Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display, the display panel comprises a substrate, an isolation structure, a plurality of light-emitting units and a plurality of packaging units, the isolation structure defines a plurality of isolation openings, and at least parts of the light-emitting units are located in the isolation openings; the packaging units are located on the sides, away from the substrate, of the corresponding light-emitting units, each packaging unit comprises an edge covering part located on the side, away from the substrate, of the corresponding isolation structure, at least part of each edge covering part makes contact with the side, away from the substrate, of the corresponding isolation structure, and each packaging unit extends from the side, facing the corresponding isolation opening, of the corresponding isolation structure to the side, away from the substrate, of the corresponding isolation structure. The packaging unit located on the side, away from the substrate, of the isolation structure is an edge covering part, and the side, away from the isolation opening, of the edge covering part makes contact with the side, away from the substrate, of the isolation structure. According to the invention, the etching liquid is not liable to invade the light-emitting units, so that the corresponding light-emitting units are not liable to generate dark spots.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology is considered the most promising new display technology for the next generation. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-luminescence, wide viewing angle, and fast response speed.

[0003] Traditionally, pixel patterning is achieved using a fine metal mask (FMM) during the production of OLED display panels. FMM technology is mature and boasts extensive mass production experience. However, it also suffers from limitations such as limited precision and high cost. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-scale scalability, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe FMM-free technology for reference.

[0004] However, the display panel still has the problem of insufficient display effect. Summary of the Invention

[0005] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a display panel, wherein the display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; a plurality of light-emitting units, at least a portion of each of the light-emitting units being located within the isolation opening; A plurality of packaging units are provided, each of which is located on a side of the corresponding light-emitting unit away from the substrate, and each of the packaging units includes a edging portion located on a side of the isolation structure away from the substrate, and at least a portion of the edging portion is in contact with a side of the isolation structure away from the substrate.

[0006] In some possible embodiments, the display panel further includes a first filling layer and a second filling layer stacked sequentially on a side of the isolation structure away from the substrate, the first filling layer including a plurality of first filling portions arranged at intervals, the second filling layer including a plurality of second filling portions arranged at intervals, and the edging portion extends from a side of the second filling portion away from the substrate to contact a side of the isolation structure away from the substrate; Preferably, the packaging unit further includes a packaging portion, which is located on a side of the light-emitting unit away from the substrate, and extends through the isolation structure toward the side wall of the isolation opening to connect with a side of the edging portion toward the isolation opening.

[0007] In some possible embodiments, the edging portion includes a first edging sub-portion and a second edging sub-portion connected to each other in a direction parallel to the plane of the substrate, the first edging sub-portion is located on a side of the second edging sub-portion away from the packaging portion, and the second edging sub-portion is connected to the packaging portion.

[0008] In some possible implementations, a side of the first edging sub-portion close to the substrate contacts a side of the isolation structure away from the substrate; Preferably, a side of the second edging sub-portion close to the substrate contacts a side of the second filling portion away from the substrate.

[0009] In some possible implementations, the light-emitting unit includes a first electrode, a light-emitting functional portion, and a second electrode stacked sequentially in a direction away from the substrate, and the first filling layer and the light-emitting functional portion are provided in the same layer and made of the same material; Preferably, the second filling layer and the second electrode are provided in the same layer and with the same material; Preferably, a side of the first electrode away from the substrate is a flat surface.

[0010] In some possible implementations, the orthographic projections of the edging portions of two adjacent packaging units on the substrate at least partially overlap, or the orthographic projections of the edging portions of two adjacent packaging units on the substrate are spaced apart.

[0011] In some possible implementations, the display panel further includes a second encapsulation layer located on a side of the encapsulation unit away from the substrate, and a third encapsulation layer located on a side of the second encapsulation layer away from the substrate; Preferably, the materials of the encapsulation unit and the third encapsulation layer both include inorganic materials; Preferably, the material of the second encapsulation layer includes organic material.

[0012] In some possible embodiments, the isolation structure includes a first isolation portion and a second isolation portion stacked sequentially in a direction away from the substrate, an orthographic projection of a side of the first isolation portion away from the substrate on the substrate is located within an orthographic projection of the second isolation portion on the substrate, an orthographic projection area of ​​a side of the first isolation portion away from the substrate on the substrate is smaller than an orthographic projection area of ​​the second isolation portion on the substrate, and the second electrode of the light-emitting unit is electrically connected to the first isolation portion; Preferably, the isolation structure further comprises a third isolation portion located on a side of the first isolation portion facing the substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion; Preferably, the material of the third isolation portion includes molybdenum or titanium; and / or the material of the first isolation portion includes aluminum, silver or copper; and / or the material of the second isolation portion includes titanium or molybdenum.

[0013] In some possible implementations, the present application further provides a method for preparing a display panel, the method comprising: providing a substrate; An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings; A plurality of light-emitting units and a packaging unit located on a side of the corresponding light-emitting units away from the substrate are formed, wherein at least a portion of the light-emitting unit is located within the isolation opening, and the packaging unit includes a edging portion located on a side of the isolation structure away from the substrate, and at least a portion of the edging portion is in contact with a side of the isolation structure away from the substrate.

[0014] In some possible implementations, the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening; and the steps of forming a plurality of light-emitting units and forming an encapsulation unit located on a side of the corresponding light-emitting unit away from the substrate include: A first partition portion and a first photoresist protection layer are formed on a side of the isolation structure away from the substrate, the first photoresist protection layer covers the second isolation opening and the third isolation opening, an orthographic projection of the first partition portion on the substrate surrounds an orthographic projection of the first isolation opening on the substrate, an orthographic projection of a side of the first partition portion facing the first isolation opening on the substrate is located within an orthographic projection of the isolation structure corresponding to the first isolation opening on the substrate, an orthographic projection of a side of the first partition portion close to the substrate on the substrate is located within an orthographic projection of a side of the first partition portion away from the substrate on the substrate, and the first partition portion is inclined toward the side of the first isolation opening; forming a light-emitting material layer, a second electrode material layer, and a first packaging material layer of a first light-emitting unit in sequence within the first isolation opening, wherein the light-emitting material layer, the second electrode material layer, and the first packaging material layer of the first light-emitting unit extend to a side of the first photoresist protection layer and the first partition portion away from the substrate; The first partition portion and the first photoresist protection layer are removed to form a first light-emitting unit in the first isolation opening and a first packaging unit located on a side of the first light-emitting unit away from the substrate.

[0015] In some possible implementations, the step of forming a first partition portion and a first photoresist protection layer on a side of the isolation structure away from the substrate includes: forming a first photoresist material layer in the isolation opening and on a side of the isolation structure away from the substrate, and patterning the first photoresist material layer to form a first partition portion and a first photoresist protection layer; Preferably, the step of removing the first partition portion and the first photoresist protection layer includes: removing, by wet etching, at least a portion of the first packaging material layer of the first light-emitting unit located on a side of the first partition portion facing the first isolation opening; removing the first partition portion and the first photoresist protection layer by using a photolithography stripping process; Preferably, the thickness of the first packaging material layer on the side of the first partition portion facing the first isolation opening is smaller than the thickness of the first packaging material layer on the side of the first partition portion away from the substrate; Preferably, the thickness of the first packaging material layer located on the side of the first partition portion facing the first isolation opening is greater than 0 and less than or equal to 500Å; Preferably, the inclination angle of the side wall of the first partition portion toward the first isolation opening is greater than or equal to 120° and less than or equal to 150°; Preferably, along the thickness direction of the substrate, the thickness of the first partition portion is greater than or equal to 5 μm and less than or equal to 10 μm.

[0016] In some possible implementations, after the steps of forming the first light-emitting unit in the first isolation opening and forming the first encapsulation unit located on a side of the first light-emitting unit away from the substrate, the method further includes: A second partition portion and a second photoresist protection layer are formed on a side of the isolation structure away from the substrate, the second photoresist protection layer covers the first encapsulation unit and the third isolation opening, an orthographic projection of the second partition portion on the substrate surrounds an orthographic projection of the second isolation opening on the substrate, an orthographic projection of a side of the second partition portion facing the second isolation opening on the substrate is located within an orthographic projection of the isolation structure corresponding to the second isolation opening on the substrate, an orthographic projection of a side of the second partition portion close to the substrate on the substrate is located within an orthographic projection of a side of the second partition portion away from the substrate on the substrate, and the second partition portion is inclined toward the second isolation opening; forming a light-emitting material layer, a second electrode material layer, and a first packaging material layer of a second light-emitting unit in sequence within the second isolation opening, wherein the light-emitting material layer, the second electrode material layer, and the first packaging material layer of the second light-emitting unit extend to a side of the second photoresist protection layer, the first packaging unit, and the second partition portion away from the substrate; The second partition portion and the second photoresist protection layer are removed to form a second light-emitting unit in the second isolation opening and a second packaging unit located on a side of the second light-emitting unit away from the substrate.

[0017] In some possible implementations, the step of forming a second partition portion and a second photoresist protection layer on a side of the isolation structure away from the substrate includes: forming a second photoresist material layer in the isolation opening and on a side of the isolation structure away from the substrate, and patterning the second photoresist material layer to form a second partition portion and a second photoresist protection layer; Preferably, the step of removing the second partition portion and the second photoresist protection layer includes: removing, by wet etching, at least a portion of the first encapsulation material layer of the second light-emitting unit located on a side of the second partition portion facing the second isolation opening; removing the second partition portion and the second photoresist protection layer by using a photolithography stripping process; Preferably, the thickness of the first packaging material layer on the side of the second partition portion facing the second isolation opening is smaller than the thickness of the first packaging material layer on the side of the second partition portion away from the substrate; Preferably, the thickness of the first packaging material layer located on the side of the second partition portion facing the second isolation opening is greater than 0 and less than or equal to 500Å; Preferably, the inclination angle of the side wall of the second partition portion toward the second isolation opening is greater than or equal to 120° and less than or equal to 150°; Preferably, along the thickness direction of the substrate, the thickness of the second partition portion is greater than or equal to 5 μm and less than or equal to 10 μm.

[0018] In some possible implementations, after the steps of forming the second light-emitting unit in the second isolation opening and forming the second encapsulation unit located on a side of the second light-emitting unit away from the substrate, the method further includes: A third partition portion and a third photoresist protection layer are formed on a side of the isolation structure away from the substrate, the third photoresist protection layer covers the first encapsulation unit and the second encapsulation unit, an orthographic projection of the third partition portion on the substrate surrounds an orthographic projection of the third isolation opening on the substrate, an orthographic projection of a side of the third partition portion facing the third isolation opening on the substrate is located within an orthographic projection of the isolation structure corresponding to the third isolation opening on the substrate, an orthographic projection of a side of the third partition portion close to the substrate on the substrate is located within an orthographic projection of a side of the third partition portion away from the substrate on the substrate, and the third partition portion is arranged obliquely toward the side of the third isolation opening; A light-emitting material layer, a second electrode material layer, and a first packaging material layer of a third light-emitting unit are sequentially formed in the third isolation opening, and the light-emitting material layer, the second electrode material layer, and the first packaging material layer of the third light-emitting unit extend to a side of the third photoresist protection layer, the first packaging unit, the second packaging unit, and the third partition portion away from the substrate; removing the third partition portion and the third photoresist protection layer to form a third light-emitting unit in the third isolation opening and a third encapsulation unit located on a side of the third light-emitting unit away from the substrate; Preferably, the step of forming a third partition portion and a third photoresist protection layer on a side of the isolation structure away from the substrate includes: forming a third photoresist material layer in the isolation opening and on a side of the isolation structure away from the substrate, and patterning the third photoresist material layer to form a third partition portion and a third photoresist protection layer; Preferably, the step of removing the third partition portion and the third photoresist protection layer includes: removing, by wet etching, at least a portion of the first encapsulation material layer of the third light-emitting unit located on a side of the third partition portion facing the third isolation opening; removing the third partition portion and the third photoresist protection layer by using a photolithography stripping process; Preferably, the thickness of the first packaging material layer located on a side of the third partition portion facing the third isolation opening is smaller than the thickness of the first packaging material layer located on a side of the third partition portion away from the substrate; Preferably, the thickness of the first packaging material layer located on the side of the third partition portion facing the third isolation opening is greater than 0 and less than or equal to 500Å; Preferably, the inclination angle of the side wall of the third partition portion toward the third isolation opening is greater than or equal to 120° and less than or equal to 150°; Preferably, along the thickness direction of the substrate, the thickness of the third partition portion is greater than or equal to 5 μm and less than or equal to 10 μm.

[0019] In some possible implementations, the present application further provides an electronic device, which includes the display panel described in the present application, or includes a display panel prepared by the method for preparing the display panel described in the present application.

[0020] Compared with the prior art, this application has the following beneficial effects: The present application provides a display panel, a method for preparing a display panel, and an electronic device. By setting at least a portion of the edging portion to contact the side of the isolation structure away from the substrate, the etching solution is not easily able to invade the light-emitting unit, thereby not easily causing the corresponding light-emitting unit to produce dark spots, thereby improving the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic cross-sectional view of a display panel provided in an embodiment of the present application; Figure 2 A cross-sectional schematic diagram showing that the edge portions of two adjacent light-emitting units in the display panel provided by an embodiment of the present application are arranged at intervals; Figure 3 A schematic cross-sectional view showing that the edge portions of two adjacent light-emitting units in the display panel provided by an embodiment of the present application at least partially overlap; Figure 4 A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application including a second encapsulation layer and a third encapsulation layer; Figure 5 A schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application; Figure 6 A schematic cross-sectional view of an isolation structure formed on one side of a substrate according to an embodiment of the present application; Figure 7a A schematic top view of a first partition portion and a first photoresist protection layer formed on a side of the isolation structure away from the substrate provided in an embodiment of the present application; Figure 7b Provided in the embodiments of this application Figure 7a Schematic diagram of the cross section at AA in the middle; Figure 8 A cross-sectional schematic diagram showing a light-emitting material layer, a second electrode material layer, and a first encapsulation material layer of a first light-emitting unit sequentially formed in a first isolation opening according to an embodiment of the present application; Figure 9 A cross-sectional schematic diagram showing a first encapsulation material layer of a first light-emitting unit with at least a portion of the first partition portion facing the first isolation opening removed, provided in an embodiment of the present application; Figure 10 A cross-sectional schematic diagram of removing the first partition portion and the first photoresist protection layer by using a photolithography stripping process according to an embodiment of the present application; Figure 11 A cross-sectional schematic diagram of forming a second partition portion and a second photoresist protection layer on a side of the isolation structure away from the substrate provided in an embodiment of the present application; Figure 12 A cross-sectional schematic diagram showing a light-emitting material layer, a second electrode material layer, and a first packaging material layer of a second light-emitting unit sequentially formed in a second isolation opening according to an embodiment of the present application; Figure 13 A cross-sectional view of an embodiment of the present application showing a portion of the first encapsulation material layer of the second light-emitting unit located on a side of the second partition portion facing the second isolation opening after removal of at least a portion thereof; Figure 14 A cross-sectional view of removing the second partition portion and the second photoresist protection layer by a photolithography stripping process provided in an embodiment of the present application; Figure 15 A schematic cross-sectional view of forming a third partition portion and a third photoresist protection layer on a side of the isolation structure away from the substrate provided in an embodiment of the present application; Figure 16 A schematic cross-sectional view of a light-emitting material layer, a second electrode material layer, and a first encapsulation material layer of a third light-emitting unit sequentially formed in the third isolation opening according to an embodiment of the present application; Figure 17 A cross-sectional schematic diagram showing a first packaging material layer of at least a portion of a third light-emitting unit located on a side of the third partition portion facing the third isolation opening, provided in an embodiment of the present application, removed; Figure 18 A cross-sectional schematic diagram of removing the third partition portion and the third photoresist protection layer by using a photolithography stripping process provided in an embodiment of the present application.

[0023] Reference numerals: 1, substrate; 2, pixel defining layer; 201, pixel opening; 3, isolation structure; 31, first isolation portion; 32, second isolation portion; 33, third isolation portion; 4, first electrode; 5, light-emitting functional portion; 6, second electrode; 7, light-emitting unit; 8, encapsulation unit; 801, first encapsulation unit; 802, second encapsulation unit; 803, third encapsulation unit; 81, edge portion; 811, first edge sub-portion; 812, second edge sub-portion; 82, encapsulation portion; 9. Isolation opening; 91. First isolation opening; 92. Second isolation opening; 93. Third isolation opening; 10. First filling portion; 11. Second filling portion; 12. Second encapsulation layer; 13. Third encapsulation layer; 14. First partition portion; 15. First photoresist protection layer; 16. Light-emitting material layer; 17. Second electrode material layer; 18. First encapsulation material layer; 19. Second partition portion; 20. Second photoresist protection layer; 21. Third partition portion; 22. Third photoresist protection layer. DETAILED DESCRIPTION

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0026] It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0027] Furthermore, when terms such as "upper," "above," "lower," "below," and "relatively" are used to define the relative position of two elements, this includes not only a state in which the two elements are directly in contact but also a state in which the two elements are separated by a gap or other elements. Furthermore, terms such as "first," "second," and "third" are used solely for purposes of distinction and description and should not be construed as indicating or implying relative importance.

[0028] It should be noted that, in the absence of conflict, different features in the embodiments of the present application can be combined with each other.

[0029] Increasing the density of light-emitting units (i.e., pixel density) in display panels is an important approach to improving display quality. However, current display panels manufactured using fine metal evaporation mask (FMM) technology are currently unable to achieve further increases in light-emitting unit density due to technical limitations. The inventors have discovered, through extensive research, that to address this technical issue, isolation structures can be incorporated into some display panels. During the full-layer evaporation of the light-emitting layer and the second electrode, these can be disconnected at the isolation structures. Through multiple evaporation and etching processes (i.e., light-emitting unit patterning), light-emitting units of different colors can be formed in different isolation openings.

[0030] The display panel in the related art includes a substrate, an isolation structure located on one side of the substrate, a light-emitting unit located in an isolation opening formed by the isolation structure, and a packaging unit located on the side of the light-emitting unit away from the substrate. There is a gap between the packaging unit located on one side of the isolation structure and the side of the isolation structure away from the substrate. During the preparation of the display panel, such as in the process of forming the rear light-emitting unit, the etching solution can easily invade the light-emitting unit through the gap between the packaging unit and the isolation structure and damage the light-emitting unit, thereby causing dark spots in the corresponding light-emitting unit, thereby affecting the display effect of the display panel.

[0031] In order to solve the above-mentioned technical problems, the following technical solutions are innovatively designed. The specific implementation solutions of this application will be described in detail below with reference to the accompanying drawings. It should be noted that the defects existing in the solutions in the above-mentioned prior art are the results obtained after practice and careful study. Therefore, the discovery process of the above-mentioned technical problems and the solutions proposed in the following embodiments for the above-mentioned problems should all be contributions made to this application in the process of invention and creation, and should not be understood as technical contents known to those skilled in the art.

[0032] See Figure 1 This embodiment provides a display panel, which includes a substrate 1, an isolation structure 3, a plurality of light-emitting units 7 and a plurality of packaging units 8.

[0033] The substrate 1 may include a substrate and a plurality of drive units located on one side of the substrate. Each drive unit may include one or more semiconductor switching devices, which may be formed by the cooperation of multiple film layers in the substrate 1. For example, the semiconductor switching device may be a thin film transistor formed by the cooperation of multiple film layers.

[0034] The isolation structure 3 is located on one side of the substrate 1 , and the isolation structure 3 encloses a plurality of isolation openings 9 .

[0035] At least part of the light-emitting unit 7 is located in the isolation opening 9; the packaging unit 8 is located on the side of the corresponding light-emitting unit 7 away from the substrate 1, and the packaging unit 8 includes a edging portion 81 located on the side of the isolation structure 3 away from the substrate 1, and at least part of the edging portion 81 is in contact with the side of the isolation structure 3 away from the substrate 1.

[0036] The packaging unit 8 extends from the side of the isolation structure 3 toward the isolation opening 9 to the side of the isolation structure 3 away from the substrate 1. The packaging unit 8 located on the side of the isolation structure 3 away from the substrate 1 is a edging portion 81. The side of the edging portion 81 away from the isolation opening 9 is in contact with the side of the isolation structure 3 away from the substrate 1. In this way, there is no gap between the edging portion 81 and the isolation structure 3, and the etching solution is not easy to invade the light-emitting unit 7, so it is not easy to cause the corresponding light-emitting unit 7 to produce dark spots, thereby improving the display effect of the display panel.

[0037] Based on the above design, this embodiment sets at least a portion of the edging portion 81 to contact the side of the isolation structure 3 away from the substrate 1, so that the etching solution is not easy to invade the light-emitting unit 7, thereby not easily causing the corresponding light-emitting unit 7 to produce dark spots, thereby improving the display effect of the display panel.

[0038] In some possible embodiments, the light-emitting unit 7 includes a first electrode 4, a light-emitting functional portion 5, and a second electrode 6 that are stacked in sequence in a direction away from the substrate 1. The display panel also includes a pixel defining layer 2 located between the first electrode 4 and the isolation structure 3. The pixel defining layer 2 includes a pixel opening 201 that exposes a portion of the first electrode 4. The pixel opening 201 is connected to the isolation opening 9. The orthographic projection of the pixel opening 201 on the substrate 1 is located within the orthographic projection of the isolation opening 9 on the substrate 1. The orthographic projection area of ​​the pixel opening 201 on the substrate 1 is smaller than the orthographic projection area of ​​the isolation opening 9 on the substrate 1.

[0039] The provision of the isolation structure 3 enables the display panel to form film layers of light-emitting units 7 of different colors in different isolation openings 9 without the need for a fine mask. Specifically, when forming the light-emitting material layer 16, the light-emitting material layer 16 is separated by the isolation structure 3 to form a plurality of spaced light-emitting functional units 5. When forming the second electrode material layer 17, the second electrode material layer 17 is separated by the isolation structure 3 to form a plurality of spaced second electrodes 6. The isolation structure 3 includes a conductive material, and the second electrodes 6 are electrically connected to the isolation structure 3. One first electrode 4, one light-emitting functional unit 5, and one second electrode 6 form one light-emitting unit 7. The first electrode 4 can be an anode, and the second electrode 6 can be a cathode.

[0040] In this way, different light-emitting units 7 can be made independent of each other, thereby reducing crosstalk between adjacent light-emitting units 7 and improving the display effect of the display panel. At the same time, due to the presence of the isolation structure 3, the light-emitting material layer 16 and the second electrode material layer 17 in the light-emitting unit 7 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the need for a fine mask and further reducing the production cost of the display panel.

[0041] For some possible implementations, see Figure 2 The display panel also includes a first filling layer and a second filling layer stacked in sequence on the side of the isolation structure 3 away from the substrate 1. The first filling layer includes a plurality of first filling portions 10 arranged at intervals, and the second filling layer includes a plurality of second filling portions 11 arranged at intervals. The edging portion 81 extends from the side of the second filling portion 11 away from the substrate 1 to contact the side of the isolation structure 3 away from the substrate 1.

[0042] Through different preparation processes, a first filling portion 10 and a second filling portion 11 can be formed in sequence on the side of the isolation structure 3 away from the substrate 1. The edging portion 81 covers the first filling portion 10 and the second filling portion 11 and contacts the side of the isolation structure 3 away from the substrate 1. In this way, it is not easy for the etching solution to invade between the edging portion 81 and the side of the isolation structure 3 away from the substrate 1, so that it is not easy to damage the corresponding light-emitting unit 7.

[0043] Preferably, see again Figure 2 The packaging unit 8 also includes a packaging portion 82, which is located on a side of the light-emitting unit 7 away from the substrate 1. The packaging portion 82 extends through the isolation structure 3 toward the side wall of the isolation opening 9 to connect with the side of the edging portion 81 toward the isolation opening 9.

[0044] The orthographic projection of the packaging portion 82 on the substrate 1 covers the orthographic projection of the corresponding light-emitting unit 7 on the substrate 1. The packaging portion 82 encapsulates the light-emitting unit 7. The packaging portion 82 and the edging portion 81 are integrally formed. In this way, the packaging unit 8 can more effectively encapsulate the light-emitting unit 7.

[0045] For some possible implementations, see again Figure 2 The edging portion 81 includes a first edging sub-portion 811 and a second edging sub-portion 812 connected to each other in a direction parallel to the plane of the substrate 1. The first edging sub-portion 811 is located on the side of the second edging sub-portion 812 away from the packaging portion 82, and the second edging sub-portion 812 is connected to the packaging portion 82.

[0046] Optionally, a side of the first edging sub-portion 811 close to the substrate 1 contacts a side of the isolation structure 3 away from the substrate 1 .

[0047] Optionally, a side of the second edging sub-portion 812 close to the substrate 1 contacts a side of the second filling portion 11 away from the substrate 1 .

[0048] The second edging sub-portion 812 covers the first filling portion 10 and the second filling portion 11, and the first edging sub-portion 811 is in close contact with the side of the isolation structure 3 away from the substrate 1. The first edging sub-portion 811 and the second edging sub-portion 812 are formed as one piece. In this way, it is not easy for the etching solution to invade between the edging portion 81 and the isolation structure 3, so that it is not easy to damage the corresponding light-emitting unit 7.

[0049] For some possible implementations, see again Figure 2 The first filling layer and the light emitting functional part 5 are provided in the same layer and with the same material.

[0050] Optionally, the second filling layer and the second electrode 6 are provided in the same layer and with the same material.

[0051] The first filling layer is formed at the same time as the light emitting functional portion 5 is formed. Thus, there is no need to set up a special process for forming the first filling layer, thereby reducing the cost of forming the first filling layer.

[0052] The second filling layer is formed at the same time as the second electrode 6 is formed. Thus, there is no need to set up a special process for forming the second filling layer, thereby reducing the cost of forming the second filling layer.

[0053] Optionally, the side of the first electrode 4 away from the substrate 1 is a flat surface. In the process of forming the display panel, the first electrode 4 is not easily damaged, thereby improving the display effect of the corresponding light-emitting unit 7.

[0054] In some possible implementations, the orthographic projections of the edging portions 81 of two adjacent packaging units 8 on the substrate 1 at least partially overlap, or the orthographic projections of the edging portions 81 of two adjacent packaging units 8 on the substrate 1 are spaced apart.

[0055] In some embodiments, see again Figure 2 The orthographic projections of the edging portions 81 of two adjacent packaging units 8 on the substrate 1 are arranged at intervals.

[0056] In other embodiments, see Figure 3 The orthographic projections of the edge portions 81 of two adjacent packaging units 8 on the substrate 1 at least partially overlap.

[0057] Through different preparation processes, the orthographic projections of the edging portions 81 of two adjacent packaging units 8 on the substrate 1 can be at least partially overlapped or spaced apart. In both cases, it is not easy for the edging portion 81 and the side of the isolation structure 3 away from the substrate 1 to form an invasion path for the etching solution.

[0058] For some possible implementations, see Figure 4 The display panel further includes a second encapsulation layer 12 located on a side of the encapsulation unit 8 away from the substrate 1 and a third encapsulation layer 13 located on a side of the second encapsulation layer 12 away from the substrate 1 .

[0059] Optionally, the materials of the encapsulation unit 8 and the third encapsulation layer 13 both include inorganic materials, and the material of the second encapsulation layer 12 includes organic materials.

[0060] For example, the encapsulation unit 8 and the third encapsulation layer 13 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 12 can be formed by inkjet printing (IJP). The second encapsulation layer 12 and the third encapsulation layer 13 can provide a better encapsulation effect on the light-emitting unit 7, thereby further improving the encapsulation quality of the display panel.

[0061] For some possible implementations, see again Figure 3 The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 stacked in sequence in a direction away from the substrate 1. The orthographic projection of the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 32 on the substrate 1. The orthographic projection area of ​​the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the second isolation portion 32 on the substrate 1. The second electrode 6 of the light-emitting unit 7 is electrically connected to the first isolation portion 31.

[0062] Because the second isolating portion 32 is located on the side of the first isolating portion 31 away from the substrate 1 and has a lateral width greater than that of the first isolating portion 31 in a plane parallel to the substrate 1, the second isolating portion 32 disconnects the light-emitting material layer 16 and the second electrode material layer 17 at the isolation structure 3. Thus, the isolation structure 3 formed by the first isolating portion 31 and the second isolating portion 32 makes it easier to independently package each light-emitting unit 7, thereby improving the packaging yield of the display panel.

[0063] The first isolation portion 31 includes a conductive material. The second electrode 6 corresponding to the light emitting unit 7 extends to contact the sidewall of the first isolation portion 31 to achieve electrical connection between the second electrode 6 corresponding to the light emitting unit 7 and the first isolation portion 31 .

[0064] Optionally, see again Figure 3 The isolation structure 3 also includes a third isolation portion 33 located on the side of the first isolation portion 31 facing the substrate 1. The third isolation portion 33 protrudes toward the center of the isolation opening 9 relative to the first isolation portion 31. The second electrode 6 of the light-emitting unit 7 is electrically connected to the third isolation portion 33.

[0065] Optionally, the material of the third isolation portion 33 includes molybdenum or titanium; and / or the material of the first isolation portion 31 includes aluminum, silver or copper; and / or the material of the second isolation portion 32 includes titanium or molybdenum.

[0066] The third isolation portion 33 includes a conductive material. The second electrode 6 corresponding to the light emitting unit 7 extends to contact the sidewall of the third isolation portion 33 to achieve electrical connection between the second electrode 6 corresponding to the light emitting unit 7 and the third isolation portion 33 .

[0067] For some possible implementations, see Figure 2 and Figure 5 , the present application also provides a method for preparing a display panel, the method comprising: S10: providing a substrate 1.

[0068] S11 : forming an isolation structure 3 on one side of the substrate 1 , wherein the isolation structure 3 encloses a plurality of isolation openings 9 .

[0069] S12: Form a plurality of light-emitting units 7 and a packaging unit 8 located on the side of the corresponding light-emitting unit 7 away from the substrate 1, wherein at least a portion of the light-emitting unit 7 is located within the isolation opening 9, and the packaging unit 8 includes a edging portion 81 located on the side of the isolation structure 3 away from the substrate 1, and at least a portion of the edging portion 81 is in contact with the side of the isolation structure 3 away from the substrate 1.

[0070] In the display panel formed by the above method, the packaging unit 8 extends from the side of the isolation structure 3 toward the isolation opening 9 to the side of the isolation structure 3 away from the substrate 1. The packaging unit 8 located on the side of the isolation structure 3 away from the substrate 1 is the edging portion 81. The side of the edging portion 81 away from the isolation opening 9 is in contact with the side of the isolation structure 3 away from the substrate 1. In this way, there is no gap between the edging portion 81 and the isolation structure 3, and the etching solution is not easy to invade the light-emitting unit 7, so it is not easy to cause the corresponding light-emitting unit 7 to produce dark spots, thereby improving the display effect of the display panel.

[0071] During the formation of the light-emitting unit 7, by adjusting the position of the partition portion, the edging portions 81 of adjacent packaging units 8 can present different positional relationships, and it can be determined whether the first filling layer and the second filling layer are formed on the side of the isolation structure 3 away from the substrate 1.

[0072] Specifically, the orthographic projection of the side of the partition away from the substrate 1 coincides with the orthographic projection of the corresponding isolation opening 9 on the substrate 1, and the first filling layer and the second filling layer are usually not formed on the side of the isolation structure 3 away from the substrate 1. Figure 1 shown.

[0073] The orthographic projection of the side of the partition away from the substrate 1 is located within the orthographic projection of the corresponding isolation structure 3 on the substrate 1, and a first filling layer and a second filling layer are usually formed on the side of the isolation structure 3 away from the substrate 1, such as Figure 2 shown.

[0074] In addition, by adjusting the position of the partition portion, the orthographic projections of the edge portions 81 of two adjacent packaging units 8 on the substrate 1 can be spaced apart, such as Figure 2 Or the orthographic projections of the edge portions 81 of two adjacent packaging units 8 on the substrate 1 may at least partially overlap, as shown. Figure 3 shown.

[0075] The following describes in detail the process of forming the light-emitting unit 7 by taking the formation of the first filling layer and the second filling layer on the side of the isolation structure 3 away from the substrate 1 and the setting of the orthographic projection spacing of the edge portions 81 of two adjacent packaging units 8 on the substrate 1 as an example.

[0076] In some possible implementations, the steps of forming a plurality of light-emitting units 7 and forming an encapsulation unit 8 located on a side of the corresponding light-emitting unit 7 away from the substrate 1 include: See Figure 6 An isolation structure 3 is formed on one side of the substrate 1 . The isolation structure 3 encloses a plurality of isolation openings 9 . The isolation openings 9 include a first isolation opening 91 , a second isolation opening 92 and a third isolation opening 93 .

[0077] See Figure 7a and Figure 7b A first partition portion 14 and a first photoresist protection layer 15 are formed on the side of the isolation structure 3 away from the substrate 1, the first photoresist protection layer 15 covers the second isolation opening 92 and the third isolation opening 93, the orthographic projection of the first partition portion 14 on the substrate 1 surrounds the orthographic projection of the first isolation opening 91 on the substrate 1, the orthographic projection of the side of the first partition portion 14 facing the first isolation opening 91 on the substrate 1 is located within the orthographic projection of the isolation structure 3 corresponding to the first isolation opening 91 on the substrate 1, the orthographic projection of the side of the first partition portion 14 close to the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the first partition portion 14 away from the substrate 1 on the substrate 1, and the first partition portion 14 is inclined toward the side of the first isolation opening 91.

[0078] Optionally, the inclination angle β1 of the side wall of the first partition portion 14 toward the first isolation opening 91 is greater than or equal to 120° and less than or equal to 150°. For example, the inclination angle β1 can be 120°, 125°, 130°, 140°, 145°, or 150°.

[0079] Optionally, along the thickness direction Z of the substrate 1 , the thickness D1 of the first partition portion 14 is greater than or equal to 5 μm and less than or equal to 10 μm. For example, the thickness D1 may be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm.

[0080] Reasonable setting of the inclination angle β1 and the thickness D1 can improve the partitioning effect of the first partition portion 14 on the light-emitting material layer 16 and the second electrode material layer 17 of the first light-emitting unit.

[0081] See Figure 8 The light-emitting material layer 16, the second electrode material layer 17 and the first packaging material layer 18 of the first light-emitting unit are formed in sequence in the first isolation opening 91, and the light-emitting material layer 16, the second electrode material layer 17 and the first packaging material layer 18 of the first light-emitting unit extend to the side of the first photoresist protection layer 15 and the first partition portion 14 away from the substrate 1.

[0082] Since the orthographic projection of the side of the first partition portion 14 close to the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the first partition portion 14 away from the substrate 1 on the substrate 1, and the first partition portion 14 is inclined toward the side of the first isolation opening 91, the light-emitting material layer 16 and the second electrode material layer 17 of the first light-emitting unit are disconnected at the first partition portion 14, and the first filling portion 10 and the second filling portion 11 corresponding to the first isolation opening 91 are formed on the side of the isolation structure 3 away from the substrate 1.

[0083] See Figure 9 and Figure 10 , the first partition portion 14 and the first photoresist protection layer 15 are removed to form a first light emitting unit in the first isolation opening 91 and a first packaging unit 801 located on a side of the first light emitting unit away from the substrate 1 .

[0084] For details, please see again Figure 9 , at least a portion of the first packaging material layer 18 of the first light-emitting unit located on a side of the first partition portion 14 facing the first isolation opening 91 is removed by wet etching.

[0085] Please see again Figure 10 , a photolithography stripping process is used to remove the first partition portion 14 and the first photoresist protection layer 15 .

[0086] In the related art, the first packaging material layer 18 of the first light-emitting unit is patterned by dry etching, which easily damages the first electrode 4 and thus causes a poor display problem.

[0087] In this embodiment, it is not necessary to pattern the first packaging material layer 18 of the first light-emitting unit by dry etching. It is only necessary to remove the first partition portion 14 and the first photoresist protection layer 15. Therefore, no corresponding dry etching equipment is required, which can reduce the investment cost of the corresponding equipment and make the process simpler. At the same time, it is not easy to damage the first electrode 4, and the product process morphology stability is better, thereby improving the display effect of the corresponding light-emitting unit 7 and improving the yield of the display panel.

[0088] In some possible implementations, the step of forming the first partition portion 14 and the first photoresist protection layer 15 on the side of the isolation structure 3 away from the substrate 1 includes: A first photoresist material layer is formed in the isolation opening 9 and on a side of the isolation structure 3 away from the substrate 1 , and the first photoresist material layer is patterned to form a first partition portion 14 and a first photoresist protection layer 15 .

[0089] In this way, the first partition portion 14 and the first photoresist protection layer 15 are formed by the same process and the same material, so there is no need to set up separate processes for forming the first partition portion 14 and the first photoresist protection layer 15, thereby reducing the process cost of forming the first partition portion 14 and the first photoresist protection layer 15.

[0090] Preferably, see again Figure 8 The thickness W1 of the first packaging material layer 18 on the side of the first partition portion 14 facing the first isolation opening 91 is smaller than the thickness of the first packaging material layer 18 on the side of the first partition portion 14 away from the substrate 1 .

[0091] Optionally, the thickness W1 of the first encapsulation material layer 18 located on the side of the first partition portion 14 facing the first isolation opening 91 is greater than 0 and less than or equal to 500Å. For example, the thickness W1 can be 50Å, 100Å, 200Å, 300Å, 400Å, 450Å or 500Å, and the thickness of the first encapsulation material layer 18 in other parts is about 2000Å. In this way, it is easier to remove the first encapsulation material layer 18 of at least a portion of the first light-emitting unit located on the side of the first partition portion 14 facing the first isolation opening 91 by wet etching to expose the first partition portion 14, thereby making it easier to peel off and remove the first partition portion 14.

[0092] The first packaging unit 801 formed by the above method and located on the side of the isolation structure 3 away from the substrate 1 is in contact with the side of the isolation structure 3 away from the substrate 1. In this way, there is no gap between the first packaging unit 801 and the isolation structure 3, and the etching solution is not easy to invade the first light-emitting unit, so it is not easy to cause dark spots in the first light-emitting unit, thereby improving the display effect of the display panel.

[0093] In some possible implementations, after the steps of forming the first light-emitting unit in the first isolation opening 91 and forming the first encapsulation unit 801 located on a side of the first light-emitting unit away from the substrate 1 , the method further includes: See Figure 11 A second partition portion 19 and a second photoresist protection layer 20 are formed on the side of the isolation structure 3 away from the substrate 1, the second photoresist protection layer 20 covers the first packaging unit 801 and the third isolation opening 93, the orthographic projection of the second partition portion 19 on the substrate 1 surrounds the orthographic projection of the second isolation opening 92 on the substrate 1, the orthographic projection of the side of the second partition portion 19 facing the second isolation opening 92 on the substrate 1 is located within the orthographic projection of the isolation structure 3 corresponding to the second isolation opening 92 on the substrate 1, the orthographic projection of the side of the second partition portion 19 close to the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the second partition portion 19 away from the substrate 1 on the substrate 1, and the second partition portion 19 is inclined toward the side of the second isolation opening 92.

[0094] Optionally, the inclination angle β2 of the side wall of the second partition portion 19 toward the second isolation opening 92 is greater than or equal to 120° and less than or equal to 150°. For example, the inclination angle β2 can be 120°, 125°, 130°, 140°, 145°, or 150°.

[0095] Preferably, the thickness D2 of the second partition portion 19 is greater than or equal to 5 μm and less than or equal to 10 μm along the thickness direction Z of the substrate 1. For example, the thickness D2 may be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm.

[0096] Reasonable setting of the inclination angle β2 and the thickness D2 can improve the partitioning effect of the second partition portion 19 on the light-emitting material layer 16 and the second electrode material layer 17 of the second light-emitting unit.

[0097] See Figure 12 The light-emitting material layer 16, the second electrode material layer 17 and the first packaging material layer 18 of the second light-emitting unit are formed in sequence in the second isolation opening 92, and the light-emitting material layer 16, the second electrode material layer 17 and the first packaging material layer 18 of the second light-emitting unit extend to the second photoresist protection layer 20, the first packaging unit 801 and the second partition portion 19 away from the side of the substrate 1.

[0098] Since the orthographic projection of the side of the second partition portion 19 close to the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the second partition portion 19 away from the substrate 1 on the substrate 1, and the second partition portion 19 is inclined toward the side of the second isolation opening 92, the light-emitting material layer 16 and the second electrode material layer 17 of the second light-emitting unit are disconnected at the second partition portion 19, and the first filling portion 10 and the second filling portion 11 corresponding to the second isolation opening 92 are formed on the side of the isolation structure 3 away from the substrate 1.

[0099] See Figure 13 and Figure 14 , the second partition portion 19 and the second photoresist protection layer 20 are removed to form a second light-emitting unit in the second isolation opening 92 and a second packaging unit 802 located on a side of the second light-emitting unit away from the substrate 1 .

[0100] For details, please see again Figure 13 , at least a portion of the first packaging material layer 18 of the second light-emitting unit located on a side of the second partition portion 19 facing the second isolation opening 92 is removed by wet etching.

[0101] Please see again Figure 14 The second partition portion 19 and the second photoresist protection layer 20 are removed by a photolithography stripping process.

[0102] In the related art, the first packaging material layer 18 of the second light-emitting unit is patterned by dry etching, which easily damages the first electrode 4 and thus causes poor display.

[0103] In this embodiment, it is not necessary to pattern the first packaging material layer 18 of the second light-emitting unit by dry etching. It is only necessary to remove the second partition portion 19 and the second photoresist protection layer 20. Therefore, no corresponding dry etching equipment is required, which can reduce the investment cost of the corresponding equipment and make the process simpler. At the same time, it is not easy to damage the first electrode 4, and the product process morphology stability is better, thereby improving the display effect of the corresponding light-emitting unit 7 and improving the yield of the display panel.

[0104] In some possible implementations, the step of forming the second partition portion 19 and the second photoresist protection layer 20 on the side of the isolation structure 3 away from the substrate 1 includes: A second photoresist material layer is formed in the isolation opening 9 and on a side of the isolation structure 3 away from the substrate 1 , and the second photoresist material layer is patterned to form a second partition portion 19 and a second photoresist protection layer 20 .

[0105] In this way, the second partition portion 19 and the second photoresist protection layer 20 are formed by the same process and the same material, so there is no need to set up a separate process for forming the second partition portion 19 and the second photoresist protection layer 20, thereby reducing the process cost of forming the second partition portion 19 and the second photoresist protection layer 20.

[0106] Optionally, see again Figure 12 The thickness W2 of the first packaging material layer 18 on the side of the second partition portion 19 facing the second isolation opening 92 is smaller than the thickness of the first packaging material layer 18 on the side of the second partition portion 19 away from the substrate 1 .

[0107] Optionally, a thickness W2 of the first packaging material layer 18 located on a side of the second partition portion 19 facing the second isolation opening 92 is greater than 0 and less than or equal to 500Å.

[0108] For example, the thickness W2 can be 50 Å, 100 Å, 200 Å, 300 Å, 400 Å, 450 Å, or 500 Å, and the thickness of the first encapsulation material layer 18 in other parts is about 2000 Å. In this way, it is easier to remove the first encapsulation material layer 18 of at least a portion of the second light-emitting unit located on the side of the second partition portion 19 facing the second isolation opening 92 by wet etching, thereby exposing the second partition portion 19, thereby making it easier to peel and remove the second partition portion 19.

[0109] The second packaging unit 802 formed by the above method and located on the side of the isolation structure 3 away from the substrate 1 is in contact with the side of the isolation structure 3 away from the substrate 1. In this way, there is no gap between the second packaging unit 802 and the isolation structure 3, and the etching solution is not easy to invade the first light-emitting unit, so it is not easy to cause dark spots in the second light-emitting unit, thereby improving the display effect of the display panel.

[0110] In some possible implementations, after the steps of forming the second light-emitting unit in the second isolation opening 92 and forming the second packaging unit 802 located on a side of the second light-emitting unit away from the substrate 1 , the method further includes: See Figure 15 A third partition portion 21 and a third photoresist protection layer 22 are formed on the side of the isolation structure 3 away from the substrate 1, the third photoresist protection layer 22 covers the first packaging unit 801 and the second packaging unit 802, the orthographic projection of the third partition portion 21 on the substrate 1 surrounds the orthographic projection of the third isolation opening 93 on the substrate 1, the orthographic projection of the side of the third partition portion 21 facing the third isolation opening 93 on the substrate 1 is located within the orthographic projection of the isolation structure 3 corresponding to the third isolation opening 93 on the substrate 1, the orthographic projection of the side of the third partition portion 21 close to the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the third partition portion 21 away from the substrate 1 on the substrate 1, and the third partition portion 21 is inclined toward the side of the third isolation opening 93.

[0111] Optionally, the inclination angle β3 of the side wall of the third partition portion 21 toward the third isolation opening 93 is greater than or equal to 120° and less than or equal to 150°. For example, the inclination angle β3 can be 120°, 125°, 130°, 140°, 145°, or 150°.

[0112] Preferably, the thickness D3 of the third partition portion 21 is greater than or equal to 5 μm and less than or equal to 10 μm along the thickness direction Z of the substrate 1. For example, the thickness D3 may be 5 μm, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm.

[0113] Reasonable setting of the inclination angle β3 and the thickness D3 can improve the partitioning effect of the third partition portion 21 on the light-emitting material layer 16 and the second electrode material layer 17 of the third light-emitting unit.

[0114] See Figure 16 The light-emitting material layer 16, the second electrode material layer 17 and the first packaging material layer 18 of the third light-emitting unit are formed in sequence in the third isolation opening 93, and the light-emitting material layer 16, the second electrode material layer 17 and the first packaging material layer 18 of the third light-emitting unit extend to the side of the third photoresist protection layer 22, the first packaging unit 801, the second packaging unit 802 and the third partition portion 21 away from the substrate 1.

[0115] Since the orthographic projection of the side of the third partition portion 21 close to the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the third partition portion 21 away from the substrate 1 on the substrate 1, and the third partition portion 21 is inclined toward one side of the third isolation opening 93, the light-emitting material layer 16 and the second electrode material layer 17 of the third light-emitting unit are disconnected at the third partition portion 21, and the first filling portion 10 and the second filling portion 11 corresponding to the third isolation opening 93 are formed on the side of the isolation structure 3 away from the substrate 1.

[0116] See Figure 17 and Figure 18 , the third partition portion 21 and the third photoresist protection layer 22 are removed to form a third light-emitting unit in the third isolation opening 93 and a third encapsulation unit 803 located on a side of the third light-emitting unit away from the substrate 1 .

[0117] For details, please see again Figure 17 , at least a portion of the first encapsulation material layer 18 of the third light-emitting unit located on a side of the third partition portion 21 facing the third isolation opening 93 is removed by wet etching.

[0118] Please see again Figure 18 , a photolithography stripping process is used to remove the third partition portion 21 and the third photoresist protection layer 22.

[0119] In the related art, the first packaging material layer 18 of the third light-emitting unit is patterned by dry etching, which easily damages the first electrode 4 and thus causes a poor display problem.

[0120] In this embodiment, it is not necessary to pattern the first packaging material layer 18 of the third light-emitting unit by dry etching. It is only necessary to remove the third partition portion 21 and the third photoresist protection layer 22. Therefore, no corresponding dry etching equipment is required, which can reduce the investment cost of the corresponding equipment and make the process simpler. At the same time, it is not easy to damage the first electrode 4, and the product process morphology stability is better, thereby improving the display effect of the corresponding light-emitting unit 7 and improving the yield of the display panel.

[0121] Preferably, the step of forming the third partition portion 21 and the third photoresist protection layer 22 on the side of the isolation structure 3 away from the substrate 1 includes: A third photoresist material layer is formed in the isolation opening 9 and on a side of the isolation structure 3 away from the substrate 1 , and the third photoresist material layer is patterned to form a third partition portion 21 and a third photoresist protection layer 22 .

[0122] In this way, the third partition portion 21 and the third photoresist protection layer 22 are formed by the same process and the same material, so there is no need to set up separate processes for forming the third partition portion 21 and the third photoresist protection layer 22, thereby reducing the process cost of forming the third partition portion 21 and the third photoresist protection layer 22.

[0123] Optionally, see again Figure 16 The thickness W3 of the first packaging material layer 18 on the side of the third partition portion 21 facing the third isolation opening 93 is smaller than the thickness of the first packaging material layer 18 on the side of the third partition portion 21 away from the substrate 1 .

[0124] Preferably, a thickness W3 of the first packaging material layer 18 located on a side of the third partition portion 21 facing the third isolation opening 93 is greater than 0 and less than or equal to 500 Å.

[0125] For example, the thickness W3 can be 50 Å, 100 Å, 200 Å, 300 Å, 400 Å, 450 Å, or 500 Å, and the thickness of the first encapsulation material layer 18 in other parts is about 2000 Å. In this way, it is easier to remove the first encapsulation material layer 18 of at least a portion of the third light-emitting unit located on the side of the third partition portion 21 facing the third isolation opening 93 by wet etching, thereby exposing the third partition portion 21, thereby making it easier to peel and remove the third partition portion 21.

[0126] The third packaging unit 803 formed by the above method and located on the side of the isolation structure 3 away from the substrate 1 is in contact with the side of the isolation structure 3 away from the substrate 1. In this way, there is no gap between the third packaging unit 803 and the isolation structure 3, and the etching solution is not easy to invade the third light-emitting unit, so it is not easy to cause dark spots in the third light-emitting unit, thereby improving the display effect of the display panel.

[0127] In summary, in the display panel formed by the above method, the packaging unit 8 extends from the side of the isolation structure 3 toward the isolation opening 9 to the side of the isolation structure 3 away from the substrate 1. The packaging unit 8 located on the side of the isolation structure 3 away from the substrate 1 is the edging portion 81. The side of the edging portion 81 away from the isolation opening 9 is in contact with the side of the isolation structure 3 away from the substrate 1. In this way, there is no gap between the edging portion 81 and the isolation structure 3, and the etching solution is not easy to invade the light-emitting unit 7, so it is not easy to cause the corresponding light-emitting unit 7 to produce dark spots, thereby improving the display effect of the display panel.

[0128] In addition, there is no need to pattern the first packaging material layer 18 of the light-emitting unit 7 by dry etching, so there is no need for corresponding dry etching equipment, which can reduce the investment cost of the corresponding equipment and make the process simpler; at the same time, it is not easy to damage the first electrode 4, and the product process morphology stability is better, which can improve the display effect of the corresponding light-emitting unit 7 and improve the yield of the display panel.

[0129] In some possible embodiments, the present application further provides an electronic device, comprising the display panel described herein, or comprising a display panel produced by the method for producing a display panel described herein. The electronic device may include a device with image processing capabilities, such as a mobile phone, desktop computer, laptop computer, tablet computer, vehicle-mounted display, wearable device, etc. Because the electronic device includes the display panel described herein, the display effect of the electronic device is improved.

[0130] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0131] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; a plurality of light-emitting units, at least a portion of each of the light-emitting units being located within the isolation opening; A plurality of packaging units are provided, each of which is located on a side of the corresponding light-emitting unit away from the substrate, and each of the packaging units includes a edging portion located on a side of the isolation structure away from the substrate, and at least a portion of the edging portion is in contact with a side of the isolation structure away from the substrate.

2. The display panel according to claim 1, wherein: The display panel further includes a first filling layer and a second filling layer stacked in sequence on a side of the isolation structure away from the substrate, the first filling layer including a plurality of first filling portions spaced apart, the second filling layer including a plurality of second filling portions spaced apart, the edge portion extending from the side of the second filling portions away from the substrate to contact the side of the isolation structure away from the substrate; Preferably, the packaging unit further includes a packaging portion, which is located on a side of the light-emitting unit away from the substrate, and extends through the isolation structure toward the side wall of the isolation opening to connect with a side of the edging portion toward the isolation opening.

3. The display panel according to claim 2, wherein: The edging portion includes a first edging sub-portion and a second edging sub-portion connected to each other in a direction parallel to the plane where the substrate is located. The first edging sub-portion is located on a side of the second edging sub-portion away from the packaging portion, and the second edging sub-portion is connected to the packaging portion.

4. The display panel according to claim 3, wherein: A side of the first edging sub-portion close to the substrate contacts a side of the isolation structure away from the substrate; Preferably, a side of the second edging sub-portion close to the substrate contacts a side of the second filling portion away from the substrate.

5. The display panel according to claim 2, wherein: The light-emitting unit includes a first electrode, a light-emitting functional portion, and a second electrode stacked in sequence in a direction away from the substrate, and the first filling layer and the light-emitting functional portion are provided in the same layer and made of the same material; Preferably, the second filling layer and the second electrode are provided in the same layer and with the same material; Preferably, a side of the first electrode away from the substrate is a flat surface.

6. The display panel according to any one of claims 1 to 5, wherein: The orthographic projections of the edging portions of two adjacent packaging units on the substrate at least partially overlap, or the orthographic projections of the edging portions of two adjacent packaging units on the substrate are spaced apart.

7. The display panel according to any one of claims 1 to 5, characterized in that: The display panel further includes a second encapsulation layer located on a side of the encapsulation unit away from the substrate, and a third encapsulation layer located on a side of the second encapsulation layer away from the substrate; Preferably, the materials of the encapsulation unit and the third encapsulation layer both include inorganic materials; Preferably, the material of the second encapsulation layer includes organic material.

8. The display panel according to claim 7, wherein: The isolation structure includes a first isolation portion and a second isolation portion stacked in sequence in a direction away from the substrate, the orthographic projection of the side of the first isolation portion away from the substrate on the substrate is located within the orthographic projection of the second isolation portion on the substrate, the orthographic projection area of ​​the side of the first isolation portion away from the substrate on the substrate is smaller than the orthographic projection area of ​​the second isolation portion on the substrate, and the second electrode of the light-emitting unit is electrically connected to the first isolation portion; Preferably, the isolation structure further comprises a third isolation portion located on a side of the first isolation portion facing the substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion; Preferably, the material of the third isolation portion includes molybdenum or titanium; and / or the material of the first isolation portion includes aluminum, silver or copper; and / or the material of the second isolation portion includes titanium or molybdenum.

9. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings; A plurality of light-emitting units and a packaging unit located on a side of the corresponding light-emitting units away from the substrate are formed, wherein at least a portion of the light-emitting unit is located within the isolation opening, and the packaging unit includes a edging portion located on a side of the isolation structure away from the substrate, and at least a portion of the edging portion is in contact with a side of the isolation structure away from the substrate.

10. The method for manufacturing a display panel according to claim 9, wherein: The isolation openings include a first isolation opening, a second isolation opening and a third isolation opening; The steps of forming a plurality of light-emitting units and forming an encapsulation unit located on a side of the corresponding light-emitting unit away from the substrate include: A first partition portion and a first photoresist protection layer are formed on a side of the isolation structure away from the substrate, the first photoresist protection layer covers the second isolation opening and the third isolation opening, an orthographic projection of the first partition portion on the substrate surrounds an orthographic projection of the first isolation opening on the substrate, an orthographic projection of a side of the first partition portion facing the first isolation opening on the substrate is located within an orthographic projection of the isolation structure corresponding to the first isolation opening on the substrate, an orthographic projection of a side of the first partition portion close to the substrate on the substrate is located within an orthographic projection of a side of the first partition portion away from the substrate on the substrate, and the first partition portion is inclined toward the side of the first isolation opening; forming a light-emitting material layer, a second electrode material layer, and a first packaging material layer of a first light-emitting unit in sequence within the first isolation opening, wherein the light-emitting material layer, the second electrode material layer, and the first packaging material layer of the first light-emitting unit extend to a side of the first photoresist protection layer and the first partition portion away from the substrate; The first partition portion and the first photoresist protection layer are removed to form a first light-emitting unit in the first isolation opening and a first packaging unit located on a side of the first light-emitting unit away from the substrate.

11. The method for manufacturing a display panel according to claim 10, wherein: The step of forming a first partition portion and a first photoresist protection layer on a side of the isolation structure away from the substrate includes: forming a first photoresist material layer in the isolation opening and on a side of the isolation structure away from the substrate, and patterning the first photoresist material layer to form a first partition portion and a first photoresist protection layer; Preferably, the step of removing the first partition portion and the first photoresist protection layer includes: removing, by wet etching, at least a portion of the first packaging material layer of the first light-emitting unit located on a side of the first partition portion facing the first isolation opening; removing the first partition portion and the first photoresist protection layer by using a photolithography stripping process; Preferably, the thickness of the first packaging material layer on the side of the first partition portion facing the first isolation opening is smaller than the thickness of the first packaging material layer on the side of the first partition portion away from the substrate; Preferably, the thickness of the first packaging material layer located on the side of the first partition portion facing the first isolation opening is greater than 0 and less than or equal to 500Å; Preferably, the inclination angle of the side wall of the first partition portion toward the first isolation opening is greater than or equal to 120° and less than or equal to 150°; Preferably, along the thickness direction of the substrate, the thickness of the first partition portion is greater than or equal to 5 μm and less than or equal to 10 μm.

12. The method for manufacturing a display panel according to claim 10, wherein: After the steps of forming the first light-emitting unit in the first isolation opening and forming the first packaging unit located on a side of the first light-emitting unit away from the substrate, the method further includes: A second partition portion and a second photoresist protection layer are formed on a side of the isolation structure away from the substrate, the second photoresist protection layer covers the first encapsulation unit and the third isolation opening, an orthographic projection of the second partition portion on the substrate surrounds an orthographic projection of the second isolation opening on the substrate, an orthographic projection of a side of the second partition portion facing the second isolation opening on the substrate is located within an orthographic projection of the isolation structure corresponding to the second isolation opening on the substrate, an orthographic projection of a side of the second partition portion close to the substrate on the substrate is located within an orthographic projection of a side of the second partition portion away from the substrate on the substrate, and the second partition portion is inclined toward the second isolation opening; forming a light-emitting material layer, a second electrode material layer, and a first packaging material layer of a second light-emitting unit in sequence within the second isolation opening, wherein the light-emitting material layer, the second electrode material layer, and the first packaging material layer of the second light-emitting unit extend to a side of the second photoresist protection layer, the first packaging unit, and the second partition portion away from the substrate; The second partition portion and the second photoresist protection layer are removed to form a second light-emitting unit in the second isolation opening and a second packaging unit located on a side of the second light-emitting unit away from the substrate.

13. The method for manufacturing a display panel according to claim 12, wherein: The step of forming a second partition portion and a second photoresist protection layer on a side of the isolation structure away from the substrate includes: forming a second photoresist material layer in the isolation opening and on a side of the isolation structure away from the substrate, and patterning the second photoresist material layer to form a second partition portion and a second photoresist protection layer; Preferably, the step of removing the second partition portion and the second photoresist protection layer includes: removing, by wet etching, at least a portion of the first encapsulation material layer of the second light-emitting unit located on a side of the second partition portion facing the second isolation opening; removing the second partition portion and the second photoresist protection layer by using a photolithography stripping process; Preferably, the thickness of the first packaging material layer on the side of the second partition portion facing the second isolation opening is smaller than the thickness of the first packaging material layer on the side of the second partition portion away from the substrate; Preferably, the thickness of the first packaging material layer located on the side of the second partition portion facing the second isolation opening is greater than 0 and less than or equal to 500Å; Preferably, the inclination angle of the side wall of the second partition portion toward the second isolation opening is greater than or equal to 120° and less than or equal to 150°; Preferably, along the thickness direction of the substrate, the thickness of the second partition portion is greater than or equal to 5 μm and less than or equal to 10 μm.

14. The method for manufacturing a display panel according to claim 12, wherein: After the steps of forming a second light-emitting unit in the second isolation opening and forming a second packaging unit located on a side of the second light-emitting unit away from the substrate, the method further includes: A third partition portion and a third photoresist protection layer are formed on a side of the isolation structure away from the substrate, the third photoresist protection layer covers the first encapsulation unit and the second encapsulation unit, an orthographic projection of the third partition portion on the substrate surrounds an orthographic projection of the third isolation opening on the substrate, an orthographic projection of a side of the third partition portion facing the third isolation opening on the substrate is located within an orthographic projection of the isolation structure corresponding to the third isolation opening on the substrate, an orthographic projection of a side of the third partition portion close to the substrate on the substrate is located within an orthographic projection of a side of the third partition portion away from the substrate on the substrate, and the third partition portion is arranged obliquely toward the side of the third isolation opening; A light-emitting material layer, a second electrode material layer, and a first packaging material layer of a third light-emitting unit are sequentially formed in the third isolation opening, and the light-emitting material layer, the second electrode material layer, and the first packaging material layer of the third light-emitting unit extend to a side of the third photoresist protection layer, the first packaging unit, the second packaging unit, and the third partition portion away from the substrate; removing the third partition portion and the third photoresist protection layer to form a third light-emitting unit in the third isolation opening and a third encapsulation unit located on a side of the third light-emitting unit away from the substrate; Preferably, the step of forming a third partition portion and a third photoresist protection layer on a side of the isolation structure away from the substrate includes: forming a third photoresist material layer in the isolation opening and on a side of the isolation structure away from the substrate, and patterning the third photoresist material layer to form a third partition portion and a third photoresist protection layer; Preferably, the step of removing the third partition portion and the third photoresist protection layer includes: removing, by wet etching, at least a portion of the first encapsulation material layer of the third light-emitting unit located on a side of the third partition portion facing the third isolation opening; removing the third partition portion and the third photoresist protection layer by using a photolithography stripping process; Preferably, the thickness of the first packaging material layer located on a side of the third partition portion facing the third isolation opening is smaller than the thickness of the first packaging material layer located on a side of the third partition portion away from the substrate; Preferably, the thickness of the first packaging material layer located on the side of the third partition portion facing the third isolation opening is greater than 0 and less than or equal to 500Å; Preferably, the inclination angle of the side wall of the third partition portion toward the third isolation opening is greater than or equal to 120° and less than or equal to 150°; Preferably, along the thickness direction of the substrate, the thickness of the third partition portion is greater than or equal to 5 μm and less than or equal to 10 μm.

15. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 8, or comprises a display panel manufactured by the method for manufacturing a display panel according to any one of claims 9 to 14.

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