Resin composition, laminate, and printed wiring board

Abstract

The invention provides a resin composition, a laminated board and a printed circuit board. The total weight of the resin composition is 100 parts by weight, and the resin composition comprises a component A, a component B and a component C, wherein the component A comprises 20-40 parts by weight of unsaturated polyphenyl ether resin; component B: 10 to 30 parts by weight of a vinyl elastomer copolymer; component C: 10 to 30 parts by weight of a hydrogenated polyolefin compound; and a component D: 30 to 50 parts by weight of a cross-linking agent; wherein the cross-linking agent is a mixture of a vinyl cross-linking agent and an acenaphthylene cross-linking agent according to a ratio of 1: 7 to 7: 1. The resin composition provided by the invention improves the resin reaction rate, and provides the electronic circuit substrate with the characteristics of better glass transition temperature, low thermal expansion coefficient and high heat resistance through specific composition and proportion.

Description

TECHNICAL FIELD

[0001] The present application relates to a resin composition, a laminate and a printed circuit board, and in particular, to a resin composition applied to the manufacture of a copper-clad plate and a prepreg for a PCB circuit board. BACKGROUND

[0002] The progress of modern information processing technology has led to the digitization of circuits, which has resulted in the high-speed processing of information and the high-frequency transmission of signals. In high-frequency circuits, the loss of electrical signals is represented by the sum of dielectric loss and conductor loss, and radiation loss. The higher the frequency of electrical signals, the greater the loss of electrical signals.

[0003] Since the transmission loss causes the attenuation of electrical signals, which in turn destroys the reliability of electrical signals, it is necessary to reduce dielectric loss, conductor loss and radiation loss. The dielectric loss of electrical signals is directly proportional to the product of the dielectric loss angle of the insulator forming the circuit and the frequency of the electrical signals used. Therefore, by selecting an insulating material with a small dielectric loss angle, the transmission loss of electrical signals can be reduced.

[0004] Radical reactions are divided into three stages: chain initiation, chain growth and chain termination. Crosslinking agents dominate the chain growth stage, and a large number of free radicals are generated during the reaction, while the total number of free radicals remains unchanged. If the reaction rate is too slow, the chain growth stage cannot effectively polymerize, and if the reaction rate is too fast, the chain termination stage is entered prematurely. Therefore, the selection of crosslinking agents also has a great influence on the stability of chain growth. In the prior art, only a single crosslinking agent is used, and the rate of crosslinking reaction is too fast or too slow, which has an adverse effect on the final product.

[0005] Therefore, how to control the crosslinking reaction rate and obtain better product properties through the improvement of ingredients has become a current research hotspot. SUMMARY

[0006] The main purpose of the present application is to provide a resin composition, wherein the total weight of the resin composition is 100 parts by weight, and the resin composition comprises: component A: 20 to 40 parts by weight of unsaturated polyphenyl ether resin; component B: 10 to 30 parts by weight of vinyl elastomer copolymer; component C: 10 to 30 parts by weight of hydrogenated polyolefin compound; and component D: 30 to 50 parts by weight of crosslinking agent; wherein the crosslinking agent is a mixture of vinyl crosslinking agent and acen crosslinking agent in a ratio of 1:7 to 7:1.

[0007] In an embodiment of the present application, the unsaturated polyphenyl ether resin is a terminal vinyl benzyl modified polyphenyl ether resin or a difunctional methacrylate modified polyphenyl ether resin.

[0008] In an embodiment of the present application, the ethylene-based elastomeric copolymer is at least one selected from the group consisting of polybutadiene, styrene butadiene copolymer (SBR), styrene butadiene styrene block copolymer (SBS), polyisoprene, styrene isoprene copolymer, styrene isoprene styrene block copolymer (SIS), acrylonitrile butadiene copolymer, acrylonitrile butadiene styrene block copolymer.

[0009] In an embodiment of the present application, the hydrogenated polyolefin compound is at least one selected from the group consisting of hydrogenated styrene-butadiene-styrene triblock copolymer, hydrogenated styrene-butadiene-styrene triblock copolymer substituted with maleic anhydride.

[0010] In an embodiment of the present application, the ethylene-based crosslinking agent is at least one selected from the group consisting of divinylbenzene (DVB), bis(vinylbenzyl) ether (BVBE), or 1,2-bis(vinylphenyl)ethane (BVPE).

[0011] In an embodiment of the present application, the resin composition further includes a promoter, and the promoter is at least one selected from the group consisting of di-tert-butyl peroxide, dilauroyl peroxide, dibenzoyl peroxide, tert-butyl peroxyacetate, tert-butyl peroxybenzoate, 1,1-di-tert-butyl peroxy-3,5,5-trimethylcyclohexane, 1,1-di-tert-butyl peroxycyclohexane, 2,2-di(tert-butylperoxy)butane, bis(4-tert-butylcyclohexyl)peroxy dicarbonate, peroxydicarbonate hexadecyl, peroxydicarbonate tetradecyl, dipentamethylene peroxide, dicumyl peroxide, bis(tert-butylperoxy isopropyl)benzene, 2,5-dimethyl-2,5-di-tert-butylperoxyhexane, 2,5-dimethyl-2,5-di-tert-butylperoxyhexyne, and dicumyl hydroperoxide.

[0012] In an embodiment of the present application, the resin composition further includes an inorganic filler, and the inorganic filler is at least one selected from the group consisting of silicon dioxide, aluminum oxide, aluminum hydroxide, magnesium oxide, magnesium hydroxide, calcium carbonate, aluminum nitride, boron nitride, aluminum silicon carbide, silicon carbide, titanium dioxide, zinc oxide, zirconium oxide, barium sulfate, magnesium carbonate, barium carbonate, mica, talc, and graphene.

[0013] Another object of the present application is to provide a build-up board comprising a resin substrate including a plurality of prepreg sheets, each of which is made of a reinforcing material by coating a resin composition according to the present application; and a metal foil layer disposed on at least one surface of the resin substrate.

[0014] Another object of the present application is to provide a printed circuit board comprising the build-up board according to the present application.

[0015] One of the advantages of the present application is that the resin composition according to the present application can improve the reaction rate which is too fast or too slow caused by using a single crosslinking agent by the technical solution of mixing the vinyl crosslinking agent and the acen crosslinking agent in a ratio of 1:7 to 7:1 and the specific formulation ratio, thereby providing a better reaction rate. In addition, the specific formulation ratio of the present application can provide better comprehensive performance requirements such as glass transition temperature (Tg), copper foil tensile force (P / S) ≥ 3.0 lb / in, water absorption less than 0.3%, and heat resistance. BRIEF DESCRIPTION OF DRAWINGS

[0016] FIG. 1A DSC chart of the present application;

[0017] FIG. 1B DSC chart of the present application;

[0018] FIG. 1C DSC chart of the present application. DETAILED DESCRIPTION

[0019] The technical solution adopted by the present application is to provide a resin composition, wherein the total weight of the resin composition is 100 parts by weight, and the resin composition comprises: component A: 20 to 40 parts by weight of unsaturated polyphenyl ether resin; component B: 10 to 30 parts by weight of vinyl elastomer copolymer; component C: 10 to 30 parts by weight of hydrogenated polyolefin compound; and component D: 30 to 50 parts by weight of crosslinking agent; wherein the crosslinking agent is a mixture of vinyl crosslinking agent and acen crosslinking agent in a ratio of 1:7 to 7:1.

[0020] In particular, polyphenylene ether (PPE) resins have good mechanical properties and excellent dielectric properties, with Dk / Df of about 2.45 / 0.0007 at 1 MHz, which is the preferred resin material for high-frequency printed circuit board substrates. Preferably, the unsaturated polyphenylene ether resin used in the present application is modified. More specifically, the unsaturated polyphenylene ether resin used in the present application can be selected from a terminal vinyl benzyl modified polyphenylene ether resin or a bifunctional methacrylate modified polyphenylene ether resin. The number average molecular weight (Mn) of the polyphenylene ether compound is preferably 500 to 5000, more preferably 2000 to 4000. An excellent polyphenylene ether resin with a specific average molecular weight can provide better dielectric properties, heat resistance and formability. If the molecular weight is less than 500, the heat resistance of the finished product is not good, and if the molecular weight is greater than 5000, the flowability is poor and the melt viscosity is high. Polyphenylene ether resins such as SA-9000 (manufactured by SABIC, polyphenylene ether compound with methacrylic acid group) and OPE-2St 1200 (manufactured by Mitsubishi Gas Chemical, polyphenylene ether compound with styrene structure) and the like.

[0021] The vinyl-containing elastomeric copolymer can improve the heat resistance of the resin composition after curing, and can also impart good physical properties to the resin composition after curing, such as toughness, processability, etc. by its own toughening properties. Preferably, the vinyl-containing elastomeric copolymer is at least one selected from the group consisting of polybutadiene, styrene butadiene copolymer (SBR), styrene butadiene styrene block copolymer (SBS), polyisoprene, styrene isoprene copolymer, styrene isoprene styrene block copolymer (SIS), acrylonitrile butadiene copolymer, acrylonitrile butadiene styrene block copolymer.

[0022] The hydrogenated polyolefin can include various types of hydrogenated styrene-butadiene-styrene triblock copolymers (also known as styrene-ethylene / butylene-styrene copolymers) known in the art. In a specific embodiment, the hydrogenated polyolefin compound is at least one selected from the group consisting of hydrogenated styrene-butadiene-styrene triblock copolymers, hydrogenated styrene-butadiene-styrene triblock copolymers substituted with maleic anhydride. For example, the hydrogenated polyolefin can be a hydrogenated polyolefin produced by Asahi KASEI, with product model numbers H1221, H1062, H1521, H1052, H1041, H1053, H1051, H1517, H1043, N504, H1272, M1943, M1911, M1913, etc.

[0023] In the specific embodiments of the present application, the resin composition includes 30 to 50 parts by weight of the crosslinking agent, based on 100 parts by weight of the total weight of the resin composition. If the proportion of the crosslinking agent is too high, the thermal conductivity of the resin composition after crosslinking will be reduced (e.g., the thermal conductivity coefficient K value will be reduced). If the proportion of the crosslinking agent is too low, the thermal value of the resin composition after crosslinking will be poor (e.g., the glass transition temperature Tg will be reduced).

[0024] In more detail, the crosslinking agent is a mixture of a vinyl crosslinking agent and an acen crosslinking agent in a ratio of 1:7 to 7:1. For example, the ratio of the vinyl crosslinking agent to the acen crosslinking agent in the crosslinking agent can be 35:5, 30:10, 20:20, 10:30, 5:35, or any ratio therebetween. In particular, if a single crosslinking agent is used, the rate of the crosslinking reaction will be too fast or too slow, which will adversely affect the final product. The use of acen crosslinking agent alone will result in a slow crosslinking reaction, powdering of the surface of the finished PP product, poor glass transition temperature (Tg) and coefficient of thermal expansion (CTE), and further result in a high water absorption of the finished product. On the other hand, the use of vinyl crosslinking agent alone will result in a fast crosslinking reaction, poor glass transition temperature (Tg), high water absorption, and poor heat resistance of the finished product.

[0025] Further, the effect of the crosslinking agent on the reaction rate is compared by measuring the energy (heat absorption and release) change of the material under specific conditions using differential scanning calorimetry (DSC) thermal analysis detection.

[0026] Please refer to FIGS. 1A-1C The DSC spectra of Comparative Example 1, Example 1, and Comparative Example 2, respectively, show the DSC curves of the resin samples using different crosslinking agents and different proportions, which affect the crosslinking of the resin samples, FIG. 1A FIG. 1A FIG. 1B FIG. The crosslinking initiation temperature of Comparative Example 2 is about 148.76°C, and the maximum heat flow rate is at 179.19°C. The initiation reaction temperature, maximum heat flow temperature, and reaction enthalpy of Example 1, Comparative Example 1, and Comparative Example 2 are recorded in Table 1. As can be seen from the DSC curves, Example 1 provides the best reaction interval, while Comparative Example 1 reacts too fast and Comparative Example 2 reacts too slowly, both of which cause defects in the subsequent process.

[0027] Table 1

[0028]

[0029] In specific embodiments of the present application, the vinyl crosslinker is at least one selected from the group consisting of divinylbenzene (DVB), bis(vinylbenzyl) ether (BVBE), or 1,2-bis(vinylphenyl)ethane (BVPE). Preferably, the vinyl crosslinker is 1,2-bis(vinylphenyl)ethane (BVPE). Further, 1,2-bis(vinylphenyl)ethane (BVPE) can be prepared by Grignard reaction of vinylbenzyl chloride such as 1-(chloromethyl)-4-vinylbenzene. The preparation of 1,2-bis(vinylphenyl)ethane (BVPE) can also refer to the disclosure of CN113372187A.

[0030] In specific embodiments of the present application, the acenaphthylene crosslinker is acenaphthylene (1,8-ethylenenaphthalene), which is a polycyclic aromatic hydrocarbon compound having a naphthalene ring and bridging the naphthalene ring at positions 1 and 8 via an ethylene group, for example, acenaphthylene available from TCI.

[0031] Further, different accelerators can be used depending on the physical properties of the product. Preferably, the accelerator is a peroxide crosslinking accelerator, more specifically, an organic peroxide radical initiator. For example, the accelerator is at least one selected from the group consisting of di(tert-butyl) peroxide, dilauroyl peroxide, dibenzoyl peroxide, tert-butyl peroxyacetate, tert-butyl peroxybenzoate, 1,1-di-tert-butylperoxy-3,5,5-trimethylcyclohexane, 1,1-di-tert-butylperoxy cyclohexane, 2,2-di(tert-butylperoxy)butane, bis(4-tert-butylcyclohexyl)peroxy dicarbonate, peroxydicarbonate hexadecyl, peroxydicarbonate tetradecyl, dipentylhexyl peroxide, dicumyl peroxide, bis(tert-butylperoxy isopropyl) benzene, 2,5-dimethyl-2,5-di-tert-butylperoxy hexane, 2,5-dimethyl-2,5-di-tert-butylperoxy hexyne-3, and dicumyl hydroperoxide, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexyne-3. In one embodiment, the accelerator is α,α'-di(tert-butylperoxy)diisopropylbenzene available from Nippon Oil & Fats Corporation.

[0032] Further, the resin composition of the present application can further include, as needed, an inorganic filler selected from the group consisting of silica, alumina, barium sulfate, talc, clay, mica powder, and boron nitride. In particular, the inorganic filler can increase the thermal conductivity of the resin composition, improve the thermal expansion and mechanical strength thereof.

[0033] Further, the resin composition of the present application can further include, as needed, a flame retardant, a suppressant, a silane coupling agent, a surfactant, a toughening agent, a core-shell rubber, a light stabilizer, or a combination thereof.

[0034] Preferably, the flame retardant is a phosphorus-containing flame retardant and a brominated flame retardant. Examples of the brominated flame retardant include ethylene-bis(tetrabromophthalimide), decabromodiphenyl ethane, and 2,4,6-tris(2,4,6-tribromophenoxy)-1,3,5-triazine. Examples of the phosphorus-containing flame retardant include bisphenol diphenyl phosphate, ammonium polyphosphate, hydroquinone bis(diphenyl phosphate), bisphenol A bis(diphenyl phosphate), tris(2-carboxyethyl)phosphine (TCEP), tris(chloroisopropyl)phosphate, trimethyl phosphate (TMP), dimethyl methylphosphonate (DMMP), resorcinol bis(dimethylphenyl phosphate), phosphazene, melamine polyphosphate, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and derivatives or resins thereof, melamine cyanurate, and trihydroxyethyl isocyanurate.

[0035] More specifically, the phosphoric acid ester-based flame retardant, the phosphazene-based flame retardant, the bisdiphenyl phosphine oxide-based flame retardant, the 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO)-based flame retardant, and the phosphinate salt-based flame retardant. Specific examples of the phosphoric acid ester-based flame retardant can include condensed phosphoric acid esters of dixylenyl phosphate. Specific examples of the phosphazene-based flame retardant can include phenoxy phosphazene. Specific examples of the bisdiphenyl phosphine oxide-based flame retardant can include the exo-bisdiphenyl phosphine oxide. Specific examples of the DOPO-based flame retardant can include hydrocarbons having 2 DOPO groups in the molecule (DOPO derivative compounds) and DOPO having a reactive functional group. Specific examples of the phosphinate salt-based flame retardant can include metal phosphinates such as aluminum dialkylphosphinate. The aforementioned flame retardants can be used alone as each of the flame retardants exemplified, or two or more of them can be used in combination. In one embodiment of the present application, the flame retardant can be exo-dixylenyl bis(diphenyl phosphine oxide) to improve the flame retardancy of the flame-retardant resin composition while improving the moisture resistance.

[0036] The silane coupling agent can improve the metal adhesion of the polyolefin material, and a silane coupling agent commonly used in the art can be used. For example, the inorganic functional group of the silane coupling agent is a trifunctional group, i.e., Si-(OR2).

[0037] [Examples]

[0038] Table 1 provides the component ratio of the resin composition of Examples 1 to 4 and Comparative Examples 1 and 2, respectively. The resin composition is prepared according to the component ratio, and the reinforcing material is immersed or roller coated with the resin composition. The resin composition is subjected to baking to evaporate the solvent and to semi-curing, cooling and winding to form a semi-cured prepreg. The semi-cured prepreg is further subjected to hot-pressing to form a dielectric substrate layer. Specifically, the hot-pressing is performed by stacking four sheets of the semi-cured prepreg and two sheets of 18 μm copper foil in the order of copper foil, four sheets of the semi-cured prepreg, copper foil, and then pressing at 220°C for 2 hours under vacuum to form a copper foil substrate, wherein the four sheets of the semi-cured prepreg are cured to form an insulation layer between the two copper foils. The obtained copper foil substrate is further subjected to physical property tests and the results are recorded in Table 2.

[0039] [Physical property test]

[0040] Appearance observation: The surface insulation layer of the copper-free substrate is observed by personnel to determine whether there is a dry plate or flow pattern. No dry plate and no flow pattern indicate that the appearance of the substrate is normal.

[0041] Gel time stability (GT): The measurement is performed according to the method described in IPC-TM-650 2.3.18. The better the reactivity, the shorter the time, and the worse the reactivity, the longer the time. The experiment is preferably 100 s to 300 s, which can have both operability and reactivity.

[0042] Transition glass temperature (Tg): The transition glass temperature of the metal foil layer substrate is measured using a thermal mechanical analyzer (TMA).

[0043] Z-axis coefficient of thermal expansion (Z-CTE): The measurement is performed according to the test standard IPC-TM-650-2.4.24. The thermal mechanical analysis (TMA) measurement is performed according to IPC-TM-650 2.4.24.5.

[0044] Peeling strength (P / S) of copper foil: The measurement is performed according to the method described in IPC-TM-650 2.4.8. The force required to peel the copper foil from the surface of the insulation layer of the substrate is measured for each sample, and the unit is lb / in.

[0045] The water absorption test is performed by placing the prepared copper clad laminate in a pressure cooker at 121°C and 1.1 kgf / cm2for 1 hour, and then testing the weight change.

[0046] Copper foil laminate heat resistance (T288): Also known as "solder float result", the heat resistance test is performed according to the industry standard IPC-TM-650 2.4.24.1, by immersing the copper foil laminate in a 288°C tin furnace until the time required to burst the board.

[0047] Table 2. Examples 1 to 4 and Comparative Examples 1 to 2

[0048]

[0049]

[0050] OPE-2St 2200: end-vinyl benzyl-modified polyphenylene ether (Mw: about 3600, available from Mitsubishi Gas Chemical Company, Inc.)

[0051] SA-9000: difunctional methacrylate-modified polyphenylene ether (Mw: 1700, available from SABIC)

[0052] Vinyl crosslinker: commercially available bis(vinylphenyl)ethane (BVPE)

[0053] Acenaphthylene crosslinker: commercially available acenaphthylene

[0054] Promoter: a,a'-bis(tert-butylperoxy)diisopropylbenzene (available from NOF Corporation as NOF-PC-1) P)

[0055] Inhibitor: tetramethylpiperidinooxy (reagent grade, available from Merck)

[0056] Flame retardant: p-xylyleneglycol bis(diphenylphosphine oxide) (available from Jin Yi Chemical Co., Ltd. as PQ-60)

[0057] Referring to Table 2, Comparative Example 1 uses only a single crosslinker (vinyl crosslinker), and the substrate surface is powdery and has flow marks, the glass transition temperature (Tg) is low, and the coefficient of thermal expansion (CTE) is high. Comparative Example 2 uses only a single crosslinker (acenaphthylene crosslinker), and the SG is only 60 seconds, the board surface is slightly dry, the glass transition temperature (Tg) is low, and the coefficient of thermal expansion (CTE) is high, and thus cannot pass the solder float heat resistance test.

[0058] Compared with the comparative examples, the examples 1 to 4 using the mixture of two cross-linking agents show that the metal foil layer substrate has normal appearance, the glass transition temperature is greater than 200℃, the thermal expansion coefficient of the metal foil layer substrate in the z direction is less than 2.8%, and the metal foil layer substrate of examples 1 to 4 has good heat resistance. In addition, the metal foil layer substrate of the present application has a copper foil pull force (P / S) of ≥3.0 lb / in, and a water absorption of preferably less than 0.3%, so that excessive moisture can be avoided from adhering to the metal foil layer substrate.

[0059] The resin composition, the laminate and the printed circuit board provided by the present application can improve the disadvantages of too fast or too slow reaction rate caused by using a single cross-linking agent, and provide a better reaction rate by the technical solution that the cross-linking agent is a mixture of a vinyl cross-linking agent and a methylene cross-linking agent in a ratio of 1:7 to 7:1 and a specific formulation ratio. In addition, the specific formulation ratio of the present application can provide a better glass transition temperature (Tg), a copper foil pull force (P / S) of ≥3.0 lb / in, a water absorption of less than 0.3%, and the requirements of heat resistance and other comprehensive performance.

[0060] The above description is only a preferred embodiment of the present application, and is not limited to the claims of the present application. Therefore, any equivalent changes made by applying the content of the present application are also included in the scope of the present application.

Claims

1. A resin composition, wherein the total weight of the resin composition is 100 parts by weight, characterized in that, The resin composition includes: Component A: 20 to 40 parts by weight of unsaturated polyphenylene ether resin; Component B: 10 to 30 parts by weight of vinyl elastomer copolymer; Component C: 10 to 30 parts by weight of hydrogenated polyolefin compound; and Component D: 30 to 50 parts by weight of crosslinking agent; The crosslinking agent is a mixture of vinyl crosslinking agent and acenaphthene crosslinking agent in a ratio of 1:7 to 7:

1.

2. The resin composition according to claim 1, characterized in that, The unsaturated polyphenylene ether resin is a terminal vinyl benzyl modified polyphenylene ether resin or a difunctional methacrylate modified polyphenylene ether resin.

3. The resin composition according to claim 1, characterized in that, The vinyl elastomer copolymer is selected from at least one of the group consisting of polybutadiene, styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, polyisoprene, styrene-isoprene copolymer, styrene-isoprene-styrene block copolymer, acrylonitrile-butadiene copolymer, and acrylonitrile-butadiene-styrene block copolymer.

4. The resin composition according to claim 1, characterized in that, The hydrogenated polyolefin compound is selected from at least one of the group consisting of hydrogenated styrene-butadiene-styrene triblock copolymers and maleic anhydride-substituted hydrogenated styrene-butadiene-styrene triblock copolymers.

5. The resin composition according to claim 1, characterized in that, The vinyl crosslinking agent is selected from at least one of the group consisting of divinylbenzene, divinylbenzyl ether, or 1,2-bis(vinylphenyl)ethane.

6. The resin composition according to claim 1, characterized in that, Further includes: An accelerator, wherein the accelerator is selected from at least one of the group consisting of di-tert-butyl peroxide, dilauroyl peroxide, benzoyl peroxide, tert-butyl peroxyacetate, tert-butyl peroxybenzoate, 1,1-di-tert-butylperoxy-3,5,5-trimethylcyclohexane, 1,1-di-tert-butylperoxycyclohexane, 2,2-di(tert-butylperoxy)butane, bis(4-tert-butylcyclohexyl)peroxydicarbonate, hexadecyl peroxydicarbonate, tetradecyl peroxydicarbonate, dipentylhexyl peroxide, diisopropylbenzene peroxide, bis(tert-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-di-tert-butylperoxyhexane, 2,5-dimethyl-2,5-di-tert-butylperoxyhexyne, and diisopropylbenzene hydroperoxide.

7. The resin composition according to claim 1, characterized in that, Further includes: An inorganic filler, wherein the inorganic filler is selected from at least one of the group consisting of silicon dioxide, aluminum oxide, aluminum hydroxide, magnesium oxide, magnesium hydroxide, calcium carbonate, aluminum nitride, boron nitride, silicon aluminum carbide, silicon carbide, titanium dioxide, zinc oxide, zirconium oxide, barium sulfate, magnesium carbonate, barium carbonate, mica, talc, and graphene.

8. The resin composition according to claim 1, characterized in that, Further includes: Flame retardants, inhibitors, silane coupling agents, surfactants, toughening agents, core-shell rubbers, light stabilizers, or combinations thereof.

9. A laminated plate, characterized in that, include: A resin substrate comprising a plurality of prepreg sheets, each of the prepreg sheets being formed by coating a reinforcing material with the resin composition as described in claim 1; and A metal foil layer is disposed on at least one surface of the resin substrate.

10. A printed circuit board, characterized in that, It includes the laminated plate as described in claim 9.

Images