Thermally conductive material suitable for local micro heat source of integrated chip and preparation method thereof

By using topology optimization design and pre-nucleated ice template method to prepare thermally conductive materials, the heat dissipation problem of local micro-heat sources in integrated chips was solved, and the thermal conductivity was improved and the temperature was reduced. This solved the problems of poor thermal conductivity enhancement effect and mismatch between structure and heat source of existing materials.

CN121610250BActive Publication Date: 2026-05-08HUAZHONG UNIV OF SCI & TECH
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Patent Information

Application Number
CN202610132806.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-01-30
Publication Date
2026-05-08
Estimated Expiration
2046-01-30

AI Technical Summary

Technical Problem

Existing materials have insufficient thermal conductivity and mismatch between structure and heat source in the local micro heat source heat dissipation of integrated chips. Traditional manufacturing processes make it difficult to achieve directional and dense arrangement of thermally conductive fillers, resulting in low heat dissipation efficiency and inability to effectively reduce the temperature of micro heat source.

Method used

A thermally conductive filler skeleton was designed using topology optimization, and ice crystal growth was controlled by a pre-nucleated ice template method to achieve directional and dense arrangement of the thermally conductive filler. This resulted in the fabrication of a patterned, dense, thin-walled thermally conductive material. The material was then composited with a polymer matrix using a vacuum impregnation method to form a thermally conductive material suitable for localized micro-heat sources in integrated chips.

Benefits of technology

It significantly improves the inter-surface thermal conductivity of the material, enhances heat dissipation efficiency, solves the problem of poor thermal conductivity enhancement effect of traditional materials, and achieves efficient reduction of micro heat source temperature.

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Abstract

The application provides a heat-conducting material suitable for local micro heat sources of integrated chips and a preparation method thereof, and the preparation method comprises the following steps: S1, obtaining a topological structure of a heat-conducting filler framework according to the parameters of the local micro heat source; S2, designing an ice template mold, comprising a heat-conducting metal block with a cavity protrusion on the upper surface and a heat insulation plate, the heat insulation plate is covered on the upper surface of the heat-conducting metal block and exposes the cavity protrusion as a cold source; S3, controlling the temperature to form uniform crystal nuclei on the cavity protrusion, adding a heat-conducting filler dispersion liquid, controlling the temperature of the cavity protrusion to be close to the freezing point, directional freezing, forming an ice template-heat-conducting filler composite, freeze-drying, and obtaining the heat-conducting filler framework; and S4, treating the heat-conducting filler framework and a polymer matrix prepolymer by a vacuum impregnation method to obtain the heat-conducting material. The heat-conducting material and method solve the problems of poor heat-conducting strengthening effect, and mismatching between the structure and the heat source of the existing material, and realize efficient reduction of the temperature of the micro heat source.
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