Multi-antenna system capable of improving isolation of background scanning antenna and isolator module thereof

Abstract

The application discloses a multi-antenna system capable of improving the isolation of a background scanning antenna and an isolator module thereof. The multi-antenna system comprises a metal carrier disc, a background scanning antenna, working antennas and an isolator module. The isolator module can be assembled to the metal carrier disc and comprises a plurality of isolators which are at least annularly arranged to form an isolation space in which the background scanning antenna is located and outside which the working antennas are located. Thus, the design of the isolator module can make the background scanning antenna and the working antennas have good isolation.

Description

Technical Field

[0001] This application relates to a multi-antenna system, and more particularly to a multi-antenna system and its isolator module that can improve the isolation of background scanning antennas. Background Technology

[0002] With the rapid development of the wireless communication industry, various wireless communication devices are constantly being innovated. The market requirements for these wireless communication devices, in addition to their slim and compact appearance, also emphasize their ability to maintain stable signal transmission quality. Among these, the "antenna" is an indispensable key component in these wireless communication devices, used to send and receive wireless signals and transmit data. The research and development of related technologies has also become a focus of attention in the field of related technologies along with the rapid development of the wireless communication industry.

[0003] As mentioned above, an "antenna" is a conductor or conductive system that can transmit electromagnetic energy into or receive electromagnetic energy from space. To improve data rate and channel capacity, "multi-input multi-output (MIMO) systems" have become a widely used architecture. This results in a multiple increase in the number of antennas required on the same electronic device. While this can increase throughput within the existing bandwidth, it also means that the distance between multiple antennas in a limited space becomes shorter and shorter. As a result, the mutual coupling effect between antennas will worsen the antenna isolation, leading to a decrease in radiation quality. In particular, the aforementioned problems are more severe in multi-antenna systems operating in the same frequency band.

[0004] Furthermore, in a network environment within the same area (such as an office, department store, etc.), there are usually multiple wireless access points or wireless routers. Therefore, some wireless network products add a background scanning function. This function detects whether there are other wireless communication devices in the current area that might interfere with its own wireless communication capabilities. For example, if other wireless communication devices on the same frequency band are detected causing interference, the wireless network product can adjust its own wireless communication frequency to improve communication quality. However, the aforementioned background scanning function requires an additional background scanning antenna to achieve the desired functionality. In terms of commonly used wireless communication systems, the IEEE 802.11ac wireless network standard specifies that Wi-Fi operates in the 2.4GHz to 2.484GHz and 5.15GHz to 5.875GHz frequency bands. Therefore, in the limited space of a wireless access point or wireless router, in addition to setting up Wi-Fi 2.4GHz / 5GHz antennas and IoT 2.4GHz antennas, a background scanning antenna is also required. Thus, the background scanning antenna needs to have good isolation from the other antennas in the two operating frequency bands (2.4GHz / 5GHz) to maintain the expected radiation quality.

[0005] Traditionally, to improve the isolation between antennas, several methods can be employed. The first is to increase the distance between antennas; however, this requires significant space, hindering the design of thin and light wireless communication devices. The second method involves adding decoupling mechanisms between multiple antennas to improve isolation. (See also...) Figure 1 As shown, the multi-antenna system 1 includes a carrier disk 10, a plurality of antenna elements 12, and a plurality of conductor grounding isolation objects 14. The plurality of antenna elements 12 and conductor grounding isolation objects 14 can be located on the grounding part of the carrier disk 10. The conductor grounding isolation objects 14 can be set at a distance of about a quarter wavelength from each antenna element 12. Since the extension length of the conductor grounding isolation object 14 is about a quarter of the antenna wavelength, like a single dipole antenna, it will compress the radiation pattern of the antenna element 12.

[0006] Secondly, the third method involves creating an isolation slit between the two antenna elements. (See [link to relevant documentation]). Figure 2As shown, the multi-antenna system 2 includes a carrier disk 20 and a plurality of antenna elements 22. The plurality of antenna elements 22 can be located on the grounding part of the carrier disk 20, and one or two isolation trenches 24 are provided between any two antenna elements 22. However, the plurality of isolation trenches 24 not only damage the structure of the grounding part, but may also have an adverse effect on the signal transmission of the multi-antenna system 2. In particular, when the number of antenna elements 22 increases, the number of isolation trenches 24 must also increase, which leads to the need to re-evaluate the electromagnetic compatibility (EMC) / electromagnetic interference (EMI) of the multi-antenna system 2, increasing the difficulty of design. Summary of the Invention

[0007] To address the aforementioned technical problems, one technical solution adopted in this application is to provide a multi-antenna system that improves the isolation of a background scanning antenna. This system includes a metal carrier disk, a background scanning antenna, multiple operational antennas, and an isolator module. The background scanning antenna is located on the metal carrier disk and can detect the frequency of radio frequency signals within a scanning area. The multiple operational antennas are located on the metal carrier disk and are spaced apart from the background scanning antenna by a distance. The isolator module includes multiple isolators, which are at least arranged in a ring to form an isolation space. The isolator module can be assembled onto the metal carrier disk, placing the background scanning antenna within the isolation space and the multiple operational antennas outside the isolation space.

[0008] Optionally, the isolator further includes a dielectric substrate, a metal top layer, a metal ground layer, and a metal pillar. The metal top layer is located on the top surface of the dielectric substrate. The metal ground layer is located on the bottom surface of the dielectric substrate and can be connected to the metal carrier plate. The metal pillar penetrates the dielectric substrate, and the top end of the metal pillar can be connected to the metal top layer, and the bottom end of the metal pillar can be connected to the metal ground layer.

[0009] Optionally, the isolator further includes a dielectric substrate, a metal top layer, and a metal pillar. The metal top layer is located on the top surface of the dielectric substrate. The metal pillar penetrates the dielectric substrate, with its top end connected to the metal top layer and its bottom end connected to the metal support plate.

[0010] Optionally, the dielectric substrates of the plurality of isolators are integrally formed.

[0011] Optionally, the plurality of metal top layers of the plurality of isolators are spaced apart from each other by a distance.

[0012] Optionally, multiple isolators are arranged in two adjacent nested inner and outer rings to form a double-ring isolator module.

[0013] Optionally, the area of ​​the plurality of metal top layers located on the outer ring may be larger than the area of ​​the plurality of metal top layers located on the inner ring.

[0014] Optionally, the metal carrier plate is connected to a grounding line.

[0015] To address the aforementioned technical problems, another technical solution adopted in this application is to provide an isolator module that can improve the isolation of a background scanning antenna. The module is composed of at least a plurality of isolators, which are arranged in a ring to form an isolation space therein. The isolation space can accommodate a background scanning antenna, while a plurality of working antennas are located outside the isolation space.

[0016] Optionally, the isolator further includes a dielectric substrate, a metal top layer, a metal ground layer, and a metal pillar. The metal top layer is located on the top surface of the dielectric substrate. The metal ground layer is located on the bottom surface of the dielectric substrate and can be connected to the metal carrier plate. The metal pillar penetrates the dielectric substrate, and the top end of the metal pillar can be connected to the metal top layer, and the bottom end of the metal pillar can be connected to the metal ground layer.

[0017] Optionally, the isolator further includes a dielectric substrate, a metal top layer, and a metal pillar. The metal top layer is located on the top surface of the dielectric substrate. The metal pillar penetrates the dielectric substrate, with its top end connected to the metal top layer and its bottom end connected to the metal support plate.

[0018] Optionally, the dielectric substrates of the plurality of isolators are integrally formed.

[0019] Optionally, multiple isolators are arranged in two adjacent nested inner and outer rings to form a double-ring isolator module.

[0020] Optionally, the area of ​​the plurality of metal top layers located on the outer ring may be larger than the area of ​​the plurality of metal top layers located on the inner ring.

[0021] Optionally, the multiple metal top layers of the multiple isolators are spaced apart from each other by a gap.

[0022] To further explain the purpose, technical features and effects of this application, specific embodiments are described in detail below with reference to the accompanying drawings. However, the accompanying drawings are for reference and illustration only and are not intended to limit this application. Attached Figure Description

[0023] Figure 1 This is a schematic diagram illustrating the addition of a decoupling mechanism between multiple antennas in existing technologies.

[0024] Figure 2 This is a schematic diagram of an existing technology that involves setting isolation trenches between multiple antennas;

[0025] Figure 3 This is a schematic diagram of a multi-antenna system according to the first embodiment of this application;

[0026] Figure 4 This is a three-dimensional schematic diagram of the isolator of this application;

[0027] Figure 5 This is a side view of the isolator in this application;

[0028] Figure 6 The return loss test diagram for the multi-antenna system of the first embodiment with / without an isolator module;

[0029] Figure 7 The isolation test diagram of the multi-antenna system of the first embodiment in the 2.4GHz operating frequency band, with / without isolator modules;

[0030] Figure 8 The isolation test diagram of each low-frequency antenna in the multi-antenna system of the first embodiment at the 2.4GHz operating frequency band is shown.

[0031] Figure 9 The multi-antenna system of the first embodiment has / does not have an isolator module, and the radiation pattern characteristics of the background scanning antenna at 2.4 GHz;

[0032] Figure 10 The multi-antenna system of the first embodiment has / does not have an isolator module, and the radiation pattern characteristics of the background scanning antenna at 5.5 GHz;

[0033] Figure 11 This is a schematic diagram of a multi-antenna system according to the second embodiment of this application;

[0034] Figure 12 The isolation test diagram for the multi-antenna system of the second embodiment, operating in the 2.4GHz frequency band, with / without an isolator module;

[0035] Figure 13 The isolation test diagram of each low-frequency antenna in the 2.4GHz operating frequency band of the multi-antenna system of the second embodiment;

[0036] Figure 14 The second embodiment of the multi-antenna system has / does not have an isolator module, and the radiation pattern characteristics of the background scanning antenna at 2.4 GHz;

[0037] Figure 15 The test diagrams show the isolation of metal columns with diameters of 1.2 mm, 1.0 mm, and 0.8 mm.

[0038] Figure 16 Isolation test diagrams for metal top layers with areas (length x width) of 14.5mm x 14.5mm, 14.7mm x 14.7mm, and 14.9mm x 14.9mm respectively;

[0039] Figure 17 This is a schematic diagram of a multi-antenna system according to a third embodiment of this application; and

[0040] Figure 18 The isolation test diagram for the multi-antenna system of the third embodiment, operating in the 2.4GHz and 5GHz frequency bands, with / without isolator modules. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description, in conjunction with specific embodiments and with reference to the accompanying drawings, further illustrates the embodiments of the "multi-antenna system and its isolator module capable of improving the isolation of background scanning antennas" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, it should be stated in advance that the accompanying drawings of this application are merely simple illustrations and not depictions based on actual dimensions. Although this document provides examples of parameters containing specific values, it should be understood that the parameters do not need to be exactly equal to the corresponding values, but can approximate the corresponding values ​​within acceptable error tolerances or design constraints. The following embodiments will further detail the relevant technical content of this application, but the disclosed content is not intended to limit the scope of protection of this application.

[0042] Furthermore, it should be stated in advance that the accompanying drawings in this application are for simple illustrative purposes only and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application. It should be understood that although terms such as "first," "second," etc. may be used herein to describe various components, each component should not be limited by the aforementioned terms, which are mainly used to distinguish one component from another. Moreover, the directional terms mentioned in subsequent embodiments, such as "up," "down," "front," "back," "left," "right," etc., are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and are not intended to limit the scope of protection of this application.

[0043] This application discloses a multi-antenna system and its isolator module that can improve the isolation of background scanning antennas. In the first embodiment, please refer to... Figure 3 As shown, the multi-antenna system S includes a metal carrier plate 3, a plurality of working antennas 4, a background scanning antenna 5, and an isolator module 6. All or part of the metal carrier plate 3 can be connected to a grounding line to form a corresponding grounding portion. Furthermore, the background scanning antenna 5 and the plurality of working antennas 4 are mounted on the metal carrier plate 3, and the background scanning antenna 5 and the plurality of working antennas 4 can also be located in the grounding portion of the metal carrier plate 3. In this embodiment, the plurality of working antennas 4 includes four low-frequency antennas 411, 412, 413, and 414 and four high-frequency antennas 421, 422, 423, and 424, wherein the low-frequency antennas 411, 412, 413, and 414 operate in the 2.4 GHz frequency band. z, the high-frequency antennas 421, 422, 423, 424 operate in the 5GHz frequency band, and the multiple low-frequency antennas 411, 412, 413, 414 and the high-frequency antennas 421, 422, 423, 424 can be arranged alternately around the metal carrier disk 3, so that the top surface of the metal carrier disk 3 near the four edges is respectively provided with a single low-frequency antenna 411, 412, 413, 414 and a single high-frequency antenna 421, 422, 423, 424 (e.g., Figure 3 (As shown).

[0044] Please refer to the above. Figure 3 As shown, the background scanning antenna 5 is located on the grounded portion of the metal carrier disk 3 and can detect the frequency of radio frequency signals within a scanning area. In the first embodiment, the background scanning antenna 5 can operate in a dual-band 2.4GHz / 5GHz operating frequency band, and the background scanning antenna 5 is located in the central region of the metal carrier disk 3, and is spaced apart from the plurality of operating antennas 4. However, in other embodiments of this application, the number, position, and operating frequency band of the plurality of operating antennas 4 can be adjusted according to actual needs, and it is even possible to have only a single operating frequency band without distinguishing between low-frequency or high-frequency antennas. Similarly, the background scanning antenna 5 can also have only a single operating frequency band, and is not limited to a dual-band form.

[0045] Please refer to the following: Figure 3 As shown, the isolator module 6 includes a plurality of isolators 61, which can be arranged in a ring to form an isolation space 60. The isolator module 6 can be assembled onto the metal carrier disk 3 and is located between the plurality of working antennas 4 and the background scanning antenna 5, such that the background scanning antenna 5 is located within the isolation space 60, while the plurality of working antennas 4 are located outside the isolation space 60 and isolated from each other by the isolator module 6. Please refer to [link / reference]. Figure 4 and Figure 5 As shown, the isolator 61 includes a dielectric substrate 611, a metal top layer 612, a metal ground layer 613, and a metal pillar 614. The top surface of the dielectric substrate 611 is provided with the metal top layer 612, the bottom surface of the dielectric substrate 611 is provided with the metal ground layer 613, and the metal pillar 614 is provided inside the dielectric substrate 611. The metal pillar 614 can penetrate the dielectric substrate 611 so that its top end can be connected to the metal top layer 612 and its bottom end can be connected to the metal ground layer 613, so that the equivalent circuit model formed by the isolator 61 can be an LC parallel resonant circuit. Thus, by adjusting the dimensions of the metal top layer 612 of the isolator 61, or the height and dielectric constant of the dielectric substrate 611, or the diameter of the metal pillar 614, the values ​​of the inductance (L) and capacitance (C) in its LC parallel resonant circuit can be changed to generate parallel resonance in the desired antenna operating frequency band, suppress coupling current, and improve the isolation of the background scanning antenna 5 corresponding to the same operating frequency band between each of the operating antennas 4. Furthermore, the metal ground layers 613 of the multiple isolators 61 can be spaced apart from each other without direct connection.

[0046] The isolator module 6 of this application has many variations to suit the actual needs of the product or the production process. For example, in some embodiments, the isolator 61 can be omitted. Figure 4 If the metal grounding layer 613 is provided, and the bottom end of the metal pillar 614 can be directly connected to the metal bearing disk 3, then a circuit model of an LC parallel resonant circuit can also be formed. Alternatively, although... Figure 5 The drawn metal pillar 614 has its two ends respectively attached to the metal top layer 612 and the metal ground layer 613. However, in some embodiments, either end or both ends of the metal pillar 614 can penetrate the corresponding metal top layer 612 or metal ground layer 613 to improve the connection stability and conductivity between the aforementioned components. Alternatively, although the metal top layer 612 is drawn in a rectangular shape, it is not limited thereto. In other embodiments of this application, the shape of the metal top layer 612 can be circular, hexagonal, star-shaped, etc. In addition, the multiple isolators 61 can be independent components, arranged in sequence in a ring, and fixed on the metal support plate 3. Alternatively, the dielectric substrate 611 and / or metal ground layer 613 of the multiple isolators 61 can be integrally formed into a single unit, and a plurality of metal top layers 612 can be disposed on the dielectric substrate 611 of the aforementioned single unit with a gap between them. A plurality of metal pillars 614 can also be disposed on the dielectric substrate 611 of the aforementioned single unit with a gap between them, to form the isolator module 6 of this application.

[0047] Please refer to the following: Figure 3 As shown, in the first embodiment, the isolator module 6 is fixed to the metal carrier plate 3 by a plurality of fixing components 65 (e.g., plastic rivets), and the background scanning antenna 5 is located at the center of the isolation space 60. Therefore, when the background scanning antenna 5 needs to be applied to different operating frequency bands, different isolator modules 6 can be easily disassembled and replaced, improving the convenience of use. In addition, in the first embodiment, the isolator module 6 is a single dielectric substrate 611. The top surface of the dielectric substrate 611 is provided with a plurality of metal top layers 612 arranged in a ring, and the plurality of metal top layers 612 do not contact each other. The dielectric substrate 611 contains a plurality of metal pillars 614, and the bottom surface of the dielectric substrate 611 is provided with a metal ground layer 613 arranged in a ring. After experimental testing, please refer to [link / reference needed]. Figure 6 As shown, when the multi-antenna system S does not have the isolator module 6, the return loss of its background scanning antenna 5 is shown as line A11; when the multi-antenna system S has the isolator module 6, the return loss of its background scanning antenna 5 is shown as line B11. It can be clearly seen that the isolator module 6 does not have a negative impact on the operating frequency band of the background scanning antenna 5, and can make the return loss of the background scanning antenna 5 perform better.

[0048] Additionally, please refer to the experimental test results. Figure 3 and Figure 7 As shown, when the multi-antenna system S does not have the isolator module 6, its background scanning antenna 5 for Figure 3 The isolation of the upper low-frequency antenna 411 is shown as line A21; when the multi-antenna system S has an isolator module 6, its background scanning antenna 5 for Figure 3 The isolation of the upper low-frequency antenna 411 is shown as in line B21; thus, a deep resonance point appears in the 2.4GHz operating frequency band of line B21, improving the isolation of the background scanning antenna 5 from the low-frequency antenna 414. Please refer to... Figure 8 As shown in the experimental test, when the multi-antenna system S has an isolator module 6, the isolation between its background scanning antenna 5 and the multiple low-frequency antennas 411, 412, 413, and 414 is shown by lines B21, B22, B23, and B24. Moreover, a resonance depth point appears simultaneously in the 2.4 GHz operating frequency band of the multiple lines B21, B22, B23, and B24. Therefore, the isolator module 6 can effectively improve the isolation between the background scanning antenna 5 and the multiple low-frequency antennas 411, 412, 413, and 414.

[0049] Furthermore, please refer to Figure 9As shown in the figure, after experimental testing, when the multi-antenna system S does not have the isolator module 6, the radiation pattern characteristics of its background scanning antenna 5 at 2.4 GHz are shown as line A31; when the multi-antenna system S has the isolator module 6, the radiation pattern characteristics of its background scanning antenna 5 at 2.4 GHz are shown as line B31. Therefore, it can be seen that when the multi-antenna system S has the isolator module 6, the radiation pattern characteristics of its background scanning antenna 5 still maintain a near-omnidirectional radiation pattern in the XY plane. Please refer to... Figure 10 As shown, when the multi-antenna system S does not have the isolator module 6, the radiation pattern characteristics of its background scanning antenna 5 at 5.5 GHz are shown as line A41; when the multi-antenna system S has the isolator module 6, the radiation pattern characteristics of its background scanning antenna 5 at 5.5 GHz are shown as line B41; it can be seen that when the multi-antenna system S has the isolator module 6, the radiation pattern characteristics of its background scanning antenna 5 do not have obvious deformation in the XY plane.

[0050] To provide better isolation between the background scanning antenna 5 and the plurality of operating antennas 4, in the second embodiment of this application, the plurality of isolators 61 can be arranged in two adjacent nested inner and outer rings to form a structure as shown in the figure. Figure 11 The isolator module 6 is shown in a double rectangular ring shape. In the second embodiment, the isolator module 6 is a single dielectric substrate 611, which is made of FR-4 epoxy glass cloth with a dielectric constant of approximately 4.3 and a thickness of approximately 1.6 mm. Furthermore, the top surface of the dielectric substrate 611 is provided with a plurality of metal top layers 612 arranged in a double ring pattern. The plurality of metal top layers 612 are spaced apart from each other, and each metal top layer 612 can be connected to the metal ground layer 613 on the bottom surface of the dielectric substrate 611 through a metal post 614 penetrating the dielectric substrate 611.

[0051] Following the above, please refer to the experimental test results. Figure 12 As shown, when the multi-antenna system S does not have the isolator module 6, the isolation of its background scanning antenna 5 to the low-frequency antenna 411 is as shown by line C11; when the multi-antenna system S has the isolator module 6, the isolation of its background scanning antenna 5 to the low-frequency antenna 411 is as shown by line D11; similarly, a deep resonance point appears in the 2.4 GHz operating frequency band of line D11, and the isolation of the background scanning antenna 5 to the low-frequency antenna 411 reaches 30 dB, exhibiting an isolation effect superior to the first embodiment. Please refer to... Figure 13As shown in the diagram, after experimental testing, when the multi-antenna system S has the isolator module 6, the isolation between its background scanning antenna 5 and the multiple low-frequency antennas 411, 412, 413, and 414 is as indicated by lines D11, D12, D13, and D14. Furthermore, a resonance depth point simultaneously appears in the 2.4GHz operating frequency band of all lines D11, D12, D13, and D14. Therefore, the isolator module 6 can effectively improve the isolation between the background scanning antenna 5 and the multiple low-frequency antennas 411, 412, 413, and 414. Please refer to... Figure 14 As shown in the figure, after experimental testing, when the multi-antenna system S does not have the isolator module 6, the radiation pattern characteristics of its background scanning antenna 5 for 2.4 GHz are shown as line C21; when the multi-antenna system S has the isolator module 6, the radiation pattern characteristics of its background scanning antenna 5 for 2.4 GHz are shown as line D21. It can be seen that when the multi-antenna system S has the isolator module 6, although the radiation pattern characteristics of its background scanning antenna 5 are somewhat reduced, it still maintains a near-omnidirectional radiation pattern in the XY plane.

[0052] Furthermore, changing the diameter of the metal pillar 614 alters the isolation level of the isolator 61. (See also...) Figure 15 As shown, when the diameter of the metal pillar 614 is 1.2 mm, the isolation of the background scanning antenna 5 from the low-frequency antenna 414 is shown as line E11; when the diameter of the metal pillar 614 is 1.0 mm, the isolation of the background scanning antenna 5 from the low-frequency antenna 414 is shown as line E12; and when the diameter of the metal pillar 614 is 0.8 mm, the isolation of the background scanning antenna 5 from the low-frequency antenna 414 is shown as line E13. Therefore, it can be seen that the smaller the diameter of the metal pillar 614, the lower the resonant frequency shifts. Furthermore, changing the area (length x width) of the top metal layer 612 can also change the isolation of the isolator 61. Please refer to [link to relevant documentation]. Figure 16 As shown, when the area of ​​the metal top layer 612 is 14.5mm x 14.5mm, the isolation of the background scanning antenna 5 from the low-frequency antenna 414 is shown by line E14; when the area of ​​the metal top layer 612 is 14.7mm x 14.7mm, the isolation of the background scanning antenna 5 from the low-frequency antenna 414 is shown by line E15; when the area of ​​the metal top layer 612 is 14.9mm x 14.9mm, the isolation of the background scanning antenna 5 from the low-frequency antenna 414 is shown by line E16. It can be seen that the smaller the area (length x width) of the metal top layer 612, the higher the resonant frequency.

[0053] Since the area of ​​the top metal layer 612 can affect the resonant frequency, the isolator module 6 of this application can also be configured to operate in a dual-band configuration. In the third embodiment, a plurality of isolators 61 can be arranged into two adjacent nested inner and outer rings to form a configuration such as... Figure 17 The isolator module 6 is shown in a double rectangular ring shape. In the third embodiment, the isolator module 6 is a single dielectric substrate 611, which is made of fiberglass (FR-4 Epoxy Glass Cloth) with a dielectric constant of approximately 4.3 and a thickness of approximately 1.6 mm. Furthermore, the top surface of the dielectric substrate 611 is provided with a plurality of metal top layers 612 arranged in a double ring pattern. The area of ​​the outer ring metal top layers 612 is larger than that of the inner ring metal top layers 612, and each metal top layer 612 can be connected to the metal ground layer 613 on the bottom surface of the dielectric substrate 611 through metal pillars 614 penetrating the dielectric substrate 611. Thus, the multiple isolators 61 in the outer ring will affect the isolation of the 2.4 GHz operating frequency band, and the multiple isolators 61 in the inner ring will affect the isolation of the 5 GHz operating frequency band, thereby improving the isolation between the dual-band background scanning antenna 5 and the multiple operating antennas 4 (low-frequency antenna 411, high-frequency antenna 412). Please refer to the experimental test results. Figure 18 As shown, when the multi-antenna system S does not have the isolator module 6, the isolation of its background scanning antenna 5 to the high-frequency antenna 424 is shown by line F11; when the multi-antenna system S has the isolator module 6, the isolation of its background scanning antenna 5 to the high-frequency antenna 424 is shown by line G11. It can be seen that a resonance depth point appears in the 2.4GHz and 5GHz operating frequency bands of line G11, which improves the isolation of the background scanning antenna 5 to the high-frequency antenna 424 between the two operating frequency bands.

[0054] In summary, the structure of the isolator module 6 not only effectively improves the isolation between the working antenna 4 and the background scanning antenna 5, but also allows for easy modification of the operating frequency band required by the isolator module 6 by adjusting the configuration of the relevant components of each isolator 61, thus greatly improving design convenience.

[0055] The above description is merely a preferred and feasible embodiment of this application and does not limit the scope of protection of the claims of this application. Therefore, any equivalent changes that can be conceived by those skilled in the art based on the technical content disclosed in this application without creative effort should be included within the scope of protection of the claims of this application.

Claims

1. A multi-antenna system capable of improving the isolation of background scanning antennas, characterized in that, The multi-antenna system includes: A metal support plate; A background scanning antenna is located on the metal support plate and can detect the frequency of radio frequency signals within a scanning area; Multiple operating antennas are located on the metal carrier disk and are each spaced a distance from the background scanning antenna; and An isolator module includes multiple isolators arranged in at least a ring to form an isolation space therein. The isolator module can be assembled onto the metal carrier disk, with the background scanning antenna located in the isolation space and the multiple working antennas located outside the isolation space. Each of the isolators includes a dielectric substrate, a metal top layer disposed on the top surface of the dielectric substrate, a metal ground layer disposed on the bottom surface of the dielectric substrate, and a metal pillar that penetrates the dielectric substrate and connects the metal top layer and the metal ground layer at both ends, and the plurality of metal top layers are spaced apart from each other.

2. The multi-antenna system as described in claim 1, characterized in that, The dielectric substrates of the multiple isolators are integrally formed.

3. The multi-antenna system as described in claim 1, characterized in that, Multiple isolators are arranged in two adjacent nested inner and outer rings to form a double-ring isolator module.

4. The multi-antenna system as described in claim 3, characterized in that, The area of ​​the plurality of metal top layers located on the outer ring will be larger than the area of ​​the plurality of metal top layers located on the inner ring.

5. The multi-antenna system as described in claim 1, characterized in that, The metal support plate is connected to a grounding line.

6. An isolator module capable of improving the isolation of a background scanning antenna, characterized in that, The isolator module comprises at least a plurality of isolators arranged in a ring to form an isolation space therein, wherein a background scanning antenna is located within the isolation space, and a plurality of operational antennas are located outside the isolation space; wherein each of the isolators comprises a dielectric substrate, a metal top layer disposed on the top surface of the dielectric substrate, a metal ground layer disposed on the bottom surface of the dielectric substrate, and a metal pillar penetrating the dielectric substrate and connecting the metal top layer and the metal ground layer at its two ends, and the plurality of metal top layers are spaced apart from each other.

7. The isolator module as described in claim 6, characterized in that, The dielectric substrates of the multiple isolators are integrally formed.

8. The isolator module as described in claim 6, characterized in that, Multiple isolators are arranged in two adjacent nested inner and outer rings to form a double-ring isolator module.

9. The isolator module as described in claim 8, characterized in that, The area of ​​the plurality of metal top layers located on the outer ring will be larger than the area of ​​the plurality of metal top layers located on the inner ring.

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