Sound cavity structure, manufacturing method thereof and electronic equipment

By using screen components and middle frame components in electronic devices to surround the equivalent sound cavity of open speakers, and combine sealing dust parts to achieve sealing, solving the problem of poorly sealing effect of open speakers, realizing the thinness of electronic equipment And efficient waterproof.

CN119383530APending Publication Date: 2025-01-28HONOR DEVICE CO LTD
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Patent Information

Application Number
CN202310939812.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-07-27
Publication Date
2025-01-28

AI Technical Summary

Technical Problem

Electronic devices using speakers with open cavity have poor sealing effect, resulting in abnormal audio performance and risk of waterproof failure.

Method used

By using the screen component and the middle frame component to form an equivalent acoustic cavity of an open speaker, combine the sealing dust parts to achieve the seal between the speakers and the middle frame to ensure the effective waterproof of the electronic equipment.

Benefits of technology

The lightness of electronic equipment is realized, while the audio performance of the speaker is guaranteed, and the IPX8 level is achieved by effective sealing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses an acoustic cavity structure, a manufacturing method thereof and electronic equipment. The sound cavity structure comprises a middle frame assembly, a screen assembly and a loudspeaker, the middle frame assembly comprises a middle frame and a sealing dustproof piece, the middle frame comprises a first through hole, and the sealing dustproof piece comprises a second through hole. The sealing dustproof piece is attached to the second surface of the middle frame and covers the first through hole, and the first through hole is communicated with the second through hole. The screen assembly is attached to the first surface of the middle frame, and the loudspeaker is attached to the sealing dustproof piece. The loudspeaker comprises an open cavity facing the first through hole, and the open cavity, the second through hole, the first through hole and the screen assembly define an equivalent sound cavity of the loudspeaker. By adopting the loudspeaker with the open cavity, the thickness of the acoustic cavity structure can be reduced. In this way, the electronic equipment can be lightened and thinned, and meanwhile the equivalent sound cavity can be used for providing a working cavity with the same or higher size for the loudspeaker. The sound cavity structure can be effectively sealed, so that the electronic equipment can be effectively waterproof, and the audio performance of the loudspeaker can be ensured.
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Description

Technical Field

[0001] The present application relates to the technical field of terminal equipment, and in particular to a sound cavity structure and a manufacturing method thereof, and an electronic device. Background Art

[0002] A speaker is provided in an electronic device to enable the electronic device to have a sound playback function. The speaker includes a housing and a speaker core contained in the housing. The speaker core and the housing form a front cavity and a rear cavity, and the front cavity is connected to the sound outlet. The speaker is usually provided on the middle frame of the electronic device. To achieve a good sound playback function, the front cavity needs to be sealed, and a sealing rubber ring is used to press against the middle frame at the sound outlet to achieve a plane seal. In this way, it can be prevented that external liquid enters the electronic device through the sound outlet and affects the circuit board on the middle frame.

[0003] As electronic devices become thinner and lighter, speakers also need to be gradually thinner. However, the thinning of speakers reduces the volume of the front and rear cavities, which reduces the audio performance of the speakers. In order to achieve the thinness requirement and ensure audio performance, speakers with open cavities (hereinafter referred to as open speakers) can be used. The open cavity can be formed in the front cavity or in the rear cavity.

[0004] However, taking the case where the open cavity is formed in the front cavity as an example, the sound outlet of the open speaker is connected to the open cavity, so it is no longer possible to seal by pressing the sealing rubber ring against the middle frame. It can be seen that the traditional sealing method cannot meet the sealing requirements of electronic devices including open speakers, and poor sealing of open speakers will lead to abnormal audio performance and the risk of waterproof failure. Summary of the invention

[0005] The present application provides a sound cavity structure and a manufacturing method thereof, and an electronic device, so as to solve the problem of poor sealing effect of electronic devices using speakers with an open cavity.

[0006] In the first aspect, the present application provides a sound cavity structure, including: a middle frame assembly, including a middle frame and a sealing dustproof part; the middle frame includes a first surface, a second surface, and a first through hole connecting the first surface and the second surface; wherein the first surface and the second surface are opposite surfaces; the sealing dustproof part is attached to the second surface and covers the first through hole, the sealing dustproof part includes a second through hole, and the second through hole is connected to the first through hole; a screen assembly and a speaker, the screen assembly is attached to the first surface, and the speaker is attached to the sealing dustproof part; the speaker includes an open cavity facing the first through hole, and the open cavity, the second through hole, the first through hole and the screen assembly form an equivalent sound cavity of the speaker.

[0007] The acoustic cavity structure provided in the embodiment of the present application uses a speaker with an open cavity, which can reduce the thickness of the speaker, so that the thickness of the acoustic cavity structure is reduced, and then the electronic device can be made thinner and lighter. At the same time, the screen assembly is bonded to the middle frame assembly to form a front shell assembly to achieve sealing between the middle frame and the screen assembly; then the speaker with an open cavity is bonded to the middle frame assembly, and the sealing between the speaker and the middle frame is achieved by a sealing dustproof part. It can be seen that the acoustic cavity structure uses the screen assembly and the middle frame assembly to form an equivalent acoustic cavity of an open speaker, which can provide the speaker with a working cavity of equal or higher volume while achieving the thinness of the electronic device. In this way, not only can effective sealing be performed, so that the electronic device can be effectively waterproofed, but the audio performance of the speaker can also be guaranteed.

[0008] In some implementations, the middle frame includes a middle plate and a frame surrounding the edge of the middle plate, the first through hole is provided on the middle plate; the side of the frame facing the first through hole includes a sound-conducting side wall, the sound-conducting side wall is connected to the middle plate at a first angle; the middle frame also includes a plurality of sound-conducting holes penetrating the frame and the sound-conducting side wall, the sound-conducting holes are connected to the equivalent sound cavity. In this way, the sound-conducting holes and the equivalent sound cavity can form a sound outlet channel to improve the audio performance of the speaker.

[0009] In some implementations, the sealing dustproof member includes a base sheet and a dustproof sheet, the base sheet and the dustproof sheet are connected at a second angle; wherein the second angle is equal to the first angle; the base sheet is attached to the middle plate, and the dustproof sheet is attached to the sound-conducting side wall; and the center of the base sheet includes a second through hole. In this way, it can be adapted to the housing structure of the speaker, so that the speaker and the sealing dustproof member can be seamlessly attached, thereby improving the sealing effect.

[0010] In some implementations, the sealed dustproof member includes a stacked substrate, a dustproof net, and a first adhesive layer; the area of ​​the substrate used to form the base sheet includes a first hollow hole, and the area of ​​the substrate used to form the dustproof sheet includes a second hollow hole; the area of ​​the dustproof net used to form the base sheet includes a third hollow hole; the area of ​​the first adhesive layer used to form the base sheet includes a fourth hollow hole, and the area of ​​the first adhesive layer used to form the dustproof sheet includes a fifth hollow hole; the first hollow hole, the third hollow hole, and the fourth hollow hole are connected to form a second through hole; the second hollow hole and the fifth hollow hole are connected to expose the area of ​​the dustproof net used to form the dustproof sheet. In this way, the sealed dustproof member can not only form an equivalent sound cavity in the subsequent process, but also have a dustproof effect.

[0011] In some implementations, the speaker includes a core and a shell with two adjacent sides forming an opening; the core is located in the shell and has a first distance L1 from the edge of the opening end of the shell to enclose an open cavity. In this way, part of the shell used to form the open cavity can be eliminated to reduce the thickness of the speaker.

[0012] In some implementations, the edge of the opening end of the housing includes an annular wire groove; the surface of the substrate includes a first sealing rib, and the first sealing rib is continuously formed in the area adjacent to the edge of the base sheet and the dustproof sheet; the first sealing rib is used to embed in the annular wire groove to abut against the edge of the opening end of the housing. In this way, the speaker and the sealing dustproof member can be sealed, and the sealing effect can be improved.

[0013] In some implementations, the second adhesive layer is further included; the second adhesive layer continuously covers the edges of the first surface and the edge of the first through hole; the second adhesive layer is used to achieve the bonding of the screen assembly and the first surface, and is used to seal the end of the first through hole facing the first surface. In this way, the bonding force between the screen assembly and the middle frame can be improved, and a good sealing effect can be obtained.

[0014] In some implementations, the sealing dustproof member further includes: a third adhesive layer; the third adhesive layer is located between the substrate and the dustproof net; the area of ​​the third adhesive layer used to form the base sheet includes a sixth hollow hole, and the area of ​​the third adhesive layer used to form the dustproof sheet includes a seventh hollow hole; the sixth hollow hole is used to form the second through hole, and the seventh hollow hole is used to expose the area of ​​the dustproof net used to form the dustproof sheet. In this way, the substrate and the dustproof net are combined through the third adhesive layer, which can reduce costs.

[0015] In some implementations, the speaker further includes a second sealing rib, which is continuously formed at the edge of the opening end of the housing; the second sealing rib is used to abut against the substrate. In this way, the speaker and the sealing dustproof member can be sealed, thereby improving the sealing effect.

[0016] In some implementations, the sealing dustproof member further includes a bracket; the bracket is located in the second through hole and is used to support the sealing dustproof member; the bracket is used to be cut off after the sealing dustproof member is attached to the second surface. In this way, the bracket can be used to provide hardness for the sealing dustproof member, making it easier to install the sealing dustproof member on the middle frame.

[0017] In the second aspect, the present application provides a method for manufacturing an acoustic cavity structure, which is used to manufacture the acoustic cavity structure provided in the first aspect, and the method includes: providing a middle frame assembly, a screen assembly and a speaker, the middle frame assembly including a middle frame and a sealing dustproof part, the middle frame including a first surface, a second surface, and a first through hole connecting the first surface and the second surface; wherein the first surface and the second surface are opposing surfaces; affixing the sealing dustproof part to the second surface and covering the first through hole, the sealing dustproof part including a second through hole, and the second through hole being connected to the first through hole; affixing the screen assembly to the first surface of the middle frame; affixing the speaker to the sealing dustproof part; the speaker includes an open cavity facing the first through hole, and the open cavity, the second through hole, the first through hole and the screen assembly form an equivalent acoustic cavity of the speaker.

[0018] In the method for manufacturing the acoustic cavity structure provided in the embodiment of the present application, the screen assembly is bonded to the middle frame assembly to form a front shell assembly, thereby achieving sealing between the middle frame and the screen assembly; then the speaker with an open cavity is bonded to the middle frame assembly, and the sealing between the speaker and the middle frame is achieved by a sealed dustproof part. It can be seen that the acoustic cavity structure manufactured by this method can use the screen assembly and the middle frame assembly to form an equivalent acoustic cavity of an open speaker, and can provide a working cavity of equal or higher volume for the speaker while achieving lightweight electronic equipment. In this way, not only can effective sealing be performed, so that the electronic device can be effectively waterproof, but also the audio performance of the speaker can be guaranteed.

[0019] In some implementations, the method further includes: processing a sound-conducting side wall on the frame of the middle frame; wherein the sound-conducting side wall is connected to the middle plate of the middle frame at a first angle; and processing a plurality of sound-conducting holes penetrating the frame and the sound-conducting side wall in the stacked structure of the frame and the sound-conducting side wall, wherein the sound-conducting holes are connected to the equivalent sound cavity. In this way, the sound-conducting holes and the equivalent sound cavity can form a sound outlet channel to improve the audio performance of the speaker.

[0020] In some implementations, the sealing dustproof part is manufactured according to the following steps: providing a substrate, a dustproof net and a first adhesive layer; forming the substrate and the dustproof net into an integral body to obtain an assembly; applying an external force to a preset area of ​​the assembly to deform the assembly; attaching the first adhesive layer to the surface of the dustproof net away from the substrate to obtain the sealing dustproof part; wherein the sealing dustproof part includes a base sheet and a dustproof sheet, and the base sheet and the dustproof sheet form a second angle, which is equal to the first angle. In this way, it can be adapted to the housing structure of the speaker, so that the speaker and the sealing dustproof part can be seamlessly attached to improve the sealing effect.

[0021] In some implementations, attaching the sealing dustproof member to the second surface and covering the first through hole includes: attaching the base sheet of the sealing dustproof member to the middle plate using the first adhesive layer, and attaching the dustproof sheet of the sealing dustproof member to the sound-conducting side wall. In this way, the seamless attachment effect of the sealing dustproof member and the middle frame can be improved.

[0022] In some implementations, attaching the screen assembly to the first surface of the middle frame includes: applying a second adhesive layer on the edges of the first surface and the edges of the first through hole; and attaching the screen assembly to the first surface of the middle frame using the second adhesive layer. In this way, the bonding strength between the screen assembly and the middle frame can be improved, and a good sealing effect can be obtained.

[0023] In some implementations, attaching the speaker to the sealing dustproof member includes: processing an annular wire groove on the edge of the open end of the speaker housing, and injecting a first sealing rib on the surface of the substrate, wherein the first sealing rib is continuously formed in the area adjacent to the edge of the base sheet and the dustproof sheet; snapping the speaker onto the sealing dustproof member and fixing it on the second surface of the middle frame, and embedding the first sealing rib into the annular wire groove to abut the edge of the open end of the speaker housing against the first sealing rib. In this way, the speaker and the sealing dustproof member can be sealed, and the sealing effect can be improved.

[0024] In some implementations, the manufacturing of the sealing dustproof member further includes: attaching a third adhesive layer between the substrate and the dustproof net. In this way, the substrate and the dustproof net are combined through the third adhesive layer, which can reduce costs.

[0025] In some implementations, attaching the speaker to the sealing dustproof member includes: injecting a second sealing rib at the edge of the opening end of the speaker housing; snapping the speaker to the sealing dustproof member and fixing it to the second surface of the middle frame, and abutting the substrate against the second sealing rib. In this way, the speaker and the sealing dustproof member can be sealed, and the sealing effect can be improved.

[0026] In some implementations, manufacturing the sealing dustproof piece further includes: injecting a bracket in the second through hole, the bracket being used to support the sealing dustproof piece; and after the sealing dustproof piece is attached to the second surface and covers the first through hole, further includes: cutting off the bracket in the sealing dustproof piece. In this way, the bracket can be used to provide hardness for the sealing dustproof piece, making it easier to install the sealing dustproof piece on the middle frame.

[0027] In a third aspect, the present application provides an electronic device, comprising the acoustic cavity structure provided in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0029] Figure 1 is a schematic diagram of the structure of an electronic device 100;

[0030] Figure 2 yes Figure 1 Partial schematic diagram of the AA section;

[0031] Figure 3 is a schematic diagram of the structure of a speaker assembly 40;

[0032] Figure 4 is a first structural schematic diagram of a speaker 401 provided in an embodiment of the present application;

[0033] Figure 5 It is a first structural schematic diagram of the acoustic cavity structure 50 provided in an embodiment of the present application;

[0034] Figure 6 is a second structural schematic diagram of the acoustic cavity structure 50 provided in an embodiment of the present application;

[0035] Figure 7 is a third structural schematic diagram of the acoustic cavity structure 50 provided in an embodiment of the present application;

[0036] Figure 8 This is a first structural diagram of the middle frame 101 provided in an embodiment of the present application;

[0037] Fig. 9 is a second structural schematic diagram of the middle frame 101 provided in an embodiment of the present application;

[0038] Fig.10 is a schematic diagram of the structure of the middle frame assembly provided in an embodiment of the present application;

[0039] Fig.11 yes Figure 6 The first partial schematic diagram of the middle BB section;

[0040] Fig.12 yes Figure 8 Enlarged view of the middle C area;

[0041] Fig.13 is a side view of a speaker 401 provided in an embodiment of the present application;

[0042] Fig.14 1 is a schematic structural diagram of the sound-conducting side wall 105 and the middle plate 103 provided in an embodiment of the present application;

[0043] Fig.15 This is a first structural schematic diagram of the sealing dustproof member 201 provided in an embodiment of the present application;

[0044] Fig.16 This is a first exploded structural diagram of the sealing dustproof component 201 provided in an embodiment of the present application;

[0045] Fig.17 This is a second exploded structural diagram of the sealing dustproof component 201 provided in the embodiment of the present application;

[0046] Fig.18 yes Figure 6 The second partial schematic diagram of the middle BB section;

[0047] Fig.19 yes Fig.11 Enlarged view of area D in the middle;

[0048] Fig. 20 is a third structural schematic diagram of the middle frame 101 provided in an embodiment of the present application;

[0049] Fig.21 is a second structural diagram of the speaker 401 provided in an embodiment of the present application;

[0050] Fig. 22 is a second structural schematic diagram of the sealing dustproof member 201 provided in an embodiment of the present application;

[0051] Fig.23 201 is a third structural schematic diagram of the sealing dustproof member 201 provided in the embodiment of the present application;

[0052] Fig.24 is a flow chart of a method for manufacturing a sound cavity structure provided in an embodiment of the present application;

[0053] Fig.25 It is a schematic diagram of the process flow of manufacturing a sealing dustproof part provided in an embodiment of the present application;

[0054] Fig.26 It is a schematic diagram of the process flow of manufacturing a middle frame assembly provided in an embodiment of the present application;

[0055] Fig. 27 This is a first process flow diagram of manufacturing the acoustic cavity structure 50 provided in an embodiment of the present application;

[0056] Fig.28 It is a second process flow diagram for manufacturing the acoustic cavity structure 50 provided in an embodiment of the present application. DETAILED DESCRIPTION

[0057] The technical solutions in the embodiments of the present application will be described clearly below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments of the present application, other embodiments obtained by ordinary technicians in this field without making creative work all belong to the protection scope of the present application.

[0058] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0059] In addition, in the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to the changes in the orientation of the components in the drawings.

[0060] The electronic device described in the embodiments of the present application includes but is not limited to a mobile phone, a folding screen mobile phone, a notebook computer, a tablet computer, a laptop computer, a personal digital assistant or a wearable device, etc. The following description is made by taking the electronic device as a mobile phone.

[0061] Figure 1 The diagram is a schematic diagram of the structure of an electronic device 100 . Figure 2 yes Figure 1 Partial schematic diagram of the AA section.

[0062] like Figure 1 and Figure 2 As shown, the electronic device 100 may include a screen 10, a body 20 and a rear shell 30, which are buckled together in sequence. A speaker assembly 40 is arranged on the body 20 so that the electronic device has a sound playing function.

[0063] The speaker assembly 40 is a component that converts an electrical signal into a sound signal for playback. The speaker assembly 40 may be composed of a diaphragm, a voice coil, a permanent magnet, a bracket, and the like.

[0064] The working principle of the speaker assembly 40 may include: the electronic device 100 sends an electrical signal, such as an audio signal, to the voice coil of the speaker assembly 40. When the voice coil of the speaker assembly 40 is fed with an electrical signal, the voice coil generates an alternating magnetic field under the action of the electrical signal, and the permanent magnet also generates a constant magnetic field with constant magnitude and direction. Since the magnitude and direction of the magnetic field generated by the voice coil are constantly changing with the change of the electrical signal, the interaction of the two magnetic fields causes the voice coil to move in a direction perpendicular to the transmission direction of the electrical signal in the voice coil. Since the voice coil is connected to the diaphragm, the diaphragm is driven to vibrate, and the vibration of the diaphragm causes the vibration of the air to produce sound.

[0065] It should be noted that the electronic device 100 may also include components such as circuit boards, batteries, and camera components, which are not listed here one by one.

[0066] To facilitate the explanation of the positions of various components in the electronic device 100, the embodiment of the present application exemplarily establishes a three-dimensional coordinate system based on the electronic device 100, wherein the x-axis direction is the width direction of the electronic device 100, the y-axis direction is the length direction of the electronic device 100, and the z-axis direction is the thickness direction of the electronic device 100.

[0067] Figure 3It is a schematic diagram of the structure of a speaker assembly 40.

[0068] Combination Figure 2 and Figure 3 As shown, the speaker assembly 40 adopts a closed structure. The speaker assembly 40 includes a housing 41 and a speaker core 42 accommodated in the housing 41. The speaker core 42 is a core component for generating external sound, and the speaker core 42 includes a diaphragm for vibrating and generating sound; the housing 41 is used to provide a sound cavity for the speaker core 42 to achieve corresponding acoustic performance.

[0069] The speaker core 42 and the shell 41 form a front cavity 43 and a rear cavity 44, the front cavity 43 faces the screen 10, and the rear cavity 44 faces the rear shell 30. The rear cavity 44 is a closed cavity to prevent sound leakage. The area of ​​the shell 41 corresponding to the front cavity 43 is provided with a sound outlet 45, and the sound outlet 45 is connected to the front cavity 43, but not to the rear cavity 44. Correspondingly, a sound outlet hole 21 is provided on the body 20, and the sound outlet hole 21 is connected to the sound outlet 45 to form a sound outlet channel. In this way, when the speaker core 42 is working, it can promote the air in the front cavity 43 to vibrate, and the vibrating air in the front cavity 43 is discharged from the sound outlet channel to form sound.

[0070] In order to achieve a good sound playback function, the front cavity 43 needs to be sealed, and the sealing rubber ring 46 is used to press the body 20 at the sound outlet 45 to achieve a plane seal. In this way, it can prevent external liquid from entering the electronic device through the sound outlet 21 and the sound outlet 45 in sequence, and affecting the circuit board on the body 20.

[0071] Due to the presence of the front cavity 43 and the rear cavity 44, the speaker assembly 40 has a certain thickness h 40 In this way, the speaker assembly 40 will occupy the internal space of the electronic device, thereby increasing the thickness of the electronic device, making it difficult to achieve a thinner and lighter electronic device.

[0072] In order to achieve thinner and lighter electronic devices, the speaker assembly 40 can be thinned. The thinning of the speaker assembly 40 reduces the volume of the front cavity and the rear cavity, thereby reducing the audio performance of the speaker assembly 40. In addition, the width W of the sound outlet 45 of the closed speaker assembly 40 is 45 It is too small, resulting in a smaller sound channel width, which will also affect the audio performance of the speaker.

[0073] Figure 4 This is the first structural diagram of the speaker 401 provided in the embodiment of the present application.

[0074] like Figure 4As shown, in some embodiments, in order to meet the requirements of electronic devices to be thin and light and to improve audio performance, an embodiment of the present application provides a speaker 401. The speaker 401 may include a core 403 and a shell 404 with two adjacent sides forming openings. The core 403 is a core component for forming external sound, and the core 403 includes a diaphragm for vibrating and sounding; the shell 404 is used to provide a sound cavity for the core 403 to achieve corresponding acoustic performance.

[0075] The core 403 is located in the shell 404, and the upper surface of the core 403 is at a first distance L1 from the edge of the opening end of the shell 404, so that the shell 404 and the core 403 form an open cavity 402 ( Figure 4 The lower surface of the core 403 and the shell 404 form a closed cavity (not shown in the figure). It should be noted that the "upper" and "lower" mentioned here are only based on Figure 4 For the status shown.

[0076] The speaker 401 may be a speaker with an open cavity 402 (hereinafter referred to as an open speaker), and the open cavity 402 may be formed in the front cavity or in the rear cavity. For example, if the open cavity 402 may be formed in the front cavity, the closed cavity enclosed by the lower surface of the core 403 and the shell 404 is the rear cavity.

[0077] However, taking the example of the open cavity 402 being formed in the front cavity, in this way, Figure 3 , the sound outlet of the open speaker will be connected to the open cavity 402, making it impossible to use the commonly used sealing method of pressing the rubber ring against the body 20 for sealing. It can be seen that the commonly used sealing method cannot meet the sealing requirements of electronic devices including open speakers, and poor sealing of electronic devices will cause abnormal audio performance of the open speaker and the risk of waterproof failure of the electronic device. Among them, the risk of waterproof failure includes air and liquid leakage from the contact surface between the speaker housing and the middle frame to the mainboard compartment, air and liquid leakage from the inclined surface of the speaker sound outlet hole to the mainboard compartment, or air and liquid leakage from the speaker sound outlet hole.

[0078] In order to solve the above problems, the embodiment of the present application provides a sound cavity structure 50 and a manufacturing method thereof, which utilizes the screen assembly and the middle frame assembly of the electronic device 100 to form an equivalent sound cavity of an open speaker, thereby reducing the thickness of the speaker 401 to achieve the lightweight and thin electronic device; and, the connection area between the screen assembly, the middle frame assembly and the speaker 401 is effectively sealed to achieve IPX8 level waterproof sealing, so that the electronic device can be effectively waterproof; and the width of the sound output channel can also be increased based on the effective sealing effect to improve the audio performance of the speaker 401.

[0079] Figure 5This is the first structural schematic diagram of the acoustic cavity structure 50 provided in an embodiment of the present application. Figure 6 This is a second structural schematic diagram of the acoustic cavity structure 50 provided in an embodiment of the present application. Figure 7 is a third structural diagram of the acoustic cavity structure 50 provided in the embodiment of the present application. Figure 5 and Figure 6 The schematic diagram of the structure of the acoustic cavity structure 50 at different viewing angles can be shown. Figure 7 Relative to Figure 6 The structure of the speaker 401 is not shown.

[0080] like Figure 5 , Figure 6 and Figure 7 As shown, in some embodiments, the sound cavity structure 50 may include: a middle frame assembly, a screen assembly 301 and a speaker 401. Among them, the middle frame assembly may include a middle frame 101 and a sealing dustproof member 201. The middle frame 101 is a relatively large structural member that carries components such as circuit boards and batteries, and is used to form the body of the sound cavity structure 50; the sealing dustproof member 201 and the speaker 401 are both installed on the middle frame 101, and are both located on the side of the middle frame 101 opposite to the screen assembly 301. The sealing dustproof member 201 is used to seal and dustproof the speaker 401.

[0081] Figure 8 This is a first structural diagram of the middle frame 101 provided in an embodiment of the present application. Fig. 9 1 is a second structural diagram of the middle frame 101 provided in the embodiment of the present application. Figure 8 and Fig. 9 The structural schematic diagrams of the middle frame 101 at different viewing angles may be shown.

[0082] like Figure 8 and Fig. 9 As shown, in some embodiments, in order to facilitate the description of the internal structure layout of the sound cavity structure 50, the middle frame 101 is defined to include a first surface 101a and a second surface 101b. The first surface 101a is the surface of the middle frame 101 facing the screen assembly 301; the second surface 101b is the surface of the middle frame 101 away from the screen assembly 301. In other words, the first surface 101a and the second surface 101b are opposite surfaces.

[0083] It should be noted that the second surface 101 b of the middle frame 101 may also be provided with a circuit board compartment and a battery compartment, etc., which are not listed here one by one.

[0084] The middle frame 101 may include a first through hole 102 connecting the first surface 101a and the second surface 101b. The area where the first through hole 102 is located is used to install the sealing dustproof member 201 and the speaker 401 so as to subsequently form an equivalent sound cavity of the speaker 401.

[0085] The structural shape of the first through hole 102 can be adapted to the structural shape of the speaker 401. For example, if the speaker 401 is a square structure, the first through hole 102 is a square structure; if the speaker 401 is a rectangular structure, the first through hole 102 is a rectangular structure.

[0086] Fig.10 It is a schematic diagram of the structure of the middle frame assembly provided in an embodiment of the present application.

[0087] Combination Figure 8 and Fig.10 As shown, in some embodiments, the sealing dustproof member 201 is attached to the second surface 101b of the middle frame 101 and covers the first through hole 102. The sealing dustproof member 201 may include a second through hole 202, and the second through hole 202 is connected to the first through hole 102. Exemplarily, the second through hole 202 has the same structure and size as the first through hole 102 to avoid affecting the volume of the equivalent sound cavity formed subsequently.

[0088] Fig.11 yes Figure 6 First partial schematic diagram of the BB section.

[0089] like Fig.11 As shown, in some embodiments, the screen assembly 301 is attached to the first surface 101a to seal the end of the first through hole 102 facing the first surface 101a. The speaker 401 is attached to the sealing dustproof member 201 to seal the end of the first through hole 102 facing the second surface 101b.

[0090] Recombination Figure 4 , the speaker 401 includes an open cavity 402 facing the first through hole 102. In this way, the open cavity 402, the second through hole 202, the first through hole 102 and the screen assembly 301 can enclose an equivalent acoustic cavity of the speaker 401. Exemplarily, when the open cavity 402 is formed by a front cavity, the equivalent acoustic cavity serves as the front cavity of the speaker 401.

[0091] The acoustic cavity structure 50 provided in the embodiment of the present application adopts a loudspeaker 401 having an open cavity 402, and the wall thickness of the shell 404 originally used to form the front cavity can be eliminated to reduce the z-direction thickness h of the loudspeaker 401. 401 , so that the thickness of the acoustic cavity structure 50 is reduced, thereby achieving a thinner and lighter electronic device. 401It can be reduced by 0.8mm, and the reduced thickness includes the wall thickness of the shell 404 and the distance to avoid the screen assembly 301. At the same time, the screen assembly 301 is fitted with the middle frame assembly to form a front shell assembly to achieve sealing between the middle frame 101 and the screen assembly 301; then the speaker 401 with an open cavity is fitted with the middle frame assembly, and the sealing between the speaker 401 and the middle frame 101 is achieved through the sealing dustproof part 201. It can be seen that the sound cavity structure 50 uses the screen assembly 301 and the middle frame assembly to form an equivalent sound cavity of the open speaker 401, which can provide the speaker 401 with an equal or higher volume of working cavity while realizing the lightness and thinness of the electronic device 100. In this way, not only can effective sealing be performed to achieve IPX8 level waterproof sealing, so that the electronic device can be effectively waterproof, but also the audio performance of the speaker 401 can be guaranteed.

[0092] Fig.12 yes Figure 8 Magnified view of area C.

[0093] Combination Figure 8 , Fig.11 and Fig.12 As shown, in some embodiments, the middle frame 101 may include a middle plate 103 and a frame 104 surrounding four edges of the middle plate 103 , and the first through hole 102 is opened on the middle plate 103 .

[0094] A side of the frame 104 facing the first through hole 102 includes a sound-conducting side wall 105 . Exemplarily, the sound-conducting side wall 105 may be located at the top of the frame 104 .

[0095] The middle frame 101 may also include a plurality of sound guide holes 106 that penetrate the frame 104 and the sound guide side wall 105, and the sound guide holes 106 are connected to the equivalent sound cavity. Adaptively, a plurality of sound outlet holes 107 are provided on the top of the frame 104, and the number of the sound outlet holes 107 is the same as the number of the sound guide holes 106, and they correspond one to one.

[0096] The sound outlet hole 107 and the sound guide hole 106 are connected to the open cavity 402 of the speaker 401 to form a sound outlet channel. In this way, when the core 403 of the speaker 401 is working, the air in the equivalent sound cavity can be driven to vibrate, and the vibrating air in the equivalent sound cavity is sequentially guided out through the sound guide hole 106 and the sound outlet hole 107 to form sound.

[0097] Since the speaker 401 can be effectively sealed, the width W of the sound guide hole 106 can be increased. 106 , the width W of the sound guide hole 106 106 Greater than Figure 3 The width W of the sound outlet 45 of the closed speaker assembly 40 is shown as 45 In this way, the embodiment of the present application can increase the width of the sound output channel, thereby improving the audio performance of the speaker 401.

[0098] Fig.13 It is a side view of the speaker 401 provided in the embodiment of the present application.

[0099] like Fig.13 As shown, in some embodiments, the housing 404 of the speaker 401 may include a first opening edge 4041 and a second opening edge 4042, wherein the first opening edge 4041, the second opening edge 4042 and the core 403 are used to enclose an open cavity 402. A preset angle α0 is formed between the first opening edge 4041 and the second opening edge 4042. Exemplarily, the preset angle α0 is a stew angle.

[0100] Fig.14 It is a schematic diagram of the structure of the sound-conducting side wall 105 and the middle plate 103 provided in an embodiment of the present application.

[0101] Combination Fig.11 , Fig.13 and Fig.14 In some embodiments, in order to adapt the shape of the housing 404 so as to seamlessly install the speaker 401, the sound-conducting side wall 105 is connected to the middle plate 103 at a first angle α1, wherein the first angle α1 is equal to the preset angle α0.

[0102] Thus, the contact surface between the housing 404 of the speaker 401 and the sound-conducting sidewall 105 is an inclined surface. When the speaker 401 is installed on the middle frame 101, the sound-conducting sidewall 105 can be used to better support the speaker 401 and prevent the speaker 401 from sliding toward the middle plate 103.

[0103] Fig.15 This is the first structural schematic diagram of the sealing dustproof component 201 provided in the embodiment of the present application.

[0104] Combination Figure 8 and Fig.15 As shown, in some embodiments, the sealing dustproof member 201 may include a base sheet 2011 and a dustproof sheet 2012. To adapt to the structure of the housing 404 and ensure the sealing effect, the base sheet 2011 and the dustproof sheet 2012 are connected at a second angle α2; wherein the second angle α2 is equal to the preset angle α0 and also equal to the first angle α1.

[0105] Fig.16 This is a first exploded structural diagram of the sealing dustproof component 201 provided in an embodiment of the present application.

[0106] Combination Fig.15 and Fig.16As shown, in some embodiments, the sealing dustproof member 201 may include a substrate 203, a dustproof net 204, and a first adhesive layer 205 stacked in sequence. The substrate 203 serves as the skeleton of the sealing dustproof member 201, the dustproof net 204 is used to prevent dust, and the first adhesive layer 205 is used to achieve the connection between the sealing dustproof member 201 and other structural members.

[0107] Exemplarily, the substrate 203 can be made of soft glue such as soft silicone or rubber, the dustproof net 204 can be made of wire mesh or woven mesh, and the first glue layer 205 can be made of glue with strong adhesion such as back glue, hot melt glue or ultraviolet (UV) glue.

[0108] The area of ​​the substrate 203 used to form the base sheet 2011 includes a first hollow hole 2031, and the area of ​​the substrate 203 used to form the dustproof sheet 2012 includes a second hollow hole 2032; the area of ​​the dustproof net 204 used to form the base sheet 2011 includes a third hollow hole 2041; the area of ​​the first adhesive layer 205 used to form the base sheet 2011 includes a fourth hollow hole 2051, and the area of ​​the first adhesive layer 205 used to form the dustproof sheet 2012 includes a fifth hollow hole 2052.

[0109] In this way, after the substrate 203, the dustproof net 204 and the first adhesive layer 205 are stacked together in sequence, the first hollow hole 2031, the third hollow hole 2041 and the fourth hollow hole 2051 correspond to and are connected to form the second through hole 202. The second hollow hole 2032 and the fifth hollow hole 2052 correspond to and are connected. Since the dustproof net 204 is located between the substrate 203 and the first adhesive layer 205, the second hollow hole 2032 and the fifth hollow hole 2052 can be used to expose the area of ​​the dustproof net 204 used to form the dustproof sheet 2012.

[0110] In some embodiments, the substrate 203 can be integrally formed with the dustproof net 204. In this way, the sealing dustproof part 201 adopts a double-layer structure, which can save the z-direction space occupied by the acoustic cavity structure 50, thereby reducing the z-direction thickness of the acoustic cavity structure 50 and further reducing the z-direction thickness of the electronic device.

[0111] Fig.17 This is a second exploded structural diagram of the sealing dustproof component 201 provided in an embodiment of the present application.

[0112] Combination Fig.15 and Fig.17 As shown, in some embodiments, the sealing dustproof member 201 may further include: a third adhesive layer 207, and the third adhesive layer 207 is located between the substrate 203 and the dustproof net 204. In this way, the sealing dustproof member 201 can be formed by stacking the substrate 203, the third adhesive layer 207, the dustproof net 204 and the first adhesive layer 205 in sequence.

[0113] The area of ​​the third adhesive layer 207 used to form the base sheet 2011 includes the sixth hollow hole 2071, and the area of ​​the third adhesive layer 207 used to form the dustproof sheet 2012 includes the seventh hollow hole 2072. In this way, the first hollow hole 2031, the sixth hollow hole 2071, the third hollow hole 2041 and the fourth hollow hole 2051 correspond to and are connected to form the second through hole 202. The second hollow hole 2032, the seventh hollow hole 2072 and the fifth hollow hole 2052 correspond to and are connected to expose the area of ​​the dustproof net 204 used to form the dustproof sheet 2012, so as to achieve the dustproof effect of the dustproof net 204.

[0114] In some embodiments, in order to save the z-direction space occupied by the acoustic cavity structure 50, in the sealed dustproof member 201, the dustproof net 204 may not be provided in the area of ​​the base sheet 2011, and the dustproof net 204 may be provided only in the area of ​​the dustproof sheet 2012. In this way, by reducing the thickness of the dustproof net 204 in the z-direction space, the z-direction thickness of the acoustic cavity structure 50 can be reduced, and the z-direction thickness of the electronic device can be further reduced.

[0115] Fig.18 yes Figure 6 The second partial schematic diagram of the BB section. Fig.18 Only the structure of the middle frame 101 and the sealing dustproof part 201 is shown.

[0116] like Fig.18 As shown, in some embodiments, when the sealing dustproof member 201 is installed on the middle frame 101, the base sheet 2011 is fitted with the middle plate 103, and the dustproof sheet 2012 is fitted with the sound-conducting side wall 105. The center of the base sheet 2011 includes a second through hole 202. Exemplarily, the edge of the base sheet 2011 used to form the second through hole 202 can be flush with the edge of the middle plate 103 used to form the first through hole 102, so as to facilitate the subsequent formation of an equivalent sound cavity of a preset volume. Among them, the equivalent sound cavity of the preset volume can meet the sound conditions of the speaker 401 and ensure the audio performance.

[0117] Recombination Fig.11 When installing the speaker 401, the first opening edge 4041 of the shell 404 is fitted with the base sheet 2011, and the second opening edge 4042 of the shell 404 is fitted with the dustproof sheet 2012. In this way, the speaker 401 is sealed and fitted with the middle frame 101 through the sealed dustproof piece 201, and forms an equivalent sound cavity with the screen assembly 301. The dustproof sheet 2012 is connected to the equivalent sound cavity through the dustproof net 204, so that the sound generated by the core 403 of the speaker 401 when working can be guided out by the sound guide hole 106 and the sound outlet hole 107 in turn. At the same time, the dustproof net 204 is used to prevent external dust from entering the sound cavity structure 50.

[0118] See again Figure 4and Fig.15 The edge of the open end of the shell 404 of the speaker 401 includes an annular wire groove 405, and the annular wire groove 405 is continuously formed on the edge of the shell 404 for forming the open cavity 402.

[0119] The surface of the substrate 203 includes a first sealing rib 206, which is continuously formed in the area near the edge of the base sheet 2011 and the dustproof sheet 2012. The first sealing rib 206 is an annular structure, which can achieve an annular seal. The first sealing rib 206 can be made of a material with elasticity and deformability, such as rubber.

[0120] When the speaker 401 is attached to the sealing dustproof member 201, the speaker 401 can be first fixed to the middle frame 101 by screws to stably fix the speaker 401. At the same time, the first sealing rib 206 is embedded in the annular wire groove 405 to abut against the edge of the opening end of the shell 404. In this way, the sound guide hole 106 and the open cavity 402 can be effectively sealed with the middle frame 101, preventing external liquid from entering the open cavity 402 through the sound guide hole 106 and then leaking into the circuit board area.

[0121] Fig.19 yes Fig.11 Magnified view of area D in the middle.

[0122] like Fig.19 As shown, in some embodiments, the first sealing rib 206 and the shell 404 are interference fit, and the deformable characteristics of the first sealing rib 206 are utilized so that the first sealing rib 206 can be deformed according to the structure of the annular wire groove 405 to be tightly combined with the annular wire groove 405 to improve the sealing effect.

[0123] The first sealing rib 206 protrudes from the corresponding contact surface relative to the annular wire groove 405. Fig.18 In this way, when the speaker 401 is fitted with the sealing dustproof member 201, the first sealing rib 206 is embedded in the annular groove 405 and abuts against the shell 404. By utilizing the elasticity of the first sealing rib 206, the first sealing rib 206 is flattened by the shell 404 and generates elastic deformation to apply pressure to the shell 404, so as to improve the sealing effect of the contact surface between the speaker 401 and the sealing dustproof member 201.

[0124] Fig. 20 1 is a third structural diagram of the middle frame 101 provided in the embodiment of the present application. Fig. 20 The state shown is a schematic structural diagram of the first surface 101 a of the middle frame 101 .

[0125] Combination Fig.11 and Fig. 20As shown, in some embodiments, the acoustic cavity structure 50 may further include: a second adhesive layer 501. The second adhesive layer 501 continuously covers the edges of the first surface 101a and the edges of the first through hole 102. In this way, the second adhesive layer 501 can be used to perform annular sealing on the edge of the middle frame 101 and the opening position to improve the sealing effect.

[0126] The screen assembly 301 is attached to the first surface 101a through the second adhesive layer 501, which can improve the bonding force between the screen assembly 301 and the middle frame 101; at the same time, the sealing effect of the screen assembly 301 on the end of the first through hole 102 facing the first surface 101a can also be improved. In this way, when it is subsequently combined with the speaker 401, an equivalent sound cavity with a good sealing effect can be obtained, thereby improving the audio performance.

[0127] Fig.21 This is a second structural diagram of the speaker 401 provided in an embodiment of the present application.

[0128] like Fig.21 As shown, in some embodiments, the speaker 401 may further include a second sealing rib 406, which is continuously formed at the edge of the opening end of the housing 404. The second sealing rib 406 is an annular structure and can achieve an annular seal. Exemplarily, the second sealing rib 406 can be formed by a glue drawing process.

[0129] In this speaker 401, the annular wire groove 405 ( Figure 4 As shown), the annular wire groove 405 may also be retained, and a second sealing rib 406 may be provided in the annular wire groove 405.

[0130] The second sealing rib 406 has the same material and characteristics as the first sealing rib 206 , and both can be elastically deformed by external force.

[0131] Fig. 22 This is a second structural schematic diagram of the sealing dustproof component 201 provided in an embodiment of the present application.

[0132] like Fig. 22 As shown, in some embodiments, to adapt Fig.21 In the structure of the speaker 401 shown, the first sealing rib 206 is removed from the surface of the substrate 203 of the sealing dustproof member 201 to form a flat surface. Alternatively, a second annular wire groove (not shown) may be provided on the surface of the substrate 203, and the structure of the second annular wire groove may be the same as that of the annular wire groove 405.

[0133] The material of the base plate 203 in the sealing dustproof member 201 can be a hard material, such as a glass fiber board, a steel sheet or a plastic bracket, etc. In this way, a certain hardness can be provided for the sealing dustproof member 201 to facilitate the pressure applied by the second sealing rib 406.

[0134] When the speaker 401 is attached to the sealing dustproof member 201, the speaker 401 can abut against the planar substrate 203 using the second sealing rib 406, or the second sealing rib 406 is embedded in the second annular groove on the substrate 203 to abut against the substrate 203. In this way, the sealing effect between the speaker 401 and the sealing dustproof member 201 can be improved.

[0135] It should be noted that the method and effect of the speaker 401 using the second sealing rib 406 to achieve sealing with the substrate 203 can be referred to Fig.19 The contents shown are not repeated here.

[0136] Fig.23 This is the third structural schematic diagram of the sealing dustproof component 201 provided in the embodiment of the present application.

[0137] like Fig.23 As shown, in some embodiments, due to Fig.15 The sealing dustproof member 201 shown is made of a soft rubber material as a skeleton, so that the sealing dustproof member 201 is relatively soft and is easily bent and deformed during installation. To increase the hardness of the sealing dustproof member 201 , the sealing dustproof member 201 may further include a bracket 208 .

[0138] The bracket 208 is located in the second through hole 202, and is used to support the sealing dustproof member 201. The bracket 208 can be made of polycarbonate (PC) plastic material or a material with a certain hardness.

[0139] Exemplarily, the bracket 208 may be connected to the substrate 203 , and after the substrate 203 is molded, the bracket 208 is injection molded in the second through hole 202 .

[0140] The bracket 208 can facilitate the process of installing the sealing dustproof member 201 on the middle frame 101, and is not an original structure of the sealing dustproof member 201. Therefore, the bracket 208 needs to be removed after the sealing dustproof member 201 is attached to the second surface 101b. The removal process can be laser removal or other methods.

[0141] for Fig. 22 The sealing dustproof member 201 shown in the figure has a certain hardness because its base plate 203 can be made of hard material. Fig. 22 In the sealing and dustproof part 201 shown, the base plate 203 thereof may not be provided with a bracket 208 for auxiliary support.

[0142] In some embodiments, in the acoustic cavity structure 50 shown in the above embodiments, the open cavity 402 of the speaker 401 is located in the front cavity, facing the screen assembly 301, and the seal is formed by the screen assembly 301. If the open cavity 402 is located in the rear cavity, that is, facing the rear shell of the electronic device 100, the seal can be formed by the rear shell of the electronic device 100. If the open cavity 402 faces the battery cover, the seal can be formed by the battery cover.

[0143] It should be noted that the solution of forming a seal using the rear shell or the battery cover can refer to the solution of forming a seal using the screen assembly 301, which will not be repeated here.

[0144] The acoustic cavity structure 50 provided in the embodiment of the present application adopts a speaker 401 with an open cavity 402, which can reduce the thickness of the speaker 401, thereby reducing the space occupied in the thickness direction of the acoustic cavity structure 50. The speaker 401 is fitted with the sealing dustproof part 201, which can improve the sealing effect to achieve IPX8 level waterproof sealing, and prevent water from entering the sound outlet hole 107 from leaking into the circuit board compartment. At the same time, the screen assembly 301 is sealed and fitted with the middle frame 101 through the second adhesive layer 501, and the equivalent acoustic cavity of the speaker 401 can be surrounded by the screen assembly 301, the first through hole 102, the second through hole 202 and the open cavity 402. In this way, when the thickness of the electronic device 100 is small, the volume of the equivalent acoustic cavity can meet the volume requirements required for the speaker 401 to make sound, so as to ensure the audio performance. In addition, due to the good sealing effect, the width of the sound outlet channel can be expanded while ensuring the sealing width at both ends of the sound guide hole 106, so as to further improve the audio performance of the speaker 401. It can be seen that the acoustic cavity structure 50 can realize the lightweight and thinning of electronic devices, improve the sealing effect for effective waterproofing, and enable the electronic devices to ensure audio performance.

[0145] Fig.24 It is a flow chart of the method for manufacturing the acoustic cavity structure provided in an embodiment of the present application.

[0146] like Fig.24 As shown, in some embodiments, the method for manufacturing the acoustic cavity structure is used to manufacture the acoustic cavity structure 50 provided in any of the above embodiments. The method may include the following steps S101 to S104:

[0147] Step S101, providing a middle frame assembly, a screen assembly and a speaker.

[0148] The middle frame assembly includes a middle frame 101 and a sealing dustproof part 201, the middle frame 101 includes a first surface 101a, a second surface 101b, and a first through hole 102 connecting the first surface 101a and the second surface 101b; wherein the first surface 101a and the second surface 101b are opposite surfaces.

[0149] Fig.25 It is a schematic diagram of the process flow for manufacturing a sealing dustproof part provided in an embodiment of the present application.

[0150] In some embodiments, the sealing dustproof part is manufactured according to the following steps 201 to 204:

[0151] Step 201, such as Fig.25 As shown in (a), a substrate 203 and a dustproof net 204 are provided. A first hollow hole 2031 and a second hollow hole 2032 are processed on the substrate 203; and a third hollow hole 2041 is processed on the dustproof net 204.

[0152] Step 202, such as Fig.25 As shown in (b), the substrate 203 and the dust screen 204 are integrally formed, and the first sealing rib 206 is injection-molded on the surface of the substrate 203 to obtain an assembly to save the stacking space in the z direction. In addition, an external force is applied to a preset area of ​​the assembly to deform the assembly.

[0153] The preset area may be an area between the first hollow hole 2031 and the second hollow hole 2032 , so that the deformed assembly includes a base sheet 2011 and a dustproof sheet 2012 , and a second angle α2 is formed between the base sheet 2011 and the dustproof sheet 2012 .

[0154] Step 203, such as Fig.25 As shown in (c), a bracket 208 is injection-molded in the second through hole 101 , and the bracket 208 can be fixed on the substrate 203 to support the sealing and dustproof component 201 .

[0155] It should be noted that the bracket 208 is an auxiliary structure and can be selected according to the actual assembly effect. Therefore, step 203 may not be performed.

[0156] Step 204, such as Fig.25 As shown in (d), a first adhesive layer 205 is attached to the surface of the dustproof net 204 away from the substrate 203 to obtain a sealed dustproof member 201.

[0157] In some embodiments, if the stacking space in the z direction is sufficient and the processing cost is high, the substrate 203 and the dustproof net 204 may not be formed in an integrated manner, but the substrate 203 and the dustproof net 204 may be formed by a third adhesive layer 207 (back adhesive or other adhesive methods) between them (such as Fig.17 shown).

[0158] Step S102 , attaching the sealing and dustproof member 201 to the second surface 101 and covering the first through hole 102 .

[0159] The sealing and dustproof component 201 includes a second through hole 202 , and the second through hole 202 is connected to the first through hole 102 .

[0160] Fig.26 It is a schematic diagram of the process flow of manufacturing the middle frame assembly provided in an embodiment of the present application.

[0161] Combination Fig.11 and Fig.26 As shown in (a), in some embodiments, a middle frame 101 and a sealing dustproof member 201 are provided. A sound-conducting side wall 105 is processed on the frame 104 of the middle frame 101; wherein the sound-conducting side wall 105 is connected to the middle plate 103 of the middle frame 101 at a first angle α1, wherein the first angle α1 is equal to the second angle α2; in the stacked structure of the frame 104 and the sound-conducting side wall 105, a plurality of sound-conducting holes 106 penetrating the frame 104 and the sound-conducting side wall 105 are processed.

[0162] Combination Fig.11 and Fig.26 As shown in (b), the sealing dustproof member 201 is attached to the second surface 101b of the middle frame 101 by using the first adhesive layer 205, and covers the first through hole 102. The base sheet 2011 is attached to the middle plate 103, the dustproof sheet 2012 is attached to the sound-conducting side wall 105, and the second through hole 202 is connected to the first through hole 102 and the edges are aligned.

[0163] like Fig.26 As shown in (c), the bracket 208 in the sealing dustproof part 201 is removed by laser cutting to obtain a middle frame assembly. Fig.26 (c) shows the structure of the first surface 101a and the structure of the second surface 101b of the middle frame assembly.

[0164] Step S103 , attaching the screen assembly 301 to the first surface 101 a of the middle frame 101 .

[0165] Fig. 27 It is a first process flow diagram for manufacturing the acoustic cavity structure 50 provided in an embodiment of the present application.

[0166] like Fig. 27 As shown in (a), in some embodiments, a second adhesive layer 501 is coated on the four edges of the first surface 101a and the edge of the first through hole 102; the screen assembly 301 is attached to the first surface 101a of the middle frame 101 by using the second adhesive layer 501 to obtain a front shell assembly.

[0167] In this way, on the first surface 101 a , an annular seal is completed at the opening position of the middle frame 101 using adhesive or other sealing glue, and is subsequently sealed with the screen assembly 301 .

[0168] Step S104 , attaching the speaker 401 to the sealing dustproof member 201 .

[0169] like Fig. 27 As shown in (b), in some embodiments, the speaker 401 includes an open cavity 402 facing the first through hole 102, and an annular wire groove 405 is processed on the edge of the open end of the housing 404 of the speaker 401.

[0170] Combination Fig.19 and Fig. 27 As shown in (c), in some embodiments, the speaker 401 is assembled with the front housing assembly. The speaker 401 is buckled onto the sealing dustproof member 201 and fixed to the second surface 101b of the middle frame 101, and the first sealing rib 206 is embedded into the annular wire groove 405, so that the edge of the opening end of the housing 404 of the speaker 401 is abutted against the first sealing rib 206 to achieve sealing.

[0171] In this way, the open cavity 402, the second through hole 202, the first through hole 102 and the screen assembly 301 form an equivalent sound cavity of the speaker 401. The sound guide hole 106 is connected to the equivalent sound cavity.

[0172] Fig.28 It is a second process flow diagram for manufacturing the acoustic cavity structure 50 provided in an embodiment of the present application.

[0173] like Fig.28 As shown in (a), in some embodiments, a second sealing rib 406 is injection molded at the edge of the open end of the housing 404 of the speaker 401. In this scenario, the surface of the substrate 203 of the sealing dustproof member 201 can be a plane, or can include a second annular wire groove.

[0174] like Fig.28 As shown in (b), in some embodiments, the speaker 401 is assembled with the front housing assembly. The speaker 401 is buckled on the sealing dustproof member 201 and fixed on the second surface 101b of the middle frame 101, and the substrate 203 is abutted against the second sealing rib 406 to achieve sealing.

[0175] In this way, an equivalent acoustic cavity of the speaker 401 is surrounded by the open cavity 402 , the second through hole 202 , the first through hole 102 and the screen assembly 301 .

[0176] In the manufacturing method of the acoustic cavity structure 50 provided in the embodiment of the present application, the screen assembly 301 is bonded to the middle frame assembly to form a front shell assembly, thereby achieving sealing between the middle frame 101 and the screen assembly 301; the speaker 401 with an open cavity is then bonded to the middle frame assembly, and the sealing between the speaker 401 and the middle frame 101 is achieved through the sealing dustproof part 201. It can be seen that the acoustic cavity structure 50 can form an equivalent acoustic cavity, providing a working cavity of the same volume for the speaker 401. In this way, not only can effective sealing be performed to achieve IPX8 level waterproof sealing, and enable the electronic device to be effectively waterproof, but also the audio performance of the speaker 401 can be guaranteed.

[0177] It should be noted that in the method for manufacturing the acoustic cavity structure provided in the embodiment of the present application, the description of the structural characteristics of the acoustic cavity structure 50 and the beneficial effects achieved is relatively brief. The corresponding content can refer to the content of the acoustic cavity structure embodiment, which will not be repeated here.

[0178] The embodiment of the present application also provides an electronic device, which includes a rear shell and a sound cavity structure 50 provided in any of the above embodiments. The rear shell is buckled on the second surface 101b of the middle frame 101 to form a closed cavity with the sound cavity structure 50. In this way, the sound cavity structure 50 has a small thickness and has a good sealing effect and audio performance, which can realize the lightness and thinness of the electronic device, enable the electronic device to be effectively waterproof, and also ensure the audio performance of the electronic device.

[0179] It should be noted that those skilled in the art will readily come up with other embodiments of the present application after considering the specification and practicing the application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope of the present application is indicated by the following claims.

[0180] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A sound cavity structure, characterized in that: include: A middle frame assembly, comprising a middle frame (101) and a sealing dustproof member (201); the middle frame (101) comprises a first surface (101a), a second surface (101b), and a first through hole (102) connecting the first surface (101a) and the second surface (101b); wherein the first surface (101a) and the second surface (101b) are opposite surfaces; the sealing dustproof member (201) is attached to the second surface (101b) and covers the first through hole (102); the sealing dustproof member (201) comprises a second through hole (202), and the second through hole (202) is connected to the first through hole (102); A screen assembly (301) and a speaker (401), wherein the screen assembly (301) is attached to the first surface (101a), and the speaker (401) is attached to the sealing dustproof component (201); the speaker (401) comprises an open cavity (402) facing the first through hole (102), and the open cavity (402), the second through hole (202), the first through hole (102) and the screen assembly (301) form an equivalent sound cavity of the speaker (401).

2. The acoustic cavity structure according to claim 1, characterized in that: The middle frame (101) comprises a middle plate (103) and a frame (104) surrounding the edge of the middle plate (103); the first through hole (102) is provided on the middle plate (103); A side of the frame (104) facing the first through hole (102) comprises a sound-conducting side wall (105), and the sound-conducting side wall (105) is connected to the middle plate (103) at a first angle; The middle frame (101) further comprises a plurality of sound guide holes (106) penetrating the frame (104) and the sound guide side wall (105), and the sound guide holes (106) are connected to the equivalent sound cavity.

3. The acoustic cavity structure according to claim 2, characterized in that: The sealing dustproof member (201) comprises a base plate (2011) and a dustproof plate (2012), wherein the base plate (2011) and the dustproof plate (2012) are connected at a second angle; wherein the second angle is equal to the first angle; The base sheet (2011) is bonded to the middle plate (103), and the dustproof sheet (2012) is bonded to the sound-conducting side wall (105); The center of the base plate (2011) includes the second through hole (202).

4. The acoustic cavity structure according to claim 3, characterized in that: The sealing dustproof component (201) comprises a substrate (203), a dustproof net (204) and a first adhesive layer (205) which are stacked in sequence; The area of ​​the substrate (203) used to form the base sheet (2011) includes a first hollow hole (2031), and the area of ​​the substrate (203) used to form the dustproof sheet (2012) includes a second hollow hole (2032); The area of ​​the dustproof net (204) used to form the base sheet (2011) comprises a third hollow hole (2041); The area of ​​the first adhesive layer (205) used to form the base sheet (2011) includes a fourth hollow hole (2051), and the area of ​​the first adhesive layer (205) used to form the dustproof sheet (2012) includes a fifth hollow hole (2052); The first hollow hole (2031), the third hollow hole (2041) and the fourth hollow hole (2051) are connected to form the second through hole (202); the second hollow hole (2032) and the fifth hollow hole (2052) are connected to expose the area of ​​the dustproof net (204) used to form the dustproof sheet (2012).

5. The acoustic cavity structure according to claim 4, characterized in that: The loudspeaker (401) comprises a core (403) and a shell (404) with two adjacent side surfaces forming openings; The inner core (403) is located inside the shell (404) and has a first distance L1 from the edge of the opening end of the shell (404) to enclose the open cavity (402).

6. The acoustic cavity structure according to claim 5, characterized in that: The edge of the opening end of the housing (404) comprises an annular wire groove (405); The surface of the substrate (203) comprises a first sealing rib (206), wherein the first sealing rib (206) is continuously formed in the area adjacent to the edges of the base sheet (2011) and the dustproof sheet (2012); The first sealing rib (206) is used to be embedded in the annular wire groove (405) so as to abut against the edge of the opening end of the shell (404).

7. The acoustic cavity structure according to claim 1, characterized in that: Also includes: a second adhesive layer (501); The second adhesive layer (501) continuously covers the edges around the first surface (101a) and the edge of the first through hole (102); The second adhesive layer (501) is used to achieve the bonding of the screen assembly (301) and the first surface (101a), and is used to seal the end of the first through hole (102) facing the first surface (101a).

8. The acoustic cavity structure according to claim 5, characterized in that: The sealing dustproof component (201) further includes: a third adhesive layer (207); The third adhesive layer (207) is located between the substrate (203) and the dustproof net (204); The area of ​​the third adhesive layer (207) used to form the base sheet (2011) includes a sixth hollow hole (2071), and the area of ​​the third adhesive layer (207) used to form the dustproof sheet (2012) includes a seventh hollow hole (2072); The sixth hollow hole (2071) is used to form the second through hole (202), and the seventh hollow hole (2072) is used to expose the area of ​​the dustproof net (204) used to form the dustproof sheet (2012).

9. The acoustic cavity structure according to claim 8, characterized in that: The loudspeaker (401) further comprises a second sealing rib (406), wherein the second sealing rib (406) is continuously formed at the edge of the opening end of the housing (404); The second sealing rib (406) is used for abutting against the substrate (203).

10. The acoustic cavity structure according to claim 1, characterized in that: The sealing dustproof component (201) further includes a bracket (208); The bracket (208) is located in the second through hole (202) and is used to support the sealing dustproof component (201); The support (208) is used to be cut off after the sealing and dustproof component (201) is attached to the second surface (101b).

11. A method for manufacturing a sound cavity structure, characterized in that: For making the acoustic cavity structure according to any one of claims 1 to 10, the method comprises: A middle frame assembly, a screen assembly and a speaker are provided, wherein the middle frame assembly comprises a middle frame and a sealing dustproof member, wherein the middle frame comprises a first surface, a second surface, and a first through hole connecting the first surface and the second surface; wherein the first surface and the second surface are opposite surfaces; The sealing and dustproof member is attached to the second surface and covers the first through hole, wherein the sealing and dustproof member includes a second through hole, and the second through hole is connected to the first through hole; Attaching the screen assembly to the first surface of the middle frame; The speaker is attached to the sealing dustproof part; the speaker includes an open cavity facing the first through hole, and the open cavity, the second through hole, the first through hole and the screen assembly form an equivalent sound cavity of the speaker.

12. The method according to claim 11, characterized in that Also includes: Processing a sound-conducting side wall on the frame of the middle frame; wherein the sound-conducting side wall is connected to the middle plate of the middle frame at a first angle; In the stacked structure of the frame and the sound-conducting side wall, a plurality of sound-conducting holes penetrating the frame and the sound-conducting side wall are processed, and the sound-conducting holes are communicated with the equivalent sound cavity.

13. The method according to claim 12, characterized in that Follow the steps below to make the sealing dustproof part: Provide substrate, dust screen and first adhesive layer; Integrally molding the substrate and the dustproof net to obtain an assembly; Applying external force to a preset area of ​​the assembly to cause the assembly to deform; The first adhesive layer is adhered to the surface of the dustproof net away from the substrate to obtain a sealed dustproof component; wherein the sealed dustproof component includes a base plate and a dustproof plate, and a second angle is formed between the base plate and the dustproof plate, and the second angle is equal to the first angle.

14. The method according to claim 13, characterized in that The step of attaching the sealing and dustproof member to the second surface and covering the first through hole comprises: The first adhesive layer is used to adhere the base plate of the sealing dustproof component to the middle plate, and the dustproof sheet of the sealing dustproof component is adhered to the sound-conducting side wall.

15. The method according to claim 11, characterized in that The step of attaching the screen assembly to the first surface of the middle frame includes: Applying a second adhesive layer on the edges of the first surface and the edges of the first through hole; The screen assembly is attached to the first surface of the middle frame by using the second adhesive layer.

16. The method according to claim 13, characterized in that The step of attaching the speaker to the sealing dustproof member comprises: Processing an annular wire groove at the edge of the open end of the speaker housing, and injection molding a first sealing rib on the surface of the substrate, wherein the first sealing rib is continuously formed in the area adjacent to the edge of the base sheet and the dustproof sheet; The speaker is buckled onto the sealing dustproof part and fixed to the second surface of the middle frame, and the first sealing rib is embedded into the annular wire groove to abut the opening end edge of the speaker housing against the first sealing rib.

17. The method according to claim 13, characterized in that The manufacturing of the sealing dustproof part also includes: A third adhesive layer is attached between the substrate and the dustproof net.

18. The method according to claim 13, characterized in that The step of attaching the speaker to the sealing dustproof member comprises: Injection molding a second sealing rib at the edge of the opening end of the speaker housing; The speaker is buckled onto the sealing and dustproof component and fixed to the second surface of the middle frame, and the substrate is abutted against the second sealing rib.

19. The method according to claim 13, characterized in that The manufacturing of the sealing dustproof part also includes: Injection-molding a bracket in the second through hole, the bracket being used to support the sealing and dustproof component; After the sealing and dustproofing member is attached to the second surface and covers the first through hole, the method further includes: The bracket in the sealing dustproof part is cut off.

20. An electronic device, characterized in that: It comprises the acoustic cavity structure as described in any one of claims 1-10.

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