Combined still and fan-coil unit and control method

Abstract

The present disclosure provides a combined device, a fan coil and a control method. The ventilation pipeline of the combined device is provided with a semiconductor device, a purification device and a filter, and the hot end of the semiconductor device is contactly installed with the filter. When the filter is high-temperature inactivated in the self-cleaning mode, the semiconductor device is powered on to enter the running state. In this case, the hot end of the semiconductor device high-temperature inactivates the filter to realize self-cleaning. Meanwhile, after the gas passes through the hot end, it needs to pass through the cold end of the semiconductor device before being discharged. The gas high-temperature disinfected by the hot end can be reduced to the original indoor return air temperature, which can well solve the problem of overheating of the supply air after passing through the filter in the combined device, reduce the redundancy of the combined device due to the need to absorb inactivated heat, save the energy consumption of the combined device to absorb waste heat, and improve the energy efficiency of the combined device.

Description

Technical Field

[0001] This disclosure relates to the field of fan coil unit technology, and in particular to a combination of emergency and emergency response equipment, a fan coil unit, and a control method. Background Technology

[0002] With the continuous growth of global healthcare needs and the frequent occurrence of public health emergencies, medical institutions are facing increasingly complex challenges. Against this backdrop, the concept of "universal / emergency integration" has gradually become an important direction for the development of medical equipment. "Universal / emergency integration equipment" refers to medical equipment that can be used routinely in daily medical work while also possessing the ability to quickly respond to and address public health emergencies, major disasters, or urgent medical needs.

[0003] In medical wards, fan coil units not only regulate air temperature and humidity but also ensure room ventilation and disinfection. When fan coil units are combined with purification equipment, a dual-use system with disinfection capabilities is created, usable in both normal and emergency situations. This type of purification equipment typically achieves this through three functions: plasma purification, high-efficiency filters, and high-temperature inactivation. In self-cleaning mode, after high-temperature inactivation, the heat used for inactivation needs to be absorbed by cooling equipment to cool the supplied air to the target indoor temperature. This involves significant energy consumption. In the context of energy conservation and carbon reduction, the characteristics of this type of purification equipment conflict with indoor environmental control requirements, necessitating a solution. Summary of the Invention

[0004] In view of this, in order to solve the technical problem of large energy consumption in the self-cleaning mode of the existing emergency-normal combined equipment, this disclosure provides an emergency-normal combined equipment, a fan coil unit and a control method.

[0005] According to a first aspect of the present disclosure, a combined emergency and non-emergency device is provided. The combined emergency and non-emergency device includes at least one ventilation duct. A semiconductor device, a purification device, and a filter are disposed in the ventilation duct. The filter is located between the purification device and the semiconductor device. The purification device is close to the air inlet side of the combined emergency and non-emergency device, and the semiconductor device is close to the air outlet side of the combined emergency and non-emergency device. The semiconductor device includes a thermoelectric cooling semiconductor, a cold end, and a hot end. The thermoelectric cooling semiconductor is located between the cold end and the hot end, and the hot end is disposed in close contact with the filter.

[0006] In one alternative implementation, The cross-sectional structure of the cold end and the hot end, which are perpendicular to the axial direction of the ventilation duct, is a striped or mesh structure.

[0007] In one alternative implementation, The thermoelectric cooling semiconductor includes a symmetrical structure composed of N-type and P-type semiconductors.

[0008] In one alternative implementation, The semiconductor device is detachably connected to the ventilation duct.

[0009] In one alternative implementation, The purification device is detachably connected to the ventilation duct.

[0010] In one alternative implementation, The filter includes a high-efficiency filter.

[0011] In one alternative implementation, A surface cooler is installed inside the ventilation duct, and the surface cooler is located on the side of the cold end away from the hot end.

[0012] In one alternative implementation, A fan is installed inside the ventilation duct, and the fan is located on the side of the surface cooler away from the cold end.

[0013] In one alternative implementation, The emergency / normal combined equipment includes at least two ventilation ducts. When the purification device in the ventilation duct has a cleaning requirement, the at least two ventilation ducts alternately operate in a usage mode and a self-cleaning mode. In the ventilation duct of the time-use mode, the semiconductor device is in a closed state; in the ventilation duct of the self-cleaning mode, the semiconductor device is in an operating state.

[0014] According to a second aspect of the present disclosure, a fan coil unit is provided, the fan coil unit including the emergency / emergency combination device as described in any of the first aspects.

[0015] According to a third aspect of the present disclosure, a control method is provided, the control method being applied to a combined emergency and emergency response device as described in any of the first aspects, the emergency and emergency response device including at least one ventilation duct, the control method comprising: When the ventilation duct is in self-cleaning mode, the semiconductor device inside the ventilation duct is controlled to be in operation. When the ventilation duct is in use mode, the semiconductor device inside the ventilation duct is controlled to be in a closed state.

[0016] In one alternative implementation, The control method includes: When the semiconductor device inside the ventilation duct is in operation, the current of the semiconductor device is controlled according to the temperature of the filter inside the ventilation duct.

[0017] In one alternative implementation, The step of controlling the input current of the semiconductor device based on the temperature of the filter in the ventilation duct includes: If the temperature of the filter is lower than the set temperature, the current supplied to the semiconductor device is increased until the temperature of the filter is greater than or equal to the set temperature. If the temperature of the filter is greater than or equal to the set temperature for a set duration, the semiconductor device is controlled to be in a closed state to shut down the self-cleaning mode of the ventilation duct.

[0018] In one alternative implementation, The emergency-rest combination device includes at least two of the ventilation pipes, and the control method includes: When at least two of the ventilation ducts have a self-cleaning requirement, the at least two ventilation ducts are controlled to alternate between the self-cleaning mode and the time-use mode.

[0019] In one alternative implementation, The control method includes: When the ventilation duct is in the time-use mode, the operating frequency of the fan in the ventilation duct is controlled according to the gas temperature on the downstream side of the surface cooler in the ventilation duct.

[0020] In one alternative implementation, The step of controlling the operating frequency of the fan in the ventilation duct based on the gas temperature downstream of the surface cooler in the ventilation duct includes: If the gas temperature downstream of the surface cooler is greater than or equal to the sum of the target temperature and the first set temperature difference, then the operating frequency of the fan is increased until the operating frequency of the fan reaches the maximum allowable value. After the operating frequency of the fan reaches the maximum allowable value, if the gas temperature downstream of the surface cooler is still greater than or equal to the sum of the target temperature and the first set temperature difference, the opening of the regulating valve upstream of the surface cooler is increased until the opening of the regulating valve reaches the maximum opening.

[0021] In one alternative implementation, The step of controlling the operating frequency of the fan in the ventilation duct based on the gas temperature downstream of the surface cooler in the ventilation duct includes: If the gas temperature downstream of the surface cooler is less than or equal to the difference between the target temperature and the second set temperature difference, then the operating frequency of the fan is reduced.

[0022] In one alternative implementation, The step of controlling the operating frequency of the fan in the ventilation duct based on the gas temperature downstream of the surface cooler in the ventilation duct includes: At set intervals, the operating frequency of the fan in the ventilation duct is adjusted once based on the gas temperature downstream of the surface cooler in the ventilation duct.

[0023] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: In this disclosure, a semiconductor device, a purification device, and a filter are installed in the ventilation duct of the emergency-normal combined equipment. The hot end of the semiconductor device is installed in contact with the filter. When the filter is sterilized at high temperature in self-cleaning mode, the semiconductor device can be energized to put it into operation. In this case, the hot end of the semiconductor device sterilizes the filter at high temperature to achieve self-cleaning. At the same time, after the gas passes through the hot end, it needs to pass through the cold end of the semiconductor device before it is discharged. This can reduce the gas sterilized at high temperature by reducing it to the original indoor return air temperature. This can effectively solve the problem of overheating of the air supplied after passing through the filter in the emergency-normal combined equipment, reduce the redundancy required by the emergency-normal combined equipment to absorb the heat of sterilization, save the energy consumption of the emergency-normal combined equipment to absorb waste heat, and improve the energy efficiency of the emergency-normal combined equipment.

[0024] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0028] Figure 1 This is a schematic diagram of an emergency-emergency combination device according to an exemplary embodiment.

[0029] Figure 2 This is a schematic cross-sectional view of the cold end according to an exemplary embodiment.

[0030] Figure 3 This is a schematic diagram of an emergency-emergency combination device according to another exemplary embodiment. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] The following disclosure provides numerous different embodiments or examples for implementing various aspects of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0033] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0034] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0035] The embodiments of this application will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be understood that the preferred embodiments are only for illustrating this application and are not intended to limit the scope of protection of this application.

[0036] To address the technical problem that existing emergency-cooling combined equipment consumes a large amount of energy and temporarily loses its cooling and purification functions in self-cleaning mode, this disclosure provides an emergency-cooling combined equipment, a fan coil unit, and a control method.

[0037] In this disclosure, a semiconductor device, a purification device, and a filter are installed inside the ventilation duct of the emergency-normal combined equipment. The hot end of the semiconductor device is installed in contact with the filter. When the filter is initiating high-temperature inactivation in self-cleaning mode, the semiconductor device can be energized to put it into operation. In this case, the hot end of the semiconductor device inactivates the filter at high temperature, achieving self-cleaning. At the same time, after passing through the hot end, the gas needs to pass through the cold end of the semiconductor device before being discharged. This can reduce the temperature of the gas that has been sterilized at high temperature to the original indoor return air temperature. This can effectively solve the problem of overheating of the incoming air after passing through the filter in the emergency-normal combined equipment, reduce the redundancy required by the emergency-normal combined equipment to absorb the heat of inactivation, save the energy consumption of the emergency-normal combined equipment to absorb waste heat, and improve the energy efficiency of the emergency-normal combined equipment.

[0038] In one exemplary embodiment, reference Figures 1 to 3 As shown, an emergency-normal combined device, a fan coil unit 5, and a control method for the emergency-normal combined device are provided. The emergency-normal combined device includes at least one ventilation duct 10, within which a semiconductor device 1, a purification device 2, and a filter 3 are installed. The filter 3 can be a high-efficiency filter, a medium-efficiency filter, or other types of filters, selected according to actual needs, and is not limited thereto.

[0039] High-efficiency filters (HEPA) are filter media specifically designed to efficiently trap submicron-sized particles in the air. They can be made of glass fiber or synthetic fiber materials, using HEPA (High-Efficiency Particulate Air) or ULPA (Ultra-Low Penetration Air) filters. Their purpose is to significantly improve the interception efficiency of pathogen particles with a diameter of 0.3 micrometers, thereby effectively removing viruses and bacteria during sudden high-pollution events and ensuring the reliability of air purification functions. They can be installed in hospital wards with high air quality requirements. Medium-efficiency filters have a filtration efficiency between pre-filters and HEPA filters, primarily capturing particles with a diameter of 1-10 micrometers (such as mold spores, some dust, and smoke).

[0040] The filter 3 is located between the purification device 2 and the semiconductor device 1. The purification device 2 is close to the air inlet side of the emergency-normal combined device, and the semiconductor device 1 is close to the air outlet side of the emergency-normal combined device. That is, the gas passes through the purification device 2, the filter 3, and the semiconductor device 1 in sequence in the emergency-normal combined device before being discharged.

[0041] The purification device 2 includes, but is not limited to, plasma purification technology, which can be flexibly combined according to needs. Plasma purification can be selected to decompose gaseous pollutants. Plasma purification technology ionizes gas into plasma through high-voltage discharge, radio frequency discharge, microwave discharge, etc. The active components in the plasma (such as free radicals, ozone, ultraviolet light, etc.) have extremely strong oxidizing and reactive properties, and can chemically react with pollutants in the air (such as volatile organic compounds (VOCs, i.e., carbon-containing compounds), bacteria, viruses, particulate matter, etc.), decomposing them into harmless or low-toxic substances, such as carbon dioxide, water, and inorganic salts, thereby achieving the purpose of purifying the air.

[0042] The purification device 2 and the semiconductor device 1 are detachably connected to the ventilation duct 10 to facilitate their installation and maintenance. For example, the purification device 2 and the semiconductor device 1 can be detachably connected to the ventilation duct 10 via a snap-fit ​​mechanism. Alternatively, the semiconductor device 1 can be detachably connected to the ventilation duct 10 via a snap-fit ​​mechanism, and the purification device 2 can also be detachably connected to the semiconductor device 1 via a snap-fit ​​mechanism, thus indirectly achieving a detachable connection between the purification device 2 and the ventilation duct 10. Of course, other methods can also be used to achieve the detachable connection between the purification device 2 and the semiconductor device 1 and the ventilation duct 10; this is not limited.

[0043] The semiconductor device 1 includes a thermoelectric cooling semiconductor 13, a cold end 11, and a hot end 12. The thermoelectric cooling semiconductor 13 is located between the cold end 11 and the hot end 12, and the hot end 12 is disposed in close contact with the filter 3. That is, the high-temperature side of the semiconductor device 1 is installed in contact with the filter 3 to facilitate high-temperature inactivation of the filter 3, thereby eliminating microorganisms in the filter 3 and cleaning the filter 3.

[0044] The semiconductor device 1 can be manufactured based on the Peltier effect in thermoelectric effects. The thermoelectric cooling semiconductor 13 includes a symmetrical structure composed of N-type and P-type semiconductors. When an N-type semiconductor and a P-type semiconductor are connected to form an electrical couple, energy transfer occurs when a direct current is applied to this circuit. The junction where the current flows from the N-type semiconductor to the P-type semiconductor absorbs heat, becoming the cold junction 11; the junction where the current flows from the P-type semiconductor to the N-type semiconductor releases heat, becoming the hot junction 12. The magnitude of heat absorption and release is determined by the magnitude of the current and the number of element pairs in the N and P semiconductors.

[0045] It should be noted that the cold end 11 and hot end 12 in semiconductor device 1 are determined by the direction of the current and the arrangement of the P / N type semiconductors. Cold end 11 (heat absorption end 12): When the current flows from the N-type semiconductor to the P-type semiconductor, the interface absorbs heat (cooling). Hot end 12 (heat release end 12): When the current flows from the P-type semiconductor to the N-type semiconductor, the interface releases heat (heating).

[0046] In the semiconductor device 1, the cold end 11 and the hot end 12 have a cross-sectional structure perpendicular to the axial direction of the ventilation pipe 10, which is a striped or mesh structure. That is, the cross-section of the semiconductor device 1 can be constructed as a striped or mesh structure to ensure that gas can pass through the semiconductor device 1 unimpeded.

[0047] The ventilation duct 10 may also be equipped with a surface cooler 4, which is located on the side of the cold end 11 away from the hot end 12, that is, the surface cooler 4 is located on the downstream side of the cold end 11, and is used to cool the gas after passing through the semiconductor device 1.

[0048] The ventilation duct 10 may also be equipped with a fan 5, which is located on the side of the surface cooler 4 away from the cold end 11, that is, the fan 5 is located on the downstream side of the surface cooler 4, and is used to drive the gas in the ventilation duct 10 to be transmitted from the inlet side to the outlet side.

[0049] In this embodiment of the emergency-normal combined equipment, the purification device 2 and the filter 3 are responsible for purifying the indoor return air. The purification device 2 can perform plasma purification, while the filter 3 performs filtration purification. The semiconductor device 1 uses direct current to achieve heating and cooling. The hot end 12, which is in contact with the filter 3, sterilizes the filter 3 at high temperature, achieving self-cleaning of the equipment. The cold end 11 cools the purified return air, saving energy consumption for the emergency-normal combined equipment to dissipate waste heat and ensuring that the intake air temperature of the fan 5 is within a safe range. The thermoelectric cooling semiconductor 13 and its hot and cold ends 12 are designed with a striped or mesh structure to avoid excessive resistance caused by blocking the gas passage, thus avoiding increasing the power of the fan 5 and further saving energy. When the emergency-normal combined equipment is in self-cleaning mode, the corresponding surface cooler 4 can be in a closed state to avoid condensation reducing heat exchange efficiency and causing water accumulation and bacterial contamination of the air. When the emergency-normal combined equipment is in use mode (including normal mode and emergency mode), the surface cooler 4 can be in an active state to provide cooling to the room. Fan 5 provides power for indoor ventilation and provides heat exchange medium for cooling. It should be noted that "emergency mode" can refer to an emergency mode in the event of major pollution or virus spread, such as "epidemic mode," which is the mode in the event of an outbreak.

[0050] In this embodiment, when the ventilation duct 10 is in self-cleaning mode, the semiconductor device 1 inside the ventilation duct 10 is controlled to be in an operating state, thereby achieving high-temperature sterilization of the filter 3 through its hot end 12, realizing the self-cleaning of the equipment that combines normal and emergency cleaning, and the cold end 11 of the semiconductor device 1 can also prevent the temperature of the gas discharged from it from being too high. When the ventilation duct 10 is in a usage mode, the semiconductor device 1 inside the ventilation duct 10 is controlled to be in a closed state. At this time, the state of the purification device 2 and the filter 3 can be controlled as needed, and there is no limitation on this.

[0051] In this embodiment, the hot end 12 of the semiconductor device 1 is installed in contact with the filter 3. When the filter 3 is deactivated at high temperature in the self-cleaning mode, the semiconductor device 1 can be powered on to put it into operation. In this case, the hot end 12 of the semiconductor device 1 deactivates the filter 3 at high temperature to achieve self-cleaning. At the same time, after the gas passes through the hot end 12, it needs to pass through the cold end 11 of the semiconductor device 1 before it is discharged. This can reduce the gas that has been deactivated at high temperature by the hot end 12 to the original indoor return air temperature. This can effectively solve the problem of overheating of the air supplied after the air in the emergency-normal combined equipment passes through the filter 3. It reduces the redundancy required by the emergency-normal combined equipment to absorb the heat of deactivation, saves the energy consumption of the emergency-normal combined equipment to absorb the waste heat, and improves the energy efficiency of the emergency-normal combined equipment.

[0052] In one exemplary embodiment, reference Figures 1 to 3As shown, a combined emergency and emergency response device, a fan coil unit 5, and a control method for the combined emergency and emergency response device are provided. In this embodiment, when the semiconductor device 1 in the ventilation duct 10 is in operation, the current of the semiconductor device 1 is controlled according to the temperature of the filter 3 in the ventilation duct 10.

[0053] Among them, "the semiconductor device 1 in the ventilation duct 10 is in the operating state" means that the system triggers the control logic only when the self-cleaning mode is activated, and the operating status of the device can be detected in real time by the status monitoring module; "based on the temperature of the filter 3 in the ventilation duct 10" can be understood as using the temperature of the filter 3 as the core feedback parameter, which can be measured non-contactly by installing a thermocouple or an infrared thermometer on the surface of the filter 3; "controlling the current of the semiconductor device 1" specifically refers to dynamically managing the power by adjusting the input current, which can be achieved by using a PID controller or a fuzzy logic controller to realize continuous current regulation.

[0054] First, it is confirmed that the semiconductor device 1 is in operation. Then, the temperature data of the filter 3 is acquired in real time, and the current is dynamically adjusted based on the temperature value. If the temperature of the filter 3 is lower than the set temperature, the current connected to the semiconductor device 1 is increased until the temperature of the filter 3 is greater than or equal to the set temperature. If the duration after the temperature of the filter 3 is greater than or equal to the set temperature reaches the set duration, the semiconductor device 1 is controlled to be turned off to disable the self-cleaning mode of the ventilation duct 10.

[0055] The set temperature refers to the temperature threshold used to trigger current adjustment. This can be achieved using a preset fixed temperature value or a dynamically calculated temperature value based on the pathogen inactivation characteristics. The purpose is to ensure that the filter 3 reaches the critical point required for effective pathogen inactivation. The set duration refers to the time threshold for maintaining the temperature after it is reached. This can be achieved using a fixed time interval or a duration adaptively adjusted based on temperature stability. The purpose is to verify the adequacy of the inactivation process. Increasing the input current refers to dynamically adjusting the power output through the controller. This can be achieved using pulse width modulation or linear current regulation, aiming to quickly respond to temperature deviations and increase cooling power.

[0056] When the detected temperature is lower than the set temperature, the controller gradually increases the current supplied to the semiconductor device 1, boosting its power to accelerate temperature recovery. Once the set temperature is reached, a timing mechanism is activated, shutting down the semiconductor device 1 only if the duration reaches the set time. This creates a dual control logic of temperature feedback and time delay. This mechanism dynamically adjusts the current driven by temperature deviation, avoiding the risk of temperature fluctuations caused by open-loop control. Simultaneously, it uses the time dimension to verify the integrity of the inactivation process, ensuring that the self-cleaning mode is terminated promptly while meeting the pathogen inactivation requirements, restoring the normal ventilation function of the ventilation duct 10.

[0057] In some embodiments, a temperature sensor may be installed on the surface of the filter 3. The temperature sensor continuously monitors the temperature of the filter 3 and transmits the data to the controller of the emergency-emergency combination device. The controller compares the real-time temperature with the set temperature. If the real-time temperature is lower than the set temperature, a control signal is output to adjust the power supply module, gradually increasing the input current of the semiconductor device 1, while continuously monitoring temperature changes until the set temperature is reached. When the temperature stabilizes above the set temperature, the controller starts an internal timer. If the timer reaches the set duration, a shutdown command is issued to stop the semiconductor device 1 from operating.

[0058] This embodiment can precisely control the temperature of filter 3 within the required range for inactivation during the self-cleaning process, effectively ensuring the inactivation effect of pathogens, while avoiding energy waste and equipment overheating risks caused by excessively high temperatures or long operating times, significantly shortening the duration of indoor environmental discomfort, and improving the operational reliability and environmental comfort of the emergency-normal combined equipment in medical scenarios.

[0059] In one exemplary embodiment, reference Figures 1 to 3 As shown, a system for combining emergency and normal operation is provided, a fan coil unit 5, and a control method for the system for combining emergency and normal operation. In this embodiment, when the ventilation duct 10 is in the operating mode, the operating frequency of the fan 5 in the ventilation duct 10 is controlled according to the gas temperature downstream of the surface cooler 4 in the ventilation duct 10.

[0060] The "time-of-use mode" refers to the state in which the equipment performs ventilation and temperature control functions normally, combining normal and emergency operation. This can be achieved by operating the equipment in a standard medical environment mode, aiming to ensure stable air handling services during daily use. The gas temperature downstream of the surface cooler 4 refers to the air temperature after being cooled by the surface cooler 4. This can be monitored in real time using a temperature sensor, directly reflecting the actual air temperature delivered into the room and providing accurate feedback for control. Specifically, controlling the operating frequency of the fan 5 refers to adjusting the fan speed to change the airflow. This can be achieved by using a frequency converter to adjust the motor input frequency, aiming to dynamically respond to temperature changes and maintain a stable supply air temperature.

[0061] If the gas temperature downstream of the surface cooler 4 is greater than or equal to the sum of the target temperature and the first set temperature difference, the operating frequency of the fan 5 is increased until the operating frequency of the fan 5 reaches the maximum allowable value. After the operating frequency of the fan 5 reaches the maximum allowable value, if the gas temperature downstream of the surface cooler 4 is still greater than or equal to the sum of the target temperature and the first set temperature difference, the opening of the regulating valve upstream of the surface cooler 4 is increased until the opening of the regulating valve reaches the maximum opening.

[0062] The gas temperature downstream of the surface cooler 4 refers to the temperature monitoring point at the airflow outlet after heat exchange is completed in the surface cooler 4. This temperature can be collected in real-time using thermocouples or infrared temperature sensors to provide accurate feedback signals for the supply air temperature. The sum of the target temperature and the first set temperature difference constitutes a dynamic temperature threshold, which can be set as a floating range based on environmental requirements to establish a baseline condition for triggering control actions. The target temperature can refer to the target supply air temperature of the combined day / night and emergency air supply equipment, and can be set by the user. The first set temperature difference can be set according to actual needs, and its specific value is not limited. The operating frequency of the fan 5 refers to the AC frequency parameter driving the motor of the fan 5, which can be steplessly adjusted using a frequency converter to adjust the heat exchange efficiency by changing the airflow. The maximum allowable value refers to the upper limit frequency threshold for the safe operation of the fan 5 motor, which can be set according to the motor nameplate parameters or protection circuit to prevent overload operation of the equipment. The regulating valve refers to the fluid flow control device located upstream of the surface cooler 4, which can be implemented using an electric butterfly valve or a pneumatic ball valve to enhance the cooling capacity by adjusting the refrigerant flow. Maximum opening refers to the state where the regulating valve is fully open. It can be designed with mechanical limit or electronic signal control, with the aim of ensuring that the refrigerant flow reaches the system design limit.

[0063] For example, in the emergency-rest combination equipment in a medical ward, a temperature sensor collects real-time gas temperature data downstream of the surface cooler 4 and transmits it to the controller. The controller compares this temperature with a target temperature plus a threshold of a first set temperature difference. When the temperature remains above the threshold, the frequency of the fan 5 is gradually increased by the frequency converter. If the temperature still does not drop below the threshold after the frequency of the fan 5 reaches the preset maximum value, the controller drives the electric regulating valve to increase the opening by a preset step size until the opening reaches the maximum opening set by the mechanical limit. At this time, the refrigerant flow is maximized to enhance the cooling effect of the surface cooler 4.

[0064] In this embodiment, the gas temperature downstream of the surface cooler 4 is used as a real-time feedback signal to first trigger the dynamic adjustment of the operating frequency of the fan 5. This increases the airflow, improving the heat exchange efficiency between the air and the refrigerant, thereby quickly suppressing the temperature rise. Once the fan 5 reaches its maximum allowable frequency, if the temperature continues to exceed the limit, it automatically switches to the regulating valve opening control stage. This increases the refrigerant flow rate, directly enhancing the cooling capacity of the surface cooler 4, forming a phased, condition-triggered cascaded control mechanism. Based on continuous analysis of temperature monitoring data, this mechanism enables the fan 5 and the regulating valve to work in an orderly and coordinated manner under different operating conditions. This avoids the physical limitations of a single adjustment method and ensures that the supply air temperature remains stable even under extreme heat load conditions, effectively solving the bottleneck problem of insufficient system cooling capacity under high-temperature conditions. This embodiment effectively solves the technical problem that the system cannot further reduce the supply air temperature after the operating frequency of fan 5 reaches the upper limit, ensuring that the medical ward can still maintain a stable temperature and humidity environment under sudden high temperature conditions, avoiding the decrease in patient comfort and the increase in infection risk caused by temperature runaway, especially ensuring the precise control capability of the equipment for indoor microclimate during public health emergency response.

[0065] In addition, in this embodiment, if the gas temperature downstream of the surface cooler 4 is less than or equal to the difference between the target temperature and the second set temperature difference, the operating frequency of the fan 5 is reduced.

[0066] The difference between the target temperature and the second set temperature difference can be understood as a preset temperature threshold. This setting introduces a reasonable temperature buffer zone to avoid frequent adjustments due to minor temperature fluctuations, aiming to improve system stability. The second set temperature difference can be set according to actual needs, and its specific value is not limited. It can be the same as or different from the first set temperature difference; there is no restriction in this regard. For example, both the first and second set temperature differences can be 1°C.

[0067] This embodiment first continuously monitors the gas temperature downstream of the surface cooler 4, then compares this temperature in real time with the difference between the target temperature and a second set temperature difference. When the temperature is less than or equal to this threshold, it immediately triggers an operation to reduce the operating frequency of the fan 5, thus forming a closed-loop control logic. This design uses the gas temperature downstream of the surface cooler 4 as the core control parameter, directly relating it to the actual state of the indoor air supply. This ensures that the frequency of the fan 5 is rapidly reduced when the supply air temperature is too low, effectively suppressing over-cooling. Simultaneously, the introduction of a temperature buffer zone avoids oscillations in the control system, making the frequency adjustment of the fan 5 smoother and more reliable. This significantly reduces unnecessary energy consumption of the fan 5 while maintaining the comfort of the medical environment. This embodiment effectively avoids the problem of over-cooling of the indoor environment caused by the failure to promptly reduce the frequency of the fan 5 when the supply air temperature is too low, reducing energy waste and improving the thermal comfort of patients in the medical environment.

[0068] In this embodiment, when controlling the operating frequency of the fan 5 in the ventilation duct 10 according to the gas temperature downstream of the surface cooler 4 in the ventilation duct 10, the operating frequency of the fan 5 in the ventilation duct 10 is adjusted once every set time interval according to the gas temperature downstream of the surface cooler 4 in the ventilation duct 10.

[0069] It should be noted that the set duration refers to a preset time period, which can be achieved by using a fixed time value or by dynamically adjusting according to the system's operating status. Its purpose is to provide a stable buffer period for the system, avoiding frequent adjustments caused by short-term fluctuations in the temperature sensor or environmental noise. The set duration can be set according to actual needs, and its specific value is not limited; for example, the set duration could be 2 hours (h).

[0070] For example, a fixed time interval can be set in the controller as the set duration. At the end of each interval, the gas temperature downstream of the surface cooler 4 is collected, and the frequency of the primary fan 5 is adjusted based on the comparison result between the temperature and the preset threshold. For example, the increase or decrease in frequency is determined based on the direction and magnitude of the temperature deviation.

[0071] This embodiment periodically triggers the adjustment of the operating frequency of fan 5, using a set duration as the trigger condition, ensuring that the system only responds to continuous temperature changes. Each time the set duration is reached, the system collects gas temperature data downstream of the surface cooler 4 and executes an adjustment decision for the operating frequency of fan 5 accordingly. This mechanism avoids system oscillations caused by short-term temperature fluctuations, while maintaining the accuracy and timeliness of temperature control. This ensures stable indoor ambient temperature while improving equipment reliability and energy efficiency. This embodiment effectively reduces the number of times the operating frequency of fan 5 is adjusted, avoiding system oscillations caused by short-term temperature fluctuations, thus maintaining indoor environmental comfort and reducing mechanical wear and energy consumption.

[0072] In one exemplary embodiment, reference Figures 1 to 3 As shown, a combined emergency and routine emergency equipment, a fan coil unit 5, and a control method for the combined emergency and routine emergency equipment are provided. It should be noted that the combined emergency and routine emergency equipment of this technology generally has a single ventilation duct 10, which has three modes: normal mode, emergency mode, and self-cleaning mode. The normal mode and emergency mode can be collectively referred to as the usage mode. In the self-cleaning mode, the airflow of the fan 5 is very small, and the surface cooler 4 generally does not work. This means that the indoor cooling and purification functions are temporarily lost, and the indoor space is in an uncomfortable and infection-prone state, which poses a great challenge to medical wards.

[0073] This embodiment proposes a combined emergency and non-emergency ventilation device, which may include at least two ventilation ducts 10, referred to as the first ventilation duct 10 and the second ventilation duct 10, respectively. When the purification device 2 has a cleaning requirement, the at least two ventilation ducts 10 alternately operate in a usage mode and a self-cleaning mode; in the usage mode of the ventilation duct 10, the semiconductor device 1 is in a closed state; in the self-cleaning mode of the ventilation duct 10, the semiconductor device 1 is in an operating state.

[0074] Among them, at least two ventilation pipes 10 refer to the dual-pipe physical structure of the equipment configuration, which can be arranged in parallel or symmetrically to achieve functional redundancy, with the aim of providing a basic guarantee for continuous environmental control of the system.

[0075] The alternation between the usage mode and the self-cleaning mode refers to the dynamic switching of the operating mode based on the actual working conditions of the purification device 2. This can be achieved by using a time cycle control mechanism or a sensor monitoring trigger mechanism. The purpose is to start the self-cleaning process only when necessary to avoid resource waste.

[0076] In self-cleaning mode, the semiconductor device 1 is in a "shutdown" state, meaning it stops operating under normal ventilation conditions. This can be achieved by cutting off the power supply through a control circuit or by signal isolation, aiming to prevent redundant energy consumption during temperature regulation when the surface cooler 4 is already fully capable of handling the process. In self-cleaning mode, the semiconductor device 1 is in an "operation" state, meaning its cooling and heating functions are activated during the cleaning process. This can be achieved using temperature feedback closed-loop control or preset timing control, aiming to complete high-temperature inactivation through the active heating auxiliary filter 3.

[0077] In this system, at least two ventilation ducts 10 of the emergency-normal combined equipment form a backup operation system. When the purification device 2 in a certain ventilation duct 10 is detected to have reached the cleaning threshold, the system switches the duct to self-cleaning mode while ensuring that the other duct is in usage mode. In the usage mode of the ventilation duct 10, the semiconductor device 1 remains closed. At this time, the surface cooler 4 and the fan 5 work together to maintain indoor temperature, humidity and air quality. In the self-cleaning mode of the ventilation duct 10, the semiconductor device 1 starts to operate and cleans the filter 3 through the high temperature of the hot end 12. Since the other duct continues to provide normal ventilation and purification, the indoor environmental parameters are maintained stably, thereby eliminating the functional interruption period.

[0078] For example, at least two ventilation ducts 10 of the emergency-restoration combined equipment are arranged side by side inside the equipment housing. Each ventilation duct 10 is equipped with a purification device 2, a filter 3, and a semiconductor device 1 in sequence along the airflow direction. When the pressure sensor detects an abnormal increase in the pressure difference of the filter 3 of a certain ventilation duct 10, the central controller switches the duct to self-cleaning mode. At this time, its semiconductor device 1 is powered on and running, while the other duct automatically switches to the usage mode, and its semiconductor device 1 remains de-powered. During the self-cleaning process, the ventilation duct 10 in the usage mode continues to perform the normal ventilation task to ensure that the temperature and air quality in the ward are within a safe range.

[0079] In this embodiment, while a single ventilation duct 10 is performing a self-cleaning operation, the other ventilation duct 10 can still maintain the continuity of indoor cooling and purification functions, which can effectively avoid the decline in environmental comfort and the risk of cross-infection, and meet the strict technical requirements of medical wards for environmental stability in emergency maintenance scenarios.

[0080] In addition, in this embodiment, when at least two ventilation ducts 10 have a self-cleaning requirement, the at least two ventilation ducts 10 are controlled to alternately be in self-cleaning mode and time-use mode.

[0081] In this embodiment, the operating status parameters of each ventilation duct 10 can be monitored in real time. When at least two ventilation ducts 10 simultaneously meet the self-cleaning trigger conditions, the control system immediately initiates an alternating operation strategy: firstly, one ventilation duct 10 is switched to self-cleaning mode (at this time, the semiconductor device 1 of this duct operates to achieve high-temperature inactivation of the filter 3), while the other ventilation duct 10 remains in usage mode (at this time, the semiconductor device 1 of this duct is turned off to maintain normal temperature and humidity regulation and air purification functions); after the preset self-cleaning cycle is completed, the control system automatically switches the status roles of the two ducts, so that the original self-cleaning duct returns to usage mode, and the original usage duct switches to self-cleaning mode. This dynamic coordination mechanism based on status requirements ensures the functional continuity of the dual-duct system under high maintenance requirements through precise timing control, avoiding interruption of indoor environmental control capabilities caused by simultaneous self-cleaning operations.

[0082] For example, the controller of the emergency-emergency combined equipment continuously receives differential pressure sensor signals from filters 3 of at least two ventilation ducts 10. When the differential pressure values ​​of the two ducts both exceed a preset threshold, the controller starts an alternating control program. First, it controls the fan 5 of ventilation duct A to reduce the air volume and turns on its semiconductor device 1 to enter self-cleaning mode. At the same time, it maintains the fan 5 of ventilation duct B at full speed and turns off its semiconductor device 1 to maintain the time-use mode. After a set time, the processing unit automatically switches the control command, so that duct A returns to the time-use mode while duct B enters the self-cleaning mode. This alternating process is executed cyclically until the self-cleaning requirements of all ducts are met.

[0083] This embodiment can effectively solve the problem of functional interruption of dual-pipe system in scenarios with high self-cleaning requirements, ensuring that there is always at least one ventilation pipe 10 in the medical space to provide air that has been regulated and purified by temperature and humidity, thereby maintaining the continuous comfort and cleanliness of the indoor environment and avoiding the increased risk of infection and patient discomfort caused by synchronous equipment maintenance.

[0084] In one exemplary embodiment, reference Figures 1 to 3 As shown, a normal / emergency combination device, a fan coil unit 5, and a control method for the normal / emergency combination device are provided. The air outlet side of the normal / emergency combination device can be directly installed to the air inlet side of the fan coil unit 5. The normal / emergency combination device may include two ventilation pipes 10, and has two operating modes: a time-based mode and a self-cleaning mode. The time-based mode can be divided into a normal mode and an emergency mode.

[0085] In normal mode, the purification device 2, filter 3 (e.g., a high-precision filter), and semiconductor device 1 can be modularly disassembled or retained, but their power supply can be turned off. If disassembled, the indoor return air and fresh air are cooled only by the surface cooler 4 before being delivered into the room by the fan 5. If retained, the indoor return air and fresh air pass through the filter 3 and then the surface cooler 4 before being delivered into the room by the fan 5. When the purification device 2, semiconductor device 1, and filter 3 are installed in the ventilation duct 10, the purification device 2, filter 3, and semiconductor device 1 can be activated as needed. If it is necessary to decompose gaseous pollutants such as formaldehyde, the indoor return air and fresh air undergo plasma purification by the purification device 2, then pass through the filter 3, are cooled by the surface cooler 4, and are then delivered into the room by the fan 5. After the air passes through the surface cooler 4, there is a temperature sensor that can measure the gas temperature t2. If t2 is greater than the required target air temperature Ts+ If T2 (i.e., the first set temperature difference) is less than the required target air supply temperature Ts, then the frequency of fan 5 will be increased; if t2 is less than the required target air supply temperature Ts, then the frequency of fan 5 will be increased. If T3 (the second set temperature difference) is reached, the frequency of fan 5 will be reduced. The target air supply temperature is related to the actual indoor demand and can be specified by the user; generally, Ts = 16℃. The temperature is checked again every 10 minutes, and the frequency of fan 5 is readjusted, repeating this cycle.

[0086] In emergency mode (e.g., during an epidemic), equipment that combines normal and emergency functions can be temporarily transferred from rooms in normal mode to epidemic wards to quickly respond to purification and disinfection needs. When self-cleaning is required in emergency mode (e.g., during an epidemic), ventilation duct A can be in emergency mode, turning on the power to purification device 2. Indoor return air and fresh air are purified by plasma from purification device 2, then filtered by filter 3, cooled by surface cooler 4, and then delivered into the room by fan 5. Ventilation duct B can be in self-cleaning mode, turning on the power to semiconductor device 1. Its hot end 12 is in close contact with filter 3 for disinfection, while its cold end 11 absorbs excess heat, completing the self-cleaning process. Ventilation ducts A and B are always open, and their states are alternated every certain period of time t (i.e., a set duration) to ensure that the epidemic needs for purification, cooling, and equipment disinfection are met simultaneously. A temperature sensor can be installed on the surface of filter 3 to measure the temperature t1. If t1 is less than or equal to the temperature tm required for high-temperature inactivation (i.e., the set temperature, the range of which is related to the actual indoor needs, and can generally be specified as 80℃), the DC current is increased until t1≥tm, and then the timing starts. When the time reaches t, the modes of the two ventilation pipes 10 are switched.

[0087] In addition, in this embodiment, if t2 is greater than the maximum allowable temperature of the motor of fan 5 (the range is related to the motor parameters, and can generally be specified as 90°C, which can be the maximum temperature the motor can withstand, tn-), then... T1, T1 is denoted as the third set temperature difference (its value is determined by referring to the first set temperature). If T1 is greater than or equal to the required target air supply temperature Ts+, then the fan motor 5 is directly shut down to prevent damage from overheating. T2, first increase the frequency of fan 5 until it reaches full frequency. If this is still not enough, open the electric regulating valve V before the surface cooler 4 (the value is determined according to actual needs, generally 30% to 70%). If t2 is less than or equal to the required target air supply temperature Ts- If T3 is selected, the frequency of fan 5 will be reduced. The temperature will be rechecked every 10 minutes, and the cycle will begin again.

[0088] In this embodiment, a semiconductor device 1, a purification device 2, and a filter 3 are installed inside the ventilation duct 10 of the emergency-normal combined equipment. The hot end 12 of the semiconductor device 1 is installed in contact with the filter 3. When the filter 3 is deactivated at high temperature in self-cleaning mode, the semiconductor device 1 can be energized to put it into operation. In this case, the hot end 12 of the semiconductor device 1 deactivates the filter 3 at high temperature, achieving self-cleaning. At the same time, after the gas passes through the hot end 12, it needs to pass through the cold end 11 of the semiconductor device 1 before being discharged. This can reduce the gas that has been deactivated at high temperature by the hot end 12 to the original indoor return air temperature. This can effectively solve the problem of overheating of the air supplied after passing through the filter 3 in the emergency-normal combined equipment, reduce the redundancy required by the emergency-normal combined equipment to absorb the heat of deactivation, save the energy consumption of the emergency-normal combined equipment to absorb waste heat, and improve the energy efficiency of the emergency-normal combined equipment. Moreover, this embodiment can effectively solve the problem of functional interruption of dual-pipe systems in scenarios with high self-cleaning requirements, ensuring that there is always at least one ventilation duct 10 in the medical space to provide air that has been regulated and purified by temperature and humidity, thereby maintaining the continuous comfort and cleanliness of the indoor environment and avoiding the increased risk of infection and patient discomfort caused by synchronous equipment maintenance.

[0089] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0090] It should be noted that the terms "one implementation," "embodiment," "exemplary embodiment," and "some embodiments" used in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0091] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or air conditioning apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or air conditioning apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or air conditioning apparatus that includes said element.

[0092] The above embodiments are merely preferred embodiments provided to fully illustrate this application, and the scope of protection of this application is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on this application are all within the scope of protection of this application.

Claims

1. A control method, characterized in that, The control method is applied to a normal-emergency combined equipment, which includes at least one ventilation pipe. A semiconductor device, a purification device, and a filter are disposed in the ventilation pipe. The filter is located between the purification device and the semiconductor device. The purification device is close to the air inlet side of the normal-emergency combined equipment, and the semiconductor device is close to the air outlet side of the normal-emergency combined equipment. The semiconductor device includes a thermoelectric cooling semiconductor, a cold end, and a hot end. The thermoelectric cooling semiconductor is located between the cold end and the hot end, and the hot end is disposed in close contact with the filter. The control method includes: When the ventilation duct is in self-cleaning mode, the semiconductor device inside the ventilation duct is controlled to be in operation. When the ventilation duct is in use mode, the semiconductor device inside the ventilation duct is controlled to be in a closed state; The control method further includes: When the semiconductor device inside the ventilation duct is in operation, the current of the semiconductor device is controlled according to the temperature of the filter inside the ventilation duct.

2. The control method according to claim 1, characterized in that, The step of controlling the input current of the semiconductor device based on the temperature of the filter in the ventilation duct includes: If the temperature of the filter is lower than the set temperature, the current supplied to the semiconductor device is increased until the temperature of the filter is greater than or equal to the set temperature. If the temperature of the filter is greater than or equal to the set temperature for a set duration, the semiconductor device is controlled to be in a closed state to shut down the self-cleaning mode of the ventilation duct.

3. The control method according to claim 1, characterized in that, The emergency-rest combination device includes at least two of the ventilation pipes, and the control method includes: When at least two of the ventilation ducts have a self-cleaning requirement, the at least two ventilation ducts are controlled to alternate between the self-cleaning mode and the time-use mode.

4. The control method according to any one of claims 1-3, characterized in that, The control method includes: When the ventilation duct is in the time-use mode, the operating frequency of the fan in the ventilation duct is controlled according to the gas temperature on the downstream side of the surface cooler in the ventilation duct.

5. The control method according to claim 4, characterized in that, The step of controlling the operating frequency of the fan in the ventilation duct based on the gas temperature downstream of the surface cooler in the ventilation duct includes: If the gas temperature downstream of the surface cooler is greater than or equal to the sum of the target temperature and the first set temperature difference, then the operating frequency of the fan is increased until the operating frequency of the fan reaches the maximum allowable value. After the operating frequency of the fan reaches the maximum allowable value, if the gas temperature downstream of the surface cooler is still greater than or equal to the sum of the target temperature and the first set temperature difference, the opening of the regulating valve upstream of the surface cooler is increased until the opening of the regulating valve reaches the maximum opening.

6. The control method according to claim 4, characterized in that, The step of controlling the operating frequency of the fan in the ventilation duct based on the gas temperature downstream of the surface cooler in the ventilation duct includes: If the gas temperature downstream of the surface cooler is less than or equal to the difference between the target temperature and the second set temperature difference, then the operating frequency of the fan is reduced.

7. The control method according to claim 4, characterized in that, The step of controlling the operating frequency of the fan in the ventilation duct based on the gas temperature downstream of the surface cooler in the ventilation duct includes: At set intervals, the operating frequency of the fan in the ventilation duct is adjusted once based on the gas temperature downstream of the surface cooler in the ventilation duct.

8. A combined emergency and routine emergency equipment, characterized in that, The emergency-normal combined device is used to implement the control method as described in any one of claims 1-7. The emergency-normal combined device includes at least one ventilation pipe. A semiconductor device, a purification device, and a filter are disposed in the ventilation pipe. The filter is located between the purification device and the semiconductor device. The purification device is close to the air inlet side of the emergency-normal combined device, and the semiconductor device is close to the air outlet side of the emergency-normal combined device. The semiconductor device includes a thermoelectric cooling semiconductor, a cold end, and a hot end. The thermoelectric cooling semiconductor is located between the cold end and the hot end, and the hot end is disposed in close contact with the filter.

9. The emergency / emergency combined equipment according to claim 8, characterized in that, The cross-sectional structure of the cold end and the hot end, which are perpendicular to the axial direction of the ventilation duct, is a striped or mesh structure.

10. The emergency / emergency combined equipment according to claim 8, characterized in that, The thermoelectric cooling semiconductor includes a symmetrical structure composed of N-type and P-type semiconductors.

11. The emergency / emergency combined equipment according to claim 8, characterized in that, The semiconductor device is detachably connected to the ventilation duct.

12. The emergency / emergency combined equipment according to claim 8, characterized in that, The purification device is detachably connected to the ventilation duct.

13. The emergency / emergency combined equipment according to claim 8, characterized in that, The filter includes a high-efficiency filter.

14. The emergency / emergency combined equipment according to claim 8, characterized in that, A surface cooler is installed inside the ventilation duct, and the surface cooler is located on the side of the cold end away from the hot end.

15. The emergency / emergency combined equipment according to claim 14, characterized in that, A fan is installed inside the ventilation duct, and the fan is located on the side of the surface cooler away from the cold end.

16. The emergency-commutation combined equipment according to any one of claims 8-15, characterized in that, The emergency / normal combined equipment includes at least two ventilation ducts. When the purification device in the ventilation duct has a cleaning requirement, the at least two ventilation ducts alternately operate in a usage mode and a self-cleaning mode. In the ventilation duct of the time-use mode, the semiconductor device is in a closed state; in the ventilation duct of the self-cleaning mode, the semiconductor device is in an operating state.

17. A fan coil unit, characterized in that, The fan coil unit includes the emergency / emergency combination device as described in any one of claims 8-16.

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