High-uniformity and high-stability epoxy modified resin and preparation method thereof

Abstract

The invention relates to the technical field of high polymer material modification, and discloses high-uniformity and high-stability epoxy modified resin and a preparation method thereof.The epoxy modified resin comprises 3, 4-epoxy cyclohexylmethyl-3 ', 4'-epoxy cyclohexane carboxylate, a synergistic modified cycloaliphatic epoxy resin matrix, an antioxidant, a light stabilizer, a flatting agent and a defoaming agent; according to the synergistic modified cycloaliphatic epoxy resin matrix, trimethyl (2, 3-epoxypropyl) ammonium chloride, 1, 3, 6, 8-tetra (4-aminophenyl) pyrene and sodium tetraphenylborate are constructed to form an embedded synergistic modified structure; the preparation method comprises the steps of matrix construction, resin pretreatment, synergistic dispersion and assistant introduction. By constructing a synergistic effect structure, the components in the system form a stable effect network on the molecular scale, microphase separation is effectively inhibited, the dispersion uniformity is improved, the thermal stability, mechanical properties and aging resistance of the material are remarkably improved, and the preparation method is suitable for the field of high-performance coatings and structural materials.

Description

Technical Field

[0001] This invention relates to the field of polymer material modification technology, and in particular to a highly uniform and stable epoxy modified resin and its preparation method. Background Technology

[0002] Epoxy resins are widely used in high-performance coatings, electronic packaging, and composite materials due to their excellent bonding strength, mechanical properties, and chemical resistance. Cycloaliphatic epoxy resins, in particular, possess low viscosity, excellent weather resistance, and electrical insulation properties due to the absence of aromatic rings in their molecular structure, making them valuable in high-end applications. However, in practical use, cycloaliphatic epoxy resin systems are typically multi-component systems, and uneven component distribution is prone to occur during curing or use. This is especially true after the introduction of functional additives, where differences in polarity and insufficient intermolecular forces can easily lead to microphase separation, resulting in discontinuous internal structures and consequently, decreased mechanical properties, reduced interfacial bonding, and insufficient long-term service stability.

[0003] In existing technologies, epoxy resins are often modified by using inorganic nanofillers, surface modification with silane coupling agents, or the introduction of flexible segments. These methods mainly rely on physical dispersion or single interfacial interactions to improve performance. However, due to the lack of effective molecular-level interactions, the modified components are prone to migration or aggregation in the system, making it difficult to form a stable microstructure. Furthermore, the interactions between components in traditional modified systems are singular, failing to construct a multi-layered synergistic network. This leads to structural evolution under heat, light, and long-term stress, thus affecting the overall stability of the material's performance.

[0004] Therefore, it is necessary to develop an epoxy resin modification system that can form stable interactions and construct multiple synergistic structures at the molecular level to achieve uniform dispersion and stable combination of each component, thereby improving the structural uniformity and long-term stability of the material and meeting the higher requirements of high-performance epoxy resin materials. Summary of the Invention

[0005] To overcome the problems of uneven dispersion, poor interfacial compatibility, and insufficient long-term stability in the cycloaliphatic epoxy resin system mentioned above, the present invention aims to provide a highly uniform and stable epoxy modified resin and its preparation method. This invention employs a method of constructing a synergistically modified cycloaliphatic epoxy resin matrix by introducing trimethyl(2,3-epoxypropyl)ammonium chloride, 1,3,6,8-tetra(4-aminophenyl)pyrene, and sodium tetraphenylborate to form an embedded synergistic structure. This achieves synergistic regulation of the multi-component system at the molecular level, thereby improving the dispersion uniformity and enhancing structural stability, resulting in excellent uniformity and long-term stability.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] A highly uniform and stable epoxy modified resin, comprising the following raw materials in parts by weight: 80-130 parts of 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate; 5-45 parts of synergistically modified cycloaliphatic epoxy resin matrix; 0.2-2 parts of antioxidant; 0.2-2 parts of light stabilizer; 0.1-1 parts of leveling agent; and 0.1-1 parts of defoamer. The synergistically modified cycloaliphatic epoxy resin matrix is ​​an embedded cycloaliphatic epoxy resin matrix formed by the synergistic modification of trimethyl(2,3-epoxypropyl)ammonium chloride and 1,3,6,8-tetra(4-aminophenyl)pyrene through charge transfer to form an electron donor-acceptor composite structure, and then constructing a confined stable network under the ion association of sodium tetraphenylborate.

[0008] Optionally, the synergistically modified cycloaliphatic epoxy resin matrix comprises the following raw materials in parts by weight: 5-20 parts of trimethyl(2,3-epoxypropyl)ammonium chloride; 1-10 parts of 1,3,6,8-tetra(4-aminophenyl)pyrene; 0.5-6 parts of sodium tetraphenylborate; and 10-40 parts of 1,2-epoxycyclohexane.

[0009] Optionally, the preparation method of the synergistically modified cycloaliphatic epoxy resin matrix includes the following steps:

[0010] (1) Trimethyl(2,3-epoxypropyl)ammonium chloride was mixed with 1,3,6,8-tetra(4-aminophenyl)pyrene to obtain an electron donor-acceptor complex precursor;

[0011] (2) Add sodium tetraphenylborate to the electron donor-acceptor complex precursor to carry out ion association reaction and obtain ion association confined intermediate;

[0012] (3) Add 1,2-epoxycyclohexane to the ion-association confinement intermediate and mix and disperse to obtain a synergistically modified cycloaliphatic epoxy resin matrix.

[0013] Optionally, the reaction conditions in step (1) are a reaction temperature of 40-80℃, a reaction time of 1-4h, and a stirring speed of 300-700rpm.

[0014] Optionally, the reaction conditions in step (2) are a reaction temperature of 20 to 60°C, a reaction time of 1 to 5 hours, and a stirring speed of 300 to 700 rpm.

[0015] Optionally, the reaction conditions in step (3) are a reaction temperature of 25 to 70°C, a reaction time of 0.5 to 3 hours, and a stirring speed of 300 to 800 rpm.

[0016] Optionally, the antioxidant is a mixture of 2,6-di-tert-butyl-p-cresol and tris(2,4-di-tert-butylphenyl) phosphite in a mass ratio of 1:2; the light stabilizer is a mixture of bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate and 2-(2′-hydroxy-5′-methylphenyl)benzotriazole in a mass ratio of 1:1; the leveling agent is a mixture of polydimethylsiloxane and polyether-modified siloxane in a mass ratio of 2:1; and the defoamer is a mixture of mineral oil defoamer and polyether-modified siloxane in a mass ratio of 3:1.

[0017] Optionally, a method for preparing a highly uniform and stable epoxy modified resin includes the following steps:

[0018] S1, 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate is added to the reaction vessel to obtain a pretreated epoxy resin system;

[0019] S2, add a synergistically modified cycloaliphatic epoxy resin matrix to the pretreated epoxy resin system, mix and disperse to obtain a synergistically dispersed epoxy resin system;

[0020] S3, antioxidants, light stabilizers, leveling agents and defoamers are added to the synergistically dispersed epoxy resin system and mixed to obtain a highly uniform and stable epoxy modified resin.

[0021] Optionally, the reaction conditions for step S1 are as follows: under nitrogen protection, the temperature is 45-60℃, the stirring speed is 300-600 rpm, and the processing time is 0.5-1h; the reaction conditions for step S2 are as follows: under closed conditions, the mixing and dispersion treatment is carried out at a temperature of 50-70℃, the stirring speed is 400-800 rpm, the processing time is 1-2h, and high-speed shear dispersion is used to assist dispersion.

[0022] Optionally, the reaction conditions for step S3 are as follows: the reaction is carried out under normal pressure, the temperature is 35-55℃, the stirring speed is 400-700 rpm, and the processing time is 0.5-1 h.

[0023] The beneficial effects of this invention are:

[0024] This invention constructs an embedded synergistic modification structure composed of trimethyl(2,3-epoxypropyl)ammonium chloride, 1,3,6,8-tetra(4-aminophenyl)pyrene, and sodium tetraphenylborate. This structure enables the components in the system to form a stable interaction network at the molecular scale, effectively suppressing microphase separation caused by polarity differences in traditional epoxy systems, thereby significantly improving the dispersion uniformity of the material. Simultaneously, the confined structure constructed by multi-site interactions constrains the movement of molecular chain segments, improving the structural stability and thermal aging resistance of the system, maintaining stable mechanical properties even under long-term heat, light, and stress. Furthermore, this synergistic structure reduces the migration tendency of functional components, avoiding performance degradation and achieving simultaneous improvement in uniformity and stability. It demonstrates significantly superior comprehensive performance compared to traditional single-modification systems, exhibiting outstanding inventiveness and practical value. Attached Figure Description

[0025] The invention will now be further described with reference to the accompanying drawings.

[0026] Figure 1 This is a comparison of the infrared spectra of cycloaliphatic epoxy resin and synergistically modified cycloaliphatic epoxy resin matrix. Detailed Implementation

[0027] The present invention will be further described below with reference to specific embodiments. However, the present invention is not limited to the following embodiments. Equivalent adjustments made without departing from the spirit and essence of the present invention should also be considered to fall within the protection scope of the present invention.

[0028] Example 1: This example aims to provide a highly filled synergistic modification system to improve the structural stability and anti-aging properties of materials.

[0029] S1, 20 parts of trimethyl(2,3-epoxypropyl)ammonium chloride and 10 parts of 1,3,6,8-tetra(4-aminophenyl)pyrene were added to a reaction vessel and reacted at 80℃ and 700rpm for 4h to obtain an electron donor-acceptor composite precursor; then 6 parts of sodium tetraphenylborate were added to the system and reacted at 60℃ and 700rpm for 5h to obtain an ion-associated confined intermediate; then 40 parts of 1,2-epoxycyclohexane were added to the system and dispersed at 70℃ and 800rpm for 3h to obtain a synergistically modified cycloaliphatic epoxy resin matrix;

[0030] S2, 130 parts of 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate were added to a reaction vessel and treated at 60°C and 600 rpm for 1 h under nitrogen protection to obtain a pretreated epoxy resin system; then 45 parts of the synergistic modified cycloaliphatic epoxy resin matrix obtained in step S1 were added to it, and the mixture was mixed and dispersed at 70°C and 800 rpm for 2 h, and then treated by high-speed shear dispersion to obtain a synergistically dispersed epoxy resin system;

[0031] S3. Add 2 parts antioxidant, 2 parts light stabilizer, 1 part leveling agent and 1 part defoamer to the system obtained in step S2, and mix and treat at 55℃ and 700rpm for 1h to obtain a highly uniform and stable epoxy modified resin.

[0032] Example 2: This example aims to provide an implementation method with optimal synergistic effect of each component to obtain epoxy modified resin with the best overall performance.

[0033] S1, 12 parts of trimethyl(2,3-epoxypropyl)ammonium chloride and 5 parts of 1,3,6,8-tetra(4-aminophenyl)pyrene were added to a reaction vessel and reacted at 60℃ and 500 rpm for 2 h to obtain an electron donor-acceptor composite precursor; then 3 parts of sodium tetraphenylborate were added to the system and reacted at 40℃ and 500 rpm for 3 h to obtain an ion-associated confined intermediate; then 25 parts of 1,2-epoxycyclohexane were added to the system and dispersed at 50℃ and 600 rpm for 1.5 h to obtain a synergistically modified cycloaliphatic epoxy resin matrix; according to Figure 1 Infrared spectral analysis showed that the main absorption peak of the unmodified cycloaliphatic epoxy resin appeared at 915 cm⁻¹. -1 Epoxy group C–O–C stretching vibration, 3050 cm -1 CH bond stretching vibration and 1720 cm -1 The C=O stretching vibration indicates that its epoxy structure is intact; in the modified synergistically modified cycloaliphatic epoxy resin matrix, in addition to the original epoxy characteristic peaks, a new peak at 1590 cm⁻¹ is added. -1 and 1505 cm -1 The aromatic ring C=C vibration peak, at 915 cm⁻¹ -1 The peaks weakened, indicating the formation of the electron donor-acceptor complex structure and the construction of the confined network; the overall peak shape was smooth and the peak intensity was moderate, indicating that the synergistic modification was uniform and effective, the epoxy structure was stable and the embedded network was fully formed, which is beneficial to improving the thermal stability and mechanical properties of the resin.

[0034] S2, 100 parts of 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylic acid ester were added to a reaction vessel and treated at 50°C and 400 rpm for 0.5 h under nitrogen protection to obtain a pretreated epoxy resin system; then 25 parts of the synergistic modified cycloaliphatic epoxy resin matrix obtained in step S1 were added to it, and the mixture was mixed and dispersed at 60°C and 600 rpm for 1 h, and then treated by high-speed shear dispersion to obtain a synergistically dispersed epoxy resin system;

[0035] S3. Add 1 part antioxidant, 1 part light stabilizer, 0.5 part leveling agent and 0.5 part defoamer to the system obtained in step S2, and mix and treat at 45℃ and 500rpm for 0.5h to obtain highly uniform and highly stable epoxy modified resin.

[0036] Example 3: This example aims to provide a synergistic modification system under low addition conditions to verify that the present invention still has good stability under low component conditions.

[0037] S1, 5 parts of trimethyl(2,3-epoxypropyl)ammonium chloride and 1 part of 1,3,6,8-tetra(4-aminophenyl)pyrene were added to a reaction vessel and reacted at 40℃ and 300 rpm for 1 h to obtain an electron donor-acceptor composite precursor; then 0.5 parts of sodium tetraphenylborate were added to the system and reacted at 20℃ and 300 rpm for 1 h to obtain an ion-associated confined intermediate; then 10 parts of 1,2-epoxycyclohexane were added to the system and dispersed at 25℃ and 300 rpm for 0.5 h to obtain a synergistically modified cycloaliphatic epoxy resin matrix;

[0038] S2, 80 parts of 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate were added to a reaction vessel and treated at 45°C and 300 rpm for 0.5 h under nitrogen protection to obtain a pretreated epoxy resin system; then 5 parts of the synergistic modified cycloaliphatic epoxy resin matrix obtained in step S1 were added to it and mixed and dispersed at 50°C and 400 rpm for 1 h to obtain a synergistically dispersed epoxy resin system;

[0039] S3. Add 0.2 parts of antioxidant, 0.2 parts of light stabilizer, 0.1 parts of leveling agent and 0.1 parts of defoamer to the system obtained in step S2, and mix and treat at 35℃ and 400rpm for 0.5h to obtain highly uniform and highly stable epoxy modified resin.

[0040] Comparative Example 1: This comparative example aims to verify the effect of the lack of ion association on the stability of the system.

[0041] S1, 12 parts of trimethyl(2,3-epoxypropyl)ammonium chloride and 5 parts of 1,3,6,8-tetra(4-aminophenyl)pyrene were added to a reaction vessel and reacted at 60°C and 500 rpm for 2 h to obtain an electron donor-acceptor composite precursor; subsequently, without adding sodium tetraphenylborate, 25 parts of 1,2-epoxycyclohexane were directly added to the system and dispersed at 50°C and 600 rpm for 1.5 h to obtain a single charge transfer modified cycloaliphatic epoxy resin matrix;

[0042] S2, 100 parts of 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate were added to a reaction vessel and treated at 50°C and 400 rpm for 0.5 h under nitrogen protection to obtain a pretreated epoxy resin system; then 25 parts of the modified matrix obtained in step S1 were added to it, and the mixture was mixed and dispersed at 60°C and 600 rpm for 1 h, and then treated by high-speed shear dispersion to obtain a dispersed epoxy resin system;

[0043] S3. Add 1 part antioxidant, 1 part light stabilizer, 0.5 part leveling agent and 0.5 part defoamer to the system obtained in step S2, and mix and treat at 45℃ and 500rpm for 0.5h to obtain epoxy modified resin.

[0044] Comparative Example 2: This comparative example aims to verify the effect of the absence of small organic molecules on the cooperative structure of the system.

[0045] S1, 12 parts of trimethyl(2,3-epoxypropyl)ammonium chloride were added to a reaction vessel and treated at 60°C and 500 rpm for 2 h; then 3 parts of sodium tetraphenylborate were added to the system and reacted at 40°C and 500 rpm for 3 h to obtain an ion-association modified intermediate; then 25 parts of 1,2-epoxycyclohexane were added to the system and dispersed at 50°C and 600 rpm for 1.5 h to obtain a single ion-association modified cycloaliphatic epoxy resin matrix;

[0046] S2, 100 parts of 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate were added to a reaction vessel and treated at 50°C and 400 rpm for 0.5 h under nitrogen protection to obtain a pretreated epoxy resin system; then 25 parts of the modified matrix obtained in step S1 were added to it, and the mixture was mixed and dispersed at 60°C and 600 rpm for 1 h, and then treated by high-speed shear dispersion to obtain a dispersed epoxy resin system;

[0047] S3. Add 1 part antioxidant, 1 part light stabilizer, 0.5 part leveling agent and 0.5 part defoamer to the system obtained in step S2, and mix and treat at 45℃ and 500rpm for 0.5h to obtain epoxy modified resin.

[0048] Comparative Example 3: This comparative example aims to verify the impact of not introducing synergistic modified structures on the system performance.

[0049] S1, without synergistic modification of the cyclic aliphatic epoxy resin matrix;

[0050] S2, 100 parts of 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylic acid ester were added to a reaction vessel and treated at 50°C and 400 rpm for 0.5 h under nitrogen protection to obtain a pretreated epoxy resin system;

[0051] S3. Add 1 part antioxidant, 1 part light stabilizer, 0.5 part leveling agent and 0.5 part defoamer to the system obtained in step S2, and mix and treat at 45℃ and 500rpm for 0.5h to obtain epoxy resin system.

[0052] Performance testing:

[0053] 1. Dispersion uniformity test method

[0054] The epoxy modified resins obtained in each embodiment and comparative example were uniformly coated onto the surface of a clean glass substrate using a film scraper, with the wet film thickness controlled at 100 μm. The coating was cured at 60°C for 2 hours and then further cured at 80°C for 2 hours to obtain a cured coating. The coating surface was observed using an optical microscope at a magnification of 200x. Five different regions of each sample were randomly selected to record the particle distribution and whether agglomeration occurred. The cross-section of the sample was further observed using a scanning electron microscope to compare the size and uniformity of the dispersed phase in order to evaluate the dispersion uniformity of the system.

[0055] 2. Thermal stability test method

[0056] The cured samples obtained from each embodiment and comparative example were cut into samples with a mass of 5-10 mg and placed in a thermogravimetric analyzer. Under nitrogen atmosphere protection, the temperature was increased from room temperature to 800°C at a heating rate of 10°C / min. The process of sample mass change with temperature was recorded, and the initial decomposition temperature and high-temperature residue of each sample were compared to evaluate the thermal stability of the material.

[0057] 3. Mechanical property testing methods

[0058] The epoxy modified resins obtained in each embodiment and comparative example were poured into a standard mold, cured at 60°C for 2 hours, and then post-cured at 100°C for 2 hours to prepare standard samples. Tensile properties were tested using a universal testing machine at a test speed of 5 mm / min. Three-point bending tests were also performed simultaneously. The tensile strength and bending strength of the materials were recorded, and the fracture surfaces of the broken samples were observed to evaluate the influence of the system on mechanical properties.

[0059] 4. Aging resistance test method

[0060] The cured samples obtained from each embodiment and comparative example were placed in a constant temperature aging chamber and subjected to thermal aging treatment at 120°C for 168 hours. After aging, the samples were taken out and placed at room temperature for 24 hours to test their mechanical property changes. The surface of the samples was observed to see if cracking, powdering or obvious discoloration occurred. The performance changes before and after aging were compared to evaluate the long-term stability of the material.

[0061] Table 1 Performance Test Results

[0062] sample Dispersion uniformity (average particle size / μm) Initial decomposition temperature / °C Tensile strength / MPa Strength retention rate after aging / % Example 1 2.8 358 72.5 86.3 Example 2 1.6 372 85.7 93.8 Example 3 4.5 341 61.2 78.6 Comparative Example 1 6.9 326 52.4 70.5 Comparative Example 2 8.2 318 47.8 65.2 Comparative Example 3 12.5 305 39.6 58.4

[0063] As shown in Table 1, the overall performance of Examples 1-3 is significantly better than that of Comparative Examples 1-3. Among them, Example 2 shows the best performance in all performance indicators, demonstrating the significant advantages of the synergistic modification system of the present invention in terms of structural uniformity and stability. Specifically, Example 2 has the best dispersion uniformity, with an average particle size of 1.6 μm, which is significantly smaller than 2.8 μm in Example 1 and 4.5 μm in Example 3, and also much lower than 6.9 μm, 8.2 μm, and 12.5 μm in Comparative Examples 1-3, indicating that the synergistic modification structure can effectively suppress the aggregation of components in the system and achieve a more uniform microstructure distribution.

[0064] Regarding thermal stability, the initial decomposition temperature of Example 2 reached 372℃, which is higher than that of Example 1 (358℃) and Example 3 (341℃), and significantly better than that of Comparative Examples 1-3 (326℃, 318℃, and 305℃). This indicates that the synergistic structure can effectively improve the system's resistance to thermal decomposition and enhance the stability of the material under high-temperature conditions.

[0065] In terms of mechanical properties, the tensile strength of Example 2 was 85.7 MPa, which was significantly better than 72.5 MPa of Example 1 and 61.2 MPa of Example 3, and also much higher than 52.4 MPa, 47.8 MPa and 39.6 MPa of Comparative Examples 1 to 3, indicating that the synergistic modification system can effectively improve the structural compactness and stress transmission capacity of the material, thereby improving the overall mechanical properties.

[0066] In terms of aging resistance, the strength retention rate of Example 2 after aging was 93.8%, which was higher than that of Example 1 (86.3%) and Example 3 (78.6%), and significantly better than that of Comparative Examples 1-3 (70.5%, 65.2%, and 58.4%). This indicates that the synergistic modified structure can effectively suppress the performance degradation of the material under long-term thermal action and improve its long-term stability.

[0067] In summary, this invention, by constructing an embedded synergistic modification structure, enables the components to form a stable interaction network at the molecular scale, significantly improving the system's dispersion uniformity, thermal stability, mechanical properties, and aging resistance. Compared with traditional single-modification systems, it exhibits obvious advantages, verifying the effectiveness and superiority of the technical solution of this invention.

Claims

1. A highly uniform and highly stable epoxy modified resin, characterized in that, The epoxy resin comprises the following raw materials in parts by weight: 80-130 parts of 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate; 5-45 parts of synergistically modified cycloaliphatic epoxy resin matrix; 0.2-2 parts of antioxidant; 0.2-2 parts of light stabilizer; 0.1-1 parts of leveling agent; and 0.1-1 parts of defoamer. The synergistically modified cycloaliphatic epoxy resin matrix is ​​an embedded synergistically modified structure constructed from trimethyl(2,3-epoxypropyl)ammonium chloride, 1,3,6,8-tetra(4-aminophenyl)pyrene, and sodium tetraphenylborate.

2. The highly uniform and highly stable epoxy modified resin according to claim 1, characterized in that, The synergistically modified cycloaliphatic epoxy resin matrix comprises the following raw materials in parts by weight: 5-20 parts of trimethyl(2,3-epoxypropyl)ammonium chloride; 1-10 parts of 1,3,6,8-tetra(4-aminophenyl)pyrene; 0.5-6 parts of sodium tetraphenylborate; and 10-40 parts of 1,2-epoxycyclohexane.

3. The highly uniform and highly stable epoxy modified resin according to claim 1 or 2, characterized in that, The method for preparing the synergistically modified cycloaliphatic epoxy resin matrix includes the following steps: (1) Trimethyl(2,3-epoxypropyl)ammonium chloride was mixed with 1,3,6,8-tetra(4-aminophenyl)pyrene to obtain an electron donor-acceptor complex precursor; (2) Add sodium tetraphenylborate to the electron donor-acceptor complex precursor to carry out ion association reaction and obtain ion association confined intermediate; (3) Add 1,2-epoxycyclohexane to the ion-association confinement intermediate and mix and disperse to obtain a synergistically modified cycloaliphatic epoxy resin matrix.

4. The highly uniform and highly stable epoxy modified resin according to claim 3, characterized in that, The reaction conditions for step (1) are a reaction temperature of 40-80℃, a reaction time of 1-4h, and a stirring speed of 300-700rpm.

5. The highly uniform and highly stable epoxy modified resin according to claim 3, characterized in that, The reaction conditions for step (2) are a reaction temperature of 20-60℃, a reaction time of 1-5h, and a stirring speed of 300-700rpm.

6. The highly uniform and highly stable epoxy modified resin according to claim 3, characterized in that, The reaction conditions for step (3) are a reaction temperature of 25-70°C, a reaction time of 0.5-3h, and a stirring speed of 300-800rpm.

7. The highly uniform and highly stable epoxy modified resin according to claim 1, characterized in that, The antioxidant is a mixture of 2,6-di-tert-butyl-p-cresol and tris(2,4-di-tert-butylphenyl) phosphite in a mass ratio of 1:2; the light stabilizer is a mixture of bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate and 2-(2′-hydroxy-5′-methylphenyl)benzotriazole in a mass ratio of 1:1; the leveling agent is a mixture of polydimethylsiloxane and polyether-modified siloxane in a mass ratio of 2:1; and the defoamer is a mixture of mineral oil defoamer and polyether-modified siloxane in a mass ratio of 3:

1.

8. A method for preparing a highly uniform and highly stable epoxy modified resin, characterized in that, The preparation method includes the following steps: S1, 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate is added to the reaction vessel to obtain a pretreated epoxy resin system; S2, add a synergistically modified cycloaliphatic epoxy resin matrix to the pretreated epoxy resin system, mix and disperse to obtain a synergistically dispersed epoxy resin system; S3, antioxidants, light stabilizers, leveling agents and defoamers are added to the synergistically dispersed epoxy resin system and mixed to obtain a highly uniform and stable epoxy modified resin.

9. The method for preparing a highly uniform and stable epoxy modified resin according to claim 8, characterized in that, The reaction conditions for step S1 are as follows: under nitrogen protection, the temperature is 45-60℃, the stirring speed is 300-600 rpm, and the processing time is 0.5-1h. The reaction conditions for step S2 are as follows: under closed conditions, the mixing and dispersion treatment is carried out at a temperature of 50-70℃, the stirring speed is 400-800 rpm, and the processing time is 1-2h. High-speed shear dispersion is used to assist dispersion.

10. The method for preparing a highly uniform and stable epoxy modified resin according to claim 8, characterized in that, The reaction conditions for step S3 are as follows: the reaction is carried out under normal pressure, the temperature is 35-55℃, the stirring speed is 400-700 rpm, and the processing time is 0.5-1h.

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