A water-based adhesive and its application in electronic ceramic molding

Abstract

The present invention relates to the field of adhesives, specifically to a water-based adhesive and its application in electronic ceramic molding. The water-based adhesive comprises an epoxy-modified polyacrylate emulsion and a polyamine compound, wherein the mass ratio of the epoxy-modified polyacrylate emulsion to the polyamine compound is 1:0.01-0.05. Tests have shown that an alumina blank prepared using the adhesive of the present invention has high mechanical strength, which is beneficial for subsequent processing and industrial application.

Description

Technical Field

[0001] The present invention relates to the field of adhesives, in particular to a water-based adhesive and its application in electronic ceramic molding. Background Art

[0002] Since its introduction in 1945, the tape casting process has been widely used in the forming of electronic ceramic materials. It is a key method for producing large-area, thin-film ceramics. Current tape casting processes can be categorized into two types, non-aqueous and aqueous, based on the solvents used. Recent research both domestically and internationally indicates that non-aqueous tape casting processes have become relatively mature. The resulting electronic ceramic green sheets exhibit uniform structure, high strength, good flexibility, and ease of cutting and processing, making them widely used in industrial production. However, the use of large amounts of flammable and toxic organic solvents, binders, and dispersants in non-aqueous tape casting processes poses certain risks to humans and the environment. Therefore, research into tape casting techniques that use water as a solvent to replace organic solvents has become an irreversible trend. However, the low strength of ceramic green sheets produced by tape casting using water as a solvent significantly limits subsequent processing and industrial applications. Summary of the Invention

[0003] Purpose of the invention: In order to solve the above technical problems, the present invention proposes a water-based adhesive and its application in electronic ceramic molding.

[0004] The technical solutions adopted are as follows:

[0005] A water-based adhesive comprises epoxy-modified polyacrylate emulsion and a polyamine compound.

[0006] Furthermore, the mass ratio of the epoxy-modified polyacrylate emulsion to the polyamine compound is 1:0.01-0.05.

[0007] Furthermore, the preparation method of the epoxy-modified polyacrylate emulsion is as follows:

[0008] Add emulsifier and part of free radical initiator into water, stir and heat to 60-80°C, add acrylate monomer and remaining free radical initiator, keep warm and react for 5-10 hours, then return to room temperature.

[0009] Furthermore, the acrylic acid ester monomers include acrylic acid, methyl methacrylate and glycidyl methacrylate.

[0010] Furthermore, the mass ratio of acrylic acid, methyl methacrylate and glycidyl methacrylate is 5-10:0.5-1:1-5.

[0011] Furthermore, the free radical initiator is any one or more combinations of potassium persulfate, benzoyl peroxide, lauroyl peroxide, di-tert-butyl peroxide, dicumyl peroxide, azobisisobutyronitrile, azobisisoheptanenitrile, and azobiscyanovaleric acid.

[0012] Furthermore, the structure of the polyamine compound is shown in Formula 1:

[0013]

[0014] R1, R2, and R3 are each independently hydrogen, amino, or a structure shown in Formula 2:

[0015]

[0016] At least one of R1, R2, and R3 is a structural formula shown in Formula 2, and at most one of R1, R2, and R3 is hydrogen.

[0017] Furthermore, at least two of R1, R2, and R3 are of the structural formula shown in Formula 2.

[0018] Furthermore, the polyamine compound is any one of the following compounds:

[0019]

[0020] Furthermore, the present invention also provides an application of a water-based adhesive in electronic ceramic molding.

[0021] Beneficial effects of the present invention:

[0022] The present invention provides a water-based adhesive, which is prepared by epoxy-modifying a polyacrylate emulsion to introduce epoxy groups with high cross-linking activity, and then forming a three-dimensional cross-linked structure polymer through the reaction of a polyamine compound with the epoxy groups, which wraps the ceramic particles as a whole. The polymer is then solidified by reaction during the casting and drying process to form a three-dimensional network form, so that the mechanical strength of the prepared ceramic blank is greatly improved. At the same time, the amide bonds in the polyamine compound undergo hydrogen bond reactions with each other to generate hydrogen bonding forces, which also improves the mechanical strength of the ceramic blank to a certain extent. The alumina blank prepared using the adhesive of the present invention has high mechanical strength, which is beneficial for subsequent processing and industrial application. DETAILED DESCRIPTION

[0023] Unless otherwise specified, the following examples and comparative examples were conducted in parallel, using the same processing steps and parameters.

[0024] Example 1:

[0025] A water-based adhesive comprises an epoxy-modified polyacrylate emulsion and a polyamine compound in a mass ratio of 1:0.05.

[0026] Wherein, the preparation method of epoxy modified polyacrylate emulsion is as follows:

[0027] Add 1.4g of emulsifier SDS and 0.2g of potassium persulfate to 150ml of water, stir and heat to 65°C, then add acrylate monomer consisting of 30g of acrylic acid, 2g of methyl methacrylate and 5g of glycidyl methacrylate and another 0.4g of potassium persulfate. Keep the reaction warm for 8h and then return to room temperature. Finally, adjust the solid content to 10% with water.

[0028] Polyamine compounds are compounds with the following structure:

[0029]

[0030] Example 2:

[0031] A water-based adhesive comprises an epoxy-modified polyacrylate emulsion and a polyamine compound in a mass ratio of 1:0.05.

[0032] Wherein, the preparation method of epoxy modified polyacrylate emulsion is as follows:

[0033] Add 1.4g of emulsifier SDS and 0.2g of potassium persulfate to 150ml of water, stir and heat to 65°C, then add acrylate monomer consisting of 30g of acrylic acid, 2g of methyl methacrylate and 5g of glycidyl methacrylate and another 0.4g of potassium persulfate. Keep the reaction warm for 8h and then return to room temperature. Finally, adjust the solid content to 10% with water.

[0034] Polyamine compounds are compounds with the following structure:

[0035]

[0036] Example 3:

[0037] A water-based adhesive comprises an epoxy-modified polyacrylate emulsion and a polyamine compound in a mass ratio of 1:0.05.

[0038] Wherein, the preparation method of epoxy modified polyacrylate emulsion is as follows:

[0039] Add 1.4g of emulsifier SDS and 0.2g of potassium persulfate to 150ml of water, stir and heat to 65°C, then add acrylate monomer consisting of 30g of acrylic acid, 2g of methyl methacrylate and 5g of glycidyl methacrylate and another 0.4g of potassium persulfate. Keep the reaction warm for 8h and then return to room temperature. Finally, adjust the solid content to 10% with water.

[0040] Polyamine compounds are compounds with the following structure:

[0041]

[0042] Example 4:

[0043] A water-based adhesive comprises an epoxy-modified polyacrylate emulsion and a polyamine compound in a mass ratio of 1:0.03.

[0044] Wherein, the preparation method of epoxy modified polyacrylate emulsion is as follows:

[0045] Add 1.4g of emulsifier SDS and 0.2g of potassium persulfate to 150ml of water, stir and heat to 65°C, then add acrylate monomer consisting of 30g of acrylic acid, 2g of methyl methacrylate and 5g of glycidyl methacrylate and another 0.4g of potassium persulfate. Keep the reaction warm for 8h and then return to room temperature. Finally, adjust the solid content to 10% with water.

[0046] Polyamine compounds are compounds with the following structure:

[0047]

[0048] Example 5:

[0049] A water-based adhesive comprises an epoxy-modified polyacrylate emulsion and a polyamine compound in a mass ratio of 1:0.01.

[0050] Wherein, the preparation method of epoxy modified polyacrylate emulsion is as follows:

[0051] Add 1.4g of emulsifier SDS and 0.2g of potassium persulfate to 150ml of water, stir and heat to 65°C, then add acrylate monomer consisting of 30g of acrylic acid, 2g of methyl methacrylate and 5g of glycidyl methacrylate and another 0.4g of potassium persulfate. Keep the reaction warm for 8h and then return to room temperature. Finally, adjust the solid content to 10% with water.

[0052] Polyamine compounds are compounds with the following structure:

[0053]

[0054] Comparative Example 1:

[0055] The process is basically the same as Example 1, except that no polyamine compound is added.

[0056] Performance testing:

[0057] Alumina powder (D 50 3.4 μm, Alteo Company) was placed in a ball mill jar of a planetary ball mill, and then the aqueous binders of Examples 1-5 and Comparative Example 1 were added respectively, with the mass ratio of alumina powder to aqueous binder being 1:1. The slurry was ball milled at a speed of 600 r / min for 5 h to obtain a slurry, which was defoamed in a vacuum degassing machine and then tape-casted on a tape-casting machine. The obtained cast sheet was dried at 50° C. for 48 h and then demolded to obtain an alumina blank, which was used as a sample for performance testing;

[0058] The three-point bending method was used to determine the bending strength of the sample. The test equipment was a WDW-10 multifunctional material testing machine. The sample size was 25 mm × 5 mm × 5 mm. The loading rate was 0.05 mm / s. The test results are shown in Table 1 below:

[0059] Table 1:

[0060]

[0061] As can be seen from Table 1 above, the alumina blank prepared using the binder of the present invention has higher mechanical strength;

[0062] By comparing the data of Example 1 with those of Examples 2 and 3, it can be seen that the increase in the number of amide bonds plays a positive role in improving the mechanical strength of the alumina blank;

[0063] By comparing the data of Example 1 with those of Examples 4 and 5, it can be seen that the mechanical strength of the alumina blank is best when the mass ratio of the epoxy-modified polyacrylate emulsion to the polyamine compound is 1:0.03;

[0064] By comparing the data of Example 1 with that of Comparative Example 1, it can be seen that the addition of polyamine compounds plays a positive role in improving the mechanical strength of the alumina blank.

[0065] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A water-based adhesive, characterized in that Including epoxy modified polyacrylate emulsion and polyamine compounds; The mass ratio of the epoxy modified polyacrylate emulsion to the polyamine compound is 1:0.01-0.05; The structure of the polyamine compound is shown in Formula 1: ; R1, R2, and R3 are each independently hydrogen, amino, or a structure shown in Formula 2: ; At least one of R1, R2, and R3 is a structural formula shown in Formula 2, and at most one of R1, R2, and R3 is hydrogen.

2. The water-based adhesive according to claim 1, wherein The preparation method of the epoxy-modified polyacrylate emulsion is as follows: Add emulsifier and part of free radical initiator into water, stir and heat to 60-80°C, add acrylate monomer and remaining free radical initiator, keep warm and react for 5-10 hours, then return to room temperature.

3. The water-based adhesive according to claim 2, wherein The acrylic acid ester monomers include acrylic acid, methyl methacrylate and glycidyl methacrylate.

4. The water-based adhesive according to claim 3, wherein The mass ratio of acrylic acid, methyl methacrylate and glycidyl methacrylate is 5-10:0.5-1:1-5.

5. The water-based adhesive according to claim 2, wherein The free radical initiator is any one or more combinations of potassium persulfate, benzoyl peroxide, lauroyl peroxide, di-tert-butyl peroxide, dicumyl peroxide, azobisisobutyronitrile, azobisisoheptanenitrile, and azobiscyanovaleric acid.

6. The water-based adhesive according to claim 1, wherein At least two of R1, R2, and R3 have the structural formula shown in Formula 2.

7. The water-based adhesive according to claim 1, wherein The polyamine compound is any one of the following compounds: .

8. Use of the aqueous adhesive according to any one of claims 1 to 7 in electronic ceramic molding.

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