Low-energy-consumption electroplating treatment method

Abstract

The invention discloses a low-energy-consumption electroplating treatment method which comprises the following steps: step 1) pretreatment: a flexible metal substrate sequentially passes through a first pretreatment solution and a second pretreatment solution, and is subjected to oil removal, rust removal and acid etching; (2) first grid layer treatment is conducted, specifically, the prepared grid layer liquid is sprayed to the surface of the flexible metal base material to form a first grid layer; (3) spraying is conducted, specifically, the flexible metal base material is placed in an automatic spraying machine, the face to be plated is bent outwards to be subjected to spraying, and a first metal plating layer is formed; (4) second grid layer treatment is conducted, specifically, prepared grid layer liquid is sprayed to the surface of the first metal coating to form a second grid layer; and (5) water electroplating is conducted, specifically, water electroplating is conducted on the flexible metal base material subjected to spray plating, the face to be plated is bent outwards to be subjected to water electroplating, and a second metal plating is formed outside the first metal plating. On the basis of optimization, low sheet resistance and high binding force of a product can be guaranteed, and machining energy consumption is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of substrate surface treatment, and in particular to a low-energy consumption electroplating treatment method. Background Art

[0002] Flexible metal substrates combine the bendability of flexible materials and the excellent properties of metal coatings, bringing more possibilities to multiple fields such as electronic products and the automotive industry. In particular, flexible metal substrates play an important role in the field of flexible electronics. They can be used to manufacture flexible electronic products such as flexible displays, flexible batteries, and flexible circuit boards. These products have the advantages of being light, flexible, and easy to carry, bringing more convenience to people's lives.

[0003] However, when the existing flexible metal substrates are directly used, most of them have the problem of insufficient conductivity. Therefore, in the prior art, the flexible metal substrate can be electroplated to improve the conductivity of the flexible metal substrate. However, as the number of plating layers of the metal substrate increases, the bonding strength between the plating layers will be affected, resulting in easy peeling. In particular, when the flexible metal material is bent, gaps in the plating layer are often generated or the plating layer falls off.

[0004] The applicant has applied for a patent application with the number: 202411846080.2, entitled: An invention patent for a water electroplating process for a substrate, which improves the bonding strength of the coating while reducing the conductive resistance by improving the process. However, in the actual processing of the above patent, due to the large number of steps involved and the large number of equipment used, the purchase cost of the processing equipment is significantly increased, and the energy consumption is also significantly increased.

[0005] Therefore, this application provides a low-energy electroplating processing method. How to reduce the processing energy consumption by improving the processing technology on the basis of the above-mentioned patented process to ensure that the product achieves low square resistance and strong bonding force is a technical problem that needs to be urgently solved by technical personnel in this field. Summary of the invention

[0006] To this end, the present invention provides a low-energy consumption electroplating treatment method to solve the related technical problems existing in the prior art.

[0007] In order to achieve the above object, the present invention provides the following technical solutions: According to a first aspect of the present application, a low-energy electroplating method is provided, comprising the following steps: Step 1), pretreatment, the flexible metal substrate is sequentially subjected to a first pretreatment liquid and a second pretreatment liquid to remove oil, rust and acid from the flexible metal substrate; Step 2), first mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer; Step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating; Step 4), second mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the first metal coating layer to form a second mesh layer; Step 5), water electroplating, the flexible metal substrate after spraying is subjected to water electroplating, the side to be plated is bent outward for water electroplating, and a second metal plating layer is formed outside the first metal plating layer.

[0008] Furthermore, an ultrasonic cleaning step is included between step 1) and step 2), between step 2) and step 3), between step 3) and step 4), and between step 4) and step 5).

[0009] Furthermore, in step 1), pretreatment, the flexible metal substrate is sequentially subjected to a first pretreatment liquid and a second pretreatment liquid to remove oil, rust and acid from the flexible metal substrate, including: The first pretreatment liquid includes: 130-160 g / L sulfuric acid, 300-500 g / L sodium chloride, 24-35 g / L sodium phosphate, 0.4-0.9 g / L alkylphenol polyoxyethylene ether, 3-5 g / L hexamethylenetetramine, 1-3 g / L triethanolamine, 10-30 g / L sodium dodecyl sulfonate and 3-6 g / L tryptophan; The flexible metal substrate to be treated is placed in the first pretreatment liquid at a temperature of 27-48° C. for a treatment time of 1.5-3.0 min; The second pretreatment liquid is the first pretreatment liquid diluted 10 times, and the flexible metal substrate to be treated is placed in the second pretreatment liquid at a temperature of 25-45° C. and a treatment time of 3-5 minutes.

[0010] Furthermore, in step 2), the first mesh layer is processed by spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer, comprising: Spray the prepared grid layer liquid onto the surface of the flexible metal substrate, dry at a temperature of 230-350°C for 1.5-2.0h; The grid layer liquid preparation method is: Add nickel chloride to deionized water, mix and stir, adjust the pH to neutral with sodium hydroxide solution, and microwave heat to 50-80°C for 1-2h; The precipitate was obtained by centrifugal filtration, washed twice with deionized water, and prepared into a grid layer liquid with a mass fraction of 5%.

[0011] Further, in step 4), the second mesh layer is processed by spraying the prepared mesh layer liquid onto the surface of the first metal coating layer to form the second mesh layer, comprising: The prepared grid layer liquid is sprayed onto the surface of the first metal coating, with a drying temperature of 230-350° C. and a drying time of 1.5-2.0 h.

[0012] Further, in step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating, comprising: The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during spraying. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0013] Further, in step 5), water electroplating is performed on the flexible metal substrate after spraying, and the side to be plated is bent outward for water electroplating to form a second metal plating layer outside the first metal plating layer, including: The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during water electroplating. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the expected thickness of the second metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0014] Furthermore, the thickness of the flexible metal substrate is 200 μm, the thickness of the first metal coating is 500 nm, and the thickness of the second metal coating is 600 nm.

[0015] Furthermore, the flexible metal substrate is a stainless steel sheet, a copper alloy sheet or a nickel alloy sheet.

[0016] According to a second aspect of the present application, a low-resistance conductive material is provided, comprising a flexible metal substrate prepared by the above low-energy electroplating treatment method.

[0017] The present invention has the following advantages: The present application improves the flexible metal substrate electroplating process in the prior art. By configuring the first pretreatment liquid and the second pretreatment liquid, the degreasing, rust removal and acid etching steps are reduced to one step, saving the number of treatment tanks and the trouble of configuring the treatment liquids separately. At the same time, the present application optimizes the number and position of the grid layer. The first grid layer can penetrate into the rough surface of the flexible metal substrate to ensure the adhesion of the first metal coating, and the second grid layer can penetrate onto the first metal coating to ensure the adhesion of the second metal coating. The present application omits the vacuum plating step, saving the purchase cost of the vacuum coating equipment. The present application can ensure the low square resistance and strong bonding force of the product on the basis of the above optimization, while greatly saving the processing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0019] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0020] Figure 1 A flow chart of the steps of the low energy consumption electroplating process provided by the present invention. DETAILED DESCRIPTION

[0021] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] In order to solve the relevant technical problems existing in the prior art, the present application improves the traditional flexible metal substrate plating process, in order to reduce the processing energy consumption and equipment investment cost under the premise of ensuring low resistance of the finished product and strong bonding strength of the coating.

[0023] According to the first aspect of the present application, Figure 1 As shown, a low energy consumption electroplating method is provided, comprising the following steps: Step 1), pretreatment, the flexible metal substrate is sequentially subjected to a first pretreatment liquid and a second pretreatment liquid to remove oil, rust and acid from the flexible metal substrate; Step 2), first mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer; Step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating; Step 4), second mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the first metal coating layer to form a second mesh layer; Step 5), water electroplating, the flexible metal substrate after spraying is subjected to water electroplating, the side to be plated is bent outward for water electroplating, and a second metal plating layer is formed outside the first metal plating layer.

[0024] Furthermore, an ultrasonic cleaning step is included between step 1) and step 2), between step 2) and step 3), between step 3) and step 4), and between step 4) and step 5).

[0025] Furthermore, in step 1), pretreatment, the flexible metal substrate is sequentially subjected to a first pretreatment liquid and a second pretreatment liquid to remove oil, rust and acid from the flexible metal substrate, including: The first pretreatment liquid includes: 130-160 g / L sulfuric acid, 300-500 g / L sodium chloride, 24-35 g / L sodium phosphate, 0.4-0.9 g / L alkylphenol polyoxyethylene ether, 3-5 g / L hexamethylenetetramine, 1-3 g / L triethanolamine, 10-30 g / L sodium dodecyl sulfonate and 3-6 g / L tryptophan; The flexible metal substrate to be treated is placed in the first pretreatment liquid at a temperature of 27-48° C. for a treatment time of 1.5-3.0 min; The second pretreatment liquid is the first pretreatment liquid diluted 10 times, and the flexible metal substrate to be treated is placed in the second pretreatment liquid at a temperature of 25-45° C. and a treatment time of 3-5 minutes.

[0026] Furthermore, in step 2), the first mesh layer is processed by spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer, comprising: Spray the prepared grid layer liquid onto the surface of the flexible metal substrate, dry at a temperature of 230-350°C for 1.5-2.0h; The grid layer liquid preparation method is: Add 0.1-0.5 parts of carboxylated carbon nanotubes, 5-30 parts of copper chloride, and 2-25 parts of nickel chloride to deionized water, mix and stir, adjust the pH to neutral with sodium hydroxide solution, microwave heat to 50-80° C., and react for 1-2 hours; The precipitate was obtained by centrifugal filtration, washed twice with deionized water, and prepared into a grid layer liquid with a mass fraction of 5%.

[0027] Further, in step 4), the second mesh layer is processed by spraying the prepared mesh layer liquid onto the surface of the first metal coating layer to form the second mesh layer, comprising: The prepared grid layer liquid is sprayed onto the surface of the first metal coating, with a drying temperature of 230-350° C. and a drying time of 1.5-2.0 h.

[0028] Further, in step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating, comprising: The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during spraying. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0029] Further, in step 5), water electroplating is performed on the flexible metal substrate after spraying, and the side to be plated is bent outward for water electroplating to form a second metal plating layer outside the first metal plating layer, including: The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during water electroplating. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the expected thickness of the second metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0030] Furthermore, the thickness of the flexible metal substrate is 200 μm, the thickness of the first metal coating is 500 nm, and the thickness of the second metal coating is 600 nm.

[0031] Furthermore, the flexible metal substrate is a stainless steel sheet, a copper alloy sheet or a nickel alloy sheet.

[0032] According to a second aspect of the present application, a low-resistance conductive material is provided, comprising a flexible metal substrate prepared by the above low-energy electroplating treatment method.

[0033] In order to better illustrate the technical effect of the processing technology provided by the present application, the present application provides the following embodiments and comparative examples. The flexible metal substrate selected is a stainless steel sheet with a thickness of 200 μm, the first metal coating is a copper coating with a thickness of 500 nm, and the second metal coating is a copper coating with a thickness of 600 nm. In the processing, when the flexible metal substrate is bent, the adjustment coefficient is between 0.0001 and 0.0001, which can be selected according to the selected materials and needs. The specific embodiments are as follows:

[0034] Example 1 This embodiment 1 provides a low-energy consumption electroplating method, comprising the following steps: Step 1), pretreatment, the flexible metal substrate is sequentially subjected to a first pretreatment liquid and a second pretreatment liquid to remove oil, rust and acid from the flexible metal substrate.

[0035] The first pretreatment liquid includes: 145 g / L sulfuric acid, 350 g / L sodium chloride, 28 g / L sodium phosphate, 0.5 g / L alkylphenol polyoxyethylene ether, 4 g / L hexamethylenetetramine, 2 g / L triethanolamine, 25 g / L sodium dodecyl sulfonate and 5 g / L tryptophan; The flexible metal substrate to be treated is placed in the first pretreatment liquid at a temperature of 40° C. and a treatment time of 2.0 min; The second pretreatment liquid is the first pretreatment liquid diluted 10 times, and the flexible metal substrate to be treated is placed in the second pretreatment liquid at a temperature of 40° C. for a treatment time of 4 minutes.

[0036] Step 2), first mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer; Add 0.1 parts of carboxylated carbon nanotubes, 28 parts of copper chloride, and 22 parts of nickel chloride to deionized water, mix and stir, adjust the pH to neutral with sodium hydroxide solution, microwave heat to 55°C, and react for 1.5 hours; centrifuge to obtain a precipitate, wash it twice with deionized water, and prepare a grid layer liquid with a mass fraction of 5%. Spray the prepared grid layer liquid onto the surface of the flexible metal substrate, dry it at 350°C, and dry it for 2.0 hours.

[0037] Step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating; The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during spraying. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0038] Step 4), second grid layer processing, spraying the prepared grid layer liquid onto the surface of the first metal coating to form a second grid layer; spraying the prepared grid layer liquid onto the surface of the first metal coating, drying temperature 300 ° C, drying for 1.8 hours.

[0039] Step 5), water electroplating, the flexible metal substrate after spraying is subjected to water electroplating, the side to be plated is bent outward for water electroplating, and a second metal plating layer is formed outside the first metal plating layer.

[0040] The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during water electroplating. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the expected thickness of the second metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0041] In this embodiment, an ultrasonic cleaning step is included between step 1) and step 2), between step 2) and step 3), between step 3) and step 4), and between step 4) and step 5).

[0042] The resistance and bonding strength of the plated flexible metal substrate were tested, as shown in Table 1.

[0043] Example 2 This embodiment 2 provides a low-energy consumption electroplating method, comprising the following steps: Step 1), pretreatment, the flexible metal substrate is sequentially subjected to a first pretreatment liquid and a second pretreatment liquid to remove oil, rust and acid from the flexible metal substrate.

[0044] The first pretreatment liquid includes: 160 g / L sulfuric acid, 400 g / L sodium chloride, 32 g / L sodium phosphate, 0.8 g / L alkylphenol polyoxyethylene ether, 5 g / L hexamethylenetetramine, 1 g / L triethanolamine, 15 g / L sodium dodecyl sulfonate and 4 g / L tryptophan; The flexible metal substrate to be treated is placed in the first pretreatment liquid at a temperature of 45° C. for a treatment time of 1.5 min; The second pretreatment liquid is the first pretreatment liquid diluted 10 times, and the flexible metal substrate to be treated is placed in the second pretreatment liquid at a temperature of 25° C. for a treatment time of 5 minutes.

[0045] Step 2), first mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer; 0.3 parts of carboxylated carbon nanotubes, 25 parts of copper chloride, and 23 parts of nickel chloride were added to deionized water, mixed and stirred, and the pH was adjusted to neutral by sodium hydroxide solution, microwaved to 60°C, and the reaction time was 1.3 hours; the precipitate was centrifuged and filtered, and washed twice with deionized water, and prepared into a grid layer liquid with a mass fraction of 5%. The prepared grid layer liquid was sprayed onto the surface of the flexible metal substrate, and the drying temperature was 250°C and dried for 1.5 hours.

[0046] Step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating; The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during spraying. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0047] Step 4), second grid layer processing, spraying the prepared grid layer liquid onto the surface of the first metal coating to form a second grid layer; spraying the prepared grid layer liquid onto the surface of the first metal coating, drying at 255°C, and drying for 1.5 hours.

[0048] Step 5), water electroplating, the flexible metal substrate after spraying is subjected to water electroplating, the side to be plated is bent outward for water electroplating, and a second metal plating layer is formed outside the first metal plating layer.

[0049] The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during water electroplating. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the expected thickness of the second metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0050] In this embodiment, an ultrasonic cleaning step is included between step 1) and step 2), between step 2) and step 3), between step 3) and step 4), and between step 4) and step 5).

[0051] The resistance and bonding strength of the plated flexible metal substrate were tested, as shown in Table 1.

[0052] Example 3 This embodiment 3 provides a low-energy consumption electroplating method, comprising the following steps: Step 1), pretreatment, the flexible metal substrate is sequentially subjected to a first pretreatment liquid and a second pretreatment liquid to remove oil, rust and acid from the flexible metal substrate.

[0053] The first pretreatment liquid includes: 135 g / L sulfuric acid, 450 g / L sodium chloride, 35 g / L sodium phosphate, 0.4 g / L alkylphenol polyoxyethylene ether, 3 g / L hexamethylenetetramine, 2.5 g / L triethanolamine, 30 g / L sodium dodecyl sulfonate and 3 g / L tryptophan; The flexible metal substrate to be treated is placed in the first pretreatment solution at a temperature of 27° C. for a treatment time of 1.8 min; The second pretreatment liquid was the first pretreatment liquid diluted 10 times, and the flexible metal substrate to be treated was placed in the second pretreatment liquid at a temperature of 30° C. and a treatment time of 3.5 min.

[0054] Step 2), first mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer; Add 0.4 parts of carboxylated carbon nanotubes, 21 parts of copper chloride, and 18 parts of nickel chloride to deionized water, mix and stir, adjust the pH to neutral with sodium hydroxide solution, microwave heat to 75°C, and react for 1.1h; centrifuge to obtain the precipitate, wash it twice with deionized water, and prepare a grid layer liquid with a mass fraction of 5%. Spray the prepared grid layer liquid onto the surface of the flexible metal substrate, dry it at 280°C, and dry it for 1.8h.

[0055] Step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating; The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during spraying. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0056] Step 4), second grid layer processing, spraying the prepared grid layer liquid onto the surface of the first metal coating to form a second grid layer; spraying the prepared grid layer liquid onto the surface of the first metal coating, drying at 275°C, and drying for 1.5 hours.

[0057] Step 5), water electroplating, the flexible metal substrate after spraying is subjected to water electroplating, the side to be plated is bent outward for water electroplating, and a second metal plating layer is formed outside the first metal plating layer.

[0058] The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during water electroplating. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the expected thickness of the second metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0059] In this embodiment, an ultrasonic cleaning step is included between step 1) and step 2), between step 2) and step 3), between step 3) and step 4), and between step 4) and step 5).

[0060] The resistance and bonding strength of the plated flexible metal substrate were tested, as shown in Table 1.

[0061] Example 4 This embodiment 4 provides a low-energy consumption electroplating method, comprising the following steps: Step 1), pretreatment, the flexible metal substrate is sequentially subjected to a first pretreatment liquid and a second pretreatment liquid to remove oil, rust and acid from the flexible metal substrate.

[0062] The first pretreatment liquid includes: 150 g / L sulfuric acid, 500 g / L sodium chloride, 24 g / L sodium phosphate, 0.9 g / L alkylphenol polyoxyethylene ether, 3.5 g / L hexamethylenetetramine, 3 g / L triethanolamine, 10 g / L sodium dodecyl sulfonate and 6 g / L tryptophan; The flexible metal substrate to be treated is placed in the first pretreatment liquid at a temperature of 48° C. for a treatment time of 2.5 min; The second pretreatment liquid is the first pretreatment liquid diluted 10 times, and the flexible metal substrate to be treated is placed in the second pretreatment liquid at a temperature of 35° C. and a treatment time of 4 minutes.

[0063] Step 2), first mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer; Add 0.2 parts of carboxylated carbon nanotubes, 15 parts of copper chloride, and 20 parts of nickel chloride to deionized water, mix and stir, adjust the pH to neutral with sodium hydroxide solution, microwave heat to 80°C, and react for 2 hours; centrifuge to obtain the precipitate, wash it twice with deionized water, and prepare a grid layer liquid with a mass fraction of 5%. Spray the prepared grid layer liquid onto the surface of the flexible metal substrate, dry it at 320°C, and dry it for 2.0 hours.

[0064] Step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating; The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during spraying. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0065] Step 4), second grid layer processing, spraying the prepared grid layer liquid onto the surface of the first metal coating to form a second grid layer; spraying the prepared grid layer liquid onto the surface of the first metal coating, drying at 230°C, and drying for 2 hours.

[0066] Step 5), water electroplating, the flexible metal substrate after spraying is subjected to water electroplating, the side to be plated is bent outward for water electroplating, and a second metal plating layer is formed outside the first metal plating layer.

[0067] The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during water electroplating. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the expected thickness of the second metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0068] In this embodiment, an ultrasonic cleaning step is included between step 1) and step 2), between step 2) and step 3), between step 3) and step 4), and between step 4) and step 5).

[0069] The resistance and bonding strength of the plated flexible metal substrate were tested, as shown in Table 1.

[0070] Example 5 This embodiment 5 provides a low-energy consumption electroplating method, comprising the following steps: Step 1), pretreatment, the flexible metal substrate is sequentially subjected to a first pretreatment liquid and a second pretreatment liquid to remove oil, rust and acid from the flexible metal substrate.

[0071] The first pretreatment liquid includes: 130 g / L sulfuric acid, 300 g / L sodium chloride, 30 g / L sodium phosphate, 0.6 g / L alkylphenol polyoxyethylene ether, 4 g / L hexamethylenetetramine, 1.5 g / L triethanolamine, 22 g / L sodium dodecyl sulfonate and 4.5 g / L tryptophan; The flexible metal substrate to be treated is placed in the first pretreatment liquid at a temperature of 32° C. and a treatment time of 3.0 min; The second pretreatment liquid is the first pretreatment liquid diluted 10 times, and the flexible metal substrate to be treated is placed in the second pretreatment liquid at a temperature of 45° C. for 3 minutes.

[0072] Step 2), first mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer; Add 0.5 parts of carboxylated carbon nanotubes, 30 parts of copper chloride, and 15 parts of nickel chloride to deionized water, mix and stir, adjust the pH to neutral with sodium hydroxide solution, microwave heat to 68°C, and react for 1.8 hours; centrifuge to obtain the precipitate, wash it twice with deionized water, and prepare a grid layer liquid with a mass fraction of 5%. Spray the prepared grid layer liquid onto the surface of the flexible metal substrate, dry it at 300°C, and dry it for 1.5 hours.

[0073] Step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating; The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during spraying. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0074] Step 4), second grid layer processing, spraying the prepared grid layer liquid onto the surface of the first metal coating to form a second grid layer; spraying the prepared grid layer liquid onto the surface of the first metal coating, drying at 350°C for 1.5 hours.

[0075] Step 5), water electroplating, the flexible metal substrate after spraying is subjected to water electroplating, the side to be plated is bent outward for water electroplating, and a second metal plating layer is formed outside the first metal plating layer.

[0076] The bending curvature of the flexible metal substrate is: ; in, It is the curvature of the flexible metal substrate during water electroplating. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the expected thickness of the second metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

[0077] In this embodiment, an ultrasonic cleaning step is included between step 1) and step 2), between step 2) and step 3), between step 3) and step 4), and between step 4) and step 5).

[0078] The resistance and bonding strength of the plated flexible metal substrate were tested, as shown in Table 1.

[0079] Comparative Example 1 This comparative example 1 is a patent applied for by the present applicant: the patent application number is: 202411846080.2, and the name is: Example 1 of a water electroplating process for a substrate.

[0080] The resistance and bonding strength of the plated flexible metal substrate were tested, as shown in Table 1.

[0081] Comparative Example 2 The scheme of this comparative example 2 is the same as that of example 1, but step 4 is omitted).

[0082] The resistance and bonding strength of the plated flexible metal substrate were tested, as shown in Table 1.

[0083] Table 1: Test results of resistance and bonding strength of flexible metal substrates

[0084] Square resistance (mΩ) Binding force (N / cm) Example 1 22.5 12.6 Example 2 22.9 13.3 Example 3 21.6 14.0 Example 4 21.1 13.5 Example 5 23.5 12.8 Comparative Example 1 25.7 11.2 Comparative Example 2 24.3 10.6

[0085] From the above experimental results, it can be seen that for the detection of square resistance, in Examples 1-5, after the technical solution of the present application, the square resistance values ​​are generally reduced compared with Comparative Example 1. At the same time, the square resistance of Example 4 reaches the lowest level, which is significantly different from Comparative Examples 1 and 2, which shows that adding the second mesh layer can improve the conductivity to a certain extent. For the detection of binding force, compared with Comparative Examples 1 and 2, Examples 1-5 ensure the binding force performance, and the processing performance is not reduced due to the use of the first pretreatment liquid and the second pretreatment liquid. On the contrary, by adding the structure of the second mesh layer, the binding performance is also improved to a certain extent.

[0086] The present application improves the flexible metal substrate electroplating process in the prior art. By configuring the first pretreatment liquid and the second pretreatment liquid, the degreasing, rust removal and acid etching steps are reduced to one step, saving the number of treatment tanks and the trouble of configuring the treatment liquids separately. At the same time, the present application optimizes the number and position of the grid layer. The first grid layer can penetrate into the rough surface of the flexible metal substrate to ensure the adhesion of the first metal coating, and the second grid layer can penetrate onto the first metal coating to ensure the adhesion of the second metal coating. The present application omits the vacuum plating step, saving the purchase cost of the vacuum coating equipment. The present application can ensure the low square resistance and strong bonding force of the product on the basis of the above optimization, while greatly saving the processing cost.

[0087] Although the present invention has been described in detail above by general description and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements can be made to the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all belong to the scope of protection claimed by the present invention.

Claims

1. A low energy consumption electroplating method, characterized in that: The steps include: Step 1), pretreatment, the flexible metal substrate is sequentially subjected to a first pretreatment liquid and a second pretreatment liquid to remove oil, rust and acid from the flexible metal substrate; Step 2), first mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer; Step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating; Step 4), second mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the first metal coating layer to form a second mesh layer; Step 5), water electroplating, the flexible metal substrate after spraying is subjected to water electroplating, the side to be plated is bent outward for water electroplating, and a second metal plating layer is formed outside the first metal plating layer.

2. The low energy consumption electroplating method according to claim 1, characterized in that: An ultrasonic cleaning step is included between step 1) and step 2), between step 2) and step 3), between step 3) and step 4), and between step 4) and step 5).

3. The low energy consumption electroplating method according to claim 1, characterized in that: in, Step 1), pre-treatment, wherein the flexible metal substrate is sequentially subjected to a first pre-treatment liquid and a second pre-treatment liquid to remove oil, rust and acid from the flexible metal substrate, including: The first pretreatment liquid includes: 130-160 g / L sulfuric acid, 300-500 g / L sodium chloride, 24-35 g / L sodium phosphate, 0.4-0.9 g / L alkylphenol polyoxyethylene ether, 3-5 g / L hexamethylenetetramine, 1-3 g / L triethanolamine, 10-30 g / L sodium dodecyl sulfonate and 3-6 g / L tryptophan; The flexible metal substrate to be treated is placed in the first pretreatment liquid at a temperature of 27-48° C. for a treatment time of 1.5-3.0 min; The second pretreatment liquid is the first pretreatment liquid diluted 10 times, and the flexible metal substrate to be treated is placed in the second pretreatment liquid at a temperature of 25-45° C. and a treatment time of 3-5 minutes.

4. The low energy consumption electroplating method according to claim 1, characterized in that: in, Step 2), first mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the flexible metal substrate to form the first mesh layer, including: Spray the prepared grid layer liquid onto the surface of the flexible metal substrate, dry at a temperature of 230-350°C for 1.5-2.0h; The grid layer liquid preparation method is: Add 0.1-0.5 parts of carboxylated carbon nanotubes, 5-30 parts of copper chloride, and 2-25 parts of nickel chloride to deionized water, mix and stir, adjust the pH to neutral with sodium hydroxide solution, microwave heat to 50-80° C., and react for 1-2 hours; The precipitate was obtained by centrifugal filtration, washed twice with deionized water, and prepared into a grid layer liquid with a mass fraction of 5%.

5. The low energy consumption electroplating method according to claim 4, characterized in that: in, Step 4), second mesh layer processing, spraying the prepared mesh layer liquid onto the surface of the first metal coating layer to form a second mesh layer, including: The prepared grid layer liquid is sprayed onto the surface of the first metal coating, with a drying temperature of 230-350° C. and a drying time of 1.5-2.0 h.

6. The low energy consumption electroplating method according to claim 1, characterized in that: in, Step 3), spraying, placing the flexible metal substrate into an automatic spraying machine, bending the side to be plated outward for spraying, and forming a first metal coating, including: The bending curvature of the flexible metal substrate is: ； in, It is the curvature of the flexible metal substrate during spraying. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

7. The low energy consumption electroplating method according to claim 6, characterized in that: in, Step 5), water electroplating, water electroplating the flexible metal substrate after spraying, bending the side to be plated outward for water electroplating, and forming a second metal plating layer outside the first metal plating layer, including: The bending curvature of the flexible metal substrate is: ； in, It is the curvature of the flexible metal substrate during water electroplating. is the thickness of the flexible metal substrate, is the expected thickness of the first metal coating, is the expected thickness of the second metal coating, is the adjustment factor for the thickness of the flexible metal substrate, is the adjustment factor for the expected thickness of the metal coating.

8. The low energy consumption electroplating method according to claim 1, characterized in that: in, The thickness of the flexible metal substrate is 200 μm, the thickness of the first metal coating layer is 500 nm, and the thickness of the second metal coating layer is 600 nm.

9. The low energy consumption electroplating method according to claim 1, characterized in that: The flexible metal substrate is a stainless steel sheet, a copper alloy sheet or a nickel alloy sheet.

10. A low resistance conductive material, characterized in that: It comprises a flexible metal substrate prepared by the low-energy electroplating treatment method described in claim 1.

Images