Key structure of keyboard and manufacturing method thereof

Abstract

The invention relates to the technical field of key structures of keyboards, and provides a key structure of a keyboard and a manufacturing method of the key structure. The key structure comprises a key cap body with a groove, and a plurality of welding pads are embedded in the groove. The at least one LED chip is arranged in the groove, is provided with a light-emitting surface and a plurality of side light-emitting surfaces, and is electrically connected to the welding pad through a welding wire; the first packaging body wraps the LED chip, and the thickness of the first packaging body is not smaller than the wire arc height of the bonding wire. The second packaging body covers the first packaging body and is filled in the groove; the first anti-dazzling screen is pressed on the surface of the second packaging body and does not protrude out of the groove; the second anti-dazzling screen is provided with a plurality of hollow through holes, is pressed on the surface of the first anti-dazzling screen and is not smaller than the first anti-dazzling screen in size. Therefore, the packaging stability of the LED light-emitting chip and the integration of the key module can be improved, the light leading-out path is effectively controlled, light dissipation is avoided, and the key backlight quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of keyboard key structures, and in particular to a keyboard key structure and a manufacturing method thereof. Background Art

[0002] Current keyboards, especially gaming keyboards or mechanical keyboards, widely use a backlight structure at the bottom of the keyboard to improve the convenience and aesthetics of nighttime operation. Figure 1 As shown, a common practice is to install a backlight module 20 under the keyboard module 10, and transmit light to the key surface with the help of a transparent material or light guide mechanism under the key. Figure 2 As shown, the backlight module 20 is typically integrated onto a printed circuit board and may include a light guide layer 21 and a reflective layer 22. These layers guide the LED chip (a solid-state semiconductor device) 30 located below to form the backlight source. The backlight module 20 is embedded between the keyboard cover 12 and keyboard base 13 of the keyboard module 10. In addition to being limited by the light guide layer 21 and the reflective layer 22, the light emitted by the LED chip 30 must also pass through or penetrate the keyboard cover 12 located below the keycap 11. Therefore, this type of structural design often presents the following problems: First, since the LED light source is far away from the keycap character area, the light needs to be transmitted through multiple structural layers, including support columns, light guide layers and even reflective layers, which makes the light path complex and part of the light energy is lost in the intermediate medium, making it difficult to achieve a lighting effect with uniform brightness and clear contrast.

[0003] Secondly, to achieve RGB (color standard) multi-color light source, the traditional bottom-emitting structure needs to be equipped with a complex light guide plate or lens design, which increases the thickness of the structure and reduces the key response sensitivity, which is not conducive to thin design. At the same time, in actual use, the uneven light divergence may cause different brightness in the key area, affecting the visual experience.

[0004] Third, mechanical keyboards generally use a replaceable keycap structure, but when the LED is set at the bottom, different keycap materials and shapes have a significant impact on the lighting performance. In particular, high keycaps or non-homogeneous keycaps are more likely to have blind spots or light leakage, reducing the overall lighting quality.

[0005] Therefore, how to simplify the light source path structure, reduce light loss, and improve light consistency and packaging reliability has become an important issue in the current keyboard light structure design. Summary of the Invention

[0006] The purpose of the present invention is to overcome the problems existing in the existing keyboard backlight structure, such as complex light path, obvious light efficiency attenuation, large structure thickness, poor luminous uniformity, etc., and to provide a keyboard key structure and its manufacturing method with compact structure, uniform light efficiency, stable packaging and precise shading, which is suitable for various luminous keyboard application scenarios such as mechanical keyboards and e-sports keyboards.

[0007] To achieve the above object, the present invention proposes a keyboard key structure, the technical solution of which includes: A keycap body having a groove, wherein a plurality of solder pads are embedded in the groove; At least one LED chip is disposed in the groove, the LED chip including a light-emitting surface and a plurality of side light-emitting surfaces, and a plurality of bonding wires extend from the light-emitting surface to be electrically connected to the bonding pad; The first package body covers the LED chip, and its thickness is not less than the arc height of the bonding wire to prevent the bonding wire from being exposed and damaged; The second package body covers the first package body and fills the entire groove, providing additional mechanical strength and optical stability; The first light shielding sheet is pressed onto the surface of the second package body and does not protrude outside the groove, forming a flat keycap structure; and The second light shielding sheet is pressed onto the surface of the first light shielding sheet, and a plurality of hollow through holes are provided on the surface of the second light shielding sheet. The positions of the through holes correspond to the light emitting paths of the LEDs, and the size of the second light shielding sheet is not smaller than that of the first light shielding sheet.

[0008] It is understandable that the present application uses the keycap as the chip package, and the overall combination does not need to consider the packaging thickness of the LED chip. The structure is more flexible and controllable, and the structural thickness is reduced.

[0009] Preferably, the light transmittance of the shading sheet is designed with differentiation to optimize the light extraction direction and brightness distribution; the first package body may include photoluminescent material to enhance the afterglow divergence and brightness retention; the second shading sheet may also be provided with multiple positioning structures to improve the assembly accuracy and consistency between the second shading sheet and the keycap body.

[0010] In addition, the present invention also provides a method for manufacturing a key structure, which specifically includes: providing a keycap body having a groove with multiple solder pads embedded therein; placing at least one LED chip in the groove, wherein the LED chip includes a light-emitting surface and multiple side light-emitting surfaces; forming multiple solder wires from the light-emitting surface so that the solder wires are electrically connected to the solder pads; forming a first package body, wherein the thickness of the first package body is not less than the arc height of the solder wires, so as to cover the LED chip; forming a second package body, which covers the first package body and fills the groove; pressing a first light shielding sheet onto the second package body so that the first light shielding sheet does not protrude outside the groove; and pressing a second light shielding sheet having multiple hollow through holes onto the surface of the first light shielding sheet, wherein the second light shielding sheet has a size not less than that of the first light shielding sheet; and forming the key structure of the keyboard described above. In other words, the LED chip is placed in the groove of the keycap body and soldered to it, a layered package structure is formed through multiple packaging steps, and finally the first and second light shielding sheets are pressed in sequence to form a backlit key structure with precisely controlled light-emitting areas.

[0011] Compared with the prior art, the present invention has the following beneficial effects: 1. Improved lighting efficiency: By placing the LED chip directly in the groove of the keycap, the light-emitting surface and side light-emitting surface of the LED chip are directly facing the top of the keycap, reducing the light guide structure, achieving upward light emission and shortening the light path, thereby improving lighting efficiency and uniformity; 2. Strong packaging protection: The layered packaging structure can effectively protect the bonding wires and chip structure, and enhance the service life and reliability of the buttons; 3. Precise shading: Double-layer shading structure combined with through-hole design achieves precise local lighting and clear boundary control to avoid light pollution; 4. Compact structure and mass production: The manufacturing process is clear and the assembly is simple, which is suitable for all kinds of luminous keyboard products.

[0012] In summary, the keyboard key structure and manufacturing method provided by the present invention take into account structural stability, luminous quality and manufacturing efficiency, and have good industrial application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0014] in: Figure 1 It is a three-dimensional schematic diagram of the key module and backlight module of a traditional keyboard; Figure 2 yes Figure 1 A partial cross-sectional view of the key module and backlight module keyboard after being combined; Figure 3 This is a cross-sectional view of a key structure of a keyboard provided by an embodiment of the present technical solution; Figure 4 is a cross-sectional view of a first light shielding sheet provided in a preferred embodiment; Figure 5 yes Figure 3 A top view of the second light shielding sheet and its hollow through hole; Figure 6 is a partial enlarged view of the combination of the second light shielding sheet and the keycap body provided in another preferred embodiment; Figure 7 is a cross-sectional view of a keycap body provided by an embodiment of the present technical solution; Figure 8 yes Figure 7 A top view of the keycap body and its groove; Figure 9 is a top view of a keycap body and its groove provided in a variation; Figure 10 is Figure 9 A cross-sectional view of a keycap body having an LED chip disposed therein; Figure 11 is Figure 10 A cross-sectional view of a light emitting surface of an LED chip electrically connected to a bonding pad by forming a bonding wire; Figure 12 is a cross-sectional view of a first package formed in an embodiment of the present technical solution; Figure 13 is a cross-sectional view showing a first package body formed in a variation; Figure 14 is Figure 12 A cross-sectional view of a first package body covering a second package body; Figure 15 It will Figure 14 A cross-sectional view of a first light shielding sheet pressed onto a second packaging body; Figure 16 It will Figure 15 A cross-sectional view of a second light shielding sheet pressed onto a first light shielding sheet.

[0015] Description of main component symbols DETAILED DESCRIPTION The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0016] See also Figure 3 This embodiment of the present invention provides a keyboard key structure 100. The key structure 100 primarily comprises a keycap body 110, at least one LED chip 130, multiple encapsulation bodies (a first encapsulation body 140 and a second encapsulation body 150), and multiple light shielding sheets (a first light shielding sheet 160 and a second light shielding sheet 170). The structure can be customized and assembled and mounted on a keyboard base 180 according to user needs. Specifically, the keycap body 110 has a groove 111 and multiple solder pads 112 embedded therein. The keycap body 110 can be integrally molded from plastic, composite resin, or other materials suitable for keyboard keycap molding. The groove 111 can be located in the center of the keycap body 110 or at the polarization axis. The groove 111 has a depth sufficient to accommodate the LED chip 130. Preferably, the solder pads 112 are metal conductive pads formed by printing, etching, electroplating, or insert molding, and are pre-electrically connected to a flexible circuit or electrode leads. Each solder pad 112 can be used to receive a wire bond from the LED chip 130 to achieve electrical continuity. The layout of the solder pads 112 can be designed to be symmetrical or asymmetrical, depending on the actual needs of the LED chip 130, to match the light-emitting surface 131 of the LED chip 130 and the soldering direction. In this embodiment, to enhance the thermal stability and electrical reliability of the overall structure, the solder pads 112 can be constructed of a metal material such as copper, nickel, or gold, and can optionally be coated with a protective layer (such as a solder mask or passivation layer) to prevent performance degradation due to overheating or oxidation during the soldering process.

[0017] The LED chip 130 is arranged in the recess 111, and includes a light emitting surface 131 and a plurality of side light emitting surfaces 132. The light emitting surface 131 faces upward, and the side light emitting surfaces 132 diverge in all directions. In this embodiment, the LED chip 130 adopts a normal structure, and is bonded to the bottom of the recess 111 or a region without the solder pad 112 (as long as the solder pad 112 is not covered) by the adhesive 120 at the back thereof, so that the light emitting surface 131 of the LED chip 130 faces upward, and a plurality of wire bonds 133 extending from the light emitting surface 131 are electrically connected to the solder pad 112. Further, the light emitting surface 131 can emit main directional light vertically toward the top of the keycap, and can be used to penetrate the upper encapsulating material and light shielding structure to illuminate the key character region. The side light emitting surfaces 132 are distributed on the outer sidewall of the LED chip 130, and are used to emit auxiliary light in the lateral or oblique direction to help improve the overall light emitting uniformity and coverage. The wire bonds 133 usually use gold wires or alloy thin wires, and can be formed by hot pressing or ultrasonic wire bonding to form a certain curvature and arc height. Generally, the LED chip 130 can be a single-color, high-brightness chip, or a multi-color chip with RGB structure can be selected according to requirements to realize the extended application of multi-region backlight or gradient light effect, and the wavelength, size and electrode layout can be matched and designed according to actual light emitting requirements and the space of the recess 111.

[0018] The first encapsulation body 140 encapsulates the LED chip 130, and the thickness of the first encapsulation body 140 is no less than the arc height of the bonding wires 133, ensuring that the first encapsulation body 140 completely covers the bonding wires 133. In this embodiment, the encapsulation material of the first encapsulation body 140 can be a thermoplastic resin or a thermosetting resin, which has good light transmittance and molding stability. During the encapsulation process, the thickness of the first encapsulation body 140 is controlled to uniformly cover the LED chip 130 and the bonding wires 133, and the top thickness is no less than the arc height of the bonding wires 133, thereby ensuring that the bonding wires 133 are completely covered and prevented from being exposed and causing short circuits, oxidation, or breakage due to external contact. Furthermore, to enhance luminous uniformity and backlighting effects, photoluminescent materials such as rare-earth-doped phosphors, glow-in-the-dark powders, or polymer luminescent particles responsive to blue light excitation can be further added to the first encapsulation body 140. When the LED chip 130 is working, the photoluminescent material inside the first package 140 can absorb part of the light energy and release auxiliary light again. By absorbing and releasing it again, it effectively prolongs the duration of the light emission and improves the visual softness of the key structure lighting. In addition, the doping concentration, particle size distribution and dispersion method of the photoluminescent material can be finely designed according to the required brightness adjustment, color temperature control and light diffusion angle to meet the personalized requirements of different keyboard models for the lighting effect. In detail, the doping concentration of the photoluminescent material can be adjusted according to different lighting requirements. For example: when the keyboard needs to achieve high brightness output, based on the total molar amount of the resin matrix of the first package, the doping concentration of rare earth ions (such as Eu²⁺, Tb³⁺ or Ce³⁺) can be selected to be 5–8mol% to increase the density of luminescent centers, thereby obtaining higher photoluminescent efficiency. To achieve a cool white light effect, the Eu²⁺ doping concentration can be controlled at 1–3 mol%. Conversely, to achieve a warm white or yellowish light, the Mn²⁺ doping concentration can be appropriately increased to 4–6 mol%. In one variation, the particle size distribution of the photoluminescent material can also be designed differently. A particle size of 50–100 nm reduces light scattering loss and improves transmittance, making it suitable for thin keycap structures. A particle size of 3–5 μm enhances light diffusion and achieves a more uniform light output angle, making it suitable for larger keys (such as the space bar and enter key). Furthermore, a mixed particle size distribution of 100 nm and 2 μm can be used to achieve both high brightness and light field uniformity, avoiding localized bright spots or dark areas. In another variation, the dispersion of the photoluminescent material can be adjusted according to design requirements. For example, photoluminescent materials can be dispersed in an epoxy or silicone matrix, and silane coupling agents can be used to improve the compatibility of the particles with the matrix and prevent agglomeration. Targeted dispersion can also be employed to increase the concentration of luminescent particles in a localized area while maintaining a lower concentration in other areas, thereby enhancing the recognition and visibility of specific buttons.Optionally, the first packaging body 140 is only filled in a local area of ​​the groove 111 , so that the first packaging body 140 can cover the LED chip and the bonding wires.

[0019] The second encapsulation body 150 covers the first encapsulation body 140 and fills the recess 111. The first encapsulation body 140 and the second encapsulation body 150 may comprise a thermoplastic resin or a thermosetting resin, and the second encapsulation body 150 does not contain a photoluminescent material. The second encapsulation body 150 covers the exterior of the first encapsulation body 140 and further fills the gap area of ​​the recess 111, thereby substantially filling the recess 111 and effectively improving the overall structural strength and sealing. In a preferred embodiment, the second encapsulation body 150 can be formed by secondary injection, potting, or transfer printing, preferably using a transparent or translucent thermoplastic resin or thermosetting resin, such as optical-grade silicone, PU (polyurethane) material, acrylic resin, epoxy-based encapsulation material, etc., which has good mechanical strength, light transmittance, and environmental adaptability. In particular, unlike the first package body 140, the second package body 150 does not contain photoluminescent materials. This design ensures that the main light source can be controlled to be excited between the first package body 140 and the LED chip 130, avoiding the occurrence of light color shift or stray light.

[0020] The first light shielding sheet 160 is pressed onto the second package body 150 and does not protrude outside the groove 111. That is to say, the upper surface height of the first light shielding sheet 160 is substantially flush with the edge of the groove 111, or slightly lower than the edge, thereby maintaining the flatness of the surface of the keycap body 110 in terms of vision and touch, avoiding accidental touch due to protrusion or affecting the keycap assembly height. The first light shielding sheet 160 is preferably made of a low-transmittance material, such as: a surface-treated black PET film, a polyimide sheet, an ink-colored epoxy sheet or other light-shielding materials with UV resistance and heat resistance. Its main function is to adjust the light emitted from the LED chip 130 to prevent the light from diverging to non-target areas, thereby enhancing the recognition and contrast effect of the key pattern or character. In a preferred embodiment, as Figure 4As shown, due to the side edge profile of the first light shield 160 being smaller than the inner wall profile of the groove 111, a small gap 113 is formed between the side of the first light shield 160 and the side wall of the groove 111 after the first light shield 160 is attached. The gap 113 can serve the following functions: (1) preventing stress concentration during press fitting, avoiding warping or deformation due to thermal expansion and contraction or material warping; (2) improving packaging compatibility, allowing different batches of light shields to be successfully installed within the tolerance range; (3) allowing light to leak from the gap 113, forming different light paths. If necessary, the gap 113 can also be filled with a light-transmitting material of different colors to further adjust the color of the light. In detail, most of the light emitted by the LED chip 130 will be blocked by the first light shield 160 during transmission, and only part of the light can pass through the gap 113 and be emitted. Through the structural design of the gap 113, on the one hand, the overall brightness of the emitted light can be effectively reduced to avoid excessive glare; on the other hand, with the help of the geometric limitation of the gap 113, the transmitted light can form a specific light-emitting profile. For example: when the gap 113 is arranged in a rectangular ring, the light-transmitting light will present a light-emitting pattern similar to the "mouth" character, thereby achieving a unique visual effect and recognition.

[0021] The second light shield 170 with a plurality of hollow through holes 171 is pressed onto the surface of the first light shield 160. Preferably, the profile size of the second light shield 170 is not smaller than that of the first light shield 160, so that the second light shield 170 can completely cover the first light shield 160, avoiding edge light transmission or misalignment, and ensuring that the entire key light-emitting area has a uniform appearance and functional performance. Specifically, the second light shield 170 is a sheet structure, and its material can be selected from black film with low light transmittance, matte polyimide, polyester sheet coated with ink layer, or other laminated materials with light-shielding and heat-resistant properties. The main function is to further block or limit the direction of light and precisely control the light-emitting path through the hollow through holes 171. As shown, Figure 5 The position of the hollow through hole 171 corresponds to the light-emitting area of the underlying LED chip, and the hollow through hole 171 can be designed in the form of a letter, for example, the letter "O", and specifically in a grid structure to present the desired light-emitting pattern or character effect. In this embodiment, the light transmittance of the second light shield 170 as a whole can be controlled to be between 1% and 5% to ensure that the area other than the hollow through hole 171 is substantially not light-transmitting, thereby blocking the light path. When the light transmittance is less than 5%, the character contrast is improved by 40%. Furthermore, the light transmittance of the hollow through hole 171 can be further controlled to be between 0% and 1%, so that a small amount of light can pass through the gap of the hollow through hole 171, while most of the light will be isolated by the solid part of the hollow through hole 171 that does not form a gap, thereby producing a local high-contrast light-emitting effect. The light transmittance of the second light shield 170 is not greater than that of the first light shield 160. In a preferred embodiment, as shown, Figure 6 As shown, to improve the positioning accuracy and assembly stability of the second light shielding sheet 170, a plurality of positioning pins 172 may be provided on the second light shielding sheet 170. The number, shape, and distribution of the positioning pins 172 may be designed to match the pre-set coupling holes 114 in the keycap body 110. Specifically, the positioning pins 172 may be inserted into the coupling holes 114 using a snap-fit ​​or interference fit structure, forming a stable connection and preventing the light shielding sheet from shifting or warping due to thermal expansion and contraction or long-term use. Optionally, the positioning pins 172 may be cylindrical protrusions that fit into the coupling holes 114. Furthermore, this structural design allows users to replace or repair the second light shielding sheet 170 at any time according to their needs, thereby adjusting its pattern or characters. By configuring a double-layer shading sheet structure, the second shading sheet 170 provides light window definition, strengthens shading control and positioning and fixing, and effectively improves the optical performance, structural consistency and assembly efficiency of the entire key structure, making it suitable for modular application scenarios of high-brightness, multi-color or patterned backlit keys.

[0022] The present technical solution embodiment provides a method for manufacturing a keyboard key structure 100, comprising the following steps: First, see Figure 7 , providing a keycap body 110 having a groove 111, in which a plurality of solder pads 112 are embedded. In this embodiment, a metal bracket (not shown) is embedded in the keycap body 110, and the keycap body 110 directly serves as a packaging material for the metal bracket to protect the metal bracket and expose the solder pads 112, providing a window for external electrical connection. The metal bracket can be set at the center of the keycap body 110, and the metal bracket is electrically connected to the solder pads 112. Furthermore, as Figure 8 As shown, the groove 111 is pre-formed in the central area of ​​the keycap body 110 and is rectangular. Figure 9 As shown, the groove 111 is formed by laser ablation, so that the groove 111 is hemispherical.

[0023] See also Figure 10, at least one LED chip 130 is set in the groove 111, and the LED chip 130 includes a light-emitting surface 131 and multiple side light-emitting surfaces 132. In this step, an appropriate amount of adhesive 120 can be applied to the predetermined installation area at the bottom of the groove 111 by dispensing, and then the LED chip 130 can be accurately placed in the predetermined installation area to ensure that the LED chip 130 is stably adhered to the groove 111, while ensuring that the light-emitting surface 131 faces upward and is consistent with the direction of the keycap surface. If a layout of multiple LED chips 130 is adopted, the LED chips 130 can also be arranged in sequence at corresponding positions in the groove 111 according to the arrangement plan to ensure that the light source is evenly distributed.

[0024] Next, see Figure 11 , a plurality of welding wires 133 are formed from the light-emitting surface 131, one end of the welding wire 133 is electrically connected to the LED chip 130, and the other end of the welding wire 133 is electrically connected to the welding pad 112. In this embodiment, the welding wire 133 is preferably made of gold wire or alloy fine wire, the wire diameter can be between 15 microns and 35 microns, and has good conductivity and flexibility. The welding wire 133 can be connected by thermosonic bonding, ultrasonic bonding or a combination of thermosonic bonding and friction bonding to ensure that the solder joint is firmly bonded and the arc height of the welding wire 133 is controllable. Preferably, the curvature of the highest point of the welding wire 133 will serve as the design basis for the subsequent packaging coating thickness to ensure that the welding wire 133 can be completely covered in the packaging material to achieve the purpose of electrical protection and mechanical protection.

[0025] See also Figure 12 , forming a first package body 140, so that the thickness of the first package body 140 is not less than the arc height of the welding wire 133, so as to cover the LED chip 130. Generally speaking, the arc height of the welding wire 133 is usually determined according to factors such as the size of the LED chip 130 and the material of the welding wire 133. The purpose of this step is to provide structural protection, optical adjustment and electrical insulation functions. Preferably, the first package body 140 can apply a transparent or translucent packaging material to the area of ​​the groove 111 where the wire bonding has been completed by dispensing, injection or molding, so that it flows naturally and covers the LED chip 130 and the welding wire 133. Specifically, the first package body 140 can be optical silicone, epoxy resin, acrylic resin or other thermosetting or thermoplastic polymer materials with good light transmittance and adhesion. In addition, ensure that all welding wires 133 are effectively covered to avoid being exposed to the outside and causing mechanical damage or electrical short circuit. In the actual molding process, the glue amount and contour control path can be set by automatic dispensing equipment to achieve local precise filling and uniform coverage. Figure 13As shown, the surface of the first encapsulation body 140 after molding can be slightly arched or flat, depending on the material fluidity and curing method. In this step, the first encapsulation body 140 is cured by thermosetting reaction or ultraviolet irradiation to form a stable and transparent solid structure that completely covers the LED chip 130 and the bonding wire 133 and forms a close fit with the sidewalls of the groove 111, forming the first layer of the encapsulation structure.

[0026] See also Figure 14 After the first packaging body 140 is formed and cured, the molding step of the second packaging body 150 is continued. In this step, the second packaging body 150 is formed so as to cover the upper surface of the first packaging body 140 and further fill the remaining space in the groove 111. The main function of the second packaging body 150 is to fill the gap in the groove 111, enhance the structural stability, and provide a flat support interface for the subsequent bonding of the light shielding film. The second packaging body 150 can be made of optically transparent or translucent packaging materials, such as silicone, polyurethane, acrylic resin or epoxy resin, and its material formula should have good fluidity and curing morphology control capabilities. During the injection process, by setting appropriate injection pressure and volume, the packaging material is filled along the edge of the first packaging body 140 to the entire space of the groove 111, while covering the top surface of the first packaging body 140, forming a continuous, uniform and bubble-free second-layer packaging structure. Preferably, the surface height of the second encapsulation body 150 should be substantially flush with, or slightly lower than, the opening edge of the groove 111 to ensure close contact when the light shield is subsequently pressed together. In this embodiment, the second encapsulation body 150 and the first encapsulation body 140 are composed of different materials. The second encapsulation body 150 does not contain photoluminescent material. The optical transparency of the second encapsulation body 150 facilitates stable light penetration and limits the luminous profile to the subsequent light shield through-hole. After curing, the second encapsulation body 150 will be tightly bonded to the keycap body 110, enhancing the packaging stability and tensile strength of the entire key module. It also provides a support surface for the subsequent light shield pressing, providing a good packaging foundation for structural integration and mass production automation.

[0027] Afterwards, see Figure 15After the second package body 150 is formed, the first light shielding sheet 160 is installed. In this step, the first light shielding sheet 160 is pressed onto the upper surface of the second package body 150, ensuring that its edges do not protrude beyond the recess 111. The first light shielding sheet 160 is preferably a sheet-like structure with dimensions that match the opening area of ​​the recess 111. It can be made of a low-transmittance polymer sheet, such as black PET, polyimide film, or a surface-coated flexible light-shielding material. It primarily serves to block light from non-target areas, further defining the key's luminous pattern and brightness distribution. During the pressing process, the adhesive properties of the second package body 150 can be leveraged to directly bring the lower surface of the first light shielding sheet 160 into close contact with the upper surface of the second package body 150, forming the pressed and formed assembly. Alternatively, to ensure adhesion strength and optical consistency, hot pressing, UV (ultraviolet light curing) adhesive bonding, or other methods can be used for attachment. Preferably, the upper surface of the first shading sheet 160 should be flush with or slightly lower than the edge of the groove 111 of the keycap body 110 to ensure that the key surface structure does not bulge due to the shading sheet, thereby maintaining the flatness, tactile consistency and assembly compatibility of the keycap surface.

[0028] See also Figure 16After the first light shield 160 is completed, the second light shield 170 is installed. In this step, the second light shield 170 with multiple hollow holes 171 is pressed onto the surface of the first light shield 160, and the overall size is ensured to be no less than the first light shield 160 to achieve complete coverage and alignment protection. The second light shield 170 can be a sheet structure, and the material can be selected from a low-transmittance or non-transmittance black film, a polyimide coated with an extinction layer, or other composite materials with light shielding function, and is pre-formed with the hollow holes 171, which can be circular, rectangular, grid-shaped or patterned, and positioned corresponding to the light-emitting area of the LED chip 130 below to achieve precise display of light-emitting characters, patterns or light guide contours. Preferably, the second light shield 170 can be fixed on the first light shield 160 by heat pressing, UV glue point sticking or local positioning structure, and the bonding surface should be as flat as possible to avoid bubbles or displacement. Since the area of the second light shield 170 is greater than or equal to the first light shield 160, full coverage shielding can be achieved, and the structural hierarchy and optical constraint ability are enhanced. In addition, the transmittance of the area of the second light shield 170 formed with the hollow holes 171 can be controlled between 0% and 1%, and the overall transmittance of the area not formed with the hollow holes 171 is controlled between 1% and 5%, thereby forming a significant separation of high-contrast light-emitting and light-shielding areas, which helps to improve the clarity of the key light-emitting characters. In a preferred embodiment, the second light shield 170 can also be provided with multiple positioning pins 172 corresponding to the multiple combination holes 114 of the keycap body 110, which are fixed in the predetermined position by clamping or interference fitting, further improving the assembly accuracy and durability. After this step, the optical definition and surface light shielding structure of the key light-emitting area are completed, ensuring the stability of the modular structure in appearance consistency, light efficiency distribution and mass production assembly. At this point, the keycap body 110 with the LED chip 130 encapsulated and having light-emitting function is basically completed. Finally, the encapsulated keycap body 110 is assembled into the corresponding keyboard base 180 according to user requirements, and the key structure 100 of the keyboard of the present application is completed. By the above method, the light-emitting assembly can be completely encapsulated in the keycap, with the advantages of modularity, one-piece molding, anti-interference and high light-emitting uniformity, which is suitable for e-sports keyboards, mechanical keyboards or key input devices with high brightness backlight requirements, and is also convenient for subsequent module integration or mass production process application.

[0029] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A keyboard key structure, characterized in that: include: A keycap body having a groove and embedded with a plurality of solder pads; At least one LED chip is disposed in the groove, the LED chip comprising a light-emitting surface and a plurality of side light-emitting surfaces, a plurality of bonding wires extending from the light-emitting surface and electrically connected to the bonding pad; A first package body, covering the LED chip, wherein the thickness of the first package body is not less than the arc height of the bonding wire; a second packaging body, covering the first packaging body and filling the groove; a first light shielding sheet, pressed onto the second packaging body and not protruding from the groove; as well as The second light shielding sheet having a plurality of hollow through holes is pressed onto the surface of the first light shielding sheet, and the size of the second light shielding sheet is not less than that of the first light shielding sheet.

2. The key structure of the keyboard according to claim 1, wherein: The light transmittance of the second light shielding sheet is between 1% and 5%, and is no greater than the light transmittance of the first light shielding sheet.

3. The key structure of the keyboard according to claim 2, wherein: The hollow through holes are in a grid form, and the light transmittance of the grid is between 0% and 1%.

4. The key structure of the keyboard according to claim 1, wherein: The first package body includes a photoluminescent material.

5. The key structure of the keyboard according to claim 4, wherein: The first package body and the second package body include thermoplastic resin or thermosetting resin, and the second package body does not include photoluminescent material.

6. The key structure of the keyboard according to claim 1, wherein: There is a gap between the side surface of the first light shielding sheet and the side wall of the groove.

7. The key structure of the keyboard according to claim 1, wherein: The first encapsulation body only fills a local area in the groove.

8. The key structure of the keyboard according to claim 1, wherein: The second light shielding sheet has a plurality of positioning pins, each positioning pin corresponds to the combining hole of the keycap body, and each positioning pin is connected to the corresponding combining hole by means of snap-fit ​​or interference fit.

9. A method for manufacturing a key structure, characterized in that: The following steps are involved: Providing a keycap body having a groove, wherein a plurality of solder pads are embedded; At least one LED chip is disposed in the groove, wherein the LED chip includes a light-emitting surface and a plurality of side light-emitting surfaces; forming a plurality of bonding wires from the light emitting surface, so that the bonding wires are electrically connected to the bonding pads; forming a first package body, wherein the thickness of the first package body is not less than the arc height of the bonding wire, so as to cover the LED chip; forming a second packaging body, covering the first packaging body and filling the groove; Pressing the first light shielding sheet onto the second packaging body so that the first light shielding sheet does not protrude outside the groove; as well as Laminating a second light shielding sheet having a plurality of hollow through holes on the surface of the first light shielding sheet, wherein the size of the second light shielding sheet is not less than that of the first light shielding sheet; A key structure of a keyboard as claimed in claim 1 is formed.

10. The method for manufacturing a key structure according to claim 9, wherein: The first encapsulation body only fills a local area in the groove.

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