A method, device and medium for thermal failure analysis of a network device

Abstract

The embodiment of the specification discloses a network equipment thermal failure analysis method, equipment and medium, relates to the technical field of network equipment, and the method comprises the following steps: collecting dynamic field infrared data of a network equipment whole machine and real-time temperature data of each network device through a temperature measurement component of a thermal failure analysis device, wherein the dynamic field infrared data comprises real-time infrared data of a plurality of network devices; screening at least one thermal failure risk device meeting the requirements based on the dynamic field infrared data and the temperature threshold of each network device; determining the real-time temperature data of each thermal failure risk device, generating a temperature rise curve of each thermal failure risk device based on the real-time temperature data and pre-acquired traffic forwarding data; analyzing the temperature rise curve according to pre-acquired network equipment operation requirements to generate a whole machine failure risk; and determining a corresponding thermal design optimization scheme to optimize the thermal failure of the network equipment through the whole machine failure risk.

Description

Technical Field

[0001] This specification relates to the field of network equipment technology, and in particular to a method, equipment and medium for analyzing the thermal failure of network equipment. Background Technology

[0002] The rapid development of modern communication technologies has ushered in the era of the Internet of Things. Intelligent driving and telemedicine are becoming a reality, and smart factories and smart cities are gradually taking shape. High-performance, highly reliable networks are increasingly becoming the core of new infrastructure. Advances in semiconductor and microelectronics technologies have enabled chips to be smaller, with higher transistor density and stronger performance, promoting the miniaturization, micro-miniaturization, and high performance of modern network equipment. While high-density electronic components bring higher performance, they also mean a significant increase in heat generation per unit area. Research has found that for every 10°C increase in temperature, the lifespan of chip devices will be reduced by half; currently, most electronic device failures originate from thermal issues.

[0003] In traditional network applications, equipment is often housed in dedicated server rooms or at least relatively well-ventilated indoor environments. Heat dissipation can be improved by adding cooling facilities and configuring dedicated cooling equipment, thus enhancing operational reliability. However, in the era of the Internet of Things (IoT), more network devices need to operate outdoors in harsher conditions. High temperatures, high humidity, and dust will severely impact heat dissipation, leading to thermal failure. Especially in industrial internet applications, the high-temperature environments and adverse consequences of network failures in most manufacturing enterprises (such as metallurgy, energy, and power) place extremely high demands on the thermal stability of network equipment. Thermal failure is becoming one of the key factors restricting the performance improvement of network devices.

[0004] Currently, conventional network equipment typically employs a forward development approach in its hardware design process. Starting with product performance, it plans the layout of hardware components such as CPUs and ports, then calculates the total heat dissipation and power consumption, and matches corresponding cooling measures. This existing approach struggles to pinpoint precise heat dissipation risk points within network equipment and the thermal failure processes of key components during operation. This results in a lack of comprehensiveness and specificity in thermal failure analysis, hindering effective optimization for high-risk thermal failure points. Summary of the Invention

[0005] This specification provides one or more embodiments of a method, device, and medium for thermal failure analysis of network devices, which addresses the following technical problem: existing methods are insufficient to accurately determine the heat dissipation risk points inside network devices and the thermal failure process of each major core component during device operation, resulting in a lack of comprehensiveness and specificity in thermal failure analysis, and consequently, an inability to effectively optimize for high-risk thermal failure points.

[0006] One or more embodiments of this specification employ the following technical solutions:

[0007] This specification provides one or more embodiments of a method for thermal failure analysis of network devices, characterized in that it is applied to a thermal failure analysis device. The method includes: dynamically acquiring dynamic field infrared data of the entire network device and real-time temperature data of each network device in the entire network device through the temperature measurement component of the thermal failure analysis device, wherein the dynamic field infrared data includes real-time infrared data of multiple network devices; based on the dynamic field infrared data and the temperature threshold of each network device in a pre-acquired network device performance library, selecting at least one thermal failure risk device that meets the requirements; determining the real-time temperature data of each thermal failure risk device; generating a temperature rise curve for each thermal failure risk device based on the real-time temperature data of each thermal failure risk device and the pre-acquired traffic forwarding data of the entire network device; analyzing the temperature rise curve of each thermal failure risk device according to the pre-acquired network device operating requirements to generate a failure risk of the entire device, so as to perform thermal failure analysis on the entire network device; and determining a corresponding thermal design optimization scheme based on the failure risk of the entire device, so as to optimize the thermal failure of the network device.

[0008] Furthermore, before selecting at least one thermal failure risk device that meets the requirements based on the dynamic field infrared data and the temperature threshold of each network device in the pre-acquired network device performance library, the method further includes: acquiring device test data of each network device under different operating conditions, wherein the device test data includes the highest operating temperature of each network device under normal operating conditions, the device failure temperature corresponding to each network device, and the overall system impact factor corresponding to the failure of each network device; determining the temperature threshold corresponding to each network device under different operating conditions based on the device test data of each network device under different operating conditions and the preset specified factor threshold, wherein the value range of the overall system impact factor is a specified numerical range, and the larger the overall system impact factor, the greater the impact of the network device failure on the operation of the network equipment as a whole; and generating a network device performance library based on the temperature threshold corresponding to each network device under each operating condition.

[0009] Furthermore, based on the device test data of each network device under different operating conditions and the preset specified factor threshold, the temperature threshold corresponding to each network device under different operating conditions is determined. Specifically, this includes: when the overall system influence factor in the device test data corresponding to the current operating condition is not less than the specified factor threshold, the highest operating temperature of the network device under normal operating conditions is taken as the temperature threshold corresponding to the network device under the current operating condition; when the overall system influence factor in the device test data corresponding to the current operating condition is less than the specified factor threshold, the device failure temperature of the network device is taken as the temperature threshold corresponding to the network device under the current operating condition.

[0010] Furthermore, based on the dynamic field infrared data and the temperature threshold of each network device in the pre-acquired network device performance library, at least one thermal failure risk device that meets the requirements is screened out. Specifically, this includes obtaining the current operating condition of the entire network device; determining the temperature threshold of each network device under the current operating condition based on the current operating condition in the network device performance library; comparing the real-time infrared data of each network device in the dynamic field infrared data with the temperature threshold of each network device to generate at least one specified real-time infrared data that is greater than the temperature threshold; and determining the thermal failure risk device corresponding to each specified real-time infrared data based on at least one of the specified real-time infrared data.

[0011] Further, based on the real-time temperature data of each of the thermal failure risk devices and the pre-acquired traffic forwarding data of the entire network device, a temperature rise curve for each of the thermal failure risk devices is generated. Specifically, this includes: acquiring the real-time traffic forwarding data of the entire network device; aligning the real-time traffic forwarding data of the entire network device and the real-time temperature data of each of the thermal failure risk devices according to timestamps to generate a data point pair for each of the thermal failure risk devices, wherein the data point pair includes the traffic forwarding data and real-time temperature data corresponding to the current moment; and generating a temperature rise curve for each thermal failure risk device by using the traffic forwarding data in the data point pair as the horizontal axis and the real-time temperature data of the thermal failure risk device as the vertical axis.

[0012] Furthermore, before analyzing the temperature rise curve of each thermal failure risk device based on the pre-acquired network device operation requirements to generate the overall failure risk, the method further includes: collecting various customer application requirements corresponding to the network device, and determining the network device operation requirements based on each customer application requirement, wherein the network device operation requirements include stable forwarding requirements and extreme operating condition requirements; determining the current overall system impact factor corresponding to each network device in the network device under the network device operation requirements; establishing a mapping relationship between the network device operation requirements and the current overall system impact factor corresponding to each network device in the network device under the network device operation requirements, and storing it in a preset database.

[0013] Furthermore, based on the pre-acquired network equipment operating requirements, the temperature rise curve of each of the thermal failure risk devices is analyzed to generate the overall system failure risk. Specifically, this includes: obtaining the current network equipment operating requirements corresponding to the network equipment; based on the current network equipment operating requirements, obtaining the current overall system impact factor of each network device corresponding to the current network equipment operating requirements from the preset database; analyzing the temperature rise curve of each of the thermal failure risk devices to generate the device failure risk of each of the thermal failure risk devices; and generating the overall system failure risk based on the device failure risk of each of the thermal failure risk devices and the current overall system impact factor of each network device.

[0014] Furthermore, the temperature rise curve of each of the thermal failure risk devices is analyzed to generate the device failure risk of each of the thermal failure risk devices. Specifically, this includes: determining the extreme points of the temperature rise curve, wherein the extreme points include a maximum point and a minimum point; determining the first forwarding traffic data corresponding to the maximum point and the second forwarding traffic data corresponding to the minimum point; calculating the difference between the first forwarding traffic data and the second forwarding traffic data; and determining the device failure risk of the thermal failure risk device based on the difference and a preset difference threshold.

[0015] This specification provides one or more embodiments of a thermal failure analysis device for network devices, comprising:

[0016] At least one processor; and,

[0017] A memory communicatively connected to the at least one processor; wherein,

[0018] The memory stores instructions executable by the at least one processor, which, when executed by the at least one processor, enable the at least one processor to:

[0019] The thermal failure analysis device uses a temperature measurement component to dynamically collect dynamic field infrared data of the entire network equipment and real-time temperature data of each network device within the network equipment. The dynamic field infrared data includes real-time infrared data from multiple network devices. Based on the dynamic field infrared data and the temperature thresholds of each network device in a pre-acquired network device performance library, at least one device with thermal failure risk is selected. The real-time temperature data of each thermal failure risk device is determined, and a temperature rise curve for each thermal failure risk device is generated based on the real-time temperature data of each thermal failure risk device and pre-acquired traffic forwarding data of the entire network equipment. According to pre-acquired network equipment operating requirements, the temperature rise curves of each thermal failure risk device are analyzed to generate overall system failure risk for thermal failure analysis of the entire network equipment. Based on the overall system failure risk, a corresponding thermal design optimization scheme is determined to optimize the thermal failure of the network equipment.

[0020] This specification provides one or more embodiments of a non-volatile computer storage medium storing computer-executable instructions, wherein the computer-executable instructions are configured as follows:

[0021] The thermal failure analysis device uses a temperature measurement component to dynamically collect dynamic field infrared data of the entire network equipment and real-time temperature data of each network device within the network equipment. The dynamic field infrared data includes real-time infrared data from multiple network devices. Based on the dynamic field infrared data and the temperature thresholds of each network device in a pre-acquired network device performance library, at least one device with thermal failure risk is selected. The real-time temperature data of each thermal failure risk device is determined, and a temperature rise curve for each thermal failure risk device is generated based on the real-time temperature data of each thermal failure risk device and pre-acquired traffic forwarding data of the entire network equipment. According to pre-acquired network equipment operating requirements, the temperature rise curves of each thermal failure risk device are analyzed to generate overall system failure risk for thermal failure analysis of the entire network equipment. Based on the overall system failure risk, a corresponding thermal design optimization scheme is determined to optimize the thermal failure of the network equipment.

[0022] The above-mentioned technical solutions adopted in the embodiments of this specification can achieve the following beneficial effects: By acquiring dynamic field infrared data and real-time temperature data through the above technical solutions, the accuracy and speed of measurement are effectively improved by adopting a point-to-surface combined measurement method; in addition, by identifying thermal failure risk devices through dynamic field infrared data, the use of thermal field visualization means can intuitively detect and analyze high-risk thermal failure devices during equipment operation, providing reliable optimization basis for thermal design users; generating temperature rise curves for the real-time temperature data of each thermal failure risk device can monitor the failure process of each thermal failure risk device during equipment operation; finally, considering the impact of each thermal failure risk device on the operation of the entire equipment, the failure risk of the entire network equipment is comprehensively generated, ensuring the comprehensiveness and pertinence of failure analysis, and providing a highly quantitative method for thermal failure analysis of network equipment, which is conducive to targeted thermal failure optimization. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0024] Figure 1 A flowchart illustrating a method for thermal failure analysis of a network device provided in an embodiment of this specification;

[0025] Figure 2 This is a schematic diagram illustrating the application of a thermal failure analysis device for a network device provided in an embodiment of this specification.

[0026] Figure 3 A flowchart illustrating another method for thermal failure analysis of network devices provided in the embodiments of this specification;

[0027] Figure 4 This is a schematic diagram of the structure of a thermal failure analysis device for a network device provided in an embodiment of this specification. Detailed Implementation

[0028] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments of this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0029] The rapid development of modern communication technologies has ushered in the era of the Internet of Things. Intelligent driving and telemedicine are becoming a reality, and smart factories and smart cities are gradually taking shape. High-performance, highly reliable networks are increasingly becoming the core of new infrastructure. Advances in semiconductor and microelectronics technologies have enabled chips to be smaller, with higher transistor density and stronger performance, promoting the miniaturization, micro-miniaturization, and high performance of modern network equipment. While high-density electronic components bring higher performance, they also mean a significant increase in heat generation per unit area. Research has found that for every 10°C increase in temperature, the lifespan of chip devices will be reduced by half; currently, most electronic device failures originate from thermal issues.

[0030] In traditional network applications, equipment is often housed in dedicated server rooms or at least relatively well-ventilated indoor environments. Heat dissipation can be improved by adding cooling facilities and configuring dedicated cooling equipment, thus enhancing operational reliability. However, in the era of the Internet of Things (IoT), more network devices need to operate outdoors in harsher conditions. High temperatures, high humidity, and dust will severely impact heat dissipation, leading to thermal failure. Especially in industrial internet applications, the high-temperature environments and adverse consequences of network failures in most manufacturing enterprises (such as metallurgy, energy, and power) place extremely high demands on the thermal stability of network equipment. Thermal failure is becoming one of the key factors restricting the performance improvement of network devices.

[0031] Currently, conventional network equipment typically employs a forward development approach in its hardware design process. Starting with product performance, it plans the layout of hardware components such as CPUs and ports, then calculates the total heat dissipation and power consumption, and matches corresponding cooling measures. This existing approach struggles to pinpoint precise heat dissipation risk points within network equipment and the thermal failure processes of key components during operation. This results in a lack of comprehensiveness and specificity in thermal failure analysis, hindering effective optimization for high-risk thermal failure points.

[0032] This specification provides a method for analyzing the thermal failure of network devices. It should be noted that the execution subject in this specification can be a server or any device with data processing capabilities. Figure 1 This is a flowchart illustrating a method for thermal failure analysis of a network device provided in an embodiment of this specification, as shown below. Figure 1 As shown, the main steps include the following:

[0033] Step S101: The temperature measurement component of the thermal failure analysis device dynamically collects the dynamic field infrared data of the entire network device and the real-time temperature data of each network device in the entire network device.

[0034] The dynamic field infrared data includes real-time infrared data from multiple network devices.

[0035] In one embodiment of this specification, Figure 2 This is a schematic diagram illustrating the application of a thermal failure analysis device for a network device provided in an embodiment of this specification, such as... Figure 2 As shown, the thermal failure analysis device includes an environmental control component, a temperature measurement component, and a data acquisition and processing component. The environmental control component includes an insulated box lined with thermal insulation cotton, a temperature sensor, a humidity sensor, and an air conditioning unit. The temperature measurement component includes an infrared thermal imager, thermocouples, and other temperature acquisition devices. The data acquisition and processing component includes a signal collector and terminal equipment with data processing capabilities. The infrared imager in the thermal failure analysis device records the temperature field during the operation of the network equipment, obtaining dynamic infrared data of the entire network equipment. The thermocouples in the thermal failure analysis device measure the temperature of each network component in the entire network equipment at specific points, obtaining real-time temperature data for each network component.

[0036] In one embodiment of this specification, a thermal failure analysis device provides a reliable testing environment for thermal failure assessment. The test chamber is lined or covered with insulating cotton to create a relatively insulated environment, avoiding environmental interference. The air conditioning system and temperature and humidity sensors inside the test chamber are regulated using a control device with negative feedback to maintain the actual temperature and humidity environment for the network equipment during testing. When evaluating the equipment's performance under extreme high-temperature environments, a heating device may be added if necessary. An external thermal imager is used to record the temperature field during equipment operation to identify key high-temperature risk points and the evolution of heat accumulation under the current heat dissipation design. Thermocouples are used to measure the temperature of core components at specific points for refined evaluation of heat dissipation effects and for infrared thermal imaging calibration.

[0037] Step S102: Based on dynamic field infrared data and the temperature threshold of each network device in the pre-acquired network device performance library, at least one thermal failure risk device that meets the requirements is selected.

[0038] Before selecting at least one thermal failure risk device that meets the requirements based on the dynamic field infrared data and the temperature threshold of each network device in the pre-acquired network device performance library, the method further includes: acquiring device test data of each network device under different operating conditions, wherein the device test data includes the highest operating temperature of each network device under normal operating conditions, the device failure temperature corresponding to each network device, and the overall system impact factor corresponding to the failure of each network device; determining the temperature threshold corresponding to each network device under different operating conditions based on the device test data of each network device under different operating conditions and the preset specified factor threshold, wherein the value range of the overall system impact factor is a specified numerical range, and the larger the overall system impact factor, the greater the impact of the failure of the network device on the operation of the entire network device; and generating a network device performance library based on the temperature threshold corresponding to each network device under each operating condition.

[0039] In one embodiment of this specification, device test data for each network device under different operating conditions is obtained. It should be noted that "operating conditions" here refers to the operating environment of the network device, such as a data center environment, a high-temperature environment, or a high-heat environment. Device test data may include the highest operating temperature of each network device under normal operating conditions, the device failure temperature corresponding to each network device, and the overall system impact factor corresponding to the failure of each network device. Different operating conditions can be simulated using a thermal failure analysis device, and multiple tests can be performed on the entire network device containing multiple network devices to obtain the highest operating temperature of each network device under normal operating conditions and the device failure temperature corresponding to the failure of each network device. The overall system impact factor corresponding to the failure of each network device refers to the impact of the network device failure on the operation of the entire network device. In practical application scenarios, the failure of some core components may cause the entire network device to crash, but there are also cases where the failure of a network device has no impact on the operation of the entire network device. An overall system impact factor is set based on the impact of each network device on the operation of the entire network device. When setting the overall system impact factor, its value range is greater than or equal to 0 and less than or equal to 1. When the overall impact factor is 0, it means that the network device has no impact on the operation of the network equipment. When the overall impact factor is 1, it means that the network device has the greatest impact on the operation of the network equipment.

[0040] In one embodiment of this specification, a preset specified factor threshold is used to distinguish the risk of network device failure to the overall operation of the network equipment, and can be set to 0.5. Based on the device test data of each network device under different operating conditions and the preset specified factor threshold, the corresponding temperature threshold for each network device under different operating conditions is determined. Based on the temperature threshold corresponding to each network device under each operating condition, a network device performance library is generated.

[0041] Based on the device test data of each network device under different operating conditions and the preset specified factor threshold, the temperature threshold corresponding to each network device under different operating conditions is determined. Specifically, when the overall system influence factor in the device test data corresponding to the current operating condition is not less than the specified factor threshold, the highest operating temperature of the network device under normal operation is taken as the temperature threshold corresponding to the network device under the current operating condition; when the overall system influence factor in the device test data corresponding to the current operating condition is less than the specified factor threshold, the device failure temperature of the network device is taken as the temperature threshold corresponding to the network device under the current operating condition.

[0042] In one embodiment of this specification, when the overall system impact factor corresponding to the current operating condition is not less than a specified factor threshold, it indicates that the failure of the network device will pose a significant risk to the overall operation of the network equipment. Therefore, during the initial screening stage of risky devices, the value below the failure temperature should be used as the temperature threshold, that is, the highest operating temperature of the network device under normal operating conditions should be used as the temperature threshold corresponding to the network device under the current operating condition. When the overall system impact factor in the device test data corresponding to the current operating condition is less than the specified factor threshold, it indicates that the failure of the network device has a small impact on the overall operation of the network equipment, which can be understood as having almost no impact on the operation of the overall network equipment. Therefore, the device failure temperature corresponding to the network device can be directly used as the temperature threshold corresponding to the network device under the current operating condition.

[0043] Based on the dynamic field infrared data and the temperature threshold of each network device in the pre-acquired network device performance library, at least one thermal failure risk device that meets the requirements is screened out. Specifically, this includes: obtaining the current operating condition of the entire network device; based on the current operating condition, determining the temperature threshold of each network device under the current operating condition in the network device performance library; comparing the real-time infrared data of each network device in the dynamic field infrared data with the temperature threshold of each network device, generating at least one specified real-time infrared data that is greater than the temperature threshold; and based on at least one of the specified real-time infrared data, determining the thermal failure risk device corresponding to each specified real-time infrared data.

[0044] In one embodiment of this specification, the current operating condition of the entire network device, i.e., the current operating environment of the entire network device, is obtained. Based on the current operating condition, the temperature threshold of each network device under the current operating condition is determined from the network device performance library. The temperature threshold of each network device is compared with the real-time infrared data of each network device in the dynamic field infrared data to identify devices at risk of thermal failure whose temperature exceeds the temperature threshold.

[0045] Step S103: Determine the real-time temperature data of each thermal failure risk device, and generate the temperature rise curve of each thermal failure risk device based on the real-time temperature data of each thermal failure risk device and the traffic forwarding data of the network equipment as a whole obtained in advance.

[0046] Based on the real-time temperature data of each thermal failure risk device and the pre-acquired traffic forwarding data of the entire network device, a temperature rise curve for each thermal failure risk device is generated. Specifically, this includes: acquiring the real-time traffic forwarding data of the entire network device; aligning the real-time traffic forwarding data of the entire network device and the real-time temperature data of each thermal failure risk device according to timestamps to generate a data point pair for each thermal failure risk device, wherein the data point pair includes the traffic forwarding data and real-time temperature data corresponding to the current moment; and generating a temperature rise curve for each thermal failure risk device by using the traffic forwarding data in the data point pair as the horizontal axis and the real-time temperature data of the thermal failure risk device as the vertical axis.

[0047] In one embodiment of this specification, real-time traffic forwarding data includes traffic forwarding data at multiple times. Similarly, real-time temperature data includes temperature data at multiple times. Traffic forwarding data and temperature data at the same timestamp are paired to obtain multiple data point pairs for each thermal failure risk device. Using the traffic forwarding data in the data point pair as the x-axis and the real-time temperature data of the thermal failure risk device as the y-axis, a temperature rise curve for the thermal failure risk device is generated. This temperature rise curve allows for monitoring of the temperature rise process of the network device during network equipment operation.

[0048] Step S104: Based on the pre-obtained network equipment operation requirements, analyze the temperature rise curve of each thermal failure risk device to generate overall failure risk, so as to perform thermal failure analysis on the entire network equipment.

[0049] Before generating the overall failure risk by analyzing the temperature rise curve of each thermally failed device based on the pre-acquired network equipment operation requirements, the method further includes: collecting various customer application requirements corresponding to the network equipment, and determining the network equipment operation requirements of the network equipment based on each customer application requirement, wherein the network equipment operation requirements include stable forwarding requirements and extreme operating condition requirements; determining the current overall impact factor of each network device in the network equipment under the network equipment operation requirements; establishing a mapping relationship between the network equipment operation requirements and the current overall impact factor of each network device in the network equipment under the network equipment operation requirements, and storing it in a preset database.

[0050] In one embodiment of this specification, multiple customer application requirements corresponding to the network device are obtained. Based on each customer application requirement, the network device operation requirements are determined. These network device operation requirements include stable forwarding requirements and extreme operating condition requirements. It should be noted that the requirements for network components in the overall network device differ under different device operation requirements. For example, under stable forwarding requirements, network components need to be in a normal operating state. The current overall impact factor of the network components can be set to a value greater than 0.5 and not greater than 1. In other words, network component failure will have a significant impact on the stable operation of the overall network device. Under extreme operating condition requirements, the network device as a whole only needs to complete traffic forwarding, without requirements on traffic forwarding efficiency. That is to say, network component failure has little impact on the stable operation of the overall network device. The current overall impact factor of the network components can be set to a value not less than 0 and less than 0.5.

[0051] In one embodiment of this specification, based on the network device's operational requirements, the current overall system impact factor corresponding to each network device in the network device is determined under those requirements. A mapping relationship is established between the network device's operational requirements and the current overall system impact factor corresponding to each network device in the network device under those requirements, and this relationship is stored in a preset database.

[0052] Based on the pre-obtained network equipment operating requirements, the temperature rise curve of each thermal failure risk device is analyzed to generate the overall system failure risk. Specifically, this includes: obtaining the current network equipment operating requirements corresponding to the network equipment; based on the current network equipment operating requirements, obtaining the current overall system impact factor of each network device corresponding to the current network equipment operating requirements from the preset database; analyzing the temperature rise curve of each thermal failure risk device to generate the device failure risk of each thermal failure risk device; and generating the overall system failure risk based on the device failure risk of each thermal failure risk device and the current overall system impact factor of each network device.

[0053] In one embodiment of this specification, the current network device operating requirements corresponding to the network device are obtained. Under these current operating requirements, the current overall system impact factor for each network device corresponding to the current network device operating requirements is retrieved from a preset database. The temperature rise curve of each thermal failure risk device is analyzed to obtain the device failure risk for each thermal failure risk device. The overall system failure risk factor is obtained by multiplying the device failure risk of each thermal failure risk device by the current overall system impact factor of each network device. The overall system failure risk is then determined using the overall system failure risk factor.

[0054] In one embodiment of this specification, a risk factor threshold is generated in advance based on the calculation rules of device failure risk and current overall system impact factor. When the overall system failure risk factor is greater than the risk factor threshold, the overall system failure risk is set as a level one risk. When the overall system failure risk factor is less than the risk factor threshold, the overall system failure risk is set as a level two risk. The level one risk corresponds to a higher risk level than the level two risk.

[0055] The temperature rise curve of each thermal failure risk device is analyzed to generate the device failure risk for each device. Specifically, this includes: identifying the extreme points of the temperature rise curve, including maximum and minimum points; identifying the first forwarding traffic data corresponding to the maximum point and the second forwarding traffic data corresponding to the minimum point; calculating the difference between the first forwarding traffic data and the second forwarding traffic data; and determining the device failure risk of the thermal failure risk device based on the difference and a preset difference threshold.

[0056] In one embodiment of this specification, the maximum and minimum points of the temperature rise curve are determined; the first forwarding traffic data corresponding to the maximum point and the second forwarding traffic data corresponding to the minimum point are determined; and the difference between the first and second forwarding traffic data is calculated. It should be noted that this difference represents the temperature rise of the network device. A larger difference indicates a relatively gentle temperature rise trend, while a smaller difference indicates a shorter temperature rise process and a steep rise trend. To differentiate between gentle and steep temperature rises, a preset difference threshold can be set. A difference greater than this threshold indicates a large difference and a gentle temperature rise trend, while a difference less than the threshold indicates a small difference and a steep rise trend. Based on the temperature rise trend, the device failure risk of the thermally unstable device is determined. When the temperature rises gradually, the risk of device failure is relatively low, and the device failure risk factor can be set to a value greater than 0 and less than 0.5. When the temperature rises sharply, the risk of device failure is relatively high, and the device failure risk factor can be set to a value greater than 0.5 and less than 1. The specific value setting can be customized according to user needs.

[0057] Step S105: Based on the overall failure risk, determine the corresponding thermal design optimization scheme to optimize the thermal failure of network equipment.

[0058] In one embodiment of this specification, a corresponding thermal design optimization scheme is determined based on the overall system failure risk. When the overall system failure risk is Level 1, a thermal failure optimization scheme is generated based on the device failure risk of each thermal failure risk device and the current overall system impact factor of each network device to avoid thermal failure problems that could affect the operation of the entire device. When the overall system failure risk is Level 2, thermal failure optimization is performed on the network devices according to a pre-set system thermal design scheme to ensure the normal operation of the devices.

[0059] Figure 3 This is a flowchart illustrating another method for thermal failure analysis of network devices provided in the embodiments of this specification, as shown below. Figure 3 As shown, the network equipment thermal failure analysis method consists of two stages. The first stage is the equipment preparation stage, which includes the pre-operation of air conditioning equipment, maintaining the balance of the test environment, and calibrating temperature measuring equipment and starting up test instruments. This stage is mainly used to ensure the stability of the test environment and the accuracy of the equipment. The second stage is the test analysis stage, which mainly includes the identification of high-risk failure devices, accurate temperature measurement, device failure risk assessment, overall failure level assessment, and thermal design optimization. First, an infrared thermal imager is used to dynamically measure the temperature of the equipment under different operating conditions to identify high-temperature points. Combined with device specifications and the consequences of device failure, high-risk thermal failure devices are initially screened. Second, the temperature rise curve of high-risk devices during operation is obtained by binding thermocouples, that is, the forwarding traffic load-temperature curve. Then, based on the temperature rise curve, the device failure risk is determined in combination with the device temperature reliability. Finally, statistical methods are used to calculate the overall thermal failure risk of the equipment, and the overall thermal failure risk level of the network equipment is comprehensively evaluated in combination with the customer's application scenario and customer network quality specifications. Thermal design optimization is then performed for high-risk designs.

[0060] By employing the aforementioned technical solutions, dynamic infrared data and real-time temperature data are collected, and a point-to-surface combined measurement method is used to effectively improve the accuracy and speed of measurement. Furthermore, dynamic infrared data is used to identify thermal failure risk devices, and thermal field visualization allows for intuitive detection and analysis of high-risk devices during equipment operation, providing reliable optimization basis for thermal design users. Temperature rise curves are generated from the real-time temperature data of each thermal failure risk device, enabling monitoring of the failure process of each device during equipment operation. Finally, considering the impact of each thermal failure risk device on the overall equipment operation, a comprehensive failure risk assessment of the entire network equipment is generated, ensuring the comprehensiveness and relevance of the failure analysis. This provides a highly quantifiable method for thermal failure analysis of network equipment, facilitating targeted thermal failure optimization.

[0061] This specification also provides an embodiment of a thermal failure analysis device for network devices, such as... Figure 4As shown, the device includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to:

[0062] The thermal failure analysis device uses a temperature measurement component to dynamically acquire dynamic field infrared data of the entire network equipment and real-time temperature data of each network device within it. The dynamic field infrared data includes real-time infrared data from multiple network devices. Based on this dynamic field infrared data and the temperature thresholds of each network device in a pre-acquired network device performance library, at least one device with thermal failure risk is selected. The real-time temperature data of each thermal failure risk device is determined, and a temperature rise curve is generated for each device based on this real-time temperature data and pre-acquired traffic forwarding data of the entire network equipment. According to pre-acquired network equipment operating requirements, the temperature rise curves of each thermal failure risk device are analyzed to generate overall system failure risk, thus performing thermal failure analysis on the entire network equipment. Based on this overall system failure risk, a corresponding thermal design optimization scheme is determined to optimize the thermal failure of the network equipment.

[0063] This specification also provides a non-volatile computer storage medium storing computer-executable instructions, wherein the computer-executable instructions are configured as follows:

[0064] The thermal failure analysis device uses a temperature measurement component to dynamically acquire dynamic field infrared data of the entire network equipment and real-time temperature data of each network device within it. The dynamic field infrared data includes real-time infrared data from multiple network devices. Based on this dynamic field infrared data and the temperature thresholds of each network device in a pre-acquired network device performance library, at least one device with thermal failure risk is selected. The real-time temperature data of each thermal failure risk device is determined, and a temperature rise curve is generated for each device based on this real-time temperature data and pre-acquired traffic forwarding data of the entire network equipment. According to pre-acquired network equipment operating requirements, the temperature rise curves of each thermal failure risk device are analyzed to generate overall system failure risk, thus performing thermal failure analysis on the entire network equipment. Based on this overall system failure risk, a corresponding thermal design optimization scheme is determined to optimize the thermal failure of the network equipment.

[0065] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the embodiments of apparatus, devices, and non-volatile computer storage media are basically similar to the method embodiments, so the descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0066] The foregoing has described specific embodiments of this specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are possible or may be advantageous.

[0067] The devices, media, and methods provided in the embodiments of this specification are one-to-one correspondences. Therefore, the devices and media also have similar beneficial technical effects as their corresponding methods. Since the beneficial technical effects of the methods have been described in detail above, the beneficial technical effects of the devices and media will not be repeated here.

[0068] Those skilled in the art will understand that embodiments of this specification can be provided as methods, systems, or computer program products. Therefore, this specification may take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this specification may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0069] This specification is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this specification. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create a machine for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0070] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0071] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0072] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0073] Memory may include non-persistent storage in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0074] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0075] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0076] The above description is merely one or more embodiments of this specification and is not intended to limit this specification. Various modifications and variations can be made to the one or more embodiments of this specification by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of one or more embodiments of this specification should be included within the scope of the claims of this specification.

Claims

1. A method for thermal failure analysis of network devices, characterized in that, The method, applied to a thermal failure analysis apparatus, includes: The temperature measurement component of the thermal failure analysis device dynamically collects dynamic field infrared data of the entire network device and real-time temperature data of each network device in the entire network device. The dynamic field infrared data includes real-time infrared data of multiple network devices. Based on the dynamic field infrared data and the temperature threshold of each network device in the pre-acquired network device performance library, at least one thermal failure risk device that meets the requirements is selected. The real-time temperature data of each of the thermal failure risk devices is determined, and the temperature rise curve of each of the thermal failure risk devices is generated based on the real-time temperature data of each of the thermal failure risk devices and the traffic forwarding data of the network device as a whole obtained in advance. Based on the pre-obtained network equipment operation requirements, the temperature rise curve of each of the thermal failure risk devices is analyzed to generate the overall failure risk of the network equipment, so as to perform thermal failure analysis on the entire network equipment. Based on the overall failure risk, corresponding thermal design optimization schemes are determined to optimize the thermal failure of the network equipment; Before selecting at least one thermal failure risk device that meets the requirements based on the dynamic field infrared data and the temperature threshold of each network device in the pre-acquired network device performance library, the method further includes: Acquire device test data for each network device under different operating conditions. The device test data includes the highest operating temperature of each network device under normal operating conditions, the device failure temperature of each network device, and the overall system impact factor corresponding to the failure of each network device. Based on the device test data of each network device under different operating conditions and the preset specified factor threshold, the temperature threshold corresponding to each network device under different operating conditions is determined. The value range of the whole machine influence factor is a specified numerical range. The larger the whole machine influence factor, the greater the impact of the failure of the network device on the operation of the whole network equipment. A network device performance library is generated based on the temperature threshold corresponding to each network device under each operating condition; Based on the device test data of each network device under different operating conditions and the preset specified factor threshold, the temperature threshold corresponding to each network device under different operating conditions is determined, specifically including: When the overall influence factor in the device test data corresponding to the current operating condition is not less than the specified factor threshold, the highest operating temperature of the network device under normal operating conditions shall be taken as the temperature threshold of the network device under the current operating condition. When the overall system impact factor in the device test data corresponding to the current operating condition is less than the specified factor threshold, the device failure temperature corresponding to the network device is taken as the temperature threshold corresponding to the network device under the current operating condition.

2. The method for thermal failure analysis of network devices according to claim 1, characterized in that, Based on the dynamic field infrared data and the temperature threshold of each network device in the pre-acquired network device performance library, at least one device with thermal failure risk that meets the requirements is selected, specifically including... Obtain the current operating status of the entire network device; Based on the current operating conditions, the temperature threshold for each network device under the current operating conditions is determined from the network device performance library. The real-time infrared data of each network device in the dynamic field infrared data is compared with the temperature threshold of each network device to generate at least one specified real-time infrared data that is greater than the temperature threshold. Based on at least one of the specified real-time infrared data, the thermal failure risk device corresponding to each specified real-time infrared data is determined.

3. The method for thermal failure analysis of network devices according to claim 1, characterized in that, Based on the real-time temperature data of each of the thermal failure risk devices and the pre-acquired traffic forwarding data of the entire network device, a temperature rise curve is generated for each of the thermal failure risk devices, specifically including: Obtain real-time traffic forwarding data of the entire network device; The real-time traffic forwarding data of the entire network device and the real-time temperature data of each of the thermal failure risk devices are aligned according to the timestamp to generate a data point pair for each of the thermal failure risk devices, wherein the data point pair includes the traffic forwarding data and real-time temperature data corresponding to the current moment. Based on the data point pair of each thermal failure risk device, the traffic forwarding data in the data point pair is used as the horizontal axis, and the real-time temperature data of the thermal failure risk device is used as the vertical axis to generate the temperature rise curve of the thermal failure risk device.

4. The method for thermal failure analysis of network devices according to claim 1, characterized in that, Before analyzing the temperature rise curve of each of the thermal failure risk devices based on the pre-obtained network equipment operating requirements and generating the overall system failure risk, the method further includes: Collect various customer application requirements corresponding to the network device, and determine the network device operation requirements based on each customer application requirement, wherein the network device operation requirements include stable forwarding requirements and extreme operating condition requirements; Based on the network equipment operation requirements, determine the current overall impact factor of each network device in the network equipment under the network equipment operation requirements; Establish a mapping relationship between the network device operation requirements and the current overall impact factor of each network device in the network device under the network device operation requirements, and store it in a preset database.

5. The method for thermal failure analysis of network devices according to claim 4, characterized in that, Based on the pre-obtained network equipment operating requirements, the temperature rise curve of each of the aforementioned thermal failure risk components is analyzed to generate the overall system failure risk, specifically including: Obtain the current network device operation requirements corresponding to the network device, and based on the current network device operation requirements, obtain the current overall impact factor of each network device corresponding to the current network device operation requirements from the preset database; The temperature rise curve of each of the aforementioned thermal failure risk devices is analyzed to generate the device failure risk of each of the aforementioned thermal failure risk devices; The overall failure risk is generated based on the device failure risk of each of the aforementioned thermal failure risk devices and the current overall impact factor of each network device.

6. The method for thermal failure analysis of network devices according to claim 5, characterized in that, Analyze the temperature rise curve of each of the aforementioned thermal failure risk devices to generate the device failure risk for each device, specifically including: In the temperature rise curve, the extreme points of the temperature rise curve are determined, wherein the extreme points include maximum points and minimum points; Determine the first forwarding traffic data corresponding to the maximum point and the second forwarding traffic data corresponding to the minimum point; Calculate the difference between the first forwarding traffic data and the second forwarding traffic data, and determine the device failure risk of the thermal failure risk device based on the difference and a preset difference threshold.

7. A thermal failure analysis device for network equipment, characterized in that, The device includes: At least one processor; and, A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method as described in any one of claims 1-6.

8. A non-volatile computer storage medium storing computer-executable instructions, characterized in that, The computer-executable instructions are configured to perform the method as described in any one of claims 1-6.

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