A cactus spine-inspired directional heat dissipation structure
By introducing a conical biomimetic spike array and an inclined angle design into the heat dissipation structure, the problem of low heat exchange efficiency caused by airflow turbulence is solved, achieving efficient directional heat dissipation, which is suitable for a variety of high-temperature equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 于世平
- Filing Date
- 2026-04-12
- Publication Date
- 2026-05-26
AI Technical Summary
Existing heat dissipation structures suffer from turbulent airflow and low heat exchange efficiency, failing to fully utilize the biomimetic directional airflow principle, thus creating a bottleneck in improving heat dissipation efficiency.
It adopts a conical biomimetic spike array and tilted design to form a directional flow, increase the heat exchange area, and enhance heat conduction through hollow spikes and microchannels.
It achieves directional airflow guidance, improves heat dissipation efficiency by 25%~30%, has a compact structure that does not take up extra space, and is suitable for a variety of high-temperature equipment.
Abstract
Description
Technical Field
[0001] This invention relates to the field of thermal management and heat dissipation technology, specifically to a cactus spine-inspired directional heat dissipation structure. Background Technology
[0002] Currently, the heat dissipation structures of electronic devices, photovoltaic modules, and industrial equipment mostly adopt heat sink fins and air cooling modes. Traditional fin structures are prone to airflow stagnation and turbulence, limiting the efficiency of air convection heat transfer and preventing the equipment from dissipating heat quickly. Cacti grow in high-temperature desert environments, and their cone-shaped spines can guide airflow and disturb the air to achieve rapid cooling of the skin. There is a significant gap in the application of this biomimetic characteristic in the field of heat dissipation. Existing heat dissipation structures do not fully utilize the biomimetic directional airflow principle, and the bottleneck in improving heat dissipation efficiency is obvious. Therefore, there is a need for a biomimetic directional airflow heat dissipation structure based on cactus spines. Summary of the Invention
[0003] To address the shortcomings of existing heat dissipation structures, such as turbulent airflow and low heat exchange efficiency, this invention provides a cactus-spine biomimetic directional airflow heat dissipation structure. Through a conical biomimetic spine array and tilted angle design, it achieves directional airflow disturbance and guidance, significantly improving convective heat dissipation efficiency.
[0004] The technical solution of this invention is as follows: Conical biomimetic spikes are arranged in an array on the surface of the heat dissipation substrate. The spikes are uniformly tilted at an angle to form a flow direction. The conical structure disrupts the laminar flow state of the airflow, increases the heat exchange area between the air and the heat dissipation structure, and the hollow spikes and microchannels further enhance heat conduction, ultimately achieving efficient directional heat dissipation.
[0005] The beneficial effects of this invention are: 1. The directional airflow design eliminates airflow turbulence, improving heat dissipation efficiency by 25%~30%; 2. The conical spike increases the heat exchange area, and the compact structure does not occupy extra space; 3. The material has excellent thermal conductivity, the processing technology is simple, and it is suitable for various high-temperature equipment heat dissipation scenarios. Detailed Implementation
[0006] Example 2: A cactus spine biomimetic directional heat dissipation structure, with a heat dissipation substrate thickness of 2mm, a conical biomimetic spine height h=10mm, a taper α=10°, an inclination angle β=20°, a spacing between adjacent spines d=0.7h=7mm, and a 0.25mm deep spiral microchannel on the inner wall of the spine; the material is a copper-aluminum composite thermally conductive material, and the surface is coated with a nano-graphene oxide coating; According to heat dissipation tests, the structure achieves a heat transfer coefficient of 125 W / (m²·K) under natural air cooling conditions, which is 28% higher than that of traditional heat dissipation fins. The formula for convective heat transfer efficiency is: η = (h1 - h2) / h1 × 100% In the formula: η is the heat dissipation efficiency; h1 is the heat transfer coefficient of the substrate surface without the biomimetic structure; h2 is the heat transfer coefficient of the substrate surface after the biomimetic structure is added.
Claims
1. A cactus spine-inspired directional heat dissipation structure, characterized in that, It includes a heat dissipation substrate and an array of conical bionic spikes; the bottom of the conical bionic spikes is fixedly connected to the heat dissipation substrate, all the bionic spikes are inclined in the same horizontal direction, and the top of the spikes has a rounded blunt structure.
2. The heat dissipation structure according to claim 1, characterized in that, The taper α of the conical bionic spike is 8°~12°, the inclination angle β of the spike is 15°~25°, and the distance d between adjacent spikes and the height h of the spike satisfy the formula: d = (0.6~0.8)h.
3. The heat dissipation structure according to claim 1, characterized in that, The cone-shaped biomimetic spike has a hollow structure with spiral microchannels on the inner wall, and the depth of the microchannels is 0.2~0.3mm.
4. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation substrate and the conical biomimetic spike are made of copper-aluminum alloy or graphite thermally conductive composite material, and the surface is coated with a nano-graphene oxide heat dissipation coating.