A chip filtering and separation device for wafer cutting machine

Abstract

The present invention relates to the field of solid-liquid separation technology, and specifically to a chip filtering and separating device for a wafer cutting machine, comprising a housing; a filter chamber provided in the housing; a filter assembly provided in the filter chamber; a liquid outlet and a liquid inlet provided in the housing; a tray provided at the bottom of the filter chamber for lifting and lowering; a waste seat provided on the tray; a waste channel provided with a waste inlet at the top of the waste seat; a waste outlet provided at the bottom of the waste seat; the waste inlet and the top of the waste channel are arranged opposite each other; the waste outlet and the bottom of the waste channel are arranged opposite each other; an upper baffle is provided for sliding between the waste channel and the waste inlet; a lower baffle is provided for sliding between the waste channel and the waste outlet; and a linkage mechanism is provided between the upper baffle and the lower baffle. The present invention controls the connection and blockage between the waste inlet and the waste channel, and controls the connection and blockage between the waste outlet and the waste channel, by providing the upper baffle, the lower baffle, and the linkage mechanism, so as to automatically discharge solid matter.

Description

Technical Field

[0001] The present invention relates to the technical field of solid-liquid separation, and in particular to a chip filtering and separation device for a wafer cutting machine. Background Art

[0002] In the wafer cutting fluid circulation system, the used cutting fluid will be mixed with a large amount of suspended debris and particulate impurities. If these impurities are not removed in time, they will seriously affect the performance of the cutting fluid and the accuracy of the cutting process. Therefore, liquid-solid separation must be achieved through sedimentation and filtration to ensure that the cutting fluid can be recycled. At present, most traditional filtration devices use a sedimentation box as the main solid-liquid separation equipment. Its principle is to use gravity to make the debris naturally settle in the sedimentation box, and then manually clean the sediment at the bottom of the box regularly. This method has many disadvantages: on the one hand, manual cleaning of sediments not only requires a lot of manpower and is extremely labor-intensive; on the other hand, the manual cleaning process requires the suspension of the filtration system. Frequent cleaning operations can easily cause interruptions in the filtration system, seriously affecting the continuity and stability of the entire machine operation, thereby reducing the production efficiency of wafer cutting and increasing production costs. It is difficult to meet the modern semiconductor manufacturing industry's demand for efficient and stable production. Summary of the Invention

[0003] The purpose of the present invention is to address the above-mentioned deficiencies in the prior art and to provide a chip filtering and separation device for a wafer cutting machine.

[0004] The object of the present invention is achieved through the following technical solution: A chip filtering and separating device for a wafer cutting machine, comprising a housing; the housing is provided with a filter cavity; a filter assembly is provided in the filter cavity; the housing is provided with a liquid outlet at the top of the filter assembly, which is in communication with the filter cavity; the housing is provided with a liquid inlet at the bottom of the filter assembly, which is in communication with the filter cavity;

[0005] The bottom of the filter chamber is provided with a tray that can be lifted and lowered; the tray is provided with a waste seat; the waste seat is provided with a waste channel; the top of the waste seat is provided with a waste inlet that is connected to the filter chamber; the bottom of the waste seat is provided with a waste outlet that is connected to the outside world; the waste inlet is arranged opposite to the top of the waste channel; the waste outlet is arranged opposite to the bottom of the waste channel;

[0006] An upper baffle is slidably provided between the waste channel and the waste inlet; a lower baffle is slidably provided between the waste channel and the waste outlet; a linkage mechanism is provided between the upper baffle and the lower baffle;

[0007] A trigger hole is provided through the bottom of the box body; the waste seat is telescopically arranged in the trigger hole.

[0008] The present invention is further configured such that an upper slide groove is provided on the top of the waste seat in the horizontal direction; a lower slide groove is provided on the bottom of the waste seat in the horizontal direction; the upper baffle is slidably arranged in the upper slide groove; and the lower baffle is slidably arranged in the lower slide groove.

[0009] The present invention is further configured such that the linkage mechanism includes an upper drive block that is movable and telescopically arranged on the waste material seat in a horizontal direction, and a lower drive block that is movable and telescopically arranged on the waste material seat in a horizontal direction; the upper drive block is arranged on the top of the lower drive block; a linkage rod is provided between the upper drive block, the lower drive block, the upper baffle and the lower baffle;

[0010] The bottom of the upper driving block is provided with an upper inclined surface for abutting against the top of the trigger hole; the top of the lower driving block is provided with a lower inclined surface for abutting against the bottom of the trigger hole; a reset spring is provided between the tray and the box body.

[0011] The present invention is further configured such that the linkage rod is provided with an upper strip groove and a lower strip groove along the length direction; the upper drive block is provided with an upper guide pin; the lower drive block is provided with a lower guide pin; the upper guide pin is movably provided in the upper strip groove; and the lower guide pin is movably provided in the lower strip groove.

[0012] The present invention is further configured as follows: the top telescopic movement of the linkage rod is provided with an upper telescopic block; an upper spring is provided between the linkage rod and the upper telescopic block; the upper baffle is provided with an upper horizontal groove along the horizontal direction; the upper telescopic block is movably provided in the upper horizontal groove; the bottom telescopic movement of the linkage rod is provided with a lower telescopic block; a lower spring is provided between the linkage rod and the lower telescopic block; the lower baffle is provided with a lower horizontal groove along the horizontal direction; the lower telescopic block is movably provided in the lower horizontal groove.

[0013] The present invention is further configured such that a bubble generating disk is provided in the filter cavity; the bubble generating disk is provided with a plurality of air holes; the box body is provided with an air pipe connected to the air holes; and the bubble generating disk is provided between the liquid inlet and the filter assembly.

[0014] The present invention is further configured such that a guide plate is provided on the top of the box body; a rotating seat is rotatably provided on the bottom of the guide plate; the rotating seat is provided with a liquid inlet channel; the bottom of the liquid inlet channel is the liquid inlet; and the guide plate is provided with a drive motor for driving the rotating seat to rotate.

[0015] The present invention is further configured such that the filter assembly includes a fixed ring fixed in the filter cavity, an extrusion plate movable and arranged on a rotating seat, and filter cotton arranged between the fixed ring and the extrusion plate; the extrusion plate rotates synchronously with the rotating seat.

[0016] The present invention is further configured such that the box body is provided with a cleaning inlet communicating with the filter cavity at the top of the filter assembly; and the box body is provided with a cleaning outlet communicating with the filter cavity at the bottom of the filter assembly.

[0017] The present invention is further configured such that a cam ring is provided in the filter cavity; a connecting rod is provided on the extrusion plate; and the connecting rod abuts against the cam ring.

[0018] Beneficial effects of the present invention: The present invention controls the communication and blockage between the waste inlet and the waste channel and controls the communication and blockage between the waste outlet and the waste channel by setting an upper baffle, a lower baffle and a linkage mechanism, thereby automatically discharging solid matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the present invention;

[0020] Figure 2 It is a structural schematic diagram of another perspective of the present invention;

[0021] Figure 3 is a cross-sectional view of the first state of the present invention;

[0022] Figure 4 yes Figure 3 A partial enlarged view of part A in the middle;

[0023] Figure 5 is a cross-sectional view of the second state of the present invention;

[0024] Figure 6 yes Figure 5 A partial enlarged view of part B in the middle;

[0025] Wherein: 1. Box; 11. Filter chamber; 12. Liquid outlet; 13. Cleaning inlet; 14. Cleaning outlet; 21. Tray; 22. Trigger hole; 23. Return spring; 3. Waste holder; 31. Waste channel; 32. Waste inlet; 33. Waste outlet; 34. Upper chute; 35. Lower chute; 41. Upper baffle; 42. Lower baffle; 43. Upper horizontal chute; 44. Lower horizontal chute; 51. Upper drive block; 52. Lower drive block; 53. Upper inclined surface; 54. Lower inclined surface Surface; 55. Upper guide pin; 56. Lower guide pin; 6. Linkage rod; 61. Upper strip groove; 62. Lower strip groove; 63. Upper telescopic block; 64. Lower telescopic block; 65. Upper spring; 66. Lower spring; 7. Bubble generating disk; 71. Air hole; 72. Air pipe; 8. Guide disk; 81. Drive motor; 82. Rotating seat; 83. Liquid inlet channel; 84. Liquid inlet; 91. Fixed ring; 92. Extrusion plate; 93. Filter cotton; 94. Cam ring; 95. Connecting rod. DETAILED DESCRIPTION

[0026] The present invention is further described with reference to the following examples.

[0027] Depend on Figures 1 to 6It can be seen that the chip filtering and separation device for a wafer cutting machine described in this embodiment includes a housing 1; the housing 1 is provided with a filter cavity 11; a filter assembly is provided in the filter cavity 11; the housing 1 is provided with a liquid outlet 12 at the top of the filter assembly, which is in communication with the filter cavity 11; the housing 1 is provided with a liquid inlet 84 at the bottom of the filter assembly, which is in communication with the filter cavity 11;

[0028] A tray 21 is provided at the bottom of the filter chamber 11 for movable lifting; the tray 21 is provided with a waste seat 3; the waste seat 3 is provided with a waste channel 31; a waste inlet 32 ​​is provided at the top of the waste seat 3 and communicates with the filter chamber 11; a waste outlet 33 is provided at the bottom of the waste seat 3 and communicates with the outside world; the waste inlet 32 ​​is arranged opposite the top of the waste channel 31; and the waste outlet 33 is arranged opposite the bottom of the waste channel 31.

[0029] An upper baffle 41 is provided for sliding movement between the waste channel 31 and the waste inlet 32; a lower baffle 42 is provided for sliding movement between the waste channel 31 and the waste outlet 33; and a linkage mechanism is provided between the upper baffle 41 and the lower baffle 42;

[0030] A trigger hole 22 is formed through the bottom of the box body 1 ; the waste seat 3 is telescopically arranged in the trigger hole 22 .

[0031] Specifically, when the chip filtering and separation device for the wafer cutting machine described in this embodiment is in use, the waste liquid enters the filter chamber 11 from the liquid inlet 84, the heavier solid matter settles into the tray 21, and the liquid passes through the filter assembly upward and flows out from the liquid outlet 12, thereby completing the solid-liquid separation.

[0032] When the overall weight of the tray 21 is relatively light, the lower baffle 42 blocks the waste outlet 33 and the waste channel 31, and the upper baffle 41 does not block the waste inlet 32 ​​and the waste channel 31. At this time, the waste inlet 32 ​​and the waste channel 31 are in a connected state; solid matter enters the waste channel 31 from the waste inlet 32, and because the lower baffle 42 blocks the waste inlet 32 ​​and the waste channel 31, the solid matter accumulates in the waste channel 31. When the weight of the solid matter accumulated on the tray 21 is sufficient, the tray 21 drives the waste seat 3 to move downward, and through the action of the linkage mechanism, the upper baffle 41 blocks the waste outlet 33 and the waste channel 31 to prevent waste liquid from entering the waste channel 31, and the lower baffle 42 opens the waste inlet 32 ​​and the waste channel 31 to connect, so that the solid matter in the waste channel 31 falls from the waste outlet 33.

[0033] This embodiment provides an upper baffle 41, a lower baffle 42 and a linkage mechanism to control the connection and blockage between the waste inlet 32 ​​and the waste channel 31 and to control the connection and blockage between the waste outlet 33 and the waste channel 31, thereby automatically discharging solid matter.

[0034] In the chip filtering and separation device for a wafer cutting machine described in this embodiment, an upper slide groove 34 is provided on the top of the waste material seat 3 in the horizontal direction; a lower slide groove 35 is provided on the bottom of the waste material seat 3 in the horizontal direction; the upper baffle plate 41 is slidably provided in the upper slide groove 34; and the lower baffle plate 42 is slidably provided in the lower slide groove 35. In the chip filtering and separation device for a wafer cutting machine described in this embodiment, the linkage mechanism includes an upper drive block 51 that is horizontally telescopically provided on the waste material seat 3 and a lower drive block 52 that is horizontally telescopically provided on the waste material seat 3; the upper drive block 51 is provided on top of the lower drive block 52; a linkage rod 6 is provided between the upper drive block 51, the lower drive block 52, the upper baffle plate 41, and the lower baffle plate 42; an upper inclined surface 53 is provided on the bottom of the upper drive block 51 for abutting against the top of the trigger hole 22; a lower inclined surface 54 is provided on the top of the lower drive block 52 for abutting against the bottom of the trigger hole 22; and a return spring 23 is provided between the tray 21 and the box body 1. In the chip filtering and separation device for a wafer cutting machine described in this embodiment, the linkage rod 6 is provided with an upper strip groove 61 and a lower strip groove 62 along its length; the upper drive block 51 is provided with an upper guide pin 55; the lower drive block 52 is provided with a lower guide pin 56; the upper guide pin 55 is movably mounted in the upper strip groove 61; the lower guide pin 56 is movably mounted in the lower strip groove 62. In the chip filtering and separation device for a wafer cutting machine described in this embodiment, the linkage rod 6 is provided with an upper telescopic block 63 at its top for telescopic movement; an upper spring 65 is provided between the linkage rod 6 and the upper telescopic block 63; the upper baffle 41 is provided with an upper horizontal groove 43 along its horizontal direction; the upper telescopic block 63 is movably mounted in the upper horizontal groove 43; the linkage rod 6 is provided with a lower telescopic block 64 at its bottom for telescopic movement; a lower spring 66 is provided between the linkage rod 6 and the lower telescopic block 64; the lower baffle 42 is provided with a lower horizontal groove 44 along its horizontal direction; the lower telescopic block 64 is movably mounted in the lower horizontal groove 44.

[0035] Specifically, when the chip filtering and separation device for the wafer cutting machine described in this embodiment is in use, the waste liquid enters the filter chamber 11 from the liquid inlet 84, the heavier solid matter settles into the tray 21, and the liquid passes through the filter assembly upward and flows out from the liquid outlet 12, thereby completing the solid-liquid separation.

[0036] When the heavy solid objects settle on the tray 21, under the action of the return spring 23, the Figure 3 The first state shown and Figure 4As shown, the upper driving block 51 is located at the top of the trigger hole 22, the upper driving block 51 extends out of the waste seat 3 and does not contact the top of the trigger hole 22, and the lower driving block 52 retracts into the waste seat 3. At this time, the lower baffle 42 blocks the waste outlet 33 and the waste channel 31, and the upper baffle 41 does not block the waste inlet 32 ​​and the waste channel 31. The waste inlet 32 ​​and the waste channel 31 are in a connected state.

[0037] Solid objects enter the waste channel 31 from the waste inlet 32. Since the lower baffle 42 blocks the waste inlet 32 ​​and the waste channel 31, the solid objects accumulate in the waste channel 31. When the weight of the solid objects accumulated on the tray 21 is sufficient, the tray 21 overcomes the action of the return spring 23 and gradually moves downward until the upper inclined surface 53 of the upper driving block 51 abuts against the top of the trigger hole 22. Figure 5 The second state shown and Figure 6 As shown, the trigger hole 22 pushes the upper driving block 51 to move toward the inside of the waste seat 3. When the upper driving block 51 is fully retracted into the inside of the waste seat 3, under the action of the linkage rod 6, the upper telescopic block 63 and the lower telescopic block 64, the upper baffle 41 blocks the waste outlet 33 and the waste channel 31 to prevent waste liquid from entering the waste channel 31. The lower driving block 52 extends out of the waste seat 3 and does not contact the bottom of the trigger hole 22. At the same time, the lower baffle 42 opens the waste inlet 32 ​​and the waste channel 31, so that the solid matter in the waste channel 31 falls from the waste outlet 33, completing a solid matter discharge.

[0038] After the solid objects are discharged from the waste channel 31, the weight of the tray 21 decreases, and the tray 21 moves upward under the action of the return spring 23. After the lower inclined surface 54 of the lower driving block 52 abuts against the bottom of the trigger hole 22, the trigger hole 22 pushes the lower driving block 52 to move toward the inside of the waste seat 3. After the lower driving block 52 is completely retracted into the inside of the waste seat 3, under the action of the linkage rod 6, the upper telescopic block 63 and the lower telescopic block 64, the upper driving block 51 is again located at the top of the trigger hole 22, the upper driving block 51 extends out of the waste seat 3 and does not contact the top of the trigger hole 22. The lower driving block 52 retracts into the waste seat 3. At this time, the lower baffle 42 blocks the waste outlet 33 and the waste channel 31, and the upper baffle 41 does not block the waste inlet 32 ​​and the waste channel 31. The waste inlet 32 ​​and the waste channel 31 are in a connected state.

[0039] The chip filtering and separation device for a wafer cutting machine described in this embodiment comprises a bubble generating disk 7 disposed within the filter chamber 11; the bubble generating disk 7 is provided with a plurality of air holes 71; the housing 1 is provided with an air pipe 72 communicating with the air holes 71; and the bubble generating disk 7 is disposed between the liquid inlet 84 and the filter assembly. Specifically, this arrangement allows gas to be introduced into the air pipe 72, thereby generating bubbles in the liquid within the filter chamber 11. As the bubbles rise, they carry lighter solids with them, causing them to gradually float upward and be absorbed into the filter assembly; while heavier solids continue to settle into the tray 21, accelerating the overall liquid-solid separation efficiency and improving the filtration effect.

[0040] The chip filtering and separation device for a wafer sawing machine described in this embodiment comprises a housing 1 having a guide plate 8 at the top; a rotating seat 82 rotatably mounted at the bottom of the guide plate 8; a liquid inlet channel 83 disposed on the rotating seat 82; a liquid inlet port 84 at the bottom of the liquid inlet channel 83; and a drive motor 81 for driving the rotating seat 82. The chip filtering and separation device for a wafer sawing machine described in this embodiment comprises a filter assembly including a fixed ring 91 fixed within a filter cavity 11, a pressing plate 92 movable and movable on the rotating seat 82, and filter cotton 93 disposed between the fixed ring 91 and the pressing plate 92; the pressing plate 92 rotates synchronously with the rotating seat 82. The chip filtering and separation device for a wafer sawing machine described in this embodiment comprises a cleaning inlet 13 at the top of the filter assembly, connected to the filter cavity 11; and a cleaning outlet 14 at the bottom of the filter assembly, connected to the filter cavity 11. In the chip filtering and separating device for a wafer cutting machine described in this embodiment, a cam ring 94 is provided in the filter cavity 11 ; a connecting rod 95 is provided on the extrusion plate 92 ; and the connecting rod 95 abuts against the cam ring 94 .

[0041] Specifically, in the chip filtering and separation device for the wafer cutting machine described in this embodiment, when the solid-liquid separation of the waste liquid is normally performed, the driving motor 81 drives the rotating seat 82 to rotate, so that the extrusion plate 92 rotates synchronously, so that the connecting rod 95 moves to the peak of the cam ring 94, so that the connecting rod 95 drives the extrusion plate 92 to move downward, compressing the filter cotton 93, so that the pore size of the filter cotton 93 is smaller, and the waste liquid is effectively filtered.

[0042] When the filter cotton 93 needs to be cleaned, cleaning liquid is introduced from the cleaning inlet 13, and at the same time, the driving motor 81 is started to drive the rotating seat 82 to rotate continuously, so that the extrusion plate 92 rotates continuously. When the connecting rod 95 moves along the cam ring 94, the extrusion plate 92 is continuously raised and lowered, that is, the filter cotton 93 is continuously squeezed and relaxed, which can effectively clean the filter cotton 93, and the cleaning liquid is discharged from the cleaning outlet 14.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A chip filtering and separation device for a wafer cutting machine, characterized in that: The invention comprises a box body (1); the box body (1) is provided with a filter cavity (11); a filter assembly is provided in the filter cavity (11); the box body (1) is provided with a liquid outlet (12) at the top of the filter assembly and communicated with the filter cavity (11); the box body (1) is provided with a liquid inlet (84) at the bottom of the filter assembly and communicated with the filter cavity (11); The bottom of the filter chamber (11) is provided with a tray (21) that is movable and can be lifted; the tray (21) is provided with a waste seat (3); the waste seat (3) is provided with a waste channel (31); the top of the waste seat (3) is provided with a waste inlet (32) that is communicated with the filter chamber (11); the bottom of the waste seat (3) is provided with a waste outlet (33) that is communicated with the outside; the waste inlet (32) is arranged opposite to the top of the waste channel (31); the waste outlet (33) is arranged opposite to the bottom of the waste channel (31); An upper baffle (41) is slidably provided between the waste channel (31) and the waste inlet (32); a lower baffle (42) is slidably provided between the waste channel (31) and the waste outlet (33); a linkage mechanism is provided between the upper baffle (41) and the lower baffle (42); The bottom of the box (1) is provided with a trigger hole (22); the waste material seat (3) is telescopically arranged in the trigger hole (22); The linkage mechanism comprises an upper driving block (51) which is arranged on the waste material seat (3) and is movable and retractable in the horizontal direction, and a lower driving block (52) which is arranged on the waste material seat (3) and is movable and retractable in the horizontal direction; the upper driving block (51) is arranged on the top of the lower driving block (52); a linkage rod (6) is provided between the upper driving block (51), the lower driving block (52), the upper baffle (41) and the lower baffle (42); The bottom of the upper driving block (51) is provided with an upper inclined surface (53) for abutting against the top of the trigger hole (22); the top of the lower driving block (52) is provided with a lower inclined surface (54) for abutting against the bottom of the trigger hole (22); a return spring (23) is provided between the tray (21) and the box body (1); The linkage rod (6) is provided with an upper strip groove (61) and a lower strip groove (62) along the length direction; the upper driving block (51) is provided with an upper guide pin (55); the lower driving block (52) is provided with a lower guide pin (56); the upper guide pin (55) is movably provided in the upper strip groove (61); the lower guide pin (56) is movably provided in the lower strip groove (62); The top of the linkage rod (6) is provided with an upper telescopic block (63) for telescopic movement; an upper spring (65) is provided between the linkage rod (6) and the upper telescopic block (63); the upper baffle (41) is provided with an upper horizontal groove (43) in the horizontal direction; the upper telescopic block (63) is movably provided in the upper horizontal groove (43); the bottom of the linkage rod (6) is provided with a lower telescopic block (64) for telescopic movement; a lower spring (66) is provided between the linkage rod (6) and the lower telescopic block (64); the lower baffle (42) is provided with a lower horizontal groove (44) in the horizontal direction; the lower telescopic block (64) is movably provided in the lower horizontal groove (44).

2. The chip filtering and separation device for a wafer cutting machine according to claim 1, characterized in that: The top of the waste material seat (3) is provided with an upper slide groove (34) in the horizontal direction; the bottom of the waste material seat (3) is provided with a lower slide groove (35) in the horizontal direction; the upper baffle (41) is slidably arranged in the upper slide groove (34); and the lower baffle (42) is slidably arranged in the lower slide groove (35).

3. The chip filtering and separation device for a wafer cutting machine according to claim 1, characterized in that: A bubble generating disk (7) is provided in the filter cavity (11); the bubble generating disk (7) is provided with a plurality of air holes (71); the box body (1) is provided with an air pipe (72) communicating with the air holes (71); the bubble generating disk (7) is provided between the liquid inlet (84) and the filter assembly.

4. The chip filtering and separation device for a wafer cutting machine according to claim 1, characterized in that: The top of the box body (1) is provided with a guide plate (8); the bottom of the guide plate (8) is rotatably provided with a rotating seat (82); the rotating seat (82) is provided with a liquid inlet channel (83); the bottom of the liquid inlet channel (83) is the liquid inlet (84); the guide plate (8) is provided with a driving motor (81) for driving the rotating seat (82) to rotate.

5. The chip filtering and separation device for a wafer cutting machine according to claim 4, characterized in that: The filter assembly comprises a fixed ring (91) fixed in the filter cavity (11), an extrusion plate (92) movable and movable on the rotating seat (82), and filter cotton (93) arranged between the fixed ring (91) and the extrusion plate (92); the extrusion plate (92) rotates synchronously with the rotating seat (82).

6. The chip filtering and separation device for a wafer cutting machine according to claim 5, characterized in that: The box (1) is provided with a cleaning inlet (13) communicating with the filter cavity (11) at the top of the filter assembly; and the box (1) is provided with a cleaning outlet (14) communicating with the filter cavity (11) at the bottom of the filter assembly.

7. The chip filtering and separation device for a wafer cutting machine according to claim 6, characterized in that: A cam ring (94) is provided in the filter cavity (11); a connecting rod (95) is provided on the extrusion plate (92); and the connecting rod (95) abuts against the cam ring (94).

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