Apparatus and method for processing probes for a probe card
By using a negative pressure fixing method with an upper and lower tray combination structure and laser cutting, the problems of bending, falling off and surface scratches in probe processing were solved, thus simplifying the probe processing flow and improving the yield rate.
CN118492661BActive Publication Date: 2026-09-11MAXONE SEMICON CO LTD
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Patent Information
- Application Number
- CN202410665771.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2044-05-27
AI Technical Summary
Technical Problem
In the existing technology, the probe processing process suffers from defects such as probe bending, falling off, and surface scratches, resulting in a low yield and a large amount of manual labor.
Method used
The device employs a combination structure of upper and lower trays, uses a negative pressure system to fix the metal substrate, forms the probe through laser cutting, and keeps the probe suspended after cutting to avoid repeated disassembly and assembly of the probe.
Benefits of technology
It simplifies the probe processing procedure, reduces labor costs, improves the probe yield, and avoids defects such as probe bending, falling off, and surface scratches.
✦ Generated by Eureka AI based on patent content.
Abstract
The application discloses a processing device and method for probes of a probe card. The device comprises an upper tray, a first main body and a plurality of first support parts, the first main body is annular, a plurality of first support parts are arranged at intervals in the first main body to support the metal substrate, there is a first space between two adjacent first support parts, and the upper tray is further provided with a positioning structure for fixing the metal substrate; a lower tray, a second main body and a plurality of second support parts, a plurality of second support parts are arranged at intervals on the second main body, when the upper tray and the lower tray are assembled, a plurality of second support parts are respectively embedded in a plurality of first spaces and support the metal substrate. The scheme simplifies the probe processing flow, reduces the labor cost, avoids defects such as bending, falling off or surface scratch caused by repeated mounting in the probe processing process, and improves the yield of the probe.
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