Windowing method of LED panel solder mask layer, laser processing device, system and LED panel

Abstract

The application relates to a windowing method of an LED panel solder resist layer, a laser processing device, a system, computer equipment, a computer readable storage medium, a computer program product and an LED panel. The method comprises the following steps: emitting a plurality of laser pulses to a to-be-processed solder resist layer on an LED panel through a laser, a rotating mirror and a target diaphragm are arranged on the light path of each laser pulse, the target diaphragm is used for shaping each laser pulse into a preset window structure shape, and the laser pulse is used for forming a window structure with the preset window structure shape at a corresponding action point position; adjusting the position of the action point position of each laser pulse on the to-be-processed solder resist layer through the rotating mirror and a processing position regulating device, so that each window structure formed by each laser pulse on the to-be-processed solder resist layer is arrayed; the rotating mirror is used for adjusting the displacement component of the action point position in a first direction, and the processing position regulating device is used for adjusting the displacement component of the action point position in a second direction. The windowing efficiency of the solder resist layer can be improved by adopting the method.

Description

Technical Field

[0001] This application relates to the field of solder resist processing technology, and in particular to a method for opening a window in the solder resist layer of an LED panel, laser processing equipment, system, computer equipment, computer-readable storage medium, computer program product, and LED panel. Background Technology

[0002] To protect the circuitry in LED (Light Emitting Diode) panels, the surface of LED panels typically has a solder mask layer. However, LEDs need to be soldered onto the solder mask layer, and the copper layer needs to be exposed in the area where the LEDs need to be soldered. This requires creating openings in the solder mask layer to selectively remove the solder mask material from that area.

[0003] In traditional techniques, the laser beam is typically deflected by a galvanometer and controlled to follow the window contour around the hole to create a window in the solder mask layer. However, each time the laser beam is used to follow the hole at a different location, the galvanometer needs to accelerate, decelerate, and pause, which can consume unnecessary time and result in low processing efficiency. Summary of the Invention

[0004] Based on this, it is necessary to provide a method for opening the solder resist layer of an LED panel, a laser processing equipment, a system, a computer device, a computer-readable storage medium, a computer program product, and an LED panel that can improve the opening efficiency of the solder resist layer, in order to address the above-mentioned technical problems.

[0005] In a first aspect, this application provides a method for opening a window in the solder resist layer of an LED panel, applied to a laser processing equipment, the laser processing equipment including a laser, a target aperture, a processing position control device, and a rotating mirror; the method includes:

[0006] Multiple laser pulses are emitted from a laser onto the solder resist layer to be processed on the LED panel. A rotating mirror and a target aperture are deployed in the optical path of each laser pulse. The target aperture is used to shape each laser pulse into a preset window structure shape. The laser pulses are used to perform laser punching at the action point to form a window structure of the preset window structure shape at the corresponding action point.

[0007] By using a rotating mirror and a processing position control device, the position of each laser pulse on the solder resist layer to be processed is adjusted so that the window structures formed by each laser pulse on the solder resist layer to be processed are distributed in an array.

[0008] The rotating mirror is used to adjust the displacement component of the point of action in the first direction, and the machining position control device is used to adjust the displacement component of the point of action in the second direction. The first direction and the second direction are not collinear.

[0009] In one embodiment, the window structure is used for welding miniature light-emitting diodes; the method further includes, prior to emitting multiple laser pulses through a laser onto the solder resist layer to be processed on the LED panel:

[0010] Obtain the outline shape and outline size information of the micro LED to be soldered;

[0011] The target aperture is determined based on the contour shape information, wherein the opening shape of the target aperture matches the contour shape of the micro light-emitting diode;

[0012] Adjust the opening size of the target aperture based on the contour size information.

[0013] In one embodiment, the target aperture has a rectangular opening shape.

[0014] In one embodiment, the length and width of the micro LED are both less than 60 μm.

[0015] In one embodiment, the laser processing apparatus further includes an optical imaging system deployed along the optical path of each laser pulse; adjusting the opening size of the target aperture based on contour size information includes:

[0016] Based on the contour size information, determine the target aperture size of the target aperture and the target scaling factor of the optical imaging system;

[0017] The aperture size of the target aperture is adjusted to the target aperture size, and the scaling factor of the optical imaging system is adjusted to the target scaling factor. The optical imaging system is configured to image the shaped laser pulse onto the corresponding action point according to the target scaling factor.

[0018] In one embodiment, the processing position control device includes a processing platform, which has a moving mechanism and a first rotating mechanism. The processing platform is used to place the solder resist layer to be processed; the moving mechanism is used to drive the processing platform to move the solder resist layer to be processed; and the first rotating mechanism is used to drive the processing platform to rotate the solder resist layer to be processed.

[0019] In one embodiment, within one scanning cycle, the actual movement direction of the action point is a third direction, which is determined based on the first direction and the second direction;

[0020] Before firing multiple laser pulses at the solder resist layer to be processed on the LED panel via a laser, the method further includes:

[0021] The first rotating mechanism drives the processing platform to rotate, causing the LED panel to rotate until the length direction of the preset window structure coincides with the third direction.

[0022] In one embodiment, the laser processing equipment includes a second rotating mechanism and a third rotating mechanism. The second rotating mechanism is used to drive the target aperture to rotate, and the third rotating mechanism is used to drive the rotating mirror to rotate around the rotation axis of the third rotating mechanism. The rotation axis of the third rotating mechanism and the rotation axis of the rotating mirror are not collinear. Within one scanning cycle, the actual movement direction of the action point is a third direction, which is determined based on the first direction and the second direction.

[0023] Before firing multiple laser pulses at the solder resist layer to be processed on the LED panel via a laser, the method further includes:

[0024] The target aperture is driven to rotate by a second rotating mechanism, and / or the rotating mirror is driven to rotate around the rotation axis of the third rotating mechanism by a third rotating mechanism, so that the length direction of the preset window structure coincides with the third direction.

[0025] In one embodiment, the target aperture includes at least one group of openings, the group of openings including a plurality of openings, the group of openings being used to divide a laser pulse passing through the group of openings into sub-laser beams corresponding to each opening.

[0026] Secondly, this application also provides a laser processing apparatus, which includes a laser, a target aperture, a processing position adjustment device, and a rotating mirror. The rotating mirror and the target aperture are deployed in the optical path of each laser pulse, wherein:

[0027] The laser is configured to emit multiple laser pulses onto the solder mask layer to be processed on the LED panel. The laser pulses are used to perform laser punching at the point of action, forming a window structure of a preset window structure shape at the corresponding point of action.

[0028] The target aperture is configured to shape each laser pulse into a preset window structure shape;

[0029] The rotating mirror is configured to adjust the displacement component of the point of action in the first direction;

[0030] The machining position control device is configured to adjust the displacement component of the action point in the second direction. The first direction and the second direction are not collinear. Through the coordination of the rotating mirror and the machining position control device, the window structures are arranged in an array.

[0031] Thirdly, this application also provides a solder resist layer windowing system, including a controller and the aforementioned laser processing equipment, wherein the controller is used for:

[0032] The laser is controlled to emit multiple laser pulses toward the solder resist layer to be processed on the LED panel. A rotating mirror and a target aperture are deployed in the optical path of each laser pulse. The target aperture is used to shape each laser pulse into a preset window structure shape. The laser pulse is used to perform laser punching at the action point to form a window structure of the preset window structure shape at the corresponding action point.

[0033] The control mirror and processing position adjustment device adjust the position of each laser pulse on the solder resist layer to be processed, so that the window structures formed by each laser pulse on the solder resist layer to be processed are distributed in an array.

[0034] The rotating mirror is used to adjust the displacement component of the point of action in the first direction, and the machining position control device is used to adjust the displacement component of the point of action in the second direction. The first direction and the second direction are not collinear.

[0035] Fourthly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0036] Multiple laser pulses are emitted from a laser onto the solder resist layer to be processed on the LED panel. A rotating mirror and a target aperture are deployed in the optical path of each laser pulse. The target aperture is used to shape each laser pulse into a preset window structure shape. The laser pulses are used to perform laser punching at the action point to form a window structure of the preset window structure shape at the corresponding action point.

[0037] By using a rotating mirror and a processing position control device, the position of each laser pulse on the solder resist layer to be processed is adjusted so that the window structures formed by each laser pulse on the solder resist layer to be processed are distributed in an array.

[0038] The rotating mirror is used to adjust the displacement component of the point of action in the first direction, and the machining position control device is used to adjust the displacement component of the point of action in the second direction. The first direction and the second direction are not collinear.

[0039] Fifthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0040] Multiple laser pulses are emitted from a laser onto the solder resist layer to be processed on the LED panel. A rotating mirror and a target aperture are deployed in the optical path of each laser pulse. The target aperture is used to shape each laser pulse into a preset window structure shape. The laser pulses are used to perform laser punching at the action point to form a window structure of the preset window structure shape at the corresponding action point.

[0041] By using a rotating mirror and a processing position control device, the position of each laser pulse on the solder resist layer to be processed is adjusted so that the window structures formed by each laser pulse on the solder resist layer to be processed are distributed in an array.

[0042] The rotating mirror is used to adjust the displacement component of the point of action in the first direction, and the machining position control device is used to adjust the displacement component of the point of action in the second direction. The first direction and the second direction are not collinear.

[0043] Sixthly, this application also provides a computer program product, including a computer program that, when executed by a processor, performs the following steps:

[0044] Multiple laser pulses are emitted from a laser onto the solder resist layer to be processed on the LED panel. A rotating mirror and a target aperture are deployed in the optical path of each laser pulse. The target aperture is used to shape each laser pulse into a preset window structure shape. The laser pulses are used to perform laser punching at the action point to form a window structure of the preset window structure shape at the corresponding action point.

[0045] By using a rotating mirror and a processing position control device, the position of each laser pulse on the solder resist layer to be processed is adjusted so that the window structures formed by each laser pulse on the solder resist layer to be processed are distributed in an array.

[0046] The rotating mirror is used to adjust the displacement component of the point of action in the first direction, and the machining position control device is used to adjust the displacement component of the point of action in the second direction. The first direction and the second direction are not collinear.

[0047] Seventhly, this application also provides an LED panel, which is processed using the method described above.

[0048] The above-mentioned method for opening windows in the solder resist layer of an LED panel, laser processing equipment, system, computer equipment, computer-readable storage medium, computer program product, and LED panel are described. The method is applied to a laser processing equipment, which includes a laser, a target aperture, a processing position control device, and a rotating mirror. The laser emits multiple laser pulses onto the solder resist layer to be processed on the LED panel. The rotating mirror and the target aperture are deployed in the optical path of each laser pulse. The target aperture is used to shape each laser pulse into a preset window structure shape. The laser pulses are used to perform laser punching at the action point, forming a window structure of the preset window shape at the corresponding action point. Simultaneously, the rotating mirror and the processing position control device adjust the position of each laser pulse's action point on the solder resist layer to make the window structures formed by each laser pulse on the solder resist layer arranged in an array. The rotating mirror is used to adjust the displacement component of the action point in a first direction, and the processing position control device is used to adjust the displacement component of the action point in a second direction. The first and second directions are not collinear.

[0049] On the one hand, for the processing of each window, the laser pulse is shaped into the preset window structure shape by the target aperture, which can directly remove all the solder resist material at the window and form the window structure on the solder resist layer. This simplifies the processing method of controlling the laser beam to move around the contour line in the traditional technology to controlling the laser beam to concentrate at the window, reducing the acceleration, deceleration, and pausing operations during the laser beam movement around the contour line, thus effectively improving processing efficiency.

[0050] On the other hand, regarding the laser deflection process between windows, the laser pulse can be controlled to move rapidly and periodically in the first direction and simultaneously move more slowly and continuously in the second direction, through the cooperation of the rotating mirror and the processing position control device. This allows for the processing of one row of window structures per scanning cycle, and the laser pulse can move to the processing starting point of the next row of window structures each time the scanning cycle is switched. After multiple scanning cycles, an array of window structures can be processed on the solder mask layer. Furthermore, the state of the rotating mirror and the processing position control device can remain unchanged throughout the entire processing of the window structure array, eliminating the need for acceleration, deceleration, or pause operations, thus further improving processing efficiency. Attached Figure Description

[0051] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0052] Figure 1 This is a schematic diagram illustrating a method for opening a window in the solder resist layer of an LED panel in one embodiment.

[0053] Figure 2 This is a schematic diagram illustrating a method for opening a window in the solder resist layer of an LED panel in another embodiment.

[0054] Figure 3 This is a schematic diagram of the structure of a laser processing device in one embodiment;

[0055] Figure 4 This is a flowchart illustrating a method for creating a window in the solder resist layer of an LED panel in one embodiment.

[0056] Figure 5 This is a schematic diagram of the window structure in one embodiment;

[0057] Figure 6 This is a schematic diagram of the laser processing equipment in another embodiment;

[0058] Figure 7 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0059] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0060] To protect the circuitry in LED (Light Emitting Diode) panels, LED panels typically have a solder mask layer. However, LEDs need to be soldered onto the solder mask layer, and the copper layer needs to be exposed in the area where the LEDs need to be soldered. This requires creating openings in the solder mask layer to selectively remove the solder mask material from that area.

[0061] In traditional techniques, the laser beam is typically deflected by a galvanometer and controlled to follow the window contour around the hole to create a window in the solder mask layer. However, this method is inefficient, and the galvanometer needs to be accelerated, decelerated, and paused each time it is processed at a different window location. These operations can consume unnecessary time, resulting in low processing efficiency.

[0062] The smaller LEDs in LED panels not only better adapt to the trend of product miniaturization and thinning, but also offer higher resolution, enabling more precise local dimming, improved contrast and color performance, thus meeting higher quality display requirements. However, they are more difficult to manufacture. With rapid technological advancements, mini LEDs and micro LEDs are becoming increasingly common. During actual production and R&D, the inventors discovered that the pad size for mini LEDs and micro LEDs is also continuously shrinking, currently reaching 60μm×60μm or 50μm×50μm, with further reductions in size still needed. The inventors also found that the solder mask window structure of mini LEDs and micro LEDs is arranged very regularly; that is, the pads requiring window openings are distributed very neatly in an array.

[0063] In this way, on the one hand, as the pad size shrinks, the window size also shrinks. Windows of 60μm×60μm and 50μm×50μm can be completely covered by the focused spot of the laser beam. The laser pulse only needs to be shaped into the preset window structure shape by passing through the target aperture. The solder mask material can be directly removed by using the laser pulse to perform hole punching to open the solder mask. In this way, there is no need to control the movement of the laser beam to scan around the hole during the processing of each window. This reduces the time required to move the laser beam, as well as the time required for acceleration, deceleration, and pausing operations during the movement of the laser beam. On the other hand, by coordinating the rotating mirror and the processing position control device, the laser pulse can be controlled to move rapidly and periodically in the first direction, and simultaneously move more slowly and continuously in the second direction. This allows for the fabrication of a row of window structures in each scanning cycle, and the laser pulse can move to the processing starting point of the next row of window structures each time the scanning cycle is switched. After multiple scanning cycles, an array of window structures can be fabricated on the solder mask layer. Furthermore, the states of the rotating mirror and the processing position control device can remain unchanged throughout the entire fabrication process, eliminating the need for acceleration, deceleration, or pause operations. In other words, by coordinating the rotating mirror and the processing position control device, window structures that meet the arrangement rules of solder mask window structures for mini LEDs and micro LEDs can be efficiently fabricated.

[0064] In one exemplary embodiment, a method for opening a window in the solder resist layer of an LED panel is provided. This embodiment uses the execution subject of the method as a terminal for illustration. The terminal can be a laser processing equipment, or other terminals capable of controlling the laser processing equipment, such as various personal computers, laptops, smartphones, tablets, IoT devices, and portable wearable devices. IoT devices can be smart speakers, smart TVs, smart air conditioners, smart in-vehicle devices, projection devices, etc. Portable wearable devices can be smartwatches, smart bracelets, head-mounted devices, etc. Head-mounted devices can be virtual reality (VR) devices, augmented reality (AR) devices, smart glasses, etc. It is understood that the execution subject of this method can also be a server, or a system including both a terminal and a server, and can be implemented through interaction between the terminal and the server.

[0065] In this embodiment, the method is applied to a laser processing equipment, which includes a laser, a target aperture, a processing position control device, and a rotating mirror.

[0066] Laser processing equipment can refer to equipment that can use a laser beam to process window structures on the surface of the solder resist layer.

[0067] A target stop refers to a physical structure in an optical system used to limit the range of a laser beam. The target stop can be used to shape individual laser pulses so that the shape of the laser pulse after passing through the target stop matches the shape of a preset window structure. The preset window structure shape refers to the shape of the window structure to be processed on the solder mask layer, which can be designed and determined in advance based on the actual processing requirements of the solder mask layer. The preset window structure shape can be circular, rectangular, etc. Matching the shape of the shaped laser pulse with the preset window structure shape means that the shape of the shaped laser pulse is identical to the preset window structure shape, or the similarity between the two is higher than a preset similarity threshold.

[0068] A laser is used to emit multiple laser pulses onto the solder resist layer to be processed on an LED panel. The laser pulses can be incident on the surface of the solder resist layer, forming a focused spot at the window location, concentrating the laser energy at that location. The position of the focused spot is the point of action of the laser pulse on the solder resist layer. After being shaped by a target aperture, the laser pulse takes on a shape corresponding to a preset window structure. After being scaled by optical components such as a focusing lens, a focused spot with the same shape and size as the preset window structure is formed at the window location of the solder resist layer. Therefore, the laser energy at the focused spot can be used to remove the solder resist material at the focused spot, thus forming a window structure of the preset window shape at the focused spot.

[0069] A rotating mirror, also known as a polyhedral rotating scanning mirror, utilizes mirrors uniformly distributed on the outer surface of a polyhedron to deflect laser pulses, thereby controlling the position of the laser pulse's interaction point on the substrate surface. This allows for processing at different locations on the substrate surface. The interaction point of the laser pulse refers to the location where the laser beam interacts with the substrate surface. Without other factors affecting the interaction point, as the rotating mirror rotates, multiple laser pulses create holes on the substrate surface in a linear arrangement. The specific direction of this linear arrangement can be adjusted according to the actual situation.

[0070] The processing position control device can refer to a device that can move the point of action of the laser pulse on the substrate surface by changing the working state, including at least one of optical deflection device and displacement controller.

[0071] The displacement controller can refer to a device that can control the movement of any one or more modules in a laser processing equipment. The change of the working state of the displacement controller can refer to the movement of the displacement controller. For example, the displacement controller can be used to control the movement of the processing platform, thereby driving the LED substrate on the processing platform to move. In this way, the movement of the point of action of the laser pulse on the substrate surface can be achieved by changing the relative position of the laser pulse on the substrate surface with respect to the substrate. For another example, the displacement controller can be used to control the movement of other modules besides the processing platform. This can also change the relative position of the point of action of the laser pulse on the substrate surface with respect to the substrate, thereby achieving the movement of the point of action of the laser pulse on the substrate surface.

[0072] Optical deflection devices can refer to optical elements or systems that can change the propagation direction of laser pulses by changing their operating states. These include galvanometers, second rotating mirrors, or acousto-optic deflectors. The changing operating state of a galvanometer can refer to the rotation of the galvanometer. A second rotating mirror can refer to a rotating mirror used to adjust the displacement component of the laser pulse's point of action in a second direction. The rotation speed of the second rotating mirror is lower than that of the rotating mirror that adjusts the displacement component of the point of action in a first direction. The changing operating state of a second rotating mirror can refer to the rotation of the second rotating mirror. The changing operating state of an acousto-optic deflector can refer to changes in the acoustic mode, diffraction efficiency, etc., of the acousto-optic deflector.

[0073] The high rotational speed of the rotating mirror allows for rapid deflection of the point of application. Furthermore, this high speed ensures that the displacement distance of adjacent laser pulses in the first direction is greater than the length of a single window structure in that direction. This prevents overlap between adjacent laser pulses, allowing for the fabrication of a linearly uniform row of window structures spaced apart during the mirror's uniform rotation. Combined with a processing position control device that adjusts the laser beam's point of application in another direction, the process can be switched continuously from one row of window structures to another, creating a uniformly distributed array of spaced-apart window structures that perfectly matches the arrangement of solder mask window structures in mini LEDs and micro LEDs.

[0074] The deflection of the laser pulse by the rotating mirror is periodic. Within each scanning cycle, the point of action moves uniformly along the first direction from its initial position. However, when two adjacent scanning cycles alternate, the point of action quickly returns to its initial position in the first direction. The machining position control device can continuously or periodically change its working state. If the machining position control device changes its working state periodically, its change period can be equal to the scanning period of the rotating mirror.

[0075] The scanning cycle refers to the total time required to complete multiple scans under the reflection of the same mirror on the rotating mirror. It can be understood that the next scanning cycle begins when the mirror reflecting the laser beam switches. For example, assuming the rotating mirror is an 8-faceted prism, its scanning cycle is the time required for the mirror to rotate 45 degrees. Since the mirrors switch continuously during rotation in one direction, the deflection angle of the laser pulse on the rotating mirror immediately returns to its initial angle after one scanning cycle. Combined with the displacement of the laser pulse's point of action in another direction by the processing position control device, the processing flow can be switched from one row of window structures to another during continuous movement. This eliminates the need for acceleration, deceleration, or pause operations during the entire window array processing, further improving processing efficiency.

[0076] In some feasible implementations, such as Figure 1As shown, assuming the first direction is the positive x-axis, when the rotating mirror independently deflects the laser pulse, the initial position within the scanning cycle is (x0, y0), and the last position is (xn, y0). Within each scanning cycle, the active point starts from (x0, y0) and moves uniformly along the positive x-axis to (xn, y0). At the end of each scanning cycle or the beginning of the next scanning cycle, it quickly returns from (xn, y0) to (x0, y0) to begin the next scanning cycle, and so on. During the independent deflection of the laser pulse by the rotating mirror, the processing position control device changes its working state at the end of each scanning cycle or the beginning of the next scanning cycle, controlling the active point to shift in the positive y-axis direction. Thus, at the end of the previous scanning cycle or the beginning of the next scanning cycle, the active point quickly deflects from (xn, ym) to (x0, ym+1), where ym represents the position of the active point in the previous scanning cycle and ym represents the position of the active point in the next scanning cycle. This cycle can be repeated to process window structures distributed in an array.

[0077] In other feasible implementations, such as Figure 2 As shown, assuming the first direction is the positive x-axis and the second direction is the square y-axis, during the independent deflection of the laser pulse by the rotating mirror, if the processing position control device continuously changes its working state, the actual movement direction of the point of action will be at a certain angle between the positive x-axis and the square y-axis. In this case, the displacement platform or other modules in the optical system can be rotated to match the array distribution direction of the window structure with the actual movement direction of the point of action, thereby processing an array-distributed window structure. It is understood that by turning off the laser or setting a laser beam blocking mechanism at a position other than the preset window structure position, no adverse effects will occur even if the point of action is not at the preset window structure position. Matching the array distribution direction of the window structure with the actual movement direction of the point of action means that the array distribution direction of the window structure is consistent with the actual movement direction of the point of action, or the angular deviation between them is less than a preset angular deviation threshold.

[0078] In some feasible implementations, the laser processing apparatus may also include at least one of a beam adjustment system and an optical imaging system.

[0079] A beam conditioning system refers to an optical system that actively or passively adjusts the spatial, temporal, or energy distribution of a laser pulse incident on it through a series of optical elements and control techniques to meet specific application requirements. The beam conditioning system can be deployed on the light-inlet side of the target aperture to perform shaping, beam expansion, collimation, and homogenization of the laser pulse before it reaches the target aperture.

[0080] In some feasible implementations, if the original laser pulse emitted by the laser is large in size or has high laser energy, while the window structure is small in size, the laser pulse can be split into multiple sub-laser beams through multiple openings in the target aperture, thereby achieving the purpose of simultaneously processing multiple window structures and improving processing efficiency. However, if the original laser pulse cannot completely cover the multiple openings of the target aperture when passing through it, it may result in incomplete processing of some window structures. In this case, it can be addressed by replacing the laser with one capable of emitting laser pulses with larger diameter laser pulses, or by using a beam adjustment system to reshape and expand the original laser pulse.

[0081] An optical imaging system refers to an optical system that uses optical elements to collect, modulate, and reconstruct light waves emitted from an object, ultimately forming an image on a solder resist layer. An optical imaging system may include optical lenses, optical lens groups, or other components that control the optical imaging. The optical imaging system and the target aperture can work together to adjust the size of the focused spot, so that the laser pulse forms a focused spot at the opening position of the solder resist layer that matches the preset window structure shape and size.

[0082] In some feasible implementations, the laser windowing device also includes an aperture control device. An aperture control device can refer to a device capable of controlling the position, opening size, and opening shape of the target aperture. For example, the aperture control device can be a rotating mechanism on the target aperture, which can control the rotation of the target aperture to rotate aperture openings of different shapes or sizes into the optical path, thereby controlling the size and shape of the focused spot; the aperture control device can also be a moving mechanism on the target aperture, which can control the target aperture to move closer to or further away from the laser imaging system, thereby controlling the size of the focused spot.

[0083] In some feasible implementations, such as Figure 3As shown, the laser processing equipment may include a laser 302, a beam adjustment system 304, a reflector 306, a target beam 308, a rotating mirror 310, a focusing lens 312, a processing platform 316, and a driving device 318. The driving device 318 includes a moving mechanism and a rotating mechanism. An LED panel 314 is placed on the processing platform 316. The laser beam emitted by the laser 302 is first processed by the beam adjustment system 304, then reflected by the reflector 306 to the target aperture 308. The target aperture 308 shapes the laser beam into a preset window structure. The shaped laser pulse is then incident on the rotating mirror 310. After the rotating mirror 310 is deflected, the pulse is incident on the focusing lens 312. The focusing lens 312 focuses the pulse onto the solder resist layer of the LED panel 314. Simultaneously, the processing platform 316 can be driven by the driving device 318 to cause relative displacement between the LED panel 314 and the optical system, thereby performing laser punching at the specified opening position on the solder resist layer to form a window structure with a preset window shape.

[0084] In this embodiment, as Figure 4 As shown, the method includes the following steps S10-S20. Wherein:

[0085] Step S10: Multiple laser pulses are emitted from a laser onto the solder resist layer to be processed on the LED panel. A rotating mirror and a target aperture are deployed in the optical path of each laser pulse. The target aperture is used to shape each laser pulse into a preset window structure shape. The laser pulses are used to perform laser punching at the action point to form a window structure of the preset window structure shape at the corresponding action point.

[0086] Laser punching refers to a processing technique that uses the laser energy of a laser beam on a material surface to rapidly ablate or vaporize the material at the point of application, forming a hole structure. The shape and size of the punched structure are basically consistent with the shape and size of the focused laser spot. Laser hole-around processing refers to controlling the laser beam's point of application on the material to move along the area where the hole structure is formed, in order to process larger-sized hole structures. Hole-around processing is suitable for situations where the size of the processed structure is larger than the size of the focused laser spot. For a hole structure, if laser punching is used, the laser pulse does not need to move; it can be fixed at one point of application to process the entire hole structure. However, if laser hole-around processing is used, a high-precision motion control system is required to control the laser pulse to move and remove the material step by step along the hole structure area. Therefore, the efficiency of laser hole-around processing is much lower than that of laser punching.

[0087] For example, before opening the solder mask layer, the laser parameters, the opening shape and size of the target aperture, the rotation speed of the rotating mirror, and the working state change speed of the processing position control device can be preset based on actual needs and the actual situation of the laser processing equipment. During the laser windowing process, each module of the laser processing equipment can be deployed in its corresponding position. For example, the rotating mirror and the target aperture can be set in the optical path of each laser pulse. The parameters of each module can be adjusted to their initial parameters so that the first laser pulse emitted by the laser can be incident on the preset initial position. For example, the deflection angle of the rotating mirror can be adjusted to the initial deflection angle, and the position or angle of the processing position control device can be adjusted to the initial position or initial angle. Then, the substrate with the solder mask layer is picked up manually, by a robot, or by a robotic arm, and placed on the processing platform. Then, the laser is turned on.

[0088] In some feasible implementations, the preset initial position can be the position of the first window structure to be processed. The position of the first window structure to be processed can be determined in advance during the processing design stage, and this embodiment does not limit this. For example, as Figure 5 As shown, assuming that a window structure 504 with six rows and eight columns in an array needs to be processed on the solder mask layer 502, and the pre-planned processing path is to process from left to right and from top to bottom, then the preset initial position can be the position of the first window structure 5041 to be processed.

[0089] In other feasible implementations, the preset initial position can also be any other designated position on the solder mask layer. The point of action can be moved to the position of the first window structure to be processed before the laser emits the first laser pulse.

[0090] Step S20: By using a rotating mirror and a processing position control device, the position of the action point of each laser pulse on the solder resist layer to be processed is adjusted so that the window structures formed by each laser pulse on the solder resist layer to be processed are distributed in an array; wherein, the rotating mirror is used to adjust the displacement component of the action point in the first direction, and the processing position control device is used to adjust the displacement component of the action point in the second direction, and the first direction and the second direction are not collinear.

[0091] For example, after the laser is turned on, the rotating mirror can be immediately controlled to rotate at a pre-set speed in a single direction at a uniform speed. Simultaneously, the processing position control device can be controlled to change its state according to a pre-set working state change speed. In this way, by simply setting the rotation speed of the rotating mirror and the working state change speed of the processing position control device so that the movement speed of the action point in the first direction is greater than the movement speed of the action point in the second direction, the two can cooperate to process an array of window structures on the surface of the solder resist layer.

[0092] In some feasible embodiments, when the rotating mirror rotates at a constant speed, the spacing of the processed window structures in the first direction is equal; when the processing position control device changes the processing state at a constant speed or at equal intervals, the spacing of the processed window structures in the second direction is equal. In this way, the window structures formed on the solder mask layer are uniformly arrayed.

[0093] The aforementioned method for opening windows in the solder resist layer of an LED panel is applied to a laser processing equipment. The laser processing equipment includes a laser, a target aperture, a processing position adjustment device, and a rotating mirror. The laser emits multiple laser pulses onto the solder resist layer to be processed on the LED panel. The rotating mirror and the target aperture are deployed in the optical path of each laser pulse. The target aperture is used to shape each laser pulse into a preset window structure shape. The laser pulses are used to perform laser punching at the action point, forming a window structure of the preset window structure shape at the corresponding action point. Simultaneously, the position of the action point of each laser pulse on the solder resist layer to be processed is adjusted by the rotating mirror and the processing position adjustment device, so that the window structures formed by each laser pulse on the solder resist layer to be processed are distributed in an array. The rotating mirror is used to adjust the displacement component of the action point in the first direction, and the processing position adjustment device is used to adjust the displacement component of the action point in the second direction. The first direction and the second direction are not collinear.

[0094] On the one hand, for the processing of each window, the laser pulse is shaped into the preset window structure shape by the target aperture, which can directly remove all the solder resist material at the window and form the window structure on the solder resist layer. This simplifies the processing method of controlling the laser beam to move around the contour line in the traditional technology to controlling the laser beam to concentrate at the window, reducing the acceleration, deceleration, and pausing operations during the laser beam movement around the contour line, thus effectively improving processing efficiency.

[0095] On the other hand, regarding the laser deflection process between windows, the laser pulse can be controlled to move rapidly and periodically in the first direction and simultaneously move more slowly and continuously in the second direction, through the cooperation of the rotating mirror and the processing position control device. This allows for the processing of one row of window structures per scanning cycle, and the laser pulse can move to the processing starting point of the next row of window structures each time the scanning cycle is switched. After multiple scanning cycles, an array of window structures can be processed on the solder mask layer. Furthermore, the state of the rotating mirror and the processing position control device can remain unchanged throughout the entire processing of the window structure array, eliminating the need for acceleration, deceleration, or pause operations, thus further improving processing efficiency.

[0096] In one exemplary embodiment, the window structure is used for soldering miniature light-emitting diodes; before emitting multiple laser pulses to the solder resist layer to be processed on the LED panel via a laser, the method further includes steps S01-S03, wherein:

[0097] Step S01: Obtain the outline shape information and outline size information of the micro LED to be soldered.

[0098] Among them, micro LEDs refer to LEDs with a size of less than 100μm × 100μm, including mini LEDs or micro LEDs. Due to the small size of micro LEDs, the corresponding window structure is also small, requiring higher precision in the windowing process. This embodiment proposes a novel method for opening the solder mask layer of an LED panel. The laser beam is shaped and adjusted so that the focused spot matches the shape and size of the window structure. The focused spot is then used to directly remove the solder mask material using a punching process to form the window structure. It is understood that, with lower laser energy, effective removal of the solder mask material can be achieved through multiple processing rounds. For example, the laser pulse can be controlled to process from the initial position to the end position, then back to the initial position, and then processed again to the end position, repeating this process multiple times.

[0099] Contour shape information can refer to information describing the geometric shape of a miniature light-emitting diode (LED), and may include at least one of the shape and structural features of the LED's boundaries. In some feasible embodiments, the contour shape information may be a design drawing or structural diagram of the miniature LED.

[0100] Outline dimension information refers to parameter values ​​that describe the specific dimensions of a micro light-emitting diode, and may include at least one of the following: length, width, height, and diameter.

[0101] Step S02: Determine the target aperture based on the contour shape information, wherein the opening shape of the target aperture matches the contour shape of the micro light-emitting diode.

[0102] The core component of the aperture is an adjustable or fixed opening used to limit the amount of light passing through. The shape of the opening can be circular, square, or other geometric shapes. The shape of the target aperture's opening determines the shape of the window that the laser pulse processes on the solder mask layer. That is, if the target aperture's opening shape is circular, the laser pulse will process a circular window on the solder mask layer; if the target aperture's opening shape is rectangular, the laser pulse will process a rectangular window on the solder mask layer.

[0103] Matching the opening shape of the target aperture with the outline shape of the micro LED can mean that the opening shape of the target aperture is consistent with the outline shape of the micro LED, or that the similarity between the two is higher than a preset similarity threshold.

[0104] For example, the micro LED to be welded can be determined first, and then the outline shape information and outline size information of the micro LED can be obtained through user input or size detection. Then, based on the obtained outline shape information, a target aperture that matches the outline shape of the micro LED can be selected from the existing apertures, or a target aperture that matches the outline shape of the micro LED can be made based on the obtained outline shape information.

[0105] In this context, matching the shape of the opening with the outline of the micro LED can mean that the shapes are the same, but the sizes can be the same or different.

[0106] Step S03: Adjust the opening size of the target aperture based on the contour size information.

[0107] The size of the target aperture is adjustable.

[0108] For example, the target aperture usually has multiple openings of different sizes. The corresponding opening size can be calculated based on the contour size information, and the opening of the corresponding size can be adjusted into the optical path.

[0109] In this embodiment, by determining and adjusting the shape and size of the target aperture based on the contour shape and size information of the micro-LED, it can be ensured that the micro-LED laser can be successfully welded to the window structure processed on the solder resist layer. On the other hand, since the shape of micro-LEDs is usually relatively uniform, but their sizes vary, the adjustable-size target aperture can adapt to the actual needs of different LED panels, thus having a wider range of applications.

[0110] In one exemplary embodiment, the opening shape of the target aperture is rectangular.

[0111] In this embodiment, the shape of the micro light-emitting diode is usually rectangular. The laser pulse can be shaped by the target aperture with a rectangular opening so that the focused spot formed by the laser pulse on the solder resist layer is rectangular. This allows the rectangular solder resist layer material to be directly eliminated, forming a rectangular window structure.

[0112] In one exemplary embodiment, the length and width of the micro LED are both less than 60 μm.

[0113] It should be noted that ultrafast laser processing equipment can refer to equipment that uses ultrafast lasers for high-precision processing. Ultrafast lasers can refer to pulsed lasers with pulse widths in the picosecond, femtosecond, or attosecond range. The extremely short pulse width of ultrafast lasers allows them to transfer energy to the material surface in a very short time, effectively removing solder resist materials.

[0114] Ultrafast laser processing equipment can provide focused light spots with a diameter of approximately 10-80 μm. The focused light spot formed by an unshaped pulsed laser is usually circular, while micro LEDs are usually rectangular. When a rectangular micro LED can be completely contained within the focused light spot, it can be shaped to achieve punching. Therefore, for micro LEDs with a length and width of less than 60 μm, ultrafast laser processing equipment can be used to effectively and precisely process the corresponding window structure on the solder mask layer.

[0115] In an exemplary embodiment, the laser processing equipment further includes an optical imaging system deployed along the optical path of each laser pulse; adjusting the opening size of the target aperture based on the contour size information includes steps S031 to S032:

[0116] Step S031: Based on the contour size information, determine the target aperture size of the target aperture and the target scaling factor of the optical imaging system;

[0117] Step S032: Adjust the aperture size of the target aperture to the target aperture size, and adjust the scaling factor of the optical imaging system to the target scaling factor. The optical imaging system is configured to image the shaped laser pulse onto the corresponding action point according to the target scaling factor.

[0118] For example, both the target aperture and the optical imaging system can adjust the size of the focused spot. Therefore, when the laser processing equipment is equipped with both a target aperture and an optical imaging system, the target opening size of the target aperture and the target scaling factor of the optical imaging system can be determined based on the contour size information. Then, the opening size of the target aperture can be adjusted to the target opening size, and the scaling factor of the optical imaging system can be adjusted to the target scaling factor.

[0119] Among them, the target aperture size of the target aperture and the target scaling factor of the optical imaging system should make the size of the focused spot match the contour size information. That is, after the laser pulse passes through the target aperture shaping and the optical imaging system focusing, the size of the focused spot formed on the solder resist layer to be processed should be consistent with the contour size of the micro light-emitting diode, or the difference between the two should be less than the preset size difference threshold.

[0120] In this embodiment, if the size of the micro LED is further reduced or the single pulse energy is further increased, the size of the focused spot that can be effectively processed may be several times larger than that of the micro LED. In this case, multiple window structures can be processed in one laser pulse through multiple aperture openings of the target aperture, thereby further improving processing efficiency.

[0121] In an exemplary embodiment, the processing position control device includes a processing platform, which has a moving mechanism and a first rotating mechanism. The processing platform is used to place the solder resist layer to be processed; the moving mechanism is used to drive the processing platform to move the solder resist layer to be processed; and the first rotating mechanism is used to drive the processing platform to rotate the solder resist layer to be processed.

[0122] It should be noted that the rotating mirror is used to control the laser pulse to process a row of window structures within one scanning cycle. The processing position control device only needs to move the point of action in the second direction by the length of one row spacing within the time range of one rotation cycle of the rotating mirror to achieve row switching, so that the laser pulse can process the next row of window structures in the next scanning cycle. Therefore, the displacement control speed of the processing position control device for the laser pulse can be relatively low.

[0123] When the processing state of the processing position control device changes continuously, it is often necessary to adjust the angle of the solder mask layer or the optical system. While adjusting the optical system can achieve changes in position and angle, its complexity makes adjustment even more complicated. Furthermore, optical systems are less stable, and many optical components are susceptible to environmental influences. Adjusting the optical system can easily lead to more complex problems, increasing the complexity of the adjustment and potentially reducing processing quality.

[0124] During the process of opening windows in the solder mask layer, the processing platform is mainly used to place and fix the solder mask layer to be processed. Changing the position or angle of the processing platform is not only simple in structure and adjustment, but also does not affect the optical system, resulting in higher processing stability.

[0125] By setting a moving structure and a first rotating mechanism on the processing platform, the processing platform can be moved and rotated. This allows the solder resist layer placed and fixed on the processing platform to be moved and rotated, thereby realizing the transformation of the relative position and relative angle between the solder resist layer and the entire optical system.

[0126] The moving structure may include at least one of a guide rail, a motor, etc. The first rotating mechanism may include at least one of a worm gear, a motor, etc.

[0127] In this embodiment, by setting a moving mechanism and a first rotating mechanism on the processing platform, the relative position and relative angle between the solder resist layer to be processed and the entire optical system can be transformed. This not only simplifies the hardware structure and the control method, but also avoids affecting the optical system and improves processing stability.

[0128] In an exemplary embodiment, within one scanning cycle, the actual movement direction of the action point is a third direction, which is determined based on a first direction and a second direction; before emitting multiple laser pulses to the solder resist layer to be processed on the LED panel via the laser, the method further includes:

[0129] The first rotating mechanism drives the processing platform to rotate, causing the LED panel to rotate until the length direction of the preset window structure coincides with the third direction.

[0130] In the case where the processing position control device is a processing platform, due to the limited moving speed of the processing platform, it is usually difficult to move the length of one row spacing within the interval of one laser pulse. Therefore, the displacement control of the action point in the second direction by the processing platform is usually continuous. In this case, the actual movement direction of the action point is determined based on the first and second directions, and is usually within the angle formed between the first and second directions. Specifically, it can be determined according to the rotation speed of the rotating mirror and the state change speed of the processing position control device, etc., which is not limited in this embodiment.

[0131] For example, before emitting the laser pulse, the processing platform can be driven to rotate by a first rotating mechanism, causing the solder resist layer to be processed to rotate until the length direction of the preset window structure on the solder resist layer coincides with the third direction. For example, as Figure 2 As shown, the preset window structure length direction is the length direction of the rectangular window structure, and the third direction is the direction indicated by the dotted arrow pointing to the upper right. By rotating the welding layer to be processed, the preset window structure length direction can be made to coincide with the third direction.

[0132] As an example, the rotation angle that makes the length direction of the preset window structure coincide with the third direction can be calculated in advance, and then the processing platform can be driven to rotate by the first rotation mechanism.

[0133] In this embodiment, by rotating the processing platform, the state change speed of the rotating mirror and the processing platform, as well as the processing direction, can be more flexibly controlled. The complex changes in the position and angle of the optical system are transformed into simple changes in the processing platform, effectively reducing the processing complexity while ensuring the effective processing of the array-distributed window structure.

[0134] In an exemplary embodiment, the laser processing equipment includes a second rotating mechanism and a third rotating mechanism. The second rotating mechanism is used to drive the target aperture to rotate, and the third rotating mechanism is used to drive the rotating mirror to rotate around the rotation axis of the third rotating mechanism. The rotation axis of the third rotating mechanism and the rotation axis of the rotating mirror are not collinear. Within one scanning cycle, the actual movement direction of the action point is a third direction, which is determined based on the first direction and the second direction.

[0135] Before firing multiple laser pulses at the solder resist layer to be processed on the LED panel via a laser, the method further includes:

[0136] The target aperture is driven to rotate by a second rotating mechanism, and / or the rotating mirror is driven to revolve by a third rotating mechanism, so that the length direction of the preset window structure coincides with the third direction.

[0137] In the case where the displacement control of the point of action in the second direction is continuous, the actual movement direction of the point of action is determined based on the first and second directions, and is usually in the angle formed between the first and second directions. Specifically, it can be determined according to the rotation speed of the rotating mirror and the state change speed of the processing position control device, etc. This embodiment does not impose any restrictions on this.

[0138] In this case, the length direction of the preset window structure can be made to coincide with the actual movement direction of the point of action by simultaneously rotating the target aperture and the rotating mirror.

[0139] For example, before emitting a laser pulse, the target aperture can be driven to rotate by a second rotating mechanism. Simultaneously, the rotating mirror can be driven to rotate around the rotation axis of the third rotating mechanism by a third rotating mechanism, so that the length direction of the preset window structure coincides with the third direction.

[0140] As an example, a rotation angle that would make the length direction of the preset window structure coincide with the third direction can be pre-calculated, and then the target aperture can be rotated by the second rotation mechanism to rotate by the rotation angle, and / or the rotating mirror can be rotated around the rotation axis of the third rotation mechanism by the third rotation mechanism to rotate by the rotation angle.

[0141] In this embodiment, by controlling the rotating mirror and the target aperture to rotate synchronously, the effective processing of window structures distributed in an array can also be achieved.

[0142] In an exemplary embodiment, the target aperture includes at least one group of openings, the group of openings including a plurality of openings, the group of openings being used to divide a laser pulse passing through the group of openings into sub-laser beams corresponding to each opening.

[0143] The aperture group consists of multiple apertures, and one aperture group is used to shape a laser pulse incident on the target aperture. Since the aperture group consists of multiple apertures, there is a light-blocking part between any two apertures. Therefore, after a laser pulse passes through an aperture group, it will be split into multiple sub-laser beams, and each sub-laser beam is shaped by one of the aperture groups.

[0144] In this embodiment, if the size of the original laser pulse emitted by the laser is large or the laser energy is high, while the size of the window structure is small, the laser energy of one laser pulse may be sufficient to remove the solder resist material at multiple window structures. In this case, by dividing the laser pulse into multiple sub-laser beams, the purpose of processing multiple window structures simultaneously can be achieved, thereby improving processing efficiency.

[0145] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps.

[0146] Based on the same inventive concept, this application also provides a laser processing apparatus for implementing the above-described method for opening a window in the solder resist layer of an LED panel. The solution provided by this apparatus is similar to the solution described in the above method; therefore, the specific limitations in one or more laser processing apparatus embodiments provided below can be found in the above-described limitations regarding the method for opening a window in the solder resist layer of an LED panel, and will not be repeated here.

[0147] In one exemplary embodiment, such as Figure 6As shown, a laser processing apparatus is provided, comprising a laser 602, a target aperture 604, a processing position adjustment device 608, and a rotating mirror 606. The rotating mirror 606 and the target aperture 604 are deployed in the optical path of each laser pulse, wherein:

[0148] Laser 602 is configured to emit multiple laser pulses toward the solder resist layer 612 to be processed. The laser pulses are used to perform laser punching at the action point to form a window structure with a preset window structure shape at the corresponding action point.

[0149] The target aperture 604 is configured to shape each laser pulse into a preset window structure shape;

[0150] The rotating mirror 606 is configured to adjust the displacement component of the point of action in the first direction;

[0151] The machining position control device 608 is configured to adjust the displacement component of the action point in the second direction. The first direction and the second direction are not collinear. Through the cooperation of the rotating mirror 603 and the machining position control device 608, the window structures are arranged in an array.

[0152] In one exemplary embodiment, a solder resist layer opening system is provided. The system includes a controller and the aforementioned laser processing equipment. The controller is used to control the laser processing equipment to implement the method for opening the solder resist layer of an LED panel, specifically for:

[0153] The laser is controlled to emit multiple laser pulses toward the solder resist layer to be processed on the LED panel. A rotating mirror and a target aperture are deployed in the optical path of each laser pulse. The target aperture is used to shape each laser pulse into a preset window structure shape. The laser pulse is used to perform laser punching at the action point to form a window structure of the preset window structure shape at the corresponding action point.

[0154] The control mirror and processing position adjustment device adjust the position of each laser pulse on the solder resist layer to be processed, so that the window structures formed by each laser pulse on the solder resist layer to be processed are distributed in an array.

[0155] The rotating mirror is used to adjust the displacement component of the point of action in the first direction, and the machining position control device is used to adjust the displacement component of the point of action in the second direction. The first direction and the second direction are not collinear.

[0156] In one exemplary embodiment, the controller may also implement the steps in the above-described method embodiments.

[0157] In one exemplary embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 7As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, Near Field Communication (NFC), or other technologies. When the computer program is executed by the processor, it implements a method for opening a window in the solder mask layer of an LED panel. The display unit is used to form a visually visible image and can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0158] Those skilled in the art will understand that Figure 7 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0159] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0160] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0161] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0162] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0163] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, database, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0164] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0165] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method of opening a window in a solder resist layer of an LED panel, characterized by, The method is applied to a laser processing device, and the laser processing device comprises a laser, a target diaphragm, a processing position regulating device and a rotating mirror. The method comprises the following steps: a plurality of laser pulses are emitted by the laser to a solder resist layer to be processed on an LED panel, wherein the rotating mirror and the target diaphragm are arranged on the light paths of the laser pulses, the target diaphragm comprises at least one opening group, the opening group comprises a plurality of openings, the opening group is used for dividing the laser pulses passing through the opening group into sub-laser beams corresponding to the openings respectively, and the target diaphragm is used for shaping the laser pulses into a preset window structure shape, so as to perform laser punching processing on the action point positions and form window structures with the preset window structure shape at the corresponding action point positions; the positions of the action point positions on the solder resist layer to be processed are adjusted by the rotating mirror rotating at a constant speed and the processing position regulating device moving at a constant speed, and in a scanning period, the actual moving direction of the action point positions is a third direction determined based on a first direction and a second direction, so that the window structures formed by the laser pulses on the solder resist layer to be processed are arranged in a continuous array.

2. The method of claim 1, wherein, The rotating mirror is used for adjusting the displacement component of the action point positions in the first direction, the processing position regulating device is used for adjusting the displacement component of the action point positions in the second direction, and the first direction is not collinear with the second direction. The window structure is used for welding a micro light emitting diode, and before the plurality of laser pulses are emitted by the laser to the solder resist layer to be processed on the LED panel, the method further comprises the following steps: obtaining contour shape information and contour size information of the micro light emitting diode to be welded; determining a target diaphragm based on the contour shape information, wherein the opening shape of the target diaphragm matches the contour shape of the micro light emitting diode; 3. The method of claim 2, wherein, adjusting the opening size of the target diaphragm based on the contour size information.

4. The method of claim 2, wherein, The opening shape of the target diaphragm is a rectangle.

5. The method of claim 2, wherein, The length and width of the micro light emitting diode are both less than 60 μm. The laser processing device further comprises an optical imaging system arranged on the light paths of the laser pulses; The adjusting of the opening size of the target diaphragm based on the contour size information comprises the following steps: determining a target opening size of the target diaphragm and a target scaling ratio of the optical imaging system based on the contour size information; 6. The method of claim 1, wherein, adjusting the opening size of the target diaphragm to the target opening size and adjusting the scaling ratio of the optical imaging system to the target scaling ratio, wherein the optical imaging system is configured to image the shaped laser pulses to the corresponding action point positions according to the target scaling ratio. The processing position regulating device comprises a processing platform, the processing platform has a moving mechanism and a first rotating mechanism, the processing platform is used for placing the solder resist layer to be processed, the moving mechanism is used for driving the processing platform to move the solder resist layer to be processed, and the first rotating mechanism is used for driving the processing platform to rotate the solder resist layer to be processed.

7. The method of claim 6, wherein, Before the laser emits a plurality of laser pulses to the solder resist layer to be processed on the LED panel, the method further comprises: The first rotating mechanism drives the processing platform to rotate, and the LED panel is rotated to a preset window structure length direction coinciding with the third direction.

8. The method of claim 1, wherein, The laser processing device comprises a second rotating mechanism and a third rotating mechanism, the second rotating mechanism is configured to drive the target diaphragm to rotate, and the third rotating mechanism is configured to drive the rotating mirror to rotate around the rotating shaft of the third rotating mechanism, and the rotating shaft of the third rotating mechanism is not collinear with the rotating shaft of the rotating mirror. Before the laser emits a plurality of laser pulses to the solder resist layer to be processed on the LED panel, the method further comprises: The second rotating mechanism drives the target diaphragm to rotate, and / or the third rotating mechanism drives the rotating mirror to rotate around the rotating shaft of the third rotating mechanism, so that the preset window structure length direction coincides with the third direction.

9. A laser processing apparatus characterized by comprising: The laser processing device comprises a laser, a target diaphragm, a processing position regulating device, and a rotating mirror, the rotating mirror and the target diaphragm are arranged on the light path of each laser pulse, wherein: The laser is configured to emit a plurality of laser pulses to the solder resist layer to be processed on the LED panel, the laser pulses are used for laser punching processing at the action point, and a window structure with a preset window structure shape is formed at the corresponding action point. The target diaphragm is configured to shape each laser pulse into a preset window structure shape; the target diaphragm comprises at least one opening group, the opening group comprises a plurality of openings, and the opening group is used for dividing the laser pulse passing through the opening group into a plurality of sub-laser beams corresponding to each opening. The rotating mirror rotating at a constant speed is configured to adjust the displacement component of the action point in the first direction. The processing position regulating device moving at a constant speed is configured to adjust the displacement component of the action point in the second direction, the first direction is not collinear with the second direction, and through the cooperation of the rotating mirror and the processing position regulating device, the actual moving direction of the action point in a scanning cycle is a third direction determined based on the first direction and the second direction, so that each window structure is arranged in a continuous array.

10. A solder resist windowing system, characterized by, The system comprises a controller and the laser processing device of claim 9, and the controller is used for: controlling the laser to emit a plurality of laser pulses to the solder resist layer to be processed on the LED panel, wherein the rotating mirror and the target diaphragm are arranged on the light path of each laser pulse, the target diaphragm comprises at least one opening group, the opening group comprises a plurality of openings, the opening group is used for dividing the laser pulse passing through the opening group into a plurality of sub-laser beams corresponding to each opening, the target diaphragm is used for shaping each laser pulse into a preset window structure shape, and the laser pulse is used for laser punching processing at the action point, and a window structure with a preset window structure shape is formed at the corresponding action point. The rotating mirror rotating at a constant speed and the machining position adjusting device moving at a constant speed are controlled to adjust positions of the action point positions of the laser pulses on the solder resist layer to be machined, and in a scanning period, actual moving directions of the action point positions are third directions determined based on first directions and second directions, so that the window structures formed by the laser pulses on the solder resist layer to be machined are distributed in a continuous array. The rotating mirror is used to adjust a displacement component of the action point position in the first direction, and the machining position adjusting device is used to adjust a displacement component of the action point position in the second direction, and the first direction is not collinear with the second direction. 11.A computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the computer device is configured to perform the method according to any one of claims 1-10 when the computer program is executed by the processor. The computer program is executed by the processor to implement the steps of the method in any one of claims 1 to 8.

12. A computer readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method in any one of claims 1 to 8.

13. A computer program product comprising a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method in any one of claims 1 to 8.

14. An LED panel, characterized in that The LED panel is machined by the method in any one of claims 1 to 8.

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