Substrate processing apparatus, abnormality detection method, and adjustment method of substrate processing apparatus

Abstract

The substrate processing apparatus includes a substrate holding unit, a nozzle, a flow path opening / closing unit, a detection unit, and a control unit capable of controlling each unit. The substrate holding portion is capable of holding a substrate. The nozzle can supply the processing liquid to the substrate or a component different from the substrate. The flow path opening and closing portion is capable of opening and closing a supply flow path for supplying the processing liquid to the nozzle. The detection unit is capable of detecting the presence or absence of the processing liquid landing on the substrate or the member. The control unit outputs, to the flow path opening and closing unit, an opening signal for causing the flow path opening and closing unit to perform an opening operation for opening the supply flow path. The control unit detects an operation abnormality of the flow path opening / closing unit on the basis of an elapsed time from the output of the opening signal until the detection unit detects that the processing liquid has landed.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus, an anomaly detection method, and an adjustment method for the substrate processing apparatus. Background Technology

[0002] As one of the steps in semiconductor manufacturing, there is a liquid treatment step, which involves processing the substrate by supplying a processing solution to a substrate such as a semiconductor wafer or a glass substrate.

[0003] The liquid treatment step is performed by positioning a nozzle connected to a liquid supply source via a supply path above the substrate, and releasing liquid supplied from the liquid supply source from the nozzle. A valve is provided in the supply path, and the release state of the liquid from the nozzle is switched by opening and closing the valve.

[0004] As a valve installed in the supply path, a pneumatic valve is sometimes used, which uses the pressure of air supplied from an air supply pipe to open and close the valve body. The opening and closing speed of the pneumatic valve can be adjusted by regulating a speed controller installed in the air supply pipe (see Patent Document 1).

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2016-178238 Summary of the Invention

[0008] The technical problem that the invention aims to solve

[0009] This invention provides a technique for properly detecting abnormal operation of flow path opening and closing parts.

[0010] Means for solving technical problems

[0011] One aspect of the substrate processing apparatus of the present invention includes a substrate holding unit, a nozzle, a flow path opening and closing unit, a detection unit, and a control unit capable of controlling each unit. The substrate holding unit holds a substrate. The nozzle supplies processing liquid to the substrate or a component different from the substrate. The flow path opening and closing unit opens and closes the supply flow path for supplying processing liquid to the nozzle. The detection unit detects whether processing liquid has fallen onto the substrate or the component. The control unit outputs an opening signal to the flow path opening and closing unit to open the supply flow path. The control unit detects abnormal operation of the flow path opening and closing unit based on the elapsed time from outputting the opening signal to the detection unit detecting the fall of processing liquid.

[0012] Invention Effects

[0013] Using this invention, abnormal operation of the flow path opening and closing parts can be properly detected. Attached Figure Description

[0014] Figure 1 This is a diagram showing the structure of the substrate processing system according to the first embodiment.

[0015] Figure 2 This is a diagram showing the structure of the processing unit in the first embodiment.

[0016] Figure 3 This is a diagram showing an example of the structure of the processing fluid supply unit in the first embodiment.

[0017] Figure 4 This is a block diagram illustrating an example of the structure of the control device according to the first embodiment.

[0018] Figure 5 This diagram illustrates the execution timing of the monitoring process in the first embodiment.

[0019] Figure 6 This is a flowchart illustrating the monitoring process of the first embodiment.

[0020] Figure 7 This is a diagram illustrating an example of the structure of the processing unit in the second embodiment.

[0021] Figure 8 This diagram illustrates the timing of the execution of the monitoring process in the second embodiment. Detailed Implementation

[0022] Hereinafter, with reference to the accompanying drawings, a method for implementing the substrate processing apparatus, the anomaly detection method, and the adjustment method of the substrate processing apparatus (hereinafter referred to as "Embodiments") will be described in detail. However, the present invention is not limited to these embodiments. Furthermore, the embodiments can be appropriately combined without contradicting the processing content. In the following embodiments, the same reference numerals are used to label the same parts, and repeated descriptions are omitted.

[0023] As one of the steps in semiconductor manufacturing, there is a liquid treatment step, which involves processing the substrate by supplying a processing solution to a substrate such as a semiconductor wafer or a glass substrate.

[0024] The liquid treatment step is performed by positioning a nozzle connected to a liquid supply source via a supply path above the substrate, and releasing liquid supplied from the liquid supply source from the nozzle. A valve is provided in the supply path, and the release state of the liquid from the nozzle is switched by opening and closing the valve.

[0025] As valves installed in the supply path, pneumatic valves are sometimes used, which open and close the valve body using the pressure of air supplied from the air supply pipe. The opening and closing speed of the pneumatic valve can be adjusted by regulating a speed controller installed in the air supply pipe.

[0026] Furthermore, the flow path opening and closing parts, including pneumatic valves and speed controllers, are pre-adjusted to open and close the valve body at an appropriate speed. However, if conditions change due to long-term use or component replacement, the pneumatic valve body may fail to open and close at the appropriate speed, resulting in abnormal dripping of the treatment fluid from the nozzle.

[0027] Therefore, it is desirable to develop a technology that can properly detect abnormalities in the operation of flow path opening and closing parts.

[0028] (First Implementation)

[0029] Figure 1 This is a diagram showing the structure of the substrate processing system according to the first embodiment. Hereinafter, to clarify the positional relationships, the X-axis, Y-axis, and Z-axis are defined as mutually orthogonal, with the positive direction of the Z-axis set as the vertically upward direction.

[0030] like Figure 1 As shown, the substrate processing system 1 includes an infeed / outfeed station 2 and a processing station 3. The infeed / outfeed station 2 and the processing station 3 are arranged adjacent to each other.

[0031] The infeed / outfeed station 2 includes a carrier placement section 11 and a transport section 12. Multiple carriers C can be placed in the carrier placement section 11, and the carriers C can hold multiple substrates, or in this embodiment, semiconductor wafers (hereinafter referred to as wafers W), in a horizontal state.

[0032] The transport section 12 is disposed adjacent to the carrier placement section 11, and has a substrate transport device 13 and a transfer section 14 inside. The substrate transport device 13 includes a wafer holding mechanism capable of holding the wafer W. In addition, the substrate transport device 13 is capable of moving in the horizontal and vertical directions and rotating about the vertical axis, and the wafer holding mechanism can be used to transport the wafer W between the carrier C and the transfer section 14.

[0033] The processing station 3 is arranged adjacent to the conveying section 12. The processing station 3 includes a conveying section 15 and a plurality of processing units 16. The plurality of processing units 16 are arranged on both sides of the conveying section 15.

[0034] The transport unit 15 has a substrate transport device 17 inside. The substrate transport device 17 includes a wafer holding mechanism capable of holding the wafer W. In addition, the substrate transport device 17 is capable of moving in the horizontal and vertical directions and rotating about the vertical axis, and can transport the wafer W between the transfer unit 14 and the processing unit 16 using the wafer holding mechanism.

[0035] The processing unit 16 is capable of performing prescribed substrate processing on the wafer W transported by the substrate transport device 17.

[0036] Additionally, the substrate processing system 1 includes a control device 4. The control device 4 is, for example, a computer, including a control unit 18 and a storage unit 19. The storage unit 19 can store programs for controlling various processes executed in the substrate processing system 1. The control unit 18 can control the operation of the substrate processing system 1 by reading and executing the programs stored in the storage unit 19.

[0037] Furthermore, the aforementioned program can also be recorded on a computer-readable storage medium and installed from that storage medium into the storage unit 19 of the control device 4. Examples of computer-readable storage media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards.

[0038] In the substrate processing system 1 configured as described above, firstly, the substrate transport device 13 of the delivery station 2 removes the wafer W from the carrier C placed in the carrier placement section 11 and places the removed wafer W in the transfer section 14. The wafer W placed in the transfer section 14 is then removed from the transfer section 14 by the substrate transport device 17 of the processing station 3 and sent to the processing unit 16.

[0039] The wafer W, which is fed into the processing unit 16, is processed by the processing unit 16 and then sent out from the processing unit 16 by the substrate transport device 17 and placed in the transfer section 14. Then, the processed wafer W, which is placed in the transfer section 14, is returned to the carrier C of the carrier placement section 11 by the substrate transport device 13.

[0040] Next, refer to Figure 2 The processing unit 16 will be described. Figure 2 This is a diagram showing the structure of the processing unit 16 in the first embodiment.

[0041] like Figure 2 As shown, the processing unit 16 includes a chamber 20, a substrate holding mechanism 30, a processing fluid supply unit 40, and a recovery cup 50.

[0042] The chamber 20 can accommodate the substrate holding mechanism 30, the process fluid supply unit 40, and the recovery cup 50. An FFU (Fan Filter Unit) 21 is provided at the top of the chamber 20. The FFU 21 can form a downward flow within the chamber 20.

[0043] The substrate holding mechanism 30 includes a holding portion 31, a support portion 32, and a driving portion 33. The holding portion 31 is capable of horizontally holding the wafer W. The support portion 32 is a member extending in the vertical direction, and its base end is rotatably supported by the driving portion 33, which horizontally supports the holding portion 31 at its front end. The driving portion 33 is capable of rotating the support portion 32 about a vertical axis. The substrate holding mechanism 30 can use the driving portion 33 to rotate the support portion 32, thereby rotating the holding portion 31 supported by the support portion 32, and thus rotating the wafer W held by the holding portion 31.

[0044] The processing fluid supply unit 40 is capable of supplying processing fluid to the wafer W. The processing fluid supply unit 40 is connected to the processing fluid supply source 70.

[0045] The recovery cup 50 is configured to surround the holding portion 31, and is capable of capturing the processing liquid that splashes off the wafer W due to the rotation of the holding portion 31. A drain port 51 is formed at the bottom of the recovery cup 50, through which the processing liquid captured by the recovery cup 50 can be discharged to the outside of the processing unit 16. In addition, an exhaust port 52 is formed at the bottom of the recovery cup 50 for discharging the gas supplied from the FFU 21 to the outside of the processing unit 16.

[0046] Additionally, the processing unit 16 includes a detection unit 80. The detection unit 80 is capable of detecting whether processing liquid has fallen onto the wafer W. The detection unit 80 has a light-projecting unit 81 and a light-receiving unit 82, and is capable of projecting laser light onto the wafer W, detecting whether processing liquid has fallen onto the wafer W based on the intensity of the reflected light from the laser light from the wafer W. The detection unit 80 outputs the detection value (i.e., the intensity value of the reflected light) used to detect whether processing liquid has fallen onto the wafer W to the control device 4. The detection value of the detection unit 80, for example, in the case where processing liquid has fallen onto the wafer W, becomes "0", indicating that there is no reflected light from the wafer W.

[0047] Next, refer to Figure 3 The structure of the processing fluid supply unit 40 included in the processing unit 16 will be described. Figure 3 This is a diagram showing an example of the structure of the processing fluid supply unit 40 in the first embodiment.

[0048] like Figure 3As shown, the processing fluid supply unit 40 includes: a nozzle 41 capable of supplying processing fluid to the wafer W; and a supply flow path 42 connecting the nozzle 41 and the processing fluid supply source 70, capable of supplying processing fluid from the processing fluid supply source 70 to the nozzle 41. Furthermore, although not shown in the figure here, the processing fluid supply unit 40 may also include an arm capable of horizontally supporting the nozzle 41 and a rotary lifting mechanism for rotating and raising the arm.

[0049] The supply flow path 42 is a tubular component, formed, for example, from a material with high chemical resistance such as fluororesin. A flow path opening / closing part 61 is provided in this supply flow path 42. The flow path opening / closing part 61 can open and close the supply flow path 42 according to the opening and closing signals output from the control device 4.

[0050] The flow path opening / closing unit 61 includes a pneumatic valve 61a, an air supply pipe 61b, and an air regulating valve 61c. The pneumatic valve 61a opens and closes the supply flow path 42 by moving its valve body using the pressure of air supplied from the air supply pipe 61b. The air regulating valve 61c, located in the air supply pipe 61b, regulates the flow rate of air supplied to the pneumatic valve 61a. Specifically, the air regulating valve 61c regulates the amount of air supplied to the pneumatic valve 61a, thereby controlling the valve body of the pneumatic valve 61a to open and close at a preset speed. The air regulating valve 61c is also referred to as a speed controller.

[0051] When the air regulating valve 61c receives an opening signal from the control device 4, it changes the opening / closing state of the pneumatic valve 61a from the "closed" state to the "open" state at a preset opening speed. As a result, the valve body of the pneumatic valve 61a opens at a preset set opening speed (set opening time). Conversely, when the air regulating valve 61c receives a closing signal from the control device 4, it changes the opening / closing state of the pneumatic valve 61a from the "open" state to the "closed" state at a preset closing speed. As a result, the valve body of the pneumatic valve 61a closes at a preset set closing speed (set closing time).

[0052] The air regulating valve 61c is pre-adjusted to open and close the flow path opening and closing part 61 at an appropriate speed. However, if conditions change due to long-term use or replacement of parts, the flow path opening and closing part 61 (i.e., the valve body of the pneumatic valve 61a) may not be able to open and close at an appropriate speed, resulting in abnormalities such as the processing liquid dripping from the nozzle 41.

[0053] Therefore, in the substrate processing system 1 of the first embodiment, the flow path opening / closing unit 61 is monitored for any abnormalities based on the elapsed time from when the opening signal is output from the flow path opening / closing unit 61 until the detection unit 80 detects that the processing liquid has fallen onto the wafer W. This will be explained in detail below.

[0054] First, refer to Figure 4 The structure of control device 4 will be described. Figure 4 This is a block diagram illustrating an example of the structure of the control device 4 in the first embodiment. Additionally, in Figure 4 In this document, the constituent elements necessary to explain the features of the first embodiment are represented by functional blocks, and descriptions of general constituent elements are omitted. That is, Figure 4 The constituent elements shown in the diagram are functional conceptual elements and do not necessarily need to be physically arranged as shown in the diagram. For example, the specific way in which the functional blocks are distributed and integrated is not limited to the way shown in the diagram. They can be distributed and integrated in any unit, either functionally or physically, according to various loads and usage conditions.

[0055] Furthermore, all or any part of the processing functions performed by each functional module of the control device 4 can be implemented by a processor such as a CPU (Central Processing Unit) and the program parsed and executed by that processor, or can be implemented as hardware based on wiring logic.

[0056] like Figure 4 As shown, the control device 4 includes a control unit 18 and a storage unit 19 (see reference). Figure 1 The storage unit 19 is implemented, for example, by semiconductor memory elements such as RAM and flash memory, or storage devices such as hard disks and optical disks. Storage scheme information 19a is provided for this storage unit 19.

[0057] Scheme information 19a is information indicating the content of substrate processing. Specifically, it is information that pre-registers the content of each process executed by the processing unit 16 in substrate processing according to the processing order.

[0058] The control unit 18, for example, is a CPU, capable of reading and executing a program (not shown) stored in the storage unit 19, and as an example... Figure 4 The functional blocks shown (substrate processing execution unit 18a, monitoring unit 18b, and exception handling unit 18c) function. Furthermore, the above program can also be recorded on a computer-readable recording medium and installed from that recording medium into the storage unit 19 of the control device 4. Examples of computer-readable recording media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards.

[0059] The control unit 18 includes a substrate processing execution unit 18a, a monitoring unit 18b, and an anomaly response handling unit 18c.

[0060] When the control unit 18 functions as the substrate processing execution unit 18a, it can control the processing unit 16 to perform a series of substrate processes according to the scheme information 19a stored in the storage unit 19. For example, the control unit 18 can perform a series of substrate processes including a solution processing of supplying a solution to the wafer W, a rinsing process of supplying a rinsing solution to the wafer W, and a drying process of increasing the rotation speed of the wafer W to dry the wafer W.

[0061] According to the timing specified in scheme information 19a, control unit 18 outputs an open signal and a close signal to the flow path opening / closing unit 61 of processing fluid supply unit 40, thereby releasing the processing fluid corresponding to the substrate processing content from nozzle 41. The processing fluid released from nozzle 41 lands on wafer W. Detection unit 80 detects whether processing fluid has landed on wafer W, and the detection value (i.e., the intensity value of reflected light) is output to control unit 18.

[0062] When the control unit 18 functions as the monitoring unit 18b, it performs a "monitoring process" based on the detection value of the detection unit 80. The "monitoring process" is the process of monitoring whether the adjustment of the air regulating valve 61c of the flow path opening and closing unit 61 is normal.

[0063] Here, refer to Figure 4 The content of the monitoring and processing is explained. Figure 5 This diagram illustrates the execution timing of the monitoring process in the first embodiment.

[0064] like Figure 5 As shown, the control unit 18 first outputs an opening signal (time t1) to the flow path opening / closing unit 61 at the timing when a series of substrate processing steps on the wafer W begin. Consequently, the flow path opening / closing unit 61 gradually opens at a preset opening speed, and the processing liquid begins to be released from the nozzle 41. At this moment, the processing liquid released from the nozzle 41 has not yet landed on the wafer W; therefore, the detection value of the detection unit 80 remains at a value indicating the reception of reflected light from the wafer W (>0).

[0065] The monitoring process is performed during a predetermined period T1, starting from the moment the open signal is output from the convection path switch 61. The length of the predetermined period T1 is set to exceed the elapsed time from the output of the open signal until the detection unit 80 detects that the processing liquid has fallen onto the wafer W.

[0066] During monitoring, the control unit 18 monitors whether the flow path opening and closing unit 61 has any abnormal operation based on the elapsed time from the output of the open signal to the detection unit 80 detecting that the processing liquid has fallen onto the wafer W.

[0067] That is, the control unit 18 continuously acquires the detection value of the detection unit 80 after outputting the open signal. When the detection value of the detection unit 80 becomes "0," indicating that the processing liquid has landed on the wafer W, the control unit 18 calculates the elapsed time from outputting the open signal to the detection unit 80 detecting that the processing liquid has landed on the wafer W. Figure 5 In the example, at time t2, the detection value of the detection unit 80 becomes 0, indicating that liquid has settled (the treatment liquid has settled). Therefore, the elapsed time is calculated to be "t2-t1".

[0068] Then, the control unit 18 determines whether the elapsed time is within a predetermined normal range. If the elapsed time deviates from the normal range, the control unit 18 detects an abnormal operation of the air regulating valve 61c. Specifically, if the elapsed time deviates from the normal range, the control unit 18 presumes that an abnormal dripping of the treatment fluid from the nozzle 41 has occurred.

[0069] Return to Figure 4 The anomaly response processing unit 18c will be described below. When an anomaly is detected during monitoring, the control unit 18 functions as the anomaly response processing unit 18c and executes the prescribed anomaly response processing.

[0070] For example, the control unit 18 causes the output device 200, such as a display unit or a sound output unit, to output warning information such as a warning screen or warning sound. This allows the operator to recognize that an abnormality has occurred.

[0071] Furthermore, the control unit 18 is capable of performing automatic adjustment processing to regulate the set opening speed and set closing speed of the pneumatic valve 61a of the flow path opening / closing unit 61. That is, if the elapsed time deviates from the normal range, the control unit 18 controls the air regulating valve 61c to adjust the set opening speed and set closing speed of the pneumatic valve 61a so that the elapsed time calculated next time is within the normal range.

[0072] The air regulating valve 61c includes, for example, a needle valve capable of regulating the flow rate of air supplied to the pneumatic valve 61a by changing the flow path cross-sectional area of ​​the air supply pipe 61b; and a drive unit capable of driving the needle valve. Furthermore, the protrusion amount of the needle valve is preset in the air regulating valve 61c so that the opening and closing speeds of the pneumatic valve 61a are preset opening and closing speeds. If the control unit 18 deviates from the normal range over time, it controls the drive unit to change the protrusion amount of the needle valve, thereby changing the preset opening and closing speeds.

[0073] Specifically, the storage unit 19 stores adjustment information 19b obtained by relating the time difference between the elapsed time and the reference value to the adjustment amount of the air regulating valve 61c. Here, the time difference between the elapsed time and the reference value represents the difference between the center value of the normal range (the value obtained by adding the upper limit and the lower limit and dividing by 2, an example of the reference value) and the elapsed time. For example, if the upper limit of the normal range is 20 msec and the lower limit is 10 msec, the center value is 15 msec. In this case, when the elapsed time is 25 msec, the time difference is +10 msec. Furthermore, when the elapsed time is 5 msec, the time difference is -10 msec.

[0074] Furthermore, the adjustment amount of the air regulating valve 61c is, for example, the amount of needle valve actuation required to make the elapsed time consistent with the center value of the normal range. For example, the adjustment information 19b associates a time difference of "+10ms" with a needle valve actuation of "+1 turn", and associates a time difference of "-10ms" with a needle valve actuation of "-1 turn". Additionally, a "+" in the time difference indicates that the elapsed time is greater than the center value, and a "-" in the time difference indicates that the elapsed time is less than the center value. Furthermore, the "+" and "-" in the needle valve actuation indicate the direction of needle valve rotation.

[0075] In the automatic adjustment process, the control unit 18 first calculates the elapsed time difference. Next, referring to the adjustment information 19b stored in the storage unit 19, the control unit 18 determines the adjustment amount of the air regulating valve 61c, i.e., the drive amount of the needle valve, corresponding to the calculated time difference. Then, the control unit 18 changes the protrusion amount of the needle valve by rotating the needle valve of the air regulating valve 61c by the determined drive amount (rotation amount). As a result, the flow path cross-sectional area of ​​the air supply pipe 61b changes, and consequently, the air supply speed (flow rate) relative to the pneumatic valve 61a changes. Consequently, the opening and closing speeds of the pneumatic valve 61a can be changed. That is, the set opening speed and set closing speed can be changed.

[0076] For example, when the elapsed time difference is "+10 msec", the control unit 18 rotates the needle valve one revolution in the direction that increases the flow path cross-sectional area of ​​the air supply pipe 61b. Conversely, when the elapsed time difference is "-10 msec", the control unit 18 rotates the needle valve one revolution in the direction that decreases the flow path cross-sectional area of ​​the air supply pipe 61b. This ensures that the release of the treatment fluid from the nozzle 41 begins and stops normally, preventing, for example, dripping.

[0077] As described above, if the time elapsed between the output of the opening signal from the flow path opening / closing unit 61 and the detection unit 80 detecting the arrival of the treatment fluid deviates from the normal range, the control unit 18 controls the air regulating valve 61c to change the set opening speed and set closing speed. Specifically, the control unit 18 controls the drive unit based on the adjustment information 19b to drive the needle valve with a drive amount corresponding to the time difference between the elapsed time and the reference value within the normal range, thereby changing the set opening speed and set closing speed. Thus, for example, the opening speed and closing speed of the pneumatic valve 61a can be adjusted to an appropriate opening and closing speed, for example, without manual adjustment by the operator, to prevent dripping.

[0078] Furthermore, the above assumes that the time difference is based on the central value of the normal range. However, the reference value only needs to be within the normal range and does not necessarily need to be the central value.

[0079] Furthermore, the control unit 18 may not necessarily need to use the aforementioned adjustment information 19b during automatic adjustment processing. For example, it is also possible that, when the elapsed time deviates from the normal range, the control unit 18 adjusts the air regulating valve 61c by a predetermined adjustment amount, regardless of the time difference. In this case, the control unit 18 adjusts the air regulating valve 61c by a predetermined adjustment amount when the elapsed time deviates from the normal range. By repeatedly performing this process, the elapsed time can be controlled within the normal range.

[0080] Alternatively, the adjustment information 19b may store the type of processing fluid, the time difference between the elapsed time and the reference value, and the adjustment amount (needle valve actuation amount) of the air regulating valve 61c in association with the scheme information 19a. In this case, the control unit 18 may control the drive unit based on the scheme information 19a and the adjustment information 19b to drive the needle valve with an actuation amount corresponding to the time difference between the elapsed time and the type of processing fluid contained in the scheme information 19a, thereby changing the set opening speed and the set closing speed.

[0081] Alternatively, the control unit 18 may switch a portion of the automatic adjustment process to manual adjustment by the operator. For example, if the elapsed time deviates from the normal range, the control unit 18 may use the output device 200 to prompt the adjustment amount of the air regulating valve 61c used to change the set opening speed and set closing speed. That is, the control unit 18 may refer to the adjustment information 19b to prompt the adjustment amount (needle valve actuation amount) of the air regulating valve 61c corresponding to the time difference between the elapsed time and the reference value. Thus, for example, the operator can drive the needle valve with the prompted actuation amount, thereby changing the set opening speed and set closing speed.

[0082] Alternatively, in the case of manual adjustment by the operator, the adjustment information 19b can also store the type of treatment fluid contained in the scheme information 19a, the time difference between the elapsed time and the reference value, and the adjustment amount (needle valve actuation amount) of the air regulating valve 61c. In this case, the control unit 18 refers to the scheme information 19a and the adjustment information 19b to prompt the adjustment amount (needle valve actuation amount) of the air regulating valve 61c corresponding to the time difference between the elapsed time and the type of treatment fluid contained in the scheme information 19a.

[0083] Next, refer to Figure 6 The above monitoring and processing procedures will be explained. Figure 6 This is a flowchart illustrating the monitoring process of the first embodiment.

[0084] like Figure 6 As shown, when the flow path opening / closing unit 61 outputs an open signal, the control unit 18 acquires the detection value of the detection unit 80 (step S101). Next, the control unit 18 determines whether the detection unit 80 has detected liquid (processing liquid falling) on ​​the wafer W by judging whether the detection value of the detection unit 80 becomes 0 (step S102).

[0085] If the detection value of the detection unit 80 is not zero, that is, if the detection unit 80 does not detect any liquid adhering to the wafer W (processing liquid adhering) (step S102: No), the control unit 18 repeatedly performs the process of step S101 until the detection unit 80 detects liquid adhering to the wafer W (processing liquid adhering). On the other hand, if the detection value of the detection unit 80 is zero, that is, if the detection unit 80 detects liquid adhering to the wafer W (processing liquid adhering) (step S102: Yes), the control unit 18 calculates the elapsed time from the output of the turn-on signal to the detection of liquid adhering (processing liquid adhering) (step S103).

[0086] Next, the control unit 18 determines whether the elapsed time is within the normal range (step S104). If the elapsed time deviates from the normal range (step S104: no), the control unit 18 detects an abnormality in the flow path opening / closing unit 61 (step S105) and performs abnormality handling (step S106). For example, the control unit 18 interrupts the substrate processing and outputs a warning message to the output device 200.

[0087] In addition, the control unit 18 controls the air regulating valve 61c to adjust the set opening speed and set closing speed of the pneumatic valve 61a so that the elapsed time calculated next time is within the normal range (step S107).

[0088] In step S104, if the elapsed time is within the normal range (step S104: Yes), the control unit 18 performs a normal judgment that the fluid supply unit 40 has no abnormalities (step S108). When the processing of step S107 or step S108 ends, the control unit 18 ends the monitoring process.

[0089] As described above, the substrate processing apparatus of the first embodiment (as an example, substrate processing system 1) includes a substrate holding unit (as an example, holding unit 31), a nozzle (as an example, nozzle 41), a flow path opening and closing unit (as an example, flow path opening and closing unit 61), a detection unit (as an example, detection unit 80), and a control unit (as an example, control unit 18) capable of controlling each unit. The substrate holding unit can hold a substrate (as an example, wafer W). The nozzle can supply processing liquid to the substrate. The flow path opening and closing unit can open and close the supply flow path (as an example, supply flow path 42) for supplying processing liquid to the nozzle. The detection unit can detect whether processing liquid has fallen onto the substrate. The control unit outputs an opening signal to the flow path opening and closing unit to open the supply flow path. The control unit detects abnormal operation of the flow path opening and closing unit based on the elapsed time from outputting the opening signal to the detection unit detecting the fall of processing liquid.

[0090] Therefore, the substrate processing apparatus according to the first embodiment can appropriately detect abnormal operation of the flow path opening and closing part.

[0091] Furthermore, in the first embodiment described above, an example was given of detecting an operational abnormality in the flow path opening / closing unit 61 based on the elapsed time from the output of the open signal to the detection unit 80 detecting the arrival of the processed liquid. However, the present invention is not limited to this. For example, it is also possible to adjust the opening and closing operation of the flow path opening / closing unit 61 (pneumatic valve 61a) without detecting an operational abnormality based on the elapsed time until the arrival of the processed liquid. Alternatively, it is also possible to indicate the adjustment amount (adjustment amount of air regulating valve 61c) for adjusting the opening and closing operation of the flow path opening / closing unit 61 (pneumatic valve 61a) without detecting an operational abnormality based on the elapsed time until the arrival of the processed liquid.

[0092] (Second Implementation)

[0093] Next, refer to Figure 7 The structure of the processing unit 16 in the second embodiment will be described. Figure 7 This is a diagram illustrating an example of the structure of the processing unit 16 in the second embodiment. Furthermore, in the following description, the same reference numerals are used for the parts that have already been described, and repeated descriptions are omitted.

[0094] like Figure 7As shown, the processing unit 16 of the second embodiment includes a detection unit 80A. The detection unit 80A is a weight sensor installed in the dummy dispense bath 90. The dummy dispense bath 90 is disposed in the standby position of the nozzle 41. During dummy dispense processing for the purpose of removing air bubbles and foreign matter from the supply flow path 42 connected to the nozzle 41, the dummy dispense bath 90 receives the processing liquid released from the nozzle 41 and discharges the received processing liquid to the discharge unit 91.

[0095] The detection unit 80A is, for example, located at the bottom of the dummy discharge tank 90. ​​The detection unit 80A detects whether any processing fluid has fallen into the dummy discharge tank 90 based on changes in the weight of the dummy discharge tank 90. ​​The detection unit 80A outputs the detection value (i.e., the weight value of the dummy discharge tank 90) used to detect whether processing fluid has fallen into the dummy discharge tank 90 to the control device 4. The detection value of the detection unit 80A may change to a value larger than the initial value, for example, if processing fluid falls onto the wafer W.

[0096] Here, refer to Figure 8 The monitoring process of the second embodiment will be described. Figure 8 This diagram illustrates the timing of the execution of the monitoring process in the second embodiment.

[0097] like Figure 8 As shown, the control unit 18 first outputs an opening signal (time t1) to the flow path opening / closing unit 61 at the timing of initiating the virtual discharge process. Consequently, the flow path opening / closing unit 61 gradually opens at a preset opening speed, and the processing liquid begins to be released from the nozzle 41. At this moment, the processing liquid released from the nozzle 41 has not yet landed in the virtual discharge tank 90; therefore, the detection value of the detection unit 80A remains at the initial value w1.

[0098] The monitoring process is performed during a predetermined period T1, starting from the moment the opening signal is output from the convection path opening / closing unit 61. The length of the predetermined period T1 is set to exceed the elapsed time from the moment the opening signal is output until the detection unit 80A detects that the processed liquid has fallen into the virtual discharge tank 90.

[0099] During monitoring, the control unit 18 monitors whether the flow path opening and closing unit 61 has any abnormal operation based on the elapsed time from the output of the open signal to the detection unit 80A detecting that the processing liquid has fallen into the virtual discharge tank 90.

[0100] That is, the control unit 18 continuously acquires the detection value of the detection unit 80A after outputting the open signal. When the detection value of the detection unit 80A changes from the initial value w1 to a value w2 (> w1) indicating that the treated liquid has landed in the virtual discharge tank 90, the control unit 18 calculates the elapsed time from outputting the open signal to the detection unit 80A detecting that the treated liquid has landed in the virtual discharge tank 90. Figure 8 In the example, at time t2, the detection value of the detection unit 80A becomes value w2, and liquid (processing liquid falling) is detected. Therefore, the elapsed time is calculated as "t2-t1".

[0101] Then, the control unit 18 determines whether the elapsed time is within a predetermined normal range. If the elapsed time deviates from the normal range, the control unit 18 detects an abnormal operation of the air regulating valve 61c. Specifically, if the elapsed time deviates from the normal range, the control unit 18 presumes that an abnormal dripping of the treatment fluid from the nozzle 41 has occurred.

[0102] As described above, the control unit 18 may detect abnormal operation of the flow path opening / closing unit 61 based on the elapsed time from when the flow path opening / closing unit 61 outputs an opening signal until the detection unit 80A detects the arrival of the processing liquid. Therefore, abnormal operation of the flow path opening / closing unit 61 can be appropriately detected during the false discharge process.

[0103] (Other variations)

[0104] In the above embodiment, an example of detecting an operational abnormality of the flow path opening / closing section 61 based on the elapsed time from the output opening signal to the detection of the processing fluid falling was described. However, the elapsed time is not limited to the elapsed time after the output opening signal. For example, it is also possible to detect an operational abnormality of the flow path opening / closing section 61 based on the elapsed time from the output closing signal to the end of the release of the processing fluid from the nozzle 41. In this case, the timing of the end of the release of the processing fluid from the nozzle 41 can be detected, for example, using various sensors installed in the nozzle 41 or the supply flow path 42 connected to the nozzle 41.

[0105] Furthermore, in the above embodiments, as an example of a detection unit for detecting whether or not processing liquid has fallen, a detection unit that detects the intensity of reflected light from the wafer W and changes in the weight of the virtual discharge tank 90 has been described. However, the detection unit is not limited to these. For example, an imaging unit may also be used as the detection unit. In this case, an imaging unit, as an example of a detection unit, is provided at a position within the chamber 20 capable of capturing images of the processing liquid released from the nozzle 41 onto the wafer W. The imaging unit can capture images of the processing liquid released from the nozzle 41 onto the wafer W. The control unit 18 controls the imaging unit to capture images of the processing liquid released from the nozzle 41 onto the wafer W, and uses the captured images obtained by the imaging unit to detect whether or not processing liquid has fallen onto the wafer W. Then, the control unit 18 detects abnormal operation of the flow path opening / closing unit 61 based on the elapsed time from the output of the open signal to the detection of processing liquid falling using the captured images obtained by the imaging unit.

[0106] The embodiments disclosed herein should be considered illustrative rather than limiting in all respects. In fact, the above embodiments can be implemented in various ways. Furthermore, the above embodiments can be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit.

[0107] Explanation of reference numerals in the attached figures

[0108] 1 Substrate processing system, 4 Control device, 16 Processing unit, 18 Control unit, 19 Storage unit, 19a Scheme information, 19b Adjustment information, 20 Chamber, 30 Substrate holding mechanism, 31 Holding unit, 40 Processing fluid supply unit, 41 Nozzle, 42 Supply flow path, 61 Flow path opening and closing unit, 61a Pneumatic valve, 61b Air supply pipe, 61c Air regulating valve, 80, 80A Detection unit, 90 Virtual discharge slot, W Wafer.

Claims

1. A substrate processing apparatus, characterized in that, include: Able to retain the substrate holding portion; A nozzle capable of supplying a treatment liquid to the substrate or a component different from the substrate; A flow path opening and closing section is provided, which is capable of opening and closing the supply flow path for supplying the treatment liquid to the nozzle. The detection unit is capable of detecting whether the processing liquid has fallen onto the substrate or the component; and A control unit capable of controlling each part. The control unit outputs an opening signal to the flow path opening and closing unit to cause the flow path opening and closing unit to open the supply flow path. The abnormal operation of the flow path opening and closing part is detected based on the elapsed time from the output of the opening signal to the detection unit detecting the landing of the processing liquid.

2. The substrate processing apparatus according to claim 1, characterized in that: The flow path opening and closing part includes: A pneumatic valve that can open and close using air pressure; and An air regulating valve, which is capable of regulating the flow rate of air supplied to the pneumatic valve. If the elapsed time deviates from the normal range, the control unit determines that the operation of the flow path opening and closing unit is abnormal.

3. The substrate processing apparatus according to claim 2, characterized in that: The air regulating valve adjusts the opening and closing speeds of the pneumatic valve to preset opening and closing speeds. When the elapsed time deviates from the normal range, the control unit controls the air conditioning valve to change the set opening speed and the set closing speed.

4. The substrate processing apparatus according to claim 3, characterized in that: The air regulating valve includes: A needle valve, which regulates the flow rate of air supplied to the pneumatic valve; and The drive unit capable of driving the needle valve, The substrate processing apparatus includes a storage unit that stores adjustment information obtained by relating the time difference between the elapsed time and a reference value within the normal range to the actuation amount of the needle valve. The control unit controls the drive unit based on the adjustment information to drive the needle valve with a drive amount corresponding to the time difference, thereby changing the set opening speed and the set closing speed.

5. The substrate processing apparatus according to claim 4, characterized in that: The adjustment information is stored in association with the type of processing liquid, the time difference, and the actuation amount of the needle valve, which are included in the scheme information for substrate processing. The control unit controls the drive unit based on the scheme information and the adjustment information to drive the needle valve with a drive amount corresponding to the time difference and the type of treatment liquid included in the scheme information, thereby changing the set opening speed and the set closing speed.

6. The substrate processing apparatus according to claim 2, characterized in that: The air regulating valve adjusts the opening and closing speeds of the pneumatic valve to preset opening and closing speeds. If the elapsed time deviates from the normal range, the control unit prompts the adjustment amount of the air regulating valve used to change the set opening speed and the set closing speed.

7. The substrate processing apparatus according to claim 6, characterized in that: The air regulating valve includes: A needle valve, which regulates the flow rate of air supplied to the pneumatic valve; and The drive unit capable of driving the needle valve, The substrate processing apparatus includes a storage unit that stores adjustment information obtained by relating the time difference between the elapsed time and a reference value within the normal range to the actuation amount of the needle valve. The control unit refers to the adjustment information to indicate the driving amount of the needle valve corresponding to the time difference as the adjustment amount of the air regulating valve.

8. The substrate processing apparatus according to claim 7, characterized in that: The adjustment information is stored in association with the type of processing liquid, the time difference, and the actuation amount of the needle valve, which are included in the scheme information for substrate processing. The control unit refers to the scheme information and the adjustment information to prompt the driving amount of the needle valve corresponding to the time difference and the type of treatment liquid included in the scheme information as the adjustment amount of the air regulating valve.

9. The substrate processing apparatus according to claim 1, characterized in that: The detection unit projects a laser onto the substrate and detects whether the processing liquid has fallen onto the substrate based on the intensity of the reflected light from the laser.

10. The substrate processing apparatus according to claim 1, characterized in that: The component is a dummy discharge slot located in the standby position of the nozzle. The detection unit is a weight sensor installed in the virtual discharge tank, which detects whether the treatment liquid has fallen into the virtual discharge tank based on the change in the weight of the virtual discharge tank.

11. The substrate processing apparatus according to claim 1, characterized in that: The control unit outputs a closing signal to the flow path opening and closing unit to cause the flow path opening and closing unit to close the supply flow path. The control unit detects abnormal operation of the flow path opening and closing unit based on the elapsed time from the output of the closing signal to the end of the release of the treatment liquid from the nozzle.

12. A substrate processing apparatus, characterized in that, include: Able to retain the substrate holding portion; A nozzle capable of supplying a treatment liquid to the substrate or a component different from the substrate; A flow path opening and closing section is provided, which is capable of opening and closing the supply flow path for supplying the treatment liquid to the nozzle. The detection unit is capable of detecting whether the processing liquid has fallen onto the substrate or the component; and A control unit capable of controlling each part. The control unit outputs an opening signal to the flow path opening and closing unit to cause the flow path opening and closing unit to open the supply flow path. The opening and closing action of the flow path opening and closing unit is adjusted based on the elapsed time from the output of the opening signal to the detection unit detecting the landing of the processing liquid.

13. A substrate processing apparatus, characterized in that, include: Able to retain the substrate holding portion; A nozzle capable of supplying a treatment liquid to the substrate or a component different from the substrate; A flow path opening and closing section is provided, which is capable of opening and closing the supply flow path for supplying the treatment liquid to the nozzle. The detection unit is capable of detecting whether the processing liquid has fallen onto the substrate or the component; and A control unit capable of controlling each part. The control unit outputs an opening signal to the flow path opening and closing unit to cause the flow path opening and closing unit to open the supply flow path. Based on the elapsed time from the output of the opening signal to the detection unit detecting the landing of the processing liquid, the adjustment amount for adjusting the opening and closing action of the flow path opening and closing unit is indicated.

14. An anomaly detection method, characterized in that, include: In the output step, a substrate processing device includes a substrate holding section capable of holding the substrate, a nozzle capable of supplying processing liquid to the substrate or a component different from the substrate, a flow path opening and closing section capable of opening and closing a supply flow path for supplying the processing liquid to the nozzle, and a detection section capable of detecting whether the processing liquid has fallen onto the substrate or the component, and outputs an opening signal to the flow path opening and closing section to cause the flow path opening and closing section to open the supply flow path. and The anomaly detection step detects an abnormality in the operation of the flow path opening and closing part based on the elapsed time from the output of the opening signal to the detection unit detecting the falling of the processing liquid.

15. A method for adjusting a substrate processing apparatus, characterized in that, include: In the output step, a substrate processing device includes a substrate holding section capable of holding the substrate, a nozzle capable of supplying processing liquid to the substrate or a component different from the substrate, a flow path opening and closing section capable of opening and closing a supply flow path for supplying the processing liquid to the nozzle, and a detection section capable of detecting whether the processing liquid has fallen onto the substrate or the component, and outputs an opening signal to the flow path opening and closing section to cause the flow path opening and closing section to open the supply flow path. and The adjustment step involves adjusting the opening and closing action of the flow path opening and closing unit based on the elapsed time from the output of the opening signal to the detection unit detecting the landing of the processing liquid.

16. A method for adjusting a substrate processing apparatus, characterized in that, include: In the output step, a substrate processing device includes a substrate holding section capable of holding the substrate, a nozzle capable of supplying processing liquid to the substrate or a component different from the substrate, a flow path opening and closing section capable of opening and closing a supply flow path for supplying the processing liquid to the nozzle, and a detection section capable of detecting whether the processing liquid has fallen onto the substrate or the component, and outputs an opening signal to the flow path opening and closing section to cause the flow path opening and closing section to open the supply flow path. and The prompt step indicates the adjustment amount for adjusting the opening and closing action of the flow path opening and closing part, based on the elapsed time from the output of the opening signal to the detection of the processing liquid falling by the detection unit.

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