Antenna unit and communication equipment
By employing a low-loss dielectric substrate and a C-slot structure in the substrate-integrated waveguide antenna, the problem of excessive dielectric loss is solved, improving the antenna's radiation efficiency and signal transmission quality, making it suitable for modern wireless communication systems.
Patent Information
- Application Number
- CN202511628332.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-07
- Publication Date
- 2026-01-30
AI Technical Summary
Existing substrate-integrated waveguide antennas suffer from excessive dielectric loss at high frequencies, resulting in low antenna radiation efficiency.
A combination of a low-loss dielectric substrate and a substrate-integrated waveguide structure is adopted. By setting the substrate-integrated waveguide structure and the coplanar waveguide feeding structure inside the dielectric substrate, a C-shaped gap is formed, which achieves low-loss feeding and good impedance matching.
It improves the antenna's radiation efficiency and signal transmission quality, reduces reflection loss, and meets the application requirements of modern wireless communication systems.
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Figure CN121440132A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of communication technology, and in particular to an antenna unit and a communication device. Background Technology
[0002] Substrate-integrated waveguide slot antennas are a novel antenna technology applied in the 2.4-2.5 GHz frequency band, widely used in communication systems such as wireless LANs and Bluetooth. These antennas construct waveguide structures by forming a metallized via array on a dielectric substrate and etching slots on the surface to achieve electromagnetic wave radiation. They offer advantages such as low loss, high quality factor, and ease of planar integration, and are gradually becoming a research hotspot in RF front-end design.
[0003] In implementing the embodiments of this application, the inventors discovered that existing substrate-integrated waveguide antennas typically use conventional microwave substrates such as FR4 or Rogers for substrate material selection. These materials suffer from excessive dielectric loss at high frequencies, leading to reduced antenna radiation efficiency and compromised signal transmission quality. Specifically, the loss tangent of conventional substrates is usually above 0.01. When operating at frequencies above 2.4 GHz, a significant amount of electromagnetic energy is converted into heat loss during transmission, severely impacting the overall performance of the antenna. Summary of the Invention
[0004] The main technical problem solved by the embodiments of this application is to provide an antenna unit that effectively solves the technical problem of low antenna radiation efficiency caused by excessive dielectric loss of conventional microwave substrates in the prior art by adopting a combination of low-loss dielectric substrate and substrate integrated waveguide structure.
[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is: providing an antenna unit, including a dielectric substrate, a substrate integrated waveguide structure, a radiating slot, and a coplanar waveguide feeding structure. The dielectric substrate includes a first surface and a second surface disposed opposite to each other. The substrate integrated waveguide structure is disposed inside the dielectric substrate and is formed by a plurality of conductive components arranged along a preset path. The plurality of conductive components penetrate the thickness direction of the dielectric substrate. The radiating slot is disposed on the first surface and is located within the coverage area of the substrate integrated waveguide structure. The coplanar waveguide feeding structure is disposed on the second surface and is electrically connected to the substrate integrated waveguide structure for feeding power to the radiating slot.
[0006] Optionally, the radiation gap includes a first straight segment, a second straight segment, and a third straight segment connected to each other, wherein the first straight segment and the third straight segment are arranged in parallel, and the second straight segment is perpendicularly connected to the first straight segment and the third straight segment.
[0007] Optionally, the radiation slit is a C-shaped slit.
[0008] Optionally, the opening of the radiating slot faces the coplanar waveguide feeding structure.
[0009] Optionally, the plurality of conductive components are arranged at equal intervals along the preset path, and the spacing between adjacent conductive components is equal to the diameter of the conductive component.
[0010] Optionally, the coplanar waveguide feeding structure includes a signal conductor and a plurality of ground conductors disposed on both sides of the signal conductor, and the signal conductor is electrically connected to the substrate integrated waveguide structure.
[0011] Optionally, the length of the C-shaped slit is 35 mm to 45 mm.
[0012] Optionally, the first surface is provided with a first metal layer, and the radiation slit is disposed on the first metal layer.
[0013] Optionally, the plurality of conductive components are metallized vias, and the inner walls of the metallized vias are plated with a metal layer.
[0014] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of this application is to provide a communication device including any of the antenna elements mentioned above.
[0015] This application provides an antenna unit including a dielectric substrate, a substrate-integrated waveguide structure, a radiating slot, and a coplanar waveguide feeding structure. The dielectric substrate includes a first surface and a second surface disposed opposite to each other. The substrate-integrated waveguide structure is disposed inside the dielectric substrate and is formed by a plurality of conductive components arranged along a predetermined path, the plurality of conductive components penetrating the thickness direction of the dielectric substrate. The radiating slot is disposed on the first surface and is located within the coverage area of the substrate-integrated waveguide structure. The coplanar waveguide feeding structure is disposed on the second surface and is electrically connected to the substrate-integrated waveguide structure for feeding power to the radiating slot. By setting the substrate-integrated waveguide structure to be formed by a plurality of conductive components penetrating the thickness direction of the dielectric substrate, it has good electromagnetic shielding effect and low transmission loss characteristics, and can efficiently transmit energy to the radiating slot. Furthermore, the coplanar waveguide feeding structure is disposed on the second surface of the dielectric substrate and electrically connected to the substrate-integrated waveguide structure, achieving low-loss feeding and good impedance matching. The radiating slot is located on the first surface and within the coverage area of the substrate-integrated waveguide structure, ensuring effective electromagnetic radiation. The coordinated operation of the various structures further improves the overall efficiency of the antenna. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0017] Figure 1 This is a schematic diagram of the antenna element according to an embodiment of this application; Figure 2 This is a schematic diagram of the antenna element from another perspective in an embodiment of this application; Figure 3 This is an exploded view of the antenna element in an embodiment of this application; Figure 4 This is an S11 curve diagram of the antenna element in an embodiment of this application; Figure 5 This is a frequency variation diagram of the antenna efficiency of the antenna element in an embodiment of this application; Figure 6 This is a diagram showing the antenna gain variation of the antenna element in an embodiment of this application; Figure 7 This is the radiation pattern of the antenna element in this embodiment at 2.45 GHz.
[0018] The reference numerals in the detailed embodiments are as follows: 100, antenna element; 10, dielectric substrate; 11, first surface; 12, second surface; 20, substrate integrated waveguide structure; 21, conductive component; 30, radiation gap; 31, first straight segment; 32, second straight segment; 33, third straight segment; 40. Coplanar waveguide feeding structure; 41. Signal conductor. Detailed Implementation
[0019] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0020] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0021] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0022] Please see Figure 1 and Figure 2 The antenna unit 100 includes a dielectric substrate 10, which has a first surface 11 and a second surface 12 disposed opposite to each other, providing mechanical support and an electromagnetic transmission medium for the antenna unit 100. A substrate-integrated waveguide structure 20 is disposed inside the dielectric substrate 10. This structure is formed by multiple conductive components 21 arranged along a predetermined path, with the multiple conductive components 21 penetrating the thickness direction of the dielectric substrate 10, thus constructing a waveguide transmission channel inside the dielectric substrate 10. A radiating slot 30 is disposed on the first surface 11, located within the coverage area of the substrate-integrated waveguide structure 20, and serves as a radiating unit for electromagnetic waves. A coplanar waveguide feed structure 40 is disposed on the second surface 12 and electrically connected to the substrate-integrated waveguide structure 20, responsible for efficiently transmitting radio frequency signals to the radiating slot 30 to achieve electromagnetic radiation.
[0023] In this embodiment, the radiating slot 30 adopts a C-shaped slot structure. The C-shaped slot consists of an open annular structure, including three sides and an open end. This slot shape can generate a specific current distribution pattern within the operating frequency band, resulting in good radiation characteristics. Compared to a closed annular slot, the C-shaped structure has a wider impedance bandwidth adjustment range, and the input impedance characteristics of the antenna can be optimized by adjusting the opening position and size. Simultaneously, the opening design of the C-shaped slot allows the electromagnetic field to be coupled more effectively from the substrate-integrated waveguide structure 20 to the radiating slot 30, improving feeding efficiency.
[0024] Furthermore, in this embodiment, the opening of the C-slot faces the coplanar waveguide feed structure 40. This orientation establishes an optimized coupling relationship between the radiating slot 30 and the feed structure. When the coplanar waveguide feed structure 40 feeds an RF signal to the substrate-integrated waveguide structure 20, electromagnetic energy propagates along the waveguide structure and excites surface currents in the C-slot region. Since the opening of the C-slot faces the feed structure, the electromagnetic field can couple more directly into the slot from the opening, forming a strong edge field distribution. This configuration improves the energy transfer efficiency between the feed network and the radiating element, reduces reflection loss, and enables the antenna to achieve better impedance matching characteristics within the operating frequency band.
[0025] Please combine Figure 4 In this embodiment, the length of the C-shaped slot is set to 35 mm to 45 mm. This length parameter is a key factor in determining the antenna's resonant frequency. According to the basic principles of slot antennas, the slot length is typically designed to be approximately half the operating wavelength. Considering the wavelength shortening effect of the dielectric substrate 10 and the unique current path of the C-shaped structure, a length range of 35 to 45 mm ensures good resonant characteristics of the antenna in the 2.4 to 2.5 GHz frequency band. This size range provides design flexibility for dielectric substrates 10 with different dielectric constants. By adjusting the slot length within this range, the center frequency and bandwidth characteristics of the antenna element 100 can be precisely controlled.
[0026] Please see Figure 3 The radial slit 30 adopts a geometric structure composed of a first straight segment 31, a second straight segment 32, and a third straight segment 33. The first straight segment 31 and the third straight segment 33 are arranged in parallel, and the second straight segment 32 connects them perpendicularly, forming a standard C-shaped geometric shape. This clear geometric definition provides a clear technical basis for the precise manufacturing and performance simulation of the slit.
[0027] In this embodiment, multiple conductive components 21 are arranged at equal intervals along a preset path, with the spacing between adjacent conductive components 21 being equal to the diameter of the conductive component 21. This proportional arrangement is a key design parameter for realizing the high-performance substrate-integrated waveguide structure 20. When the spacing and diameter are kept equal, the gap width formed between adjacent conductive components 21 is moderate, which can effectively suppress electromagnetic wave leakage from the gap without increasing manufacturing difficulty and cost due to excessively dense conductive components 21. This arrangement enables the substrate-integrated waveguide structure 20 to have electromagnetic characteristics similar to traditional metal waveguides, maintaining low-loss transmission within the operating frequency band while ensuring a uniform distribution of the electromagnetic field inside the waveguide.
[0028] Please continue reading. Figure 3 In this embodiment, multiple conductive components 21 are arranged at equal intervals along a preset path, with the spacing between adjacent conductive components 21 being equal to the diameter of the conductive component 21. This proportional arrangement is a key design parameter for realizing the high-performance substrate-integrated waveguide structure 20. When the spacing and diameter are kept equal, the gap width formed between adjacent conductive components 21 is moderate, which can effectively suppress electromagnetic wave leakage from the gap without increasing manufacturing difficulty and cost due to excessively dense conductive components 21. This arrangement enables the substrate-integrated waveguide structure 20 to have electromagnetic characteristics similar to traditional metal waveguides, maintaining low-loss transmission within the operating frequency band while ensuring a uniform distribution of the electromagnetic field inside the waveguide.
[0029] Specifically, in this embodiment, a first metal layer 101 is disposed on the first surface 11, and a radiation slit 30 is disposed on the first metal layer 101. The first metal layer 101 is formed by processes such as sputtering, electroplating or lamination, and covers most of the area of the first surface 11. The radiation slit 30 is formed into an opening region of a specific shape in the first metal layer 101 by photolithography and etching processes.
[0030] Meanwhile, multiple conductive components 21 are implemented using a metallized via structure, with the inner walls of the metallized vias plated with a metal layer (not shown). In the specific manufacturing process, through-holes are first formed by drilling or laser drilling in the dielectric substrate 10, and then a metal layer is deposited on the hole walls through chemical copper plating or electroplating processes to form a conductive path. This metallized via structure electrically connects the first metal layer 101 of the first surface 11 to the metal structure of the second surface 12, constituting a complete substrate-integrated waveguide shielding system. This manufacturing scheme is fully compatible with mature printed circuit board processes, enabling mass production and effectively controlling manufacturing costs.
[0031] In this embodiment, the substrate-integrated waveguide structure 20 is implemented using equally spaced metallized vias. The inner walls of the vias are plated with a metal layer, and the spacing between adjacent vias is equal to the via diameter, ensuring that the transmission characteristics of the waveguide structure are optimized. The first metal layer 101 of the first surface 11 is formed with a precise gap pattern through a photolithography etching process.
[0032] The coplanar waveguide feed structure 40 consists of a central signal conductor 41 and two side ground conductors (not shown). The signal conductor 41 is electrically connected to the substrate-integrated waveguide structure 20 via vias or direct coupling. This complete feed configuration ensures low-loss transmission throughout the entire path from the RF interface to the radiating slot 30.
[0033] Please continue reading. Figures 5-7 This application integrates radiating element design, waveguide structure optimization, feed network configuration, and manufacturing process to form a complete antenna element 100 technical solution with excellent performance, mature technology, and easy mass production. It can achieve a reflection coefficient of less than -6 dB, a radiation efficiency of more than -1 dB, and a gain of about 5 dB in the 2.4 to 2.5 GHz frequency band, meeting the application requirements of modern communication systems such as wireless local area networks and Bluetooth.
[0034] This application provides an antenna unit 100, including a dielectric substrate 10, a substrate-integrated waveguide structure 20, a radiating slot 30, and a coplanar waveguide feeding structure 40. The dielectric substrate 10 includes a first surface 11 and a second surface 12 disposed opposite to each other. The substrate-integrated waveguide structure 20 is disposed inside the dielectric substrate 10 and is formed by a plurality of conductive components 21 arranged along a predetermined path. The plurality of conductive components 21 penetrate the thickness direction of the dielectric substrate 10. The radiating slot 30 is disposed on the first surface 11 and is located within the substrate-integrated waveguide structure 20. Within the coverage area of the substrate 10, the coplanar waveguide feed structure 40 is disposed on the second surface 12. The coplanar waveguide feed structure 40 is electrically connected to the substrate integrated waveguide structure 20 and is used to feed power to the radiation slot 30. The substrate integrated waveguide structure 20, formed by multiple conductive components 21 penetrating the thickness direction of the dielectric substrate 10, has good electromagnetic shielding effect and low transmission loss characteristics, enabling efficient energy transmission to the radiation slot 30. Furthermore, the coplanar waveguide feed structure 40, disposed on the second surface 12 of the dielectric substrate 10 and electrically connected to the substrate integrated waveguide structure 20, achieves low-loss feeding and good impedance matching. The radiation slot 30 is located on the first surface 11 and within the coverage area of the substrate integrated waveguide structure 20, ensuring effective electromagnetic radiation. The coordinated operation of each structure further improves the overall efficiency of the antenna.
[0035] This embodiment provides a communication device, including the antenna unit 100 described in any of the foregoing embodiments.
[0036] The communication device can be a wireless router, wireless access point, Bluetooth device, or other wireless communication device operating in the 2.4 to 2.5 GHz frequency band. The antenna unit is integrated into the RF front-end module and connected to the RF transceiver circuit through a coplanar waveguide feeding structure to realize the transmission and reception of electromagnetic waves.
[0037] The antenna unit employs substrate-integrated waveguide technology, featuring a compact structure that can be directly fabricated on the main circuit board or installed as a standalone module. This integration method simplifies the assembly process and reduces production costs. Simultaneously, the design based on a low-loss dielectric substrate ensures excellent performance of the communication equipment in the target frequency band, meeting the application requirements of modern wireless communication systems for miniaturized, high-performance antennas.
[0038] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. An antenna unit, characterized by The antenna unit comprises: a dielectric substrate comprising a first surface and a second surface arranged oppositely; a substrate integrated waveguide structure arranged inside the dielectric substrate, the substrate integrated waveguide structure being formed by a plurality of electrically conductive components arranged along a preset path, the plurality of electrically conductive components penetrating a thickness direction of the dielectric substrate; a radiation slot arranged on the first surface, the radiation slot being located in a coverage area of the substrate integrated waveguide structure; and a coplanar waveguide feed structure arranged on the second surface, the coplanar waveguide feed structure being electrically connected to the substrate integrated waveguide structure and configured to feed electricity to the radiation slot.
2. The antenna unit of claim 1, wherein the radiation slot comprises a first straight segment, a second straight segment and a third straight segment connected to each other, the first straight segment and the third straight segment being arranged in parallel, and the second straight segment being arranged perpendicularly to the first straight segment and the third straight segment.
3. The antenna unit of claim 1, wherein the radiation slot is a C-shaped slot.
4. The antenna unit of claim 1, wherein an opening of the radiation slot faces the coplanar waveguide feed structure.
5. The antenna unit of claim 1, wherein the plurality of electrically conductive components are arranged at equal intervals along the preset path, and a distance between adjacent electrically conductive components is equal to a diameter of the electrically conductive components.
6. The antenna unit of claim 1, wherein the coplanar waveguide feed structure comprises a signal conductor and a plurality of ground conductors arranged on both sides of the signal conductor, and the signal conductor is electrically connected to the substrate integrated waveguide structure.
7. The antenna unit of claim 3, wherein a length of the C-shaped slot is 35 mm to 45 mm.
8. The antenna unit of claim 1, wherein the first surface is provided with a first metal layer, and the radiation slot is arranged on the first metal layer.
9. The antenna unit of claim 1, wherein the plurality of electrically conductive components are metalized vias, and inner walls of the metalized vias are plated with a metal layer.
10. A communication device, characterized by An antenna unit as claimed in any one of claims 1 to 9.
