Polishing Compositions With Abrasives TRIZ Cases
- Copper CMP Slurry Composition for High Rate and Low Dishing
Planar rigid amide compounds in copper CMP slurry improve adsorption, limiting dishing and erosion without slowing polishing.
- SiC Wafer Polishing Slurry for High Removal Without Corrosion
A water-based SiC polishing slurry uses an oxidizer, electrophile, and abrasive to raise removal rate while limiting corrosion, discoloration, and defects.