Planarization of spin-on films

By using an intermediate layer development technique that spin-coates on uneven semiconductor substrates and utilizes photochemical radiation patterns to change solubility, the problem of uneven deposition of spin-coated films on uneven substrates has been solved, thereby improving the resolution of photolithography processes and device performance.

CN115298805BActive Publication Date: 2026-07-24TOKYO ELECTRON LTD
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Patent Information

Application Number
CN202180021194.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-12-15
Filing Date
2021-02-09
Publication Date
2026-07-24
Estimated Expiration
2041-02-09

AI Technical Summary

Technical Problem

Existing technologies struggle to uniformly apply spin-coated films on uneven semiconductor substrates, impacting the critical size resolution of photolithography processes and device performance.

Method used

An intermediate layer containing a solubility modifier is spin-coated onto an uneven semiconductor substrate, and its solubility is altered using a photochemical radiation pattern, making the upper region of the uneven topography soluble in the solvent while the lower region is insoluble. The soluble portion is then removed by development, followed by spin-coating to deposit a second layer to improve flatness.

Benefits of technology

This technology enables uniform deposition of thin films on uneven semiconductor substrates, improving the critical size resolution of photolithography processes and device performance.

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Abstract

A method of planarizing a substrate includes receiving a substrate having microfabricated structures of varying height on a working surface of the substrate defining an uneven topography; depositing a first layer including a solubility-altering agent on the working surface of the substrate in an uneven manner by spin-on deposition; exposing the first layer to a first pattern of actinic radiation based on the topography; developing the first layer using a predetermined solvent; and depositing a second layer on the working surface of the substrate, the second layer having a greater planarity than the first layer prior to developing the first layer. The first radiation pattern alters the solubility of the first layer such that upper regions of the uneven topography of the first layer are soluble in the predetermined solvent.
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