout design, and / or trade dress protection, belonging to Jio Platforms Limited (JPL) or its affiliates (hereinafter referred as owner). The owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent files or records, but otherwise reserves all rights whatsoever. All rights to such intellectual property are fully reserved by the owner.FIELD OF DISCLOSURE

[0002] The embodiments of the present disclosure generally relate to communication networks. In particular, the present disclosure relates to an integrated Radio Unit (RU) for use in wireless communication networks.DEFINITIONS

[0003] As used in the present disclosure, the following terms are generally intended to have the meaning as set forth below, except to the extent that the context in which they are used to indicate otherwise.

[0004] The expression ‘Integrated Radio Unit (RU)’ used hereinafter in the specification refers to a compact network device that integrates a baseband section, an RF front-end section, a power supply section, a thermal management system, a memory section, and a clock section. The integrated RU combines all these critical sections into a single, compact, and efficient network device designed to handle the complex tasks involved in modem wireless communication, simplifying infrastructure deployment and operation.

[0005] The expression ‘Baseband Section’ used hereinafter in the specification refers to a component that is configured for digital signal processing, including encoding, modulation, and interfacing with the RF section. The baseband section ensures that the data is prepared for transmission or reception in a usable form.

[0006] The expression ‘RF Front-End Section’ used hereinafter in the specification refers to the part of the RU handling the transmission and reception of radio frequency signals, including amplifiers and filters. The RF front-end section ensures that the transmitted signals are properly sent out and received signals are correctly captured and processed.

[0007] The expression ‘5GNew Radio (NR) Two Carriers’ used hereinafter in the specification refers to radio frequency carriers used for 5G communication, each supporting up to 100 MHz occupied bandwidth (OBW). Occupied Bandwidth (OBW) refers to the range of frequencies within a signal's spectrum that contains a specified percentage of the total signal's power. OBW is often used in telecommunications and wireless communication to describe the bandwidth usedby a signal that is not spread too thin or overly concentrated.

[0008] The expression ‘Fronthaul Interface’ used hereinafter in the specification refers to a high-speed optical connectivity interface between the integrated RU and the centralized unit-distributed unit (CU-DU). The Fronthaul interface enables the high-bandwidth transmission of data, control, and synchronization signals between these network components, playing a crucial role in ensuring the performance and efficiency of the networks.

[0009] The expression ‘Dual 25G Optical Interface’ used hereinafter in the specification refers to two independent 25-gigabit-per-second (25G) optical links, used for both data transmission and synchronization purposes within the network. These dual high-speed optical links allow for high-throughput communication and precise timing, essential for maintaining synchronization between network elements in 5G communication systems.

[0010] The expression ‘Blind Mate’ used hereinafter in the specification refers to a mechanical design that enables seamless connectivity between components without the need for manual alignment or cabling. This design feature allows for easy and quick connection, reducing the complexity and time required for installation and maintenance in network systems.

[0011] The expression ‘Power Management Integrated Circuits (PMICs)’ used hereinafter in the specification refers to the integrated circuits for converting and regulating power supply voltages within the integrated RU. PMICs are essential for ensuring that the various components of the integrated RU receive the correct voltage levels required for optimal operation. They manage power distribution, minimize power loss, and contribute to the overall efficiency of the system.

[0012] The expression ‘Switching Regulator’ used hereinafter in the specification refers to a power supply component that efficiently converts an input voltage to a desired output voltage using high frequency switching techniques. Unlike linear regulators, switching regulators operate by rapidly switching the power transistor on and off, converting excess energy into usable voltage through inductive and capacitive filtering.

[0013] The expression ‘Low-Dropout Regulator (LDO)’ used hereinafter in the specification refers to a voltage regulator that provides a stable output voltage with minimal voltage drop between the input and output. The LDO is particularly useful in situations where the input voltage is close to the desired output voltage, enabling efficient regulation without requiring excessive power loss.

[0014] The expression ‘Embedded Copper Coin’ used hereinafter in the specification refers to a thermal management feature integrated into the Printed Circuit Board (PCB). The embedded copper coin is placed within the PCB to enhance heat dissipation by increasing the surface area available for heat transfer. The embedded copper coin helps in effectively conducting heat away from critical components, thereby improving the overall thermal performance.

[0015] The expression ‘System Synchronizer’ used hereinafter in the specification refers to a device or circuit ensuring synchronized operation across RU components.

[0016] The expression ‘Clock Generator’ used hereinafter in the specification refers to a circuit that generates clock signals for synchronized processing within the integrated RU.

[0017] The expression ‘Vertical Finned Heat Sink’ used hereinafter in the specification refers to a mechanical structure with vertical fins for efficient thermal dissipation.

[0018] The expression ‘Centralized Unit-Distributed Unit (CU-DU)’ used hereinafter in the specification refers to a 5G network architecture that splits baseband functions between centralized and distributed units.

[0019] The expression ‘Occupied Bandwidth (OBW)’ used hereinafter in the specification refers to the portion of the frequency spectrum occupied by a signal for effective communication.

[0020] These definitions are in addition to those expressed in the art.BACKGROUND OF DISCLOSURE

[0021] The following description of related art is intended to provide background information pertaining to the field of the disclosure. This section may include certain aspects of the art that may be related to various features of the present disclosure. However, it should be appreciated that this section be used only to enhance the understanding of the reader with respect to the present disclosure, and not as admissions of prior art.

[0022] As global data consumption continues to rise, mobile networks are experiencing increased demand for higher capacity and more reliable performance, particularly in terms of uplink coverage and data quality. Traditional solutions in existing cellular networks often struggle to meet these growing demands, especially in challenging areas like the cell edges. At these locations (cell edges), the signal strength weakens significantly due to the increased distance from the base station and environmental factors such as obstacles and interference. This results in degraded signal quality, which directly impacts the uplink performance (the transmission of data from the user device to the network).

[0023] To address the growing demand for higher capacity and reliable performance, especially at the cell edges, the deployment of Radio Units (RUs) in mobile networks must be optimized to enhance coverage and signal quality. Fifthgeneration (5G) wireless communication networks introduce advanced technologies such as Massive Multiple-Input Multiple-Output (MIMO) and millimeter-wave communications to achieve high spectral efficiency, increased data rates, and ultra-low latency.

[0024] Traditional Radio Frequency (RF) transceiver architectures, while effective for lower-frequency bands, encounter significant challenges when scaled for the complexity of multiple transceiver configurations in New Radio (NR) deployments. These challenges include increased power consumption, signal interference, and heat dissipation caused by the simultaneous operation of multiple RF chains. Furthermore, integration with advanced field-programmable gate array (FPGA) / Application-Specific Integrated Circuit (ASIC) components,synchronization across multiple clock domains, and power management for high-bandwidth data interfaces pose additional technical hurdles.

[0025] Existing solutions for Radio Frequency (RF) transceivers often fail to optimize the balance between performance, power efficiency, and scalability. The existing solutions lack robust RF section controls that efficiently manage Low-Noise Amplifiers (LNAs), Power Amplifiers (PAs), and signal combiners for concurrent Uplink (UL) and Downlink (DL) operations. Moreover, insufficient integration of memory subsystems and high-speed data interfaces, limits system performance and debugging capabilities.

[0026] Additionally, traditional radio units lack the flexibility and ease of installation required for rapid deployment in diverse site conditions, such as Ground-Based Towers (GBT), Ground Base Masts (GBM), and other tower sites. Additionally, traditional radio units lack the flexibility and ease of installation required for rapid deployment in diverse site conditions, such as Ground-Based Towers (GBT), Ground Base Masts (GBM), and other tower sites. These units are often cumbersome to deploy and fail to achieve the desired balance of high performance and low power consumption, which is critical for power efficiency and sustainability in modem network infrastructure.

[0027] Therefore, there is a need for a system and a method that can automate a network slice provisioning process to overcome the limitations of the prior art.OBJECTIVES OF THE PRESENT DISCLOSURE

[0028] Some of the objectives of the present disclosure, which at least one embodiment herein satisfies, are as listed herein below.

[0029] An objective of the present disclosure is to deliver high output power with improved efficiency.

[0030] Another objective of the present disclosure is to enhance coverage and capacity in wireless networks.

[0031] Another objective of the present disclosure is to reduce power consumption.

[0032] Another objective of the present disclosure is to enable the deployment of high-performance networks in demanding environments such as dense urban areas and high-traffic locations.

[0033] Another objective of the present disclosure is to provide a compact and lightweight radio unit for easy installation and deployment.

[0034] Another objective of the present disclosure is to provide an integrated radio unit that can be easily installed in tower sites, Ground-Based Towers (GBTs), and Ground Base Masts (GBMs), enabling quick deployment while delivering high performance with low power consumption, thereby making it a power-efficient solution.

[0035] Another objective of the present disclosure is to provide a Fifth Generation New Radio 8 Transmit and 8 Receive (5G NR 8T8R) radio unit developed based on a thermally efficient convection cooling system thatincorporates heat pipes for managing localized heat spots and optimized mechanical fins for reduced weight and size.

[0036] Another objective of the present disclosure is to provide the 5G NR 8T8R 320 W radio unit (RU) that improves the user experience at cell edges by extending uplink coverage due to enhanced sensitivity.

[0037] Other objectives and advantages of the present disclosure will be more apparent from the following description, which is not intended to limit the scope of the present disclosure.SUMMARY

[0038] In an exemplary embodiment, an integrated Radio Unit (RU). The integrated RU includes a multilayer printed circuit board (PCB) comprising at least eighteen layers. The integrated RU includes a baseband section provided on the multilayer PCB. The integrated RU includes a radio frequency (RF) front-end section provided on the multilayer PCB comprising a plurality of RF chains, each RF chain including atleast one of a driver power amplifier, a final stage power amplifier, and a low-noise amplifier (LNA), wherein each RF chain is coupled to a cavity filter, wherein each RF chain further comprises a blind-mated RF interface configured to couple to the cavity filter. The integrated RU includes an embedded copper coin structure extending across multiple layers of the multilayer PCB and thermally coupled to at least one of the final stage power amplifier.

[0039] In some embodiments, each driver power amplifier of each RF chain is configured as a Doherty driver amplifier and the final stage power amplifier of each RF chain is configured as a Gallium Nitride (GaN)-based Doherty amplifier.

[0040] In some embodiments, the final stage power amplifier is configured to deliver an output power corresponding to approximately 40 watts.

[0041] In some embodiments, the RF front-end section comprises eight transmit (T) chains and eight receive (R) chains forming an 8T8R configuration with an aggregate output power of approximately 320 watts.

[0042] In some embodiments, each cavity filter comprises eight filter paths, each filter path corresponding to a respective RF chain of the 8T8R configuration.

[0043] In some embodiments, the embedded copper-coin structure comprises a U-shaped or T-shaped cavity extending vertically across multiple layers of the multilayer PCB.

[0044] In some embodiments, the integrated RU includes a heat-sink assembly thermally coupled to the embedded copper coin structure.

[0045] In some embodiments, the heat-sink assembly comprises a plurality of cooling fins arranged on a single exterior side of the integrated RU.

[0046] In some embodiments, one or more heat pipes are thermally coupled between the embedded copper coin structure and the heat-sink assembly.

[0047] In some embodiments, the integrated RU includes a clock section, the clock section includes a system synchronizer integrated circuit and at least one programmable oscillator configured to distribute synchronization signals to the baseband section and the RF front-end section.

[0048] In some embodiments, the integrated RU includes a power supply section is provided on the multilayer PCB configured to supply power to the RF front-end section and the baseband section, and wherein the baseband section, the RF front-end section, and the power supply section are electrically interconnected through conductive layers of the multilayer PCB.

[0049] In an exemplary embodiment, a multilayer printed circuit board (PCB) for an integrated Radio Unit (RU) is disclosed. The multilayer PCB includes a plurality of conductive and dielectric layers comprising at least eighteen or more layers. The multilayer PCB includes a baseband section provided on the multilayer PCB. The multilayer PCB includes a radio frequency (RF) front-end section comprising a plurality of RF chains, each RF chain including atleast one of a driver power amplifier, a final stage power amplifier, and a low-noise amplifier (LNA), wherein each RF chain is coupled to a cavity filter, wherein each RF chain further comprises a blind-mated RF interface configured to couple to the cavity filter. The multilayer PCB includes an embedded copper-coin structure extending across multiple PCB layers and thermally coupled to at least one of the final stage power amplifier.

[0050] In some embodiments, the driver power amplifier is configured as a Doherty driver amplifier and the final stage power amplifier is configured as a Gallium Nitride (GaN)-based Doherty amplifier.

[0051] In some embodiments, the embedded copper coin structure comprises a U-shaped or T-shaped cavity extending vertically across multiple layers of the multilayer PCB.

[0052] In some embodiments, the embedded copper-coin structure extends vertically through multiple conductive and dielectric layers of the multilayer PCB.

[0053] In some embodiments, one or more drilled through-holes are formed in proximity to the embedded copper-coin structure.

[0054] In some embodiments, the RF front-end section comprises eight transmit (T) chains and eight receive (R) chains forming an 8T8R configuration with an aggregate output power of approximately 320 watts.

[0055] In some embodiments, the multilayer PCB includes high-speed digital signal traces routed on conductive layers adjacent to RF signal layers.

[0056] In some embodiments, the high-speed digital signal traces are configured for operation at approximately 25 Gigabits per second.

[0057] The foregoing general description of the illustrative embodiments and the following detailed description thereof are merely exemplary aspects of the teachings of this disclosure and are not restrictive.BRIEF DESCRIPTION OF DRAWINGS

[0058] The accompanying drawings, which are incorporated herein, and constitute a part of this disclosure, illustrate exemplary embodiments of the disclosed methods and systems in which like reference numerals refer to the same parts throughout the different drawings. Components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Some drawings may indicate the componentsusing block diagrams and may not represent the internal circuitry of each component. It will be appreciated by those skilled in the art that disclosure of such drawings includes the disclosure of electrical components, electronic components or circuitry commonly used to implement such components.

[0059] FIG. 1 illustrates an exemplary network architecture for implementing an integrated radio unit (RU) in a network, in accordance with embodiments of the present disclosure.

[0060] FIG. 2A illustrates an exemplary structural architecture of the integrated RU, in accordance with embodiments of the present disclosure.

[0061] FIG. 2B illustrates another exemplary structural architecture of the integrated RU, in accordance with embodiments of the present disclosure.

[0062] FIG. 3 illustrates an exemplary block diagram of a Radio Frequency (RF) front-end section, in accordance with embodiments of the present disclosure.

[0063] FIG. 4 illustrates an exemplary block diagram of a clock section, in accordance with embodiments of the present disclosure.

[0064] FIG. 5 illustrates an exemplary architecture of a thermal management unit, in accordance with embodiments of the present disclosure.

[0065] FIG. 6 illustrates an exemplary computer system in which or with which embodiments of the present disclosure may be implemented

[0066] The foregoing shall be more apparent from the following more detailed description of the disclosure.LIST OF REFERENCE NUMERALS100 - Network Architecture102-1, 102-2 - Users104-1, 104-2 - User equipments112-1, 112-2 - Base stations106 - Network108 - Integrated Radio Unit (RU)200A, 200B - Structural architecture202 - Baseband section204 - Radio Frequency (RF) front-end section206 - Power supply section208 - Thermal management unit210 - Memory section212 - Clock section214-1, 214-2...214-8- Plurality ofRF chains216, 330 - Cavity filter218, 406 - Baseband and the Radio Frequency (RF) transceiver Application-Specific Integrated Circuit (ASIC)300 - Block diagram of RF front-end section302 - Transmission chain (Tx)304 - Feedback306 - Reception chain (Rx)308 - Filter310 - Gain block312 - Digital Step Attenuator (DSA)314 - Pre-driver amplifier316 - Driver Power Amplifier (PA)318 - Circulator320 - Coupler322 - Power amplifier324 - Coupler326 - Circulator328 - RF Connector332 - RF Port O334 - Attenuation336 - Filter338 - First switch340 - Second switch342 - Low-Noise Amplifier (LNA)344 - Filter346 - Digital Step Attenuator (DSA)348 - Gain block400 - Block diagram of clock section402 - System synchronizer404 - Phase-Locked Loops (PLLs) and the clock generator500 - Block diagram of thermal management unit502 - U-shaped cavity504 - U-shaped embedded copper coin600 - Computer system610 - External storage device620 - Bus630 - Main memory640 - Read only memory650 - Mass storage device660 - Communication port(s)670 - ProcessorDETAILED DESCRIPTION OF DISCLOSURE

[0067] In the following description, for the purposes of explanation, various specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent, however, that embodiments of the present disclosure may be practiced without these specific details. Several features described hereafter can each be used independently of one another or with any combination of other features. An individual feature may not address all of the problems discussed above or might address only some of the problems discussed above. Some of the problems discussed above might not be fully addressed by any of the features described herein.

[0068] The ensuing description provides exemplary embodiments only, and is not intended to limit the scope, applicability, or configuration of the disclosure. Rather, the ensuing description of the exemplary embodiments will provide those skilled in the art with an enabling description for implementing an exemplary embodiment. It should be understood that various changes may be made in the function and arrangement of elements without departing from the spirit and scope of the disclosure as set forth.

[0069] Specific details are given in the following description to provide a thorough understanding of the embodiments. However, it will be understood by one of ordinary skill in the art that the embodiments may be practiced without these specific details. For example, circuits, systems, networks, processes, and other components may be shown as components in block diagram form in order not to obscure the embodiments in unnecessary detail. In other instances, well-known circuits, processes, algorithms, structures, and techniques may be shown without unnecessary detail in order to avoid obscuring the embodiments.

[0070] Also, it is noted that individual embodiments may be described as a process which is depicted as a flowchart, a flow diagram, a data flow diagram, a structure diagram, or a block diagram. Although a flowchart may describe the operations as a sequential process, many of the operations can be performed in parallel or concurrently. In addition, the order of the operations may be re-arranged. A process is terminated when its operations are completed but could have additional steps not included in a figure. A process may correspond to a method, a function, a procedure, a subroutine, a subprogram, etc. When a process corresponds to a function, its termination can correspond to a return of the function to the calling function or the main function.

[0071] The word “exemplary” and / or “demonstrative” is used herein to mean serving as an example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples. In addition, any aspect or design described herein as “exemplary” and / or “demonstrative” is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it meant to preclude equivalent exemplary structures and techniques known to those of ordinary skill in the art. Furthermore, to the extent that the terms “includes,” “has,” “contains,” and other similar words are used in either the detailed description or the claims, such terms are intended to be inclusive in a manner similar to the term “comprising” as an open transition word without precluding any additional or other elements.

[0072] Reference throughout this specification to “one embodiment” or “an embodiment” or “an instance” or “one instance” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0073] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and / or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0074] The present disclosure relates to an integrated Radio Unit (RU) configured to enhance coverage and capacity in wireless communication networks. In one embodiment, the integrated RU constitutes a Fifth Generation (5G) New Radio (NR) 8 Transmitter 8 Receiver (8T8R) system, which is a high-performance RU designed to deliver scalable and robust support for fifth generation (5G) NR networks. The integrated RU incorporates eight transmitters (8T) and eight receivers (8R) with an advanced Multiple-Input, Multiple-Output (MIMO) configuration to improve throughput, reliability, and coverage in communication systems.

[0075] The integrated RU achieves a total output power of 320 W, delivering approximately 40 W or 46 dBm per antenna port, depending on configuration and use case. This power capability supports coverage across geographical areas and high-capacity data transmissions, thereby catering to environments with demanding network requirements. Additionally, the integrated RU supports dual-carrier operations, enabling simultaneous utilization of multiple frequency channel in n78 band, which enhances deployment flexibility, data rates, and capacity by aggregating carriers for improved throughput and optimized spectrum utilization.

[0076] The integrated RU may be employed for large-area coverage and long-range signal transmission. The integrated RU is particularly optimized for coverage at cell edges, which are traditionally challenging areas in wireless communication networks. The high-power output and MIMO configuration support improved signal conditions at coverage boundaries.

[0077] The integrated RU may be deployed in dense urban environments characterized by high concentrations of users within confined areas. The 8T8RRU addresses the substantial demand for data and network capacity in such high-density scenarios by managing heavy traffic volumes while maintaining high-speed connectivity. The advanced design of the integrated RU is particularly advantageous for deployment in hot zones or high-demand areas, including stadiums, concert venues, and urban centers, where high Quality of Service (QoS) and throughput are critical for delivering superior user experiences in applications such as video streaming, online gaming, and real-time communications.

[0078] In another aspect, the integrated RU is optimized for high-traffic and high-demand environments, including business districts and transportation hubs.The integrated RU 320 W power output and dual-carrier functionality allow for efficient management of the substantial data generated in such scenarios, ensuring consistent, reliable, and high-speed service during peak usage periods. Additionally, the integrated RU is suitable for ultra-reliable and low-latency communication scenarios, making the integrated RU a preferred choice for applications in industrial automation, healthcare, and other mission-critical environments.

[0079] The integrated RU further enhances network performance by leveraging its high power and MIMO technology to support multiple spatial streams, resulting in increased data throughput and superior network efficiency. The integrated RU improves user experiences by ensuring robust signal strength and consistent connectivity, even for users at the periphery of coverage areas. The integrated RU support for dual carriers and frequency bands facilitates optimal spectrum utilization, thereby reducing network congestion and maximizing capacity.

[0080] The integrated RU is designed for scalability, allowing seamless integration into 5G networks as demand escalates. As mobile data consumption continues to grow, the integrated RU provides a future-ready solution capable of expanding coverage and capacity to meet evolving network requirements. Additionally, the integrated RU supports latency-sensitive applications, making the integrated RU an ideal solution for use cases such as autonomous vehicles, remote surgeries, and immersive media technologies.

[0081] In summary, the integrated RU provides a high-power 8T8R configuration supporting dual -carrier operation and multilayer PCB integration for 5G deployments. The high-power output, dual-carrier capability, and advanced MIMO configuration of the integrated RU makes it an optimal choice for dense urban areas, high-traffic zones, and applications requiring high QoS and reliable coverage. By delivering superior coverage, capacity, and data rates, the integrated RU addresses the growing demand for mobile data while supporting the continued advancement of the new technologies.

[0082] The various embodiments throughout the disclosure will be explained in more detail with reference to FIG. 1- FIG. 6.

[0083] FIG. 1 illustrates an exemplary network architecture (100) for implementing the integrated Radio Unit (RU) (108) in a network, in accordance with embodiments of the present disclosure.

[0084] Referring to FIG. 1, the exemplary network architecture (100) may include one or more User Equipments (UEs) (104-1, 104-2... 104-N) associated with one or more users (102-1, 102-2... 102 -N) in an environment. A person of ordinary skill in the art will understand that one or more users (102-1, 102-2... 102-N) may be individually referred to as the user (102) and collectively referred to as the users (102). Similarly, a person of ordinary skill in the art will understand that one or more user equipments (104-1, 104-2... 104-N) may be individually referred to as the user equipment (104) and collectively referred to as the user equipment (104). A person of ordinary skill in the art will appreciate that the terms “computingdevice(s)” and “user equipment” may be used interchangeably throughout the disclosure. Further, any number of the UEs (104) may be included without departing from the scope of the ongoing description. In an embodiment, each of the user equipment (104) may have a first unique identifier attribute associated therewith. In an embodiment, the first unique identifier attribute may be indicative of Mobile Station International Subscriber Directory Number (MSISDN), International Mobile Equipment Identity (IMEI) number, International Mobile Subscriber Identity (IMSI), Subscriber Permanent Identifier (SUPI) and the like.

[0085] In an embodiment, the UE (104) may include smart devices operating in a smart environment, for example, an Internet of Things (loT) system. In such an embodiment, the UE (104) may include but is not limited to, smartphones, smart watches, smart sensors (e.g., mechanical, thermal, electrical, magnetic, etc.), networked appliances, networked peripheral devices, networked lighting system, communication devices, networked vehicle accessories, networked vehicular devices, smart accessories, tablets, smart television (TV), computers, smart security system, smart home system, other devices for monitoring or interacting with or for the users (102) and / or entities, or any combination thereof. A person of ordinary skill in the art will appreciate that the user equipment (104) may include, but is not limited to, intelligent, multi -sensing, network-connected devices that can integrate seamlessly with each other and / or with a central server or a cloud-computing system or any other device that is network-connected.

[0086] In an embodiment, the UE (104) may include, but is not limited to, a handheld wireless communication device (e.g., a mobile phone, a smartphone, a phablet device, and so on), a wearable computer device (e.g., a head-mounted display computer device, a head-mounted camera device, a wristwatch computer device, and so on), a Global Positioning System (GPS) device, a laptop computer, a tablet computer, or another type of portable computer, a media playing device, a portable gaming system, and / or any other type of computer device with wireless communication capabilities, and the like. In an embodiment, the user equipment (104) may include but is not limited to, any electrical, electronic, electromechanical, or an equipment, or a combination of one or more of the above devices such as virtual reality (VR) devices, augmented reality (AR) devices, laptop, a general-purpose computer, desktop, personal digital assistant, tablet computer, mainframe computer, or any other computing device, the user equipment (104) may include one or more in-built or externally coupled accessories including, but not limited to, a visual aid device such as a camera, an audio aid, a microphone, a keyboard, and input devices for receiving input from the user (102) or the entity such as touchpad, touch-enabled screen, electronic pen, and the like. A person of ordinary skill in the art will appreciate that the user equipment (104) may not be restricted to the mentioned devices and various other devices may be used.

[0087] Referring to FIG. 1, the user equipment (104) may communicate with the integrated RU (108) via the network (106). The UE (104) may be communicatively coupled with the network (106). The communicative coupling comprises receiving, from the UE (104), a connection request by the network (106),sending an acknowledgment of the connection request to the UE (104), and transmitting a plurality of signals in response to the connection request. In an embodiment, the network (106) may include at least one of a Fourth Generation (4G) network, a Fifth Generation (5G) network, a Sixth Generation (6G) network, or the like. The network (106) may enable the user equipment (104) to communicate with other devices in the network architecture (100) and / or with the system (108). The network (106) may include a wireless card or another transceiver connection to facilitate this communication. In another embodiment, the network (106) may be implemented as or include any of a variety of different communication technologies such as a wide area network (WAN), a local area network (LAN), a wireless network, a mobile network, a Virtual Private Network (VPN), the Internet, the Public Switched Telephone Network (PSTN), or the like.

[0088] Although FIG. 1 shows exemplary components of the network architecture (100), in other embodiments, the network architecture (100) may include fewer components, different components, differently arranged components, or additional functional components than depicted in FIG. 1. Additionally, or alternatively, one or more components of the network architecture (100) may perform functions described as being performed by one or more other components of the network architecture (100).

[0089] FIG. 2A illustrates an architecture (200A) of the integrated RU (108), in accordance with embodiments of the present disclosure. The integrated RU (108) is a key component in wireless communication networks. The integrated RU (108) is responsible for transmitting and receiving radio signals to and from the UE (104) and connecting to other network parts, such as a Centralized Unit (CU).

[0090] In an embodiment, the architecture (200A) may comprise a baseband section (202), an RF front-end section (204), a power supply section (206), a thermal management unit (208), a memory section (210), and a clock section (212).

[0091] In an embodiment, the power supply section (206) is configured to provide power to all components of the integrated RU (108). The power supply section (206) is configured to convert a high-voltage direct current (DC) input power into the appropriate voltage levels required for operation of each of the baseband section (202), the RF front-end section (204), the clock section (212), and the thermal management unit (208).

[0092] In an embodiment, the power supply section (206) may be configured to receive a high-voltage DC input power (for example typical - 48 V to 50 V) via a connector interface that is coupled to an external power source. The external power source may include but is not limited to rectifiers or telecom battery systems, which are commonly used in telecommunications and network equipment. Upon receiving the input power, the power supply section (206) directs the received voltage to an internal power regulation circuit.

[0093] The internal power regulation circuit performs step-down voltage conversion, utilizing suitable regulation techniques such as buck conversion or other suitable methods to efficiently reduce the voltage to predetermined, stable, and precise output voltage levels. This ensures that the voltage supplied to variousinternal components is both reliable and accurate, minimizing the risk of power-related malfunctions or inefficiencies.

[0094] The power supply section (206) is further configured to provide specific regulated voltage outputs for different sections of the device. In an example, the power supply section (206) generates 48 V DC, which is supplied to support the operation of the RF amplifiers within the RF front-end section (204). The 48 V output is ideal for the high-power requirements of RF amplification in wireless communication systems. Additionally, the power supply section (206) may generate 12 V DC for powering other critical components, including the baseband section, memory units, and various auxiliary control circuits. These components require lower voltage levels to ensure proper operation without compromising their performance or functionality. In an example, the power supply section (206) generates 48 V DC output that is utilized to provide the necessary power to RF amplifiers within the RF front-end section (204) of a telecommunications system, such as a 5G base station. RF amplifiers, which are crucial for boosting the power of the radio frequency signals before transmission, require high-voltage DC input to achieve the power output needed for efficient long-range communication.

[0095] In an embodiment, the voltage regulation process may employ highly efficient switching regulators and DC-DC converters to minimize heat generation while maintaining operational reliability. These circuits are supported by capacitive filtering systems that remove voltage ripples and noise, ensuring clean and stable power output. Additionally, the power supply section (206) incorporates overvoltage and overcurrent protection circuits to safeguard downstream components from power surges or electrical faults.

[0096] In an embodiment, the power supply section (206) may distribute regulated power to various subsystems through one or more dedicated power rails in an 18-layer printed circuit board (PCB) of the integrated RU (108). The hybrid multi-layer PCB design is employed to provide high-density power distribution while ensuring minimal interference between different electrical circuits. The integration of power rails within the PCB is essential for efficiently managing the power requirements of the diverse components within the integrated RU (108). In an example, one of the dedicated power rails is a 48 V DC rail, which is routed to power the Doherty driver amplifiers and the high-power Doherty Gallium Nitride (GaN) amplifiers in the RF front-end section. The dedicated 48 V DC power rail facilitates efficient signal amplification by providing the necessary high-voltage power to the RF amplifiers, enabling them to boost the radio frequency signals with high efficiency. The use of GaN amplifiers is particularly beneficial due to their ability to handle higher power levels and operate at higher frequencies, which is critical for meeting the stringent performance requirements of the networks.

[0097] In a further example, another dedicated power rail may be a 12 V DC rail, which powers critical components in the baseband section. The 12 V DC is converted to various lower voltages based on requirements from different devices on board. Power management integrated chipset (PMIC), DC-DC converters and LDO regulators devices are used to generate these voltages. These generated lowervoltages rail supplies power to components such as the Application-Specific Integrated Circuit (ASIC) or Field-Programmable Gate Array (FPGA), memory units, and control logic circuits. These components are essential for processing baseband signals, managing data, and controlling the overall operation of the Radio Unit. The 12 V DC rail ensures that these lower-power components receive a stable and regulated supply, supporting the efficient operation of the integrated RU (108).

[0098] In an embodiment, the power supply section (206) may include one or more real-time monitoring circuits to track voltage levels, current consumption, and component temperatures. These monitoring features allow the integrated RU (108) to detect power anomalies, such as voltage fluctuations or overheating, and initiate protective actions as necessary. The integration of monitoring capabilities ensures uninterrupted and reliable operation of the integrated RU (108).

[0099] In an embodiment, the power supply section (206) works with the thermal management unit (208) to manage the heat dissipation. As the power supply section (206) converts high-voltage input to regulated DC output, significant heat may be generated due to power loss in the conversion circuitry. To ensure that the integrated RU (108) remains within operational temperature limits and to prevent thermal degradation of components, an integrated heat management system may be employed. Excess heat generated during RF signal power conversion due to Power Added Efficiency (PAE) of power amplifier is transferred to an embedded U coin, as referenced in FIG. 5, located within the PCB. The embedded U coin (502) is a copper-based thermal management feature specifically designed to conduct thermal energy away from heat-generating components in the RF Front End transmit section. The high thermal conductivity of copper allows for efficient heat transfer, ensuring that heat is quickly removed from critical components, thereby reducing the risk of overheating. Excess heat generated during RF signal power conversion due to Power Added Efficiency (PAE) of power amplifier may be transferred to an embedded U coin (502 ref. FIG. 5) in the PCB, which efficiently conducts thermal energy to a heat sink with vertical fins. This configuration provides thermal conduction from the multilayer PCB to the external heat sink.

[0100] In an embodiment, the power supply section (206) enables a seamless flow of energy within the integrated RU (108). The power supply section (206) is configured to receive - 48 V to 50 V DC input, which is converted into regulated output 12 V DC and 48 V DC. The output is then distributed to the respective components, ensuring synchronized operation across all sections.

[0101] In an embodiment, the baseband section (202) may be configured for signal processing and control functions. The baseband section (202) handles highspeed digital data streams received via the fronthaul interface and convert them into signals ready for RF transmission.

[0102] In an embodiment, the baseband section (202) may be configured for receiving high-speed digital data streams (digital data) through an optical fronthaul interface from a Distributed Unit (DU) or a Centralized Unit (CU) within the network 106. The DU is responsible for handling lower-layer functionalities in the Radio Access Network (RAN). The DU is deployed closer to the radio hardware(e.g., antennas, radio heads) and is designed to process real-time tasks that require low latency. The DU handles tasks related to the physical layer (Layer 1) and macroscopic control of the user equipment (UE). In an example, the optical fronthaul interface is a dual 25G optical fronthaul interface. Also, high-speed data interface denotes one or more serialized digital communication links configured to transfer data between the FPGA, RF transceiver, and the dual 25G optical interface at multi-gigabit data rates. These interfaces may operate using high-speed differential signalling and are configured to support data rates corresponding to approximately 25 Gigabits per second per lane. The CU is a network element that handles higher-layer functions within the RAN. The CU is responsible for processing tasks related to the control plane (signalling, management) and non-real-time user plane data. Unlike the DU, which is focused on low-latency tasks, the CU is optimized for computationally intensive operations that do not require immediate real-time processing. The dual 25G optical fronthaul interface ensures the seamless transfer of digital data streams required for processing and transmission, thereby enabling the efficient operation of the integrated RU (108). The dual 25G optical fronthaul interface establish a robust connection between the integrated RU (108) and the CU-DU, enabling seamless communication and synchronization. The dual 25G optical fronthaul interface is designed to adhere to an Open Radio Access Network (0-RAN) standards, ensuring interoperability within the network (106).

[0103] In an embodiment, the digital data received via the fronthaul interface is directed to an integrated circuit. In an example, the integrated circuit is an Application-Specific Integrated Circuit (ASIC) / Field-Programmable Gate Array (FPGA) with RF transceiver, the central processing unit of the baseband section (202). In an example, the ASIC / FPGA integrated with the RF transceiver may be configured to process the received digital data to generate the processed data. The ASIC / FPGA integrated with the RF transceiver serves as the core processing unit responsible for performing key tasks such as signal modulation, demodulation, coding, and decoding of the data. The use of ASIC or FPGA allows for high-speed, parallel processing of complex baseband functions, which are critical for ensuring efficient signal processing and maintaining network performance under varying loads. Advanced digital signal processing (DSP) functions are performed to prepare the data for RF transmission. In an example, the key functions may include:• Digital Up-Conversion (DUC): Converts baseband digital signals into a higher intermediate frequency range, aligning them with the target RF transmission frequency.• Crest Factor Reduction (CFR): Optimizes the power efficiency of the signals by reducing signal peaks, ensuring effective use of the power amplifiers in the RF front-end section.• Digital Pre-Distortion (DPD): Pre-compensates for distortions introduced by non-linearities in the RF amplification process, ensuring the transmitted signal maintains high fidelity and compliance with emission standards.

[0104] In an embodiment, after the signal processing, the processed digital signals may be routed to one or more Transmitter Digital-to- Analog Converters (Tx DACs). The Tx DACs are configured for transforming the processed digital signals into the analog RF signals. The Tx DACs are configured for transforming the processed digital signals into the analog RF signals. This conversion enables subsequent RF amplification and transmission through the RF front-end section. These analog RF signals are then passed to the RF front-end section, where they are amplified by the RF amplifiers, such as Doherty amplifiers, before being radiated through the antennas.

[0105] In an embodiment, the baseband section (202) also includes auxiliary control functions to manage synchronization across the integrated RU (108). A clock generator and a system synchronizer ensure that all signal processing tasks are precisely timed, facilitating smooth and coordinated operation with the digital front-end section (204). The clock generator is configured for producing accurate and stable timing signals that serve as the reference for all time-dependent operations within the baseband section. These timing signals are crucial for coordinating the activities of the digital signal processing blocks, including modulation, demodulation, coding, and decoding. The clock generator ensures that these operations occur in sync with the RF front-end section (204), which handles the analog RF signals. The system synchronizer is configured to operate in conjunction with the clock generator to maintain precise synchronization across the entire system, including both the baseband and RF processing units. The synchronizer ensures that the timing of signal processing tasks across the different subsystems, such as the baseband, RF front-end, and auxiliary control circuits is coordinated to prevent misalignment or timing errors.

[0106] In an embodiment, the baseband section (202) seamlessly integrates with other components of the integrated RU (108), ensuring the efficient flow of data from the fronthaul interface to the RF front-end section (204). The combination of high-speed fronthaul connectivity, advanced Digital Signal Processor (DSP) functions, and precise synchronization enables the integrated RU (108) to deliver high-performance signal processing capabilities for 5G NR deployments.

[0107] In an embodiment, the integrated RU (108) is configured to include the clock section (212), which serves the essential purpose of ensuring precise synchronization across all operational components within the integrated RU (108). The clock section (212) is critical for maintaining the timing accuracy required for seamless communication and processing across the baseband section (202) and the RF front-end section (204).

[0108] In an embodiment, the clock section (212) comprises the clock generator and the system synchronizer, which collectively produce and distribute timing signals throughout the integrated RU (108). The clock generator is designed to generate stable and accurate reference clock signals, which are the foundation for timing synchronization. The reference clock signals are used to align all data processing and transmission tasks to a common temporal framework.

[0109] In an embodiment, the system synchronizer operates in conjunction with the clock generator to ensure the coordination of processing tasks between the baseband section (202) and the RF front-end section (204). The synchronization ensures that data processed in the baseband section (202) is transmitted at precisely the right moment to the RF front-end section (204) for amplification and eventual transmission.

[0110] In an embodiment, the clock section (212) supports synchronization protocols and standards compliant with the network, ensuring compatibility and interoperability within the broader network infrastructure. The clock section (212) plays a vital role in maintaining the stability and reliability of the operation of the integrated RU (108), especially in scenarios involving high-speed data transfers and complex signal processing tasks. In an embodiment, the clock section (212) is designed with redundancy and fault-tolerance measures to safeguard against timing disruptions. This ensures continuous synchronization and prevents any degradation in performance due to clock-related errors or failures.

[0111] In an embodiment, the RF front-end section (204) is configured for amplifying and preparing RF signals for transmission to external antennas. The RF front-end section (204) is responsible for ensuring that the RF signals are optimized for high-quality transmission, adhering to the requirements of 5G NR networks.

[0112] In an embodiment, the RF front-end section (204) is configured to process the analog RF signals received from the baseband section (202). The RF signals are routed through a plurality of band-pass filters (BPFs) to remove unwanted frequencies and ensure that only the desired signal spectrum is passed through. The filtered signals then pass through digital step attenuators, which enable precise adjustment of signal power levels. These attenuators provide fine control over the signal strength, ensuring optimal performance and compliance with regulatory power limits

[0113] In an embodiment, the RF signal is then passed to a first stage of amplification which occurs in the Doherty driver amplifier, where the signals are boosted to an intermediate level. This initial amplification step prepares the signals for further enhancement while maintaining signal integrity. In an embodiment, the output from the Doherty driver amplifier is fed into the high-power Doherty gallium nitride (GaN) amplifiers, which perform the final-stage amplification. These amplifiers utilize gallium nitride (GaN) technology to achieve high efficiency and power output, enabling the RF signals to meet the necessary transmission power levels for 5G communication. The Doherty architecture is specifically designed to enhance efficiency, especially at peak power levels, making it ideal for the demanding requirements of 5GNR systems.

[0114] In an embodiment, the final step in the RF signal preparation involves directing the signals through an 8 -port cavity filter through blind mating, which acts as the interface between the RF front-end section (204) and the external antennas. The cavity filter ensures that the signals are properly conditioned for transmission and prevents interference by isolating the transmitted signals from unwanted noise or harmonics. The 8-port cavity filter ensures that the transmittedRF signals meet the necessary frequency characteristics for efficient transmission. The 8-port cavity filter performs precise filtering of the RF signals, ensuring that only the desired frequency components are passed through to the antennas. By attenuating out-of-band signals and harmonics, the 8-port cavity filter ensures that the transmission is clean, minimizing signal degradation and improving overall transmission quality. The 8-port cavity filter is configured to isolate the transmitted signals from unwanted noise or harmonics. The 8-port cavity filter effectively attenuates any spurious signals or harmonic distortions that may arise from the RF transmission process, thereby preventing interference with neighbouring channels and ensuring that the transmission complies with regulatory requirements for spectral purity.

[0115] The 8-port cavity filter may include multiple resonating cavities, each tuned to specific frequencies, allowing for precise filtering characteristics. By utilizing multiple ports, the filter can support multiple frequency bands, enabling it to efficiently manage signals in complex network environments and deliver reliable, interference-free transmission.

[0116] In an embodiment, the 8-port cavity filter is configured to blind-mate with the multilayer PCB through corresponding RF contact interfaces. The cavity filter is further configured to connect to external antennas through RF connectors. This design enhances the overall robustness and usability of the integrated RU (108) in field deployments. Blind Mating refers to a mechanical connection design that allows the interface to automatically align and securely connect without requiring manual intervention or precise alignment by the installer. This feature ensures that the connectivity between the 8-port cavity filter and the external antennas is both secure and reliable, minimizing the potential for human error during setup. By eliminating the need for precise alignment or external tools, the blind mating design enhances the ease of installation and maintenance, particularly in large-scale or remote deployments where efficiency is critical.

[0117] In an embodiment, the memory section (210) provides essential storage capabilities to support the operation of the system. The memory section (210) plays a pivotal role in maintaining system functionality by storing firmware, operational data, and configuration settings required by various components of the integrated RU (108), particularly the baseband section (202).

[0118] In an embodiment, the memory section (210) comprises multiple types of memory devices, each tailored to meet specific storage requirements essential for the efficient operation of the integrated RU (108). The memory devices work in tandem to ensure smooth functionality, data retention, and adaptability of the integrated RU (108).

[0119] In an embodiment, a Double Data Rate 4 (DDR4) Memory is a highspeed dynamic memory designed to support real-time processing in the baseband and RF transceiver ASIC. The memory section (210) enables the seamless execution of advanced digital signal processing functions, including digital up-conversion (DUC) for frequency adjustment, digital pre-distortion (DPD) for signal correction, and crest factor reduction (CFR) for optimizing power efficiency. Byproviding rapid access and processing capabilities, the DDR4 memory ensures the high-speed operations required in modem communication systems.

[0120] In an embodiment, the Embedded Multimedia Card (eMMC) serves as a reliable non-volatile storage medium for system firmware and critical operational data. The memory section (210) ensures the integrated RU (108) can boot up correctly, maintain stable operation during runtime, and securely store essential software components. The eMMC robust design makes it well-suited for handling frequent read / write operations without compromising data integrity.

[0121] In an embodiment, the flash memory is employed for long-term storage of configuration files, software updates, and other critical data. The flash memory provides a reliable medium for storing information that may need to be accessed or modified periodically. The flash memory plays a crucial role in enabling over-the-air (OTA) updates, ensuring that the integrated RU (108) remains adaptable and future-ready as new features and enhancements are rolled out.

[0122] In an embodiment, the EEPROM (Electrically Erasable Programmable Read-Only Memory) is used to store persistent settings, such as calibration parameters, system identifiers, and other critical data that must remain intact across power cycles. By retaining data even when the integrated RU (108) is powered off, the EEPROM ensures consistency in operational configurations and facilitates smooth transitions during system restarts.

[0123] The memory devices collectively empower the memory section (210) to handle diverse storage demands efficiently, ensuring the reliable and robust operation of the integrated RU (108) in dynamic communication environments.

[0124] In an embodiment, the memory devices collectively ensure that the integrated RU (108) operates efficiently, with the ability to store and retrieve large volumes of data necessary for advanced 5G NR functionalities. The memory section (210) also supports the adaptability of the integrated RU (108) by enabling OTA updates and configuration changes, making the integrated RU (108) versatile and future ready.

[0125] In an aspect, an optimized PCB design is achieved by placing the high-power Doherty GaN power amplifier in a compact form factor to deliver 40 W per chain, resulting in an overall output power of 320 W in a hybrid multilayer substrate.

[0126] In an aspect, to optimize the efficiency of the integrated RU (108) a Doherty Driver amplifier is used in the RF Front End section (204) instead of the conventional Class AB amplifier, which operates in a very linear region.

[0127] In an aspect, advanced PCB embedded copper coin technology may be utilized in the integrated RU (108) to achieve a thermally efficient design. In an aspect, advanced PCB design techniques may be employed in the integrated RU (108) to integrate a high DC power system, complex high-speed interfaces running up to 2x 25G, and a high-power RF Front End design into a single board with 18 or more layers.

[0128] In an aspect, uplink coverage and performance in the integrated RU (108) may be improved by utilizing a sub-ldB ultra-low noise amplifier and a high-power SPDT switch for receiver protection.

[0129] In an aspect, an overall noise figure of 3.0 dB or less is achieved in the integrated RU (108) by using an LNA, a Single Pole, Double Throw switch, a digital gain control, and efficient RF layout techniques.

[0130] In an aspect, the integrated RU (108) includes a blind-mated and cable-less design with an integrated 8-port cavity filter.

[0131] In an aspect, the integrated RU (108) comprises a low PHY section of the LI layer with a network layer split of 7.2X, ORAN-compliant fronthaul on two 25G optical interfaces, and Digital Front End support using commercial-grade ASICs / FPGAs and 8 RF Transceiver chains.

[0132] In an aspect, Precision Time Protocol (PTP) and SyncE -based clock synchronization architecture is implemented in the integrated RU (108) on two 25G optical interfaces using a system synchronizer IC and clock generators.

[0133] In an aspect, the integrated RU (108) is power-efficient, with an overall power consumption of around 990W for two carriers, which significantly improves Operational Expenditure (OPEX).

[0134] In an aspect, the RF Front End section of the integrated RU (108) is cost-optimized by implementing fixed attenuation using passive components in the feedback path.

[0135] In an aspect, the integrated RU (108) features a low- weight and compact form factor.

[0136] In an aspect, the integrated RU (108) receives external -48 V input DC voltage and converts it to various lower voltages based on the requirements of different devices within the RU. Power management integrated chipsets (PMICs), DC-DC converters, and LDO regulators are used to generate these voltages.

[0137] In an aspect, the integrated RU (108) comprises lower LI layer processing and digital front-end support using commercial-grade ASICs / FPGAs to manage 8 transmit and receive chains.

[0138] In an aspect, the integrated RU (108) is synchronized using Precision Time Protocol Version 2 (PTPv2) over two 25G fronthaul interfaces. The integrated RU (108) includes an onboard synchronization circuit with ultra-low noise clock generation PLLs, a programmable oscillator, and a system synchronizer.

[0139] In an aspect, the integrated RU (108) is designed as a single PCB with 18 or more layers, accommodating complex subsystems such as ASICs, highspeed digital signals, switching power supplies, clock circuits, and radio frequency signals.

[0140] In an embodiment, the baseband section (202), the RF front-end section (204), and the power supply section (206) are integrated on a single multilayer PCB comprising eighteen or more conductive and dielectric layers, thereby eliminating inter-board cabling between these sections.

[0141] In an aspect, the integrated RU (108) includes PCB design techniques to route RF signals and high-speed signals, running at up to 25GT / s on adjacent layers while meeting design specifications.

[0142] In an aspect, the integrated RU (108) monitors the temperature of different sections using temperature sensors. This provides a complete thermal profile of the integrated RU (108), enabling software to take appropriate action in the event of thermal failure.

[0143] In an aspect, the integrated RU (108) includes transceivers that monitor Power Amplifier (PA) output by measuring the received power through the feedback chain. This power measurement is used in software to monitor total transmit power in a closed-loop system.

[0144] In an aspect, the RF front-end section (RFEB section) (204) of the integrated RU (108) delivers 320 W output power in an 8T8R configuration. The RFEB section refers to the portion of the integrated RU (108) that includes the plurality of TX RF chains, RX RF chains, Digital Pre-Distortion (DPD) chains, associated gain control components, switches, and filtering elements configured to process analog RF signals prior to transmission and after reception. The RF frontend section (204) consists of 8 transmit chains for signal transmission, 8 receive chains for signal reception, and 2 observation chains that act as DPD feedback paths from PAs to ASICs for linearization. Further, the notation “X8” indicates that the corresponding functional block is replicated eight times, consistent with the 8T8R configuration of the integrated RU (108). Similarly, the notation “X2” indicates duplication of the corresponding block, such as dual Digital Pre-Distortion (DPD) feedback paths. These multiplicity indicators are illustrative and represent scalable architectural replication.

[0145] In an aspect the connector represents a physical interface configured for interconnection between the RF front-end section (204) and external subsystems or testing modules. The debug emulator represents a debugging interface configured to access internal registers and operational states of the integrated circuit during development or maintenance. The surge protection represents protective circuitry configured to protect RF and control interfaces against voltage transients or electrostatic discharge (ESD). The testing platform represents external test equipment configured to interface with the integrated RU (108) during manufacturing validation or field diagnostics. The block labelled transceiver represents one or more integrated RF transceiver circuits configured to perform frequency conversion, analog-to-digital conversion (ADC), and digital-to-analog conversion (DAC) for transmit and receive paths. Multiple RF transceiver blocks may be instantiated to support the plurality of RF chains (214-1 to 214-8 (ref FIG.2B)).

[0146] In an aspect, the one or more Power Management Integrated Circuits (PMICs) are configured to regulate, monitor, and distribute voltage rails to the baseband section (202), the RF front-end section (204), the memory section (210), and the clock section (212).

[0147] In an aspect, reference markers A-I denote functional interfaces and sub-blocks associated with the integrated circuit RF transceiver and related subsystems. These reference markers are used for illustration clarity and do not limit the structural implementation of the integrated RU (108).

[0148] Reference marker A denotes clock input interfaces coupled from the clock section (212) to the integrated circuit RF transceiver, providing synchronized clock signals for RF and baseband processing.

[0149] Reference marker B denotes RF transceiver receive signal paths corresponding to one or more receive chains (RX), each associated with a respective antenna port.

[0150] Reference marker C denotes RF transceiver transmit signal paths corresponding to one or more transmit chains (TX), each associated with a respective antenna port.

[0151] Reference marker D denotes RF chain interconnection paths between the RF transceiver and the RF front-end section (204), including interfaces to driver amplifiers and final stage power amplifiers.

[0152] Reference marker E denotes a Joint Test Action Group (JTAG) interface configured for boundary scan testing, debugging, and device configuration of the integrated circuit.

[0153] Reference marker F denotes a Remote Electrical Tilt (RET) control interface configured to provide antenna tilt control signalling to compatible external antenna systems.

[0154] Reference marker G denotes high-speed memory interface paths between the integrated circuit and a Double Data Rate 4 (DDR4) memory device.

[0155] Reference marker H denotes a non-volatile memory interface between the integrated circuit and an embedded Multimedia Card (eMMC) device.

[0156] Reference marker I denotes an interface between the integrated circuit and flash memory devices configured to store firmware, configuration data, and software images.

[0157] In an aspect, each transmit chain in the integrated RU (108) includes a matching balun, a pre-driver amplifier, a Doherty driver amplifier, and a final high-power RF amplifier as the final stage PA.

[0158] In an aspect, each receive chain in the integrated RU (108) includes a high-power SPDT switch, a low-noise amplifier with a sub-ldB noise figure, a band-pass SAW filter, and a matching network.

[0159] In an aspect, each observation chain in the integrated RU (108) includes a directional coupler, fixed attenuation using passive components, and an SP4T switch. The SP4T switch is used to switch between four DPD feedback signals.

[0160] In an aspect, circulators and cavity filters are used between each RF switch and antenna port in the integrated RU (108).

[0161] In an aspect, the integrated RU (108) includes an RF calibration chain for channel correction.

[0162] In an aspect, high-order QAM transmissions are supported by the integrated RU (108), requiring a linear RF amplifier to handle the high peak-to-average power ratio (PAPR). A Doherty driver amplifier is used in place of conventional Class AB amplifiers to improve efficiency while maintaining linearity, particularly in high-PAPR scenarios.

[0163] In an aspect, a high-power Doherty GaN amplifier is used as the final stage power amplifier (322) in the integrated RU (108). The high-power Doherty GaN amplifier is designed in a multilayer substrate, with impedance mismatches minimized through accurate tuning of input and output matching elements using existing simulation tools.

[0164] In an aspect, the integrated RU (108) is thermally efficient, with its RF front-end section (204) delivering 40 W of high output power per antenna port. Embedded copper coin technology, combined with a U-shaped copper coin provides a ground connection for the GaN power amplifier, removing thermal energy from the multilayer PCB to a heat sink without requiring depth or protrusion on the heat sink. In an embodiment, the heat sink comprises a plurality of cooling fins arranged on a single exterior side of the integrated RU (108). Further, one or more drilled through-holes are formed adjacent to the embedded copper coin to enhance mechanical anchoring and thermal coupling to the heat sink.

[0165] In an embodiment, one or more internal conductive layers of the multilayer PCB are configured as dedicated DC power distribution planes.

[0166] In an aspect, the integrated RU (108) includes an 8-port cavity filter designed for an 8T8R configuration. The cavity filter provides a steeper roll-off outside the operating band to ensure better spectral performance. The cavity filter is connected to an external antenna that includes an integrated calibration circuit for precise channel correction.

[0167] In an aspect, the integrated RU (108) incorporates heat pipe-based mechanical housing with highly efficient heat pipes that feature superior thermal conductivity. These heat pipes effectively distribute localized heat from the ASIC and other components across the heat sink.

[0168] In an aspect, the mechanical heat sink of the integrated RU (108) features an innovative design with vertical fins to enhance heat dissipation capabilities. The integration of heat pipes into the finned heat sink reduces the overall product size and weight, resulting in a compact and lightweight solution.

[0169] In an aspect, the integrated RU (108) is designed to be compact and lightweight, with a total weight under 25kg. This design ensures optimal power efficiency while saving physical space, making it suitable for various deployment scenarios.

[0170] In an aspect, the heat pipe-based mechanical housing of the integrated RU (108) offers significant advantages, including weight reduction, improved thermal efficiency, high performance, and low power consumption, making it a reliable and efficient choice for high-power applications. The 320 W RU incorporates highly efficient heat pipes with superior thermal conductivity to effectively distribute localized heat of ASIC and across the heat sink. Theinnovative design of the mechanical heat sink featuring vertical fins enhances heat dissipation capabilities. By integrating heat pipes into the finned heat sink, the overall RU size and weight are reduced, resulting in a compact and lightweight solution within 25 kg. This compact design not only saves space but also ensures optimal power efficiency. Thus, the heat pipe based mechanical housing offers weight reduction, improved thermal efficiency, high performance and low power consumption making it a reliable and efficient choice.

[0171] FIG. 2B illustrates another exemplary block diagram (200B) of the integrated RU (108), in accordance with embodiments of the present disclosure.

[0172] In an embodiment, the integrated RU (108) comprises of the baseband section (202) and the RF front-end section (204). The baseband section (202) and the RF front-end section (204) are interconnected for seamless communication and signal processing between the fronthaul interface and external antennas. FIG. 2B highlights the data flow and key components involved in the operation of the integrated RU (108).

[0173] In an embodiment, the baseband section (202) includes a baseband and RF transceiver Application-Specific Integrated Circuit (ASIC) (214) that performs digital signal processing and acts as the core of the system. The baseband section (202) connects to the fronthaul interface, which serves as the communication link towards the Centralized Unit-Distributed Unit (CU-DU). The CU manages higher-layer protocols, including network control and user-plane data routing, while the DU handles real-time processing tasks, such as scheduling and physical layer operations, ensuring efficient and low-latency communication in the network (106). The fronthaul interface utilizes two 25G optical interfaces for highspeed data transmission, ensuring low latency and high bandwidth for modem communication networks. Key functionalities performed by the baseband section (202) may include Digital Up-Conversion (DUC), Crest Factor Reduction (CFR), Digital Pre-Distortion (DPD), and Digital Down-Conversion (DDC). Additionally, the baseband section (202) includes 8 Tx DACs, 8 Rx ADCs, and 2 Feedback ADCs, which facilitate the conversion of digital signals to the analog signals and vice versa for seamless RF signal transmission and reception.

[0174] In an embodiment, the RF front-end section (204) may include one or more RF Chains (RF Chain- 1 toRF Chain-8) (214-1, 214-2...214-8) that process RF signals for transmission to and reception from the external antennas. Each RF chain includes essential components such as Band-Pass Filters (BPFs), Gain Blocks, Digital Step Attenuators, Pre-Driver Amplifiers, Driver Amplifiers, and High-Power Doherty Amplifiers. These components work together to amplify, filter, and adjust signal power levels. The amplified signals are then routed through the 8-port cavity filter, which provides further signal filtering and interfaces with external antennas for transmission. This ensures the delivery of high-quality RF signals with minimal distortion and noise.

[0175] In an embodiment, the baseband and RF transceiver ASIC in the baseband section (202) interfaces with the plurality of RF chains (214-1, 214-2...214-8) in the RF front-end section (204) through dedicated connections for eachchain. These connections facilitate the flow of analog RF signals, ensuring efficient coordination between digital and RF signal processing tasks. This interaction is critical for maintaining synchronization and precision across all operations, enabling the integrated RU (108) to meet stringent performance requirements.

[0176] In an embodiment, the fronthaul interface enables communication between the integrated RU (108) and the CU-DU via two 25G optical links, ensuring the efficient transport of high-bandwidth data. On the other end, the RF signals processed by the plurality of RF chains (214-1, 214-2...214-8) are transmitted through the 8-port cavity filter (216), which connects to external antennas.

[0177] In an embodiment, the functional flow begins with the baseband section (202) receiving digital data via the fronthaul interface. The digital data is processed and converted to analog RF signals, which are sent to the RF front-end section (204). Here, the signals are amplified, filtered, and adjusted before being transmitted to the antennas through the cavity filter (216). Similarly, RF signals received from the antennas are routed back to the baseband section (202) for further processing.

[0178] Referring to FIG. 3, provides a detailed block diagram of a single RF Chain (RF Chain 0) (300), showcasing the components and flow of signals across the Transmission Chain (Tx) (302), a Reception Chain (Rx) (306), and feedback (304) within the integrated radio unit (RU) (108). The feedback (304) in the RF Chain (300) is used to monitor transmit signal for calibration, fault detection, and system optimization. FIG. 3 illustrates the seamless operation of signal processing in each chain, ensuring efficient and high-quality wireless communication.

[0179] In an embodiment, the transmission path begins with a signal entering a filter (308). The filter (308) eliminates unwanted frequency components, ensuring that only the desired frequency range is passed through for further processing. This is crucial for maintaining signal integrity and avoiding interference with other signals.

[0180] In an embodiment, after filtering, the signal enters the gain block (310), where it is amplified to ensure sufficient power for further processing. This stage ensures that the signal strength is adequate for subsequent stages without introducing significant noise.

[0181] In an embodiment, the amplified signal then passes through the Digital Step Attenuator (DSA) (312) to dynamically adjust the signal power level as needed, ensuring optimal performance under varying conditions. In an embodiment, the attenuated signal is fed into a pre-driver amplifier (314), which further amplifies the signal to prepare it for the next stage. This step is essential to provide sufficient power for a driver Power Amplifier (PA) (316).

[0182] In an embodiment, the driver PA (316) provides a significant boost to the signal power, making it suitable for transmission. From here, the signal passes through a circulator (318), which isolates the transmit and receive paths, preventing interference between the transmit and receive paths. In an embodiment, the output from the circulator (318) acts as an isolator by connecting 50-ohm terminationresistance externally and it is used to avoid any interstage impedance mismatch and to provide isolation between driver and final amplifier stages. The output is directed to a hybrid coupler (320), which splits the signal into two amplification paths: one goes through the carrier amplifier, and the other goes through the peak amplifier. The carrier amplifier provides amplification across the entire signal range, while the peak amplifier contributes additional power during peak signal conditions, which enhances the efficiency of the system, especially during high peak-to-average power ratio (PAPR) scenarios common in 5G signals. In an embodiment, the fully amplified signal from the power amplifier (322) is routed through another coupler (324) and a second circulator (326) to an RF connector (328), which interfaces with the external antenna system. Before reaching the antenna, the signal passes through a cavity filter (330), ensuring only the desired frequency components are transmitted via a RF Port 0 (332).

[0183] In an embodiment, the feedback path begins with a portion of the transmitted signal being diverted by the coupler (324). In an embodiment, the filtered feedback signal is then attenuated (334) using fixed attenuation components, which help bring the signal within a measurable range without introducing noise. This ensures that the integrated RU (108) can accurately assess the performance of the transmitted signal.

[0184] In an embodiment, the feedback signal may be passed through a filter (336), which removes any unwanted frequency components, ensuring accurate signal measurement and analysis.

[0185] In an embodiment, the feedback signal first passes through a first switch (338), which enables selection between different feedback chains (e.g., Feedback Chain 0 to Feedback Chain 3). This flexibility allows the integrated RU (108) to monitor multiple parameters or configurations as needed.

[0186] In an embodiment, the reception path starts with the incoming signal passing through a second switch (340), which controls the flow of signals into the receive chain. The signal then enters a Low-Noise Amplifier (LNA) (342), which boosts the signal strength while minimizing added noise. This ensures that weak incoming signals can be processed effectively.

[0187] In an embodiment, the amplified signal from the LNA (342) is passed through a filter (344), which removes unwanted frequencies and ensures only the desired signal components are processed further.

[0188] In an embodiment, the filtered signal then enters another Digital Step Attenuator (DSA) (346) for precise attenuation control, allowing the system (100) to optimize the signal level before further processing.

[0189] In an embodiment, the signal is passed through a gain block (348), providing the final stage of amplification in the reception path. This prepares the signal for downstream processing, such as digital conversion or decoding.

[0190] FIG. 4 provides a block diagram (400) highlighting the interaction between the system synchroniser (402), the Phase-Locked Loops (PLLs) and the clock generator (404), and the baseband and the Radio Frequency (RF) transceiver Application-Specific Integrated Circuit (ASIC) (406). FIG. 4 complements FIG. 2Aby showing how timing and synchronization are achieved across various components of the clock section (212) to ensure efficient and coherent signal processing.

[0191] In an embodiment, the system synchroniser (402) is the primary component responsible for maintaining the timing and synchronization of the entire RF system. The system synchroniser (402) provides a reference signal to the PLLs and the clock generator (404), ensuring that all subsystems operate in a coordinated manner. The system synchroniser (402) ensures that the timing of the transmission, reception, and feedback paths described in FIG. 2A remains accurate, reducing errors caused by timing mismatches. The system synchroniser (402) is also responsible for feeding timing signals directly to the baseband and RF transceiver ASIC (406), establishing a direct synchronization channel for the RF front end section (204).

[0192] In an embodiment, the PLLs and the clock generator (404) are central to generating precise clock signals required for both the baseband section (202) and the RF front end section (204). The PLLs receive a reference signal from the system synchroniser (402), locking the output clock signals to the reference and ensuring stability and accuracy. The clock generator then distributes these clock signals to various subsystems, including the baseband and RF transceiver ASIC (406), to support operations like modulation, demodulation, and carrier frequency generation. By providing synchronized clock signals, the PLLs and the clock generator (404) ensures that the RF Chain (as shown in FIG. 2) functions seamlessly with minimal jitter and phase noise.

[0193] In an embodiment, the baseband and RF transceiver ASIC (406) is the core processing unit that interfaces with the transmission, reception, and feedback paths described in FIG. 2A. The baseband section (202) and the RF transceiver ASIC (406) handles signal modulation, encoding, decoding, and demodulation while ensuring precise timing with the help of synchronization signals received directly from both the system synchroniser (402) and the PLLs and the clock generator (404). The dual synchronization paths (one direct from the synchroniser and another via the clock generator) ensure redundancy and robustness in timing, enabling reliable communication even in challenging operating conditions.

[0194] FIG. 5 illustrates an exemplary architecture of a thermal management unit (500), in accordance with embodiments of the present disclosure. In an example, the thermal management unit (500) includes the U-shaped cavity (502) provided in the PCB using the U-shaped embedded copper coin (504). In an embodiment, the power supply section (206) works seamlessly with the thermal management unit (208) to handle heat dissipation. Excess heat generated during RF signal power conversion due to Power Added Efficiency (PAE) of the power amplifier is transferred to the U-shaped embedded copper coin (504) located within the multilayer PCB. The embedded copper coin (504) conducts thermal energy to a heat sink having vertical fins.

[0195] The thermal management unit (500) comprises a plurality of conductive and dielectric layers, represented as layers LI through LI 8. Further, the U-shaped cavity (502) extends from an upper portion of the PCB downward through multiple layers. Disposed within the U-shaped cavity (502) is the U-shaped embedded copper coin (504). The U-shaped embedded copper coin (504) extends vertically through multiple conductive and dielectric layers of the thermal management unit (500). In an embodiment, the U-shaped configuration of the embedded copper coin (504) provides dual vertical thermal conduction paths along opposing sidewalls of the cavity (502) while maintaining a central opening that accommodates routing of internal PCB layers and signal traces. The U-shaped geometry enables efficient thermal transfer from one or more surface-mounted high-power components to a heat-dissipating structure while preserving structural integrity of the multilayer PCB stack-up.

[0196] In the illustrated embodiment, the U-shaped embedded copper coin (504) occupies a central region of the thermal management unit (500) and is in thermal contact with one or more components mounted on the upper layers of the PCB, such as a final stage power amplifier. The vertical arms and base portion of the U-shaped embedded copper coin (504) extend across several PCB layers to provide a continuous metallic structure through the PCB thickness.

[0197] The U-shaped embedded copper coin (504) is configured to interface with a heat-dissipating structure positioned external to the PCB, such as the heat sink. In this manner, thermal energy generated by high-power components mounted on the PCB is conducted through the U-shaped embedded copper coin (504) toward the external heat-dissipating structure.

[0198] In another embodiment, the embedded copper coin (504) may be configured in a T-shaped geometry, wherein a vertical stem portion extends through multiple PCB layers and a transverse cross-member portion increases lateral thermal spreading across adjacent layers. The T-shaped configuration enhances distribution of localized thermal energy across a broader area of the multilayer PCB while maintaining mechanical anchoring within the cavity structure.

[0199] The illustrated arrangement enables integration of the embedded copper structure within the multilayer PCB stack-up without requiring a protruding heat spreader external to the PCB layers.

[0200] FIG. 6 illustrates a computer system (600) in which or with which the embodiments of the present disclosure may be implemented.

[0201] As shown in FIG. 6, the computer system (600) may include an external storage device (610), a bus (620), a main memory (630), a read-only memory (640), a mass storage device (650), communication port(s) (660), and a processor (670). A person skilled in the art will appreciate that the computer system may include more than one processor and communication ports. The processor (670) may include various modules associated with embodiments of the present disclosure. The communication port(s) (660) may be any of an RS-232 port for use with a modem -based dialup connection, a 10 / 100 Ethernet port, a Gigabit or 10 Gigabit port using copper or fiber, a serial port, a parallel port, or other existing orfuture ports. The communication port(s) (660) may be chosen depending on a network (106), such a Local Area Network (LAN), Wide Area Network (WAN), or any network to which the computer system connects.

[0202] The main memory (630) may be random access memory (RAM), or any other dynamic storage device commonly known in the art. The read-only memory (640) may be any static storage device(s) e.g., but not limited to, a Programmable Read Only Memory (PROM) chips for storing static information e.g., start-up or Basic Input / Output System (BIOS) instructions for the processor (670). The mass storage device (650) may be any current or future mass storage solution which can be used to store information and / or instructions. The mass storage device (650) includes, but is not limited to, Parallel Advanced Technology Attachment (PATA) or Serial Advanced Technology Attachment (SATA) hard disk drives or solid-state drives (internal or external, e.g., having Universal Serial Bus (USB) and / or Firewire interfaces), one or more optical discs, Redundant Array of Independent Disks (RAID) storage, e.g., an array of disks.

[0203] The bus (620) communicatively couples the processor (670) with the other memory, storage, and communication blocks. The bus (620) may be, e.g., a Peripheral Component Interconnect / Peripheral Component Interconnect Extended bus, Small Computer System Interface (SCSI), Universal Serial Bus (USB), or the like, for connecting expansion cards, drives, and other subsystems as well as other buses, such a Front Side Bus (FSB), which connects the processor (670) to the computer system.

[0204] Optionally, operator and administrative interfaces, e.g., a display, keyboard, joystick, and a cursor control device, may also be coupled to the bus (620) to support direct operator interaction with the computer system. Other operator and administrative interfaces can be provided through network connections connected through the communication port(s) (660). The components described above are meant only to exemplify various possibilities. In no way should the aforementioned exemplary computer system limit the scope of the present disclosure.

[0205] While considerable emphasis has been placed herein on the preferred embodiments, it will be appreciated that many embodiments can be made, and many changes can be made in the preferred embodiments without departing from the principles of the disclosure. These and other changes in the preferred embodiments of the disclosure will be apparent to those skilled in the art from the disclosure herein, whereby it is to be distinctly understood that the foregoing descriptive matter is to be implemented merely as illustrative of the disclosure and not as a limitation.

[0206] The present disclosure provides a technical advancement in high-power 5G radio unit design by introducing a single multilayer printed circuit board (PCB) architecture that integrates the baseband section, RF front-end section, and power supply section on a board having eighteen or more layers. An embedded U-shaped copper coin extending vertically through multiple PCB layers conducts heat from high-power RF amplifiers toward a heat-dissipating structure, eliminating theneed for separate thermal spreaders. The integration of Doherty driver amplifiers and GaN-based Doherty final stage power amplifiers on the same multilayer PCB, along with blind-mated coupling to a cavity filter and high-speed signal routing within the stack-up, enables compact integration of RF, digital, and power subsystems. The present disclosure reduces interconnections, improves structural efficiency, and supports high-power 8T8R radio configurations.ADVANTAGES OF THE PRESENT DISCLOSURE

[0207] The present disclosure provides an integrated multilayer copper coin-based single Printed Circuit Board (PCB) solution that blind mates with the cavity filter, creating a cableless design.

[0208] The present disclosure provides an integrated Radio Unit that integrates Radio Frequency (RF), baseband, and Direct Current (DC) power system in a single multilayer PCB, resulting in a cost-optimized system.

[0209] The present disclosure provides improved Fifth Generation (5G) coverage in the uplink due to an enhanced system noise figure and receiver diversity gain, along with increased data capacity in the downlink through support for two 100 MHz carriers.

[0210] The present disclosure provides a cost and weight-optimized, IP65-compliant, thermally efficient solution, which improves both Capital Expenditure (CAPEX) and Operational Expenditure (OPEX) for the network.

[0211] The present disclosure provides low power consumption and effective thermal management through an ingress-protected mechanical housing.

[0212] The present disclosure is an 8T8R Integrated RU having 200 MHz of OBW with increased carriers allows for efficient utilization of spectrum and thus provide better coverage, increased capacity and performance which will enhance user experience in data download rates to keep up with the customer demands.8T8R Integrated RU addresses critical challenges such as uplink coverage and data quality at the cell edges.

Claims

1. CLAIMSWe Claim:

1. An integrated Radio Unit (RU) (108), comprising:a multilayer printed circuit board (PCB) comprising at least eighteen layers;a baseband section (202) provided on the multilayer PCB;a radio frequency (RF) front-end section (204) provided on the multilayer PCB comprising a plurality ofRF chains (214-1, 214-2...214-8), each RF chain including atleast one of a driver power amplifier (316), a final stage power amplifier (322), and a low-noise amplifier (LNA) (342), wherein each RF chain is coupled to a cavity filter (216, 330), wherein each RF chain further comprises a blind-mated RF interface configured to couple to the cavity filter (216, 330); andan embedded copper coin structure (504) extending across multiple layers of the multilayer PCB and thermally coupled to at least one of the final stage power amplifier (322).

2. The integrated RU (108) as claimed in claim 1, wherein each driver power amplifier (316) of each RF chain is configured as a Doherty driver amplifier and the final stage power amplifier of each RF chain is configured as a Gallium Nitride (GaN)-based Doherty amplifier.

3. The integrated RU (108) as claimed in claim 2, wherein the final stage power amplifier (322) is configured to deliver an output power corresponding to approximately 40 watts.

4. The integrated RU (108) as claimed in claim 1, wherein the RF front-end section (204) comprises eight transmit (T) chains and eight receive (R) chains forming an 8T8R configuration with an aggregate output power of approximately 320 watts.

5. The integrated RU (108) as claimed in claim 1, wherein each cavity filter (216, 330) comprises eight filter paths, each filter path corresponding to a respective RF chain of the 8T8R configuration.

6. The integrated RU (108) as claimed in claim 1, wherein the embedded copper-coin structure (504) comprises a U-shaped or T-shaped cavity extending vertically across multiple layers of the multilayer PCB.

7. The integrated RU (108) as claimed in claim 1, further comprising a heatsink assembly thermally coupled to the embedded copper coin structure (504).

8. The integrated RU (108) as claimed in claim 7, wherein the heat-sink assembly comprises a plurality of cooling fins arranged on a single exterior side of the integrated RU (108).

9. The integrated RU (108) as claimed in claim 7, wherein one or more heat pipes are thermally coupled between the embedded copper coin structure (504) and the heat-sink assembly.

10. The integrated RU (108) as claimed in claim 1, comprising a clock section (212), the clock section (212) includes a system synchronizer integrated circuit (402) and at least one programmable oscillator (404) configured to distribute synchronization signals to the baseband section (202) and the RF front-end section (204).

11. The integrated RU (108) as claimed in claim 1, wherein a power supply section (206) is provided on the multilayer PCB configured to supply power to the RF front-end section (204) and the baseband section (202), and wherein the baseband section (202), the RF front-end section (204), and the power supply section (206) are electrically interconnected through conductive layers of the multilayer PCB.

12. A multilayer printed circuit board (PCB) for an integrated Radio Unit (RU) (108), comprising:a plurality of conductive and dielectric layers comprising at least eighteen or more layers;a baseband section (202) provided on the multilayer PCB; a radio frequency (RF) front-end section (204) comprising a plurality of RF chains (214-1, 214-2...214-8), each RF chain including atleast one of a driver power amplifier (316), a final stage power amplifier (322), and a low-noise amplifier (LNA) (342), wherein each RF chain is coupled to a cavity filter (216, 330), wherein each RF chain further comprises a blind-mated RF interface configured to couple to the cavity filter (216, 330); andan embedded copper-coin structure (504) extending across multiple PCB layers and thermally coupled to at least one of the final stage power amplifier (322).

13. The multilayer PCB as claimed in claim 12, wherein the driver power amplifier (316) is configured as a Doherty driver amplifier and the finalstage power amplifier (322) is configured as a Gallium Nitride (GaN)-based Doherty amplifier.

14. The multilayer PCB as claimed in claim 12, wherein the embedded copper coin structure (504) comprises a U-shaped or T-shaped cavity extending vertically across multiple layers of the multilayer PCB.

15. The multilayer PCB as claimed in claim 14, wherein the embedded copper- coin structure (504) extends vertically through multiple conductive and dielectric layers of the multilayer PCB.

16. The multilayer PCB as claimed in claim 14, wherein one or more drilled through-holes are formed in proximity to the embedded copper-coin structure (504).

17. The multilayer PCB as claimed in claim 12, the RF front-end section (204) comprises eight transmit (T) chains and eight receive (R) chains forming an 8T8R configuration with an aggregate output power of approximately 320 watts.

18. The multilayer PCB as claimed in claim 12, comprising high-speed digital signal traces routed on conductive layers adjacent to RF signal layers.

19. The multilayer PCB as claimed in claim 18, wherein the high-speed digital signal traces are configured for operation at approximately 25 Gigabits per second.

Images