Light-emitting assembly and preparation method thereof, display device and electronic equipment

Abstract

The invention discloses a light-emitting assembly and a preparation method thereof, a display device and electronic equipment, and belongs to the technical field of display. The light-emitting assembly comprises a rigid island array, a first elastic layer and a second elastic layer, the second elastic layer is fixed on the first elastic layer; the rigid island array is arranged on the second elastic layer, and light emitting units are arranged on the rigid island array; the Young's modulus of the second elastic layer is lower than the Young's modulus of the first elastic layer. Therefore, by taking the two elastic layers with different Young moduli as the substrate, the mechanical integrity and stress buffering performance of the light-emitting component can be ensured at the same time, so that the stretchable effect of the light-emitting component is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a light-emitting assembly, a preparation method thereof, a display device and an electronic equipment. BACKGROUND

[0002] At present, in many types of stretchable electronic devices, the stretchable light source is considered as a key component because it is essential for information display or indicators in the stretchable system. However, there are still many obstacles in realizing the stretch performance of the stretchable light source, such as not having mechanical properties capable of bearing high strain related to stretching, etc. SUMMARY

[0003] The present application provides a light-emitting assembly, a preparation method thereof, a display device and an electronic equipment to solve the technical problem of poor stretch performance of the stretchable light source.

[0004] According to a first aspect of the present application, a light-emitting assembly is provided, comprising: a rigid island array, a first elastic layer and a second elastic layer; the second elastic layer is fixed on the first elastic layer; the rigid island array is arranged on the second elastic layer, and the rigid island array is used to arrange light-emitting units; the Young's modulus of the second elastic layer is lower than the Young's modulus of the first elastic layer.

[0005] In one possible implementation, the rigid island array comprises: a plurality of rigid island units and a connecting structure; the connecting structure is S-shaped; two rigid island units are connected by one connecting structure.

[0006] In one possible implementation, the light-emitting assembly further comprises: a light-emitting unit; at least one light-emitting unit is arranged on one rigid island unit; the rigid island unit is in a trapezoidal structure, and the short bottom edge of the rigid island unit is close to the second elastic layer, and the long bottom edge of the rigid island unit is away from the second elastic layer; the light-emitting unit is arranged on the long bottom edge of the rigid island unit.

[0007] In one possible implementation, the material of the rigid island unit is the same as that of the connecting structure; the connecting structure is used to deposit a metal material to form an electrical connection between the rigid island units.

[0008] In one possible implementation, the Young's modulus of the first elastic layer is lower than the Young's modulus of the rigid island array, and the Young's modulus of the first elastic layer is higher than a preset lower limit value; the Young's modulus of the second elastic layer is lower than the preset lower limit value.

[0009] In one possible implementation, the material of the first elastic layer is polydimethylsiloxane (PDMS), and the material of the second elastic layer is an organic silicon elastomer material.

[0010] According to a second aspect of the embodiments of the present application, a preparation method of a light-emitting assembly is further provided, which is used for preparing the light-emitting assembly of any one of the first aspect, and the method comprises: determining a mixing ratio of a substrate and a curing agent based on a required Young's modulus of a second elastic layer; mixing the substrate and the curing agent based on the mixing ratio to obtain the second elastic layer; coating the second elastic layer on a first elastic layer; coating a photoresist layer on the second elastic layer; and generating a rigid island array on the photoresist layer.

[0011] In a possible implementation, the generating the rigid island array on the photoresist layer comprises: covering a pattern of the rigid island array on the photoresist layer based on a thin film mask; and obtaining the rigid island array through developing and etching operations.

[0012] According to a third aspect of the embodiments of the present application, a display device is further provided, which comprises the light-emitting assembly of any one of the first aspect.

[0013] According to a fourth aspect of the embodiments of the present application, an electronic device is further provided, which comprises the display device of any one of the third aspect.

[0014] The light-emitting assembly, the preparation method thereof, the display device and the electronic device provided by the embodiments of the present application comprise: a rigid island array, a first elastic layer and a second elastic layer; the second elastic layer is fixed on the first elastic layer; the rigid island array is arranged on the second elastic layer, and the rigid island array is used for arranging a light-emitting unit; and the Young's modulus of the second elastic layer is lower than that of the first elastic layer. In this way, the rigid island array is arranged on the substrate composed of two elastic layers, the elasticity of the second elastic layer with a lower Young's modulus is higher, the demand of the stretching process is met, the stress generated by the stretching action on the substrate is released, the elasticity of the first elastic layer with a higher Young's modulus is lower, the production and use of the second elastic layer which is too soft are avoided, the mechanical integrity of the light-emitting assembly can be maintained in the manufacturing and using process, and the reliability of the stretchable light-emitting assembly is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] The accompanying drawings, which are included to provide a further understanding of the present application, form a part of the present application and illustrate the illustrative embodiments of the present application and its description are used to explain the present application and do not constitute improper limitations to the present application. In the drawings:

[0016] Figure 1 is a structural schematic diagram of a light-emitting assembly provided by the embodiments of the present application;

[0017] Figure 2 is a structural schematic diagram of a rigid island array provided by the embodiments of the present application;

[0018] Figure 3 is a structural schematic diagram of a light emitting assembly provided by an embodiment of the present application.

[0019] Figure 4 is a flowchart of a light emitting assembly preparation method provided by an embodiment of the present application.

[0020] Figure 5 is a structural schematic diagram of a light emitting assembly provided by an embodiment of the present application.

[0021] Legend of Reference Signs

[0022] 1, rigid island array; 2, first elastic layer; 3, second elastic layer; 4, light emitting unit; 11, rigid island unit; 12, connecting structure. DETAILED DESCRIPTION

[0023] In order to make the personnel in the art better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor should fall within the scope of protection of the present application. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0024] It should be noted that the terms "first", "second", and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0025] The present embodiment provides a light emitting assembly, Figure 1 is a structural schematic diagram of a light emitting assembly provided by an embodiment of the present application. As Figure 1 shown, the light emitting assembly can include: a rigid island array 1, a first elastic layer 2 and a second elastic layer 3.

[0026] The second elastic layer 3 is fixed on the first elastic layer 2; the rigid island array 1 is arranged on the second elastic layer 3, and the rigid island array 1 is used for arranging light emitting units; and the Young's modulus of the second elastic layer 3 is lower than the Young's modulus of the first elastic layer 2.

[0027] In an embodiment, the light emitting assembly can be applied to display devices such as display panels of various electronic devices, and the electronic devices can be wearable electronic devices with stretchable effect and the like. The first elastic layer 2 and the second elastic layer 3 can constitute a substrate of the light emitting assembly, and the rigid island array 1 is fixed on the substrate and used for arranging light emitting units 4.

[0028] Here, the Young's modulus of the rigid island array 1 is higher than the Young's modulus of the first elastic layer 2, that is, the elasticity of the rigid island array 1 is the worst, or the rigidity is the best. Here, the light emitting units 4 can be organic electroluminescence displays (OLED) and the like.

[0029] In an embodiment, the material of the rigid island array 1 can be photoresist, such as epoxy-based photoresist (SU-8) and the like. In addition, the Young's modulus of the rigid island array 1 is greater than the Young's modulus of the first elastic layer 2 and greater than the Young's modulus of the second elastic layer 3. For example, the material of the first elastic layer 2 can be polydimethylsiloxane (PDMS), and the material of the second elastic layer 3 can be organic silicon elastomer material and the like.

[0030] In an embodiment, the thickness of the second elastic layer 3 can be the same as the thickness of the first elastic layer 2.

[0031] In another embodiment, the thickness of the second elastic layer 3 can be different from the thickness of the first elastic layer 2. For example, the thickness of the second elastic layer 3 can be related to at least one of the thickness of the rigid island array 1, the Young's modulus of the rigid island array 1, the thickness of the first elastic layer 2, the Young's modulus of the second elastic layer 3, and the Young's modulus of the first elastic layer 2.

[0032] In an embodiment, the thickness of the first elastic layer 2 can be related to at least one of the thickness of the rigid island array 1, the Young's modulus of the rigid island array 1, the thickness of the first elastic layer 2, the Young's modulus of the second elastic layer 3, and the Young's modulus of the first elastic layer 2.

[0033] In one embodiment, the difference between the Young's modulus of the first elastic layer 2 and the Young's modulus of the rigid island array 1 can be greater than a first threshold value, so that the elasticity of the first elastic layer 2 is much higher than the rigid island array 1, and it is easy to stretch. Preferably, the Young's modulus of the first elastic layer 2 can also be higher than a preset lower limit value, which can be a lower limit value for the first elastic layer 2 to be used to eliminate stress, so that the Young's modulus value of the first elastic layer 2 is not low enough to work as a stress relief layer to maintain the mechanical integrity of the light-emitting component.

[0034] In one embodiment, the difference between the Young's modulus of the second elastic layer 3 and the Young's modulus of the first elastic layer 2 can be greater than a second threshold value, so that the second elastic layer 3 can have sufficient elasticity to eliminate the stress acting on the first elastic layer 2 during the stretching process, improving the stretching effect.

[0035] In one embodiment, the upper surface of the second elastic layer 3 is arranged with the rigid island array 1, and the lower surface of the second elastic layer 3 is fixed to the upper surface of the first elastic layer 2. Among them, the rigid island array 1 can be embedded in the second elastic layer 3 from the upper surface of the second elastic layer 3.

[0036] In this way, the rigid island array 1 is arranged on the substrate composed of two elastic layers, which can be based on the second elastic layer 3 with a lower Young's modulus and higher elasticity to meet the needs of the stretching process and better release the stress generated by the stretching action on the substrate, and based on the first elastic layer 2 with a higher Young's modulus and lower elasticity to avoid the situation that the rigid island is easy to fall off or unstable due to the second elastic layer 3 being too soft, and to maintain the mechanical integrity of the light-emitting component during manufacturing and use, thereby improving the reliability of the stretchable light-emitting component.

[0037] The rigid island array 1 bears a certain stress and deformation during the stretching process, and needs to ensure the stable connection and light-emitting reliability of the rigid island array 1 during the stretching process. Therefore, in some embodiments, as shown in Figure 2 The rigid island array 1 can include a plurality of rigid island units 11 and a connection structure 12; the connection structure 12 is S-shaped;

[0038] Two of the rigid island units 11 are connected by one connection structure 12.

[0039] In one embodiment, a plurality of rigid island units 11 can be arranged in a rectangular array.

[0040] In one embodiment, two of the rigid island units 11 are connected by one connection structure 12, which can mean that two adjacent rigid island units 11 of the rigid island array 1 are connected by one connection structure 12.

[0041] In one embodiment, two of the rigid island units 11 are connected by a connecting structure 12, which can include: every two adjacent rigid island units 11 in the rigid island array 1 in the longitudinal direction are connected by a connecting structure 12, and / or every two adjacent rigid island units 11 in the rigid island array 1 in the transverse direction are connected by a connecting structure 12.

[0042] In one embodiment, the connecting structure 12 is S-shaped, and the shape and size of all connecting structures 12 in the rigid island array 1 are the same.

[0043] In one embodiment, the thickness of the rigid island array 1, i.e. the thickness of each rigid island unit 11, can be 15 μm, where the thickness can refer to the thickness in the up-down direction. The width of the connecting structure 12 can be 100 μm.

[0044] In one embodiment, the size of the rigid island unit 11 can be 4 mm x 4 mm, i.e. the length and width are both 4 mm.

[0045] In this way, the rigid island units 11 are connected by the S-shaped connecting structure 12 to form the rigid island array 1, which can better withstand the stress generated in all directions during the stretching process. At this time, the second elastic layer 3 makes it easier to adapt to the vertical movement of the "S" shaped connecting structure 12 associated with 3D deformation (e.g. twisting or bending).

[0046] Since the light emitting units 4 are densely arranged on the plurality of rigid island units 11 of the rigid island array 1, it is necessary to avoid crosstalk caused by unclear active area boundary during deposition of the light emitting units 4 to improve light emitting stability. Therefore, in some embodiments, as shown in Figure 3 The light emitting assembly further comprises: a light emitting unit 4; at least one light emitting unit 4 is arranged on one of the rigid island units 11.

[0047] The rigid island unit 11 is in a trapezoidal structure, and the short base of the rigid island unit 11 is close to the second elastic layer 3, and the long base of the rigid island unit 11 is away from the second elastic layer 3; the light emitting unit 4 is arranged on the long base of the rigid island unit 11.

[0048] Here, the rigid island unit 11 in a trapezoidal structure can refer to the cross section of the rigid island unit 11 being in a trapezoidal structure, and the cross section can refer to the cross section in the up-down direction.

[0049] In one embodiment, the central axis of the rigid island unit 11 in a trapezoidal structure can be perpendicular to the upper surface of the second elastic layer 3. Wherein, the central axis is the central axis of the trapezoidal structure which is mirror symmetric. That is, the short base and the long base of the rigid island unit 11 in a trapezoidal structure are parallel to the upper surface of the second elastic layer 3.

[0050] In one embodiment, the short bottom edge of the trapezoidal structure of the rigid island unit 11 is attached to the second elastic layer 3, for example, the short bottom edge of the trapezoidal structure of the rigid island unit 11 is attached to the upper surface of the second elastic layer 3.

[0051] In one embodiment, the rigid island array 1 can further comprise a fixing structure, each rigid island unit 11 is fixed to the second elastic layer 3 by a fixing structure. For example, the fixing structure is embedded into the second elastic layer 3 from the upper surface of the second elastic layer 3, and the rigid island unit 11 is fixed on the fixing structure.

[0052] In one embodiment, at least one light emitting unit 4 is disposed on one of the rigid island units 11, and the light emitting unit 4 is deposited in the rigid island unit 11.

[0053] In one embodiment, the width of the light emitting unit 4 is greater than the length of the short bottom edge of the trapezoidal structure of the rigid island unit 11, and less than the length of the long bottom edge of the trapezoidal structure of the rigid island unit 11, so that the light emitting unit 4 can be embedded in the middle of the trapezoidal structure, avoiding being deposited on the top or bottom of the rigid island unit 11 to cause mutual crosstalk.

[0054] In one embodiment, the taper angle of the trapezoidal structure of the rigid island unit 11 can be 50°, and the thickness can be 15 μm.

[0055] In this way, the discontinuity between the thin layer deposited on the surface of the rigid island unit 11 and the thin layer deposited on the surface of the second elastic body is provided by the inverted trapezoidal structure, so that the light emitting unit 4 can be deposited to have a well-defined active region, reducing the occurrence of crosstalk.

[0056] In some embodiments, the material of the rigid island unit 11 is the same as the material of the connecting structure 12; and the connecting structure 12 is used for depositing metal material to form electrical connection between the rigid island units 11.

[0057] Here, the material of the rigid island unit 11 and the connecting structure 12 can be photoresist such as SU-8 and the like.

[0058] In one embodiment, the connecting structure 12 is used for depositing metal material to form an organic layer and an electrode layer.

[0059] In one embodiment, the light emitting unit 4, the organic layer and the electrode layer are disposed on the rigid island unit 11, and the organic layer on the rigid island unit 11 is the same as the organic layer on the connecting structure 12, and the electrode layer on the rigid island unit 11 is the same as the electrode layer on the connecting structure 12.

[0060] In one embodiment, the thickness of the connecting structure 12 and the thickness of the deposited metal material can be determined according to the material of the rigid island unit 11 and / or the light emitting unit 4.

[0061] In this way, by arranging the rigid island unit 11 and the connecting structure 12 of the same material, the metal connecting region formed on the connecting structure 12 can have the same electroluminescent performance as the light emitting unit 4 on the rigid island unit 11, thereby improving the light emitting effect.

[0062] In some embodiments, the Young's modulus of the first elastic layer 2 is lower than the Young's modulus of the rigid island array 1, and the Young's modulus of the first elastic layer 2 is higher than a preset lower limit value; the Young's modulus of the second elastic layer 3 is lower than the preset lower limit value.

[0063] Here, the preset lower limit value can be a lower limit value at which the first elastic layer 2 can be used to eliminate stress, so that the Young's modulus value of the first elastic layer 2 is not low enough to make the first elastic layer 2 work as a stress elimination layer to maintain the mechanical integrity of the light emitting assembly.

[0064] In one embodiment, the difference between the Young's modulus of the first elastic layer 2 and the Young's modulus of the rigid island array 1 can be greater than a first threshold value, so that the elasticity of the first elastic layer 2 is much higher than that of the rigid island array 1, and the first elastic layer 2 is easy to stretch.

[0065] In one embodiment, the difference between the Young's modulus of the second elastic layer 3 and the Young's modulus of the first elastic layer 2 can be greater than a second threshold value, so that the second elastic layer 3 can have sufficient elasticity to eliminate the stress acting on the first elastic layer 2 during the stretching process, thereby improving the stretching effect.

[0066] In one embodiment, the Young's modulus of the first elastic layer 2 is lower than a preset upper limit value, and the preset upper limit value is greater than the preset lower limit value and less than the Young's modulus of the rigid island array 1. Here, the preset upper limit value can be an upper limit value at which the first elastic layer 2 can have the required elasticity during the stretching process, so that the first elastic layer 2 can still have a certain elasticity to meet the basic requirements of the stretching process.

[0067] In this way, on the basis of maintaining a certain elasticity, the Young's modulus of the first elastic layer 2 will not be too low, ensuring that the first elastic layer 2 will not work as a stress elimination layer like the second elastic layer 3, so that the first elastic layer 2 can maintain the mechanical integrity of the light emitting assembly during the stretching process.

[0068] In some embodiments, the material of the first elastic layer 2 is polydimethylsiloxane (PDMS), and the material of the second elastic layer 3 is an organic silicon elastomer material.

[0069] Here, the organic silicon elastomer material can be Silbione. Silbione can be obtained by mixing a base material and a curing agent at a certain mixing ratio and curing. By changing the ratio between the base material and the curing agent, the Young's modulus of the second elastic layer 3 can be adjusted.

[0070] In one embodiment, the material of the second elastic layer 3 can also have viscosity, for example, the upper surface and the lower surface of the second elastic layer 3 have viscosity, and can be fixed on the first elastic layer 2 and the rigid island array 1 by bonding. In this way, the pattern of the rigid island array 1 is not easy to be separated. Thus, the pattern of the rigid island array 1 formed on the second elastic layer 3 will not delaminate when stretched and maintain the integrity of the pattern.

[0071] In this way, the first elastic layer 2 selects PDMS, and the second elastic layer 3 selects silicone elastomer material, which can maintain the elastic difference between the two layers, ensure the stretching effect and mechanical integrity, and the silicone elastomer material can have viscosity, thereby maintaining the stability of the arrangement of the rigid island array 1.

[0072] The embodiment provides a light-emitting component preparation method, which is used for preparing the light-emitting component described in any one or more of the preceding embodiments, Figure 4 is a flowchart of a light-emitting component preparation method provided by the embodiment. As shown in Figure 4 the method can comprise:

[0073] S10: determining the mixing ratio of the base material and the curing agent based on the required Young's modulus of the second elastic layer;

[0074] S20: mixing the base material and the curing agent based on the mixing ratio to obtain the second elastic layer;

[0075] S30: coating the second elastic layer on the first elastic layer;

[0076] S40: coating a photoresist layer on the second elastic layer;

[0077] S50: generating a rigid island array on the photoresist layer.

[0078] Here, the material of the second elastic layer 3 can be silicone elastomer material Silbione, the base material can be alkali, and the Young's modulus of the second elastic layer 3 generated based on different mixing ratios is different.

[0079] In one embodiment, before step S30, the method can further comprise: obtaining the first elastic layer 2 by film cutting and placing the first elastic layer 2 on a carrier glass substrate. The first elastic layer 2 can be PDMS, and the thickness of the first elastic layer 2 can be 250pm. The size of the carrier glass substrate can be 40mm x 40mm.

[0080] In one embodiment, in step S20, the method can comprise: mixing the base material and the curing agent based on the mixing ratio, and removing internal voids by vacuum treatment for a first time length to obtain the second elastic layer 3. The first time length can be 20 minutes, etc.

[0081] In one embodiment, the second elastic layer 3 can have a thickness of 400 pm. The step S30 can comprise spin-coating the second elastic layer 3 on the first elastic layer 2 at a first rotation speed. The first rotation speed can be 500 rpm, etc.

[0082] In one embodiment, before the step S40, the method can further comprise treating the first elastic layer 2 and the second elastic layer 3 by air plasma. For example, the first elastic layer 2 and the second elastic layer 3 can be treated by 70 W air plasma for 30 s.

[0083] In one embodiment, the step S40 can comprise spin-coating the photoresist layer on the second elastic layer 3 based on a second rotation speed. The second rotation speed can be 2000 rpm, etc.

[0084] In one embodiment, after the step S40 and before the step S50, the method can further comprise baking for a second duration. The second duration can be 60 s. The baking temperature can be 100 degrees Celsius, etc.

[0085] In one embodiment, after the step S50, the method can further comprise baking the light-emitting assembly in a vacuum oven at a predetermined temperature for a third duration to evaporate any residue. The predetermined temperature can be 60 °C, and the third duration can be 12 hours, etc.

[0086] In this way, by arranging the rigid island array 1 on the substrate composed of two elastic layers, the second elastic layer 3 with a lower Young’s modulus can be more elastic to meet the requirements of the stretching process and better release the stress generated by the stretching action on the substrate, and the first elastic layer 2 with a higher Young’s modulus can be less elastic to avoid the rigid islands from being easily detached or unstable due to the second elastic layer 3 being too soft, so that the mechanical integrity of the light-emitting assembly can be maintained during the manufacturing and use processes, thereby comprehensively improving the reliability of the stretchable light-emitting assembly.

[0087] In some embodiments, the step S50 can comprise:

[0088] covering the photoresist layer with a thin film mask to obtain a pattern of the rigid island array 1;

[0089] obtaining the rigid island array 1 through developing and etching operations.

[0090] In one embodiment, covering the photoresist layer with a thin film mask to obtain a pattern of the rigid island array 1 can comprise covering the photoresist layer with a thin film mask and exposing it to ultraviolet light for a fourth duration to obtain a pattern of the rigid island array 1. The fourth duration can be 12 s, etc.

[0091] In one embodiment, before the rigid island array 1 is obtained by the developing and etching operation, the method can further comprise: baking the photoresist by a hot plate for a fifth time length. For example, the hot plate temperature can be 80℃, and the fifth time length can be 60s, etc.

[0092] In one embodiment, the rigid island array 1 can be obtained by the developing and etching operation, which can comprise: developing the photoresist by a developing agent for a sixth time length, and rinsing the rigid island array 1 by isopropyl alcohol. Wherein, the sixth time length can be 60s, etc.

[0093] In this way, the mask box developing and etching on the photoresist SU-8 can quickly and accurately obtain the required rigid island array 1 pattern, and improve the manufacturing efficiency.

[0094] The embodiments of the present application also provide a display device, which comprises the light emitting assembly according to any one or more of the preceding embodiments.

[0095] Here, the display device can be a display panel, a display array, a display module, etc.

[0096] The embodiments of the present application also provide an electronic device, which comprises the display device.

[0097] As a possible implementation, a light emitting assembly is provided, which comprises a mixed stretchable platform, and a partial schematic view of the light emitting assembly is shown in Figure 5 The bottom layer adopts a popular elastomer material, such as polydimethylsiloxane (PDMS). On the top of the bottom layer, a kind of silicon elastomer material is deposited by spin casting, which is called "Silbione", a very soft material. Silbione is formed by curing two liquid components (referred to as "base" and "curing agent", respectively) after mixing at room temperature. By changing the ratio between the base and the curing agent, the Young's modulus can be adjusted. Therefore, Silbione can be compatible with the photolithography process, so that a rigid island array and a base structure can be formed on the top thereof. The rigid island array generally uses a photoresist, such as SU-8.

[0098] The whole system is composed of three different regions with different values of Young's modulus: high value for SU-8, intermediate value for PDMS and very low value for Silbione. On one hand, the value of Young's modulus of PDMS is much lower than that of SU-8, making PDMS elastic and thus easily stretchable; on the other hand, the value of Young's modulus of PDMS is not low enough for PDMS to work as a stress-relief layer. In addition, Silbione is not recommended to be used as a standalone substrate because of its high flexibility, which makes it very difficult to handle during fabrication and use. The bottom PDMS keeps the mechanical integrity of the whole system during fabrication and operation; while the upper Silbione layer significantly reduces the stress applied to the rigid islands during stretching. Moreover, Silbione makes it easier to accommodate the vertical movement of the "S" shaped interconnect structure associated with 3D deformation (e.g. twisting or buckling). Another function of Silbione is to work like an adhesive so that the SU-8 pattern is not easily separated from the substrate. Without the Silbione interlayer, the SU-8 pattern formed directly on PDMS will delaminate severely when stretched; while the SU-8 pattern formed on the Silbione-coated PDMS does not delaminate when stretched and keeps the integrity of the pattern.

[0099] The rigid islands and "S" shaped interconnect structures are formed by photolithographic patterning of SU-8, which is about 15 μιη thick. The "S" shaped interconnect material can be chosen as a similar photoresist as SU-8, considering the elasticity of the "S" shaped interconnect material and the stress to connect the rigid islands, the width of which is about 100 μιη. The size of a single SU-8 rigid island is 4 mm x 4 mm. In theory, it can be further reduced in size because the SU-8 pattern can be photolithographically formed in the scale of several microns. However, considering the size of the current interconnect structure and the practical reasonable size of a single island, the size of the rigid island is 4 mm x 4 mm is more appropriate.

[0100] In the sample based on Silbione with high modulus, the deformation is not only limited in the vertical direction, but also in the stretching direction. This lateral limitation tends to cause stress concentration at the boundary between the interconnect and the rigid island. Due to this stress concentration, interconnect failure can occur even at a relatively short stretching length. On the other hand, if Silbione with low modulus is used, the interconnect is uniformly stretched in the tension direction and easily deformed even in the vertical direction, so that the stress applied to the stretched interconnect remains minimal. In addition, since the "S" shaped interconnect is made of similar SU-8 material and has the same organic layer and electrode layer on top, the area on the interconnect emits electroluminescence with the same performance as the OLED on the SU-8 island.

[0101] A stretchable OLED was fabricated by depositing metal electrode layers and organic layers thereon. Silbione with a low Young's modulus was used for the stress relief layer. SU-8 is a negative photoresist, and the cross-section of a UV-cured and developed SU-8 pattern is a reverse-trapezoidal structure with a taper angle of ~50° and a thickness of ~15 μm. This thick reverse-trapezoidal structure provides discontinuity between the thin layers deposited on the SU-8 surface and the thin layers deposited on the Silbione surface when the thin films of the OLED are deposited on the platform by vacuum thermal evaporation, even if they are deposited simultaneously. Using this discontinuity, the organic layers as well as the metal thin films for electrodes, fine-patterned interconnects and contact pads can be deposited with well-defined active areas and without the occurrence of cross-talk between adjacent pixels even without a high-precision alignment of shadow masks.

[0102] In summary, a hybrid stretchable structure composed of a double-layer elastic structure and an array of rigid islands. The rigid island structure of SU-8 photoresist and the island-bridge interconnect structure were deposited with OLED layers and metal interconnect layers, respectively. In the double-layer elastic structure, the bottom layer was a PDMS elastomer substrate, which determined the overall stretchability of the system while maintaining its mechanical integrity; the top layer was a silicone elastomer (Silbione), which had an ultra-low Young's modulus and could serve as a stress relief layer, greatly reducing the stress exerted on the rigid islands and connecting lines on top of it. The stretchable OLED could withstand repeated stretching cycles and was compatible with typical multilayer structures composed of conventional thermal evaporation materials. At the same time, it exhibited comparable optoelectronic performance to rigid devices.

[0103] Those skilled in the art can clearly understand the method according to the above-mentioned embodiments can be realized by means of software and the necessary general hardware platform, of course, can also be realized by hardware, but in many cases, the former is a better embodiment. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes a plurality of instructions for making a terminal device (which can be a mobile phone, computer, server, or network device, etc.) execute the method described in each embodiment of the present application.

[0104] The above only describes the preferred embodiments of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0105] The foregoing detailed description of the application has been presented for purposes of illustration and description. Various modifications and changes can be made to these embodiments without departing from the spirit and scope of the application. It is intended that the scope of the application should not be limited by the particular representative embodiments described above.

Claims

1. A light emitting assembly, characterized by The application relates to a light-emitting assembly and a display device. The light-emitting assembly comprises a rigid island array, a first elastic layer and a second elastic layer. The second elastic layer is fixed on the first elastic layer. The rigid island array is arranged on the second elastic layer, and the rigid island array is used for arranging light-emitting units; the Young's modulus of the second elastic layer is lower than that of the first elastic layer.

2. The light emitting assembly of claim 1, wherein, The rigid island array comprises a plurality of rigid island units and a connecting structure; the connecting structure is S-shaped. Two rigid island units are connected by a connecting structure.

3. The light emitting assembly of claim 2, wherein, The light-emitting assembly further comprises light-emitting units; at least one light-emitting unit is arranged on one rigid island unit. The rigid island unit is in a trapezoidal structure, the short bottom edge of the rigid island unit is close to the second elastic layer, the long bottom edge of the rigid island unit is far away from the second elastic layer, and the light-emitting unit is arranged on the long bottom edge of the rigid island unit.

4. The light emitting assembly of claim 2, wherein, The rigid island unit and the connecting structure are made of the same material. The connecting structure is used for depositing metal materials to form electrical connections between the rigid island units.

5. The light emitting assembly of claim 1, wherein, The Young's modulus of the first elastic layer is lower than that of the rigid island array, and the Young's modulus of the first elastic layer is higher than a preset lower limit value; the Young's modulus of the second elastic layer is lower than the preset lower limit value.

6. The light emitting assembly of claim 1, wherein, The material of the first elastic layer is polydimethylsiloxane (PDMS), and the material of the second elastic layer is an organic silicon elastomer material.

7. A method for producing a light emitting component according to any one of claims 1 to 6, characterized in that The method comprises the following steps. A mixing ratio of a base material and a curing agent is determined based on the required Young's modulus of the second elastic layer. The base material and the curing agent are mixed based on the mixing ratio to obtain the second elastic layer. The second elastic layer is coated on the first elastic layer. A photoresist layer is coated on the second elastic layer. A rigid island array is generated on the photoresist layer.

8. The method of claim 7, wherein the step of forming the light emitting assembly comprises the step of: The generation of the rigid island array on the photoresist layer comprises the following steps. ​ A pattern of the rigid island array is obtained on the photoresist layer based on a thin film mask. The rigid island array is obtained through developing and etching operations.

9. A display device, characterized by The display device comprises the light-emitting assembly according to any one of claims 1 to 6.

10. An electronic device, comprising: The electronic equipment comprises the display device according to claim 9.

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