Color electrophoretic display with micro-compartment structure

Abstract

A color electrophoretic display having a micro-compartment structure includes: a control substrate having a first surface and a second surface; the driving circuit layer, the control electrode layer and the electrophoresis layer are sequentially arranged on the second surface of the control substrate; the electrophoresis layer is provided with a micro-compartment structure, the micro-compartment structure is arranged above the control substrate and is made of a high polymer material, and the micro-compartment structure comprises a plurality of compartment walls to define a plurality of grooves filled with a colloidal solution; wherein the color filter layer is arranged at the bottom of the groove chamber, and the colloidal solution contains charged black color particles and / or charged white color particles.

Description

Technical Field

[0001] The present invention relates to a display, in particular to a color electrophoretic display with a micro-compartment structure. Background Art

[0002] Electronic paper displays, such as electrophoretic displays (EPDs), are thin, portable, and low energy, and can retain images even when the power is turned off. In addition to being used in readers, mobile phones, and wearable devices, electronic paper displays can also be used in shelf labels at hypermarkets and instant messaging billboards at bus stops, taking into account both energy conservation and sustainable development goals.

[0003] Figure 1A A cross-sectional view of a known electrophoretic display 100 is shown, and the electrophoretic display 100 is a black and white electrophoretic display 100. The electrophoretic display 100 includes, from top to bottom, a relative substrate 12 (for example, a transparent plastic substrate), a common electrode layer 14 (for example, a transparent conductive electrode layer), an electrophoretic layer 20, a control electrode layer PEL, a driving circuit layer 30a, and a control substrate 10 (for example, a glass substrate). Figure 1A In the illustrated structure, the viewing surface is close to the direction of the relative substrate 12. Figure 1A As shown, the electrophoretic layer 20 includes a plurality of hollow cavities 22 (only one of which is shown), and a colloidal solution 24 filled in each hollow cavity 22 contains a plurality of suspended charged color particles 26 (for example, charged black particles 26B and charged white particles 26W), and the hollow cavity 22 structure serves as a container for electronic ink (or electrophoretic material). The hollow cavity 22 is, for example, made of an organic polymer material and is used to fill the charged color particles 26. In addition, the charged color particles 26 can be a two-color combination (black / white), a three-color combination (black / red / white, black / yellow / white), a four-color combination (black / red / yellow / white, cyan / yellow / magenta / white), and the like. Figure 1A In the structure shown, the charged color particles 26 are, for example, a combination of two colors and include charged black particles 26B and charged white particles 26W.

[0004] The common electrode layer 14 is generally connected to the ground potential (0V) to provide a common voltage Vcom, and the control substrate 10 below is generally manufactured using the TFT Array process of the panel to manufacture the drive circuit layer 30a thereon. The drive switches of the drive circuit layer 30a mostly include thin film transistors manufactured using an amorphous silicon (a-Si) process (described in detail below). Amorphous silicon is a low-cost material with abundant supply, but the electron mobility of amorphous silicon is very low (approximately 1 cm 2 / V*s), and does not physically support high refresh rates. However, amorphous silicon has the characteristics of high voltage resistance and ultra-low leakage current, which are necessary conditions for electronic paper control. The charged color particles 26 carry a charge of a predetermined polarity, for example, the charged black particles 26B are positively charged and the charged white particles 26W are negatively charged. By controlling the electrical properties and voltage of each control electrode PE through the driving circuit layer 30a, the charged black particles 26B and the charged white particles 26W can be attracted to each pixel and repelled (so that the pixel appears white on the viewing surface opposite to the control electrode PE) or the charged white particles 26W and the charged black particles 26B can be attracted to each pixel and repelled (so that the pixel appears black on the viewing surface opposite to the control electrode PE).

[0005] Figure 1B FIG. 1 is a cross-sectional view of another conventional electrophoretic display 100, which is a color electrophoretic display 100. The structure of the color electrophoretic display 100 is similar to that of FIG. Figure 1A The structure of the black and white electrophoretic display 100 shown in the figure is that a color filter layer CF is bonded on the opposite substrate 12 by an optical adhesive 13 , and the color filter layer CF is disposed on an upper glass substrate 16 .

[0006] Electrophoretic displays with arrays of color filter layers rely on area sharing and color mixing to produce visual color. Available display area is shared between three or four primary colors such as red / green / blue (RGB) or red / green / blue / white (RGBW), and the filter layers can be arranged in a one-dimensional (striped) or two-dimensional (2x2) repeating pattern. Three subpixels (in the case of an RGB display) or four subpixels (in the case of an RGBW display) are small enough to be interpreted as higher resolution, and visually blend together into a single pixel of uniform color. The inherent disadvantage of area sharing is that the colorant is always present, and the color can only be modulated by switching the corresponding pixel of the underlying monochrome display to white or black (turning the corresponding primary color on or off). For example, in an ideal RGBW display, each of the red, green, blue, and white primary colors occupies one-quarter of the display area (one of the four subpixels), and the white subpixel is as bright as the underlying monochrome white, so the combined contribution of the three color subpixels is no more than that of one white subpixel.

[0007] Multicolor display can use charged color particles of different colors. Different colors can be presented by controlling the distances of these different charged color particles when they reach the viewing surface under different physical and electrical conditions such as the charge polarity (positive or negative), charge quantity, particle density, and particle volume. For example, three-color display (black, white, red; black, white, yellow) and four-color display (black, white, red, yellow). Similar to the operation of black and white electrophoretic displays, the operation of electrophoretic displays with three or four reflective colors is similar to that of simple black and white displays, but because the required color particles are driven to the viewing surface, the driving scheme is much more complicated than only black and white.

[0008] See also Figure 2A and 2B , to illustrate Figure 1A The operation diagram of the known black and white electrophoretic display 100 and the equivalent circuit diagram of the control electrode layer PEL / driving circuit layer 30a are shown in FIG. Figure 2A As shown, by controlling the electrical properties and voltage of each control electrode PE in the control electrode layer PEL by the driving circuit layer 30a, black and white pixels can be formed on the viewing surface (close to the opposite substrate 12). Figure 2A The control electrodes PE1 and PE3 shown as positive voltages will attract the negatively charged white particles 26W and push the positively charged black particles away from the electrode contact surface and move to the viewing surface, resulting in a relatively large number of positively charged black particles 26B on the viewing surface to provide black pixels on the viewing surface. Figure 2A The control electrode PE2 shown is at a negative voltage, which attracts the positively charged black particles 26B and pushes the negatively charged white particles away from the electrode contact surface and toward the viewing surface, resulting in a relatively large number of negatively charged white particles 26W on the viewing surface to provide white pixels on the viewing surface.

[0009] like Figure 2A As shown, and in conjunction with Figure 2B The common electrode layer 14 is usually electrically connected to the ground potential (0V, i.e., V com potential) and sandwiches the electrophoretic layer 20 with the control electrode layer PEL. The control electrode PE of the control electrode layer PEL and the V com potential form a capacitor (electrophoretic capacitor Cp). Since the thickness of the electrophoretic layer is relatively thick, the above-mentioned capacitor is very small. The charge on the control electrode quickly interacts with the charged particles to enter a state of equilibrium, and the distance that the charged particles move is very small. In order to increase the energy of each drive, a storage capacitor must be added in the drive circuit layer 30a. One end of the storage capacitor is connected to the control electrode, and the other end forms a parallel surface capacitor Cs on the conductor on the other side of the control electrode facing the electrophoretic layer. Figure 2BThe equivalent circuit of the electrophoretic layer 20 is represented as an electrophoretic capacitor Cp in parallel with a resistor R (the energy consumed by the movement of the equivalent charged color particles), and also includes the above-mentioned storage capacitor Cs. Figure 2B As shown, the driving circuit layer 30a includes a plurality of thin film transistors 32, and the gate metal Mg of each thin film transistor 32 is electrically connected to the gate line GL, the source metal Ms is electrically connected to the data line DL, and the drain metal Md is electrically connected to the corresponding control electrode (also called pixel electrode) PE. According to the potential applied by the gate line GL to the gate metal Mg, it can be determined whether the thin film transistor 32 is turned on (On) or off (Off); thereby determining whether the voltage from the source metal Ms is transmitted to the drain metal Md via the data line DL, and further transmitted to the corresponding control electrode PE and the storage capacitor Cs is charged to the same voltage as the data line. The control electrode PE will also apply the voltage on the corresponding data line to the electrophoretic layer 20. In principle, the driving circuit layer includes a plurality of thin film transistors, a plurality of gate lines and a plurality of data lines, each of which is electrically connected to the gate of the plurality of thin film transistors, each of which is electrically connected to the drain or source of the plurality of thin film transistors, and a plurality of control electrodes, each of which is connected to the source or drain of a thin film transistor.

[0010] The electrophoretic layer includes an electrophoretic material, which includes a plurality of charged color particles. The plurality of charged color particles are disposed in a colloidal solution and can move through the colloidal solution under the influence of an electric field. The plurality of charged color particles include positively charged color particles and / or negatively charged color particles. The charged color particles 26 are moved by the force of the electric field between the colloidal solution 24 of the electrophoretic layer 20 having appropriate viscosity, and the moving speed is very slow. The driving circuit layer 30a first quickly stores the energy in the storage capacitor Cs, and then the storage capacitor Cs slowly releases the energy to the electrophoretic layer 20 through the control electrode PE as the energy source for the movement of the charged color particles 26. The larger the capacitance value of the storage capacitor Cs, the more energy can be stored, the fewer times the energy storage needs to be repeated, and the faster the screen update speed of the electrophoretic display 100. Therefore, the electrophoretic display 100 will increase the area of ​​the storage capacitor Cs as much as possible in the circuit layout design to increase the capacitance value. However, in a system with multi-color charged color particles, since the distance and direction of movement of the charged color particles need to be accurately controlled, the capacitance of the storage capacitor Cs is appropriately reduced to reduce the energy supply to increase the accuracy of controlling the movement distance of the charged color particles. However, the need to increase the number of energy storage times will come at the expense of reducing the update speed of the electrophoretic display 100.

[0011] See also Figure 2C, is a cross-sectional view illustrating the formation method of the storage capacitor Cs in the known technology. As shown in this figure, the gate metal Mg of the general thin film transistor 32 and the first electrode CE1 of the storage capacitor Cs are manufactured together with the gate line GL when the first metal layer M1 is manufactured. In addition, the source metal Ms / drain metal Md of the thin film transistor 32 and the second electrode CE2 of the storage capacitor Cs are manufactured together with the data line DL when the second metal layer M2 is manufactured. In the known technology, the first electrode CE1 for the storage capacitor Cs can be manufactured simultaneously when the first metal layer M1 is manufactured, the insulating layer CI for the storage capacitor Cs can be manufactured simultaneously when the gate insulating layer is manufactured, and the second electrode CE2 for the storage capacitor Cs can be manufactured simultaneously when the second metal layer M2 is manufactured. Therefore, the following can be formed. Figure 2C The capacitor structure shown is metal (first electrode CE1)-insulating layer (insulating layer CI)-metal (second electrode CE2). However, the gate metal Mg and the source metal Ms / drain metal Md must be made of metal to reduce impedance, and thus the first metal layer M1 and the second metal layer M2 must also be made of metal. This results in a restriction on the material selection of the first electrode CE1 / second electrode CE2 of the storage capacitor Cs in the conventional electrophoretic display 100, and thus the storage capacitor Cs will shield light, reducing the aperture ratio of the control substrate of the conventional electrophoretic display, that is, the overall aperture ratio of the control substrate end components (including the control substrate 10, the driving circuit layer 30a and the control electrode layer PEL).

[0012] In addition, the disadvantages of the known technology include that the charged particles are moved toward the viewing surface by pushing them away. The farther the particles are pushed away, the weaker the driving force of the charge on the control electrode. When more particles with charges of opposite polarity to the control electrode are attracted to the surface of the control electrode, the electric field of the electrophoretic layer is reduced, resulting in a weaker driving force on the particles moving away. Under the influence of these two factors, the speed of the charged particles moving toward the viewing surface will become slower and slower, resulting in higher energy and more time required to move the charged particles to the expected viewing surface position. This is the main reason why the display of the known technology has a very slow update speed.

[0013] Furthermore, the charged particles moving toward the viewing surface will be affected by the different voltages and polarities between the different control electrodes, causing a phenomenon of lateral movement. We can call this the diffusion phenomenon of particle movement, which will cause a decrease in contrast in the border area, blurred images, and edge afterimages in black and white displays. This problem is particularly serious in color displays, causing serious image afterimage problems, reduced color saturation, and color distortion. This is why electrophoretic displays using known technology cannot display true colors like LCDs in color displays, and have image afterimages when turning pages (different from black and white edge afterimages). Multiple uneven diffusions cause the charged particles to move farther and farther laterally, causing the originally evenly distributed density of charged particles of different colors to become uneven, causing the image display to deteriorate. When the image display deteriorates to a certain extent, the life of the display is over.

[0014] When charged particles move toward the viewing surface, they will attract charges on the common electrode and attract each other, resulting in charge movement on the common electrode. The charge movement throughout the common electrode will interfere with each other, and these interfering charge movements will push away particles of the same charge that were originally on the viewing surface, causing erroneous display. When the charge density at the position corresponding to each control electrode on the common electrode changes continuously, it will also cause the problem of lateral movement of charged particles (particle diffusion problem), making the afterimage problem of color display more serious and affecting the service life. In addition, the driving circuit will change with the most extreme voltage gap when switching the gate line voltage, and the generated pulse conflict will also cause sudden charge movement in the common electrode layer connected to the ground GND, affecting the display.

[0015] The common electrode layer is the largest conductor on the display and is easily affected by other static electricity, causing the screen to change state. All of the above shortcomings have slowed down the development of color electrophoretic displays, so a thorough change is needed from the viewing surface, the source of the error. Summary of the invention

[0016] According to one embodiment of the present invention, the present invention discloses a color electrophoretic display having a micro-compartment structure, comprising:

[0017] A control substrate having a first surface and a second surface;

[0018] a driving circuit layer, located on the second surface of the control substrate, comprising a plurality of thin film transistors, a plurality of gate lines and a plurality of data lines, at least one of the gate lines being electrically connected to the gates of the plurality of thin film transistors, and at least one of the data lines being electrically connected to the drains or sources of the plurality of thin film transistors;

[0019] A control electrode layer, located on a surface of the driving circuit layer away from the control substrate, comprising a plurality of control electrodes, at least one of which is electrically connected to the source or the drain of one of the thin film transistors;

[0020] A micro-compartment structure is set on the control substrate and is made of a polymer material. The micro-compartment structure includes a plurality of compartment walls to define a plurality of tanks filled with a colloidal solution;

[0021] It further comprises a color filter layer formed at the bottom of the chamber, and the colloidal solution comprises charged black color particles and / or charged white color particles;

[0022] A relative substrate is arranged on a side of the micro compartment structure away from the control substrate.

[0023] According to another embodiment of the present invention, the present invention discloses a color electrophoretic display having a micro-compartment structure, comprising:

[0024] A control substrate having a first surface and a second surface,

[0025] a driving circuit layer, located on the second surface of the control substrate, comprising a plurality of thin film transistors, a plurality of gate lines and a plurality of data lines, at least one of the gate lines being electrically connected to the gates of the plurality of thin film transistors, and at least one of the data lines being electrically connected to the drains or sources of the plurality of thin film transistors;

[0026] A control electrode layer, located on a surface of the driving circuit layer away from the control substrate, comprising a plurality of control electrodes, at least one of which is electrically connected to the source or the drain of one of the thin film transistors;

[0027] a counter substrate, located at a side of the control electrode layer away from the control substrate;

[0028] A micro-compartment structure is set up on the relative substrate and is made of polymer material. The micro-compartment structure includes multiple compartment walls to define multiple tanks filled with a colloidal solution. The colloidal solution contains at least one charged color particle; and further includes a color filter layer between the relative substrate and the control electrode layer.

[0029] The electronic paper used in the prior art electronic paper display is made by using microcapsule and microcup technology. The production cost of electronic paper is high due to the yield rate. The purpose of the present invention is to save the production cost of electronic paper and make the electronic paper directly in the display. At present, the most commonly used electronic paper adopts a microcup structure, and the production method mostly adopts a roll-to-roll method. During the production, a convex roller is used to press a dent on the resin film to make a microcup structure. The microcup structure serves as a container for electronic ink, and the resin film is soft and can be easily broken by pressure. Therefore, the electronic paper product must be well protected, which causes major difficulties in the process. Secondly, the thickness of the microcup (the extension distance perpendicular to the viewing surface) is between 25 and 50um, so the production precision requirement is very high. In terms of roller die production, the thinner the microcup is, the easier it is to break and be peeled off and adhered to the roller, causing damage to the roller and worse production yield. In practice, it is above 25um. The thicker the microcup is, the more electronic ink is consumed. Due to the viscosity and surface tension of the colloidal solution, a gap is formed at the bottom of the microcup when the electronic ink is filled, and it cannot be completely filled. The produced display is also defective and scrapped, all of which make the cost of electronic paper high. Furthermore, the thicker the microcup is, the greater the distance between the control electrode and the common electrode, which slows down the movement of the charged color particles, increases the movement distance, requires a higher driving voltage and a longer time to position, which affects the update speed and quality of the picture. When used in an electronic paper reader, it will cause a poor user experience. Based on the above shortcomings, the present invention can completely solve them.

[0030] The color filter structure of the prior art requires additional color filters to be manufactured before being attached to the black-and-white electrophoretic display. This will result in two important disadvantages. First, due to the error in alignment and attachment, the color blocks of the filter and the control electrode will not completely overlap when projected on the viewing surface. Therefore, the control electrode will overlap across the color blocks, resulting in a color mixing effect and distorting the displayed colors. Secondly, the distance between the color blocks of the filter and the reflective particles will increase, causing light with different incident angles to be absorbed when reflected back to the viewing surface because they cross different color blocks and cannot penetrate the color filter layer, resulting in insufficient reflectivity. The larger the distance, the more serious the problem.

[0031] Before making the micro-compartment, the present invention first makes the color filter block above the control electrode. Since the process is completed on the same substrate, the area of ​​the control electrode can be accurately aligned, there is no problem of cross-region, and there is no problem of color mixing, and the color accuracy is greatly improved. With the structure of the micro-compartment, the distance between the reflective particles and the color filter block can be less than 3um, which successfully solves the problem of incident light being reflected across regions and absorbed by filter blocks of different colors, the reflectivity can be improved, the brightness can be improved, and the same filtering effect is improved, and the color saturation is also improved, achieving important creativity. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1A A cross-sectional view of a conventional black-and-white electrophoretic display is shown.

[0033] Figure 1B A cross-sectional view of a known color electrophoretic display is shown.

[0034] Figure 2A illustrate Figure 1A Schematic diagram of the operation of a known black and white electrophoretic display.

[0035] Figure 2B Describe the control electrode layer / drive circuit layer equivalent circuit diagram.

[0036] Figure 2C Explain how the storage capacitor is designed.

[0037] Figure 3A A cross-sectional view of an electrophoretic display according to an embodiment of the present invention is shown.

[0038] Figure 3B FIG. 4 is a cross-sectional view of a portion of components of an electrophoretic display according to an embodiment of the present invention.

[0039] Figure 3C For the corresponding Figure 3B Top view of .

[0040] Figure 4A FIG. 4 is a cross-sectional view of some components of an electrophoretic display according to another embodiment of the present invention.

[0041] Figure 4B For the corresponding Figure 4A Top view of .

[0042] Figure 4C FIG. 4 is a top view of a portion of components of an electrophoretic display according to another embodiment of the present invention.

[0043] Figure 5A FIG. 1 is a cross-sectional view of a portion of components of an electrophoretic display according to another embodiment of the present invention.

[0044] Figure 5B For the corresponding Figure 5A Top view of .

[0045] Figure 5C FIG. 4 is a cross-sectional view of some components of an electrophoretic display according to another embodiment of the present invention.

[0046] Fig. 6A A diagram illustrating the structure of a conventional thin film transistor.

[0047] Figure 6BA top view of a known thin film transistor and other related components.

[0048] Figure 6C This is a thin film transistor embodiment according to the present invention.

[0049] Fig.6D Examples of aperture ratios at different resolutions designed according to the present invention are shown.

[0050] Fig. 7A is a cross-sectional view of a known color electrophoretic display.

[0051] Figure 7B FIG. 4 is a cross-sectional view of a color electrophoretic display according to an embodiment of the present invention.

[0052] Figure 7C for Figure 7B Partial cross-sectional view.

[0053] Fig. 8A FIG. 4 is a cross-sectional view of a color electrophoretic display according to an embodiment of the present invention.

[0054] Figure 8B for Fig. 8A Partial cross-sectional view.

[0055] Fig. 9A FIG. 4 is a schematic diagram of a color filter layer.

[0056] Fig. 9B FIG. 4 is another schematic diagram of a color filter layer.

[0057] Fig. 10A FIG. 1 is a top view of a microcup compartment and a related color filter layer of a conventional electrophoretic display.

[0058] Fig. 10B FIG. 1 is a top view of a micro compartment according to an embodiment of the present invention.

[0059] Fig. 10C FIG. 4 is another top view of a micro compartment according to an embodiment of the present invention.

[0060] Fig. 10D FIG. 1 is a top view of a micro compartment according to another embodiment of the present invention.

[0061] Figures 11A to 11C FIG. 4 is a schematic diagram of a process for manufacturing a micro-compartment structure according to an embodiment of the present invention.

[0062] Figures 12A to 12C FIG. 4 is a schematic diagram of a process for manufacturing a micro-compartment structure according to another embodiment of the present invention.

[0063] Figures 13A to 13C FIG. 4 is a schematic diagram of a process for manufacturing a micro-compartment structure according to another embodiment of the present invention.

[0064] Figures 14A to 14C FIG. 4 is a schematic diagram of a process for manufacturing a micro-compartment structure according to another embodiment of the present invention.

[0065] Fig.14D FIG. 4 is a cross-sectional view of a micro-compartment structure according to another embodiment of the present invention.

[0066] Fig.14E FIG. 4 is a cross-sectional view of a micro-compartment structure according to another embodiment of the present invention.

[0067] Fig.14F It is a top view of a micro-tenon according to an embodiment of the present invention.

[0068] Fig.15A A partial top view of a transparent two-color electrophoretic display manufactured according to the present invention.

[0069] Figures 15B to 15D The cross-sectional view is a transparent dual-color / color electrophoretic display manufactured according to the present invention.

[0070] Figures 16A-16D It is a cross-sectional view of a transparent double-sided electrophoretic display manufactured according to another embodiment of the present invention.

[0071] Figures 17A-17F A flow chart is provided to illustrate the partition wall production of the micro-compartment.

[0072] Fig.18A FIG. 4 is a schematic diagram of a color filter layer according to an embodiment of the present invention.

[0073] Fig.18B For illustration Fig.18A Schematic diagram of the operation.

[0074] Fig.19 FIG. 4 is a schematic diagram of an in-cell touch screen of an electrophoretic display according to the present invention.

[0075] Figures 20A-20C FIG. 4 is a schematic diagram of an embodiment of an electrophoretic display with a double-sided control substrate according to the present invention.

[0076] Explanation of symbols in the accompanying drawings:

[0077] 100: electrophoretic display;

[0078] 10: control substrate;

[0079] 10U: second control substrate (upper control substrate);

[0080] 10D: first control substrate (lower control substrate);

[0081] 12: relative substrate;

[0082] 13: optical glue;

[0083] 14: common electrode layer;

[0084] 15: transparent protective layer;

[0085] 16: upper glass substrate;

[0086] 20,20a: electrophoresis layer;

[0087] 22: Hollow cavity / micro cup;

[0088] 24: colloidal solution;

[0089] 26: Charged color particles;

[0090] 26B: Charged black particles;

[0091] 26W: charged white particles;

[0092] 26C: charged cyan particles;

[0093] 26M: charged magenta particles;

[0094] 26Y: Charged yellow particles;

[0095] 30,30a: driving circuit layer;

[0096] 30U: second driving circuit layer (upper driving circuit layer);

[0097] 30D: first driving circuit layer (lower driving circuit layer);

[0098] PEL: control electrode layer;

[0099] PE: control electrode;

[0100] PELU: second control electrode layer (upper control electrode layer);

[0101] PELD: first control electrode layer (lower control electrode layer);

[0102] PEU: second control electrode;

[0103] PED: first control electrode;

[0104] PE1, PE2, PE3: control electrodes;

[0105] CF: color filter layer;

[0106] CF1, CF2, CF3, CFR, CFG, CFB, CFW: filter color blocks;

[0107] CF-1: first color filter layer;

[0108] CF-2: second color filter layer;

[0109] Vcom: common voltage;

[0110] Cp: ​​electrophoretic capacitance;

[0111] Cs: storage capacitor;

[0112] R: resistance;

[0113] 32: thin film transistor;

[0114] 320: insulating layer;

[0115] 322: doping layer;

[0116] 324: insulating protective layer;

[0117] Mg: gate metal;

[0118] Ms: source metal;

[0119] Md: drain metal;

[0120] M1: first metal layer;

[0121] M2: second metal layer;

[0122] CE1: first electrode;

[0123] CE2: second electrode;

[0124] CI: insulation layer;

[0125] V1, V2: through hole (via);

[0126] ITO1: first transparent conductive layer;

[0127] ITO2: second transparent conductive layer;

[0128] ITO3: the third transparent conductive layer;

[0129] PLN: flat layer;

[0130] AS: Semiconductor Division;

[0131] GL: gate line;

[0132] DL: data line;

[0133] GLITO: Transparent Conductive Gate Line;

[0134] DLITO: Transparent Conductive Data Line;

[0135] BM: light shielding layer;

[0136] L1, L2 incident light;

[0137] Ve: common voltage line;

[0138] 50: micro compartment structure;

[0139] 52: partition wall;

[0140] 54: trough room;

[0141] 56: gap;

[0142] D: length;

[0143] 60: micro-tenon;

[0144] VCL: common voltage layer;

[0145] L: gate channel length;

[0146] W: gate channel width;

[0147] W1, W2: width;

[0148] PRA: first residual photoresist (first polymer material stack);

[0149] PRB: second residual photoresist (second polymer material stack);

[0150] PR1: first layer of photoresist;

[0151] PR2: second layer of photoresist;

[0152] PM: photomask;

[0153] H: Hole;

[0154] Tx1, Tx2, TxN: touch transmitting electrodes;

[0155] Rx1, Rxn, RxM: touch receiving electrodes;

[0156] 200: display touch integrated driver (display driver);

[0157] S: gap;

[0158] T: compartment wall thickness;

[0159] H1: Compartment wall height (micro-compartment structure thickness). DETAILED DESCRIPTION

[0160] For detailed description and technical contents of the present invention, please refer to the following detailed description and drawings. However, it should be noted that the following drawings are only for illustration of various embodiments of the invention, and some components are drawn in a way that is easier to understand, not for the actual component size.

[0161] As used herein, the terms "above" and "on" may refer to a relative position of a component relative to other components or a sequence in the manufacturing process. For example, component A is on component B, or component A is above component B, which does not mean that component A is in direct contact with component B. There may be other components between component A and component B. In addition, for example, component A is on component B, or component A is above component B represents the sequence of manufacturing order. The manufacturing process of component B precedes the manufacturing process of component A. There may be other manufacturing processes between component A and component B. Furthermore, the so-called up and down positions are only for the convenience of description with the diagram, and do not represent the specific position of the present invention when it is used.

[0162] As used herein, the term "between" may refer to a relative position of a component relative to other components or a sequence in the manufacturing process. For example, component A being between components B and C does not mean that component A is in direct contact with components B and C. There may be other components between components A, B and C. In addition, for example, component A being between components B and C represents the sequence of manufacturing order. The manufacturing process of component B precedes the manufacturing process of component A, or the manufacturing process of component C precedes component A. There may be other manufacturing processes between components A and B, and there may be other manufacturing processes between components A and C. Furthermore, the so-called position between is only for the convenience of description in conjunction with the diagram, and does not represent the specific position of the present invention when it is used.

[0163] 1. High aperture ratio electrophoretic display

[0164] To achieve the viewing surface on the surface of the control substrate, the key is to increase the aperture ratio of the control substrate. The aperture ratio refers to the ratio between the area of ​​the part through which light can pass after removing all opaque areas (such as the metal electrodes of the thin film transistor) and the area of ​​the entire display area within the display area. Since the display area is usually composed of display pixels, it is also equivalent to expressing it by the ratio of the area through which light can pass in a single display pixel to the area of ​​the pixel. The known technology uses a metal layer as a storage capacitor in its driving circuit layer 30a, so the aperture ratio in the pixel is less than 20%, so it is impossible to move the viewing surface to the side of the control substrate. The present invention increases the aperture ratio to not less than 70%, preferably to not less than 80%, and best to not less than 90%. The key to increasing the aperture ratio is to first replace part of the non-transparent storage capacitor electrode with a transparent conductive material, and then reduce the area of ​​the thin film transistor TFT, and finally limit the line width of the gate line and the data line to achieve the high aperture ratio requirement.

[0165] See also Figure 3A, is a cross-sectional view of an electrophoretic display 100 for illustrating an embodiment of the present invention. The electrophoretic display 100 is, for example, a black and white electrophoretic display 100, and includes from top to bottom a relative substrate 12 (for example, a plastic substrate, a glass substrate, or a metal substrate), a common electrode layer 14 (for example, a transparent conductive electrode layer, an opaque conductive metal layer, or other conductive materials), an electrophoretic layer 20, a control electrode layer PEL including a plurality of transparent control electrodes PE, a high aperture ratio driving circuit layer 30 (hereinafter referred to as the driving circuit layer 30) and a control substrate 10 (for example, a glass substrate, a transparent PI substrate, or other substrate materials with a light transmittance greater than 90%). The common electrode layer may not be required under special supporting measures. Figure 3A As shown, the electrophoretic layer 20 includes a plurality of hollow cavities 22 (only one of which is shown), and a colloidal solution 24 filled in each hollow cavity 22 contains a plurality of charged color particles (e.g., charged black particles 26B and charged white particles 26W). The hollow cavity 22 structure is used as a container for electronic ink. According to one embodiment of the present invention, the material of the first electrode CE1 / second electrode CE2 of the storage capacitor Cs in the high aperture ratio driving circuit layer 30 is selected from a transparent conductive material or partially selected from a transparent material, so as to increase the aperture ratio of the electrophoretic display 100. In addition, it is more helpful for the user to view the electrophoretic display 100 from the control substrate 10 side, so as to attract the charged black particles 26B or the charged white particles 26W by the control electrode layer PEL close to the viewing side, so as to achieve the purpose of solving the above-mentioned disadvantages of the known technology. According to other embodiments of the present invention (not shown), the hollow cavity 22 can also be filled with a colloidal solution 24, which contains a colored fluid (e.g., black) and a plurality of charged particles of a single color (e.g., white particles). When the control electrode layer PEL attracts the charged color particles, the color of the particles (e.g., white) is displayed on the viewing surface, and when the control electrode layer PEL repels the charged color particles, the color of the fluid (e.g., black) is displayed on the viewing surface. It can be defined that the electrophoretic layer includes an electrophoretic material, and the electrophoretic material includes a plurality of charged color particles, and the plurality of charged color particles are arranged in a colloidal solution and can move through the colloidal solution under the influence of an electric field, and the plurality of charged color particles include positively charged color particles and / or negatively charged color particles.

[0166] See also Figure 3B , is a cross-sectional view of a portion of components of an electrophoretic display 100 according to an embodiment of the present invention, mainly showing the control electrode layer PEL, the driving circuit layer 30 and the control substrate 10 according to the present invention. Figure 3C , corresponding to Figure 3BAccording to the embodiment of the present invention, the viewing surface is viewed from the direction of the control substrate 10 close to the control electrode layer PEL, so the color displayed is the color of the charged color particles in the colloidal solution 24 attracted by the potential of each control electrode PE of the control electrode layer PEL. Figure 1A and Figure 3A ,exist Figure 1AIn the conventional electrophoretic display 100 shown, by controlling the electrical properties and voltage of each control electrode PE through the driving circuit layer 30a, the charged black particles 26B can be attracted and the charged white particles 26W can be repelled corresponding to each pixel (so that the pixel appears white on the viewing surface opposite to the control electrode layer PEL), or the charged white particles 26W can be attracted and the charged black particles 26B can be repelled corresponding to each pixel (so that the pixel appears black on the viewing surface opposite to the control electrode layer PEL). Since the viewing surface is relatively far away from the control electrode layer PEL relative to the substrate 12, and the farther away from the control electrode layer PEL, the weaker the electric field, the weaker the force of repelling the charged color particles 26, resulting in various defects of the screen of the conventional electrophoretic display 100. In contrast, in the electrophoretic display 100 of the present invention, the driving circuit layer 30 is close to the viewing surface (located on the control substrate 10 side). By controlling the electrical properties and voltage of each control electrode PE through the driving circuit layer 30, the charged black particles 26B can be attracted and the charged white particles 26W can be repelled for each pixel (so that the pixel appears black on the viewing surface close to the control electrode layer PEL), or the charged white particles 26W can be attracted and the charged black particles 26B can be repelled for each pixel (so that the pixel appears white on the viewing surface close to the control electrode layer PEL). In other words, the multiple control electrodes PE on the control electrode layer PEL attract the charged color particles (such as the charged black particles 26B or the charged white particles 26W) with different polarities from the control electrodes PE to accumulate on the side of the electrophoretic layer 20 close to the control electrode layer PEL (including the multiple control electrodes PE).Since the viewing surface is closer to the control substrate 10 side of the control electrode layer PEL, and the closer to the control electrode layer PEL, the stronger the electric field is, the stronger the force to attract the charged color particles 26 is, and the charged particles 26 close to the electrode layer can be firmly locked, so that the electrophoretic display 100 of the present invention can achieve multiple advantages such as excellent screen refresh rate, brightness, contrast, saturation, etc., and since the charge on the control electrode will not move when the thin film transistor 32 is not conducting and is in a locked state, the charged color particles 26 can be stably attracted and will not move with the movement of the charge on the common electrode like the known technology (voltage kickback problem, the charge flows from the storage capacitor to the common electrode after discharge). The charge of the electrode layer, for example, when the common electrode presents a white background with black text with most of the negatively charged white particles, it means that a large proportion of positive charges are condensed on the surface of the common electrode, which is not conducive to the approach of the positively charged black particles. The black particles will be forced back to the control electrode side, commonly known as voltage kickback, making the original black font thinner or disappear. The greater the difference in the black and white ratio on the screen, the more serious the problem is, or it may cause color distortion in color display), and the particles after moving will not return to their original position, causing the image on the viewing surface to be distorted. Using the solution of the present invention, there will be no lateral diffusion and retreat of the charged color particles 26 (color mixing problem, saturation reduction problem) or the inability to move to the new correct position when the picture is updated (afterimage problem).

[0167] In addition, the present invention further provides an improved design for the driving circuit layer 30 to increase the aperture ratio when viewed from the control substrate 10. Figure 3B As shown, according to one embodiment of the present invention, the first electrode CE1 of the storage capacitor Cs is made of a transparent conductive material, such as indium tin oxide (ITO) or a similar transparent conductive material. In addition, the second electrode CE2 of the storage capacitor Cs is also made of a transparent conductive material, such as indium tin oxide (ITO) or a similar transparent conductive material. The insulating layer CI of the storage capacitor Cs can be made simultaneously with the step of making the gate insulating layer (see below for details).

[0168] See also Figure 3C, the control electrode (also called pixel electrode) PE at the top layer is also made of a transparent conductive material, such as indium tin oxide (ITO) or a similar transparent conductive material and electrically connected to the first transparent conductive layer ITO1 (first electrode CE1) of the storage capacitor Cs through a through hole (via) V1; furthermore, the control electrode PE is also electrically connected to the drain metal Md through a through hole (via) V2. When manufacturing the storage capacitor Cs according to the present invention, the corresponding metal layer portion (corresponding to the electrode portion of the storage capacitor Cs) of the original first metal layer M1 in the known technology is replaced by the first transparent conductive layer ITO1 made of a transparent conductive material (such as ITO). According to one embodiment of the present invention, the first metal layer M1 can be made first and then the first transparent conductive layer ITO1, or the first transparent conductive layer ITO1 can be made first and then the first metal layer M1. Basically, there can be no insulating layer between the first metal layer M1 and the first transparent conductive layer ITO1. Of course, adding an insulating layer between the first metal layer M1 and the first transparent conductive layer ITO1 is also functionally the same.

[0169] In addition, the corresponding metal part of the original second metal layer M2 in the known technology is replaced by a second transparent conductive layer ITO2 made of a transparent conductive material (such as ITO). The second transparent conductive layer ITO2 is between the control electrode PE and the first transparent conductive layer ITO1 from the projection direction and is electrically connected to a common voltage Vcom or a DC voltage source such as a 0V voltage. Furthermore, according to one embodiment of the present invention, the second metal layer M2 is made first and then the second transparent conductive layer ITO2, or the second transparent conductive layer ITO2 is made first and then the second metal layer M2. Basically, there can be no insulating layer between the second metal layer M2 and the second transparent conductive layer ITO2. Of course, adding an insulating layer between the second metal layer M2 and the second transparent conductive layer ITO2 is also functionally the same.

[0170] As disclosed above, by Figures 3A to 3C In the disclosed electrophoretic display 100, since the two electrodes of the storage capacitor Cs are made of the first transparent conductive layer ITO1 and the second transparent conductive layer ITO2 respectively, and the distance between the first transparent conductive layer ITO1 and the second transparent conductive layer ITO2 is very small (the thickness of the insulating layer CI is about 0.1 micrometer to 0.5 micrometer), the capacitance value of the storage capacitor Cs can be increased. Furthermore, since the first transparent conductive layer ITO1 and the second transparent conductive layer ITO2 and the control electrode will not block light, it helps to improve the aperture ratio of the control substrate when the electrophoretic display 100 is viewed from the control substrate 10.

[0171] See also Figures 3A to 3CAccording to the present invention, when manufacturing the electrophoretic display 100, for the side portion of the control substrate 10, a metal film can be firstly formed on the upper surface of the control substrate 10 by a deposition process or a sputtering process and a first metal layer M1 can be formed by a lithography process. This first metal layer M1 is used to form the gate metal Mg and the gate line GL, and then a transparent conductive material film is formed by a sputtering process and a first transparent conductive layer ITO1 is formed by a lithography process. The above two steps can also be interchanged with each other, that is, the first transparent conductive layer ITO1 is formed first, and then the first metal layer M1 is formed. Subsequently, the capacitor insulating layer CI (such as SiNx, SiO2) and the a-Si layer AS of the storage capacitor Cs are deposited, and the semiconductor portion of the thin film transistor is defined in conjunction with the lithography process. Then, a metal film is formed on the obtained structure by a deposition process or a sputtering process, and a second metal layer M2 is formed by a lithography process. The second metal layer M2 is used to form a source metal Ms, a drain metal Md and a data line DL, and then a transparent conductive material film is formed by a sputtering process and a second transparent conductive layer ITO2 is formed by a lithography process. The above two steps can also be interchanged with each other, that is, the second transparent conductive layer ITO2 is formed first, and then the second metal layer M2 is formed. Then, a flat layer PLN is formed on the obtained structure by a coating process and a lithography process, and then a transparent conductive material film is formed by a sputtering process and a lithography process is formed to form a control electrode PE (that is, the third transparent conductive layer ITO3) of the control electrode layer PEL. Then, the electrophoretic layer 20 can be laminated or made on the control electrode layer PEL (the hollow cavity 22 is formed by forming a resin film on a multi-molecule substrate, and a roller is used to press out indentations on the resin film to form a hollow cavity 22 structure, and then hardened. The hollow cavity 22 structure is used as a container for electronic ink. Then, the colloidal solution 24 containing charged color particles 26 is injected into the hollow cavity 22 structure, and then the top is sealed with glue and hardened to form a sealed cavity to form the electrophoretic layer 20. The detailed manufacturing process can refer to Taiwan Patent Application No. 93100767, or the micro-compartment structure of the present invention is used, which will be described in detail later). Then, the relative substrate 12 part is manufactured, and the common electrode layer 14 can be formed on the relative substrate 12, or the common electrode layer 14 can be not provided on the relative substrate 12. Finally, the control substrate 10 with the electrophoretic layer 20 is bonded to the opposite substrate 12 by optical adhesive or by using the micro-latching structure of the present invention (described in detail later) and frame glue. The above-mentioned deposition process (CVD, PECVD), sputtering process (sputter deposition), coating process (coating), and insulation layer production are all mature processes commonly used in display panels, and can be used to produce the electrophoretic display 100 of the present invention with multiple advantages such as high aperture ratio and high screen refresh rate.

[0172] In practice, the electronic paper manufacturer will first form the common electrode layer 14 on the above-mentioned relative substrate 12 and then adhere the microcup film containing electronic ink to form the electronic paper. The module manufacturer can also complete the electrophoretic display 100 by adhering the above-made control substrate 10 to the electronic paper. However, since the microcups of the electronic paper are formed by pressing indentations on the resin, the structure is very fragile, and the yield rate is very low during the production process, which invisibly raises the cost. The use of the micro-compartment structure in the present invention can greatly improve this problem.

[0173] See also Figure 4A , is a cross-sectional view of a portion of components of an electrophoretic display 100 according to another embodiment of the present invention, mainly showing a control electrode layer PEL, a driving circuit layer 30 and a control substrate 10 according to the present invention. Figure 4B , corresponding to Figure 4A In addition, Figure 4A and 4B The control electrode layer PEL, the driving circuit layer 30 and the control substrate 10 shown can also be used for Figure 3A In the structure shown, the viewing surface is viewed from the control substrate 10 close to the control electrode layer PEL, so the image display principle is to use the potential of the control electrode layer PEL to attract rather than repel the charged color particles 26 in the colloidal solution 24, so as to achieve better display effects and higher screen refresh rates. In addition, the present invention further provides an improved design for the driving circuit layer 30 to increase the aperture ratio and light transmittance when viewed from the control substrate 10. Figure 4A The disclosed embodiments are similar to Figure 3A The disclosed embodiments, however Figure 4A The control electrode (also called pixel electrode) PE also replaces Figure 3B The first electrode CE1 in the first transparent conductive layer ITO1 plays a role, and in Figure 4A The second electrode CE2 is made in the first transparent conductive layer ITO1, which replaces Figure 3B The second electrode CE2 located in the second transparent conductive layer ITO2 acts as a second electrode. Figure 4A and 4BIn the embodiment shown, the first electrode CE1 (control electrode PE) and the second electrode CE2 (electrically connected to the common voltage Vcom or a DC voltage such as 0V) of the storage capacitor Cs are respectively provided by the control electrode PE and the first transparent conductive layer ITO1 formed of transparent conductive materials, and the insulating layer of the storage capacitor Cs can be simultaneously manufactured by the step of manufacturing the gate insulating layer. The control electrode PE is on the first transparent conductive layer ITO1 when viewed from the projection direction. In addition, the common voltage line Ve of the first transparent conductive layer ITO1 (the second electrode CE2 of the storage capacitor Cs) also extends in the same direction as the gate line GL of the first metal layer M1 (that is, the common voltage line Ve is electrically connected to the first transparent conductive layer ITO1 and is substantially parallel to a gate line GL of the driving circuit layer 30).

[0174] Similarly, in Figure 4A and 4B In the embodiment shown, because the first electrode CE1 and the second electrode CE2 of the storage capacitor Cs are respectively formed of transparent conductive materials, the aperture ratio of the electrophoretic display 100 can be increased. Furthermore, in the present embodiment, the control electrode PE directly formed of transparent conductive materials also serves as the first electrode CE1 of the storage capacitor Cs. This simplifies the structure and reduces the manufacturing process. In addition, Figure 4A and 4B The embodiment shown can also be applied to Figure 3A That is, the viewing surface is on the control substrate 10 side. Figure 4A and 4B The disclosed control electrode layer PEL, driving circuit layer 30 and control substrate 10 are applied to Figure 3A When the structure is constructed, the driving circuit layer 30 can be closer to the viewing surface (located on the control substrate 10 side), so that the electrophoretic display 100 of the present invention has excellent display effects and a higher screen refresh rate and other creative aspects. Figure 4A The stacking ratio Figure 3B The stacked layer has one less transparent conductive layer, so it has better light transmittance.

[0175] See also Figure 4A and 4BWhen manufacturing the electrophoretic display 100, for the side portion of the control substrate 10, a metal film can be first formed on the upper surface of the control substrate 10 by a deposition process or a sputtering process and a first metal layer M1 can be formed by a photolithography process. This first metal layer M1 is used to form a gate metal Mg and a gate line GL. Subsequently, a transparent conductive material film is formed by a sputtering process and a first transparent conductive layer ITO1 and a common voltage line Ve are formed by a photolithography process. The above two steps can also be interchanged with each other, that is, the first transparent conductive layer ITO1 is formed first, and then the first metal layer M1 is formed. Subsequently, a capacitor insulating layer CI (such as SiNx, SiO2) and an a-Si layer AS are deposited, and the semiconductor portion of the thin film transistor is defined in conjunction with the photolithography process. Then, a metal film is formed on the obtained structure by a deposition process or a sputtering process and a lithography process is performed to form a second metal layer M2. The second metal layer M2 is used to form a source metal Ms, a drain metal Md and a data line DL, and then a transparent conductive material film is formed by a sputtering process and a lithography process is performed to form a control electrode layer PEL (ITO2). The above two steps can also be interchanged with each other, that is, the control electrode layer PEL (ITO2) is formed first, and then the second metal layer M2 is formed, as long as there is a partial overlap between the control electrode layer PEL (ITO2) and the drain metal Md in the second metal layer M2 to achieve electrical connection. Then, a coating process and a lithography process are performed on the obtained structure to form a flat layer PLN. Then, the electrophoretic layer 20 can be laminated or manufactured on the flat layer PLN (the hollow cavity 22 is formed by forming a resin film on a plastic substrate, and a roller is used to press out indentations on the resin film to form a hollow cavity 22 structure, and the hollow cavity 22 structure is used as a container for electronic ink. Then, the colloidal solution 24 containing charged color particles 26 is injected into the hollow cavity 22 structure, and then the top is sealed with glue to form a sealed cavity to form the electrophoretic layer 20. The detailed manufacturing process can be referred to Taiwan Patent Application No. 93100767, or the micro-compartment structure of the present invention is used, which will be described in detail later). Then, the side portion of the relative substrate 12 is manufactured, and the common electrode layer 14 can be formed on the relative substrate 12, or the common electrode layer 14 can be not provided on the relative substrate 12. Finally, the control substrate 10 with the electrophoretic layer 20 on one side is bonded to the opposite substrate 12 with optical adhesive or with frame glue using the micro-latching structure of the present invention (described in detail later). The above-mentioned deposition process (CVD, PECVD), sputtering process (sputterdeposition), and coating process (coating) are all mature processes commonly used for display panels, and can be used to produce the electrophoretic display 100 of the present invention with a high aperture ratio and a high screen refresh rate and other creative features.

[0176] See also Figure 4C, is a partial top view of an electrophoretic display 100 according to another embodiment of the present invention, mainly showing the control electrode layer PEL and the driving circuit layer 30 according to the present invention. Figure 4A and 4B The embodiment shown, however, the gate line GL originally made of the first metal layer M1 is replaced by the first transparent conductive layer ITO1 to form a transparent conductive gate line GLITO, and the data line DL part of the second metal layer M2 is replaced by a second transparent conductive layer, that is, the control electrode layer PEL (ITO2) to form a transparent conductive data line DLITO. In other words, the process of the first metal layer M1 mainly forms the gate metal Mg of the thin film transistor, and the process of the second metal layer M2 mainly forms the source metal Ms / drain metal Md of the thin film transistor. The first electrode CE1 of the storage capacitor Cs is provided by the control electrode PE, and the second electrode CE2 of the storage capacitor Cs is provided by the first transparent conductive layer ITO1. Similarly, because the gate line of the first metal layer M1 is partially implemented by the first transparent conductive layer ITO1, the common voltage line Ve for applying the common voltage Vcom to the first transparent conductive layer ITO1 also extends in the same direction as the transparent conductive gate line GLITO (that is, the common voltage line Ve is substantially parallel to the transparent conductive gate line GLITO), the above-mentioned replacement of the metal gate line GL with the transparent conductive material GLITO and the replacement of the metal data line DL with the transparent conductive material DLITO can be replaced at the same time or only one of them is replaced, all within the scope of the present invention. Furthermore, the gate line GL can also be partially implemented by the first transparent conductive layer ITO1, while the other part is still made of the first metal layer M1; and the data line DL can also be partially implemented by the second transparent conductive layer ITO2, while the other part is still made of the second metal layer M2, all within the scope of the present invention.

[0177] Similarly, in Figure 4C In the embodiment shown, because the first electrode CE1 and the second electrode CE2 of the storage capacitor Cs are respectively formed of transparent conductive materials, the transparent conductive gate line GLITO and the transparent conductive data line DLITO are respectively formed of transparent conductive materials or any one of them is at least partially formed of transparent conductive materials, which is within the scope of the present invention, and the aperture ratio of the electrophoretic display 100 can be increased. Furthermore, the first electrode CE1 of the storage capacitor Cs must be electrically connected to the control electrode PE in operation, and in this embodiment, the control electrode PE formed of transparent conductive material is directly used as the first electrode CE1 of the storage capacitor Cs. This can simplify the structure and further reduce the manufacturing process. In addition, Figure 4C The embodiment shown can also be applied to Figure 3A The structure, that is, the viewing surface is on the control substrate 10 side, so when Figure 4C The disclosed control electrode layer PEL, driving circuit layer 30 and control substrate 10 are applied to Figure 3A When constructing the structure, the driving circuit layer 30 can also be close to the viewing surface (located on the control substrate 10 side), so that the electrophoretic display 100 of the present invention has many creative features such as excellent display effect, higher screen update rate and reflectivity. In addition, Figure 4C The process of manufacturing the structure shown is similar to Figure 4A and 4B The process of the structure shown, but in Figure 4A and 4B In the process of manufacturing the first metal layer M1, no gate line is made, but in the process of manufacturing the first transparent conductive layer ITO1, transparent conductive gate line GLITO and common voltage line Ve are made at the same time. Figure 4A and 4B The data lines are not made in the process of the second metal layer M2, but the transparent conductive data lines DLITO are made simultaneously in the process of the second transparent conductive layer ITO2. The use of transparent conductive materials for the gate lines and the data lines can further increase the aperture ratio of the control substrate 10 to more than 90%.

[0178] See also Figure 5A , is a cross-sectional view of a portion of components of an electrophoretic display 100 according to another embodiment of the present invention, mainly showing another implementation of the control electrode layer PEL, the driving circuit layer 30 and the control substrate 10 according to the present invention. Figure 5B , corresponding to Figure 5A In addition, Figure 5A and 5B The control electrode layer PEL, the driving circuit layer 30 and the control substrate 10 shown can also be used for Figure 3A In the illustrated structure, the viewing surface is viewed from the control substrate 10 close to the control electrode layer PEL, so the image display principle is to use the potential of the control electrode layer PEL to attract rather than repel the charged color particles in the colloidal solution 24, so as to achieve a better display effect and a higher screen refresh rate. In addition, the present invention further provides an improved design for the driving circuit layer 30 to increase the aperture ratio when viewed from the control substrate 10.

[0179] like Figure 5A As shown, this embodiment is similar to Figure 4A The embodiment of the present invention is similar to the embodiment of the present invention, but the control electrode PE and the first transparent conductive layer ITO1 are both made on the second metal layer M2. Similarly, the first electrode CE1 of the storage capacitor Cs is provided by the control electrode PE, and the second electrode CE2 of the storage capacitor Cs is provided by the first transparent conductive layer ITO1. In addition, since the control electrode PE and the first transparent conductive layer ITO1 are both made on the flat layer PLN, it is not necessary to cooperate with the first metal layer M1 and the second metal layer M2 process. Figure 4AFor the embodiment of the present invention, the flexibility of the process is increased. Furthermore, the flat layer PLN can also be eliminated. The first transparent conductive layer ITO1 is made on the second metal layer M2, or the second metal layer M2 is made on the first transparent conductive layer ITO1 (hereinafter referred to as Figure 5C Furthermore, if Figure 5B As shown, a portion of the first transparent conductive layer ITO1 extends in the same direction as the data line DL to form a common voltage line Ve receiving the common voltage Vcom (ie, the common voltage line Ve is substantially parallel to the data line DL).

[0180] Similarly, in Figure 5A and 5B In the embodiment shown, because the first electrode CE1 and the second electrode CE2 of the storage capacitor Cs are respectively formed of transparent conductive materials, the aperture ratio of the control substrate 10 in the electrophoretic display 100 can be increased. Furthermore, the first electrode CE1 of the storage capacitor Cs must be electrically connected to the control electrode PE in operation, and in this embodiment, the control electrode PE formed of a transparent conductive material is directly used as the first electrode CE1 of the storage capacitor Cs. This simplifies the structure and further reduces the manufacturing process. In addition, Figure 5A and 5B The embodiment shown can also be applied to Figure 3A The structure, that is, the viewing surface is on the control substrate 10 side, so when Figure 5A and 5B The disclosed control electrode layer PEL, driving circuit layer 30 and control substrate 10 are applied to Figure 3A During the construction, the driving circuit layer 30 can also be close to the viewing surface (located on the control substrate 10 side), so that the electrophoretic display 100 of the present invention has various creative features such as excellent display effect and higher screen refresh rate.

[0181] also, Figure 5A and 5BThe manufacturing method of the embodiment shown is for the side portion of the control substrate 10. First, a metal film can be formed on the upper surface of the control substrate 10 by a deposition process or a sputtering process, and a first metal layer M1 can be formed by a lithography process. This first metal layer M1 is used to form a gate metal Mg and a gate line GL. Subsequently, an insulating layer (such as SiNx) and an a-Si layer AS are deposited, and the semiconductor layer of the thin film transistor is defined in conjunction with a lithography process. Subsequently, a metal film is formed on the obtained structure by a deposition process or a sputtering process, and a second metal layer M2 is formed by a lithography process. This second metal layer M2 is used to form a source metal Ms, a drain metal Md, and a data line DL. Subsequently, a planar layer PLN and a through hole VIA are formed on the obtained structure by coating and lithography processes. Then, a transparent conductive material film is made by sputtering process and a first transparent conductive layer ITO1 is made by lithography process to serve as the second electrode CE2 of the storage capacitor Cs, an insulating material is deposited and a capacitor insulating layer CI of the storage capacitor Cs is made by lithography process, a transparent conductive material film (second transparent conductive layer ITO2) is made by sputtering process and a control electrode PE of the control electrode layer PEL is made by lithography process to serve as the first electrode CE1 of the storage capacitor Cs, and then an insulating protective layer is made. Then, the electrophoretic layer 20 can be laminated or made (for example, a resin film is formed on a plastic substrate to contain a hollow cavity 22, and a roller is used to press a dent on the resin film to form a hollow cavity 22 structure, and the hollow cavity 22 structure is used as a container for electronic ink, and then the colloidal solution 24 containing the charged color particles 26 is injected into the hollow cavity 22 structure, and then the top is sealed with glue to form a sealed cavity to form the electrophoretic layer 20. The detailed manufacturing process can refer to Taiwan Patent Application No. 93100767). Then, the part on the opposite substrate 12 side is made, and the common electrode layer 14 and the insulating layer can be formed on the opposite substrate 12. Finally, the side of the control substrate 10 with the electrophoretic layer 20 and the side of the opposite substrate 12 with the common electrode and the insulating layer are bonded together by optical adhesive. The above-mentioned deposition process (CVD, PECVD), sputtering process (sputter deposition), and coating process (coating) are all mature processes commonly used in display panels, and can be used to manufacture the electrophoretic display 100 of the present invention with high aperture ratio and high screen refresh rate and other creative features.

[0182] See also Figure 5C , is a partial component cross-sectional view of an electrophoretic display 100 according to another embodiment of the present invention, mainly showing another implementation method of the control electrode layer PEL, the driving circuit layer 30 and the control substrate 10 according to the present invention. Figure 5C The control electrode layer PEL, the driving circuit layer 30 and the control substrate 10 shown can also be used for Figure 3AIn the illustrated structure, the viewing surface is viewed from the control substrate 10 close to the control electrode layer PEL, so the image display principle is to use the potential of the control electrode layer PEL to attract rather than repel the charged color particles in the colloidal solution 24, so as to achieve a better display effect and a higher screen refresh rate. In addition, the present invention further provides an improved design for the driving circuit layer 30 to increase the aperture ratio when viewed from the control substrate 10.

[0183] like Figure 5C As shown, this embodiment is similar to Figure 5A In the embodiment, the first electrode CE1 of the storage capacitor Cs is provided by the control electrode PE, and the second electrode CE2 of the storage capacitor Cs is provided by the first transparent conductive layer ITO1, but the control electrode PE and the first transparent conductive layer ITO1 are not made on the flat layer PLN. Because the first electrode CE1 and the second electrode CE2 of the storage capacitor Cs are respectively formed of transparent conductive materials, the aperture ratio of the control substrate 10 in the electrophoretic display 100 can be increased. Furthermore, the first electrode CE1 of the storage capacitor Cs must be electrically connected to the control electrode PE in operation, and in this embodiment, the control electrode PE formed of a transparent conductive material is directly used as the first electrode CE1 of the storage capacitor Cs. This can simplify the structure and further reduce the manufacturing process. In addition, Figure 5C The embodiment shown can also be applied to Figure 3A The structure, that is, the viewing surface is on the control substrate 10 side, so when Figure 5C The disclosed control electrode layer PEL, driving circuit layer 30 and control substrate 10 are applied to Figure 3A During the construction, the driving circuit layer 30 can also be close to the viewing surface (located on the control substrate 10 side), so that the electrophoretic display 100 of the present invention has various creative features such as excellent display effect and higher screen refresh rate.

[0184] also, Figure 5CThe manufacturing method of the embodiment shown, for the side portion of the control substrate 10, can firstly form a metal film on the upper surface of the control substrate 10 by a deposition process or a sputtering process and form a first metal layer M1 by a lithography process. This first metal layer M1 is used to form the gate metal Mg and the gate line GL. Subsequently, an insulating layer (such as SiNx) and an a-Si layer AS are deposited, and the semiconductor layer of the thin film transistor is defined in cooperation with the lithography process. Subsequently, a metal film is formed on the obtained structure by a deposition process or a sputtering process and a second metal layer M2 is formed by a lithography process. This second metal layer M2 is used to form the source metal Ms, the drain metal Md and the data line DL. Subsequently, a transparent conductive material film is formed by a sputtering process and a lithography process is formed to form the first transparent conductive layer ITO1 and the common voltage line Ve. The above two steps can also be interchanged with each other, that is, the first transparent conductive layer ITO1 is formed first, and then the second metal layer M2 is formed. Basically, the first transparent conductive layer ITO1 and the second metal layer M2 are on the same layer or at a position close in height. Then, an insulating layer is deposited, and an insulating layer CI for storing capacitor Cs is defined in cooperation with a lithography process; and then a transparent conductive material film is made by a sputtering process and a lithography process is performed to make a control electrode layer PEL (ITO2). Then, a coating process and a lithography process can be used on the obtained structure to make a flat layer PLN or an insulating layer, and then an electrophoretic layer 20 is laminated or made (the hollow cavity 22 is formed by forming a resin film on a plastic substrate, and a roller is used to press a dent on the resin film to make a hollow cavity 22 structure, and the hollow cavity 22 structure is used as a container for electronic ink, and then the colloidal solution 24 containing charged color particles 26 is injected into the hollow cavity 22 structure, and then the top is sealed with glue to form a sealed cavity to make the electrophoretic layer 20. The detailed production process can refer to Taiwan Patent Application No. 93100767, or use the micro-compartment structure of the present invention, which will be described in detail later). Then, the relative substrate 12 side is manufactured. The common electrode layer 14 may be formed on the relative substrate 12, or the common electrode layer 14 may not be provided on the relative substrate 12. Finally, the control substrate 10 with the electrophoretic layer 20 is bonded to the relative substrate 12 side with optical adhesive or with the micro-tenon structure of the present invention (described in detail later) and frame glue. The above-mentioned deposition process (CVD, PECVD), sputtering process (sputter deposition), and coating process (coating) are all mature processes commonly used in display panels, and can manufacture the electrophoretic display 100 of the present invention with a high aperture ratio and a high screen refresh rate and other creative features. Figure 3B-3CIn the examples shown in , 4A-4C, and 5A-5C, according to one feasible method, at least one storage capacitor Cs includes a transparent first electrode CE1, a transparent second electrode CE2, and an insulating layer CI between the first electrode CE1 and the second electrode CE2; according to another feasible method, all storage capacitors Cs respectively include a transparent first electrode CE1, a transparent second electrode CE2, and an insulating layer CI between the first electrode CE1 and the second electrode CE2; according to yet another feasible method, at least the storage capacitors Cs in the viewing area of ​​the electrophoretic display respectively include a transparent first electrode CE1, a transparent second electrode CE2, and an insulating layer CI between the first electrode CE1 and the second electrode CE2.

[0185] exist Figures 3A-3C , Figures 4A-4C and Figures 5A-5C In the embodiment shown, because the common electrode layer 14 is located away from the viewing surface, the common electrode layer 14 does not need to be made of a conductive transparent material. For example, the common electrode layer 14 can be made of an opaque conductive material, such as an aluminum film. Since the viewing surface is not on the opposite substrate side, it is also an embodiment of the present invention not to set the common electrode layer 14 on the opposite substrate. In addition, according to Figures 3A-3C , Figures 4A-4C and Figures 5A-5C In the embodiment shown, the aperture ratio is increased to not less than 70%, preferably the aperture ratio is increased to not less than 80%, and most preferably the aperture ratio is increased to not less than 90%. According to an embodiment of the present invention, the sum of the line widths of the gate line and the data line is designed to be not more than 20 microns (for large-size displays or low-resolution displays), or not more than 10 microns (for medium- and small-size displays or high-resolution displays), which can further increase the aperture ratio.

[0186] In addition, Figures 3A-3C , Figures 4A-4C and Figure 5A and 5C In the embodiment shown, the area of ​​the semiconductor portion AS of the thin film transistor 32 may be no greater than 1000 square microns, the overlapping area of ​​the thin film transistor 32 and the gate line GL may be no less than 20 square microns, and the overlapping area of ​​the thin film transistor 32 and the data line DL may be no less than 5 square microns; in addition, the line width of the gate line GL may be no greater than 5 microns or 10 microns, and the line width of the data line DL may be no greater than 5 microns or 10 microns; the sum of the line width of the gate line GL and the line width of the data line DL may be no greater than 20 microns. Furthermore, the first electrode CE1 and the second electrode CE2 of the storage capacitor Cs overlap each other in the projection direction, and the overlapping area is no less than 30% of the pixel area. Figures 3A-3C , Figures 4A-4C and Figure 5A and 5CIn the electrophoretic display 100 to which the embodiment shown is applicable, the electrophoretic layer 20 may have Figures 11A-11C , Figures 12A-12C , Figures 13A-13C and Figures 14A-14E The micro-compartment structure shown in the figure or realized in a similar manner, and the electrophoretic display 100 may also have a corresponding Figures 14C-14E , Figures 16A-16D The micro-lattice 60 implemented in a corresponding or similar manner. Those skilled in the art should be able to appropriately modify the micro-compartment and micro-lattice disclosure of the above embodiment and apply it to the present invention. Figures 3A-3C , Figures 4A-4C and Figure 5A and 5C In the embodiment shown. In addition, if using Figures 3A-3C , Figures 4A-4C and Figure 5A and 5C The electrophoretic display 100 of the embodiment shown has a color filter layer, and the color filter layer may have the Fig.18A The structure shown, that is, the color filter layer CF includes a plurality of filter color blocks (CFR, CFG, CFB) of different colors, the filter color blocks include a plurality of holes H and at least one of the holes H has an area not greater than 100 square microns. Figures 3A-3C , Figures 4A-4C and Figure 5A and 5C The electrophoretic display 100 of the embodiment shown may also be Fig.19 In the structure shown, the common voltage lines Ve are electrically connected to a display driver 200 or a display touch integrated driver 200; during the touch operation of the electrophoretic display 100, the display touch integrated driver 200 electrically connects multiple data lines DL together as a single touch transmitting electrode; the display touch integrated driver 200 electrically connects multiple common voltage lines Ve together as a single touch receiving electrode or the above-mentioned touch transmitting electrode and touch receiving electrode can be swapped with each other.

[0187] 2. Make thin film transistors on the gate lines

[0188] See also Fig. 6A, is a structural diagram of a known thin film transistor. The manufacturing process of a thin film transistor generally includes five masking steps. In the first masking process, a first metal layer M1 is formed on a glass substrate (e.g., a control substrate 10), that is, the gate metal Mg and the gate line GL are defined in cooperation with the lithography process of the first mask. In a known electrophoretic display, this first metal layer M1 also serves as the first electrode CE1 of the storage capacitor Cs. Subsequently, an insulating layer 320 (e.g., SiNx, SiO2) and an a-Si layer are deposited, and the semiconductor portion (i.e., the a-Si layer AS) is defined in cooperation with the lithography process of the second mask, and then ion implantation is performed to form a doping layer 322. Subsequently, a second metal layer M2 is formed, that is, the source metal Ms / drain metal Md and the data line are defined in cooperation with the lithography process of the third mask. In a known electrophoretic display, this second metal layer M2 also serves as the second electrode CE2 of the storage capacitor Cs. Then, a transparent conductive layer (ITO) is formed by sputtering, and the contact points between the control electrode PE and the source metal Ms are formed by a lithography process in coordination with the fourth mask. An insulating protection layer (passivation layer) 324 is deposited, and the remaining metal surfaces to be exposed are defined by a lithography process in coordination with the fifth mask.

[0189] See also Figure 6B , is a top view of a known thin film transistor 32 and other related components. As shown in this figure, the source metal Ms of the thin film transistor is electrically connected to the data line DL, the drain metal Md is connected to the control electrode PE through the through hole V1, and the gate metal Mg is electrically connected to the gate line GL. In addition, the semiconductor layer of the thin film transistor 32, that is, the semiconductor portion AS, does not overlap with the gate line GL or the data line DL in the projection angle, because the design of the amorphous silicon TFT will occupy a larger area and affect the aperture ratio of the control substrate.

[0190] See also Figure 6C In order to further improve the aperture ratio of the control substrate, according to a thin film transistor embodiment of the present invention, the a-Si layer (i.e., the semiconductor portion) AS of the thin film transistor 32 at least partially overlaps with one of the gate line GL or the data line DL, or the a-Si layer AS of the thin film transistor 32 at least partially overlaps with both the gate line GL and the data line DL. In addition, the through hole V1 of the thin film transistor 32 also overlaps with the gate line GL. In other words, the present invention moves the thin film transistor 32 originally placed in the control electrode PE region of the electrophoretic display 100 to the intersection point relative to the data line (Data line) and the gate line (Gate line) to increase the aperture ratio of the electrophoretic display 100. After actual design and under optimal conditions, the electrophoretic display 100 of the present invention can have the following aperture ratios:

[0191] refer to Fig.6DDesign examples using the present invention.

[0192] (a) At a black-and-white resolution of 166 PPI (pixel size is 150umX150um), the aperture ratio of the control substrate can reach 95.5%, (b) At a black-and-white resolution of 250 PPI (pixel size is 100umX100um), the aperture ratio of the control substrate can reach 92.88%, (c) At a black-and-white resolution of 300 PPI (pixel size is 85umX85um), the aperture ratio of the control substrate can reach 91.39%, (d) At a color resolution of 200 PPI (pixel size is 120umX120um, RGB sub-pixels are 40umX120um each), the aperture ratio of the control substrate can reach 87.67%. According to the present invention, a conservative design scheme is used at the resolution of most application scenarios, and the gate line width is adjusted to 5 microns and the data line width is adjusted to 5 microns (that is, the gate line width plus the data line width is not greater than 10 microns). Under the above resolution conditions, the aperture ratio can reach more than 80%. In addition, according to an embodiment of the present invention, the gate line width is adjusted to 10 microns, and the data line width is adjusted to 10 microns (that is, the gate line width plus the data line width is not greater than 20 microns), and the aperture ratio can reach more than 70% under the above resolution conditions. According to an embodiment of the present invention, the gate line and the data line are replaced with transparent conductive materials in the area that does not overlap with the AS area (semiconductor area) of the TFT, that is, part of the gate line area is replaced with transparent conductive materials or part of the data line area is replaced with transparent conductive materials, and the aperture ratio can reach more than 90% under the above resolution conditions.

[0193] The current standard display driver circuit design uses the original LCD circuit design as a template. When using amorphous silicon thin film transistor a-Si design, due to the slow drift speed of a-Si, the on-resistance is very large, so the TFT design will use a higher (gate channel width W / gate channel length L), so the thin film transistor will occupy a high proportion of the area, especially at higher resolutions, the area ratio of the thin film transistor will be higher. Since thin film transistors are opaque, a higher thin film transistor area ratio means a lower aperture ratio. Since the liquid crystal transition speed of LCD is much higher than the speed of charged particles moving in electrophoretic displays, LCD displays can provide a higher screen refresh rate. However, for displays using electrophoresis, the speed at which charged particles move in colloidal solutions is very slow, and the screen refresh rate is also very slow, so the design considerations of thin film transistors should be different from those of thin film transistors in LCD driver circuits. The thin film transistor design of LCD should consider the use of lower on-resistance, while electrophoretic displays allow the use of higher on-resistance designs. See also Figure 6C, the thin film transistor 32 in the driving circuit layer 30 of the electrophoretic display can reduce the area of ​​the transistor to increase the aperture ratio. According to one embodiment of the present invention, Figure 6C As shown, the gate channel length L and gate channel width W parameters of the thin film transistor are adjusted for the electrophoretic display to increase the aperture ratio. Generally, the W / L ratio of the thin film transistor in the LCD driving circuit is greater than 10:1, that is, the gate channel length L is much smaller than the gate channel width W. According to one embodiment of the present invention, the ratio of the gate channel width W and the gate channel length L parameters of the thin film transistor is 1:1, that is, the gate channel length L is equal to the gate channel width W, which can increase the aperture ratio of the electrophoretic display 100.

[0194] See also Figure 6C According to one embodiment of the present invention, the area of ​​the a-Si layer (semiconductor portion) AS of the thin film transistor 32 is less than 1000 square micrometers (um 2 The overlap area between the semiconductor portion AS of the thin film transistor 32 and the data line DL is greater than 5 square micrometers (um 2 The overlap area between the semiconductor portion AS of the thin film transistor 32 and the gate line GL is greater than 20 square micrometers (um 2). In other words, according to one embodiment of the present invention, the main part of the semiconductor layer AS is constructed on the gate line GL; because the gate line GL is generally formed of a non-transparent conductive material, by constructing the main part of the semiconductor part AS of the thin film transistor 32 on the gate line GL, the control substrate aperture ratio of the electrophoretic display 100 can be greatly improved. In addition, in order to further optimize the design parameters of the thin film transistor 32 used in the electrophoretic display 100, according to one embodiment of the present invention, the thin film transistor 32 is designed with a gate channel length L less than 10um and a gate channel width W less than 25um. According to one embodiment of the present invention, the gate channel length L is 5um, and the gate channel width W is 5um. The design requires that the width of the gate channel is not greater than 5 times the gate channel length, that is, the ratio of W / L is less than 5 times. There will be different design specifications for different display sizes. The larger the display, the lower its resolution. In order to improve the production yield, data lines and gate lines with larger line widths will be used. For example, the widths of the data lines and gate lines are both 10 microns, that is, the sum of the line widths of the gate lines and the line widths of the data lines is not greater than 20 microns. Small-sized displays must use relatively thin line widths. For example, the widths of the data lines and gate lines are both 5 microns, that is, the sum of the line widths of the gate lines and the line widths of the data lines is not greater than 10 microns. In this way, the aperture ratio of the control substrate can be greater than 80%. The same is true for transistor channel design. The gate channel length L of large-sized displays is not greater than 10 microns, and the width W of the gate channel is not greater than 50 microns under the condition that W / L is 5 times. In the design of small-sized displays, the gate channel length L is not greater than 5 microns, and the width W of the gate channel is not greater than 25 microns under the condition that W / L is 5 times.

[0195] Figure 6C The thin film transistor 32 structure at least partially constructed on the gate line GL can be applied to the high aperture ratio driving circuit layer 30 of the present invention to further improve the overall aperture ratio of the electrophoretic display 100. For example, Figure 6C The thin film transistor 32 structure can be applied to the present invention Figures 3A-3C , Figures 4A-4C and Figures 5A-5C In the high aperture ratio driving circuit layer 30 shown in the figure, in addition to constructing the first electrode CE1 / second electrode CE2 of the storage capacitor Cs with transparent conductive materials, the overall aperture ratio of the electrophoretic display 100 can be further improved. Figure 6C The thin film transistor 32 structure can also be used in the known driving circuit layer 30a, for example Figure 1A-1B In the conventional electrophoretic display 100 shown in the figure, the aperture ratio of the control substrate of the electrophoretic display 100 can be improved without changing the design of the storage capacitor Cs.

[0196] Furthermore, when using Figure 6C In the electrophoretic display 100 with a thin film transistor 32 structure partially constructed on the gate line GL and a gate channel width / length design, the electrophoretic layer 20 may have the Figures 11A-11C , Figures 12A-12C , Figures 13A-13C and Figures 14A-14E The micro-compartment structure shown in the figure or realized in a similar manner, and the electrophoretic display 100 may also have a corresponding Figures 14C-14E , Figures 16A-16D The micro-cages and micro-cages 60 are implemented in a corresponding or similar manner. Those skilled in the art should be able to appropriately modify the micro-compartments and micro-cages disclosed in the above embodiments to apply to the use of Figure 6C The thin film transistor 32 structure and gate channel width / length design are partially constructed in the electrophoretic display 100 on the gate line GL. In addition, if the Figure 6C The electrophoretic display 100 with a thin film transistor 32 structure partially constructed on the gate line GL and a gate channel width / length design has a color filter layer, and the color filter layer can have the structure of the present invention. Fig.18A The structure shown in FIG. 1 is that the color filter layer CF includes a plurality of filter color blocks (CFR, CFG, CFB) of different colors, and the filter color blocks include a plurality of holes H, and the area of ​​at least one of the holes H is not greater than 100 square micrometers. Figure 6C The electrophoretic display 100 with the thin film transistor 32 structure partially constructed on the gate line GL and the gate channel width / length design can also be as follows Fig.19 In the structure shown, the common voltage lines Ve are electrically connected to a display driver 200 or a display touch integrated driver 200; during the touch operation of the electrophoretic display 100, the display touch integrated driver 200 electrically connects multiple data lines DL together as a single touch transmitting electrode; the display touch integrated driver 200 electrically connects multiple common voltage lines Ve together as a single touch receiving electrode or the above-mentioned touch transmitting electrode and touch receiving electrode can be swapped with each other.

[0197] 3. Move the color filter layer to the control substrate

[0198] refer to Fig. 7A , is a cross-sectional view of a known color electrophoretic display 100, which includes, from top to bottom, an upper glass substrate 16, a color filter layer CF, an optical glue 13, a counter substrate 12 (e.g., a transparent plastic substrate), a common electrode layer 14 (e.g., a transparent conductive electrode layer), an electrophoretic layer 20, a control electrode layer PEL, a driving circuit layer 30, and a control substrate 10 (e.g., a glass substrate). In addition, as Fig. 7AAs shown, the electrophoretic layer 20 includes a plurality of hollow cavities 22 (only one of which is shown), a colloidal solution 24 containing a plurality of charged color particles 26 (such as charged black particles 26B and charged white particles 26W) filled in each hollow cavity 22, and the hollow cavity 22 structure serves as a container for the electronic ink. Fig. 7A In the color electrophoretic display 100 shown, the color filter layer CF is separated from the charged color particles by the thickness of the relative substrate 12 plus the thickness of the cavity film of the hollow cavity 22 plus the thickness of the optical adhesive 13, which is about 100 to 200 um. This thickness will cause the color of the incident light to be reflected and absorbed by the filter pigments of other colors, and no reflected light will penetrate to the outside, causing the visible brightness to decrease. Fig. 7A As shown, the incident light L1 is first incident through the second filter color block CF2, and after being reflected by the charged color particles (e.g., the charged white particles 26W), it leaves the color electrophoretic display 100 through the second filter color block CF2. However, the incident light L1 must pass through the opposite substrate 12 and the second filter color block CF2 before reaching the charged white particles 26W, and will be attenuated to a certain extent. Furthermore, the incident light L1 may leave the color electrophoretic display 100 through the second filter color block CF2 again, resulting in secondary filtering attenuation.

[0199] Furu Fig. 7A As shown, a worse situation is that another incident light L2 is first incident through the second filter color block CF2, and after being reflected by the charged color particles (e.g., charged white particles 26W), it leaves the color electrophoretic display 100 through the third filter color block CF3 of a different color. Since the third filter color block CF3 (e.g., blue) and the second filter color block CF2 (e.g., green) have different colors, the incident light L2 is completely absorbed and cannot leave the color electrophoretic display 100, so the color produced by the charged white particles 26W and the second filter color block CF2 cannot be presented. The above situation is more serious when the distance of the incident light from the filter pigment incident surface to the charged color particles and then from the filter pigment exit surface is greater. In short, the thicker the relative substrate 12 thickness and the thickness of the cavity film of the hollow cavity 22, the greater the thickness of the optical glue, or the higher the resolution, the more serious the problems such as color distortion, reduced visible brightness, and insufficient saturation will be. This problem has plagued the development of color electronic paper displays using color filter layers for many years, and the screen resolution of color electrophoretic displays 100 is also severely limited and cannot be developed towards high resolution.

[0200] refer to Figure 7BIn the present invention, the color filter layer CF is fabricated on the control substrate 10 or at a position close to the control substrate 10, so that the distance between the color filter layer CF and the reflective particles can be reduced. When the viewing surface is on the same side of the control substrate 10, the distance between the color filter layer CF and the charged color particles 26 will be reduced to within 30um (reducing the thickness of the substrate 12), and the above-mentioned problem can be solved. If the hollow cavity 22 of the electrophoretic layer 20 is constructed using the micro-compartment of the present invention (described later), the distance between the color filter layer CF and the charged color particles 26 can be further reduced to less than 3um or zero distance of direct contact, so that the best display quality of the color electrophoretic display 100 can be achieved.

[0201] like Figure 7B For the sake of convenience, that is, to provide a clearer comparison with the known electrophoretic display; even though the electrophoretic display 100 of the present invention is viewed from the control substrate 10 side, Figure 7B In the structure shown, the control substrate 10 is still located below the structure. According to this embodiment, the electrophoretic display 100 of the present invention includes, from bottom to top, the control substrate 10, the color filter layer CF, the high aperture ratio driving circuit layer 30 (hereinafter referred to as the driving circuit layer 30), the control electrode layer PEL, the electrophoretic layer 20, the common electrode layer 14 (for example, a transparent conductive electrode layer, or an opaque metal conductive layer, etc.) and a relative substrate 12. Similarly, the electrophoretic layer 20 includes a plurality of hollow cavities 22 (only one of which is shown in the figure), and a colloidal solution 24 containing a plurality of charged color particles 26 (for example, charged black particles 26B and charged white particles 26W) filled in each hollow cavity 22. The hollow cavity 22 is, for example, a hollow cavity made of an organic polymer material, and is used to fill the colloidal solution 24 containing the charged color particles 26. According to other embodiments of the present invention (not shown), the hollow cavity 22 can also be filled with a colloidal solution 24, which contains a colored fluid (such as black) and multiple charged particles of a single color (such as white particles). The hollow cavity 22 structure serves as a container for electronic ink.

[0202] The electronic ink in the present invention is defined as comprising a plurality of charged color particles, which are disposed in a colloidal solution and can move through the colloidal solution under the influence of an electric field, and the plurality of charged color particles include positively charged color particles and / or negatively charged color particles.

[0203] like Figure 7C As shown, the corresponding Figure 7B The partial cross-sectional view of the embodiment mainly shows the control substrate 10, the color filter layer CF, the high aperture ratio driving circuit layer 30, and the control electrode layer PEL. Figure 7C The high aperture ratio driving circuit layer 30 may adopt a similar Figure 5AThe structure is that the control electrode PE and the first transparent conductive layer ITO1 are both made on the flat layer PLN. The two electrode layers (the first electrode CE1 and the second electrode CE2) of the storage capacitor Cs are provided by the control electrode PE and the first transparent conductive layer ITO1 respectively. Furthermore, the source metal Ms / drain metal Md of the thin film transistor 32 is formed by the second metal layer M2, and the drain metal Md is connected to the control electrode PE through a through hole (via) V1. Figure 7C As shown, since the two electrode layers (first electrode CE1 and second electrode CE2) of the storage capacitor Cs are made of transparent conductive materials (such as ITO), they will not block light, and the aperture ratio of the electrophoretic display of the high aperture ratio driving circuit layer 30 can be increased. In addition, the thickness of the insulating layer CI of the storage capacitor Cs can be reduced according to the design, so that the capacitance value of the storage capacitor Cs can be maximized without affecting the aperture ratio of the control substrate of the electrophoretic display 100. Furthermore, there can be a transparent protective layer 15 of silicon nitride material, silicon oxide material or a composite laminate of the two between the driving circuit layer 30 and the color filter layer CF.

[0204] In addition, in making Figure 7B and 7C The electrophoretic display 100 shown in FIG. Figure 5AThe steps of the embodiment are shown. However, before forming the thin film transistor on the upper surface of the control substrate 10, a color filter layer CF is first formed. The color filter layer CF can be formed in different processes according to the different colorant materials, such as pigments or dyes. For pigments, printing, electrodeposition, or coating followed by exposure, development, or etching can be used; for dyes, dyeing or coating followed by exposure, development, or etching can be used to form a color filter layer CF containing multiple colors on the upper surface of the control substrate 10. Since the thicker the color filter layer, the greater the light loss caused, the less light can penetrate, so in practice the thickness of the color filter layer is limited to within 5 microns (um), that is, the thickness of the filter color block of the color filter layer does not exceed 5 microns. After the color filter layer CF is made, a transparent protective layer 15 of silicon nitride material, silicon oxide material, or a composite stack of the two can be formed on the surface of the color filter layer CF. Then, a metal film is formed on the upper surface of the control substrate 10 by a deposition process or a sputtering process, and a first metal layer M1 is formed by a lithography process. This first metal layer M1 is used to form a gate metal Mg and a gate line GL. Then, an insulating layer (such as SiNx, SiO2) and an a-Si layer are deposited, and the semiconductor portion AS of the thin film transistor is defined in conjunction with a lithography process. Then, a metal film is formed on the obtained structure by a deposition process or a sputtering process, and a second metal layer M2 is formed by a lithography process. This second metal layer M2 is used to form a source metal Ms, a drain metal Md and a data line DL. Then, a planar layer PLN and a through hole are formed on the obtained structure. Then, a transparent conductive material film is made by sputtering process and a first transparent conductive layer ITO1 is made by lithography process to serve as the second electrode CE2 of the storage capacitor Cs, an insulating material is deposited to serve as the capacitor insulating layer CI of the storage capacitor Cs, a transparent conductive material film (ITO2) is made by sputtering process and a control electrode PE of the control electrode layer PEL is made by lithography process to serve as the first electrode CE1 of the storage capacitor Cs. Then, an electrophoretic layer 20 can be bonded or made (the hollow cavity 22 is formed by forming a resin film on a plastic substrate, and a roller is used to press a dent on the resin film to form a hollow cavity 22 structure, and the hollow cavity 22 structure is used as a container for electronic ink, and then the colloidal solution 24 containing charged color particles 26 is injected into the hollow cavity 22 structure, and then the top is sealed with glue to form a sealed cavity to form the electrophoretic layer 20. The detailed manufacturing process can refer to Taiwan Patent Application No. 93100767, or the micro-compartment structure of the present invention). Then, the part on the opposite substrate 12 side is made, and the common electrode layer 14 and the insulating layer can be formed on the opposite substrate 12. Finally, the side of the control substrate 10 with the electrophoretic layer 20 and the side of the opposite substrate 12 with the common electrode and the insulating layer are bonded together with optical glue or with a frame glue using the micro-clamp structure of the present invention (described in detail later). And when the viewing surface is not on the opposite substrate 12 side, it is not necessary to set the common electrode layer 14 on the opposite substrate 12.The above-mentioned deposition process (CVD, PECVD), sputtering process (sputterdeposition), and coating process (coating) are all commonly used and mature processes for display panels, and can be used to manufacture the electrophoretic display 100 of the present invention with a high aperture ratio and a high frame rate.

[0205] However, in the above process, if the material of the color filter layer CF is affected by the temperature of the subsequent thin film transistor process, the thin film transistor process method must be selected. For example, the thin film transistor can adopt a-SiTFT (temperature below 200 degrees C) with a low temperature process, or an organic thin film transistor (Organic TFT, temperature below 100 degrees C) with a lower process temperature.

[0206] like Figure 7B and 7C As shown in FIG. 1 , according to the electrophoretic display 100 of the present invention, the viewing surface is on the control substrate 10 side, and the color filter layer CF is moved above the control substrate 10. Furthermore, the total thickness of the driving circuit layer 30 and the control electrode layer PEL is much smaller than Fig. 7A The thickness of the relative substrate 12 in the control substrate 10 is reduced, so the distance between the light incident from the control substrate 10 side and the electrophoretic layer 20 can be reduced. Furthermore, as mentioned above, the charged color particles 26 (such as the charged black particles 26B and the charged white particles 26W) attracted by the high aperture ratio driving circuit layer 30 can reach the side of the electrophoretic layer 20 close to the control electrode layer PEL more quickly, further reducing the distance between the light incident from the control substrate 10 side and the charged color particles 26, thereby increasing the color accuracy, color saturation and contrast, brightness and other creativity of the electrophoretic display 100.

[0207] Fig. 8A A cross-sectional view of an electrophoretic display 100 according to another embodiment of the present invention is shown. Figure 7B The structure shown, that is, the color filter layer CF is also disposed close to the control substrate 10. Fig. 8A In the structure shown, the color filter layer CF is moved to the control electrode layer PEL. In practice, it can also be disposed between the driving circuit layer and the control electrode layer. The control electrode can be electrically connected to the source or drain of the transistor via the through hole on the color filter layer. Therefore, the electrophoretic display 100 of this embodiment includes a control substrate 10, a high aperture ratio driving circuit layer 30, a control electrode layer PEL, a color filter layer CF, an electrophoretic layer 20, a common electrode layer 14 (for example, a transparent conductive electrode layer or an opaque metal conductive layer) and a counter substrate 12 from bottom to top, wherein the control electrode layer PEL and the color filter layer CF can be swapped.

[0208] like Figure 8B As shown, the corresponding Fig. 8A The partial cross-sectional view of the embodiment mainly shows the control substrate 10, the color filter layer CF, the high aperture ratio driving circuit layer 30, and the control electrode layer PEL. Figure 8B The high aperture ratio driving circuit layer 30 may adopt a similar Figure 5A The structure is that the control electrode PE and the first transparent conductive layer ITO1 are both made on the flat layer PLN. The two electrode layers (the first electrode CE1 and the second electrode CE2) of the storage capacitor Cs are provided by the control electrode PE and the first transparent conductive layer ITO1 respectively. Furthermore, the source metal Ms / drain metal Md of the thin film transistor 32 is formed by the second metal layer M2 and is connected to the control electrode PE (ITO2) through a through hole (via) V1. Figure 8B As shown, since the two electrode layers (the first capacitor conductive layer and the second capacitor conductive layer) of the storage capacitor Cs are made of transparent conductive materials (such as ITO), they will not block light. In addition, the thickness of the insulating layer CI of the storage capacitor Cs can be reduced according to the design, so that the capacitance value of the storage capacitor Cs can be maximized without affecting the aperture ratio of the electrophoretic display 100.

[0209] In addition, in making Fig. 8A and 8B The electrophoretic display 100 shown in FIG. Figure 5A The steps of the embodiment are shown. However, after the thin film transistor 32 and the control electrode PE are formed on the upper surface of the control substrate 10, a color filter layer CF is formed on the thin film transistor 32 and the control electrode PE. The formation method of this color filter layer CF can have different processes depending on the colorant material, such as pigment (Pigment) or dye (Dye). For pigments, printing, color photoresist exposure and development or etching can be used; for dyes, etching or color photoresist exposure and development can be used to form a color filter layer CF containing multiple colors on the thin film transistor 32 and the control electrode PE. After the color filter layer CF is made, a transparent protective layer made of acrylic resin (Acryl resin) or epoxy resin (Epoxy resin) can be formed on the surface of the color filter layer CF, or a protective film can be made of inorganic materials such as SiNx, SiO2, etc., or neither of them can be done.

[0210] See also Fig. 8A, then the electrophoretic layer 20 is laminated or made on the color filter layer CF (or on the transparent protective layer) (the hollow cavity 22 is formed by forming a resin film on a plastic substrate, and a roller is used to press out a dent on the resin film to form a hollow cavity 22 structure, and the hollow cavity 22 structure is used as a container for electronic ink, and then the colloidal solution 24 containing charged color particles 26 is injected into the hollow cavity 22 structure and then sealed with glue to form a sealed cavity to form the electrophoretic layer 20. For the detailed manufacturing process, please refer to Taiwan Patent Application No. 93100767, or the micro-compartment structure of the present invention). Then, the side portion of the opposite substrate 12 is manufactured, and the common electrode layer 14 can be formed on the opposite substrate 12. Finally, the side of the control substrate 10 where the electrophoretic layer 20 is made and the side of the relative substrate 12 where the common electrode is made are bonded together with optical glue or frame glue using the micro-locking structure of the present invention (described in detail later). When the viewing surface is not on the relative substrate 12 side, the common electrode layer 14 may not be set on the relative substrate 12. The above-mentioned deposition process (CVD, PECVD), sputtering process (sputter deposition), and coating process (coating) are all mature processes commonly used in display panels, and can be used to manufacture the electrophoretic display 100 of the present invention with a high aperture ratio and a high screen refresh rate.

[0211] like Fig. 8A and 8B As shown, according to the electrophoretic display 100 of the present invention, the viewing surface is on the control substrate 10 side, and the color filter layer CF is disposed on the control substrate 10. Furthermore, the color filter layer CF is almost in contact with the electrophoretic layer 20, so the distance between the light incident from the control substrate 10 side and the electrophoretic layer 20 can be reduced after passing through the color filter layer CF, thereby increasing the color accuracy, color saturation, contrast and visible brightness of the electrophoretic display 100.

[0212] Since electronic ink has black charged particles and has sufficient black saturation, there is no need to use a black shading layer (BM) to increase the black saturation. Therefore, the black shading layer (BM) used by the thin-film transistor that originally used the black frame to shield the metal wire can be replaced by white or transparent. After the color filter layer is made of photoresist materials corresponding to various colors and exposed through a mask, the development process will wash away the unexposed areas and leave the color photoresist in the exposed area (negative photoresist). For example, to form red, green and blue photoresist materials, different masks can be used to retain photoresist materials in different positions. In addition, when making the color filter layer, the exposed color photoresist can also be washed away to leave the color photoresist in the unexposed area (positive photoresist). In other words, after multiple color photoresist exposure processes, the required color photoresist is laid at the specified position of the design, and the color photoresist can be made into different required thicknesses by coating.

[0213] like Fig. 9AAs shown, the color filter layer is usually divided into three regions (red, green, and blue, namely, the red filter color block CFR, the green filter color block CFG, and the blue filter color block CFB) in design. Fig. 9B As shown, the color filter layer can also be divided into four areas (red, green, blue, and white, namely, the red filter color block CFR, the green filter color block CFG, the blue filter color block CFB, and the white filter color block CFW) in design, and the white part of the area does not need to be filled with photoresist to maintain transparency.

[0214] In the application of electronic paper display devices, the black shading layer (BM) area, which was originally used to increase the black saturation, does not need to be black, because the black saturation of electronic paper is already sufficient. Therefore, this area can be replaced by black, white, or transparent without color. The color filter layer is divided into 3 blocks and filled with red, blue, green, plus the black of the border (BM), a total of 4 colors. The color filter layer is divided into 3 blocks and filled with red, blue, green, plus the white of the border (BM), a total of 4 colors. The color filter layer is divided into 3 blocks and filled with red, blue, green, plus the transparent of the border (BM), a total of 3 colors.

[0215] In order to improve the grayscale range, the color filter layer can also be used for grayscale compensation, so the color can be made into 4 blocks, and each block is filled with red, blue, green, transparent and the color of the border. The color filter layer is divided into 4 blocks and filled with red, blue, green, transparent, plus the black of the border (BM), a total of 4 colors. The color filter layer is divided into 4 blocks and filled with red, blue, green, transparent, plus the white of the border (BM), a total of 4 colors. The color filter layer is divided into 4 blocks and filled with red, blue, green, transparent, plus the transparent of the border (BM), a total of 3 colors. Transparency means leaving the area blank without placing color photoresist.

[0216] Furthermore, when using Figure 7B-7C and Figures 8A-8B The color filter layer is disposed in the electrophoretic display 100 close to the control substrate 10, and the electrophoretic layer 20 may have the Figures 11A-11C , Figures 12A-12C , Figures 13A-13C and Figures 14A-14E The micro-compartment structure shown in the figure or realized in a similar manner, and the electrophoretic display 100 may also have a corresponding Figures 14C-14E , Figures 16A-16D The micro-cage 60 is realized in a corresponding or similar manner. Those skilled in the art should be able to appropriately modify the micro-compartment and micro-cage disclosure of the above embodiment and apply it to the use of Figure 7B-7C and Figures 8A-8B The color filter layer is disposed close to the electrophoretic display 100 of the control substrate 10. Figure 7B-7C and Figures 8A-8BThe color filter layer is disposed in the electrophoretic display 100 close to the control substrate 10, and the color filter layer may have the Fig.18A The structure shown in FIG. 1 is that the color filter layer CF includes a plurality of filter color blocks (CFR, CFG, CFB) of different colors, and the filter color blocks include a plurality of holes H, and the area of ​​at least one of the holes H is not greater than 100 square micrometers. Figure 7B-7C and Figures 8A-8B The electrophoretic display 100 of placing the color filter layer close to the control substrate 10 may also be as follows. Fig.19 In the structure shown, the common voltage lines Ve are electrically connected to a display driver 200 or a display touch integrated driver 200; during the touch operation of the electrophoretic display 100, the display touch integrated driver 200 electrically connects multiple data lines DL together as a single touch transmitting electrode; the display touch integrated driver 200 electrically connects multiple common voltage lines Ve together as a single touch receiving electrode or the above-mentioned touch transmitting electrode and touch receiving electrode can be swapped with each other.

[0217] 4. Micro compartment design

[0218] The electronic paper used in the production of electronic paper displays by known technology is made by using microcapsule and microcup technology. The production cost of electronic paper is affected by the yield rate and remains high. In addition, when making an electrophoretic display later, the prepared electronic paper must be peeled off the protective film and then bonded to the control substrate. During bonding, foreign matter and bubbles on the contact surface will cause a significant loss of yield. Since the structure of the electronic paper is very fragile, it is easy to break and damage in the process of tearing off the protective film, which also causes a significant loss in the production process. The purpose of the present invention is to save the production cost of electronic paper and there is no need for a bonding procedure, so there is no yield loss in bonding, and the electronic paper is directly made in the display. At present, the most commonly used electronic paper adopts a microcup structure, and the production method mostly adopts a roll-to-roll method. During production, a convex roller is used to press a dent on the resin film to make a microcup structure. The microcup structure is used as a container for electronic ink, and the resin film is soft and easily broken by pressure. Therefore, the electronic paper product must be well protected, causing major difficulties in the process. Secondly, the thickness of the microcup (the extension distance perpendicular to the viewing surface) is about 25 to 50um, so the precision requirement for production is very high. In terms of roller molding production, the thinner the thickness of the microcup, the easier it is for the resin of the matrix to break and be peeled off and adhered to the roller, causing damage to the roller and worse production yield; the thicker the microcup, the more electronic ink is consumed, and due to the viscosity and surface tension of the resin solution, a gap is formed at the bottom of the microcup when filling, and it cannot be completely filled. The produced display will also be scrapped due to poor display, all of which make the cost of electronic paper high. Furthermore, the thicker the microcup, the greater the distance between the control electrode and the common electrode, the slower the movement speed of the charged color particles, the longer the movement distance, and the higher the driving voltage and the longer the time required to reach the position, which will affect the update speed and display quality of the picture. When used in an electronic paper reader, it will cause the user experience to be poor. Based on the above shortcomings, the present invention can solve them.

[0219] refer to Fig. 10A , is a top view of a microcup compartment and a related color filter layer of a known electrophoretic display. The thickness of the compartment wall of the microcup (see the present invention Fig.11A , the thickness of the partition wall of the present invention is marked as T, Fig. 10A The thickness of the compartment wall of the microcup 22 (also the thickness extending in the direction parallel to the drawing) must be greater than 10um to have sufficient support strength. In addition, when viewing the microcup 22 of a known electrophoretic display from an upward projection angle, a hexagonal compartment structure is often used to increase the structural strength. The charged color particles cannot reach the area within the microcup wall, which can be regarded as a key factor affecting the display aperture ratio. In known electrophoretic displays, there are no charged color particles 26 at this location. Fig. 10A The microcup compartments shown are connected to a control substrate (e.g. Figure 1AWhen the control substrate 10 shown in the figure is attached, the electrodes on the control substrate will be shielded, causing the display color to be partially shielded, forming background textures that affect the imaging quality, and the color will be distorted due to the uneven shielding position of the microcup wall on the color filter layer.

[0220] refer to Fig. 10B According to one embodiment of the present invention, micro-compartments are made on a substrate, and the pixel electrodes (control electrodes PE) can be accurately aligned, so that the partition walls 52 of the micro-compartment structure 50 are made in the non-display area between pixels. In the projection direction of the viewing surface, the overlapping area between the partition walls and the control electrodes is as small as possible, and must be at least less than 50% of the area of ​​the control electrodes. In other words, according to the design of the present invention, the partition walls 52 of the micro-compartment structure 50 can be made into a rectangular structure close to the pixel, and can be matched with the boundary of the pixel without affecting the display. According to the present invention, for example, a mask can be used to develop the pattern of a photoresist film to produce the wall surface of the micro-compartment, wherein the photoresist film can use a material with a higher hardness (such as a transparent photoresist made of acrylic). Furthermore, according to other embodiments of the present invention, the partition walls 52 of the micro-compartment structure 50 can also be made of a polymer material (such as a flat layer material, a resin or an acrylic material). Furthermore, such as Fig. 10B As shown, the partition walls 52 of the micro-compartment structure 50 may be partially aligned with the gate lines GL or the data lines DL. More specifically, the partition walls 52 overlap with a portion of the data lines DL and / or a portion of the gate lines GL when viewed from a vertical projection direction (eg, perpendicular to the viewing surface).

[0221] Since the present invention uses a hard polymer material (such as a transparent photoresist material) as the compartment wall 52 of the micro-compartment structure 50, its hardness can reach a pencil hardness of 3H or more, which is much higher than the resin material used in the micro-cup container of the prior art (the hardness is less than 1H). Therefore, the present invention can use a thinner wall thickness to support the weight and pressure of the upper and lower substrates. The wall thickness T of the micro-compartment (see Fig.11A ) can be less than 10um. Fig. 10C Since the partition wall 52 of the micro-compartment structure 50 of the present invention can be accurately positioned in the non-display area of ​​the pixel (between pixels), it will not affect the display quality. Its high-precision characteristics will bring a good yield and reduce production costs. The greater advantage is that it eliminates the cost and cost of making electronic paper with known micro-cups, and does not require the cost of optical glue that can be saved by bonding the substrate and the yield loss caused by bonding, so a thinner electrophoretic display can be made. In addition, the material of the flat layer (PLN) can be used to make the micro-compartment structure 50, and the area outside the wall can be peeled off by etching to complete the micro-compartment. The micro-compartment structure 50 made by the present invention can make a thinner electrophoretic display, and can easily make an electrophoretic layer 20 with a thickness of less than 25um (the micro-compartment wall height H1 (see Fig.11A) can be less than 25um). When the electrophoretic layer thickness of the electrophoretic display using the micro-compartment structure 50 of the present invention is thinner, the distance between the control electrode and the common electrode will be closer, the electric field strength will be greater, and the display can work at a lower driving voltage. The charged color particles will move faster and the distance they need to move will be shorter, which greatly improves the picture update speed and solves the picture update problem that plagues the electrophoretic display. This problem is particularly important in color electrophoretic displays.

[0222] refer to Fig. 10D , is a top view of a micro-compartment structure according to another embodiment of the present invention. According to this embodiment, the compartment wall 52 of the micro-compartment structure 50 (indicated by a diagonal line graphic to highlight its shape) is easily broken and damaged by bending when the compartment wall 52 of the micro-compartment structure 50 is made of a material with a higher hardness and the substrate for making the micro-compartment is a flexible substrate. In order to improve this problem, the compartment wall 52 of the micro-compartment structure 50 can be made into a discontinuous shape, referring to Fig. 10D The cross-shaped partition wall 52 on the substrate, the slit 56 on the partition wall 52 can be used as a telescopic space when the partition wall 52 is squeezed by bending the substrate. According to one embodiment of the present invention, the area of ​​the slit 56 is not greater than 50% of the area of ​​the partition wall 52, or the length D of the slit 56 is not greater than 50% of the length of the partition wall 52. According to one embodiment of the present invention, the length D of the slit 56 can be greater than 0.5um to provide a telescopic space when the partition wall 52 is squeezed. According to one embodiment of the present invention, the slot chamber formed by the cross-shaped partition wall 52 can accommodate a pixel, such as a pixel composed of filter color blocks of different colors (CFR, CFG, CFB). In addition, although Fig. 10D The partition walls 52 shown in the figure are cross-shaped when viewed from above, so as to provide a slot when there is a gap between adjacent partition walls 52; however, the partition walls 52 of the present invention may be in other shapes when viewed from above, such as T-shaped or U-shaped, as long as there is a gap 56 between at least some of the adjacent partition walls 52. In addition, although Fig. 10D In the illustrated embodiment, the gaps 56 on the partition wall 52 are evenly distributed, but it should be noted that in actual manufacturing, the gaps 56 may have different lengths due to process errors. In addition, the gaps 56 do not necessarily need to pass through the partition wall 52 in the thickness direction, as long as they can provide expansion space for the partition wall 52 when it is squeezed.

[0223] See also Figures 11A to 11C , are schematic diagrams of the process of manufacturing a micro-compartment structure 50 according to an embodiment of the present invention. These schematic diagrams respectively show the steps of Fig. 10C The structure is a cross-sectional view of the line AA at different processes. In this embodiment, the micro-compartment structure 50 is made on the driving circuit layer 30 (that is, on the control substrate 10 side). Fig.11AFirst, a driving circuit layer 30, a transparent control electrode layer PEL and an insulating protection layer are made on the control substrate 10. Then, a transparent photoresist and an exposure and development process are used to make the partition wall 52 of the micro-compartment structure 50. Since the depth of the developable area is causally related to the intensity of the light and the number of irradiations during the development process, in practice, the thickness of the developable photoresist is usually less than 5um due to production cost and yield considerations. When the thickness of the electrophoretic layer is too thin, the number of color particles that can be placed will be limited, which in turn affects the number of layers of color particles stacked. When the number of layers of color particles stacked is insufficient, it will affect the reflectivity, resulting in insufficient reflected light and a decrease in visible brightness. Therefore, the thickness of the electrophoretic layer is usually not less than 5um (micro-compartment wall height H1 (see Fig.11A ) not less than 5um). Figures 17A to 17F , is to illustrate the steps of making a partition wall 52 on a substrate side (such as the control substrate side 10 or the relative substrate side 12) according to an embodiment of the present invention. According to the present invention, the partition wall 52 can be directly made on a surface of the substrate using a transparent photoresist and an exposure and development process. In addition, other structures may also exist on the surface of the substrate, such as a transparent control electrode layer PEL, an insulating layer, a protective layer, a driving circuit layer 30, a color filter layer CF or a common electrode layer 14, and the partition wall 52 can be directly made on these structures using a transparent photoresist and an exposure and development process. Furthermore, a flat layer PLN can be added to other structures on the substrate (such as the transparent control electrode layer PEL, the driving circuit layer 30, and the color filter layer CF), and then the partition wall 52 can be made using a transparent photoresist and an exposure and development process. Therefore, although Figures 17A to 17F The initial structure is schematically shown as a substrate 10 / 12, but it is not limited whether there are other structures thereon. Fig.17A As shown, firstly, cleaning is performed on a substrate 10 / 12, which may be a control substrate 10 or a counter substrate 12, and may have other structures on its cleaning surface. Fig. 17B , a first photoresist layer PR1 is coated on the substrate 10 / 12, for example, a transparent photoresist material. Fig. 17C , using a photomask PM to perform exposure, the location where the partition wall 52 is to be formed is exposed to define the first residual photoresist PRA (i.e., the first polymer material stack). According to one embodiment of the present invention, the first photoresist layer PR1 is a negative photoresist material, that is, the illuminated portion will remain after development; however, according to another feasible embodiment of the present invention, the first photoresist layer PR1 is also a positive photoresist material, and the photomask PM must be changed accordingly. See later Fig.17D , a second photoresist layer PR2 is coated on the substrate 10 / 12, for example, also a transparent photoresist material. Fig.17E, and then use a photomask PM to perform exposure, that is, repeatedly expose, to expose the position where the partition wall 52 is to be formed, so as to define the second residual photoresist PRB (that is, the second polymer material stack), and the range of the second layer of photoresist residue can be smaller than the range of the previous layer of residual photoresist, forming an upward decreasing shape. Fig.17F , and develop the obtained structure to leave the first residual photoresist PRA and the second residual photoresist PRB. The superimposed structure (the first polymer material stacked on the second polymer material stack) is the partition wall 52 of the present invention. According to the above method, by repeatedly coating the photoresist and exposing, and finally developing, the developer removes the unnecessary part (hollow area), leaving a sufficiently high micro-compartment wall surface. The photoresist coating and exposure can be repeated more than once and then developed, or the photoresist coating and exposure can be repeated more than twice and then developed. The area of ​​each exposure can be reduced to thin the partition wall. The diameter of the partition wall can be reduced to less than 5um (W1-W2) per layer. See. Fig. 11B After the partition wall 52 is made, the colloidal solution is filled into the groove chamber 54 defined by the partition wall 52 under vacuum conditions. This can prevent air from remaining in the micro-compartment structure and causing filling failure. The filling method can first use a shielding plate (not shown) to cover the non-display area and then use a spraying device to spray the heated colloidal solution into the display area. In order to increase the yield of the colloidal solution filling later, since there will be alignment errors in each layer of exposure, according to one embodiment of the present invention, the design will adopt a wall thickness that decreases with the growth of the stack to avoid the wall surface being uneven, which will reduce the contact area when filling the colloidal solution, and further generate more unfilled gaps when filling the colloidal solution, resulting in the product becoming a defective product. In practice, the line width of the first layer of photoresist (that is, the first polymer material stack) will be the largest and then decrease with each layer. For example, the width (cross-sectional width) of each layer of the polymer material stack used to make the partition wall is reduced to less than 5 microns, and the shape of the micro-compartment wall is thick at the bottom and thinner at the top. Fig.17F As shown, the width difference (reduction amount) between the second polymer material stacking layer width W2 and the first polymer material stacking layer width W1 is less than 5 microns.

[0224] In this embodiment, the transparent control electrode layer PEL can be formed after the Figures 17A to 17F The partition wall 52 process can also be performed after a flat layer PLN is formed on the transparent control electrode layer PEL. Figures 17A to 17FThe partition wall 52 is formed in the process of forming the partition wall 52. The material of the above-mentioned flat layer PLN can be an organic insulating material, an inorganic insulating material or a combination thereof. According to one embodiment, the organic insulating material can be polyimide (PI), polyamic acid (PAA), polyamide (PA), polyvinyl alcohol (PVA), polyvinyl cinnamate (PVCi), polymethyl methacrylate (poly(methyl methacrylate)) or other suitable photoresist materials or a combination thereof. In addition, the inorganic insulating material can be silicon oxide, silicon nitride, silicon oxynitride, siloxane or a combination thereof.

[0225] See also Fig.11A In the present invention, for the convenience of explanation, the thickness of the micro-compartment structure 50 is defined as the height H of the compartment wall 52, and the thickness of the compartment wall 52 is T. According to the present invention, the thickness of the micro-compartment structure 50 (i.e., the height H1 of the compartment wall) is greater than 5 microns and less than 25 microns, and the thickness T of the compartment wall is less than or equal to 10 microns. In addition, with reference to Fig.11A and Fig.17F , the average cross-sectional width of the compartment wall 52 of the micro-compartment structure 50 is not greater than 10 microns. Fig. 11B After the partition wall 52 is made, the chamber 54 defined by the partition wall 52 is filled with a colloidal solution containing charged black particles and / or charged white particles; or the colloidal solution contains charged colored particles, such as Fig. 11B The charged cyan particles 26C, the charged magenta particles 26M, the charged yellow particles 26Y, and the charged white particles 26W are shown. Fig. 11C The process of attaching the opposite substrate is performed, that is, providing an opposite substrate 12 with a conductive film (such as a common electrode layer 14) or an opposite substrate 12 without a common electrode layer 14 (when the viewing surface is not on the opposite substrate 12 side), and using optical glue 13 between the opposite substrate 12 and the partition wall 52 or applying sealant on the four frames of the display area for bonding, and then sending the two substrates into a gas pressure chamber for heating and pressurization to squeeze the colloidal solution into and fill the gaps in the micro-compartment structure 50, and finally curing the optical glue or sealant to complete the production of the electrophoretic display 100. Fig. 11C As shown, the overlapping area between the partition wall 52 and any control electrode PE is less than 50% of the area of ​​the control electrode (the electrode in the control electrode layer PEL).

[0226] See also Figures 12A to 12C, is a schematic diagram of a process of manufacturing a micro-compartment structure 50 according to another embodiment of the present invention. In this embodiment, the micro-compartment structure 50 is manufactured after the driving circuit layer 30, and the electrophoretic display 100 is a color electrophoretic display 100. Fig. 12A As shown, firstly, the driving circuit layer 30, the transparent control electrode layer PEL and the insulating protection layer (not shown) are manufactured on the control substrate 10, and then the color filter layer CF is manufactured. In this embodiment, the color filter layer CF can be manufactured after the color filter layer CF is completed. Figures 17A to 17F The partition wall 52 process can also be performed after a flat layer PLN is formed on the color filter layer CF. Figures 17A to 17F The material of the flat layer PLN can be an organic insulating material, an inorganic insulating material or a combination thereof. Fig. 12B Under vacuum working conditions, a colloidal solution is filled into the chamber 54 defined by the partition wall 52. The colloidal solution contains charged black particles 26B and charged white particles 26W. Fig. 12C A relative substrate pasting process is performed, that is, a relative substrate 12 with a conductive film (such as a common electrode layer 14) or a relative substrate 12 without a common electrode layer 14 (when the viewing surface is not on the relative substrate 12 side) is provided, and optical glue 13 is used between the relative substrate 12 and the partition wall 52 or frame glue is applied to the four frames of the display area for pasting. After completion, the two substrates are sent into a gas pressurized chamber for heating and pressurization to squeeze the colloidal solution into and fill the gaps in the micro-compartment structure. Finally, the optical glue or frame glue is cured to produce a finished electrophoretic display 100.

[0227] See also Figures 13A to 13C , is a schematic diagram of a process for manufacturing a micro-compartment structure 50 according to another embodiment of the present invention. In this embodiment, the micro-compartment structure 50 is manufactured on the color filter layer CF. Fig.13A As shown, first, a color filter layer CF is formed on the counter substrate 12, and then a common electrode layer 14 is formed on the color filter layer CF. The two-layer fabrication process can be reversed to fabricate the common electrode layer 14 first and then the color filter layer. Then, a transparent photoresist and an exposure and development process are used on the common electrode layer 14 or the color filter layer to fabricate the partition wall 52 of the micro-compartment structure 50.

[0228] In this embodiment, the process can be performed directly on the color filter layer CF or the common electrode layer 14. Figures 17A to 17F The partition wall 52 process can also be performed after a flat layer PLN is formed on the color filter layer CF or the common electrode layer 14. Figures 17A to 17F The material of the planar layer PLN can be an organic insulating material, an inorganic insulating material or a combination thereof.

[0229] See also Fig. 13BAfter the partition wall 52 is manufactured, a colloidal solution containing charged black particles 26B and charged white particles 26W is filled into the chamber 54 defined by the partition wall 52 under vacuum working conditions. Fig. 13C The control substrate pasting process is performed, that is, a control substrate 10 having a control electrode layer PEL and a driving circuit layer 30 is provided, and the control substrate 10 is pasted with the relative substrate 12 with micro compartments after applying optical glue 13 or applying frame glue on the four frames of the display area. After completion, the two substrates are sent into the gas pressure chamber for heating and pressurization, and the colloidal solution is squeezed into and fills the gaps in the micro compartment structure. Finally, the optical glue or frame glue is cured to produce the finished electrophoretic display 100. In this embodiment, since the driving circuit layer 30 is not located near the viewing side, a wider design possibility can be provided, and the high aperture ratio driving circuit layer 30 of the present invention is not required. Furthermore, because this embodiment uses transparent photoresist (such as a photoresist made of acrylic) to produce the compartment wall 52 of the micro compartment structure 50, the height H1 of the compartment wall 52 can be less than 25um. In other words, the distance between the driving circuit layer 30 and the common electrode layer 14 can be less than 25um, which can greatly increase the electric field applied to the electronic ink, increase the picture update rate and other creative features. In addition, because the working condition is vacuum, the colloidal solution is filled into the groove chamber 54 defined by the partition wall 52, and the filling rate of the colloidal solution in the groove chamber 54 can reach more than 70%. With the micro-tenon of the present invention, the colloidal solution with a volume equivalent to the micro-tenon can be further squeezed into the groove chamber, and the filling rate of the colloidal solution in the groove chamber 54 can reach more than 90%.

[0230] See also Figures 14A to 14C , is a schematic diagram of a process for manufacturing a micro-compartment structure 50 according to another embodiment of the present invention. In this embodiment, the micro-compartment structure 50 is manufactured on a conductive layer (eg, the common electrode layer 14). Fig.14A As shown, firstly, a common electrode layer 14 and an optional insulating layer are formed on the opposite substrate 12, and then a common electrode layer 14 is formed. Figures 17A to 17F The insulating layer can be made of silicon nitride material, silicon oxide material or a composite layer of the two by using a deposition method on the common electrode layer 14.

[0231] In this embodiment, the common electrode layer 14 can be directly Figures 17A to 17F The partition wall 52 process can also be performed after a flat layer PLN is formed on the common electrode layer 14. Figures 17A to 17F The material of the planar layer PLN can be an organic insulating material, an inorganic insulating material or a combination thereof.

[0232] like Fig. 14BAs shown, under vacuum working conditions, the compartment wall 52 of the micro-compartment structure 50 is filled with a colloidal solution in the chamber 54 defined by the compartment wall 52. The colloidal solution contains charged cyan particles 26C, charged magenta particles 26M, charged yellow particles 26Y, and charged white particles 26W. Fig. 14C , a control substrate 10 having a micro tenon 60 is prepared, and the control substrate 10 is fixed on the opposite substrate 12 by registering the micro tenon 60 with the groove chamber 54 defined by the partition wall 52, so that the two substrates are closely combined and the colloidal solution can be further filled in the entire groove chamber 54. More specifically, a driving circuit layer 30, such as the high aperture ratio driving circuit layer 30 of the present invention, is first grown on the control substrate 10; then a control electrode layer PEL is formed, and a micro tenon 60 is formed on the control electrode layer PEL. Furthermore, the details of the micro tenon 60 can be seen below.

[0233] 5. Micro-tenon

[0234] In the production process of electronic paper, filling electronic ink into microcups or encapsulating it in microcapsules is the part that has the greatest impact on the yield rate in the entire production process and is also the part with the highest investment in production equipment. Since electronic ink is made by mixing charged color particles with a colloidal solution, in order to achieve the ability to suspend particles, the density and viscosity of the colloidal solution must be increased. This will cause the colloidal solution to be filled into the microcup or microcompartment in the process of filling the microcup or microcompartment, due to the large surface tension and viscosity of the colloidal solution, it is not easy to fill the entire microcup or microcompartment, which will cause gaps at the bottom. This gap will cause image quality degradation, which is the key factor in the poor yield rate of electronic paper production. The use of the micro-tenon of the present invention can solve this problem. When the micro-tenon is inserted into the microcompartment, the colloidal solution is further squeezed into the microcompartment and fills the internal space of the microcompartment. The problem of gaps can be solved by adjusting the thickness of the micro-tenon to determine the extruded volume, which makes a great contribution to improving the production yield rate. In addition, the micro-tenons inserted into the micro-compartments can also block the entry of air. Therefore, after filling the colloidal solution in a vacuum, the frame glue can be used to fit the four sides of the panel instead of the optical glue bonding procedure, and the atmospheric pressure is used to press the two substrates with micro-compartments and micro-tenons together evenly and tightly. Even if there is air leakage due to defects in the frame glue, the air will be blocked by the micro-tenons and micro-compartments, and will not affect the pressing force of the substrate. The reduction of the thickness of the optical glue can reduce the distance between the charged color particles and the control electrode, increase the screen update speed and reduce the driving voltage. All these benefits are built on the ingenious design of this micro-tenon.

[0235] See also Fig.14F, the micro-tenon 60 can be exposed and developed with a photoresist, leaving the micro-tenon area and cleaning the rest; the micro-tenon can also be replaced by a color filter layer; in addition, the micro-tenon can also be made by using a flat layer (PLN) to leave the micro-tenon area through a lithography process. A certain gap S should be maintained between the micro-tenon 60 and the side wall of the slot chamber 54 of the micro compartment as an alignment margin. This gap S is, for example, a gap of 1 to 50 um. According to one embodiment of the present invention, this gap ranges from 1 to 5 um, depending on the accuracy of the mask alignment when the substrate is bonded, as the error tolerance range during alignment and bonding, to avoid the alignment and bonding due to errors causing the micro compartment and the micro-tenon to collide and be damaged. The thickness of the micro-tenon can be 0.5 to 50 um. The thicker the thickness, the more secure the seal can be, but it will affect the attraction or repulsion of the control electrode, so the sealing degree and the electrical effect need to be reasonably allocated. According to one embodiment of the present invention, the thickness of the micro-tenon 60 is also between 1 and 5 um.

[0236] See also Fig.14D , is a schematic diagram of manufacturing a micro-compartment structure 50 according to another embodiment of the present invention. In this embodiment, the micro-compartment structure 50 is manufactured after a conductive layer (such as a common electrode layer 14), and the conductive layer includes an insulating layer (not shown) for electrical isolation from the charged color particles. Fig.14D As shown, first, a common electrode layer 14 and an insulating layer are formed on the opposite substrate 12. The insulating layer can be made of silicon nitride material, silicon oxide material or a composite laminate of the two by deposition on the common electrode layer 14. Then, a photoresist and exposure and development process are used to form the partition wall 52 of the micro-compartment structure 50 on the common electrode layer 14 and the insulating layer. The process of forming the partition wall 52 can be as follows: Figures 17A to 17F The partition wall 52 process. Fig.14D As shown, a colloidal solution containing charged particles, such as a colloidal solution containing charged black particles 26B and charged white particles 26W, is filled between the compartment walls 52 of the micro-compartment structure 50. Fig.14D This embodiment further includes preparing a control substrate 10 having a micro tenon 60, and fixing the control substrate 10 on the counter substrate 12 by aligning the micro tenon 60 with the groove 54 defined by the partition wall 52, so as to achieve the combination of the two substrates. More specifically, a driving circuit layer 30, such as the high aperture ratio driving circuit layer 30 of the present invention, is first grown on the control substrate 10; then a control electrode layer PEL is formed, and a color filter layer CF is formed on the control electrode layer PEL. The micro tenon 60 is formed on the color filter layer CF. If the thickness of the color filter layer meets the requirements, the color filter layer can also be used as the micro tenon 60.

[0237] See also Fig.14F , micro-stuck can be exposed and developed with transparent photoresist, leaving the micro-stuck area and cleaning the rest; micro-stuck can be used with reference Fig.14D The color filter layer in the embodiment is used as a micro-tenon; in addition, the production of the micro-tenon can also use a flat layer (PLN) to leave a micro-tenon area through a photolithography process. A certain gap S should be maintained between the micro-tenon 60 and the side wall of the slot chamber 54 of the micro-compartment as an alignment margin. This gap S is, for example, a gap of 1 to 50 um. According to one embodiment of the present invention, this gap ranges from 1 to 5 um, which is determined in conjunction with the accuracy of the mask alignment, as an allowable error range during alignment and bonding to avoid damage to the micro-compartment and micro-tenon due to collision caused by errors in alignment and bonding. The thickness of the micro-tenon can be 0.5 to 50 um. The thicker the thickness, the more secure the seal can be, but it will affect the attraction or repulsion of the control electrode, so the sealing degree and the electrical effect need to be reasonably allocated. According to one embodiment of the present invention, the thickness of the micro-tenon 60 is also in the range of 1 to 5 um.

[0238] See also Fig.14E , is a schematic diagram of manufacturing a micro-compartment structure 50 according to another embodiment of the present invention. In this embodiment, the micro-compartment structure 50 is manufactured on a conductive layer (such as the common electrode layer 14). Fig.14E As shown, first, a common electrode layer 14 is formed on the counter substrate 12. Then, a color filter layer CF is formed on the common electrode layer 14, and then a partition wall 52 of the micro-compartment structure 50 is formed by using a transparent photoresist and an exposure and development process.

[0239] In this embodiment, the color filter layer CF can be directly Figures 17A to 17F The partition wall 52 process can also be performed after a flat layer PLN is formed on the color filter layer CF. Figures 17A to 17F The material of the planar layer PLN can be an organic insulating material, an inorganic insulating material or a combination thereof.

[0240] like Fig.14E As shown, a colloidal solution containing charged color particles, such as a colloidal solution containing charged black particles 26B and charged white particles 26W, is filled between the compartment walls 52 of the micro-compartment structure 50. Fig.14EThis embodiment further includes preparing a control substrate 10 having a micro tenon 60, and fixing the control substrate 10 on the counter substrate 12 by registering the micro tenon 60 with the groove chamber 54 defined by the partition wall 52, thereby achieving the combination of the two substrates. More specifically, a driving circuit layer 30, such as the high aperture ratio driving circuit layer 30 of the present invention, is first grown on the control substrate 10; then a control electrode layer PEL is formed, and the micro tenon 60 is formed on the control electrode layer PEL.

[0241] See also Fig.14F , the micro-tenon can be made of transparent photoresist through exposure and development, leaving the micro-tenon area and cleaning the rest; in addition, the micro-tenon can also be made by using a flat layer (PLN) through a lithography process to leave the micro-tenon area. A certain gap S should be maintained between the micro-tenon 60 and the side wall of the slot chamber 54 of the micro compartment as an alignment margin. This gap S is, for example, a gap of 1 to 50 um. According to one embodiment of the present invention, this gap ranges from 1 to 5 um, which is determined in conjunction with the accuracy of the mask alignment, as an allowable error range during alignment and bonding, to avoid alignment and bonding due to errors causing collision and damage between the micro compartment and the micro-tenon. The thickness of the micro-tenon can be 0.5 to 50 um. The thicker the thickness, the more secure the seal can be, but it will affect the attraction or repulsion of the control electrode, so the sealing degree and the electrical effect need to be reasonably allocated. According to one embodiment of the present invention, the thickness of the micro-tenon 60 is also in the range of 1 to 5 um.

[0242] In the above embodiment, the compartment wall 52 of the micro-compartment structure 50 can be made of a high-hardness polymer material, such as a polymer material with a hardness greater than 3H. Thus, the average wall thickness of the compartment wall 52 can be no greater than 5um while still maintaining sufficient support capacity. Figures 11A-11C , Figures 12A-12C , Figures 13A-13C , Figures 14A-14E However, those skilled in the art will appreciate that in these diagrams, the color filter layer CF may have the same Fig.18A The structure shown, that is, the color filter layer CF includes a plurality of filter color blocks (CFR, CFG, CFB) of different colors. The filter color blocks include a plurality of holes H, and the area of ​​at least one of the holes H is not greater than 100 square micrometers.

[0243] In addition, Figures 11A-11C , Figures 12A-12C , Figures 13A-13C , Figures 14A-14E The electrophoretic display 100 of the embodiment shown may have the following features: Figures 3A-3C , Figures 4A-4C and Figure 5A and5C The control electrode layer PEL and the driving circuit layer 30 are structured as shown to increase the aperture ratio of the electrophoretic display 100; in addition, the thin film transistor 32 and the gate channel width / length design can also be adopted as shown in FIG. Figure 6C The structure and gate channel width / length design of the thin film transistor 32 partially constructed on the gate line GL.

[0244] More specifically, in Figures 11A-11C , Figures 12A-12C , Figures 13A-13C , Figures 14A-14E In the electrophoretic display 100 of the embodiment shown, the control electrode layer PEL and the driving circuit layer 30 may be formed as follows: Figure 3B-3C , Figures 4A-4C , Figures 5A-5C In the structure shown, the driving circuit layer 30 further includes a plurality of storage capacitors Cs, and the driving circuit layer 30 further includes a plurality of common voltage lines Ve, which are respectively set up corresponding to the storage capacitors Cs and are substantially parallel to the gate lines GL or the data lines DL. According to one embodiment of the present invention, Figures 11A-11C , Figures 12A-12C , Figures 13A-13C , Figures 14A-14E In the electrophoretic display 100 of the embodiment shown, Fig.19 The structure shown in FIG. 1 electrically connects the common voltage line Ve to a display driver 200 or a display touch integrated driver 200. During the touch operation of the electrophoretic display 100, the display touch integrated driver 200 electrically connects multiple data lines DL together as a single touch transmitting electrode. The display touch integrated driver 200 electrically connects multiple common voltage lines Ve together as a single touch receiving electrode, or the above-mentioned touch transmitting electrode and touch receiving electrode can be swapped with each other.

[0245] 6. Translucent electrophoretic display

[0246] Electronic paper displays of known technology (such as electrophoretic displays) cannot use translucent display methods. Translucent displays can be used for information display on car windows, placed on display cabinet glass for product descriptions, on windows for exterior wall advertising, indoor painted glass, etc. Currently, the only technologies that can be used for translucent display methods are organic light emitting diodes (OLED) and micro light emitting diodes (micro LED), while traditional LCDs do not work well due to the need for backlighting. Electrophoretic displays of known technology cannot be used in the above scenarios because they are opaque, and both OLED and micro LED methods consume a lot of energy. More specifically, most of the area of ​​electrophoretic displays of known technology is used for the display of electronic ink, and the electronic ink contains a variety of charged color particles, resulting in the opaque state of electrophoretic displays of known technology.

[0247] The advantage of using electrophoretic displays as semi-transparent displays is that they can be used in outdoor display windows, car windows for external display (such as rear windshields, which can display messages to remind the following cars and advertisements), exterior wall advertisements on windows that can be seen inside the house, and light-transmitting indoor stained glass. The advantage of using electrophoretic displays that do not consume electricity is the best choice in the current energy shortage.

[0248] See also Fig.15A, which is a top view of a semi-transparent semi-dual-color electrophoretic display manufactured according to the present invention. According to the present invention, when manufacturing a transparent two-color electrophoretic display, a micro-compartment structure 50 having a plurality of compartment walls 52 is manufactured on the control substrate 10, or the micro-compartment structure 50 is manufactured after the color filter layer is completed, or the micro-compartment structure 50 is manufactured after the conductive substrate is completed. The compartment walls 52 of the micro-compartment structure 50 can be manufactured into a rectangular structure close to a color pixel or a square structure of a black and white pixel, and can be matched with the boundary of the pixel without affecting the display. According to the present invention, for example, a mask can be used to develop a pattern of a transparent photoresist to manufacture a transparent micro-compartment wall. The material of the transparent photoresist can be made of a material with a higher hardness (such as a photoresist made of acrylic material). Transparent photoresist is used to make the partition wall 52 of the micro-compartment structure 50. Since there are no charged color particles on the wall of the micro-compartment, the scene on the back of the display can be penetrated on the display. By increasing the thickness of the partition wall 52 to increase the transparent area, the transparent part of the transparent two-color electrophoretic display can be increased (from the perspective of the operating surface). The light transmittance of transparent photoresist is very high, greater than 90%. This micro-compartment structure 50 with high light transmittance is combined with the control substrate 10 of the present invention that is equipped with a high-aperture driving circuit layer 30, and then combined with the relative substrate 12 with a transparent conductive layer, a translucent electrophoretic display 100 can be made. The degree of transparency of this translucent electrophoretic display 100 depends on the ratio of the area of ​​the micro-compartment container (opaque area containing electronic ink) to the entire display surface. The area of ​​the micro-compartment container containing electronic ink (colloidal solution containing charged color particles) is the opaque area, and the rest of the area is the transparent area. In other words, Fig.15A The inner gray areas are all compartment walls 52 of the micro compartments, which are transparent areas, and the remaining areas are opaque areas filled with electronic ink.

[0249] refer to Fig. 15B , is a cross-sectional view of a semi-transparent two-color electrophoretic display 100 manufactured according to an embodiment of the present invention. To achieve the level of transparency on both sides of the electrophoretic display, a control substrate 10 with a high aperture ratio driving circuit layer 30 of the present invention is used, and a transparent opposite substrate 12 with a transparent conductive layer is used. In addition, the transparent two-color electrophoretic display 100 is Figures 17A to 17F The cell wall 52 is processed by increasing the thickness of the cell wall to increase transparency. According to one embodiment of the present invention, the total area of ​​the wall thickness of the micro-cell cell wall 52 is not less than 10% of the entire display area of ​​the electrophoretic display 100. According to another embodiment of the present invention, the total area of ​​the wall thickness of the micro-cell cell wall 52 is not less than 35% of the entire display area of ​​the electrophoretic display 100. Fig. 15BAs shown, the semi-transparent two-color electrophoretic display 100 comprises from top to bottom a relative substrate 12 (i.e., a second substrate, which may be, for example, a transparent plastic substrate or a glass substrate), a common electrode layer 14 (which may be, for example, a transparent conductive electrode layer), an electrophoretic layer 20a, a control electrode layer PEL, a high aperture ratio driving circuit layer 30 (hereinafter referred to as the driving circuit layer 30) and a control substrate 10 (which may be, for example, a glass substrate). In addition, as Fig. 15B As shown, the electrophoretic layer 20a includes a micro-compartment structure 50 formed by a plurality of partition walls 52, and the partition walls 52 define a plurality of slots 54 (two slots 54 are shown in the figure), and a colloidal solution 24 containing a plurality of charged color particles (e.g., charged black particles 26B and charged white particles 26W) filled in each slot 54. According to one embodiment of the present invention, the material of the first electrode CE1 / second electrode CE2 of the storage capacitor Cs in the high aperture ratio driving circuit layer 30 is a transparent conductive material, so as to increase the aperture ratio of the electrophoretic display 100. In addition, it is more helpful for the user to watch the electrophoretic display 100 from the control substrate 10 side, so that the control electrode layer PEL close to the viewing side can attract the required charged black particles 26B and charged white particles 26W, so as to achieve a faster screen refresh rate. Fig. 15B The driving circuit layer 30 shown may be composed of Figure 3B-3C , Figures 4A-4C , Figures 5A-5C The driving circuit layer 30 shown is implemented.

[0250] refer to Fig. 15C , is a cross-sectional view of a semi-transparent color electrophoretic display 100 according to another embodiment of the present invention. This embodiment can display a color image on one side and a black and white image on the other side. First, a color filter layer CF is formed on a control substrate 10 having a transparent control electrode layer PEL and a high aperture ratio driving circuit layer 30, and then Figures 17A to 17F The partition wall 52 is then filled with a colloidal solution containing two-color charged particles 26 (e.g., charged black particles 26B and charged white particles 26W). Then, a transparent opposing substrate 12 (second substrate) is bonded to the transparent common electrode layer 14. Similarly, Fig. 15C In the electrophoretic display 100 shown, the cell walls 52 of the micro-cells are made of transparent photoresist, and the wall thickness of the cell walls is increased to increase transparency. According to one embodiment of the present invention, the total area of ​​the wall thickness of the cell walls 52 of the micro-cells is not less than 10% of the entire display area of ​​the electrophoretic display 100. According to another embodiment of the present invention, the total area of ​​the wall thickness of the cell walls 52 of the micro-cells is not less than 35% of the entire display area of ​​the electrophoretic display 100. Fig. 15CAs shown, the semi-transparent color electrophoretic display 100 comprises, from top to bottom, a relative substrate 12 (e.g., a transparent plastic substrate or a glass substrate), a common electrode layer 14 (e.g., a transparent conductive electrode layer), an electrophoretic layer 20a, a color filter layer CF, a control electrode layer PEL, a high aperture ratio driving circuit layer 30 (hereinafter referred to as the driving circuit layer 30) and a control substrate 10 (e.g., a glass substrate). In addition, as Fig. 15C As shown, the electrophoretic layer 20a includes a micro-compartment structure 50 formed by a plurality of partition walls 52, and the partition walls 52 define a plurality of slots 54 (two slots 54 are shown in the figure), and a colloidal solution 24 containing a plurality of charged color particles (e.g., charged black particles 26B and charged white particles 26W) is filled in each slot 54. According to one embodiment of the present invention, the material of the first electrode CE1 / second electrode CE2 of the storage capacitor Cs in the high aperture ratio driving circuit layer 30 is a transparent conductive material, so as to increase the aperture ratio of the electrophoretic display 100. In addition, it is more helpful for users to watch the electrophoretic display 100 from the control substrate 10 side, so that the control electrode layer PEL close to the viewing side can attract the required charged black particles 26B and charged white particles 26W, and achieve a faster screen refresh rate and other creative features. Fig. 15C The driving circuit layer 30 shown may be composed of Figure 3B-3C , Figures 4A-4C , Figures 5A-5C The driving circuit layer 30 shown is implemented.

[0251] refer to Fig.15D , is a cross-sectional view of a semi-transparent color electrophoretic display 100 according to another embodiment of the present invention. The electrophoretic display 100 first manufactures a control substrate 10 having a transparent control electrode layer PEL and a high aperture ratio driving circuit layer 30, and then uses a polymer material (such as a transparent photoresist material) to Figures 17A to 17F The partition wall 52 is then filled with a colloidal solution containing two-color charged particles 26 (e.g., charged black particles 26B and charged white particles 26W). Then, a transparent counter substrate 12 is bonded to a transparent common electrode layer 14. The transparent counter substrate 12 is further provided with a color filter layer CF and micro tenons 60 located on the common electrode layer 14. Fig.14F, the micro-tenon 60 can be made of transparent photoresist, after exposure and development, leaving the micro-tenon area and cleaning the rest; in addition, the micro-tenon can also be made by using a flat layer (PLN) through a lithography process to leave the micro-tenon area. A certain gap S should be maintained between the micro-tenon 60 and the side wall of the slot chamber 54 of the micro-compartment structure 50 as an alignment margin. This gap S is, for example, a gap of 1 to 50 um. According to one embodiment of the present invention, this gap ranges from 1 to 5 um, depending on the accuracy of the mask alignment when the substrate is bonded, as the error tolerance range during alignment and bonding, to avoid the alignment and bonding due to errors causing the micro-compartment and micro-tenon to collide and be damaged. The thickness of the micro-tenon can be 0.5 to 50 um. The thicker the thickness, the more secure the seal can be, but it will affect the attraction or repulsion of the control electrode, so the sealing degree and the electrical effect need to be reasonably allocated. According to one embodiment of the present invention, the thickness of the micro-tenon 60 also ranges from 1 to 5 um.

[0252] Likewise, Fig.15D In the electrophoretic display 100 shown, the cell walls 52 of the micro-cells are made of transparent photoresist, and the wall thickness of the cell walls is increased to increase transparency. According to one embodiment of the present invention, the total area of ​​the wall thickness of the cell walls 52 of the micro-cells is not less than 10% of the entire display area of ​​the electrophoretic display 100. According to another embodiment of the present invention, the total area of ​​the wall thickness of the cell walls 52 of the micro-cells is not less than 35% of the entire display area of ​​the electrophoretic display 100. Fig.15D As shown, the transparent two-color electrophoretic display 100 includes, from top to bottom, a relative substrate 12 (e.g., a transparent plastic substrate or a glass substrate), a common electrode layer 14 (e.g., a transparent conductive electrode layer), a color filter layer CF, a micro-clamp 60, an electrophoretic layer 20a, a control electrode layer PEL, a high aperture ratio driving circuit layer 30 (hereinafter referred to as the driving circuit layer 30) and a control substrate 10 (e.g., a glass substrate). In addition, as Fig.15DAs shown, the electrophoretic layer 20a includes a micro-compartment structure 50 formed by a plurality of partition walls 52, and the partition walls 52 define a plurality of slots 54 (two slots 54 are shown in the figure), and a colloidal solution 24 containing a plurality of charged color particles (e.g., charged black particles 26B and charged white particles 26W) filled in each slot 54. In addition, the counter substrate 12 further includes a color filter layer CF and a micro tenon 60 located on the common electrode layer 14 and facing the electrophoretic layer 20a. The micro tenon 60 is suitable for being embedded in the corresponding slot 54 of the micro-compartment structure 50. According to one embodiment of the present invention, the material of the first electrode CE1 / the second electrode CE2 of the storage capacitor Cs in the high aperture ratio driving circuit layer 30 is selected from transparent conductive materials to improve the aperture ratio of the electrophoretic display 100. In addition, it is more helpful for the user to watch the electrophoretic display 100 from the control substrate 10 side, so that the control electrode layer PEL close to the viewing side can attract the required charged black particles 26B and charged white particles 26W, thereby achieving a faster screen refresh rate. Fig.15D The driving circuit layer 30 shown may be composed of Figure 3B-3C , Figures 4A-4C , Figures 5A-5C The driving circuit layer 30 shown is implemented.

[0253] refer to Fig.16A , is a cross-sectional view of a semi-transparent dual-color double-sided electrophoretic display 100 manufactured according to another embodiment of the present invention. The electrophoretic display 100 can display different images on both sides. The structure of this embodiment is similar to Fig. 15B The structure shown in the figure is different from the structure shown in the figure, but the relative substrate 12 is replaced by a second control substrate 10U, which is also a transparent substrate and is combined with the first control substrate 10D by embedding the micro-clamp 60 into the corresponding groove chamber 54 of the micro-compartment structure 50. Furthermore, the second control substrate 10U also has a high aperture ratio driving circuit layer (second driving circuit layer) 30U on the top and a control electrode layer (second control electrode layer) PELU on the top, and the second control electrode layer PELU has a plurality of second control electrodes PEU. Furthermore, the first control substrate 10D has a high aperture ratio driving circuit layer (first control electrode layer) 30D on the bottom and a control electrode layer (first control electrode layer) PELD on the bottom, and the first control electrode layer PELD has a plurality of first control electrodes PED.

[0254] Similarly, the micro-tenon 60 can be made of transparent photoresist, and after exposure and development, the micro-tenon area is left, and the rest is cleaned; in addition, the micro-tenon can also be made by using a flat layer (PLN) through a lithography process to leave the micro-tenon area. A certain gap S should be maintained between the micro-tenon 60 and the side wall of the slot chamber 54 of the micro-compartment structure 50 as an alignment margin. This gap S is, for example, a gap of 1 to 50um. According to one embodiment of the present invention, this gap ranges from 1 to 5um, depending on the accuracy of the mask alignment when the substrate is bonded, as an allowable error range during alignment and bonding, to avoid alignment and bonding due to errors causing collision and damage between the micro-compartment and the micro-tenon. The thickness of the micro-tenon can be 0.5 to 50um. The thicker the thickness, the more secure the seal can be, but it will affect the attraction or repulsion of the control electrode, so the sealing degree and the electrical effect need to be reasonably allocated. According to one embodiment of the present invention, the thickness of the micro-tenon 60 is also between 1 and 5um.

[0255] exist Fig.16A In the electrophoretic display 100 shown, a transparent photoresist is used for Figures 17A to 17F The partition wall 52 is processed by the process of forming the partition wall 52, and the thickness of the partition wall is increased to increase transparency. According to one embodiment of the present invention, the total area of ​​the thickness of the partition wall 52 of the micro-compartment is not less than 10% of the entire display area of ​​the electrophoretic display 100. According to another embodiment of the present invention, the total area of ​​the thickness of the partition wall 52 of the micro-compartment is not less than 35% of the entire display area of ​​the electrophoretic display 100. According to one embodiment of the present invention, the material of the first electrode CE1 / second electrode CE2 of the storage capacitor Cs in the high aperture ratio driving circuit layer 30U and 30D is selected from a transparent conductive material to increase the aperture ratio of the electrophoretic display 100. In addition, it is more helpful for the user to watch the electrophoretic display 100 from the first control substrate 10D and the second control substrate 10U side, so that the control electrode layers PELU and PELD close to the viewing side attract the required charged black particles 26B and charged white particles 26W, thereby achieving a faster screen update rate. Fig.16A The driving circuit layers 30U and 30D shown in the figure may be, for example, Figure 3B-3C , Figures 4A-4C , Figures 5A-5C Furthermore, the control electrode layer PELU and the control electrode layer PELD may also correspond to Figure 3B-3C , Figures 4A-4C , Figures 5A-5C The control electrode layer PEL shown is implemented.

[0256] Complex matching reference Fig.16AWhen the upper high aperture ratio second driving circuit layer 30U controls the electrode (second control electrode PEU) at the second control substrate 10U to be negatively charged, and the lower high aperture ratio first driving circuit layer 30D controls the corresponding electrode (first control electrode PED) of the first control substrate 10D to be positively charged, the positively charged black particles 26B will move to the upper second control electrode PEU, so that the upper electrode position displays black pixels; the negatively charged white particles 26W will move to the lower first control electrode PED, so that the lower first control electrode PED position displays white pixels. When the polarity of the upper and lower electrodes is swapped, the color of the displayed pixel will also be swapped.

[0257] refer to Fig. 16B ,correspond Fig.16A In the structure, when the upper and lower electrodes (the upper second control electrode PEU and the corresponding lower first control electrode PED) are of the same polarity, for example, when both are positively charged, the negatively charged white particles 26W will move to the upper and lower electrodes, allowing the upper and lower electrodes to display white pixels, and the positively charged black particles 26B will move to the middle and be blocked by the white particles 26W. On the contrary, when both the upper and lower electrodes are negatively charged, the positively charged black particles 26B will move to the upper and lower electrodes, and the white particles 26W will move to the middle and be blocked by the black particles 26B and cannot be seen. At this time, the upper and lower electrodes display black pixels.

[0258] refer to Fig. 16C , is a cross-sectional view of a semi-transparent color double-sided display electrophoretic display 100 according to another embodiment of the present invention. The electrophoretic display 100 can display different color images on both sides. The electrophoretic display 100 firstly forms a first color filter layer CF-1 on a first control substrate 10D having a transparent first control electrode layer PELD (having a first control electrode PED) and a first driving circuit layer 30D with a high aperture ratio below, and then uses a transparent photoresist to Figures 17A to 17F The partition wall 52 is then filled with a colloidal solution containing two-color charged particles 26 (e.g., charged black particles 26B and charged white particles 26W). Then, a transparent second control substrate 10U having a micro-tenon 60 is pressed and manufactured. Fig. 16C The transparent second control substrate 10U also has a high aperture ratio second driving circuit layer 30U on the top, a transparent second control electrode layer PELU (having a second control electrode PEU) and a second color filter layer CF-2 formed on the transparent second control electrode layer PELU.

[0259] See also Fig.14F, the micro-tenon 60 can be made of transparent photoresist, and after exposure and development, the micro-tenon area is left, and the rest is washed away; in addition, the micro-tenon can also be made by using a flat layer (PLN) through a lithography process to leave the micro-tenon area. A certain gap S should be maintained between the micro-tenon 60 and the side wall of the slot chamber 54 of the micro-compartment structure 50 as an alignment margin. This gap S is, for example, a gap of 1 to 50um. According to one embodiment of the present invention, this gap ranges from 1 to 5um, which is determined in conjunction with the accuracy of the mask alignment, as an allowable error range during alignment and bonding, to avoid alignment and bonding due to errors causing collision and damage between the micro-compartment and the micro-tenon. The thickness of the micro-tenon can be 0.5 to 50um. The thicker the thickness, the more secure the seal can be, but it will affect the attraction or repulsion of the control electrode, so the sealing degree and the electrical effect need to be reasonably allocated. According to one embodiment of the present invention, the thickness of the micro-tenon 60 is also in the range of 1 to 5um.

[0260] exist Fig. 16C In the electrophoretic display 100 shown, the partition walls 52 of the micro-compartments are made of transparent photoresist, and the thickness of the partition walls is increased to increase transparency. According to one embodiment of the present invention, the total area of ​​the thickness of the partition walls 52 of the micro-compartments is not less than 10% of the entire display area of ​​the electrophoretic display 100. According to another embodiment of the present invention, the total area of ​​the thickness of the partition walls 52 of the micro-compartments is not less than 35% of the entire display area of ​​the electrophoretic display 100. According to one embodiment of the present invention, the material of the first electrode CE1 / second electrode CE2 of the storage capacitor Cs in the high aperture ratio driving circuit layer 30U and 30D is selected from a transparent conductive material to increase the aperture ratio of the electrophoretic display 100. In addition, it is more helpful for users to watch the electrophoretic display 100 from the first control substrate 10D and the second control substrate 10U side, so that the control electrode layers PELU and PELD close to the viewing side attract the required charged black particles 26B and charged white particles 26W, achieving a faster screen update rate and other creative ideas. Fig. 16C The driving circuit layers 30U and 30D shown in the figure may be, for example, Figure 3B-3C , Figures 4A-4C , Figures 5A-5C Furthermore, the control electrode layer PELU and the control electrode layer PELD may also correspond to Figure 3B-3C , Figures 4A-4C , Figures 5A-5C The control electrode layer PEL shown is implemented.

[0261] refer to Fig.16D , is a cross-sectional view of a semi-transparent double-sided display electrophoretic display 100 according to another embodiment of the present invention. The electrophoretic display 100 can display color on one side and black and white on the other side. The electrophoretic display 100 of this embodiment is similar to Fig. 16CThe electrophoretic display shown in the figure does not have a color filter layer on the second control substrate 10U side, so that a black and white image can be displayed on the second control substrate 10U side, and a color image can be displayed on the first control substrate 10D. Similarly, the second control substrate 10U has a micro-cage 60 formed thereon, and the first control substrate 10D has a micro-compartment structure 50 (with a groove chamber 54) formed thereon. Similarly, it is also within the scope of the present invention to form the micro-compartment structure 50 on the second control substrate 10U and the micro-cage 60 on the first control substrate 10D, and the second control substrate 10U is combined with the first control substrate 10D by inserting the micro-cage 60 into the corresponding groove chamber 54 of the micro-compartment structure 50. Or, the first control substrate 10D is combined with the second control substrate 10U by inserting the micro-cage 60 into the corresponding groove chamber 54 of the micro-compartment structure 50. The micro-tenon 60 can be made by using transparent photoresist through exposure and development; in addition, the micro-tenon can also be made by using a flat layer (PLN) through a lithography process to leave a micro-tenon area. A certain gap S should be maintained between the micro-tenon 60 and the side wall of the slot chamber 54 of the micro-compartment structure 50 as an alignment margin. This gap S is, for example, a gap of 1 to 50 um. According to one embodiment of the present invention, this gap ranges from 1 to 5 um, depending on the accuracy of the alignment, as an allowable error range during the alignment and bonding of the mask, to avoid damage to the micro-compartment and the micro-tenon due to the alignment error. The thickness of the micro-tenon can be 0.5 to 50 um. The thicker the thickness, the more secure the seal can be, but it will affect the attraction or repulsion of the control electrode, so the sealing degree and the electrical effect need to be reasonably allocated. According to one embodiment of the present invention, the thickness of the micro-tenon 60 also ranges from 1 to 5 um.

[0262] exist Fig.16D In the electrophoretic display 100 shown, the partition walls 52 of the micro-compartments are made of transparent photoresist, and the thickness of the partition walls is increased to increase transparency. According to one embodiment of the present invention, the total area of ​​the thickness of the partition walls 52 of the micro-compartments is not less than 10% of the entire display area of ​​the electrophoretic display 100. According to another embodiment of the present invention, the total area of ​​the thickness of the partition walls 52 of the micro-compartments is not less than 35% of the entire display area of ​​the electrophoretic display 100. According to one embodiment of the present invention, the material of the first electrode CE1 / second electrode CE2 of the storage capacitor Cs in the high aperture ratio driving circuit layer 30U and 30D is selected from a transparent conductive material to increase the aperture ratio of the electrophoretic display 100. In addition, it is more helpful for the user to view the electrophoretic display 100 from the first control substrate 10D and the second control substrate 10U side, so that the control electrode layers PELU and PELD close to the viewing side attract the required charged black particles 26B and charged white particles 26W, thereby achieving a faster screen update rate. Fig.16D The driving circuit layers 30U and 30D shown in the figure may be, for example, Figure 3B-3C , Figures 4A-4C , Figures 5A-5C Furthermore, the control electrode layer PELU and the control electrode layer PELD may also correspond to Figure 3B-3C , Figures 4A-4C , Figures 5A-5C The control electrode layer PEL shown is implemented.

[0263] 7. Color filter layer with holes

[0264] like Fig. 7A As shown, when the electronic paper display uses a color filter layer to display a color image, the light will be lost once when it enters the color filter layer, and will be lost again after being reflected. The two light losses will cause the visible brightness to decrease. In addition, due to the distance between the color filter layer and the reflective particles, the color area where the incident light enters is different from the color area where it is reflected. After being filtered by different colors, almost no light penetrates and is completely absorbed, causing the visible brightness to decrease again.

[0265] See also Fig.18A According to an embodiment of the present invention, a plurality of holes H may be respectively provided on the filter color blocks of the color filter layer CF, such as the red filter color block CFR, the green filter color block CFG, and the blue filter color block CFB. According to one embodiment, the area of ​​at least one hole H is not greater than 100 square microns, or the area of ​​most of the holes H is not greater than 100 square microns. In addition, according to another embodiment, the total area of ​​the holes H in the same color is not less than 10% of the total area of ​​the color. For example, for the red filter color block CFR, the total area of ​​the holes H within its range is not less than 10% of the total area of ​​the red filter color block CFR. By providing the holes H and planning their individual areas and the total area, the light loss of the color filter layer CF can be reduced.

[0266] See also Fig.18BWhen the incident light L2 enters a colored area (such as the red filter color block CFR) and the reflected light is also in a colored area (such as the red filter color block CFR), the light has been filtered twice, so the attenuation is higher. When the incident light L1 enters a colored area (such as the red filter color block CFR) and the reflected light is in a colorless area (such as the corresponding hole H), the light has only been filtered once, so the attenuation is lower. If the incident light enters a colorless area (such as the corresponding hole H) and the reflected light is in a colored area (such as the red filter color block CFR), the light has been filtered once, so the attenuation is lower. If both the incident light and the reflected light are in a colorless area (such as the corresponding hole H), there is no filtering attenuation, but the color that comes out is the color of the charged color particles 26. However, the probability of the above situation is the lowest, and it will only occur near the vertical incident angle or the light incident at a special angle. Using the color filter layer CF with the hole H of the present invention can improve the color saturation and brightness, which is of great help to the color display of the electronic paper.

[0267] The color filter layer CF having the hole H can be used in a conventional electrophoretic display 100, for example. Figure 2A The electrophoretic display 100 shown in the figure can also be applied to the Figure 3B-3C , Figures 4A-4C , Figures 5A-5C The color electrophoretic display 100 with a driving circuit layer 30 having a high aperture ratio as shown in the figure can also be applied to the color electrophoretic display 100 with a driving circuit layer 30 having the present invention. Figure 6C The color electrophoretic display 100 of the thin film transistor with improved aperture ratio can also be applied to the present invention. Figure 7B-7C , Figures 8A-8B The color filter layer CF shown is in the color electrophoretic display 100 close to the control substrate side; it can also be applied to the present invention. Figures 12A-12C , Figures 13A-13C , Fig.14D and Fig.14E The color electrophoretic display 100 having the micro-compartment structure 50 shown in the figure can also be applied to the present invention. Figures 15C-15D , Figures 16C-16D In the color semi-transparent electrophoretic display 100 shown in the figure, the color filter layer CF used in the above various embodiments and combinations thereof are all within the protection scope of the present invention.

[0268] 8. Electrophoretic display with built-in touch

[0269] See also Fig.19 , is a schematic diagram of an embedded touch control of an electrophoretic display 100 according to the present invention. Figure 4A and Figure 4B Examples of Figure 4BAs shown, the common voltage line Ve of the transparent conductive electrode ITO1 (CE2) used to provide the second electrode of the storage capacitor Cs extends in a direction substantially parallel to the gate line GL. Furthermore, the data line DL made of the second metal layer M2 is substantially perpendicular to the common voltage line Ve, and an insulating layer is sandwiched between the first electrode and the second electrode of the storage capacitor Cs, wherein the insulating layer between the data lines and the common voltage lines is in the same layer as an insulating layer of the storage capacitors (for example, the insulating layer CI of the storage capacitor Cs, or the insulating layer of the thin film transistor 32 or its extension). Therefore, the data line DL and the common voltage line Ve made of transparent conductive material can provide a mutual capacitance touch sensing structure, so that the electrophoretic display 100 has an embedded touch function. See also Fig.19 , a plurality of common voltage lines Ve along the gate line GL are extended to the peripheral position of the display surface of the electrophoretic display 100, and then connected together in groups in more than one manner inside or outside a display touch integrated driver 200 (TDDI). The following example uses four common voltage lines Ve that can be electrically connected into a group for illustration. However, according to other feasible embodiments of the present invention, other numbers of common voltage lines Ve can also be electrically connected into a group, so the following examples of the present invention are only for illustration and are not intended to limit the scope of the present invention. For example, assuming that there are 4M common voltage lines Ve, and every four common voltage lines Ve are electrically connected to each other as a group, there are a total of M groups of touch receiving electrodes (Rx), and they are respectively electrically connected to the display touch integrated driver 200 (TDDI). In other words, according to one embodiment of the present invention, there are 4M common voltage lines Ve electrically connected to the display touch integrated driver 200 (TDDI), and inside the display touch integrated driver 200 (TDDI), four common voltage lines Ve are electrically connected together as a group by a plurality of switches to form M groups of touch receiving electrodes (Rx). Furthermore, according to another embodiment of the present invention, there are 4M common voltage lines Ve, and four common voltage lines Ve are electrically connected together to form M groups of touch receiving electrodes (Rx). The M groups of touch receiving electrodes (Rx) are then electrically connected to the display touch integrated driver 200 (TDDI).

[0270] Furthermore, after the data lines DL enter the display touch integrated driver 200 (TDDI) from the electrophoretic display 100, they are connected together in groups greater than one by using a switching switch. The following example uses four data lines DL that can be electrically connected into a group for illustration. However, according to other feasible implementations of the present invention, other numbers of data lines DL can also be electrically connected into a group, so the following examples of the present invention are only for illustration and are not used to limit the scope of the present invention. For example, assuming that there are 4N data lines DL, and after the 4N data lines DL are electrically connected to the display touch integrated driver 200 (TDDI), every four data lines DL can be selectively electrically connected as a group in the display touch integrated driver 200 (TDDI) to form N groups of touch transmitting electrodes (Tx). In addition, the above-mentioned selective electrical connection specifically means that the display touch integrated driver 200 (TDDI) can selectively electrically connect every four data lines DL as a group according to the required operation, or selectively disconnect the electrical connection of these four data lines DL. By using the above-mentioned architecture, an in-cell touch structure with a resolution of MxN can be provided in an electrophoretic display.

[0271] In the screen display stage of the electrophoretic display 100, M groups of touch receiving electrodes (Rx) are electrically connected together inside the display touch integrated driver 200 (TDDI) to be used as a common voltage line Ve (i.e., to provide Vcom), and the display touch integrated driver 200 (TDDI) controls all 4N data lines DL to be separated as control signals for outputting the screen. In the touch stage, the M groups of touch receiving electrodes (Rx) are respectively used as input signal terminals for touch, that is, the display touch integrated driver 200 (TDDI) connects and receives these common voltage lines Ve in groups, and then sends them to a touch sensing circuit for subsequent processing. Furthermore, the display touch integrated driver 200 (TDDI) controls the 4N data lines DL so that every four data lines DL are electrically connected as a group to provide N groups of touch transmitting electrodes (Tx) and a touch driving circuit provides a transmitting signal, thereby forming an MxN embedded touch structure. In addition, the touch driver integrated circuit and the display driver integrated circuit are integrated into a touch display integrated driver 200 (TDDI) to simplify the structure of the electrophoretic display 100 in providing touch control and image display.

[0272] According to another embodiment of the present invention, the 4M common voltage lines Ve can also constitute M groups of touch transmitting electrodes (Tx). Conversely, the 4N data lines DL can also constitute N groups of touch receiving electrodes (Rx). For example, after the 4N data lines DL are electrically connected to the display touch integrated driver 200 (TDDI), every four data lines DL can be selectively electrically connected as a group in the display touch integrated driver 200 (TDDI) to constitute N groups of touch receiving electrodes (Rx). In the picture display stage of the electrophoretic display 100, the M groups of touch transmitting electrodes (Tx) are electrically connected together inside the display touch integrated driver 200 (TDDI) to be used as the common voltage line Ve (that is, to provide Vcom), and the display touch integrated driver 200 (TDDI) controls all the 4N data lines DL to be separated as the control signal for outputting the picture. In the touch stage, a touch driving circuit provides a transmission signal to the M groups of touch transmitting electrodes (Tx). Furthermore, the display touch integrated driver 200 (TDDI) controls 4N data lines DL so that every four data lines DL are electrically connected as a group to provide N groups of touch receiving electrodes (Rx), that is, after the display touch integrated driver 200 (TDDI) groups and connects and receives these data lines, they are sent to a touch sensing circuit for subsequent processing, thereby providing an MxN embedded touch structure. In addition, integrating the touch driver integrated circuit and the display driver integrated circuit into a display touch integrated driver 200 (TDDI) (Touch with Display Driver) can simplify the architecture of the electrophoretic display 100 when providing touch and screen display. In addition, the display touch integrated driver 200 can also make the touch sensing circuit and driving circuit on other chips, which is also within the scope of the present invention.

[0273] Integrating the above description, when performing a touch operation, the display touch integrated driver electrically connects multiple data lines together as a single touch transmitting electrode; the display touch integrated driver electrically connects multiple common voltage lines together as a single touch receiving electrode. Alternatively, when performing a touch operation, the display touch integrated driver electrically connects multiple data lines together as a single touch receiving electrode; the display touch integrated driver electrically connects multiple common voltage lines together as a single touch transmitting electrode. Both of the above methods are within the scope of the present invention.

[0274] In the above description, although 4M common voltage lines Ve are used as an example, and every four common voltage lines Ve are electrically connected to each other as a group to form M groups of touch receiving electrodes (Rx) or M groups of touch transmitting electrodes (Tx) for illustration, the above example should not be limited to the scope of the present invention, and those skilled in the art can design so that different numbers (at least greater than one) of common voltage lines Ve are electrically connected to each other as a group. Furthermore, in the above description, although 4N data lines DL are used as an example, and every four data lines DL are electrically connected to each other as a group to form N groups of touch transmitting electrodes (Tx) or N groups of touch receiving electrodes (Rx) for illustration, the above example should not be limited to the scope of the present invention, and those skilled in the art can design so that different numbers (at least greater than one) of data lines DL are electrically connected to each other as a group during touch operation.

[0275] have Fig.19 The in-cell touch electrophoretic display may have a Figure 3B-3C , Figures 4A-4C , Figures 5A-5C The structure of the driving circuit layer 30 and the control electrode layer PEL with high aperture ratio is shown. Fig.19 The electrophoretic display with in-cell touch can have Figures 11A-11C , Figures 12A-12C , Figures 13A-13C , Figure 14A-14E The micro compartment structure 50 and the corresponding micro latch 60 are shown.

[0276] 9. Electrophoretic display with double-sided control substrate

[0277] like Fig. 20AFIG. 1 shows an electrophoretic display with a double-sided control substrate according to an embodiment of the present invention. The electrophoretic display 100 with a double-sided control substrate has, from top to bottom, a second control substrate 10U, a micro-compartment structure 50, and a first control substrate 10D. Furthermore, the first control substrate 10D has a first surface and a second surface close to the micro-compartment structure 50, and a first high-aperture driving circuit layer 30D and a first control electrode layer PELD (having a plurality of first control electrodes PED) are provided on the second surface of the first control substrate 10D. The second control substrate 10U has a fourth surface and a third surface close to the micro-compartment structure 50, and a second high-aperture driving circuit layer 30U and a second control electrode layer PELU (having a plurality of second control electrodes PEU) are provided on the third surface of the second control substrate 10U. According to an embodiment of the present invention, when manufacturing the electrophoretic display 100 with a double-sided control substrate, a micro-compartment structure 50 with a plurality of compartment walls 52 is manufactured on the side of the first control substrate 10D. In more detail, first, the first driving circuit layer 30D, the first transparent control electrode layer PELD and the insulating protection layer (not shown) are fabricated on the first control substrate 10D, and then the color filter layer CF is fabricated. Figures 17A to 17F The partition wall 52 process can also be performed after a flat layer PLN is formed on the color filter layer CF. Figures 17A to 17F The partition wall 52 is formed in a process. The material of the flat layer PLN can be an organic insulating material, an inorganic insulating material or a combination thereof. After the partition wall 52 is formed, a colloidal solution containing charged black particles 26B and charged white particles 26W can be filled into the chamber 54 defined by the partition wall 52 under vacuum working conditions. Then, a second control substrate 10U is attached, that is, a second control substrate 10U having a second high aperture ratio driving circuit layer 30U and a second control electrode layer PELU is provided. In addition, Fig. 20A The second control electrode layer PELU is provided with a micro-tenon 60 corresponding to the shape of the groove chamber 54 .

[0278] See also Fig.14F, the micro-tenon 60 can be made of transparent photoresist, and after exposure and development, the micro-tenon area is left, and the rest is washed away; in addition, the micro-tenon can also be made by using a flat layer (PLN) through a lithography process to leave the micro-tenon area. A certain gap S should be maintained between the micro-tenon 60 and the side wall of the slot chamber 54 of the micro-compartment structure 50 as an alignment margin. This gap S is, for example, a gap of 1 to 50um. According to one embodiment of the present invention, this gap ranges from 1 to 5um, which is determined in conjunction with the accuracy of the mask alignment, as an allowable error range during alignment and bonding, to avoid alignment and bonding due to errors causing collision and damage between the micro-compartment and the micro-tenon. The thickness of the micro-tenon can be 0.5 to 50um. The thicker the thickness, the more secure the seal can be, but it will affect the attraction or repulsion of the control electrode, so the sealing degree and the electrical effect need to be reasonably allocated. According to one embodiment of the present invention, the thickness of the micro-tenon 60 is also in the range of 1 to 5um.

[0279] like Fig. 20AAs shown, by applying voltages of different polarities to the first control electrode PED and the second control electrode PEU during driving, the movement of charged particles can be accelerated, and the clustering phenomenon caused by the aggregation of positive and negative charged particles can be dissociated, so as to speed up the update speed of the picture and improve the reflectivity. When the upper second driving circuit layer 30U controls the electrode (second control electrode PEU) at the second control substrate 10U to be negatively charged, and the lower first driving circuit layer 30D controls the corresponding electrode (first control electrode PED) of the first control substrate 10D to be positively charged, the positively charged black particles 26B will move to the upper second control electrode PEU; the negatively charged white particles 26W will move to the lower first control electrode PED, so that the position of the lower first control electrode PED cooperates with the corresponding filter color block of the color filter layer CF to display color pixels. More specifically, the first driving circuit layer 30D below controls the first control electrode PED to generate an attractive force for the negatively charged white particles 26W, allowing the white particles to adhere to the surface of PED, and the color of the color filter block reflected by the white particles can be seen from the first surface of the first control substrate 10D, while the second driving circuit layer 30U above controls the second control electrode PEU to generate a repulsive force for the negatively charged white particles 26W, accelerating the movement of the white particles toward the first control electrode PED, achieving a display effect of faster screen update speed of the electrophoretic display with a double-sided control substrate. The above operation is based on the example of the viewing surface on the first surface, and a color screen with a better update rate can be presented on the first surface. Similarly, if the viewing surface is on the fourth surface of the second control substrate 10U (the side farthest from the first surface), a black and white image with a better refresh rate can be presented on the fourth surface. In addition, the attraction and repulsion generated by the two substrates are much greater than the attraction and repulsion of the known technology, which can effectively dissociate the clustering phenomenon caused by the agglomeration of positive and negative charged particles. Therefore, a higher density of charged particles can be used to increase the number of stacked layers of particles in the control electrodes PEU and PED, thereby improving the reflectivity of light.

[0280] like Fig. 20BFIG. 1 shows an electrophoretic display with a double-sided control substrate according to another embodiment of the present invention. The electrophoretic display 100 with a double-sided control substrate has, from top to bottom, a second control substrate 10U, a micro-compartment structure 50, and a first control substrate 10D. Furthermore, the first control substrate 10D has a first surface and a second surface close to the micro-compartment structure 50, and a first high-aperture driving circuit layer 30D and a first control electrode layer PELD (having a plurality of first control electrodes PED) are provided on the second surface of the first control substrate 10D. The second control substrate 10U has a fourth surface and a third surface close to the micro-compartment structure 50, and a second high-aperture driving circuit layer 30U and a second control electrode layer PELU (having a plurality of second control electrodes PEU) are provided on the third surface of the second control substrate 10U. According to one embodiment of the present invention, when manufacturing the electrophoretic display 100 with a double-sided control substrate, a micro-compartment structure 50 with a plurality of compartment walls 52 is manufactured on the side of the first control substrate 10D. In more detail, first, the first driving circuit layer 30D, the first transparent control electrode layer PELD and the insulating protection layer (not shown) are fabricated on the first control substrate 10D, and then the first transparent control electrode layer PELD is Figures 17A to 17F The partition wall 52 process can also be performed after a flat layer PLN is formed on the first transparent control electrode layer PELD. Figures 17A to 17F The partition wall 52 manufacturing process. The material of the flat layer PLN can be an organic insulating material, an inorganic insulating material or a combination thereof. After the partition wall 52 is manufactured, a colloidal solution can be filled into the chamber 54 defined by the partition wall 52 under vacuum working conditions. The colloidal solution contains charged color particles, such as charged cyan particles 26C, charged magenta particles 26M, charged yellow particles 26Y and charged white particles 26W. Then, a second control substrate 10U is attached, that is, a second control substrate 10U having a second high aperture ratio driving circuit layer 30U and a second control electrode layer PELU is provided. In addition, as Fig. 20B The second control electrode layer PELU is provided with a micro-tenon 60 corresponding to the shape of the groove chamber 54 .

[0281] See also Fig.14F, the micro-tenon 60 can be made of transparent photoresist, and after exposure and development, the micro-tenon area is left, and the rest is washed away; in addition, the micro-tenon can also be made by using a flat layer (PLN) through a lithography process to leave the micro-tenon area. A certain gap S should be maintained between the micro-tenon 60 and the side wall of the slot chamber 54 of the micro-compartment structure 50 as an alignment margin. This gap S is, for example, a gap of 1 to 50um. According to one embodiment of the present invention, this gap ranges from 1 to 5um, which is determined in conjunction with the accuracy of the mask alignment, as an allowable error range during alignment and bonding, to avoid alignment and bonding due to errors causing collision and damage between the micro-compartment and the micro-tenon. The thickness of the micro-tenon can be 0.5 to 50um. The thicker the thickness, the more secure the seal can be, but it will affect the attraction or repulsion of the control electrode, so the sealing degree and the electrical effect need to be reasonably allocated. According to one embodiment of the present invention, the thickness of the micro-tenon 60 is also in the range of 1 to 5um.

[0282] like Fig. 20B As shown, when the upper second driving circuit layer 30U controls the electrode (second control electrode PEU) at the second control substrate 10U to be negatively charged, and the lower first driving circuit layer 30D controls the corresponding electrode (first control electrode PED) of the first control substrate 10D to be positively charged, the charged cyan particles 26C (positive charge), the charged magenta particles 26M (positive charge), the charged yellow particles 26Y (negative charge) and the charged white particles 26W (negative charge) can be controlled to move in corresponding directions. For example, the first driving circuit layer 30D below controls the first control electrode PED to generate attraction for the negatively charged white particles 26W and yellow particles 26Y, and repulsion for the positively charged magenta particles 26M and cyan particles 26C, while the second driving circuit layer 30U above controls the second control electrode PEU to generate attraction for the positively charged magenta particles 26M and cyan particles 26C, and repulsion for the negatively charged white particles 26W and yellow particles 26Y. The attraction will be different due to the different charge numbers, and the voltage change and polarity can be used to adjust the voltage. The movement of the four kinds of charged particles can be controlled by the changes in the charge polarity of the double-sided control electrodes PED and PEU. Since the charge polarity of the double-sided control electrodes PED and PEU is different, the movement speed of the charge can be several times faster than that of the known technology, which speeds up the update speed of the picture and solves the clustering phenomenon that occurs when the density of charged particles is high. A colloidal solution of higher density charged particles can be used to increase the number of particle stacking layers contacting the surfaces of the control electrodes PED and PEU, thereby increasing the reflectivity of light and improving the shortcoming of insufficient reflectivity of the known technology, thereby achieving a better picture update rate and reflectivity of the electrophoretic display 100 with a double-sided control substrate.

[0283] like Fig. 20CFIG. 1 shows an electrophoretic display with a double-sided control substrate according to another embodiment of the present invention. The electrophoretic display 100 with a double-sided control substrate has, from top to bottom, a second control substrate 10U, a micro-compartment structure 50, and a first control substrate 10D. Furthermore, the first control substrate 10D has a first surface and a second surface close to the micro-compartment structure 50, and a first high-aperture driving circuit layer 30D and a first control electrode layer PELD (having a plurality of first control electrodes PED) are provided on the second surface of the first control substrate 10D. The second control substrate 10U has a fourth surface and a third surface close to the micro-compartment structure 50, and a second high-aperture driving circuit layer 30U and a second control electrode layer PELU (having a plurality of second control electrodes PEU) are provided on the third surface of the second control substrate 10U. According to one embodiment of the present invention, when manufacturing the electrophoretic display 100 with a double-sided control substrate, a micro-compartment structure 50 with a plurality of compartment walls 52 is manufactured on the side of the first control substrate 10D. In more detail, first, the first driving circuit layer 30D, the first transparent control electrode layer PELD and the insulating protection layer (not shown) are fabricated on the first control substrate 10D, and then the first color filter layer CF-1 is fabricated. Figures 17A to 17F The partition wall 52 process can also be performed after a flat layer PLN is formed on the first color filter layer CF-1. Figures 17A to 17F The partition wall 52 is formed in a process. The material of the flat layer PLN can be an organic insulating material, an inorganic insulating material or a combination thereof. After the partition wall 52 is formed, a colloidal solution containing charged black particles 26B and charged white particles 26W can be filled into the chamber 54 defined by the partition wall 52 under vacuum working conditions. Then, a second control substrate 10U is attached, that is, a second control substrate 10U having a second high aperture ratio driving circuit layer 30U and a second control electrode layer PELU is provided. In addition, Fig. 20C As shown. A second color filter layer CF-2 is provided on the second control electrode layer PELU. Optical glue is used between the second control substrate 10U and the partition wall 52, or frame glue is applied to the four frames of the display area for bonding. After completion, the two substrates are sent to the gas pressure chamber for heating and pressurization, and the colloidal solution is squeezed into and fills the gaps in the micro-compartment structure 50. Finally, the optical glue or frame glue is cured to complete the production of the finished electrophoretic display 100.

[0284] like Fig. 20CAs shown, when the upper second driving circuit layer 30U controls the electrode (second control electrode PEU) at the second control substrate 10U to be negatively charged, and the lower first driving circuit layer 30D controls the corresponding electrode (first control electrode PED) of this first control substrate 10D to be positively charged, the positively charged black particles 26B will move to the upper second control electrode PEU; the negatively charged white particles 26W will move to the lower first control electrode PED, so that the position of the lower first control electrode PED cooperates with the corresponding filter color block of the color filter layer CF to display color pixels. More specifically, since the first driving circuit layer 30D below controls the first control electrode PED to generate an attractive force on the negatively charged white particles 26W, and the second driving circuit layer 30U above controls the second control electrode PEU to generate a repulsive force on the negatively charged white particles 26W, the movement speed of the white particles 26W can be accelerated, thereby achieving a better screen refresh rate of the electrophoretic display 100 with a double-sided control substrate. In addition, the attractive force and repulsive force generated by the two substrates are much greater than the attractive force and repulsive force of the known technology, and can effectively dissociate the clustering phenomenon caused by the agglomeration of positively and negatively charged particles. Therefore, a higher density of charged particle concentration can be used to increase the number of stacked layers of particles in the control electrodes PEU and PED, thereby improving the reflectivity of light.

[0285] like Fig. 20C As shown, when the upper second driving circuit layer 30U controls the electrode (second control electrode PEU) at the second control substrate 10U, and the lower first driving circuit layer 30D controls the corresponding electrode (first control electrode PED) of the first control substrate 10D, and the charges of PEU and PED present the voltages required for their respective display images, the embodiment of the present invention can be used as an electrophoretic display that displays different color images on both sides. When the upper and lower electrodes (the upper second control electrode PEU and the corresponding first control electrode PED) are of the same polarity, for example, both are positively charged, the negatively charged white particles 26W will move to the upper and lower electrodes, allowing the upper and lower electrodes to display the color of the color filter block reflected by the white pixel, and the positively charged black particles 26B will move to the middle and be blocked by the white particles 26W and cannot be seen. On the contrary, when both the upper and lower electrodes are negatively charged, the positively charged black particles 26B will move to the upper and lower electrodes, and the white particles 26W will move to the middle and be blocked by the black particles 26B and cannot be seen. At this time, the upper and lower electrodes display black pixels. For example, when the charge polarity of the upper and lower electrodes is reversed, the positively charged black particles 26B will move to the negatively charged control electrode and appear black on the viewing surface of the control electrode, and the negatively charged white particles 26W will move to the positively charged control electrode and appear the color of the color filter block reflected by the white pixels on the viewing surface of the control electrode. In this way, the picture seen on the first surface of 10D can be different from the picture seen on the fourth surface of 10U, presenting an electrophoretic display 100 with a double-sided color picture display.

[0286] However, the above is only a preferred embodiment of the present invention, and it cannot limit the scope of the implementation of the present invention. That is, all equivalent changes and modifications made according to the scope of the patent application of the present invention should still fall within the scope of the patent coverage of the present invention. The present invention can also have many other embodiments. Without departing from the spirit and essence of the present invention, those familiar with the art can make various corresponding changes and deformations according to the present invention, but these corresponding changes and deformations should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A color electrophoretic display having a micro-compartment structure, comprising: A control substrate having a first surface and a second surface; a driving circuit layer, located on the second surface of the control substrate, comprising a plurality of thin film transistors, a plurality of gate lines and a plurality of data lines, at least one of the gate lines being electrically connected to the gates of the plurality of thin film transistors, and at least one of the data lines being electrically connected to the drains or sources of the plurality of thin film transistors; a control electrode layer, located on a surface of the driving circuit layer away from the control substrate, comprising a plurality of control electrodes, at least one of the control electrodes being electrically connected to the source or the drain of one of the thin film transistors; A micro-compartment structure is established on the control substrate and is made of a polymer material. The micro-compartment structure includes a plurality of compartment walls to define a plurality of tanks filled with a colloidal solution; It also includes a color filter layer set up at the bottom of the chamber, and the colloidal solution includes charged black color particles and / or charged white color particles; A relative substrate is arranged on a side of the micro compartment structure away from the control substrate.

2. The color electrophoretic display with a micro-compartment structure according to claim 1, wherein the compartment wall is formed by a plurality of polymer material stacks, and the cross-sectional width of the micro-compartment wall decreases with each layer of the polymer material stack.

3. The color electrophoretic display with a micro-compartment structure according to claim 2, wherein the width reduction of each layer of the polymer material stack is less than 5 microns. 4 . The color electrophoretic display with a micro-compartment structure as claimed in claim 1 , wherein a common electrode layer is disposed on one side of the opposite substrate.

5. The color electrophoretic display with a micro-compartment structure according to claim 1, wherein when looking from the first surface of the control substrate into the display area of ​​the electrophoretic display, an aperture ratio of the control substrate of the electrophoretic display is not less than 70%.

6. A color electrophoretic display having a micro-compartment structure, comprising: A control substrate having a first surface and a second surface; a driving circuit layer, located on the second surface of the control substrate, comprising a plurality of thin film transistors, a plurality of gate lines and a plurality of data lines, at least one of the gate lines being electrically connected to the gates of the plurality of thin film transistors, and at least one of the data lines being electrically connected to the drains or sources of the plurality of thin film transistors; a control electrode layer, located on a surface of the driving circuit layer away from the control substrate, comprising a plurality of control electrodes, at least one of the control electrodes being electrically connected to the source or the drain of one of the thin film transistors; a counter substrate, located at a side of the control electrode layer away from the control substrate; a micro-compartment structure, which is set on the relative substrate and is made of a polymer material, wherein the micro-compartment structure comprises a plurality of compartment walls to define a plurality of tanks filled with a colloidal solution, wherein the colloidal solution comprises at least one type of charged color particles; It also includes a color filter layer between the relative substrate and the control electrode layer. 7 . The color electrophoretic display with a micro-compartment structure according to claim 1 or claim 6 , wherein the colloidal solution is filled into the micro-compartment structure under vacuum conditions.

8. The color electrophoretic display with a micro-compartment structure according to claim 6, wherein the compartment wall is formed by a plurality of polymer material stacks, and the cross-sectional width of the compartment wall decreases with each layer of the polymer material stack. 9 . The color electrophoretic display with a micro-compartment structure according to claim 8 , wherein the width reduction of each layer of the polymer material stack is less than 5 microns.

10. The color electrophoretic display with a micro-compartment structure according to claim 1 or claim 6, wherein the plurality of compartment walls overlap with portions of the data lines and / or portions of the gate lines when viewed from a vertical projection direction. 11 . The color electrophoretic display with a microcompartment structure according to claim 10 , wherein the colloidal solution comprises at least two kinds of charged color particles.

12. The color electrophoretic display with a micro-compartment structure according to claim 6, wherein the color filter layer is established on the control electrode layer, and the colloidal solution comprises charged black color particles and / or charged white color particles.

13. The color electrophoretic display with a micro-compartment structure according to claim 6, further comprising a micro-latch formed on the color filter layer and extending toward the chamber.

14. The color electrophoretic display with a micro-compartment structure according to claim 6, wherein the color filter layer is established on the opposite substrate, and the colloidal solution comprises charged black color particles and / or charged white color particles.

15. The color electrophoretic display with a micro-compartment structure according to claim 6, further comprising a micro-latch formed on the control electrode layer and extending toward the chamber.

16. The color electrophoretic display having a micro-compartment structure according to claim 1 or claim 6, wherein the height of the compartment wall of the micro-compartment structure is less than 25 micrometers. 17 . The color electrophoretic display with a micro-compartment structure according to claim 1 or claim 6 , wherein the polymer material is a photoresist material, a flat layer material, a resin, or an acrylic material.

18. The color electrophoretic display with a micro-compartment structure according to claim 1 or claim 6, wherein the average cross-sectional width of the compartment walls of the micro-compartment structure is not greater than 10 micrometers.

19. The color electrophoretic display with a micro-compartment structure according to claim 1 or claim 6, wherein along the projection direction of the plurality of compartment walls on the viewing surface, the overlapping area between the compartment walls and the control electrode is less than 50% of the area of ​​the control electrode.

20. The color electrophoretic display with a micro-compartment structure according to claim 1 or claim 6, wherein the height of the compartment wall of the micro-compartment structure is greater than 5 micrometers.

21. The color electrophoretic display with a micro-compartment structure according to claim 1 or claim 6, wherein the filling rate of the colloidal solution in the chambers can reach more than 70%.

22. The color electrophoretic display with a micro-compartment structure according to claim 1 or claim 6, wherein the filling rate of the colloidal solution in the chambers can reach more than 90%.

23. A color electrophoretic display with a microcompartment structure according to claim 1 or claim 6, wherein at least two of the compartment walls have a gap between them, the area of ​​the gap is not greater than 50% of the area of ​​the compartment wall, or the length of the gap is not greater than 50% of the length of the compartment wall.

24. The color electrophoretic display with a micro-compartment structure according to claim 1 or claim 6, wherein the compartment walls are rectangular in outline and substantially correspond to pixels of the electrophoretic display.

25. The color electrophoretic display with a micro-compartment structure according to claim 17, wherein the micro-compartment structure is manufactured by repeating more than one photoresist coating exposure and then development.

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