Disk device

Abstract

The embodiment of the invention provides a disc device which can prevent a component from being peeled off from an adhesive. According to one embodiment, a disk device includes an electronic component, a flexible printed circuit board, a first adhesive, a component, and a first bonding layer. The flexible printed circuit board has a first surface facing the electronic component, a second surface located on the opposite side of the first surface, and a pad provided on the first surface and connected to the electronic component by a conductive joining body. The first adhesive is disposed on the second surface. The component has a third face facing the second face. And the first bonding layer is arranged on the third surface, enters the recess of the third surface and is fixedly connected to the second surface through the first adhesive.

Description

[0001] Reference to related applications

[0002] This application claims the benefit of priority based on Japanese Patent Application No. 2024-014556 (filing date: February 2, 2024), the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present embodiment generally relates to a disk device. Background Art

[0004] A disk drive such as a hard disk drive (HDD) includes a flexible printed circuit (FPC), electronic components connected to the FPC via a conductive bonding material, and components bonded to the FPC. For example, a flexure is connected to the FPC via solder, and a metal reinforcing plate is bonded to the FPC.

[0005] For example, when the bonded body is heated, there is a possibility that the component may be peeled off from the adhesive bonding the component to the FPC. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a disk device capable of suppressing the peeling of components from the adhesive.

[0007] A disk device according to an embodiment includes an electronic component, a flexible printed circuit board (FPCB), a first adhesive, a component, and a first bonding layer. The FPCB has a first surface facing the electronic component, a second surface opposite the first surface, and a pad disposed on the first surface and connected to the electronic component via a conductive bonding body. The first adhesive is disposed on the second surface. The component has a third surface facing the second surface. The first bonding layer is disposed on the third surface and extends into a recess in the third surface, being fixed to the second surface via the first adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is an exemplary perspective view showing an exploded view of the HDD according to the first embodiment.

[0009] Figure 2 This is an illustrative diagram schematically illustrating an exploded view of the FPC and the flexure according to the first embodiment.

[0010] Figure 3 This is an illustrative plan view schematically showing a portion of the slider, FPC, and flexure according to the first embodiment.

[0011] Figure 4 It is along Figure 3An exemplary cross-sectional view schematically shows an exemplary portion of the slider and the FPC according to the first embodiment, taken along line F4 - F4 .

[0012] Figure 5 This is an exemplary cross-sectional view schematically showing a portion of the slider and the FPC according to the second embodiment.

[0013] Figure 6 This is an exemplary cross-sectional view schematically showing a portion of a slider and an FPC according to a third embodiment.

[0014] Figure 7 It is an illustrative plan view schematically showing a portion of a slider, an FPC, and a flexure according to a fourth embodiment.

[0015] Figure 8 It is along Figure 7 An exemplary cross-sectional view schematically shows an exemplary portion of the slider and the FPC according to the fourth embodiment, taken along line F8 - F8 .

[0016] Figure 9 It is an exemplary cross-sectional view schematically showing a slider and an FPC according to a fifth embodiment.

[0017] Figure 10 It is an illustrative plan view schematically showing a portion of a slider, an FPC, and a flexure according to the sixth embodiment.

[0018] Figure 11 It is an illustrative plan view schematically showing a portion of a slider, an FPC, and a flexure according to the seventh embodiment.

[0019] Description of Reference Signs

[0020] 10: Hard disk drive (HDD), 11: Housing, 12: Disk, 35: Slide, 37: Flexible printed circuit (FPC), 53: Flexure, 54: Head, 71a, 71b: Surface, 74: Pad, 75: Solder, 88, 405: Ground surface, 92: Reinforcement plate, 92a, 92b: Surface, 92c: Flat surface, 92e: Curved surface, 101, 102, 605, 705: Bonding layer, 101a, 101b: Surface, 103, 301, 501: Adhesive, 105, 106: Recess, 502: Outer layer, 601, 602, 701, 702: Area. DETAILED DESCRIPTION

[0021] (First embodiment)

[0022] Below, refer to Figures 1 to 4The first embodiment is described. In this specification, components and descriptions of components involved in the embodiments are sometimes described using various representations. These components and their descriptions are examples and are not limited to the representations in this specification. Components may also be identified using names different from those in this specification. Furthermore, components may also be described using representations different from those in this specification.

[0023] In the following description, "suppress" is defined as, for example, preventing a phenomenon, action, or influence from occurring, or reducing the extent of a phenomenon, action, or influence. Furthermore, in the following description, "restrict" is defined as, for example, preventing movement or rotation, or allowing movement or rotation within a specified range and preventing movement or rotation beyond the specified range.

[0024] Figure 1 This is an illustrative perspective view showing an exploded hard disk drive (HDD) 10 according to Embodiment 1. The HDD 10 is an example of a disk device and can also be called an electronic device, a storage device, an external storage device, or a magnetic disk device.

[0025] like Figure 1 As shown, HDD 10 includes a housing 11, a plurality of magnetic disks 12, a spindle motor 13, a head stack assembly (HSA) 14, a voice coil motor (VCM) 15, a ramp load mechanism 16, and a printed circuit board (PCB) 17. However, HDD 10 is not limited to this example.

[0026] The housing 11 houses the magnetic disk 12 , the spindle motor 13 , the HSA 14 , the VCM 15 , and the ramp load mechanism 16 . The housing 11 includes a base 21 , an inner cover 22 , and an outer cover 23 .

[0027] The base 21 is formed into a generally rectangular box shape that is open in one direction. The base 21 has a bottom wall 25 and side walls 26. The bottom wall 25 is formed into a generally rectangular (quadrilateral) plate shape. The side walls 26 protrude from the edges of the bottom wall 25 and are formed into a generally rectangular frame shape.

[0028] The inner cover 22 is attached to the end of the side wall 26, for example, by screws, and blocks the space inside the base 21. The outer cover 23 covers the inner cover 22 and is attached to the end of the side wall 26, for example, by welding. The inner cover 22 is provided with a vent 27. The outer cover 23 is also provided with a vent 28.

[0029] After components are installed inside the base 21 and the inner cover 22 and the outer cover 23 are attached to the base 21, air inside the housing 11 is extracted from the vents 27 and 28. Then, the housing 11 is filled with a gas different from air.

[0030] The gas filled into the housing 11 is, for example, a low-density gas having a lower density than air, an inert gas with low reactivity, etc. For example, helium gas is filled into the housing 11. Alternatively, other fluids may be filled into the housing 11.

[0031] The vent 28 of the outer cover 23 is blocked by a seal 29. The seal 29 hermetically seals the vent 28, and prevents the fluid filling the interior of the housing 11 from leaking out of the vent 28.

[0032] The plurality of magnetic disks 12 are formed in a substantially disk shape. A magnetic recording layer is provided on at least one of the upper surface and the lower surface of the magnetic disk 12. The plurality of magnetic disks 12 are stacked at intervals.

[0033] The spindle motor 13 supports a plurality of magnetic disks 12. The spindle motor 13 rotates the plurality of magnetic disks 12 about a central axis Axd of the spindle motor 13. The plurality of magnetic disks 12 are held on a hub of the spindle motor 13 by, for example, a clamp spring.

[0034] The HSA 14 is rotatably supported by a support shaft 31 . The support shaft 31 is provided at a position spaced apart from the magnetic disk 12 in a direction perpendicular to the central axis Axd. The support shaft 31 protrudes from the bottom wall 25 of the housing 11 .

[0035] The HSA 14 is rotatable about a central axis Axh. The central axis Axh is a virtual axis extending substantially parallel to the central axis Axd of the magnetic disk 12. The central axis Axh is, for example, the center of rotation of the HSA 14 and is also the central axis of the support shaft 31.

[0036] The HSA 14 includes a carriage 35 , a plurality of head gimbal assemblies (HGAs) 36 , and a flexible printed circuit board (FPC) 37 . The carriage 35 includes an actuator block 41 and a plurality of arms 42 .

[0037] The actuator module 41 is rotatably supported by the support shaft 31 via a bearing, for example. Multiple arms 42 protrude from the actuator module 41 in a direction perpendicular to the central axis Axh. Alternatively, the carriage 35 may be divided, with the arms 42 protruding from each of the multiple actuator modules 41.

[0038] The arms 42 extend substantially in parallel and are arranged at intervals along the central axis Axh. Each arm 42 is formed in a plate shape capable of entering a gap between two adjacent magnetic disks 12 among the magnetic disks 12.

[0039] The voice coil of the VCM 15 is attached to the actuator module 41. The support shaft 31 is located between the arm 42 and the voice coil. The VCM 15 includes the voice coil, a pair of yokes, and magnets provided on the yokes.

[0040] Multiple HGAs 36 are attached to the front ends of corresponding arms 42. Thus, the HGAs 36 are spaced apart along the central axis Axh. Each HGA 36 includes a base plate 51, a load beam 52, a flexure 53, and a magnetic head 54. The flexure 53 is an example of an electronic component. The magnetic head 54 can also be called a slider.

[0041] The base plate 51 is formed in a plate shape and is attached to the front end of the arm 42. The loading beam 52 is formed in a plate shape that is thinner than the base plate 51. The loading beam 52 is attached to the base plate 51 so as to protrude from the base plate 51.

[0042] The flexure 53 is a flexible printed wiring board formed in an elongated strip shape and includes, for example, a metal backing layer, an insulating base layer, a conductive layer, and an insulating cover layer.

[0043] Figure 2 FIG. 1 is an illustrative diagram schematically showing the FPC 37 and the flexure 53 of the first embodiment after being decomposed. Figure 2 As shown, the flexure 53 includes, for example, a universal joint 61 , a tail 62 , a plurality of pads 63 , and a plurality of wirings 64 .

[0044] The gimbal 61 is provided at one end portion of the flexure 53. The magnetic head 54 is mounted on the gimbal 61. The gimbal 61 is mounted on the load beam 52 so that the portion of the gimbal 61 on which the magnetic head 54 is mounted can rotate.

[0045] The tail portion 62 is provided at the other end portion of the flexure 53. The tail portion 62 extends, for example, along the arm 42. The pad 63 and the wiring 64 are provided on the conductive layer of the flexure 53.

[0046] A plurality of pads 63 are disposed on the tail portion 62. The pads 63 are spaced apart in the longitudinal direction of the tail portion 62 to form flying leads. A plurality of wirings 64 extend between the gimbal 61 and the tail portion 62. The wirings 64 electrically connect at least one of the pads 63 to a read element, a write element, a heater, or other components of the magnetic head 54.

[0047] The FPC 37 is formed into a strip shape, for example. The FPC 37 has two joint portions 71 and 72, a flexible portion 73, and a plurality of pads 74. Figure 1 As shown, a joint portion 71 is provided at one end of the FPC 37 and is mounted on the actuator module 41. A joint portion 72 is provided at the other end of the FPC 37 and is mounted on the bottom wall 25 of the base 21. A flexible portion 73 is provided between the joint portions 71 and 72 and elastically bends in response to the rotation of the HSA 14.

[0048] like Figure 2 As shown, a plurality of solder pads 74 are provided on the joint portion 71. The solder pads 63 of the plurality of flexures 53 are joined to the plurality of solder pads 74 via solder 75. In other words, the solder pads 74 are connected to the flexures 53 via the solder 75. Thus, the flexures 53 electrically connect the FPC 37 and the magnetic head 54. The solder 75 is an example of a conductive bonding body. The bonding body may also be another bonding body such as a conductive adhesive.

[0049] Figure 1 The VCM 15 rotates the carriage 35 about the central axis Axh. The carriage 35 rotates about the central axis Axh, thereby moving the magnetic head 54 to a desired position on the magnetic disk 12. The magnetic head 54 records and reproduces information on the recording layer of the magnetic disk 12. In other words, the magnetic head 54 reads and writes information on the magnetic disk 12.

[0050] When the VCM 15 rotates the carriage 35 and the magnetic head 54 moves toward the outermost periphery of the magnetic disk 12 , the ramp load mechanism 16 holds the HGA 36 .

[0051] The PCB 17 is a rigid substrate such as a glass epoxy substrate, a multi-layer substrate, or a build-up substrate. The PCB 17 is disposed outside the housing 11 and mounted on the bottom wall 25 of the base 21 .

[0052] PCB 17 is equipped with various electronic components such as a relay connector connected to FPC 37, an interface (I / F) connector connected to a host computer, and a controller that controls the operation of HDD 10. The relay connector is electrically connected to the joint portion 72 of FPC 37 via a connector provided on bottom wall 25, for example.

[0053] The PCB 17 is electrically connected to the magnetic head 54 via the FPC 37 and the flexure 53 . The controller of the PCB 17 controls the magnetic head 54 so as to read and write information with respect to the magnetic disk 12 .

[0054] Figure 3 It is an illustrative plan view schematically showing a portion of the carriage 35 , the FPC 37 , and the flexure 53 according to the first embodiment. Figure 4 It is along Figure 3 The F4-F4 line in FIG. 1 schematically shows an exemplary cross-sectional view of a portion of the slide 35 and the FPC 37 of the first embodiment. Figure 4 As shown, the bonding portion 71 of the FPC 37 has two surfaces 71a and 71b. The surface 71a is an example of a first surface, and the surface 71b is an example of a second surface.

[0055] like Figure 3 As shown, a plurality of pads 74 are provided on a surface 71a. Therefore, the surface 71a faces the tails 62 of the plurality of flexures 53. Figure 4 As shown, the other surface 71 b is located on the opposite side of the surface 71 a. The surface 71 b faces the actuator module 41 of the carriage 35.

[0056] The FPC 37 includes, for example, a base layer 81, a conductive layer 82, two cover layers 83 and 84, and two adhesive layers 85 and 86. The FPC 37 is not limited to this example and may include fewer or more layers. The joint portion 71, the joint portion 72, and the flexible portion 73 each partially include the base layer 81, the conductive layer 82, the cover layers 83 and 84, and the adhesive layers 85 and 86.

[0057] The base layer 81 and the cover layers 83 and 84 are made of, for example, an insulating synthetic resin such as polyimide (PI). The base layer 81 and the cover layers 83 and 84 are not limited to this example and may be made of different materials.

[0058] The base layer 81 has two surfaces 81a and 81b. One surface 81a faces the tail portion 62 of the flexure 53. The other surface 81b is located on the opposite side of the surface 81a and faces the actuator module 41 of the carriage 35.

[0059] Conductive layer 82 is provided on surface 81a of base layer 81. Conductive layer 82 is bonded to surface 81a of base layer 81, for example, by an adhesive that is integrated with base layer 81. However, conductive layer 82 is not limited to this example. Furthermore, FPC 37 may further include another conductive layer provided on the other surface 81b.

[0060] The conductive layer 82 is made of a conductive material such as copper foil. The conductive layer 82 has a plurality of pads 74. Figure 3 As shown, the conductive layer 82 includes a plurality of wirings 87 and a ground plane 88. The wirings 87 transmit electrical signals, supply power, or are set to ground potential. The ground plane 88 is provided along the surface 81a and is set to ground potential.

[0061] like Figure 4 As shown, cover layer 83 covers surface 81a of base layer 81 and conductive layer 82. For example, cover layer 83 and pad 74 of conductive layer 82 form surface 71a of joint 71. Cover layer 84 covers surface 81b of base layer 81. Cover layer 84 forms surface 71b of joint 71. Surfaces 71a and 71b are not limited to this example.

[0062] Adhesive layers 85 and 86 are made of, for example, an acrylic adhesive. Adhesive layer 85 secures cover layer 83 to surface 81a of base layer 81 and conductive layer 82. Adhesive layer 86 secures cover layer 84 to surface 81b of base layer 81.

[0063] like Figure 3 As shown, the HSA 14 further includes a plurality of preamplifiers 91, a reinforcing plate 92, and a plurality of screws 93. The preamplifier 91 is also called a head IC or a head amplifier. The reinforcing plate 92 is an example of a component and a metal component.

[0064] The preamplifier 91 is mounted on the surface 71a of the joint 71. The preamplifier 91 is electrically connected to the PCB 17 via at least one of the plurality of wirings 87. Furthermore, the preamplifier 91 is electrically connected to the plurality of pads 74 via at least one of the plurality of wirings 87.

[0065] The preamplifier 91 amplifies, for example, a write signal transmitted from the PCB 17 toward the magnetic head 54 and then to the FPC 37, and a read signal transmitted from the magnetic head 54 toward the PCB 17 and then to the FPC 37. The write signal corresponds to information written by the magnetic head 54 to the magnetic disk 12, and the read signal corresponds to information read from the magnetic head 54 from the magnetic disk.

[0066] The reinforcing plate 92 is made of a metal such as stainless steel or aluminum alloy and is formed into a plate shape. However, the reinforcing plate 92 is not limited to this example. The rigidity of the reinforcing plate 92 is higher than the rigidity of the FPC 37.

[0067] like Figure 4 As shown, the reinforcing plate 92 has two surfaces 92a and 92b. Surface 92a is an example of a third surface and a first outer surface. Surface 92b is an example of a fourth surface and a second outer surface.

[0068] One surface 92a faces the surface 71b of the joint 71. The other surface 92b is located on the opposite side of the surface 92a. At least a portion of the surface 92b faces the actuator module 41 of the carriage 35.

[0069] The reinforcing plate 92 is partially curved. Therefore, the reinforcing plate 92 has a flat portion 95 and a guide portion 96. The reinforcing plate 92 is not limited to this example. The flat portion 95 and the guide portion 96 each partially have surfaces 92a and 92b.

[0070] The flat portion 95 is formed in a substantially flat plate shape and is disposed between the actuator module 41 of the carriage 35 and the joint 71 of the FPC 37 . The flat portion 95 supports the tail portion 62 of the flexure 53 and the preamplifier 91 via the FPC 37 .

[0071] The guide portion 96 extends from the edge of the flat portion 95 and is bent relative to the flat portion 95. Figure 3 The guide portion 96 is shown extending straight from the flat portion 95 without being bent for convenience.

[0072] like Figure 4 As shown, surface 92a of reinforcing plate 92 includes a flat surface 92c, an inclined surface 92d, and a curved surface 92e. Alternatively, surface 92a may omit inclined surface 92d. Flat surface 92c is provided on flat portion 95 and is formed substantially flat. Inclined surface 92d and curved surface 92e are provided on guide portion 96. Inclined surface 92d is inclined relative to flat surface 92c. Curved surface 92e is provided between flat surface 92c and inclined surface 92d and is continuous with flat surface 92c and inclined surface 92d. Curved surface 92e is a curved surface that is substantially arc-shaped.

[0073] For convenience, the following definitions include the X-axis, Y-axis, and Z-axis. The X-axis, Y-axis, and Z-axis are mutually orthogonal. The X-axis is disposed along the width of plane 92c. The Y-axis is disposed along the length of plane 92c. The Z-axis is disposed orthogonally to plane 92c.

[0074] In this specification, the X, Y, and Z directions are defined. The X direction is a direction along the X-axis, including the +X direction indicated by the arrow on the X-axis and the -X direction, which is the direction opposite to the X-axis arrow. The Y direction is a direction along the Y-axis, including the +Y direction indicated by the arrow on the Y-axis and the -Y direction, which is the direction opposite to the Y-axis arrow. The Z direction is a direction along the Z-axis, including the +Z direction indicated by the arrow on the Z-axis and the -Z direction, which is the direction opposite to the Z-axis arrow.

[0075] like Figure 3As shown, the plurality of pads 74 are arranged near the end of the joint portion 71 in the +Y direction. The plurality of pads 63 and 74 are arranged along the Y direction. The guide portion 96 of the reinforcing plate 92 extends from the end of the flat portion 95 in the -Y direction.

[0076] The guide portion 96 is provided with a through hole 97. The through hole 97 extends substantially in the X direction along the edge of the flat portion 95. The through hole 97 penetrates the guide portion 96 and facilitates bending of the guide portion 96. Alternatively, the guide portion 96 may be provided without the through hole 97.

[0077] The screws 93 penetrate the joint portion 71 of the FPC 37 and the flat portion 95 of the reinforcing plate 92, thereby coupling the FPC 37 to the actuator module 41 of the carriage 35. The screws 93 thus attach the joint portion 71 and the flat portion 95 to the actuator module 41. The two screws 93 are located at both ends of the joint portion 71 and the flat portion 95 in the X direction.

[0078] like Figure 4 As shown, HSA 14 further includes two bonding layers 101 and 102 and an adhesive 103. Bonding layer 101 is an example of a first bonding layer. Bonding layer 102 is an example of a second bonding layer. Adhesive 103 is an example of a first adhesive.

[0079] The bonding layers 101 and 102 are organic compounds, such as primers. They can also be films made of other organic materials. The bonding layer 101 is disposed on one surface 92a of the reinforcing plate 92 and is directly attached to the surface 92a. The bonding layer 102 is disposed on the other surface 92b of the reinforcing plate 92 and is directly attached to the surface 92b.

[0080] The adhesive 103 is, for example, an acrylic adhesive. The adhesive 103 is not limited to this example and may be made of other organic materials such as polyolefin. The adhesive 103 is provided on the surface 71 b of the bonding portion 71 .

[0081] The adhesive 103 fixes the bonding layer 101 to the surface 71 b of the joint portion 71 . In other words, the adhesive 103 fixes the surface 92 a of the reinforcing plate 92 provided with the bonding layer 101 to the surface 71 b of the joint portion 71 .

[0082] Adhesive 103 adheres more readily to bonding layers 101 and 102 than to surface 92a of reinforcement plate 92 made of stainless steel or aluminum alloy. For example, reinforcement plate 92 provided with bonding layer 101 adheres firmly to adhesive 103 through non-covalent bonds such as hydrogen bonds.

[0083] Bonding layer 101 has two surfaces 101a and 101b. Surface 101a is an example of a fifth surface. Surface 101b is an example of a sixth surface. One surface 101a is directly attached to surface 92a of reinforcing plate 92. The other surface 101b is located on the opposite side of surface 101a and is directly attached to adhesive 103.

[0084] The bonding layer 101 penetrates into the fine depressions 105 present on the surface 92a of the reinforcing plate 92. Meanwhile, the surface roughness of the surface 101b of the bonding layer 101 is lower than that of the surface 92a of the reinforcing plate 92. Therefore, the bonding layer 101 adheres to the adhesive 103 with almost no gaps, and the anchoring effect strengthens the bond between the reinforcing plate 92 and the adhesive 103. Furthermore, the bonding layer 102 also penetrates into the fine depressions 106 present on the surface 92b of the reinforcing plate 92. These depressions 105 and 106 are formed by the fine irregularities that contribute to the surface roughness of the surfaces 92a and 92b and are shown exaggeratedly in the drawings.

[0085] A gap is unlikely to form between the bonding layer 101 and the surface 92a of the reinforcing plate 92. Furthermore, a gap is unlikely to form between the bonding layer 101 and the adhesive 103. Therefore, moisture is unlikely to form between the bonding layer 101 and the reinforcing plate 92, and between the bonding layer 101 and the adhesive 103.

[0086] In this embodiment, the FPC 37, the bonding layer 101, and the adhesive 103 cover the entire surface 92a of the reinforcing plate 92. That is, the bonding layer 101 is provided over the entire surface 92a of the reinforcing plate 92. The adhesive 103 is attached to the entire surface 101b of the bonding layer 101. The adhesive 103 secures the entire surface 101b of the bonding layer 101 to the FPC 37. In this embodiment, the FPC 37 also covers the through-hole 97.

[0087] The joint portion 71 includes a flat portion 111 and a bent portion 112. The flat portion 111 is secured to the flat portion 95 of the reinforcing plate 92 via adhesive 103. The bent portion 112 extends from the end of the flat portion 111 in the -Y direction and is bonded to the guide portion 96 of the reinforcing plate 92. In other words, the bent portion 112 is secured to the curved surface 92e via adhesive 103 and the bonding layer 102. The bent portion 112 is connected to the flexible portion 73.

[0088] When the carriage 35 rotates about the central axis Axh, the reinforcing plate 92 also rotates about the central axis Axh. The flexible portion 73 of the FPC 37 elastically deforms to follow the rotation of the reinforcing plate 92. The bent portion 112 of the FPC 37 is bonded to the entire inclined surface 92d and curved surface 92e of the guide portion 96, thereby increasing the bonding area between the FPC 37 and the guide portion 96. This improves the ability of the flexible portion 73 to follow the rotation of the carriage 35.

[0089] like Figure 3 As shown, a portion of wiring 87 and a portion of ground plane 88 are provided in bent portion 112. A portion of wiring 87 extends across through-hole 97 of guide portion 96. A portion of ground plane 88 is provided between both ends of bent portion 112 in the X direction and the plurality of wirings 87. However, wiring 87 and ground plane 88 are not limited to this example.

[0090] like Figure 4 As shown, the bonding layer 102 contacts the actuator module 41 of the carriage 35 and is disposed between the reinforcing plate 92 and the actuator module 41. The reinforcing plate 92 is supported by the actuator module 41 via the bonding layer 102. The bonding layer 102 is substantially entirely covered by the actuator module 41. Alternatively, the bonding layer 102 may be covered by another component or may be separate from the actuator module 41.

[0091] During the assembly of the HDD 10 described above, the pads 65 of the flexure 53 are joined to the pads 74 of the FPC 37 via solder 75. For example, a paste containing solder 75 is applied to one of the pads 65 and 74. Next, the tail portion 62 of the flexure 53 and the joint portion 71 of the FPC 37 are overlapped, and the paste is applied to the other of the pads 65 and 74.

[0092] Next, for example, laser light is irradiated onto the tail portion 62 and the joining portion 71. This laser light is an area laser light, and irradiates a relatively wide range of the tail portion 62 and the joining portion 71. The laser light is not limited to this example.

[0093] The laser beam irradiates the tail portion 62 and the joint portion 71 and, for example, irradiates the solder 75 through a hole provided in the tail portion 62. Heat is conducted from the tail portion 62 and the joint portion 71 heated by the laser beam to the solder 75. Furthermore, the solder 75 is directly heated by the laser beam. This melts the paste, and the pads 65 and 74 are bonded via the solder 75. Meanwhile, the heat from the joint portion 71 heated by the laser beam is dissipated to the reinforcing plate 92.

[0094] If the bonding strength of adhesive 103 between joint 71 and reinforcing plate 92 is weak, there is a risk of delamination between reinforcing plate 92 and adhesive 103, for example, due to moisture. The gap between reinforcing plate 92 and adhesive 103 hinders heat conduction from joint 71 to reinforcing plate 92. In this case, joint 71 may be overheated, potentially causing delamination between conductive layer 82 and base layer 81, or burning of joint 71.

[0095] In the HDD 10 of this embodiment, the bonding layer 101 strengthens the bonding force of the adhesive 103, thereby preventing the reinforcing plate 92 from peeling off from the adhesive 103. Therefore, heat can be dissipated from the joint 71 via the reinforcing plate 92, thereby preventing delamination between the conductive layer 82 and the base layer 81 and preventing the joint 71 from burning.

[0096] The bonding layers 101 and 102 strengthen the bonding strength of the adhesive 103, but they are susceptible to the adhesion of contaminants such as dust. Furthermore, contaminants adhering to the bonding layers 101 and 102 are difficult to remove through cleaning. In the HDD 10 of this embodiment, the entire surface 101a of the bonding layer 101 is covered by the FPC 37 and the adhesive 103, thereby suppressing the adhesion of contaminants to the bonding layer 101. Furthermore, the bonding layer 102 is covered by the actuator module 41 of the carriage 35, thereby protecting it from contaminants.

[0097] In the HDD 10 according to the first embodiment described above, the FPC 37 has a surface 71a, a surface 71b, and solder pads 74. Surface 71a faces the flexure 53. Surface 71b is located on the opposite side of surface 71a. The solder pads 74 are provided on surface 71a and connected to the flexure 53 via solder 75. Adhesive 103 is provided on surface 71b. The reinforcing plate 92 has a surface 92a facing surface 71b.

[0098] The bonding layer 101 is provided on the surface 92a and enters the recess 105 of the surface 92a and is fixed to the surface 71b via the adhesive 103. Thus, the bonding layer 101 can strengthen the bonding between the reinforcing plate 92 and the adhesive 103 through, for example, an anchoring effect.

[0099] The solder 75 is heated during bonding. The bonding layer 101 increases the bonding strength of the adhesive 103. Therefore, the bonding layer 101 can prevent the reinforcing plate 92 from peeling off from the adhesive 103 when the solder 75 is heated, for example. The reinforcing plate 92 is continuously bonded to the FPC 37 by the adhesive 103, thereby dissipating heat from the FPC 37 and preventing thermal damage to the FPC 37.

[0100] The housing 11 houses the flexure 53, the FPC 37, the adhesive 103, the reinforcing plate 92, and the bonding layer 101. The magnetic disk 12 is housed in the housing 11. The magnetic head 54 is configured to read and write information with respect to the magnetic disk 12. The carriage 35 is configured to move the magnetic head 54 by rotating. The flexure 53 is connected to the pad 74 via solder 75, and the FPC 37 and the magnetic head 54 are electrically connected. The reinforcing plate 92 is attached to the carriage 35.

[0101] The solder 75 connecting the pads 74 of the FPC 37 to the flexure 53 is heated, for example, by exposure to laser light. The bonding layer 101 increases the bonding strength of the adhesive 103. Therefore, the bonding layer 101 can prevent the reinforcing plate 92 from peeling off from the adhesive 103 when the solder 75 is heated.

[0102] The reinforcing plate 92 has a surface 92b located on the opposite side from the surface 92a and facing the carriage 35. The bonding layer 102 is provided on the surface 92b and enters the recess 106 of the surface 92b.

[0103] Bonding layers 101 and 102 are provided on both surfaces 92a and 92b of reinforcing plate 92. Therefore, compared to a case where bonding layer 102 is not provided on surface 92b of reinforcing plate 92, the material of bonding layers 101 and 102 can be more easily applied by, for example, dipping. This facilitates the manufacture of HDD 10.

[0104] The bonding layer 101 is provided over the entire surface 92a. Therefore, compared to a case where the bonding layer 101 is provided only on a portion of the surface 92a, for example, a mask need not be provided on the surface 92a, and the bonding layer 101 can be easily applied to the surface 92a. This facilitates the manufacture of the HDD 10.

[0105] The bonding layer 101 has a surface 101a attached to the surface 92a and a surface 101b located opposite the surface 101a. The adhesive 103 is attached to the entire surface 101b. In other words, the adhesive 103 covers the entire bonding layer 101. Therefore, the adhesive 103 can prevent contaminants from adhering to the bonding layer 101, thereby preventing contamination of the interior of the housing 11.

[0106] Adhesive 103 secures the entire surface 101b to FPC 37. That is, FPC 37 covers the entire bonding layer 101. Therefore, FPC 37 can prevent contaminants from adhering to bonding layer 101, thereby preventing the interior of housing 11 from being contaminated.

[0107] Surface 92a has a flat surface 92c and a curved surface 92e continuous from flat surface 92c. FPC 37 has a ground plane 88. A portion of ground plane 88 is provided in a bent portion 112 of FPC 37 that is fixed to curved surface 92e via adhesive 103 and bonding layer 101.

[0108] Curved surface 92e bends the FPC 37, generating an elastic force. Therefore, in typical HDDs, the curved surface is difficult to bond to the FPC, leaving it partially exposed. However, in this embodiment, bonding layer 101 enhances the bonding strength of adhesive 103, allowing the FPC 37 to be secured to the curved surface 92e via adhesive 103 and bonding layer 101. In HDD 10 of this embodiment, the FPC 37 can extend over the entire area of curved surface 92e, expanding the ground plane 88. Consequently, the FPC 37 can improve electrical properties.

[0109] The magnetic disk 12 is housed in the housing 11. The magnetic head 54 is configured to read and write information relative to the magnetic disk 12. The carriage 35 is configured to move the magnetic head 54 by rotating. The FPC 37 has a solder pad 74. The flexure 53 is bonded to the solder pad 74 via solder 75, electrically connecting the FPC 37 and the magnetic head 54. The reinforcing plate 92 has surfaces 92a and 92b. Surface 92a faces the FPC 37 and is entirely covered by the FPC 37. Surface 92b is located on the opposite side of surface 92a and faces the carriage 35. The reinforcing plate 92 is attached to the carriage 35.

[0110] The metal surfaces 92a and 92b of the reinforcing plate 92 are generally rougher than the surfaces 71a and 71b of the FPC 37, making them more susceptible to contaminants. However, the entire surface 92a of the reinforcing plate 92 is covered by the FPC 37. This prevents contaminants from adhering to the surface 92a of the HDD 10, thereby preventing contamination of the interior of the housing 11.

[0111] The bonding layer 101 contains an organic compound and is directly attached to the surface 92a. Thus, the bonding layer 101 can strengthen the bond between the reinforcing plate 92 and the adhesive 103 by, for example, a non-covalent bond.

[0112] (Second embodiment)

[0113] Below, refer to Figure 5 The second embodiment will be described. In the following descriptions of various embodiments, components having the same functions as previously described components are assigned the same reference numerals as those already described, and their descriptions may be omitted. Furthermore, components assigned the same reference numerals are not limited to sharing all functions and properties; they may also have different functions and properties depending on the respective embodiments.

[0114] Figure 5 : is an exemplary cross-sectional view schematically showing a portion of the slider 35 and the FPC 37 according to the second embodiment. Figure 5 As shown, in the second embodiment, the HSA 14 does not have the bonding layer 102 . Therefore, the surface 92 b of the reinforcing plate 92 is in contact with the actuator module 41 of the carriage 35 .

[0115] For example, reinforcing plate 92 is made of a single metal plate. For example, the material for bonding layer 101 is applied by dipping the metal plate in the material for bonding layer 101. Prior to dipping, a mask is applied to one surface of the metal plate, which will become surface 92b. As a result, bonding layer 101 is formed on surface 92a, but bonding layer 102 is not formed on surface 92b.

[0116] The reinforcing plate 92 is cut out of the metal plate. Therefore, the bonding layer is not provided at the edge of the reinforcing plate 92. The cut reinforcing plate 92 is bent, thereby providing the flat portion 95 and the guide portion 96 on the reinforcing plate 92.

[0117] In the HDD 10 of the second embodiment described above, the reinforcing plate 92 has a surface 92b located opposite the surface 92a and in contact with the carriage 35. Specifically, the surface 92b is in direct contact with the carriage 35 and is not covered by the bonding layer 102. Therefore, the HDD 10 can prevent contaminants from adhering to the bonding layer 102, thereby preventing the interior of the housing 11 from becoming contaminated.

[0118] (Third embodiment)

[0119] Below, refer to Figure 6 A third embodiment will be described. Figure 6 : is an exemplary cross-sectional view schematically showing a portion of the slider 35 and the FPC 37 according to the third embodiment. Figure 6 As shown, the HSA 14 of the third embodiment further includes an adhesive 301. The adhesive 301 is an example of a second adhesive.

[0120] The adhesive 301 is an acrylic adhesive, similar to the adhesive 103. The adhesive 301 may be different from the adhesive 103. The adhesive 301 secures the connecting layer 102 and the actuator module 41 of the carriage 35 to each other.

[0121] In this embodiment, the adhesive 301 is interposed between the entire bonding layer 102 and the slider 35. Therefore, the adhesive 301 covers the entire bonding layer 102. Alternatively, the adhesive 301 may cover a portion of the bonding layer 102.

[0122] In the HDD 10 of the third embodiment described above, adhesive 301 secures the bonding layer 102 to the carriage 35. The bonding layer 102 is generally susceptible to adhesion not only to adhesives 103 and 301 but also to other substances, such as contaminants. However, the bonding layer 102 is covered with adhesive 301. This prevents contaminants from adhering to the bonding layer 102, thereby preventing contamination of the interior of the housing 11. Furthermore, adhesive 301 securely secures the reinforcing plate 92 to the carriage 35, thereby preventing displacement and vibration of the reinforcing plate 92 relative to the carriage 35.

[0123] (Fourth embodiment)

[0124] Below, refer to Figure 7 as well as Figure 8 A fourth embodiment will be described. Figure 7 It is an illustrative plan view schematically showing a portion of the carriage 35 , the FPC 37 , and the flexure 53 according to the fourth embodiment. Figure 8 It is along Figure 7 An exemplary cross-sectional view schematically shows a portion of the slider 35 and the FPC 37 according to the fourth embodiment, taken along line F8 - F8 .

[0125] like Figure 7 As shown, the joint portion 71 of the fourth embodiment includes a bent portion 401 in place of the bent portion 112. The bent portion 401 is substantially identical to the bent portion 112 except for the following points. The bent portion 401 partially covers the surface 92a of the guide portion 96 of the reinforcing plate 92. Multiple wiring lines 87 are provided in the bent portion 401.

[0126] The FPC 37 of the fourth embodiment includes a ground plane 405 instead of the ground plane 88. The ground plane 405 is substantially identical to the ground plane 88 except for the following points. The ground plane 405 is not provided on the bent portion 401 but on the flat portion 111. Therefore, the ground plane 405 is separated from the bent portion 401.

[0127] Adhesive 103 covers the entire surface 92a and adheres to the entire surface 101b of bonding layer 101. That is, a portion of bonding layer 101 provided on surface 92a is covered by adhesive 103 and bent portion 401, while the remaining portion of bonding layer 101 is covered by adhesive 103. Cured adhesive 103, as a layer of synthetic resin, covers surface 101b of bonding layer 101.

[0128] In the HDD 10 of the fourth embodiment described above, the surface 92a has a flat surface 92c and a curved surface 92e continuous from the flat surface 92c. The FPC 37 has a ground plane 405. The ground plane 405 is separated from the bent portion 401 of the FPC 37 and fixed to the curved surface 92e via the adhesive 103 and the bonding layer 101.

[0129] The bent portion 401 of the FPC 37 bends along the curved surface 92e. Meanwhile, the ground plane 405 increases the rigidity of the FPC 37. The ground plane 405 is separated from the bent portion 401, thereby making it easier for the FPC 37 to bend along the curved surface 92e.

[0130] (Fifth embodiment)

[0131] Below, refer to Figure 9 A fifth embodiment will be described. Figure 9 : is a schematic cross-sectional view showing an exemplary embodiment of the carriage 35 and the FPC 37. As in the fourth embodiment, the joint 71 of the fifth embodiment has a bent portion 401 instead of the bent portion 112. Figure 9 As shown, the HSA 14 of the fifth embodiment includes an adhesive 501 and an outer layer 502 instead of the adhesive 103. The adhesive 501 is substantially the same as the adhesive 103 except for the following points.

[0132] Adhesive 501 is attached to the entire surface 101b of bonding layer 101 provided on flat surface 92c, as well as to a portion of surface 101b of bonding layer 101 provided on inclined surface 92d and curved surface 92e. Bend portion 401 is fixed to reinforcing plate 92 via adhesive 501 and bonding layer 101. Alternatively, adhesive 501 may not be attached to bonding layer 101 provided on inclined surface 92d and curved surface 92e.

[0133] Outer layer 502 adheres to surface 101b of the other portion of bonding layer 101 provided on inclined surface 92d and curved surface 92e. Therefore, the entire surface 101b of bonding layer 101 adheres to adhesive 501 and outer layer 502. FPC 37 is exposed without covering outer layer 502. Alternatively, FPC 37 may cover a portion of outer layer 502.

[0134] Outer layer 502 is made of an organic material, such as polyolefin. However, outer layer 502 is not limited to this example. Outer layer 502 is made of a different material from adhesive 501. Adhesive 501 is less likely to adhere to outer layer 502 than to bonding layer 101. Therefore, contaminants are less likely to adhere to outer layer 502.

[0135] In the HDD 10 of the fifth embodiment described above, the outer layer 502 is distinct from the adhesive 501. The bonding layer 101 has surfaces 101a and 101b. Surface 101a is attached to surface 92a. Surface 101b is located opposite surface 101a and is entirely attached to the adhesive 501 and outer layer 502. In other words, the adhesive 501 and outer layer 502 cover the entire bonding layer 101. Therefore, the adhesive 501 and outer layer 502 prevent contaminants from adhering to the bonding layer 101, thereby preventing contamination of the interior of the housing 11.

[0136] (Sixth embodiment)

[0137] Below, refer to Figure 10 A sixth embodiment will be described. Figure 10 FIG. 1 is an illustrative plan view schematically showing a portion of the carriage 35, the FPC 37, and the flexure 53 according to the sixth embodiment. Figure 10 As shown, similarly to the fourth embodiment, the joint portion 71 of the sixth embodiment includes a bent portion 401 instead of the bent portion 112. Also, similarly to the fifth embodiment, the HSA 14 of the sixth embodiment includes an adhesive 501 instead of the adhesive 103.

[0138] The surface 92a of the reinforcing plate 92 of the sixth embodiment has two regions 601 and 602. Region 601 is an example of a first region. Region 602 is an example of a second region. Regions 601 and 602 are each a portion of the surface 92a. Figure 10 In FIG. 6 , for convenience, region 601 and region 602 are divided by a dotted line.

[0139] Region 601 comprises a portion of plane 92c. Region 601 overlaps with the plurality of pads 74 of FPC 37, the plurality of tails 62 of flexure 53, and the plurality of solders 75 in the Z direction. The Z direction is perpendicular to plane 92c of surface 92a. Therefore, region 601 supports the plurality of tails 62 via FPC 37.

[0140] Region 602 includes the remaining portion of plane 92c, inclined surface 92d, and curved surface 92e. Region 602 is adjacent to region 601. Region 602 is separated from the plurality of pads 74 of FPC 37, the plurality of tails 62 of flexures 53, and the plurality of solders 75 in the -Y direction. The -Y direction is along plane 92c of surface 92a. Region 602 supports preamplifier 91. Furthermore, a hole for screw 93 is opened in region 602.

[0141] In the sixth embodiment, HSA 14 includes a bonding layer 605 instead of bonding layer 101. Bonding layer 605 is substantially identical to bonding layer 101 except for the following points. Bonding layer 605 is provided in region 601 and is separated from region 602. In other words, bonding layer 605 is not provided in region 602.

[0142] A portion of adhesive 501 secures bonding layer 605 provided in region 601 to surface 71b of joint 71. Adhesive 501 adheres to the entire surface 101b of bonding layer 605. The remaining portion of adhesive 501 secures region 602 to surface 71b.

[0143] Part of the inclined surface 92d and part of the curved surface 92e in the region 602 are exposed without being covered by the bent portion 401, the adhesive 501, and the bonding layer 605. The inclined surface 92d and the curved surface 92e are not limited to this example.

[0144] In the HDD 10 of the sixth embodiment described above, the surface 92a has regions 601 and 602. Region 601 overlaps with the solder 75 in the Z direction perpendicular to the surface 92a. Region 602 is separated from the solder 75 in the -Y direction along the surface 92a. A bonding layer 605 is provided in region 601 and separated from region 602. Thus, the bonding layer 605 can enhance the bonding strength of the adhesive 501 near the heated solder 75, thereby preventing the reinforcing plate 92 from peeling off from the adhesive 501 when the solder 75 is heated. Furthermore, compared to a case where the bonding layer 605 is provided over the entire surface 92a, the HDD 10 can achieve cost reduction.

[0145] (Seventh embodiment)

[0146] Below, refer to Figure 11 A seventh embodiment will be described. Figure 11 This is an illustrative plan view schematically showing a portion of the carriage 35, FPC 37, and flexure 53 according to the seventh embodiment. Similar to the fourth embodiment, the joint 71 of the seventh embodiment includes a bent portion 401 in place of the bent portion 112. Also, similar to the fifth embodiment, the HSA 14 of the seventh embodiment includes an adhesive 501 in place of the adhesive 103.

[0147] The surface 92a of the reinforcing plate 92 of the seventh embodiment has two regions 701, 702, and 703. Region 701 is an example of the third region. Region 702 is an example of the fourth region. Regions 701, 702, and 703 are each part of the surface 92a. Figure 11 In FIG. 7 , for convenience, area 701 , area 702 , and area 703 are divided by dotted lines.

[0148] Region 701 comprises a portion of plane 92c. Region 702 comprises the remaining portion of plane 92c. Region 703 comprises an inclined surface 92d and a curved surface 92e. Region 701 surrounds region 702. Regions 701 and 702 overlap with the plurality of pads 74 of FPC 37, the plurality of tails 62 of flexures 53, and the plurality of solders 75 in the Z direction, respectively. Alternatively, one of regions 701 and 702 may not overlap with solder 75.

[0149] In the seventh embodiment, HSA 14 includes a bonding layer 705 in place of bonding layer 101. Bonding layer 705 is substantially identical to bonding layer 101 except for the following points. Bonding layer 705 is provided in region 701 and is separated from regions 702 and 703. In other words, bonding layer 705 is not provided in regions 702 and 703. Region 702 is surrounded by bonding layer 705 provided in region 701.

[0150] A portion of adhesive 501 secures bonding layer 705, located in region 701, to surface 71b of joint 71. Adhesive 501 adheres to the entire surface 101b of bonding layer 705. The remaining portion of adhesive 501 secures region 702 to surface 71b. Region 703 is exposed, uncovered by folded portion 401, adhesive 501, and bonding layer 705. Region 703 is not limited to this example.

[0151] In the HDD 10 of the seventh embodiment described above, the surface 92a has a region 701 and a region 702. A bonding layer 705 is provided in region 701. Region 702 is surrounded by the bonding layer 705 provided in region 701 and is fixed to the surface 92b via the adhesive 501. Thus, the bonding layer 705 prevents external moisture from penetrating into the adhesive 501 that secures region 702 to surface 92b, thereby preventing this moisture from causing the adhesive 501 and region 702 to separate.

[0152] While several embodiments of the present invention have been described, these embodiments are provided as examples and are not intended to limit the scope of the invention. These novel embodiments may be implemented in various other forms, and various omissions, substitutions, and modifications may be made without departing from the spirit of the invention. These embodiments and their variations are intended to be included within the scope and spirit of the invention, and are also intended to be included in the invention set forth in the claims and their equivalents.

Claims

1. A disk device comprising: electronic components; a flexible printed circuit board having a first surface facing the electronic component, a second surface opposite to the first surface, and pads provided on the first surface and connected to the electronic component via a conductive bonding body; a first adhesive disposed on the second surface; a component having a third surface facing the second surface; as well as The first bonding layer is disposed on the third surface and enters the recess of the third surface, and is fixed to the second surface through the first adhesive.

2. The disk device according to claim 1, further comprising: a housing for housing the electronic component, the flexible printed circuit board, the first adhesive, the component, and the first bonding layer; a magnetic disk housed in the housing; a magnetic head configured to read and write information to and from the magnetic disk; and The carriage is configured to move the magnetic head by rotating. The electronic component includes a flexure connected to the pad via the bonding body and electrically connecting the flexible printed circuit board and the magnetic head. The component is mounted on the slide.

3. The disk device according to claim 2, wherein Also having a second bonding layer, The component has a fourth surface located on the side opposite to the third surface and facing the slide, The second bonding layer is disposed on the fourth surface and enters the recess of the fourth surface.

4. The disk device according to claim 3, wherein A second adhesive is further provided for fixing the second bonding layer and the slider to each other.

5. The disk device according to claim 2, wherein The member has a fourth surface located on the side opposite to the third surface and in contact with the carriage.

6. The disk device according to claim 1, wherein The first bonding layer is provided on the entire area of the third surface.

7. The disk device according to claim 6, wherein The first bonding layer has a fifth surface attached to the third surface, and a sixth surface located on the opposite side of the fifth surface. The first adhesive is attached to the entire area of the sixth surface.

8. The disk device according to claim 7, wherein The first adhesive secures the entire sixth surface and the flexible printed circuit board to each other.

9. The disk device according to claim 8, wherein The third surface has a plane and a curved surface continuous from the plane, The flexible printed circuit board has a ground plane. A portion of the ground plane is disposed at a portion of the flexible printed circuit board that is fixed to the curved surface via the first adhesive and the first bonding layer.

10. The disk device according to claim 8, wherein The third surface has a plane and a curved surface continuous from the plane, The flexible printed circuit board has a ground plane. The ground plane is separated from a portion of the flexible printed circuit board that is fixed to the curved surface via the first adhesive and the first bonding layer.

11. The disk device according to claim 6, wherein further comprising an outer layer different from the first adhesive, The first bonding layer has a fifth surface and a sixth surface. The fifth surface is attached to the third surface. The sixth surface is located on the opposite side to the fifth surface and the entire area of the sixth surface is attached to the first adhesive and the outer layer.

12. The disk device according to claim 1, wherein The third surface has a first region overlapping with the bonded body in a direction perpendicular to the third surface, and a second region separated from the bonded body in a direction along the third surface. The first bonding layer is provided in the first region and separated from the second region.

13. The disk device according to claim 1, wherein The third surface includes a third region provided with the first bonding layer, and a fourth region surrounded by the first bonding layer provided in the third region and fixed to the second surface by the first adhesive.

14. The disk device according to claim 1, wherein The first bonding layer includes an organic compound and is directly attached to the third surface.

15. A disk device comprising: case; a magnetic disk housed in the housing; a magnetic head configured to read and write information to and from the magnetic disk; and The carriage is configured to move the magnetic head by rotating, a flexible printed circuit board having solder pads; a flexure connected to the pad via a conductive bonding body and electrically connecting the flexible printed circuit board and the magnetic head; as well as The metal member is mounted on the slide and has a first outer surface facing the flexible printed circuit board and entirely covered by the flexible printed circuit board, and a second outer surface located on the opposite side of the first outer surface and facing the slide.

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