Telecommunication cabinet door and related telecommunication cabinet

Abstract

The application relates to a door for a telecommunication cabinet. The door includes a cooling system including a heat exchanger and at least two fan units. The door also includes a wind deflector coupled to an inner surface of the door. One of the fan units is configured to draw outside air into the telecommunications cabinet, and one of the fan units is configured to draw heated inside air out of the telecommunications cabinet. The air deflector is configured to direct an air flow from one or more of the at least two fan units into an interior cavity of the telecommunication cabinet. Related telecommunications cabinets are also described herein.

Description

Technical Field

[0001] This invention relates to telecommunications equipment, and more particularly to doors for telecommunications cabinets and related telecommunications cabinets. Background Technology

[0002] The purpose and construction of enclosures for housing electronic and telecommunications equipment are well known. For example, as shown in Figures 1A to 1C, an enclosure (or telecommunications cabinet) 10 is typically a rectangular box with side walls 13, a rear wall 14, a bottom plate 11, and a top plate 12. These enclosures 10 are typically constructed with at least one sealed weatherproof compartment in which the equipment is housed (e.g., an upper compartment 15a within the interior cavity 15 of the enclosure 10). The enclosure 10 will be provided with openings for access to one or more of its equipment compartments, and doors 20 for opening and closing over these openings. Doors 20 are typically adapted to seal over at least one internal compartment 15a, 15b of the enclosure 10. Telecommunications cabinets 10 are typically designed to prevent the ingress of dust, dirt, and water; however, overheating is one of the single greatest threats to the electronic equipment housed within the cabinet 10. Overheating of these electronic devices can lead to potential malfunctions, failures, and unplanned, costly downtime. As is known to those skilled in the art, the performance of the equipment and the system to which it belongs will decrease as the equipment temperature increases. As a result, manufacturers of these equipment enclosures, as well as telecommunications system manufacturers and suppliers, have been looking for ways to cool the equipment housed within these enclosures or cabinets.

[0003] Because electronic cabinets house equipment that generates heat during operation, they typically include a thermal management or cooling system 50 (e.g., a heat exchanger) to prevent overheating. A common solution is to construct the cooling system 50 on the door 20 of the enclosure 10, with the aim of drawing ambient air from outside the enclosure 10 and circulating the air through the enclosure 10 to cool the equipment housed within. However, as shown in FIG1A, the cooling system 50 extends outward a distance D1 from the outer surface of the door 20, resulting in an unsightly appearance. Additionally, as shown in FIG1C, the air inlet 40 and air outlet 42 of the cooling system 50 are positioned on the door 20 relative to the compartment housing the equipment (i.e., in FIG1C, the air inlet 40 and air outlet 42 are located in the upper portion of the door 20 to allow air circulation into and out of the upper compartment 15a of the cabinet 10). Therefore, the entire area of ​​the door 20 is not fully utilized, which ultimately leads to a decrease in the cooling capacity of the cooling system 50. Summary of the Invention

[0004] A first aspect of the invention relates to a door for a telecommunications cabinet. The door includes a cooling system comprising a heat exchanger and at least two fan units. The door also includes an air deflector coupled to an inner surface of the door. One of the fan units is configured to draw in outside air into the telecommunications cabinet, and another fan unit is configured to extract heated internal air from the telecommunications cabinet. The air deflector is configured to guide airflow from one or more of the at least two fan units into the interior cavity of the telecommunications cabinet.

[0005] Another aspect of the invention relates to a door for a telecommunications cabinet. The door includes a cooling system comprising a first fan unit and a second fan unit, the first fan unit being configured to draw outside air into the interior cavity of the telecommunications cabinet, and the second fan unit being configured to extract heated internal air from the interior cavity of the telecommunications cabinet. The door also includes a first air guide vane and a second air guide vane, the first air guide vane being coupled to an inner surface of the door and configured to guide airflow from the first fan unit into the interior cavity, and the second air guide vane being coupled to an inner surface of the door and configured to guide airflow from the interior cavity into the second fan unit.

[0006] Another aspect of the invention relates to a telecommunications cabinet. The telecommunications cabinet includes a base plate, a top plate, a rear wall, opposing side walls, and a door, the base plate, top plate, rear wall, opposing side walls, and door together defining an interior cavity configured to house electronic equipment therein. The door includes a cooling system comprising at least two fan units. The door also includes an air deflector coupled to an inner surface of the door. One of the fan units is configured to draw outside air into the telecommunications cabinet, and the other fan unit is configured to extract heated internal air from the telecommunications cabinet. The air deflector is configured to guide airflow from one or more of the at least two fan units into the interior cavity of the telecommunications cabinet.

[0007] Note that aspects of the invention described with respect to one embodiment may be incorporated into different embodiments, even if not specifically described therein. That is, features of all embodiments and / or any embodiment may be combined in any manner and / or combination. The applicant reserves the right to amend any originally filed claim and / or accordingly file any new claim, including the right to modify any originally filed claim to be subordinate to and / or incorporated into any feature of any other claim or claims, although not originally claimed in this manner. These and other objects and / or aspects of the invention are explained in detail in the specification set forth below. Other features, advantages, and details of the invention will be understood by those skilled in the art upon reading the accompanying drawings and the subsequent detailed description of preferred embodiments, which are merely illustrative of the invention. Attached Figure Description

[0008] Figure 1A is a front perspective view of a known telecommunications cabinet with a cooling system mounted on the outer surface of the door.

[0009] Figure 1B is a front view of the telecommunications cabinet shown in Figure 1A.

[0010] Figure 1C is a front perspective view of the telecommunications cabinet shown in Figure 1A with the door open.

[0011] Figure 2A This is a front perspective view of a telecommunications cabinet with a cooling system integrated into the door, according to an embodiment of the present invention.

[0012] Figure 2B yes Figure 2A The image shows a side view of the telecommunications cabinet.

[0013] Figure 2C yes Figure 2A The image shows a front view of a telecommunications cabinet.

[0014] Figure 3A It is for use according to an embodiment of the present invention. Figures 2A to 2C The image shows a front view of the door of a telecommunications cabinet.

[0015] Figure 3B yes Figure 3A The image shows a top view of the door.

[0016] Figure 3C yes Figure 3A The rear view of the door is shown in the image.

[0017] Figure 3D yes Figure 3A The image shows a side view of the door.

[0018] Figure 3E According to an embodiment of the present invention Figure 3A The side view of the door shown shows the air deflector removed.

[0019] Figure 3F yes Figure 3E The rear view of the door is shown in the image.

[0020] Figure 4A According to an embodiment of the present invention Figures 2A to 2C The image shows a front perspective view of an alternative door for a telecommunications cabinet.

[0021] Figure 4B yes Figure 4A The image shows a rear perspective view of the door.

[0022] Figure 5A According to an embodiment of the present invention Figures 4A to 4B The image shows a front perspective view of the core insert of the door.

[0023] Figure 5B yes Figure 5A The rear perspective view of the core insert is shown in the figure.

[0024] Figure 5C yes Figure 5A The front view of the core insert is shown in the image.

[0025] Figure 5D yes Figure 5A The rear view of the core insert is shown in the image.

[0026] Figure 5E yes Figure 5A The image shows a side view of the core insert.

[0027] Figure 5F It is along the core insert Figure 5E The top view section shown is taken from line 5F-5F.

[0028] Figure 6A This is the utilization of the embodiments of the present invention. Figures 3A to 3E or Figures 4A to 4B The image shows a front perspective view of the equipment and power bay of the three doors in the center.

[0029] Figure 6B yes Figure 6A The front view of the equipment and power compartment shown in the image.

[0030] Figure 6C yes Figure 6A The image shows a side view of the equipment and power compartment.

[0031] Figures 7A to 7G This is a thermal simulation illustrating the utilization of an embodiment according to the invention. Figures 4A to 4B The image shows an example of heat dissipation within a telecommunications cabinet with a door.

[0032] Figures 8A to 8B This illustrates an embodiment according to the present invention. Figures 4A to 4B The graph shows the operating fan curve of the door. Detailed Implementation

[0033] The invention will now be described more fully below with reference to the accompanying drawings, in which embodiments of the invention are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0034] In the accompanying drawings, certain layers, components, or features may be exaggerated for clarity, and dashed lines indicate optional features or operations unless otherwise stated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0035] It will be understood that although the terms first, second, etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or segment from another region, layer, or segment. Therefore, without departing from the teachings of the invention, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment. Unless otherwise specifically indicated, the order of operations (or steps) is not limited to the order presented in the claims or drawings.

[0036] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms such as those defined in common dictionaries shall be interpreted as having the same meaning as they have in the context of the specification and related art, and shall not be interpreted in an idealized or overly formal form unless specifically defined herein. For the sake of brevity and / or clarity, well-known functions or constructions may not be described in detail.

[0037] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, the singular forms “a,” “an,” and “described” are also intended to include the plural forms unless the context clearly indicates otherwise. It will also be understood that, when used in this specification, the terms “comprises” and / or “comprising” specify the presence of the said feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0038] As used herein, phrases such as “between X and Y” and “between about X and Y” should be interpreted as including both X and Y. As used herein, phrases such as “between about X and Y” mean “between about X and about Y”. As used herein, phrases such as “from about X to Y” mean “from about X to about Y”.

[0039] It will be understood that when an element is described as being "on," "attached," "connected," "joined," or "in contact" with another element, it may be directly on, directly attached to, directly connected to, directly joined to, or directly in contact with the other element, or there may be intermediate elements. Conversely, when an element is described as being "directly" on, "directly attached to," "directly connected to," "directly joined to," or "directly in contact" with another element, there are no intermediate elements. Those skilled in the art will also understand that references to structures or features "adjacent" to another feature may have portions that overlap with or are located below the adjacent feature.

[0040] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” “up,” “side,” “left,” “right,” etc., are used herein to describe the relationship of one element or feature to another element or feature as shown in the accompanying drawings. It should be understood that, in addition to the orientation shown in the figures, spatial relative terms are also intended to cover different orientations of the device in use or operation. For example, if the device in the figures is inverted, an element described as “below” or “under” other elements or features would be oriented as “above” other elements or features. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the descriptions of relative spatial relationships used herein shall be interpreted accordingly.

[0041] Embodiments of the present invention relate to a door for a telecommunications cabinet. According to an embodiment of the invention, the door has a cooling system integrated therein. The cooling system utilizes a considerable area of ​​the door, which helps to improve the cooling capacity within the telecommunications cabinet. Furthermore, the cooling system has an ultra-thin design, thus providing an aesthetically pleasing appearance for the cabinet. Reference will now be made to it. Figures 2A to 8B The embodiments of the present invention will be described in more detail below.

[0042] refer to Figures 2A to 2C The diagram illustrates a housing or communication cabinet 100 according to an embodiment of the present invention. The telecommunications cabinet 100 is identical or similar to the housing or telecommunications cabinet 10 described above and shown in Figures 1A to 1C. Figures 2A to 2CAs shown, the telecommunications cabinet 100 is typically a rectangular box having side walls 130, a rear wall 140, a bottom plate 110, and a top plate 120. The telecommunications cabinet 100 also includes doors 200, 200', 300 hinged to one of the side walls 130. According to an embodiment of the invention, doors 200, 200', 300 include cooling systems 250, 250', 350, which will be described in further detail below. These components together define an interior cavity 150 in which electronic devices 50, 50' (e.g., the upper portion or upper chamber 150a) can be installed (see, for example...). Figures 7A to 7G ).

[0043] refer to Figures 3A to 3F The diagram illustrates doors 200, 200' for a telecommunications cabinet 100 according to an embodiment of the invention. According to an embodiment of the invention, doors 200, 200' have a cooling system 250 integrated therein. Figure 3A As shown, door 200 has a height H and a width W to fit a standard telecommunications cabinet 100; however, the height H and width W can be modified to accommodate telecommunications cabinets 100 of different sizes. Figure 3B As shown, door 200 also has a thickness (or depth) D2. (As...) Figure 3B As shown, the thickness D2 of door 200 is less than the distance D1 from which the cooling system 50 extends outward from the outer surface of door 20 as shown in Figure 1A, thus achieving a more aesthetically pleasing appearance than the aforementioned conventional telecommunications cabinet 10. In some embodiments, door 200 may have a width W of approximately 32 inches, a height H of approximately 72 inches, and a thickness or depth D2 of approximately 42 inches.

[0044] like Figures 3A to 3D As shown, door 200 has an outer surface 210a (i.e., when door 200 is in the closed position, surface 210a is located outside the cavity 150) and an inner surface 210b (i.e., when door 200 is in the closed position, surface 210b is located inside the cavity 150) (e.g., as shown). Figures 2A to 2C (As shown). In some embodiments, door 200 includes one or more vents 220, 222, 224, which are configured to allow air to enter and / or exit the interior 150 of the telecommunications cabinet 100. Figure 3A , Figure 3B and Figure 3DAs shown, vents 220, 222, and 224 can be positioned at various locations on door 200 (e.g., front, top, side, etc.). In some embodiments, door 200 also includes a handle 212 and a locking mechanism 214. In some embodiments, cavity 150 is divided into an upper portion or upper chamber 150a and a lower portion or lower chamber 150b, the upper portion or upper chamber typically housing telecommunications or electronic equipment 50, 50' such as radio equipment, multi-carrier power amplifiers (MCPAs), DC power distribution units, rectifiers, and wireless cell site backhaul equipment, the lower portion or lower chamber typically housing power supplies and / or batteries (see example...). Figures 7A to 7G ).

[0045] Those skilled in the art will understand that the separately cooled upper portion or upper chamber 150a and lower portion or lower chamber 150b of the cavity 150 can affect the arrangement of telecommunications equipment or electronic equipment 50, 50' within the cabinet 100. For example, it may be desirable to house the equipment that generates the most heat (e.g., an AC-to-DC power rectifier unit or equipment that can withstand higher operating temperatures) in one chamber (e.g., upper chamber 150a) and the equipment that generates the least heat (e.g., radio equipment or equipment limited to operation at lower temperatures) in another chamber (e.g., lower chamber 150b), resulting in lower chamber 150b requiring less cooling and thus saving power. Alternatively, it may be desirable to house the most heat-sensitive equipment in the same chamber and to control that chamber more closely. As another alternative, it may be desirable to attempt to balance or equalize the heat output of the equipment in each chamber 150a, 150b. Other arrangements may also be suitable.

[0046] like Figure 3C and Figure 3D As shown, door 200 also includes a cooling system 250. In some embodiments, the cooling system 250 includes a heat exchanger 247. In some embodiments, the cooling system 250 also includes a plurality of fan units 240, 242. In some embodiments, the cooling system 250 also includes a deflector or baffle 260. Note that the term "plate" as used herein does not necessarily have to be planar. In other words, the deflector or baffle described herein may have non-planar edges, for example, such as... Figure 3B , Figure 5B and Figure 5E As shown. As described in further detail below, in some embodiments, the air deflector 260 may be positioned on the inner surface of the door 200 and configured to direct airflow (e.g., cooled outside air) into the upper chamber 150a of the inner cavity 150 of the telecommunications cabinet 100. In some embodiments, the air deflector 260 may be used, for example, with an equipment or power plant bay 400 having a cooling capacity of approximately 4000W (see also, for example...). Figures 6A to 6C ).

[0047] like Figures 3E to 3F As shown, in some embodiments, for example when door 200' is mounted on a power supply compartment 400 of an equipment having a cooling capacity of approximately 5000W (see also, for example...) Figures 6A to 6C The air deflector 260 can be removed from door 200'. The same cooling system 350 is simulated to have different cooling capacities because the airflow AF within rack 100 can increase when the air deflector 260 is removed. Without the air deflector 260, the cool air does not have to undergo many directional changes, and the air can move more quickly throughout rack 100. When the air deflector 260 is removed, rack 100 will be in a "full equipment" configuration, which will allow for an increased airflow AF above the top of rack 100 (i.e., through airflow channel 155).

[0048] refer to Figures 4A to 4B This illustrates another door 300 for a telecommunications cabinet 100 according to an embodiment of the present invention. The properties and / or characteristics of door 300 may be referenced above. Figures 3A to 3F The doors 200 and 200' shown in the figure are described, and for the purpose of discussion Figures 4A to 4B For the purposes of this paper, repeated discussion of these can be omitted.

[0049] like Figures 4A to 4B As shown, door 300 has an outer surface 310a and an inner surface 310b. In some embodiments, door 300 includes one or more vents 320, 324 configured to allow air to enter and / or exit the cavity 150 of telecommunications cabinet 100. In some embodiments, door 300 also includes a handle 312 and a locking mechanism 314 (see example...). Figures 5C to 5F Similar to doors 200 and 200', door 300 includes a cooling system 350, which in some embodiments includes a heat exchanger 347. In some embodiments, the cooling system 350 is integrated with door 300. In other embodiments, door 300 may have a cavity 315, and the cooling system 350 is configured to be inserted into and secured within the cavity 315 of door 300. As shown, the cooling system 350 utilizes a considerable area of ​​the door, which helps to increase cooling capacity by 30% or more compared to current cooling system designs (see, for example, Figures 1A to 1C).

[0050] Cooling system 350 Figures 5A to 5F This is shown in more detail below. For example... Figures 5A to 5FAs shown, in some embodiments, the cooling system 350 includes a main compartment or housing 353 and an outer frame 351. The outer frame 351 extends outward from and around the periphery of the main compartment 353. In some embodiments, the main compartment 353 is sized and configured to be received within a cavity 315 of the door 300, and the outer frame 351 is configured to be fixed to the inner surface 310b of the door 300.

[0051] In some embodiments, the main compartment 353 of the cooling system 350 includes a plurality of fan units 340, 342. In some embodiments, the main compartment 353 may also include one or more vents 354. The plurality of fan units 340, 342 and one or more vents 354 provide inlets for cold air (i.e., air from outside the rack) to enter the interior cavity 150 of the rack 100, and / or provide outlets for heated air (i.e., air heated by the electronic devices 50, 50') to leave the interior cavity 150 of the rack 100 (see also, for example, see...). Figures 7A to 7G In some embodiments, the main compartment 353 includes at least one lower fan unit 340 and at least one upper fan unit 342. In some embodiments, the main compartment 353 includes two lower fan units 340 and two upper fan units 342. In some embodiments, the lower fan units 340 are configured to draw air into the cavity 150 of the cabinet 100 (i.e., air inlet), and the upper fan units 342 are configured to extract air from the cavity 150 of the cabinet (i.e., air outlet). In other embodiments, the upper fan units 342 may be configured to draw air into the cavity 150, and the lower fan units 340 may be configured to extract air from the cavity 150. In some embodiments, the main compartment 353 may have a removable access cover 344 to allow easy maintenance of the lower fan units 340. Additionally, in some embodiments, the main compartment 353 may include a control unit 370. In some embodiments, control unit 370 may be configured to monitor the temperature within cavity 150 of telecommunications cabinet 100 (e.g., control unit 370 may include a thermometer or similar sensor) and control the operation of multiple fan units 340, 342 as needed. For example, in some embodiments, control unit 370 may be configured to turn on fan units 340, 342 when the temperature within cavity 150 of telecommunications cabinet 100 exceeds a predetermined maximum threshold. Similarly, in some embodiments, control unit 370 may be configured to turn off fan units 340, 342 when the temperature within cavity 150 of telecommunications cabinet 100 drops below a predetermined maximum threshold and / or drops to a predetermined minimum threshold. Alternatively, fan units 340, 342 (and / or control unit 370) may be remotely controlled.

[0052] As described in further detail below, in some embodiments, at least one lower fan unit 340 is configured to draw cooler (or ambient) air from the outside of the telecommunications cabinet 100 into the interior 150 of the telecommunications cabinet 100 (see, for example...). Figures 7A to 7G In some embodiments, at least one upper fan unit 342 is configured to draw heated internal air (e.g., heated by the operation of electronic devices 50, 50' stored in the cavity 150 of the telecommunications cabinet 100) from the cavity 150 of the telecommunications cabinet 100 and (e.g., through one or more vents 354) out of the telecommunications cabinet 100.

[0053] like Figures 5A to 5F As further shown, in some embodiments, the cooling system 350 also includes a lower air guide vane or lower baffle 360 ​​and an upper air guide vane or upper baffle 365. The lower air guide vane 360' and the upper air guide vane 365 are positioned on the inner surface 352b of the cooling system 350 and are configured to guide airflow within the cavity 150 of the telecommunications cabinet 100 (e.g., toward or from fan units 340, 342) (see example...). Figures 7A to 7G For example, in some embodiments, the lower air deflector 360 is positioned and configured to facilitate the guidance of airflow (i.e., outside air) from the lower fan unit 340 to the upper portion of the cavity 150 of the telecommunications cabinet 100 or the upper chamber 150a (i.e., the location within the cabinet 100 where the electronic devices 50, 50' are located). In some embodiments, the upper air deflector 365 is positioned and configured to facilitate the guidance of airflow (i.e., heated internal air) from the upper portion of the cavity 150 or the upper chamber 150a to the upper fan unit 342 and out of the telecommunications cabinet 100 (see, for example...). Figures 7A to 7G ).

[0054] Figure 5F It is along the cooling system 350 Figure 5E The top-view cross-sectional view taken along line 5F-5F is shown. Figure 5F As shown, in some embodiments, the heat exchanger 347 may include a plurality of vertically extending plates 355 serving as heat transfer surfaces. Each plate 355 is spaced apart from adjacent plates 355 and defines a gap 355a between them, which allows air to flow from the lower fan unit 340 and through the heat exchanger 347 and main compartment 353 of the cooling system 350. This improves the heat exchange surface area and thus improves the cooling efficiency of the heat exchanger 347 (and the cooling system 350). The external loop of the heat exchanger 347 draws in (or draws in) ambient air through the lower vent 320 and through the lower fan 340, then through the heat exchanger components (not shown), and exits the hot air through the upper vent 320. Figure 5FAs further shown, in some embodiments, the lower air deflector 360 may include a mesh or grille 362 configured to prevent debris from being drawn into the interior cavity 150 of the telecommunications cabinet 100, where debris could damage the electronic equipment 50, 50'. The mesh or grille 362 also helps prevent objects from falling into the baffle 360 ​​and prevents technicians from removing objects without removing the baffle 360 ​​from the door 300.

[0055] Note that the operation of the heat exchanger is well known to those skilled in the art and requires no further explanation herein. Those skilled in the art will also recognize that other types of heat exchangers, such as heat pipes and direct air cooling (DAC) devices combined with hydrophobic air filters to repel or prevent water or water vapor from entering the cabinet 100, may be used in place of the cooling system 350 and / or heat exchanger 347 discussed herein.

[0056] refer to Figures 6A to 6C In some implementations, the doors 200, 200', and 300 described herein are compatible with the equipment and power supply compartment 400. For example... Figures 6A to 6C As shown, the equipment and power compartment 400 is an extended telecommunications cabinet having side walls 430, a rear wall 440, a bottom plate 410, and a top plate 420, with doors 200, 200', and 300 hinged to one of the side walls 430. According to embodiments of the invention, the equipment and power compartment 400 may utilize a plurality of doors 200, 200', and 300 as described herein. These components together define an interior cavity 450 in which electronic devices 50, 50' may be installed. In some embodiments, each of the doors 200, 20', and 300 may provide an entrance to a separate internal compartment 450a, 450b, or 450c within the interior cavity 450 of the equipment and power compartment 400.

[0057] Now for reference Figures 7A to 7G A thermal simulation according to an embodiment of the present invention is shown, which illustrates the use of Figures 4A to 4B The example heat dissipation within the telecommunications cabinet 100 of door 300 is shown (airflow AF is indicated by the dashed arrow). Note that, utilizing... Figures 3A to 3F Doors 200 and 200' shown can achieve similar heat dissipation results within the telecommunications cabinet 100. For example... Figures 7A to 7GAs shown, air enters the door 300 via the lower fan unit 340 and then into the cooling system 350. The airflow AF from the cooling system 350 is guided via the lower air deflector 360 to the upper portion of the interior cavity 150 or the upper chamber 150a of the cabinet 100. The heated air (i.e., heated by the electronic equipment 50) from the upper portion of the interior cavity 150 or the upper chamber 150a of the cabinet 100 exits the door 300 via the upper fan unit 342 (and is further guided by the upper air deflector 365).

[0058] Figure 7A An exemplary heat dissipation of a cabinet 100 with six (6) rectifier shelves (i.e., electronic devices 50) utilizing a door 300 according to an embodiment of the present invention is shown. Thermal simulations show a heat dissipation of approximately 4000 W, an ambient temperature of approximately 46°C, and approximately 753 W / m². 2 The solar load is subject to environmental requirements set for Telcordia GR-487-CORE (telecom outdoor cabinet standard). For example... Figure 7A As shown, in some embodiments, the internal outlet temperature (i.e., the temperature of the air exiting from the lower air guide plate 360) is approximately 56.4°C, and the temperature change (Delta T) of the air entering and leaving the cooling system 350 is approximately 10.4°C. Therefore, according to embodiments of the invention, the cooling system 350 is capable of meeting the required cooling capacity of 4000W at a Delta T of 10°C, i.e., the cooling system 350 can absorb 4000W of heat and reduce the temperature by approximately 10°C. In some embodiments, an airflow channel 155 is formed within the upper portion of the cavity 150 of the cabinet 100 or the upper chamber 150a (e.g., the space between the top of the electronic device 50 and the top plate 120 of the cabinet 100). In some embodiments, the airflow channel 155 has a height X1 of approximately 88 mm.

[0059] Figures 7B to 7C Another exemplary heat dissipation of a cabinet 100 with seven (7) rectifier shelves (i.e., electronic devices 50') utilizing a door 300 according to an embodiment of the present invention is shown. Thermal simulations show a heat dissipation of approximately 4000 W, an ambient temperature of approximately 46°C, and approximately 753 W / m². 2 Solar load (according to GR-487 requirements). For example... Figures 7B to 7CAs shown, in some embodiments, the internal outlet temperature (i.e., the temperature of the air exiting from the lower air guide plate 360) is approximately 56.9°C, and the temperature change (Delta T) of the air entering and exiting the cooling system 350 is approximately 10.9°C. In some embodiments, an airflow channel 155 is formed in the upper portion of the inner cavity 150 of the cabinet 100 or in the upper chamber 150a (e.g., between the electronic device 50' and the top plate 120 of the cabinet 100). In some embodiments, the airflow channel 155 has a height of approximately 44 mm x 2. Therefore, according to embodiments of the invention, the cooling system 350 is able to meet the required cooling capacity of 4000 W at a Delta T of 10°C, i.e., the cooling system 350 can absorb 4000 W of heat and reduce the temperature by approximately 10°C using the relatively small airflow channel 155.

[0060] Figures 7D to 7E The diagram illustrates and compares the cabinet 100 with six (6) rectifier shelves (i.e., electronic devices 50) within the cavity 150 and adjacent to the cabinet 100 when using the door 300 according to an embodiment of the invention. Figure 7D ) and a cabinet 100 with seven (7) rectifier shelves (i.e., electronic equipment 50') Figure 7E Exemplary heat dissipation of the rear wall 140 of the ). For example Figure 7D As shown, in some embodiments, the cabinet 100 with six rectifiers has an average temperature of approximately 66.1°C and a maximum temperature of approximately 70.6°C at the rear of the cabinet. In contrast, as... Figure 7E As shown, in some embodiments, the cabinet 100 with seven rectifiers has an average temperature of approximately 67.9°C and a maximum temperature of approximately 73.1°C at the rear of the cabinet. These temperatures represent the exhaust temperatures from the electronic devices 50, 50'. The temperatures will be higher or lower based on the inlet temperature (i.e., the cold air from the cooling system 350 and heat exchanger 347).

[0061] Figures 7F to 7G A cabinet 100 having six (6) rectifiers (i.e., electronic devices 50) is shown and compared when using a door 300 including vents (e.g., vents 320, 322, 324) according to an embodiment of the invention. Figure 7F ) and a cabinet 100 with seven (7) rectifiers (i.e., electronic equipment 50') Figure 7G An exemplary heat dissipation pattern within the cavity 150 of the cabinet 100. For example, a 400mm x 100mm vent has a 60% opening area located on the front cover of the cabinet 100. Figure 7FAs shown, in some embodiments, the internal outlet temperature (i.e., the temperature of the air exiting from the lower air guide plate 360) is approximately 56.3°C, and the temperature change (Delta T) of the air entering and leaving the cooling system 350 is approximately 10.3°C. In contrast, as... Figure 7G As shown, the internal outlet temperature (i.e., the temperature of the air exiting from the lower air guide plate 360) is approximately 56.4°C, and the temperature change (Delta T) of the air entering and leaving the cooling system 350 is approximately 10.4°C. Therefore, the temperature of the 44mm airflow channel 155 will be the same as the temperature of the 88mm airflow channel 155. In some embodiments, vents 320, 322, 324 help increase the airflow through the upper portion of the interior 150 of the cabinet 100 (i.e., within the airflow channel 155), thereby contributing to more efficient cooling of the cabinet 100. These simulations show that the thermal performance of the cabinet 100 of the present invention is very similar to that of a cabinet with six rectifier shelves and a larger 88mm airflow channel 155 and a solid DC power distribution door, or a cabinet with seven rectifier shelves and a smaller 44mm airflow channel 155 and a ventilation door for the DC power distribution unit.

[0062] Figures 8A to 8B This illustrates an embodiment according to the present invention. Figures 4A to 4B The graph shows the operating fan curve of door 300. Note that... Figures 3A to 3F The doors 200 and 200' shown can achieve similar operating fan curves. For example, as... Figure 8A As shown, in some embodiments, cabinet 100 has six rectifier shelves (i.e., electronic equipment 50) and utilizes a door 300 as described herein, with fan operating points at 661 m³ / h and 390.5 Pa. In contrast, as... Figure 7B As shown, in some embodiments, the cabinet 100 has seven rectifier shelves (i.e., electronic devices 50') and utilizes a door 300 as described herein, with a fan operating point of 635 m³ / h and 401 Pa. Figures 8A to 8B The fan operation curves show that for the cabinet 100 of the present invention with six or seven rectifier shelves, the flow rate and air pressure are similar.

[0063] The foregoing description is a description of the invention and should not be construed as limiting it. Although several exemplary embodiments of the invention have been described, those skilled in the art will readily understand that many modifications can be made to the exemplary embodiments without substantially departing from the novel teachings and advantages of the invention. Therefore, all such modifications are intended to be included within the scope of the invention as defined in the claims. The invention is defined by the appended claims, and equivalents of the claims are included therein.

Claims

1. A door for a telecommunications cabinet, the door comprising: a cooling system, the cooling system comprising: a heat exchanger; and at least two fan units, one fan unit configured to draw external air into the telecommunications cabinet and one fan unit configured to draw heated internal air out of the telecommunications cabinet; and a deflector coupled to an inner surface of the door, the deflector configured to direct a flow of air from one or more of the at least two fan units into an internal cavity of the telecommunications cabinet.

2. The door of claim 1, further comprising at least one vent configured to allow air to enter and / or exit the telecommunications cabinet.

3. The door of any one of claim 1 or claim 2, wherein the door comprises a cavity and the cooling system is configured to be inserted and secured within the cavity.

4. The door of claim 3, wherein the cooling system comprises a main housing and an outer frame extending outwardly from and around a periphery of the main housing, the main housing configured to be received and secured within the cavity of the door.

5. The door of any one of the preceding claims, wherein the deflector is configured to direct a flow of air into an upper portion or chamber of the internal cavity of the telecommunications cabinet.

6. The door of any one of the preceding claims, wherein the at least two fan units comprise at least one lower fan unit and at least one upper fan unit, wherein the at least one lower fan unit is configured to direct a flow of air into the internal cavity of the telecommunications cabinet and the at least one upper fan unit is configured to direct a flow of air out of the internal cavity of the telecommunications cabinet.

7. The door of claim 6, wherein the cooling system comprises two lower fan units and two upper fan units.

8. The door of any one of the preceding claims, wherein the cooling system comprises a control unit configured to monitor a temperature within the internal cavity of the telecommunications cabinet and control operation of the at least two fan units.

9. The door of any one of the preceding claims, wherein the deflector is a first deflector and the door further comprises a second deflector positioned on the inner surface and configured to direct a flow of air to one of the fan units and out of the telecommunications cabinet.

10. The door of any one of the preceding claims, wherein the heat exchanger comprises a plurality of vertically extending spaced apart plates.

11. The door of any one of the preceding claims, wherein the first deflector comprises a filter-like feature configured to prevent debris from entering the internal cavity of the telecommunications cabinet.

12. The door of any one of the preceding claims, wherein the door has a width of about 32 inches, a height of about 72 inches, and a thickness of about 42 inches.

13. A door for a telecommunications cabinet, the door comprising: a cooling system, the cooling system comprising: a heat exchanger; and at least two fan units, one fan unit configured to draw external air into the telecommunications cabinet and one fan unit configured to draw heated internal air out of the telecommunications cabinet; and a deflector coupled to an inner surface of the door, the deflector configured to direct a flow of air from one or more of the at least two fan units into an internal cavity of the telecommunications cabinet. a first fan unit configured to draw outside air into an interior cavity of the telecommunications cabinet; and a second fan unit configured to draw heated interior air out of the interior cavity of the telecommunications cabinet; a first air deflector coupled to an interior surface of the door, the first air deflector configured to direct a flow of air from the first fan unit into the interior cavity; and a second air deflector coupled to an interior surface of the door, the second air deflector configured to direct a flow of air from the interior cavity to the second fan unit.

14. The door of claim 13, wherein the cooling system includes a main housing and an outer frame extending outwardly from and around a periphery of the main housing, and wherein the first fan unit and the second fan unit are located within the main housing.

15. The door of any one of claims 13 or 14, further comprising at least one vent configured to allow air to enter and / or exit the telecommunications cabinet.

16. The door of any one of claims 13 to 15, wherein the door includes a cavity, and the cooling system is configured to be inserted and secured within the cavity.

17. The door of claim 16, wherein the cooling system includes a main housing and an outer frame extending outwardly from and around a periphery of the main housing, the main housing being configured to be received and secured within the cavity of the door.

18. The door of any one of claims 13 to 17, wherein the first air deflector is configured to direct a flow of air into an upper portion or chamber of the interior cavity of the telecommunications cabinet.

19. The door of any one of claims 13 to 18, wherein the cooling system includes a control unit configured to monitor a temperature within the interior cavity of the telecommunications cabinet and to control operation of the first fan unit and the second fan unit.

20. The door of any one of claims 13 to 19, wherein the heat exchanger includes a plurality of vertically extending spaced apart plates.

21. The door of any one of claims 13 to 20, wherein the first air deflector includes a filter-like feature configured to prevent debris from entering the interior cavity of the telecommunications cabinet.

22. The door of any one of claims 13 to 21, wherein the door has a width of about 32 inches, a height of about 72 inches, and a thickness of about 42 inches.

23. A telecommunications cabinet, the telecommunications cabinet comprising: a floor, a roof, a rear wall, opposing side walls, and a door, the floor, the roof, the rear wall, the opposing side walls, and the door together defining an interior cavity configured to house electronic equipment therein, wherein the door includes: a cooling system including: a heat exchanger; and a first fan unit configured to draw outside air into an interior cavity of the telecommunications cabinet; and a second fan unit configured to draw heated interior air out of the interior cavity of the telecommunications cabinet; a first air deflector coupled to an interior surface of the door, the first air deflector configured to direct a flow of air from the first fan unit into the interior cavity; and a second air deflector coupled to an interior surface of the door, the second air deflector configured to direct a flow of air from the interior cavity to the second fan unit. at least two fan units, one fan unit configured to draw outside air into the telecommunications cabinet and one fan unit configured to draw heated inside air out of the telecommunications cabinet; and a deflector coupled to an inner surface of the door, the deflector configured to direct an airflow from one or more of the at least two fan units into an internal cavity of the telecommunications cabinet.

24. The telecommunications cabinet of claim 23, further comprising at least one vent configured to allow air to enter and / or exit the telecommunications cabinet.

25. The telecommunications cabinet of any one of claims 23 or 24, wherein the door includes a cavity and the cooling system is configured to be inserted and secured within the cavity.

26. The telecommunications cabinet of claim 25, wherein the cooling system includes a main housing and an outer frame extending outwardly from and around a periphery of the main housing, the main housing configured to be received and secured within the cavity of the door.

27. The telecommunications cabinet of any one of claims 23 to 26, wherein the deflector is configured to direct an airflow into an upper portion or chamber of the internal cavity of the telecommunications cabinet.

28. The telecommunications cabinet of any one of claims 23 to 27, wherein the at least two fan units include at least one lower fan unit and at least one upper fan unit, wherein the at least one lower fan unit is configured to direct an airflow into the internal cavity of the telecommunications cabinet and the at least one upper fan unit is configured to direct an airflow out of the internal cavity of the telecommunications cabinet.

29. The telecommunications cabinet of claim 28, wherein the cooling system includes two lower fan units and two upper fan units.

30. The telecommunications cabinet of any one of claims 23 to 29, wherein the cooling system includes a control unit configured to monitor a temperature within the internal cavity of the telecommunications cabinet and control operation of the at least two fan units.

31. The telecommunications cabinet of any one of claims 23 to 30, wherein the deflector is a first deflector and the door further includes a second deflector positioned on the inner surface and configured to direct an airflow to one of the fan units and out of the telecommunications cabinet.

32. The telecommunications cabinet of any one of claims 23 to 31, wherein the heat exchanger includes a plurality of vertically extending spaced apart plates.

33. The telecommunications cabinet of any one of claims 23 to 32, wherein the first deflector includes a filter-like feature configured to prevent debris from entering the internal cavity of the telecommunications cabinet.

34. The telecommunications cabinet of any one of claims 23 to 33, wherein the door has a width of about 32 inches, a height of about 72 inches, and a thickness of about 42 inches.

Images