Substrate holder, plating apparatus, and method for inducing liquid into substrate holder

Abstract

The present invention addresses the problem of efficiently introducing a liquid into an internal space of a substrate holder. The present invention relates to a substrate holder for holding a substrate, the substrate holder comprising: a first holding member and a second holding member that sandwich and hold the substrate; a sealing member disposed between the first holding member and the second holding member in a state in which the substrate is held by the first holding member and the second holding member, the sealing member sealing an outer peripheral portion of the substrate in contact with a contact of the substrate holder; a liquid injection port for injecting a liquid into the internal space sealed by the sealing member; and an exhaust port for discharging gas from the internal space, the exhaust port being formed by combining the recess of the first holding member and the recess of the second holding member, and the flow path area of the exhaust port being larger than the flow path area of the liquid injection port.

Description

Technical Field

[0001] The present application relates to a substrate holder, a plating device, and a method for introducing liquid into the substrate holder. Background Art

[0002] During electroplating, if the plating liquid leaks into the substrate holder due to certain undesirable conditions (concavities and convexities on the substrate, deterioration of the seal, etc.), the plating liquid that invades the interior of the holder may cause corrosion and / or dissolution of the substrate's seed layer, resulting in poor conductivity, and the uniformity of the plating may be reduced.

[0003] Japanese Patent No. 7132135 (Patent Document 1) describes a method of providing a liquid inlet and an exhaust port on the upper portion of a substrate holder. When the substrate holder is immersed in liquid, the substrate holder is tilted with the liquid inlet positioned below the liquid surface and the exhaust port positioned above the liquid surface. This allows air in the enclosed space (internal space) within the substrate holder to be exhausted through the exhaust port, while liquid is simultaneously filled into the internal space through the liquid inlet. Japanese Patent No. 7097522 (Patent Document 2) describes a method of providing an inlet passage and an outlet passage communicating with the internal space of the substrate holder, connecting a decompression device to the exhaust port, and introducing liquid into the internal space after the internal space is depressurized by the decompression device.

[0004] Patent Document 1: Japanese Patent No. 7132135

[0005] Patent Document 2: Japanese Patent No. 7097522

[0006] The substrate holder described in Japanese Patent No. 7132135 (Patent Document 1) requires a mechanism for tilting the substrate holder when liquid is injected, potentially complicating the structure of the plating apparatus. Furthermore, it may be difficult to maintain a sufficient pressure difference between the liquid injection port and the exhaust port of the substrate holder, thereby failing to ensure a sufficient liquid injection speed. As described in Japanese Patent No. 7095722 (Patent Document 2), when a pressure reducing device is connected to the substrate holder, an additional step of connecting the pressure reducing device to the substrate holder is required. Summary of the Invention

[0007] One object of the present invention is to solve at least one of the above-mentioned problems. Another object of the present invention is to efficiently introduce liquid into the interior space of a substrate holder. Another object of the present invention is to efficiently introduce liquid into the interior space of a substrate holder using a simple structure and / or process.

[0008] According to one embodiment of the present invention, there is provided a substrate holder, which is a substrate holder for holding a substrate and comprises: a first holding component and a second holding component for clamping and holding the substrate; a sealing member arranged between the first holding component and the second holding component when the substrate is held by the first holding component and the second holding component, so as to seal the outer peripheral portion of the substrate contacted by the contact of the substrate holder; a liquid injection port for injecting liquid into an internal space sealed by the sealing member; and an exhaust port for discharging gas from the internal space, the exhaust port being composed of a combination of a recessed portion of the first holding component and a recessed portion of the second holding component, and a flow path area of ​​the exhaust port being larger than a flow path area of ​​the liquid injection port. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is an overall configuration diagram of a plating apparatus according to one embodiment.

[0010] Figure 2 This is a schematic diagram showing a plating module according to one embodiment.

[0011] Figure 3 This is a front view of a substrate holder according to one embodiment.

[0012] Figure 4 It is along Figure 3 AA cross-sectional view.

[0013] Figure 5 It is a schematic diagram showing an enlarged cross section of the internal space of a substrate holder of a comparative example.

[0014] Figure 6A This is a front view of an example of a substrate holder.

[0015] Figure 6B It is along Figure 6A Cross-sectional view of BB.

[0016] Figure 7A It is a front view of the substrate holder of a comparative example.

[0017] Figure 7B It is along Figure 7A Cross-sectional view of CC.

[0018] Figure 8A This is a front view of an example of a substrate holder when liquid is introduced.

[0019] Figure 8B It is along Figure 8A Cross-sectional view of DD.

[0020] Figure 9A This is a cross-sectional view of an example of a substrate holder when liquid is introduced.

[0021] Figure 9B It is along Figure 9A Cross-sectional view of EE.

[0022] Figure 10 This is a front view of the substrate holder in the plating tank.

[0023] Figure 11 This is an example of the structure of the exhaust port of the substrate holder.

[0024] Figure 12 This is an example of the structure of the exhaust port of the substrate holder. DETAILED DESCRIPTION

[0025] The following describes embodiments of the present invention with reference to the accompanying drawings. In the accompanying drawings, identical or similar elements are denoted by identical or similar reference numerals, and repeated descriptions of identical or similar elements may be omitted in the description of each embodiment. Furthermore, features described in each embodiment may also be applied to other embodiments unless they conflict with each other.

[0026] In this specification, "substrate" includes not only semiconductor substrates such as wafers, glass substrates, liquid crystal substrates, and printed circuit substrates, but also magnetic recording media, magnetic recording sensors, reflectors, optical elements, micro-mechanical elements, or partially manufactured integrated circuits, and other arbitrary processed objects. The substrate includes any shape including polygons (quadrilaterals, etc.) and circles. In addition, in this specification, expressions such as "front surface", "rear surface", "front", "rear", "up", "down", "left", and "right" are used, but they are terms for indicating the position and direction on the paper of the illustrated drawings for the convenience of explanation, and may be different in the actual configuration when the device is used.

[0027] Figure 1 The overall configuration diagram of a plating device according to an embodiment is shown. The plating device 100 is a device that holds a substrate on a substrate holder 200 ( Figure 2 ) state. The plating apparatus 100 is broadly divided into a loading / unloading station 110 for loading and unloading substrates onto and from a substrate holder 200; a processing station 120 for processing substrates; and a cleaning station 50a. The processing station 120 includes a pre-processing / post-processing module 120A for pre-processing and post-processing substrates; and a plating module 120B for plating substrates.

[0028] The loading / unloading station 110 includes one or more cassette tables 25 and a substrate loading / unloading module 29. The cassette table 25 carries a cassette 25a (e.g., FOUP) containing one or more substrates. The substrate loading / unloading module 29 is configured to load and unload a substrate W onto a substrate holder 200 (see FIG. Figure 2). In addition, a stocker 30 for accommodating the substrate holder 200 is provided near (eg, below) the substrate loading and unloading module 29. The cleaning station 50a includes a cleaning module 50 for cleaning and drying the substrate W after the plating process.

[0029] A transfer robot 27 for transferring substrates between these units (modules) is provided in a position surrounded by the cassette table 25, the substrate loading and unloading module 29, and the cleaning station 50a. The transfer robot 27 is configured to be movable by a moving mechanism 28. The transfer robot 27 is configured to, for example, remove a substrate before plating from the cassette 25a and transfer it to the substrate loading and unloading module 29, receive a substrate after plating from the substrate loading and unloading module 29, transfer the plated substrate to the cleaning module 50, and remove a cleaned and dried substrate from the cleaning module 50 and store it in the cassette 25a.

[0030] The pre-treatment and post-treatment module 120A includes a pre-wetting module 32, a pre-dip module 33, a first rinsing module 34, a spray module 35, and a second rinsing module 36. The pre-wetting module 32 wets the plated surface of the substrate before plating with a treatment liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the substrate surface with the treatment liquid. The pre-wetting module 32 is configured to perform a pre-wetting process, which is a process that replaces the treatment liquid inside the pattern with the plating liquid during plating, thereby facilitating the supply of the plating liquid to the pattern. The pre-dip module 33 is configured to perform a pre-dip process, which is a process that uses a treatment liquid such as sulfuric acid or hydrochloric acid to etch away the high-resistance oxide film on the surface of the seed layer formed on the plated surface of the substrate before plating, thereby cleaning or activating the plating base surface. In the first rinsing module 34, the pre-dip substrate and the substrate holder 200 are cleaned together with a cleaning liquid (pure water, etc.). In the spray module 35, the cleaned substrate is de-liquidated. In the second rinse module 36, the plated substrate is cleaned with a cleaning liquid (pure water, etc.) together with the substrate holder 200. The above configuration is an example and is not limited thereto. The pre-processing / post-processing module 120A may also adopt other configurations.

[0031] The plating module 120B has a plurality of plating tanks 39 (also referred to as plating chambers) and an overflow tank 38. Each plating tank 39 accommodates a substrate in the interior and immerses the substrate in the plating solution held therein, thereby plating the substrate surface with copper plating or the like. Here, the type of plating solution is not particularly limited, and various plating solutions are used according to the application. The structure of the plating module 120B is an example, and the plating module 120B can adopt other structures.

[0032] The plating apparatus 100 has a transport device 37, for example, a linear motor, located on the side of each of the above-mentioned devices and transporting the substrate holder 200 together with the substrate between the above-mentioned devices. The transport device 37 is configured to transport the substrate holder 200 between the substrate loading and unloading module 29, the stocker 30, the pre-wetting module 32, the pre-preg module 33, the first rinsing module 34, the spraying module 35, the second rinsing module 36, and the plating module 120B. Figure 1 Although an example in which the transport device 37 includes one conveyor is described in FIG, the transport device 37 may include two or more conveyors.

[0033] The plating device 100 constructed as described above has a control module (controller) 175 as a control unit configured to control the above-mentioned various parts. The controller 175 has a memory 175B that stores a specified program and a CPU 175A that executes the program of the memory 175B. The storage medium constituting the memory 175B stores various setting data, various programs including the program for controlling the plating device 100, etc. The program, for example, includes the control of the transport of the transport robot 27, the control of the loading and unloading of substrates in the substrate loading and unloading module 29 to the substrate holder 200, the control of the transport of the transport device 37, the control of the processing in each processing module, the control of the plating process in each plating tank 39, and the control of the cleaning station 50a. The storage medium can include a non-volatile storage medium and / or a volatile storage medium. As the storage medium, for example, a computer-readable ROM, RAM, flash memory or other memory, a hard disk, a CD-ROM, a DVD-ROM, a floppy disk or other disk-shaped storage medium or other known storage medium can be used.

[0034] Controller 175 is configured to communicate with the unillustrated superior controller of unified control plating device 100 and other related devices, and can exchange data between the database that superior controller has.A part or all of the functions of controller 175 can be made up of hardware such as ASIC.A part or all of the functions of controller 175 can also be made up of PLC or sequence controller etc.A part or all of controller 175 can be configured in the inside and / or outside of the housing of plating device 100.A part or all of controller 175 is connected to each part of plating device 100 by wired and / or wireless communication.

[0035] (Plating Module)

[0036] Figure 2Schematic diagram of a plating module 120B. As shown in the figure, the plating module 120B includes: a plating tank 39, which holds a plating solution Q; an anode 40, which is arranged in the plating tank 39 opposite to the substrate holder 200; and an anode holder 60, which holds the anode 40. The substrate holder 200 is configured to hold a substrate W, which serves as a cathode, in a removable manner and to immerse the substrate W in the plating solution Q in the plating tank 39. The plating device 100 of this embodiment is an electroplating device that plates the surface of the substrate W with metal by passing an electric current between the anode 40 and the substrate W via the plating solution Q. In other embodiments, the plating device may also be an electroless plating device. As the anode 40, an insoluble anode that does not dissolve in the plating solution, for example, titanium coated with iridium oxide or platinum, is used. A soluble anode may also be used as the anode 40. As the soluble anode, for example, a soluble anode composed of phosphorus-containing copper can be used. The substrate W can be, for example, a semiconductor substrate, a glass substrate, a resin substrate, or any other object to be processed. The metal plated on the surface of the substrate W is, for example, copper (Cu), nickel (Ni), tin (Sn), a Sn-Ag alloy, or cobalt (Co). The plating solution Q is an acidic solution containing the metal to be plated, for example, a copper sulfate solution in the case of copper plating.

[0037] Anode 40 and substrate W are configured to extend in the vertical direction and are configured to be opposed to each other in the plating solution. However, in other embodiments, anode 40 and substrate W can be configured to extend in the horizontal direction (referred to as horizontal type or cup type). Anode 40 is connected to the positive pole of power supply 90 via anode holder 60, and substrate W is connected to the negative pole of power supply 90 via substrate holder 200. When voltage is applied between anode 40 and substrate W, current flows into substrate W, forms a metal film on the surface of substrate W in the presence of plating solution.

[0038] The plating module 120B also includes an overflow tank 38 adjacent to the plating tank 39. The plating solution in the plating tank 39 overflows from the sidewalls of the plating tank 39 and flows into the overflow tank 38. One end of a plating solution circulation line 58a is connected to the bottom of the overflow tank 38, and the other end of the circulation line 58a is connected to the bottom of the plating tank 39. The circulation line 58a is equipped with, for example, a circulation pump 58b, a constant temperature unit 58c, and a filter 58d. The plating solution Q overflows from the sidewalls of the plating tank 39 and flows into the overflow tank 38. Then, it returns from the overflow tank 38 to the plating tank 39 through the circulation line 58a. In this way, the plating solution Q circulates between the plating tank 39 and the overflow tank 38 through the circulation line 58a.

[0039] The plating apparatus 100 can further include: a regulation plate 14 for regulating the potential distribution on the substrate W; and a paddle 16 for stirring the plating solution in the plating tank 39. The regulation plate 14 is disposed between the paddle 16 and the anode 40 and has an opening 14a for limiting the electric field in the plating solution. The paddle 16 is disposed near the surface of the substrate W on the substrate holder 200 held in the plating tank 39. The paddle 16 is made of, for example, titanium (Ti) or resin. The paddle 16 stirs the plating solution Q by reciprocating parallel to the surface of the substrate W so that sufficient metal ions in the plating of the substrate W are uniformly supplied to the surface of the substrate W.

[0040] The above-described configuration is merely an example, and the plating apparatus 100 , the plating module 120B, and other configurations may be employed.

[0041] (Substrate Holder)

[0042] <Structure Example 1>

[0043] Figure 3 This is a front view of an example of a substrate holder. Figure 4 The substrate holder is along Figure 3 AA cross-sectional view of FIG. In this figure, the state in which the substrate holder 200 is in the plating liquid Q is shown.

[0044] like Figure 4 As shown, the substrate holder 200 includes a first holding member 210 and a second holding member 220, and the substrate W is clamped and held from both sides by the first holding member 210 and the second holding member 220. An opening 211A is formed in the first holding member 210 and the second holding member 220 to expose both sides of the substrate W. The opening 211A can also be provided in one of the first holding member 210 or the second holding member 220. The first holding member 210 includes: an inner seal 215 that seals between the substrate W and the first holding member 210; and an outer seal 216. Figure 3 ), the space between the first holding member 210 and the second holding member 220 is sealed at a position outside the inner seal 215. The second holding member 220 includes an inner seal 225 that seals the space between the substrate W and the second holding member 220. The space surrounded by the inner seals 215 and 225 and the outer seal 216 constitutes an inner space 240 that is sealed from the outside of the substrate holder.

[0045] In addition, the first holding member 210 includes an external connection terminal 218 ( Figure 3 )、Contact 213( Figure 4 ), and the bus bar 214 ( Figure 3 、 Figure 4 ).exist Figure 3 The contact 213 is omitted in the figure. The contact 213 is an electrical contact that contacts the seed layer 401 of the substrate W and allows the plating current to flow to the substrate W when the substrate W is clamped and held by the first holding member 210 and the second holding member 220. A plurality of contacts 213 are provided along the periphery of the substrate W. Figure 4 In the example of FIG. 4 , a resist pattern 402 for dividing a plating pattern is formed on a seed layer 401 (eg, a Cu layer) of a substrate W. In addition, the substrate holder 200 has a handle 212 ( Figure 3 In this embodiment, the external connection terminal 218 is provided at one end of the handle 212. In other embodiments, the external connection terminal 218 may also be provided at both ends of the handle 212.

[0046] like Figure 4 As shown, a liquid (in this structural example, deionized water DIW, which is a type of pure water) is introduced into the internal space 240 of the substrate holder 200. Here, the structure in which the contact 213 is covered with liquid is called a wet contact. The liquid injected into the internal space 240 may be a liquid other than DIW as long as it does not corrode the structural parts exposed in the internal space 240 of the substrate holder 200. For example, a liquid that does not contain metal salts (a liquid in which the concentration of metal salts is less than a specified concentration (for example, 5 g / L)) can be used. Such liquids include, for example, tap water, natural water, and pure water. Pure water includes, for example, deionized water (DIW), distilled water, purified water, or RO water.

[0047] exist Figure 4 In the example, DIW is introduced into the internal space 240 through an inlet passage 231 provided in the substrate holder 200. The outlet of the inlet passage 231 becomes a liquid injection port 511 opening in the internal space 240. A valve 231a is provided in the middle of the inlet passage 231 for controlling the conduction and shutoff of the inlet passage 231. The valve 231a can be, for example, a solenoid valve, an on-off valve, or a flow control valve capable of controlling the flow rate. The valve 231a is controlled by the controller 175. The valve 231a can be provided inside or on the surface of the second holding member 220 of the substrate holder 200. A part or all of the inlet passage 231 can be provided as a passage formed inside the second holding member 220 of the substrate holder 200 and / or as a pipe arranged on the surface of the second holding member 220. The inlet passage 231 is preferably provided, for example, at the lower portion of the substrate holder 200, and is particularly preferably provided below the substrate W.

[0048] like Figure 3As shown in FIG. 2 , an exhaust port 521 communicating with the internal space 240 is provided at the upper portion of the substrate holder 200. The exhaust port 521 is configured so that the upper end portion of the portion of the substrate holder 200 holding the substrate W (the portion other than the handle) extends in the width direction of the substrate holder (in the same direction as the width direction of the substrate holder). Figure 12 The exhaust port 521 has the same slit shape as the exhaust port 521. In this embodiment, the flow path area of ​​the exhaust port 521 is formed to be larger than the flow path area of ​​the liquid injection port 511 (the outlet of the inlet passage 231). According to this structure, when liquid is injected into the internal space 240 of the substrate holder 200, the air in the internal space 240 can be efficiently discharged from the exhaust port 521 having a relatively large flow path area, while the liquid can be efficiently injected into the internal space 240 from the liquid injection port 511, and the speed of injection of the liquid into the internal space 240 can be increased. The exhaust port 521 can be formed, for example, by combining a recess (not shown) provided in the first holding member 210 and a recess (not shown) provided in the second holding member 220. If the exhaust port 521 is formed in this way, it is easy to increase the flow path area of ​​the exhaust port 521. In addition, in the plating tank 39, the substrate holder 200 is immersed in the plating liquid in such a manner that the exhaust port 521 is located above the plating liquid surface.

[0049] exist Figure 4 In the embodiment of the present invention, an electrode 235A can be provided in the internal space 240 of the substrate holder 200 to function as a sacrificial electrode and / or a leakage current detection electrode. In addition, a power supply 236A can be connected between the electrode 235A and the bus bar 214 in the plating tank 39. The power supply 236A can be composed of a DC power supply and / or an AC power supply. In addition, a current detector 237A can be provided in the power supply 236A or on the wiring extending from the power supply 236A. In this state, the controller 175 can detect whether the plating solution has leaked into the internal space 240 by monitoring the current flowing between the electrode 235A and the contact 213 (bus bar 214) or the resistance therebetween. In the absence of plating solution leakage, no current flows between the electrode 235A and the contact 213 due to the high resistance of the DIW. However, in the presence of plating solution leakage, the resistance of the DIW decreases due to the plating solution, and current flows between the electrode 235A and the contact 213. Furthermore, when the electrode 235A functions as a sacrificial electrode, the electrode 235A is dissolved prior to the contact 213 , thereby suppressing corrosion of the contact 213 even when the plating solution leaks into the internal space 240 .

[0050] The electrode 235A can be formed of a material having a higher natural potential (standard electrode potential) than the material of the seed layer, or can be an insoluble electrode coated with such a material. In the case where the electrode 235A and the contact 213 are made of the same material, the electrode 235A can be biased to a higher potential relative to the contact 213, thereby making the electrode 235A more soluble than the contact 213. In addition, only the electrode 235A can be provided as a sacrificial electrode, only the electrode 235A that functions as a leakage current detection electrode can be provided, or the electrode 235A and related structures can be omitted. In the structural examples described below, part or all of the above-mentioned electrode 235A and related structures can be provided, or the above-mentioned electrode 235A and related structures can be omitted.

[0051] Figure 5 This is a schematic diagram of an enlarged cross-section of the interior space of a substrate holder of a comparative example. This figure shows substrate holder 200 immersed in plating solution Q. As shown, in substrate holder 200A of the comparative example, interior space 240A is hollow and contains air. In substrate holder 200A of the comparative example, contacts 213 are positioned dry within interior space 240. Such contacts 213 are referred to as dry contacts.

[0052] In the substrate holder 200A of the comparative example, since the internal space 240A is hollow, if the plating liquid Q leaks into the internal space 240A (if a leak path exists), the air in the internal space 240A is compressed due to the hydraulic pressure generated by the plating liquid Q, and a large amount of the plating liquid Q may enter the sealing member. Furthermore, if the plating liquid Q leaks, the original plating liquid Q adheres to the seed layer 401 exposed near the contact 213 without being diluted. If the plating liquid Q adheres to the seed layer 401 in the internal space 240A, the air present in the internal space 240 dissolves in the plating liquid Q. Due to localized cell action caused by the dissolved oxygen concentration gradient in the plating liquid Q and / or electrolytic corrosion caused by the diversion of the plating current, the seed layer 401 dissolves, potentially causing electrical insulation (resulting in power failure).

[0053] On the other hand, Figure 4 As shown, when the internal space 240 of the substrate holder 200 is filled with liquid (DIW in this example), the following effective effects are achieved.

[0054] (1) Reduce the risk of leakage

[0055] Even if a leak path exists, the internal space 240 of the substrate holder 200 is filled with liquid, and the pressure inside and outside the seals 215 and 216 is balanced. Therefore, the intrusion of the plating liquid Q into the internal space 240 is limited to the diffusion amount.

[0056] (2) Suppressing seed dissolution during leakage

[0057] Even if leakage occurs, the plating solution Q is diluted by the liquid and no gas-liquid interface exists, so that the seed crystal 401 of the substrate W is less likely to be corroded.

[0058] If sacrificial electrode 235A is provided, even if a plating solution leaks in an amount that may cause corrosion, since contact 213 and seed layer 401 are biased higher than sacrificial electrode (e.g., Cu), sacrificial electrode 235A dissolves preferentially, suppressing dissolution of seed layer 401.

[0059] (3) Leak detection

[0060] If a leakage sensor (electrode 235A) is provided near the seal, it is possible to detect whether the plating solution has leaked into the internal space 240 .

[0061] (4) Reliability during mass production

[0062] Since liquid is supplied and drained from the seal each time the substrate is fixed (each time the substrate holder is held), the accumulation of residual cleaning liquid on the contacts can be suppressed. In addition, after the substrate holder is automatically cleaned, plating can be performed without drying the contacts.

[0063] <Structure Example 2>

[0064] Figure 6A This is a front view of an example of a substrate holder. Figure 6B It is along Figure 6A In the substrate holder 200, the structure of the outer seal 216 is the same as that of the substrate holder ( Figure 3 、 Figure 4 ) has a different structure. In addition, Figure 3 Although omitted in Figure 6A and Figure 6B , there are shown clamps (hook 227, hook 217) that lock the first holding member 210 and the second holding member 220. The other structures are the same as those of the substrate holder described above, so the following description will focus on the differences and omit the same structures.

[0065] The clamp includes a hook 217 provided on the first holding member 210 and a hook 227 provided on the second holding member 220. The hook 227 is biased by a spring in a direction to engage with the hook 217. When the substrate W is clamped and held by the first holding member 210 and the second holding member 220, the hook 227 engages with the hook 217, thereby locking the first holding member 210 and the second holding member 220.

[0066] In this structural example, Figure 6A As shown, the exhaust port 521 is provided at one end side in the left-right direction of the substrate holder 200. The outer seal 216 is formed in a manner interrupted around the exhaust port 521 according to the structure of the exhaust port 521. The exhaust port 521 allows fluid to flow between the internal space 240 and the outside of the substrate holder 200. Figure 6A In the example, the exhaust port 521 can be set at any position as long as it is higher than the liquid injection port 511 described later. However, when the substrate holder 200 is immersed in the plating liquid Q (refer to Figure 10 ), the exhaust port 521 needs to be located higher than the plating liquid level to prevent the plating liquid from intruding through the exhaust port 521. Therefore, the exhaust port 521 is preferably located higher than the area holding the substrate W, for example, at the upper end of the portion of the substrate holder 200 that holds the substrate W (the portion other than the handle).

[0067] At the lower portion of the substrate holder 200, a Figure 6A ) is extended downwards more than the other parts of the portion surrounded by the outer seal 216 (the inner space 240). The outer seal 216 is provided with an extended region 216A so that the inner space 240 extends to the vicinity of the lower end of the substrate holder 200. The front end / lower end of the extended region 216A serves as a liquid injection port 511 which is opened and closed by the outer seal 216. In addition, a protrusion 330 ( Figure 8A 、 Figure 8B )、Pin 340( Figure 9A ) intrusion, the extension region 216A may be omitted.

[0068] In this embodiment, the flow path area of ​​the exhaust port 521 is larger than the flow path area of ​​the liquid injection port 511. This configuration allows for efficient discharge of air from the internal space 240 through the exhaust port 521, which has a relatively large flow path area, while also efficiently injecting liquid into the internal space 240 through the liquid injection port 511. This also increases the rate at which liquid is injected into the internal space 240. The exhaust port 521 can be formed, for example, by combining a recess (not shown) provided in the first holding member 210 with a recess (not shown) provided in the second holding member 220. This configuration of the exhaust port 521 facilitates increasing the flow path area of ​​the exhaust port 521.

[0069] In this embodiment, the plating process is performed while the internal space 240 of the substrate holder 200 is filled with liquid (e.g., DIW) injected from the liquid injection port 511. Filling the internal space 240 with liquid only requires that at least all of the contacts 213 within the internal space 240 be covered with the liquid.

[0070] Figure 7A It is a front view of the substrate holder of a comparative example. Figure 7B It is along Figure 7A Cross-sectional view of CC. Figure 5 Similarly, in the substrate holder 200A of the comparative example, the liquid injection port 511 and the exhaust port 521 are not provided for the internal space 240, and no liquid is injected into the internal space 240. In the substrate holder 200A, the internal space 240 is not filled with liquid, so a reference Figure 5 Various problems described above. On the other hand, according to Figure 6A and Figure 6B In the substrate holder 200 shown, the internal space 240 is filled with liquid, and thus the problems of the substrate holder 200A of the comparative example can be solved, and the effects (1) to (4) described above can be achieved.

[0071] Figure 8A This is a front view of an example of the substrate holder 200 when liquid is introduced. Figure 8B It is along Figure 8A The structure of the substrate holder 200 is similar to Figure 6A and Figure 6B The structure is the same as described in [ ]. Here, the example of introducing liquid into the internal space 240 of the substrate holder 200 in the pre-wetting module 32 is used. Specifically, during the pre-wetting process (degassed water immersion), liquid (DIW) is introduced into the contact area (internal space 240). Alternatively, the liquid may be introduced into the internal space 240 of the substrate holder 200 in the first rinse module 34 or another module capable of accommodating liquid, instead of the pre-wetting module 32.

[0072] In this configuration example, the prewet module 32 includes a prewet tank 320 and an overflow tank 321 for receiving DIW overflowing from the prewet tank 320. The DIW in the overflow tank 321 is circulated within the prewet tank 320 via a pump and a degassing module. A protrusion 330 is provided on the bottom surface of the prewet tank 320 as a protrusion protruding approximately perpendicularly from the bottom surface to open the liquid injection port 511.

[0073] In this structural example, the liquid injection port 511 is provided on the first holding member 210. Figure 8BAs shown, the liquid injection port 511 corresponds to the lower end of the outer seal 216 when the substrate holder is upright (the front end of the extended area 216A), and corresponds to the area on the front end side of the lip of the outer seal 216 (the area corresponding to the gap between the outer seal 216 and the protrusion 330), and is opened by the protrusion 330.

[0074] When the substrate holder 200 is immersed in the liquid (DIW in this example) in the pre-wetting tank 320, the exhaust port 521 can be located either above or below the liquid level. Even when the exhaust port 521 is in the liquid, air within the internal space 240 can be exhausted from the exhaust port 521, while liquid can be injected into the internal space 240 through the liquid injection port 511 and the exhaust port 521. Even in this case, since the flow path area of ​​the exhaust port 521 is larger than that of the liquid injection port 511, which is located below, air can be efficiently exhausted from the exhaust port 521, while liquid can be efficiently injected into the internal space 240.

[0075] When the discharge port 521 is above the liquid level, liquid does not flow into the internal space 240 from the discharge port 521, so the air in the internal space 240 can be discharged more efficiently. In addition, the possibility of air being entrained in the liquid flowing from the discharge port 521 and remaining in the internal space 240 can be reduced.

[0076] like Figure 8B As shown in the left-to-right figures, when the substrate holder 200 is immersed in the DIW in the pre-wetting tank 320, the protrusion 330 deforms the outer seal 216 at the lower end of the expanded area 216A at the bottom of the substrate holder 200, forming a gap between the outer seal 216 and the protrusion 330, thereby opening the liquid inlet 511. The DIW in the pre-wetting tank 320 is injected into the interior space 240 of the substrate holder 200 through the opened liquid inlet 511. The flow path area of ​​the liquid inlet 511 corresponds to the flow path area of ​​the gap between the outer seal 216 and the protrusion 330. After the liquid is injected into the interior space 240, the substrate holder 200 moves upward. When the protrusion 330 disengages from the outer seal 216, the outer seal 216 returns to its original position, and the interior space 240 is sealed again. The outer seal 216 functions as a valve to open and close the liquid inlet 511.

[0077] When liquid is injected into the internal space 240 from the liquid injection port 511, the air in the internal space 240 is discharged from the upper exhaust port 521. As described above, the flow path area of ​​the exhaust port 521 is larger than the flow path area of ​​the liquid injection port 511. Therefore, while the air in the internal space 240 is efficiently discharged from the exhaust port 521 with a relatively large flow path area, the liquid can be efficiently injected into the internal space 240 from the liquid injection port (introduction passage 231), thereby increasing the speed at which the liquid is injected into the internal space 240.

[0078] Furthermore, since the liquid is injected into the internal space 240 of the substrate holder 200 from below, the possibility of air remaining in the internal space 240 can be reduced.

[0079] In the above structure, an internal passage extending in the longitudinal direction and opening to the pre-wet layer 320 and the internal space 240 at the base end and the front end may be provided inside the convex portion 330 , and DIW may be injected through the internal passage.

[0080] <Structure Example 3>

[0081] Figure 9A This is a cross-sectional view of another example of a substrate holder when liquid is introduced. Figure 8A Cross-sectional view at the same position of DD. Figure 9B It is along Figure 9A EE sectional view. In this structural example, instead of the protrusion 330, a pin 340 for opening the liquid injection port 511 is provided on the bottom surface of the pre-wetting tank 320 in a manner protruding approximately vertically from the bottom surface. A passage 341 extending in the longitudinal direction and opening on the base end side and the front end side is provided inside the pin 340. In addition, in the substrate holder 200 of this structural example, on the basis of the structure of the above-mentioned substrate holder, a thick-walled portion 216B is provided on the outer seal 216 of the extension area 216A, and a cutout 512 through which the pin 340 can pass is provided in the thick-walled portion 216B. In this structural example, the liquid injection port 511 is provided in the first retaining component 210. As Figure 9A and Figure 9B As shown, the liquid injection port 511 corresponds to the lower end of the outer seal 216 (the front end of the extended region 216A) when the substrate holder is viewed from above, and corresponds to the region opened by the passage 341 of the pin 340 at the thick wall portion 216B of the outer seal 216. The remaining structure is the same as that of the above-described Structural Example 1.

[0082] In this structural example, when the substrate holder 200 is immersed in the DIW in the pre-wet tank 320, Figure 9A and Figure 9BAs shown, the pin 340 pushes open and penetrates the cutout 512 of the outer seal 216, entering the interior space 240. The passage 341 within the pin 340 opens the cutout 512 (liquid inlet 511), allowing the DIW in the pre-wetting tank 320 to be injected into the interior space 240 of the substrate holder 200 via the passage 341 of the pin 340. The flow path area of ​​the liquid inlet 511 is the same as the flow path area of ​​the passage 341 of the pin 340. After the liquid is injected into the interior space 240, the substrate holder 200 moves upward. When the pin 340 disengages from the cutout 51 of the outer seal 216, the cutout 512 returns to its original state, and the interior space 240 is sealed again. The outer seal 216 functions as a valve that opens and closes the liquid inlet 511 at the cutout 512.

[0083] In this structural example, the cutout 512 of the outer seal 216 is configured to allow the pin 340 having the passage 341 to pass through, thereby opening the liquid injection port 511. In this structure, the liquid injection port 511 can also be considered to be the area opened by the passage 341 of the pin 340 at the lower end of the outer seal 216 (the front end of the extended region 216A) when the substrate holder is viewed from the front.

[0084] In this structural example, the exhaust port 521 ( Figure 8A ) is formed to have a flow path area larger than that of the liquid injection port 511. With this structure, when liquid is injected into the internal space 240 of the substrate holder 200, air in the internal space 240 can be efficiently exhausted from the exhaust port 521 having a relatively large flow path area while liquid can be efficiently injected into the internal space 240 from the liquid injection port 511, thereby increasing the injection speed of the liquid into the internal space 240.

[0085] In this structure as well, liquid is injected into the internal space 240 of the substrate holder 200 from below, and thus the possibility of air remaining in the internal space 240 can be reduced.

[0086] (Substrate holder in plating tank)

[0087] Figure 10 This is a front view of a substrate holder positioned within a plating tank. The substrate holder 200 of the above embodiment is immersed in the plating liquid Q within the plating tank 39, with the internal space 240 filled with liquid (the contacts are covered with liquid). In the plating tank 39, the liquid inlet 511 is closed, preventing the plating liquid from entering the internal space 240 through the liquid inlet 511. Furthermore, the exhaust port 521 is positioned above the liquid level S of the plating liquid Q, preventing the plating liquid from entering the internal space 240 through the exhaust port 521.

[0088] (Other structural examples of exhaust ports)

[0089] Figure 11 and Figure 12 1 shows another example of the structure of the exhaust port of the substrate holder. The exhaust port 521 of the substrate holder 200 may also be provided at multiple locations (two or more) ( Figure 11 In this case, the total flow area of ​​the plurality of exhaust ports 521 is larger than the flow area of ​​the liquid injection port 511. By adjusting the number of exhaust ports 521, the flow area of ​​the exhaust ports 521 can be easily made larger than the flow area of ​​the liquid injection port 511. Alternatively, the exhaust ports 521 of the substrate holder 200 may be formed as slits extending in the left-right direction ( Figure 12 By forming the exhaust port 521 as a slit extending in the width direction of the substrate holder, the flow path area of ​​the exhaust port 521 can be easily made larger than the flow path area of ​​the liquid injection port 511 . Figure 11 and Figure 12 The structure of the discharge port can be applied to any of the above embodiments. In addition, the structure of the discharge port of any of the above embodiments can also be combined. Figure 11 The structure of the discharge port, and Figure 12 The structure of the discharge port has two or more.

[0090] (Other embodiments)

[0091] (1) In the above embodiment, a substrate holder for a quadrilateral substrate is described as an example. However, the above embodiment can also be applied to a substrate holder for a circular substrate, a polygonal substrate other than a quadrilateral, or any other arbitrary shape.

[0092] (2) In the above embodiment, a substrate holder is used as an example in which a substrate is held by first and second holding members. However, the present invention can be applied to a substrate holder of any structure as long as the substrate holder has an internal space that seals the contacts.

[0093] (3) In the above embodiment, pure water is injected into the internal space of the substrate holder in the pre-wetting module, but pure water can also be injected into the internal space of the substrate holder in other modules (such as the first rinsing module), and other modules can also be provided for injecting liquids such as pure water into the internal space of the substrate holder.

[0094] The present invention can also be described in the following aspects.

[0095] [1] According to one embodiment, a substrate holder is provided, which is a substrate holder for holding a substrate, and comprises: a first holding member and a second holding member for clamping and holding the substrate; a sealing member arranged between the first holding member and the second holding member when the substrate is held by the first holding member and the second holding member, and sealing the outer periphery of the substrate contacted by the contact of the substrate holder; a liquid injection port for injecting liquid into an internal space sealed by the sealing member; and an exhaust port for discharging gas from the internal space, the exhaust port being composed of a combination of a recess of the first holding member and a recess of the second holding member, and a flow path area of ​​the exhaust port being larger than a flow path area of ​​the liquid injection port.

[0096] According to this configuration, the flow path area of ​​the exhaust port is relatively larger than that of the liquid inlet. This allows air within the substrate holder's internal space to be efficiently exhausted from the relatively large exhaust port while simultaneously efficiently injecting liquid into the internal space from the liquid inlet, thereby increasing the speed at which liquid is injected into the internal space. Furthermore, the simple structure of making the flow path area of ​​the exhaust port relatively larger than that of the liquid inlet allows for efficient liquid injection into the internal space. Furthermore, there is no need to tilt the substrate or connect a pressure reducing device, allowing for efficient liquid injection into the internal space through a simple process.

[0097] Furthermore, since the exhaust port is formed by combining the recess of the first retaining member and the recess of the second retaining member, the flow path area of ​​the exhaust port can be easily increased. On the other hand, since the flow path area of ​​the liquid injection port is relatively smaller than that of the exhaust port, the liquid injection port can be provided in either the first retaining member or the second retaining member.

[0098] [2] According to one embodiment, the liquid injection port is provided in the first holding member or the second holding member.

[0099] According to this aspect, the degree of freedom in selecting the position of the liquid injection port becomes greater.

[0100] [3] According to one embodiment, the liquid injection port is provided at a lower portion of the substrate holder when the substrate holder is in an upright state.

[0101] According to this configuration, a liquid inlet is provided at the bottom of the substrate holder, where the hydraulic pressure is relatively high when the substrate holder is immersed in liquid. This allows for efficient liquid injection into the interior of the substrate holder. Furthermore, since the liquid is injected from below, the possibility of air remaining in the interior is reduced. Furthermore, without tilting the substrate holder, liquid can be efficiently injected into the interior through the lower liquid inlet, and gas (air) in the interior can be exhausted through the upper exhaust port.

[0102] [4] According to one embodiment, the liquid injection port is provided below the region of the substrate holder where the substrate is disposed, and the exhaust port is provided above the region of the substrate holder where the substrate is disposed.

[0103] According to this configuration, liquid can be efficiently injected into the internal space from the liquid injection port at the bottom without tilting the substrate holder, and gas (air) in the internal space can be discharged from the exhaust port at the top. In addition, when the substrate is immersed in the plating solution, the exhaust port can be easily positioned above the plating solution surface. This can inhibit or prevent the plating solution from invading through the exhaust port.

[0104] [5] According to one embodiment, the sealing member includes a valve portion that opens the liquid injection port by elastic deformation.

[0105] According to this embodiment, the liquid inlet is opened during liquid injection and closed after liquid injection. When the substrate holder is immersed in the plating liquid, the plating liquid can be suppressed or prevented from entering through the liquid inlet. In addition, the valve of the liquid inlet can be formed by a sealing member that seals the internal space of the substrate holder, eliminating the need for a separate valve to close the liquid inlet.

[0106] [6] According to one embodiment, the liquid injection port is opened as a gap formed between the first or second holding member and the protrusion by inserting the protrusion between the seal and the first or second holding member.

[0107] According to this configuration, by providing a protrusion on the bottom surface of a tank holding liquid (e.g., a pre-wetting tank or a rinse tank), and immersing the substrate holder in the liquid in the tank, the liquid injection port can be opened, thereby suppressing or preventing an increase in process steps.

[0108] [7] According to one embodiment, the seal member includes an expansion region configured so that a portion of the internal space is expanded more than other portions, and the protrusion is inserted into a front end portion of the expansion region.

[0109] According to this aspect, it is easy to ensure a space in the internal space for inserting the projection that opens the liquid injection port.

[0110] [8] According to one embodiment, the seal has a thick wall portion provided with a notch, and the liquid injection port is opened by inserting a pin having a passage passing through the interior into the notch.

[0111] This structure allows the liquid inlet to be opened by providing a pin on the bottom surface of a tank holding liquid (e.g., a pre-wetting tank or a rinse tank) and immersing the substrate holder in the liquid within the tank, thereby suppressing or preventing an increase in process steps. Furthermore, since the flow area of ​​the passageway within the pin becomes the flow area of ​​the liquid inlet, a stable flow area can be ensured.

[0112] [9] According to one embodiment, the seal has an expansion region configured so that a portion of the internal space is expanded more than other portions, and the pin is inserted into a front end portion of the expansion region.

[0113] According to this aspect, it is easy to ensure a space in the internal space for inserting a pin for opening the liquid injection port.

[0114]

[10] According to one embodiment, the discharge portion has a plurality of exhaust ports, and the total flow path area of ​​the plurality of exhaust ports is larger than the flow path area of ​​the liquid injection portion.

[0115] According to this aspect, by adjusting the number of the exhaust ports, it is easy to form the flow path area of ​​the exhaust ports larger than the flow path area of ​​the liquid injection portion.

[0116]

[11] According to one embodiment, the discharge portion includes a slit extending in the width direction of the substrate holder.

[0117] According to this aspect, by forming the exhaust port as a slit extending in the width direction of the substrate holder, it is easy to form the flow path area of ​​the exhaust port larger than the flow path area of ​​the liquid injection port.

[0118]

[12] According to one embodiment, there is provided a plating apparatus comprising the above-mentioned substrate holder and a plating tank for accommodating the above-mentioned substrate holder.

[0119] According to this aspect, a plating device that achieves the above-mentioned effects can be provided.

[0120]

[13] According to one embodiment, there is also a first groove having a protrusion protruding from the bottom surface and holding the liquid, and the substrate holding frame is configured such that when the substrate holding frame is accommodated in the first groove, the protrusion is inserted between the seal and the first or second holding member, so that the liquid injection port is opened as a gap formed between the first or second holding member and the protrusion.

[0121] According to this structure, by providing a protrusion on the bottom surface of a tank holding liquid (e.g., a pre-wetting tank or a rinse tank), and immersing the substrate holder in the liquid in the tank, the liquid injection port can be opened, thereby suppressing or preventing an increase in process steps. In addition, the structure for injecting liquid into the substrate holder can be simply constructed.

[0122]

[14] According to one embodiment, there is also a first groove having a pin and holding liquid, the pin protruding from the bottom surface of the first groove and having a passage passing through the interior, the sealing member having a thick-walled portion provided with a cutout, and the substrate holder being constructed such that when the substrate holder is accommodated in the first groove, the pin is inserted into the cutout, thereby opening the liquid injection port as the passage.

[0123] According to this structure, by providing a pin on the bottom surface of a tank holding liquid (e.g., a pre-wetting tank or a rinse tank), and immersing the substrate holder in the liquid in the tank, the liquid injection port can be opened, thereby suppressing or preventing an increase in process steps. In addition, the structure for injecting liquid into the substrate holder can be simply constructed.

[0124]

[15] According to one embodiment, a method is provided for introducing liquid into a substrate holder for holding a substrate, the method comprising the following steps: clamping and holding the substrate by a first holding member and a second holding member of the substrate holder; and injecting liquid from a liquid injection port into an internal space of the substrate holder in which the outer periphery of the substrate is sealed by a seal, and discharging gas in the internal space from an exhaust port having a flow area larger than a flow path area of ​​the liquid injection port, the exhaust port being formed by a combination of a recess of the first holding member and a recess of the second holding member.

[0125] This configuration allows for efficient exhaust of air from the substrate holder's internal space through the relatively large exhaust port, while simultaneously efficiently injecting liquid into the internal space through the liquid inlet. This also increases the speed at which liquid is injected into the internal space. Furthermore, by making the exhaust port's flow area relatively larger than the liquid inlet's, a simple structure allows for efficient liquid injection into the internal space. Furthermore, there's no need to tilt the substrate or connect a pressure-reducing device, allowing for efficient liquid injection into the internal space through a simple process.

[0126] Furthermore, the exhaust port is formed by combining the recess of the first retaining member and the recess of the second retaining member, thereby easily increasing the flow path area of ​​the exhaust port. On the other hand, since the flow path area of ​​the liquid injection port is relatively smaller than that of the exhaust port, the liquid injection port can be provided in either the first retaining member or the second retaining member.

[0127] Above, the embodiments of the present invention have been described, but the embodiments of the above invention are for easy understanding of the present invention and do not limit the present invention. As long as the present invention does not depart from its main purpose, it can be changed and improved, and its equivalent structure is of course included in the present invention. In addition, within the scope of at least a part of the above-mentioned problem or within the scope of at least a part of the effect, any combination of the embodiments and modifications can be carried out, and any combination or omission of the various constituent elements described in the claims and the specification can be carried out.

[0128] The entire disclosure of Japanese Patent No. 7132135 (Patent Document 1) and Japanese Patent No. 7095722 (Patent Document 2) including the specification, claims, drawings, and abstract are incorporated herein by reference in their entirety.

[0129] Description of Reference Numerals

[0130] 32...Pre-wetting module; 33...Pre-preg module; 34...First rinse module; 35...Blowing module; 36...Second rinse module; 38...Overflow tank; 39...Coating tank; 100...Coating device; 120...Processing station; 120A...Pre-processing / post-processing module; 120B...Coating module; 175...Controller; 200...Substrate holder; 210...First holding member; 211A...Opening; 212...Handle; 213...Contact; 214...Bus bar; 215...Inner seal; 216...Outer seal; 216A...Extension area; 21 6B...thick-walled portion; 217...hook; 218...external connection terminal; 220...second retaining member; 225...inner seal; 227...hook; 231...introduction passage; 231A...valve; 235A...electrode; 236A...power supply; 237A...current detector; 240...inner space; 320...pre-wetting tank; 330...protrusion (bump); 340...pin; 341...passage; 401...seed layer; 402...resist pattern; 511...liquid injection port; 512...incision; 521...discharge port; Q...plating liquid; S...liquid surface.

Claims

1. A substrate holder for holding a substrate, characterized in that: have: A first holding member and a second holding member clamp and hold the substrate; a sealing member disposed between the first holding member and the second holding member when the substrate is held by the first holding member and the second holding member, and sealing an outer periphery of the substrate contacted by the contacts of the substrate holder; a liquid injection port for injecting liquid into the internal space sealed by the sealing member; as well as an exhaust port for discharging gas from the internal space, The exhaust port is formed by combining the recess of the first holding member and the recess of the second holding member, and a flow path area of ​​the exhaust port is larger than a flow path area of ​​the liquid injection port.

2. The substrate holder according to claim 1, wherein: The liquid injection port is provided on the first holding member or the second holding member.

3. The substrate holder according to claim 1, wherein: The liquid injection port is provided at a lower portion of the substrate holder in a state where the substrate holder is in an upright position.

4. The substrate holder according to claim 3, wherein: The liquid injection port is provided below the area of ​​the substrate holder where the substrate is disposed. The exhaust port is provided above a region of the substrate holder where the substrate is arranged.

5. The substrate holder according to any one of claims 1 to 4, wherein: The sealing member includes a valve portion that opens the liquid injection port by elastic deformation.

6. The substrate holder according to claim 5, wherein: The projection is inserted between the seal and the first or second holding member, so that the liquid injection port is opened as a gap formed between the first or second holding member and the projection.

7. The substrate holder according to claim 6, wherein: The seal member includes an expansion region configured to expand a portion of the internal space more than other portions, and the protrusion is inserted into a front end portion of the expansion region.

8. The substrate holder according to claim 5, wherein: The sealing member is configured such that the sealing member includes a thick wall portion having a notch, and the liquid injection port is opened by inserting a pin having a passage penetrating the interior into the notch.

9. The substrate holder according to claim 8, wherein: The seal member includes an expansion region configured to expand a portion of the internal space more than other portions, and the pin is inserted into a front end portion of the expansion region.

10. The substrate holder according to any one of claims 1 to 4, wherein: The exhaust portion has a plurality of exhaust ports. The total flow path area of ​​the plurality of exhaust ports is greater than the flow path area of ​​the liquid injection port.

11. The substrate holder according to any one of claims 1 to 4, wherein: The discharge portion has a slit extending in a width direction of the substrate holder.

12. A plating device, characterized in that: have: The substrate holder according to any one of claims 1 to 4; and The plating tank accommodates the substrate holding frame.

13. The plating device according to claim 12, characterized in that Also features: a first groove having a protrusion protruding from the bottom surface and holding the liquid, The substrate holder is configured such that when the substrate holder is accommodated in the first groove, the protrusion is inserted between the seal and the first or second holding member, thereby opening the liquid injection port as a gap formed between the first or second holding member and the protrusion.

14. The plating device according to claim 12, characterized in that Also features: The first groove has a pin and holds the liquid, wherein the pin protrudes from the bottom surface of the first groove and has a passage penetrating the interior. The sealing member has a thick wall portion provided with a cutout, The substrate holder is configured such that when the substrate holder is accommodated in the first groove, the pin is inserted into the cutout, thereby opening the liquid injection port as the passage.

15. A method for introducing a liquid into a substrate holder holding a substrate, characterized in that: The following steps are included: The substrate is clamped and held by the first holding member and the second holding member of the substrate holder; and Liquid is injected from a liquid injection port into the internal space of the substrate holder, the outer periphery of the substrate being sealed by a seal, and gas in the internal space is discharged from an exhaust port having a flow area larger than the flow path area of ​​the liquid injection port, the exhaust port being formed by a combination of a recess of the first holding component and a recess of the second holding component.

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