Display having buffer structure and electronic device comprising same

Abstract

NOT VISIBLE DUE TO STATUS OF PATENT

Description

Display having a buffer structure and electronic device including the same

[0001] Various embodiments of the present disclosure relate to a display of an electronic device, and more particularly, to a display having a buffer structure and an electronic device including the same.

[0002] An electronic device may include a display that outputs visual information. The display may include an area for displaying information and peripheral circuitry formed around the area for displaying information. The peripheral circuitry may connect pixels formed in the area for displaying information of the display to a driving circuit of the display (e.g., a display driver IC (DDI)). The peripheral circuitry of the display may be formed on a member such as a flexible printed circuit board and / or a chip on plastic (COP).

[0003] The display may include a protective member to protect the edges of the display. For example, the protective member may be formed by molding a resin around the edges or corners of the display.

[0004] In order to increase the area ratio of the area displaying information on the front of the electronic device and reduce the area of ​​the inactive area (e.g., bezel), at least a portion of the peripheral circuit may be bent to the back of the display. The peripheral circuit portion of the display may be protected by a protective member. When the protective member is formed by resin molding, resin may be injected and cured on the outside and inside of the bend portion of the peripheral circuit. Despite the presence of the protective member, an impact applied from the outside of the electronic device may be directly transmitted to the bend portion through the protective member. The peripheral circuit portion is vulnerable to impact, and there is a risk that the conductive patterns of the peripheral circuit may be damaged, causing a malfunction or failure of the display of the electronic device.

[0005] According to various embodiments of the present disclosure, a display and an electronic device including the same can be provided with reduced risk of damage to a peripheral circuit portion on the display side.

[0006] An electronic device according to various embodiments of the present invention may be an electronic device including a display.

[0007] The above display may be placed under a transparent cover layer.

[0008] The display may include a back layer disposed beneath the transparent cover layer.

[0009] The display may include a panel layer disposed below the transparent cover layer and above the back layer. The panel layer may include a bending portion and a flat portion extending from the bending portion, and the bending portion may be bent such that the flat portion is disposed below the back layer.

[0010] The display may include a protective member comprising a first resin covering an outer circumferential surface of the bending portion and an air gap region positioned between a side surface of the rear layer and the bending portion. At least one of the side ends of the air gap region may be at least partially closed by at least one blocking member.

[0011] A display according to various embodiments of the present invention is configured to display visual information in a first direction, and may include a panel layer including a bending portion and a flat portion extending from the bending portion, and a rear layer positioned in a direction opposite to the first direction with respect to the panel layer. The bending portion may be bent such that the flat portion is positioned in a direction opposite to the first direction with respect to the rear layer. The display may further include a protective member including a first resin positioned on a surface of the bending portion facing the second direction. The display may further include an air gap region positioned between a surface of the rear layer facing the second direction and the bending portion.

[0012] According to various embodiments of the present disclosure, a display can be provided in which the risk of damage and failure due to external impact is reduced by allowing a buffer area formed on the inside of a bending portion of a display peripheral circuit portion to absorb impact transmitted through a protective member.

[0013] FIG. 1 is a block diagram of an exemplary electronic device capable of performing the operations described herein.

[0014] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.

[0015] FIG. 2b is a perspective view of the rear surface of an electronic device according to various embodiments of the present disclosure.

[0016] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0017] FIG. 4A is a front view showing a display of an electronic device according to various embodiments of the present invention.

[0018] FIG. 4b is a rear view of a display of an electronic device according to various embodiments of the present invention.

[0019] FIG. 4c is a cross-sectional view of a display of an electronic device according to various embodiments of the present invention.

[0020] FIG. 5A is a cross-sectional view of a display according to various embodiments of the present invention.

[0021] Figure 5b is a cross-sectional view of a display according to a comparative example.

[0022] FIG. 6A is a rear view of a display according to various embodiments.

[0023] FIG. 6b is a perspective view showing a blocking member of a display of various embodiments.

[0024] FIG. 6c is a rear view of a display according to various embodiments.

[0025] Figure 6d is an enlarged view showing a display of various embodiments.

[0026] FIG. 7a is a plan view of a display according to various embodiments.

[0027] FIG. 7b is a cross-sectional view of a display according to various embodiments.

[0028] Figure 7c is a perspective view of a bracket according to various embodiments.

[0029] FIG. 7d is a perspective view illustrating operations for placing a bracket on a display according to various embodiments.

[0030] FIG. 8A is a cross-sectional view showing a display according to various embodiments.

[0031] FIG. 8b is a plan view and a perspective view showing a display according to various embodiments.

[0032] FIG. 9A is a cross-sectional view of a display according to various embodiments.

[0033] FIG. 9b is a drawing showing an operation of manufacturing a display according to various embodiments of the present invention.

[0034] FIG. 1 is a block diagram of an exemplary electronic device (100) capable of performing the operations described in this document.

[0035] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in this document. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0036] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0037] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0038] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0039] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0040] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0041] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0042] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0043] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0044] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0045] Various embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (110)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0046] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0047] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0048] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A according to various embodiments of the present disclosure.

[0049] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (100) of FIG. 1 or may include other embodiments of the electronic device.

[0050] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by at least a portion of a substantially transparent front plate (202) (e.g., a glass plate including various coating layers, or a polymer plate, which may be referred to as a transparent cover layer, front plate, or window). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side frame (or “side member”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In some embodiments, the back plate (211) and the side frame (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0051] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side frame (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0052] According to one embodiment, the electronic device (200) may include at least one of a display (400), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0053] The display (400) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (400) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (400) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0054] The input device (203) may include a microphone. In some embodiments, the input device (203) may include multiple microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210). In some embodiments, the electronic device (200) may include a tray member arranged through at least a portion of the side frame (218).

[0055] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (400) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0056] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0057] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (400). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (400).

[0058] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element may provide a light source that is linked to the operation of the camera module (205), for example. The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0059] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0060] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (400). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (400). In one embodiment, an area where the display (400) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (400) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (400) facing the sensor module may not require a perforated opening.

[0061] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to various embodiments of the present disclosure.

[0062] Referring to FIG. 3, the electronic device (200) may include a side member (218) (e.g., the side frame (218) of FIGS. 2A and 2B), an inner frame (2181a) (e.g., an extension member or a support member), a front plate (202) (which may be referred to as, for example, a transparent cover layer, a front cover, or a window layer), a display (400), a substrate (240), a battery (250), a support bracket (260) (e.g., a rear case or a support member), an antenna (270), and a rear plate (211) (e.g., a rear cover). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the inner frame (2181a) or the support bracket (260)) or may additionally include other components. At least one of the components of the electronic device (200) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2a or FIG. 2b, and any overlapping description will be omitted below.

[0063] According to various embodiments, the inner frame (2181a) may be disposed inside the electronic device (200) and structurally coupled to the side member (218) or formed integrally with the side member (218). The inner frame (2181a) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The inner frame (2181a) may have a display (400) coupled to one surface and a substrate (240) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0064] The memory may include, for example, volatile memory or non-volatile memory.

[0065] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multi-media card) connector, or an audio connector.

[0066] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the substrate (340). The battery (250) may be integrally disposed within the electronic device (200). In one embodiment, the battery (250) may be disposed so as to be detachably attached to or detached from the electronic device (200).

[0067] Antenna (270) may be positioned between the rear plate (211) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a portion of the side member (218) and / or the inner frame (2181a), or a combination thereof.

[0068] FIG. 4A is a front view showing a display (400) of an electronic device according to various embodiments of the present invention.

[0069] FIG. 4b is a rear view of a display (400) of an electronic device according to various embodiments of the present invention.

[0070] FIG. 4c is a cross-sectional view of a display (400) of an electronic device according to various embodiments of the present invention.

[0071] Figure 4c is a cross-section taken along the 7-7 direction of Figure 2a.

[0072] Referring to FIGS. 4A and 4B, an electronic device (e.g., the electronic device (100) of FIG. 1 and the electronic device (200) of FIGS. 2A to 3) may include a display (400). The display (400) may include a front portion (401) facing a first direction (e.g., the z direction in the drawing), a rear portion (402) facing a direction opposite to the front portion (401) (e.g., the -z direction in the drawing), and a side portion (403) facing a side of the display (400) between the front portion (401) and the rear portion (402) (e.g., the x-axis direction and / or the y-axis direction in the drawing).

[0073] The display (400) may include a first region (408) (e.g., may be referred to as an “active region”) where visual information is displayed, and a second region (409) (e.g., may be referred to as a “bezel” or a “black matrix”) including a bending portion (430) (e.g., 430 of FIG. 4C) described below. A conductive pattern (e.g., a conductive pattern (432) of FIG. 6D) may be formed on the bending portion (430) and electrically connected to the first region (408) to supply information and signals to pixels of the first region (408).

[0074] Referring to FIGS. 4B and 4C , the display (400) may include a plurality of layers. For example, the display (400) may include a panel layer (411) configured to display visual information in a first direction (e.g., a z-direction in the drawing) and a back layer (415) disposed below (e.g., in a direction opposite to the first direction (-z-direction)) the panel layer (411). The back layer (415) may include layers such as a light absorbing layer (412), a protective layer (413), and / or a support plate (414). In various embodiments, a lower surface (e.g., a surface facing the -z-direction in the drawing) of a lowermost layer of the back layer (e.g., the support plate (414)) of the back layer (415) may be a back surface (402) of the display (400).

[0075] In various embodiments, an electronic device (e.g., an electronic device (100) of FIG. 1, an electronic device (200) of FIGS. 2A, 2B, and 3) includes a transparent cover layer (202) (e.g., a front plate (202) of FIGS. 2A, 2B, and 3), and a display (400) can be disposed below (e.g., in the -z direction) the transparent cover layer (202). For example, a panel layer (411) can be disposed below the transparent cover layer (202), and a back layer (415) can be disposed below the panel layer (411).

[0076] In various embodiments, the panel layer (411) may include a bending portion (430). The bending portion (430) may be a portion extending in a second direction (e.g., the -y direction in the drawing, which may be referred to as a "lateral direction") from an edge of the panel layer (411). For example, one end (430b) of the bending portion (430) may be coupled to a lateral side of the panel layer (411). In various embodiments, the bending portion (430) may be an extension of a plastic substrate of the panel layer (411) of the display (400), such as a chip on plastic (COP). In some embodiments, the bending portion (430) may include a flexible substrate electrically connected to the substrate of the display (400), such as a chip on FPCB (COF). In various embodiments, the bending portion (430) may include peripheral circuitry that supplies electrical signals and power to a portion corresponding to, for example, the first region (408) of the display (400).

[0077] In various embodiments, the panel layer (411) may include a flat portion (430a) extending from the bending portion (430). The flat portion (430a) may be, for example, part of the COP or COF described above.

[0078] The flat portion (430a) may be operatively connected to some circuit elements of the display (400) (e.g., including a display driver IC (DDI) and a cable connector) located on the back surface (402) of the display (400). The bending portion (430) may be bent from the side of the display (400) in a downward direction of the display (400) (in the direction toward the back surface (402), e.g., the -z direction in the drawing). The bending portion (430) may be located on the side surface (403) of the display (400). For example, the bending portion (430) may be located in the second region (409) of the display (400). The flat portion (430a) can be positioned below the rear layer (415) of the display (400) by bending the bending portion (430) in a downward direction (e.g., in the opposite direction to the first direction, the -z direction in the drawing, and the direction toward the rear surface (402)). For example, the flat portion (430a) can be positioned on the rear surface (402) of the display (400). As described above, by bending the bending portion (430) and positioning it below the rear surface (415), the area ratio of the second area (e.g., the bezel and / or the black matrix) that is not used for displaying image information on the front surface of the display (400) can be reduced, and the area ratio of the first area (408) that displays visual information can be increased.

[0079] The inner and outer sides of the bending portion (430) can be defined based on the radius of curvature of the bending portion (430). That is, a position closer to the bending portion (430) in the direction of the radius of curvature from the center of curvature of the bending portion (430) can be referred to as the 'inner side of the bending portion (430)', and a position farther away from the bending portion (430) in the direction of the radius of curvature can be referred to as the 'outer side of the bending portion (430)'. For example, in FIG. 4c, an area located between a side (e.g., a side facing the second direction (-y direction)) of the rear layers (415) of the display (400) (e.g., a light absorbing layer (412), a protective layer (413), and / or a support plate (414)) and the bending portion (430) may be referred to as the 'inner side of the bending portion (430)', and an area located in the second direction (-y direction) with respect to the bending portion (430) may be defined as the 'outer side of the bending portion (430)'.

[0080] The display (400) may include a protective member (420). The protective member (420) may be positioned in an area adjacent to a side of the display (400), an area surrounded by the cover layer (202), the side frame (218), and the inner frame (2181a). The protective member (420) may be in close contact with the side (second direction, for example, the -y direction in the drawing) of the display (400). In various embodiments, the protective member (420) may be arranged to surround an outer surface (which may be referred to as an outer peripheral surface or outer periphery) (430c) of the bending portion (430).

[0081] In various embodiments, the protective member (420) may include a first resin (421) (e.g., an epoxy resin). For example, the protective member (420) may be formed by molding and curing the uncured first resin (421) against the side surface (431a) of the bending portion (430). The protective member (420) including the molded first resin (421) may be referred to by terms such as “molding” or “molding portion.”

[0082] In various embodiments, the display (400) may include a buffer region (440). The buffer region (440) may be located on the inside of the bending portion (430). In various embodiments, the buffer region (440) may include an air gap region (441). There may be a region on the inside of the bending portion (430) that is not filled with a material such as a resin (e.g., the first resin (421)). For example, the inside of the bending portion (430) may be completely or partially empty so that an air layer or air cell is formed.

[0083] FIG. 5A is a cross-sectional view of a display (400) according to various embodiments of the present invention.

[0084] Figure 5b is a cross-sectional view of a display (40) according to a comparative example.

[0085] Referring to FIG. 5A, when an external force or impact (F1) is applied to the side of the display (400) according to the present invention, the buffer area (440) located on the inside of the bending portion (430) can absorb the impact (F1). For example, the air gap area (441) of the buffer area (440) can provide a space in which the bending portion (430) can be deformed (S1) by the impact (F1). Therefore, damage to the bending portion (430) can be prevented and / or reduced.

[0086] Referring to FIG. 5b, the display (40) according to the comparative example may have the inner side of the bending portion (43) filled with resin. For example, the inner side of the bending portion (43) may be filled with resin and hardened during a resin molding process for forming a protective member (42). According to the comparative example, when a force or impact (F1) is applied to the side of the display (40), a reaction force (F2) generated from the resin filled in the inner side of the bending portion (43) is generated, and deformation of the bending portion (43) for absorbing the impact (F1) may be limited. Therefore, the risk of damage to the bending portion (43) due to the impact may increase.

[0087] FIG. 6A is a rear view of a display (400) according to various embodiments.

[0088] FIG. 6b is a perspective view showing a blocking member of a display (400) of various embodiments.

[0089] FIG. 6c is a rear view of a display (400) according to various embodiments.

[0090] FIG. 6d is an enlarged view showing a display (400) of various embodiments.

[0091] FIG. 6a is a drawing showing a display (400) with the protective member (420) of FIG. 6c removed.

[0092] Figure 6b is an enlarged view of part A of Figure 6a, and Figure 6d is an enlarged view of part B of Figure 6a.

[0093] Referring to FIGS. 6A to 6C , in various embodiments, the display (400) may include a dam. In various embodiments, the blocking member (450) may be positioned at a side end (431a) of the bending portion (430) in the width direction (e.g., the x-direction and / or the -x-direction in the drawing). In various embodiments, the blocking member (450) may include a first blocking member (450a) positioned at one of the two side ends (431a) of the bending portion and a second blocking member (450b) positioned at the other. In various embodiments, the blocking member (450) may be positioned at one of the two side ends (431a) of the bending portion. The blocking member (450) may completely or partially close the internal space of the bending portion (430) at the side end (431a) of the bending portion (430). For example, with respect to the side end (431a) of the bending portion (430) in an open state as in (1) of Fig. 6b, the side end (431a) of the bending portion (430) can be closed by positioning a blocking member (450) as in (2) of Fig. 6b.

[0094] Since the bending portion (430) is bent from the second direction (e.g., -y direction) to the opposite direction of the first direction (e.g., -z direction) and enters the back surface (402) of the display (400), both side ends (431a) of the bending portion (430) in the third direction (e.g., x direction or -x direction) may be open, so that the uncured first resin (421) may flow into the inside of the bending portion (430) when the first resin (421) is molded. Accordingly, the blocking member (450) may prevent or reduce the flow of the first resin (421) into the bending portion (430) by closing the side ends (431a) of the bending portion (430). The blocking member (450) may be referred to as a dam because it blocks the flow of the resin.

[0095] In various embodiments, the blocking member (450) may be formed by applying a viscous resin to the side end portion (431a) of the bending portion (430). The viscous resin may include an adhesive seal (451) (also referred to as a bond seal) made of a material such as silicone and / or synthetic rubber. For example, the blocking member (450) may be formed of the same material as the adhesive seal (407) used to seal other components of the display (400) during the manufacture of the display (400). That is, during the manufacture of the display (400), the operation of applying the blocking member (450) may be processed simultaneously and simultaneously with the operation of applying the adhesive seal (407).

[0096] Referring to FIG. 6c, in a state where a blocking member (450) is formed, a first resin (421) may be molded on the outside of the bending portion (430) to at least partially cover the blocking member (450), thereby forming a protective member (420), as shown in FIG. 6c. At this time, the blocking member (450) may prevent or reduce the first resin (421) from flowing into the inside of the bending portion (430) through both ends of the bending portion (430) during the molding of the first resin (421).

[0097] Referring to FIG. 6d, in various embodiments, the bending portion (430) may include a margin portion (433). The margin portion (433) may be an area adjacent to the side end portion (431a) of the bending portion (430), where the conductive pattern (432) is not formed. For example, the conductive pattern (432) may not be formed in an area that is a predetermined distance (W1) inward from the widthwise edge of the bending portion (430).

[0098] In various embodiments, the blocking member (450) may not overlap the bending portion (430) by a predetermined distance (W1). That is, the blocking member (450) may not be positioned to overlap the conductive pattern (432) of the bending portion (430). When the blocking member (450) overlaps the conductive pattern (432), various stresses applied from the outside may be transmitted to the conductive pattern (432) through the blocking member (450), which may cause damage and / or detachment of the conductive pattern (432), thereby increasing the risk of failure of the display (400).

[0099] In various embodiments, the width (W1) of the margin portion (433) may be set so that the blocking member (450) is not applied overlapping the conductive pattern (432). For example, the predetermined distance (W1) between the edge of the bending portion (430) and the conductive pattern (432) may be 50% or more of the width (W2) of the blocking member (450). Accordingly, when applying the blocking member (450), the overlapping of the conductive pattern (432) and the blocking member (450) can be prevented or reduced.

[0100] FIG. 7a is a plan view of a display (400) according to various embodiments.

[0101] FIG. 7b is a cross-sectional view of a display (400) according to various embodiments.

[0102] FIG. 7c is a perspective view of a bracket (460) according to various embodiments.

[0103] FIG. 7d is a perspective view illustrating operations for placing a bracket (460) on a display (400) according to various embodiments.

[0104] The cross-section of Fig. 7b is a cross-section taken along the CC direction of Fig. 7a.

[0105] Referring to FIGS. 7A to 7C, the display (400) may further include a bracket (460). The bracket (460) may be a member that protects some components of the rear surface (402) of the display (400). For example, it may be positioned to cover a portion of the bending portion (430) and / or the flat portion (430a) located toward the rear surface (402) of the display (400).

[0106] In various embodiments, the bracket (460) may have an internal space (460a). For example, referring to (1) and (2) of FIG. 7c, the bracket (460) may be a member having an internal space (460a) that is open in a first direction (e.g., the z direction in the drawing). Referring to FIG. 7b, the internal space (460a) of the bracket (460) may block or reduce the transmission of impact or force from the protective member (420) to a portion of the bending portion (430) and / or the flat portion (430a) covered by the bracket (460).

[0107] The bracket (460) can be attached to the back surface (402) of the display (400) by an adhesive seal (451) applied around the bracket (460). For example, referring to FIG. 7D, the bracket (460) is positioned in an area of ​​the back surface (402) of the display (400) that is to be covered by the bracket (460), and an adhesive seal (451) can be applied along the periphery of the bracket (460).

[0108] In various embodiments, the bracket (460) may be positioned adjacent to the side end (431a) of the bending portion (430). For example, the bracket (460) may be positioned such that a portion of the adhesive seal (451) applied around the bracket (460) closes the side end (431a) of the bending portion (430). Accordingly, the adhesive seal (451) may simultaneously perform the functions of attaching the bracket (460) and closing the side end (431a) of the bending portion (430).

[0109] FIG. 8A is a cross-sectional view showing a display (400) according to various embodiments.

[0110] FIG. 8b is a plan view and a perspective view showing a display (400) according to various embodiments.

[0111] The cross-section of Fig. 8a is a cross-section along the DD direction of Fig. 8b.

[0112] Referring to FIG. 8A, the buffer region (440) may include a second resin (442). For example, the second resin (442) may at least partially fill the air gap region (441). The second resin (442) may include a material having higher flexibility than the first resin (421). For example, the second resin (442) may include a material such as thermoplastic polyurethane (TPU), thermoplastic polyolefin (TPO), and / or silicone, which have a lower elastic modulus than epoxy resin. In some embodiments, the second resin (442) may include various foamed polymer materials. The second resin (442) may completely or partially fill the inner space of the bending portion (430). Since the second resin (442) has higher flexibility than the first resin (421), it can absorb shock transmitted from the outside to the bending portion (430) through the first resin (421), thereby preventing or reducing damage to the bending portion (430).

[0113] Referring to FIG. 8B, the display (400) may include a blocking member (450). The blocking member (450) may be positioned at either one of the two side ends (431a) (e.g., the x-direction side end (431a) or the -x-direction side end (431a)) of the bending portion (430) in the width direction (e.g., the x-axis direction). The blocking member (450) may close either one of the two side ends (431a) of the bending portion (430). For a detailed configuration of the blocking member (450), reference may be made to the descriptions of FIGS. 6A to 6C, unless otherwise contradictory.

[0114] A display (400) according to various embodiments can be manufactured by closing one of the two side ends (431a) of the bending portion (430) by a blocking member (450) and injecting (R2) a second resin (442) through an opening formed in the other of the two side ends (431a).

[0115] FIG. 9a is a cross-sectional view of a display (400) according to various embodiments.

[0116] FIG. 9b is a drawing showing an operation of manufacturing a display (400) according to various embodiments of the present invention.

[0117] Referring to FIG. 9A, the buffer area (440) may include a buffer member (443). For example, the buffer member (443) may be positioned in the air gap area (441). In various embodiments, the buffer member (443) may be attached on the inner surface of the bending portion (430) on the inner side of the bending portion (430). The buffer member (443) may include, for example, various polymer materials having a lower elastic modulus than the first resin (421), such as elastomers such as silicone, TPU, TPO, FKM (fluoroelastomer), and / or polyisoprene. In addition, the buffer member (443) may include various foamed polymer materials such as PE foam, PU foam, PP foam, and / or PS foam. The air gap area (441) may be positioned in an area of ​​the buffer area (440) where the buffer member (443) is not positioned. In various embodiments, the buffer member (443) may be a beam-shaped member extending in the width direction (e.g., in the x-axis direction). In various embodiments, the buffer member (443) may have a layered structure composed of one or more layers. For example, the buffer member (443) may have a first layer (443a) and a second layer (443b). The first layer (443a) and the second layer (443b) may have different materials and stiffnesses.

[0118] Referring to FIG. 9b, when the bending portion (430) is unfolded, the buffer member (443) can be attached to the area (D) that will become the bending portion (430). In the unfolded state, the bending portion (430) to which the buffer member (443) is attached can be bent so that one end (flat portion (430a)) is positioned downward of the display (400), thereby becoming a bending portion (430) (for example, a structure such as FIG. 9a) to which the buffer member (443) is attached on the inside.

[0119] According to the above-described operation, a pre-molded buffer member (443) can be positioned inside the bending portion (430). In addition, even if a liquid or molten resin is not necessarily injected into the bending portion (430), the buffer member (443) can be positioned inside the bending portion (430). Accordingly, since the buffer member (443) may have a complex layered structure or may include a material that is not suitable for injection in a liquid state, such as a foamed polymer, the shock transmitted from the outside to the bending portion (430) can be effectively absorbed inside the bending portion (430).

[0120] An electronic device according to various embodiments of the present invention may be an electronic device including a display (400).

[0121] The above display (400) can be placed under the transparent cover layer (202).

[0122] The above display (400) may include a back layer (415) disposed below the transparent cover layer (202).

[0123] The display (400) may include a panel layer (411) disposed below the transparent cover layer (202) and above the rear layer (415). The panel layer (411) includes a bending portion (430) and a flat portion (430a) extending from the bending portion (430), and the bending portion (430) may be bent such that the flat portion (430a) is disposed below the rear layer (415).

[0124] The display (400) may include a protective member (420) including a first resin (421) covering an outer circumferential surface (430c) of the bending portion (430) and an air gap region (441) positioned between a side surface of the rear layer (415) and the bending portion (430). The air gap region (441) may have at least one of the side ends (431a) at least partially closed by at least one blocking member (450).

[0125] In various embodiments, the blocking member (450) may include a first blocking member (450a) disposed on one of the side ends (431a) and a second blocking member (450b) disposed on the other of the side ends (431a).

[0126] In various embodiments, the bending portion (430) may include a conductive pattern (432) electrically connected to the panel layer (411). The bending portion (430) may include a margin portion (433) where the conductive pattern (432) is not arranged at a predetermined distance in the width direction from the side end portion (431a). The predetermined distance may be 50% or more of the width of the blocking member (450).

[0127] In various embodiments, the blocking member (450) may include an adhesive seal (451) applied to the bending portion (430).

[0128] In various embodiments, the display (400) may include a bracket (460) positioned to partially cover an area adjacent to the side end (431a) of the bending portion (430).

[0129] In various embodiments, the adhesive seal (451) may be applied along the outer perimeter of the bracket (460) to secure the bracket (460) to the bending portion (430).

[0130] In various embodiments, the display (400) may include a second resin (442) that at least partially fills the air gap region (441) and has a lower elastic modulus than the first resin (421).

[0131] In various embodiments, the display (400) includes a blocking member (450) positioned at one of the two side ends (431a) based on the width direction of the bending portion (430),

[0132] The second resin (442) can be injected into the internal space of the air gap region (441) through one of the two side ends (431a) where the blocking member (450) is not arranged.

[0133] In various embodiments, the buffer member (443) may include a buffer member (443) attached to the inner surface of the bending portion (430).

[0134] In various embodiments, the buffer member (443) may have a beam shape extending in the width direction of the bending portion (430).

[0135] A display (400) according to various embodiments of the present invention is configured to display visual information in a first direction, and may include a panel layer (411) including a bending portion (430) and a flat portion (430a) extending from the bending portion (430), and a rear layer (415) positioned in a direction opposite to the first direction with respect to the panel layer (411). The bending portion (430) may be bent such that the flat portion (430a) is positioned in a direction opposite to the first direction with respect to the rear layer (415). The display (400) may further include a protective member (420) including a first resin (421) positioned on a surface of the bending portion (430) facing the second direction. The above display (400) may further include an air gap region (441) located between the surface of the rear layer facing the second direction and the bending portion (430).

[0136] In various embodiments, the display (400) may further include a blocking member (450) disposed at a side end (431a) of the bending portion (430) along the width direction of the bending portion (430) to at least partially close the air gap region (441).

[0137] In various embodiments, the bending portion (430) may include a margin portion (433) where the conductive pattern (432) is not arranged at a predetermined distance from the side end portion (431a) in the width direction. The predetermined distance may be 50% or more of the width of the blocking member (450).

[0138] In various embodiments, the blocking member (450) may include an adhesive seal (451) applied to the bending portion (430).

[0139] In various embodiments, the display (400) may further include a bracket (460) positioned to partially cover a position adjacent to the side end (431a) of the bending portion (430).

[0140] In various embodiments, the adhesive seal (451) may be applied along the outer perimeter of the bracket (460) to secure the bracket (460) to the bending portion (430).

[0141] In various embodiments, the display (400) may further include a second resin (442) that at least partially fills the air gap region (441) and has a lower elastic modulus than the first resin (421).

[0142] In various embodiments, the display (400) includes a blocking member (450) positioned at one of the two side ends (431a) of the bending portion (430) based on the width direction of the peripheral circuit portion (430), and the second resin (442) can be injected into the internal space of the air gap region (441) through the other of the two side ends (431a).

[0143] In various embodiments, the display (400) may include a buffer member (443) attached to the bending portion (430) on the inner surface of the air gap region (441).

[0144] In various embodiments, the display (400) may have a beam shape in which the buffer member (443) extends in the width direction of the bending portion (430).

[0145] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, transparent cover layer (202); and Includes a display (400) placed under the transparent cover layer (202), The above display (400) is, A back layer (415) placed under the above transparent cover layer (202); A panel layer (411) disposed below the transparent cover layer (202) and above the rear layer (415), comprising a bending portion (430) and a flat portion (430a) extending from the bending portion (430), wherein the bending portion (430) is a panel layer (411) bent so that the flat portion (430a) is disposed below the rear layer (415); A protective member (420) including a first resin (421) covering the outer surface (430c) of the above bending portion (430); and It includes an air gap region (441) located between the side surface of the rear layer (415) and the bending portion (430), An electronic device in which the air gap region (441) is at least partially closed by at least one blocking member (450) disposed on at least one of the two side ends (431a) of the bending portion.

2. In paragraph 1, The above blocking member (450) is A first blocking member (450a) arranged on one of the above two side ends (431a), and An electronic device comprising a second blocking member (450b) disposed on the other of the two side ends (431a).

3. In paragraph 1, The above bending portion (430) is A conductive pattern (432) electrically connected to the above panel layer (411); and It includes a margin portion (433) in which the conductive pattern (432) is not arranged in the width direction of the bending portion by a predetermined distance from at least one of the two side ends (431a), An electronic device in which the above-mentioned predetermined distance is 50% or more of the width of the above-mentioned blocking member (450).

4. In paragraph 2, The above blocking member (450) is an electronic device including an adhesive thread (451) applied to the bending portion (430).

5. In paragraph 4, The above display (400) is an electronic device including a bracket (460) arranged to partially cover an area adjacent to the two side ends (431a) of the bending portion (430).

6. In paragraph 5, An electronic device in which the adhesive thread (451) is applied along the outer perimeter of the bracket (460) to secure the bracket (460) to the bending portion (430).

7. In paragraph 1, The above display (400) is, An electronic device comprising a second resin (442) at least partially filled in the air gap region (441) and having a lower elastic modulus than the first resin (421).

8. In paragraph 7, The above blocking member (450) is located at one of the two side ends (431a) of the bending portion (431) based on the width direction of the bending portion (430), An electronic device in which the second resin (442) is injected into the internal space of the air gap region (441) through the other of the two side ends (431a).

9. In paragraph 1, The above display is, An electronic device including a buffer member (443) attached to the inner surface of the above bending portion (430).

10. In paragraph 9, An electronic device in which the above-mentioned buffer member (443) has a beam shape extending in the width direction of the above-mentioned bending portion (430).

11. In paragraph 1, The above panel layer is configured to display visual information in a first direction, An electronic device wherein the rear layer is positioned in an opposite direction to the first direction with respect to the panel layer.

12. In paragraph 11, An electronic device in which the bending portion is bent in a second direction that is perpendicular to the first direction in a direction opposite to the first direction.

13. In paragraph 12, An electronic device wherein the flat portion is positioned in a direction opposite to the first direction with respect to the rear layer.

14. In paragraph 13, An electronic device wherein the first resin is positioned on a surface of the bending portion facing the second direction.

15. In paragraph 13, An electronic device wherein the air gap region is located between the surface of the rear layer facing the second direction and the bending portion.