Shock absorption effect evaluation method and device for sound box foot pad, equipment, storage medium and product

Abstract

The invention discloses a sound box foot pad damping effect evaluation method and device, equipment, a storage medium and a product. Comprising the following steps: performing sound field analysis on the whole structure of the sound box under rated power to obtain an exciting force curve generated by a triple bass horn; obtaining analysis data of a material used by the sound box foot pad, and establishing a hyperelastic material model based on the analysis data; performing static analysis on the overall structure of the sound box based on the hyperelastic material model to obtain a static analysis result; performing modal analysis of the prestress based on the static analysis result to obtain an analysis result until the inherent frequency in the analysis result and the starting frequency of the loudspeaker box application frequency band meet a preset condition; and in combination with the excitation force curve, performing transient dynamic analysis on the sound box structure corresponding to the analysis result meeting the preset condition to obtain a sound box jumping deviation result under the influence of different frequencies. According to the method, by establishing the hyperelastic material model, the characteristics of the hyperelastic material can be accurately reflected, and the assessment accuracy of the damping effect of the sound box foot pad is improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of data processing technology, and in particular to a method, device, equipment, storage medium and product for evaluating the shock absorption effect of a speaker foot pad. Background Art

[0002] When a subwoofer works under high power conditions, the speaker will drive the reciprocating vibration of the surrounding space through the vibration system, thereby producing sound. The reciprocating vibration will also produce a force on the speaker body. When the force is large enough, it will cause the speaker to jump at certain frequencies and then shift and rotate. The jumping and shifting will not only affect the sound quality of the speaker, but also bring some noise. There are also some other risks that will seriously affect the user experience. Therefore, most subwoofers use a bottom shock-absorbing design to achieve the shock-absorbing effect.

[0003] Figure 1 A schematic diagram of the structure of a subwoofer speaker provided by an embodiment of the present invention is shown in FIG. Figure 1 As shown, a subwoofer and a speaker foot pad are installed at the bottom of the subwoofer, and the speaker foot pad is used to reduce the risk of vibration of the subwoofer caused by the reaction force generated by the reciprocating motion of the subwoofer.

[0004] In order to evaluate the shock absorption effect of the speaker pad, the prior art uses a conventional linear elastic model, an empirical formula and an empirical system, takes the hardness and size of the material as variables, calculates the natural frequency of the vibration isolation system, and determines the shock absorption effect of the speaker pad according to the difference between the natural frequency and the vibration frequency of the subwoofer. However, the prior art equates rubber and rubber-like materials to a linear elastic model, which cannot reflect the characteristics of hyperelastic materials, resulting in low accuracy in evaluating the shock absorption effect of the speaker pad. Summary of the invention

[0005] The present invention provides a method, device, equipment, storage medium and product for evaluating the shock absorbing effect of a speaker foot pad, so as to solve the problem that the prior art treats rubber and rubber-like materials as equivalent to a linear elastic model, which cannot reflect the characteristics of hyperelastic materials and leads to low accuracy in evaluating the shock absorbing effect of the speaker foot pad.

[0006] According to one aspect of the present invention, a method for evaluating the shock absorption effect of a speaker foot pad is provided, comprising:

[0007] Perform sound field analysis on the overall structure of the speaker at rated power to obtain the excitation force curves generated by the three subwoofers;

[0008] Obtaining analysis data of materials used in speaker foot pads, and establishing a hyperelastic material model based on the analysis data;

[0009] Performing static analysis on the overall structure of the speaker based on the hyperelastic material model to obtain a static analysis result;

[0010] Based on the static analysis result, a prestressed modal analysis is performed on the overall structure of the speaker to obtain an analysis result, until the natural frequency in the analysis result and the starting frequency of the speaker application frequency band meet a preset condition;

[0011] In combination with the excitation force curve, a transient dynamic analysis is performed on the sound box structure corresponding to the analysis result that meets the preset conditions to obtain the sound box bounce offset results under the influence of different frequencies.

[0012] According to another aspect of the present invention, a device for evaluating the shock absorption effect of a speaker foot pad is provided, comprising:

[0013] The first analysis module is used to analyze the sound field of the overall structure of the speaker at rated power and obtain the excitation force curve generated by the three subwoofers;

[0014] Establishing a module for obtaining analysis data of materials used in speaker foot pads, and establishing a hyperelastic material model based on the analysis data;

[0015] A second analysis module is used to perform a static analysis on the overall structure of the speaker based on the hyperelastic material model to obtain a static analysis result;

[0016] A third analysis module is used to perform a prestressed modal analysis on the overall structure of the speaker based on the static analysis result to obtain an analysis result, until the natural frequency in the analysis result and the starting frequency of the speaker application frequency band meet a preset condition;

[0017] The fourth analysis module is used to combine the excitation force curve to perform transient dynamic analysis on the sound box structure corresponding to the analysis result that meets the preset conditions, so as to obtain the sound box bounce offset results under the influence of different frequencies.

[0018] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0019] at least one processor;

[0020] and a memory communicatively coupled to the at least one processor;

[0021] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for evaluating the shock-absorbing effect of the speaker foot pad described in any embodiment of the present invention.

[0022] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method for evaluating the shock-absorbing effect of a speaker foot pad according to any embodiment of the present invention when executed.

[0023] According to another aspect of the present invention, a computer program product is provided. The computer program product includes a computer program. When the computer program is executed by a processor, the method for evaluating the shock absorption effect of a speaker foot pad according to any embodiment of the present invention is implemented.

[0024] The technical solution of the embodiment of the present invention obtains analysis data of the materials used in the speaker pads and establishes a hyperelastic material model based on the analysis data, thereby solving the problem that the prior art treats rubber and rubber-like materials as equivalent to a linear elastic model, which is unable to reflect the characteristics of hyperelastic materials and leads to low accuracy in evaluating the shock absorbing effect of the speaker pads. The technical solution has the beneficial effect of being able to accurately reflect the characteristics of hyperelastic materials and improve the accuracy of evaluating the shock absorbing effect of the speaker pads.

[0025] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A schematic diagram of the structure of a subwoofer provided by an embodiment of the present invention;

[0028] Figure 2 A schematic flow chart of a method for evaluating the shock absorption effect of a speaker foot pad provided in the first embodiment of the present invention;

[0029] Figure 3 A schematic flow chart of a method for evaluating the shock absorption effect of a speaker foot pad provided in the second embodiment of the present invention;

[0030] Figure 4 A schematic flow chart of a method for evaluating the shock absorption effect of a speaker foot pad provided in Embodiment 3 of the present invention;

[0031] Figure 5 A schematic diagram of the structure of a device for evaluating the shock absorption effect of a speaker foot pad provided in a fourth embodiment of the present invention;

[0032] Figure 6 The present invention is a schematic structural diagram of an electronic device for a method for evaluating the shock absorption effect of a speaker foot pad according to an embodiment of the present invention. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only an embodiment of a part of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work should belong to the scope of protection of the present invention. It should be understood that the various steps recorded in the method implementation of the present invention can be performed in different orders and / or in parallel. In addition, the method implementation may include additional steps and / or omit the steps shown. The scope of the present invention is not limited in this respect.

[0034] The term "including" and its variations used herein are open inclusions, i.e., "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0035] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0036] It should be noted that the modifications of "one" and "plurality" mentioned in the present invention are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0037] The names of the messages or information exchanged between multiple devices in the embodiments of the present invention are only used for illustrative purposes, and are not used to limit the scope of these messages or information.

[0038] Embodiment 1

[0039] Figure 2 A flow chart of a method for evaluating the shock-absorbing effect of a speaker foot pad provided in Embodiment 1 of the present invention. The method can be applied to reduce the bounce and offset generated when the speaker is working. The method can be executed by a device for evaluating the shock-absorbing effect of a speaker foot pad, wherein the device can be implemented by software and / or hardware and is generally integrated on an electronic device. In this embodiment, the electronic device includes but is not limited to: a computer device.

[0040] like Figure 2 As shown, a method for evaluating the shock absorption effect of a speaker foot pad provided in Embodiment 1 of the present invention includes the following steps:

[0041] S110, performing sound field analysis on the overall structure of the speaker at rated power, and obtaining the excitation force curves generated by the three subwoofers.

[0042] In this embodiment, an analysis model is first established, and then the analysis model is studied and calculated. This process requires the user to operate on the multi-physics field simulation software, and includes the following steps:

[0043] 1. Click "Model Guide", then click "3D". In the physical field selection interface, select "Solid Mechanics" and "Pressure Acoustics, Frequency Domain" in turn, two physical fields, and click Research to enter the research selection interface, select "Frequency Domain", and click Finish to enter the main interface of the software;

[0044] 2. In the model builder on the left side of the software main interface, click "Geometry 1" and change the length unit to mm, check "Design module Boolean operation option", right-click and select the "Import" option, browse and select the model to be simulated and perform basic processing, insert a sphere, and set the size of the sphere to 2 to 3 times the size of the overall structure of the speaker to simulate air and form a joint body;

[0045] 3. Right-click "Material" to choose to create a new material or browse materials from the library, establish the material information required for simulation, and assign it to the overall structure of the speaker;

[0046] 4. Select the corresponding physical field. For the subwoofer, define the structure part as the "Solid Mechanics" physical field, and define the air part as the "Pressure Acoustics, Frequency Domain" physical field, and set the corresponding boundary conditions in the corresponding physical field;

[0047] 5. Right-click "Multiphysics Field" and insert 1 "Acoustic-Structure Boundary". Select all boundaries for "Acoustic-Structure Boundary 1", and the coupling interface is "Pressure Acoustics, Frequency Domain" for acoustics and "Solid Mechanics" for structure.

[0048] 6. Divide the grids for the structure and air. The structural grid needs to be sufficiently close to the body, that is, the grid size should be small enough to simulate the local details of the structure. At the same time, since the interaction between air and structure needs to be considered, the grid at the interface between the structure and the air should be as close as possible to ensure the accuracy of the coupling calculation. For the air domain, the size of the grid needs to be defined according to the wavelength of the sound wave in the air, generally requiring 5 to 6 grid units per wavelength. At the same time, for areas with drastic changes in geometric shape, local grid refinement is required. For the divided grids, a grid independence check is generally required to avoid excessive errors or waste of computing resources due to grid reasons.

[0049] 7. Set the "frequency domain" study involved in step 1. Set the frequency according to the application frequency range of the subwoofer. Take the setting of the subwoofer with an application frequency range of 20-400Hz as an example. Click the "Range" button after the frequency input box to pop up the frequency range setting window. Select "ISO preferred frequency" as the definition method, define the start frequency as 20Hz, define the stop frequency as 400Hz, select "1 / 12 octave" as the interval, and click the "Add" button to define the frequency.

[0050] 8. After research and calculation, extract the total reaction force curve, which is the excitation force curve of the subwoofer to the outside world.

[0051] S120, obtaining analysis data of materials used for speaker foot pads, and establishing a hyperelastic material model based on the analysis data.

[0052] Among them, the analysis data of the materials used in the speaker pads are obtained after experimental analysis of the materials used in the speaker pads.

[0053] Among them, the hyperelastic material model describes the ability of a material to maintain elastic behavior under large deformation conditions.

[0054] In this embodiment, two material parameters C of the hyperelastic material model can be obtained based on the analysis data. 10 and C 01 , according to C 10 and C 01 Two parameters can establish a hyperelastic material model.

[0055] S130. Performing a static analysis on the overall structure of the speaker based on the hyperelastic material model to obtain a static analysis result.

[0056] Among them, static analysis is an important analysis method in engineering mechanics and computational mechanics, which is used to solve the response of the structure under static loads, such as displacement, stress, strain, etc. Determine the mechanical behavior of the overall structure of the speaker under static external forces, and evaluate whether the overall structure of the speaker meets the design requirements, such as strength, stiffness and stability.

[0057] In this embodiment, static analysis of the overall structure of the speaker can obtain the displacement of the overall structure of the speaker, including: reasonably simplifying the overall structure of the speaker according to the characteristics of the overall structure of the speaker through finite element analysis software, establishing a mechanical model, and determining the geometric shape, size, material properties, constraints and load conditions of the overall structure of the speaker; according to the complexity of the structure and the analysis requirements, selecting a suitable analysis method, and using the selected analysis method to solve.

[0058] Specifically, the static analysis of the overall structure of the speaker box based on the hyperelastic material model to obtain the static analysis result includes:

[0059] According to the hyperelastic material model, a mechanical model is established for the overall structure of the speaker through finite element analysis software, wherein the mechanical model represents the material properties, constraint conditions and load conditions of the overall structure of the speaker;

[0060] Using finite element analysis software to mesh the overall structure of the speaker to obtain multiple finite element units, and establishing a finite element equation based on the material properties, constraints and load conditions of the overall structure of the speaker;

[0061] The finite element equations are solved by a solver to obtain the displacement, stress and strain of the overall structure of the speaker as static analysis results.

[0062] S140, performing a prestressed modal analysis on the overall structure of the speaker based on the static analysis result to obtain an analysis result, until the natural frequency in the analysis result and the starting frequency of the speaker application frequency band meet a preset condition.

[0063] Among them, the modal analysis of prestress is an important analysis method used to study the dynamic characteristics of structures under prestress. The modal analysis of prestress can more accurately reflect the actual state of the structure and optimize the structural design.

[0064] In this embodiment, after the overall structure of the speaker is simplified, a structural finite element model is established through finite element software, prestress is applied in the finite element model according to the static analysis results, and the finite element solver is run to calculate the natural frequency and vibration mode of the overall structure of the speaker under the action of prestress.

[0065] Furthermore, the preset conditions include: the ratio of the starting frequency of the speaker application frequency band to the natural frequency in the analysis result is greater than a set value; and the solution of the natural frequency in the analysis result satisfies the following formula:

[0066]

[0067] Among them, f 0is the natural frequency, k is the stiffness of the overall structure of the speaker, and m is the mass of the overall structure of the speaker.

[0068] In this embodiment, if the ratio of the starting frequency of the speaker application frequency band to the natural frequency in the analysis result is less than or equal to the set value, the set value is preferably Then reduce the k value or increase the m value. This can be achieved by reducing the hardness level of the speaker foot pad or increasing the weight of the overall speaker structure.

[0069] S150. In combination with the excitation force curve, a transient dynamic analysis is performed on the sound box structure corresponding to the analysis result that meets the preset condition to obtain the sound box bounce offset results under the influence of different frequencies.

[0070] Among them, transient dynamic analysis is used to determine the dynamic response of the structure under time-varying loads, such as displacement, velocity, acceleration and stress.

[0071] In this embodiment, a finite element model is first created for the speaker structure corresponding to the analysis results that meet the preset conditions, and then a transient dynamic analysis is set up and a solution calculation is performed. After the calculation is completed, the dynamic response results of the structure are obtained, including curves and cloud diagrams of changes in displacement, velocity, acceleration, stress, strain, etc. over time.

[0072] A method for evaluating the shock absorption effect of a speaker pad provided in a first embodiment of the present invention comprises the following steps: firstly, the sound field of the overall structure of the speaker is analyzed at rated power to obtain the excitation force curve generated by three subwoofers; secondly, the analysis data of the material used in the speaker pad is obtained, and a hyperelastic material model is established based on the analysis data; then, a static analysis is performed on the overall structure of the speaker based on the hyperelastic material model to obtain a static analysis result; then, a prestressed modal analysis is performed on the overall structure of the speaker based on the static analysis result to obtain an analysis result, until the natural frequency in the analysis result and the starting frequency of the speaker application frequency band meet a preset condition; finally, in combination with the excitation force curve, a transient dynamic analysis is performed on the speaker structure corresponding to the analysis result that meets the preset condition to obtain the speaker bounce offset result under the influence of different frequencies. The above method establishes a hyperelastic material model based on the analysis data, which can accurately reflect the characteristics of the hyperelastic material and improve the evaluation accuracy of the shock absorption effect of the speaker pad.

[0073] Based on the above embodiment, a variant embodiment of the above embodiment is proposed. It should be noted that in order to make the description concise, only the differences from the above embodiment are described in the variant embodiment.

[0074] In one embodiment, establishing a hyperelastic material model based on the analysis data includes: fitting the analysis data to obtain two material parameters required for a hyperelastic constitutive model; and establishing the hyperelastic material model according to the two material parameters.

[0075] In this embodiment, the hyperelastic material model is a constitutive model used to describe the mechanical behavior of hyperelastic materials such as rubber materials. The model is based on the strain energy density function and uses two material parameters C 10 and C 01 To characterize the nonlinear elastic properties of materials.

[0076] Among them, parameter C 10 It mainly reflects the shear modulus characteristics of the material under large deformation and is related to the initial stiffness of the material molecular chain. In the case of simple shear deformation, when the deformation is small, in the relationship between shear stress and shear strain, C 10 It can be understood that C 10 The larger the C is, the stronger the material's ability to resist shear deformation in the small deformation stage is, that is, the harder the material is. For example, for a rubber material with a high hardness, its C 10 The value is relatively large.

[0077] Among them, parameter C 01 It also has an important influence on the mechanical response of the material, especially when the material undergoes large deformations. It is related to the deformation behavior of the material under complex stress states, especially in large deformation situations involving insignificant volume changes. In some cases, C 10 It reflects the interaction between the molecular chains of the material and the ability of the molecular chain network structure to adjust under large deformation. For example, when the material is subjected to large tensile or compressive deformation, C 10 It will affect the stress-strain response of the material, allowing the model to more accurately describe the nonlinear behavior of the material.

[0078] In this embodiment, the strain energy density function W of the hyperelastic constitutive model is defined as:

[0079] W=C 10 (I 1 -3)+C 01 (I 2 -3)

[0080] Among them, C 10 and C 01 Represents two material parameters; I 1 and I 2 represents the strain invariant.

[0081] Embodiment 2

[0082] Figure 3This is a flow chart of a method for evaluating the damping effect of a speaker foot pad provided in the second embodiment of the present invention. The second embodiment is optimized on the basis of the above embodiments. For details not yet provided in this embodiment, please refer to the first embodiment.

[0083] like Figure 3 As shown, a method for evaluating the shock absorption effect of a speaker foot pad provided in Embodiment 2 of the present invention comprises the following steps:

[0084] S210, performing sound field analysis on the overall structure of the speaker at rated power, and obtaining the excitation force curves generated by the three subwoofers.

[0085] S220, obtaining analysis data of materials used for speaker foot pads, and establishing a hyperelastic material model based on the analysis data.

[0086] S230. Perform a static analysis on the overall structure of the speaker based on the hyperelastic material model to obtain a static analysis result.

[0087] S240, processing and simplifying the overall structure of the speaker to obtain a target speaker structure.

[0088] The overall 3D structure of the speaker is processed and simplified, for example, detail features that have little impact on the analysis results, such as small holes and small chamfers, are removed to reduce the amount of calculation.

[0089] S250, defining material properties of the target sound box structure, and using finite element software to mesh the target sound box structure according to different meshing parameters to obtain a plurality of finite element units.

[0090] The material properties of the target speaker structure are defined, including the speaker foot pad material and other conventional materials, and the elastic modulus, Poisson's ratio, density and other parameters of each material are defined.

[0091] The division parameters may include unit type parameters and mesh density parameters. Specifically, for complex structures or stress concentration areas, finer mesh division should be used to improve calculation accuracy; while for minor parts of the structure, coarser mesh can be used to reduce calculation time.

[0092] In this embodiment, after obtaining a plurality of finite elements, the mesh quality may also be checked to ensure that the shape and size of the elements meet the requirements and to avoid the occurrence of deformed elements.

[0093] S260. Establish a structural finite element model using finite element software according to the geometric shapes, sizes and material properties of the multiple finite element units.

[0094] S270. Apply prestress in the finite element model according to the static analysis result.

[0095] Among them, according to the actual state of the speaker placed on the desktop, the desktop is fixedly constrained, gravity acceleration is added, the direction is defined as from the speaker to the desktop, and large deformation is turned on.

[0096] S280. According to the modal analysis setting result, run a finite element solver to calculate the natural frequency of the finite element model under the prestressing force.

[0097] Among them, users can activate the influence of prestress on modal analysis through option settings, and set the extraction method and extraction order of modal analysis.

[0098] In this embodiment, the natural frequency of the speaker foot pad in the vertical direction is calculated according to the results of the state analysis by using the finite element simulation software and the finite element solver according to the maximum deformation of the finite element model under the deadweight state.

[0099] A method for evaluating the shock-absorbing effect of a speaker foot pad is provided in a second embodiment of the present invention. The method combines the results of sound field analysis, modal analysis, and transient dynamics analysis to intuitively compare the magnitude of the risk of bounce and offset between different schemes, and has higher credibility than traditional evaluation methods.

[0100] Embodiment 3

[0101] Figure 4 This is a flow chart of a method for evaluating the damping effect of a speaker foot pad provided by the third embodiment of the present invention. The third embodiment is optimized on the basis of the above embodiments. For details not yet fully described in this embodiment, please refer to the first and second embodiments.

[0102] like Figure 4 As shown, a method for evaluating the shock absorption effect of a speaker foot pad provided in Embodiment 3 of the present invention comprises the following steps:

[0103] S310, performing sound field analysis on the overall structure of the speaker at rated power, and obtaining the excitation force curves generated by the three subwoofers.

[0104] S320, obtaining analysis data of materials used for speaker foot pads, and establishing a hyperelastic material model based on the analysis data.

[0105] S330. Perform a static analysis on the overall structure of the speaker based on the hyperelastic material model to obtain a static analysis result.

[0106] S340, performing a prestressed modal analysis on the overall structure of the speaker based on the static analysis result to obtain an analysis result, until the natural frequency in the analysis result and the starting frequency of the speaker application frequency band meet a preset condition.

[0107] S350: constructing a geometric model of the acoustic structure corresponding to the analysis result that meets the preset conditions through modeling software.

[0108] Furthermore, in the process of constructing the geometric model of the sound structure corresponding to the analysis result that meets the preset conditions through the modeling software, if the volume of the sound box structure corresponding to the analysis result that meets the preset conditions is greater than a preset value, the other components of the sound box structure except the foot pad are set as rigid components, and the rigid components and the connection between the rigid components and the foot pad are set.

[0109] Among them, if the speaker structure corresponding to the analysis result that meets the preset conditions is too large, the deformation of the non-foot pad parts can be ignored, and the other parts except the foot pads can be set to be rigid, and connections between rigid parts and rigid parts and between rigid parts and foot pads are set to achieve the purpose of reducing the amount of calculation.

[0110] S360, setting the analysis time and the number of steps, defining the damping coefficient of the geometric model, and applying the reaction force included in the excitation force curve as a load to the geometric model.

[0111] S370, solving the geometric model by using a solver provided by the modeling software to obtain a dynamic response result of the speaker structure.

[0112] S380, extracting a curve of the displacement of the sound box structure in three directions of X / Y / Z versus time from the dynamic response result.

[0113] S390, analyzing the curve to obtain speaker bounce offset results under the influence of different frequencies.

[0114] A method for evaluating the shock-absorbing effect of a speaker foot pad is provided in a third embodiment of the present invention. The method combines the results of sound field analysis, modal analysis, and transient dynamics analysis to intuitively compare the magnitude of the risk of bounce and offset between different schemes, and has higher credibility than traditional evaluation methods.

[0115] Embodiment 4

[0116] Figure 5 This is a schematic diagram of the structure of a device for evaluating the shock absorption effect of a speaker foot pad provided in Example 4 of the present invention. The device can be used to reduce the bounce and offset generated when the speaker is working, wherein the device can be implemented by software and / or hardware and is generally integrated on an electronic device.

[0117] like Figure 5 As shown, the device includes: a first analysis module 110 , a building module 120 , a second analysis module 130 , a third analysis module 140 and a fourth analysis module 150 .

[0118] The first analysis module 110 is used to perform a sound field analysis on the overall structure of the speaker at rated power to obtain an excitation force curve generated by three subwoofers;

[0119] Establishing module 120, for obtaining analysis data of materials used in speaker foot pads, and establishing a hyperelastic material model based on the analysis data;

[0120] A second analysis module 130 is used to perform a static analysis on the overall structure of the speaker based on the hyperelastic material model to obtain a static analysis result;

[0121] A third analysis module 140 is used to perform a prestressed modal analysis on the overall structure of the speaker based on the static analysis result to obtain an analysis result, until the natural frequency in the analysis result and the starting frequency of the speaker application frequency band meet a preset condition;

[0122] The fourth analysis module 150 is used to perform transient dynamic analysis on the sound box structure corresponding to the analysis result that meets the preset condition in combination with the excitation force curve, so as to obtain the sound box bounce offset results under the influence of different frequencies.

[0123] In this embodiment, the device first performs a sound field analysis on the overall structure of the speaker at rated power through the first analysis module 110 to obtain the excitation force curves generated by the three subwoofers; secondly, the establishment module 120 obtains the analysis data of the material used for the speaker foot pad, and establishes a hyperelastic material model based on the analysis data; then, the second analysis module 130 performs a static analysis on the overall structure of the speaker based on the hyperelastic material model to obtain a static analysis result; then, the third analysis module 140 performs a prestressed modal analysis on the overall structure of the speaker based on the static analysis result to obtain an analysis result, until the natural frequency in the analysis result and the starting frequency of the speaker application frequency band meet the preset conditions; finally, the fourth analysis module 150 combines the excitation force curve to perform a transient dynamic analysis on the speaker structure corresponding to the analysis result that meets the preset conditions to obtain the speaker bounce offset results under the influence of different frequencies.

[0124] This embodiment provides a device for evaluating the shock-absorbing effect of a speaker pad, which can accurately reflect the characteristics of a superelastic material and improve the evaluation accuracy of the shock-absorbing effect of the speaker pad.

[0125] Furthermore, the establishment module 120 includes:

[0126] A fitting unit, used for fitting the analysis data to obtain two material parameters required for a hyperelastic constitutive model;

[0127] The first establishing unit is used to establish a hyperelastic material model according to the two material parameters.

[0128] Furthermore, the second analysis module 130 includes:

[0129] A second establishing unit is used to establish a mechanical model for the overall structure of the speaker box through finite element analysis software according to the hyperelastic material model, wherein the mechanical model represents the material properties, constraint conditions and load conditions of the overall structure of the speaker box;

[0130] A first division unit is used to mesh the overall structure of the speaker using finite element analysis software to obtain a plurality of finite element units, and to establish a finite element equation according to material properties, constraints and load conditions of the overall structure of the speaker;

[0131] The first solving unit is used to solve the finite element equation through a solver to obtain the displacement, stress and strain of the overall structure of the speaker as a static analysis result.

[0132] Furthermore, the third analysis module 140 includes:

[0133] A processing unit, used to process and simplify the overall structure of the speaker to obtain a target speaker structure;

[0134] A second division unit is used to define the material properties of the target sound box structure, and to mesh the target sound box structure using finite element software according to different division parameters to obtain a plurality of finite element units;

[0135] A first construction unit is used to establish a structural finite element model through finite element software according to the geometric shapes, sizes and material properties of the plurality of finite element units;

[0136] A first applying unit, used for applying prestress in the finite element model according to the static analysis result;

[0137] The calculation unit is used to run a finite element solver according to the modal analysis setting result to calculate the natural frequency of the finite element model under the prestressing effect.

[0138] Based on the above optimization, the preset conditions include:

[0139] The ratio of the starting frequency of the speaker application frequency band to the natural frequency in the analysis result is greater than a set value; the solution of the natural frequency in the analysis result satisfies the following formula:

[0140]

[0141] Among them, f 0 is the natural frequency, k is the stiffness of the overall structure of the speaker, and m is the mass of the overall structure of the speaker.

[0142] Furthermore, the third analysis module 150 includes:

[0143] A second construction unit is used to construct a geometric model of the sound structure corresponding to the analysis result that meets the preset conditions through a modeling software;

[0144] A second applying unit is used to set the analysis time and the number of steps, define the damping coefficient of the geometric model, and apply the action reaction force included in the excitation force curve as a load on the geometric model;

[0145] A second solving unit is used to solve the geometric model by using a solver provided by the modeling software to obtain a dynamic response result of the sound box structure;

[0146] An extraction unit, used to extract a curve of the displacement of the sound box structure in three directions of X / Y / Z over time from the dynamic response result;

[0147] The analysis unit is used to analyze the curve to obtain the speaker bounce deviation results under the influence of different frequencies.

[0148] Based on the above technical solution, in the process of constructing the geometric model of the sound structure corresponding to the analysis result that meets the preset conditions through the modeling software, if the volume of the sound box structure corresponding to the analysis result that meets the preset conditions is greater than a preset value, the other components of the sound box structure except the foot pad are set as rigid components, and the rigid components and the connection between the rigid components and the foot pad are set.

[0149] The above-mentioned device for evaluating the shock absorption effect of the speaker foot pad can execute the method for evaluating the shock absorption effect of the speaker foot pad provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0150] Embodiment 5

[0151] Figure 6 A schematic diagram of the structure of an electronic device 10 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0152] like Figure 6As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0153] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0154] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a method for evaluating the shock absorption effect of a speaker foot pad.

[0155] In some embodiments, a method for evaluating the shock absorption effect of a speaker pad can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the method for evaluating the shock absorption effect of a speaker pad described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to execute a method for evaluating the shock absorption effect of a speaker pad in any other appropriate manner (for example, by means of firmware).

[0156] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0157] In some embodiments, a method for evaluating the shock absorption effect of a speaker foot pad can be implemented as a computer program, which is invisibly included in a computer program product. When the computer program is executed by a processor, it implements a method for evaluating the shock absorption effect of a speaker foot pad of the present invention. The computer program product can be understood as a software product that mainly implements its solution through a computer program. The computer program for implementing the method of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flowchart and / or block diagram are implemented. The computer program can be executed entirely on the machine, partially on the machine, as an independent software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0158] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0159] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0160] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0161] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0162] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0163] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for evaluating the shock absorption effect of a speaker foot pad, characterized in that: The method comprises: Perform sound field analysis on the overall structure of the speaker at rated power to obtain the excitation force curves generated by the three subwoofers; Obtaining analysis data of materials used in speaker foot pads, and establishing a hyperelastic material model based on the analysis data; Performing static analysis on the overall structure of the speaker based on the hyperelastic material model to obtain a static analysis result; Based on the static analysis result, a prestressed modal analysis is performed on the overall structure of the speaker to obtain an analysis result, until the natural frequency in the analysis result and the starting frequency of the speaker application frequency band meet a preset condition; In combination with the excitation force curve, a transient dynamic analysis is performed on the sound box structure corresponding to the analysis result that meets the preset conditions to obtain the sound box bounce offset results under the influence of different frequencies.

2. The method according to claim 1, characterized in that A hyperelastic material model is established based on the analysis data, including: Fitting the analysis data to obtain two material parameters required for a hyperelastic constitutive model; A hyperelastic material model is established according to the two material parameters.

3. The method according to claim 1, characterized in that The static analysis result obtained by performing static analysis on the overall structure of the speaker based on the hyperelastic material model includes: According to the hyperelastic material model, a mechanical model is established for the overall structure of the speaker through finite element analysis software, wherein the mechanical model represents the material properties, constraint conditions and load conditions of the overall structure of the speaker; Using finite element analysis software to mesh the overall structure of the speaker to obtain multiple finite element units, and establishing a finite element equation based on the material properties, constraints and load conditions of the overall structure of the speaker; The finite element equations are solved by a solver to obtain the displacement, stress and strain of the overall structure of the speaker as static analysis results.

4. The method according to claim 1, characterized in that: Based on the static analysis results, a prestressed modal analysis is performed on the overall structure of the speaker to obtain an analysis result, including: The overall structure of the speaker is processed and simplified to obtain the target speaker structure; Defining material properties of the target sound box structure, and using finite element software to mesh the target sound box structure according to different partitioning parameters to obtain a plurality of finite element units; Establishing a structural finite element model by finite element software according to the geometric shapes, sizes and material properties of the plurality of finite element units; Applying prestress in the finite element model according to the static analysis results; According to the modal analysis setting results, a finite element solver is run to calculate the natural frequency of the finite element model under the prestressing force.

5. The method according to claim 1 or 4, characterized in that: The preset conditions include: The ratio of the starting frequency of the speaker application frequency band to the natural frequency in the analysis result is greater than a set value; The solution to the natural frequency in the analysis results satisfies the following formula: Among them, f0 is the natural frequency, k is the stiffness of the overall structure of the speaker, and m is the mass of the overall structure of the speaker.

6. The method according to claim 1, characterized in that The method combines the excitation force curve to perform transient dynamic analysis on the speaker structure corresponding to the analysis result that meets the preset conditions, and obtains the speaker bounce offset results under the influence of different frequencies, including: Constructing a geometric model of the acoustic structure corresponding to the analysis result that meets the preset conditions by using a modeling software; Setting the analysis time and the number of steps, defining the damping coefficient of the geometric model, and applying the reaction force included in the excitation force curve as a load to the geometric model; Solving the geometric model by using a solver provided by the modeling software to obtain a dynamic response result of the speaker structure; Extract the curve of the displacement of the sound box structure in the three directions of X / Y / Z versus time from the dynamic response result; The curve is analyzed to obtain the speaker bounce deviation results under the influence of different frequencies.

7. The method according to claim 6, characterized in that Also includes: In the process of constructing the geometric model of the sound structure corresponding to the analysis result that meets the preset conditions through the modeling software, if the volume of the sound box structure corresponding to the analysis result that meets the preset conditions is greater than a preset value, the other components of the sound box structure except the foot pad are set as rigid components, and the rigid components and the connection between the rigid components and the foot pad are set.

8. A device for evaluating the shock absorption effect of a speaker foot pad, characterized in that: The device comprises: The first analysis module is used to analyze the sound field of the overall structure of the speaker at rated power and obtain the excitation force curve generated by the three subwoofers; Establishing a module for obtaining analysis data of materials used in speaker foot pads, and establishing a hyperelastic material model based on the analysis data; A second analysis module is used to perform a static analysis on the overall structure of the speaker based on the hyperelastic material model to obtain a static analysis result; A third analysis module is used to perform a prestressed modal analysis on the overall structure of the speaker based on the static analysis result to obtain an analysis result, until the natural frequency in the analysis result and the starting frequency of the speaker application frequency band meet a preset condition; The fourth analysis module is used to combine the excitation force curve to perform transient dynamic analysis on the sound box structure corresponding to the analysis result that meets the preset conditions, so as to obtain the sound box bounce offset results under the influence of different frequencies.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively coupled to the at least one processor; The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for evaluating the shock-absorbing effect of the speaker foot pad according to any one of claims 1-7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the shock-absorbing effect evaluation method of a speaker foot pad according to any one of claims 1 to 7 when executed.

11. A computer program product, characterized in that The computer program product comprises a computer program, and when the computer program is executed by a processor, the computer program implements the method for evaluating the shock absorption effect of the speaker foot pad according to any one of claims 1 to 7.

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