Intelligent cooling patch and control method

Abstract

The application provides a kind of intelligent cooling patch, including temperature control host and flexible patch, the temperature control host includes shell, water circulation module, semiconductor refrigeration / heat module, heat dissipation module and main control module set in the shell, the water circulation module includes water pump, liquid storage tank and connecting pipeline, the flow channel outlet of flexible patch is connected to liquid storage tank by pipeline, the hot end of semiconductor module is tightly coupled with heat dissipation module;The flexible patch includes upper layer patch, double-path S-shaped uniform temperature flow channel, lower layer patch and second temperature sensor, the inlet end and outlet end of double-path S-shaped uniform temperature flow channel are connected to the water circulation module of temperature control host unit by manifold, double-path S-shaped uniform temperature flow channel is arranged between upper layer patch and lower layer patch, and second temperature sensor is also integrated between upper layer patch and lower layer patch.The application can uniformly and accurately control temperature, and dynamically switch heat dissipation mode according to real-time thermal load, while ensuring cooling efficiency, considering quietness and energy efficiency ratio.

Description

Technical Field

[0001] This invention belongs to the field of medical cooling technology, and in particular relates to an intelligent cooling patch and its control method. Background Technology

[0002] In the fields of healthcare and personal care, physical cooling is a non-invasive, low-side-effect method of body temperature intervention, and has long been widely used as an adjunct treatment for febrile patients. In recent years, intelligent cooling devices integrating temperature sensing and active cooling functions have emerged on the market. These devices typically consist of a flexible contact unit attached to the skin surface and an external main unit. They collect local skin temperature through a built-in temperature sensor and trigger a semiconductor cooling chip based on a preset temperature threshold. This, combined with a micro-pump driving coolant to circulate in a closed loop, transfers cooling energy to the body surface. Compared to traditional passive cooling methods, this significantly improves response speed and automation. However, existing cooling devices still suffer from problems such as large size and high noise levels.

[0003] To ensure cooling efficiency, existing devices typically combine high-power semiconductor cooling / heating modules with forced air cooling. While this can quickly establish a temperature difference, the resulting operating noise can easily disrupt normal rest when used at night.

[0004] Current cooling strategies typically employ an "all or nothing" binary control logic—meaning that once cooling is activated, the fan runs continuously, failing to dynamically adjust the cooling intensity according to the actual heat load. This results in excessive heat dissipation and increased energy consumption under conditions of slight heat generation or low ambient temperature.

[0005] While existing flexible coolant patches have multi-layered composite structures that improve adhesion to some extent, their internal flow channels are mostly single-loop or linear, resulting in significant temperature rise of the coolant along the flow path and making it difficult to maintain a uniform temperature distribution over a large area. When the patch covers irregular curved surfaces such as foreheads, "hot spots" may form in localized areas due to poor contact or dead zones in the flow channels, thereby weakening the overall cooling uniformity.

[0006] Therefore, designing a cooling patch that integrates a highly adhesive flexible patch with intelligent graded heat dissipation, while ensuring cooling efficiency and taking into account quiet operation and energy efficiency ratio, has significant practical implications. Summary of the Invention

[0007] The purpose of this invention is to provide an intelligent cooling patch and control method to solve the problems of heat sensing and heat transfer in the existing flexible patch and temperature control host, so as to achieve uniform and accurate temperature control of the body surface, and dynamically switch between natural heat dissipation and forced heat dissipation modes according to the real-time heat load, so as to ensure cooling performance while taking into account quietness and energy efficiency.

[0008] To achieve the above objectives, the present invention provides a smart cooling patch, comprising:

[0009] A temperature control unit includes a housing, a water circulation module, a semiconductor cooling / heating module, a heat dissipation module, and a main control module disposed inside the housing. The water circulation module includes a water pump, a storage tank, and connecting pipes. The outlet of the water pump is connected to the inlet of a flexible adhesive channel via the connecting pipes, and the outlet of the flexible adhesive channel is connected to the storage tank via pipes, forming a closed loop. The hot end of the semiconductor cooling / heating module is tightly coupled to the heat dissipation module. The heat dissipation module includes a heat dissipation vent, a heat spreader, a heat dissipation fin array, a cooling fan, and a first temperature sensor. The heat dissipation vent is located on the top of the housing. The heat spreader is in direct contact with the hot end of the semiconductor cooling / heating module. The heat dissipation fin array is vertically attached to the heat spreader. The cooling fan is located on the upper part of the storage tank and is coaxial with the heat dissipation vent. The first temperature sensor is located on the surface of the heat spreader for monitoring the temperature of the hot end.

[0010] The flexible adhesive tape includes an upper adhesive tape, a dual S-shaped temperature equalization channel, a lower adhesive tape, and a second temperature sensor. The dual S-shaped temperature equalization channel consists of two S-shaped channels that are distributed in a mirror image. The inlet and outlet ends of the dual S-shaped temperature equalization channel are connected to the water circulation module of the temperature control host unit through a manifold. The dual S-shaped temperature equalization channel is located between the upper adhesive tape and the lower adhesive tape, and the second temperature sensor is also integrated between the upper adhesive tape and the lower adhesive tape.

[0011] The first temperature sensor, the second temperature sensor, the semiconductor cooling / heating module, the water pump, and the cooling fan are all electrically connected to the main control module.

[0012] The aforementioned intelligent cooling patch includes a main control module comprising a main control chip, a power management unit, a drive circuit, a control panel, and a miniature buzzer. The power management unit, drive circuit, and control panel are electrically connected to the ports of the main control chip, and the control panel and miniature buzzer are fixedly mounted through the outer casing.

[0013] In the aforementioned intelligent cooling patch, the semiconductor cooling / heating module includes a semiconductor cooling plate, the cold end of which is disposed on the inner wall of the liquid storage tank, and the hot end of which is attached to the heat spreader.

[0014] In the aforementioned intelligent cooling patch, the liquid storage tank is made of transparent material, an observation window is provided at the position where the outer shell and the liquid storage tank are attached, and the water pump is immersed in the liquid storage tank.

[0015] In the aforementioned intelligent cooling patch, the heat dissipation vent is further provided with a flow guiding structure.

[0016] The aforementioned smart cooling patch has an upper layer with a waterproof layer and a lower layer made of a skin-friendly material with good biocompatibility.

[0017] A method for controlling a smart cooling patch includes the following steps:

[0018] S1. The system is powered on and initialized. The flexible attachment unit is attached to the target surface, and the second temperature sensor begins to continuously monitor the surface temperature T. surface The first temperature sensor monitors the temperature T of the heat dissipation vapor chamber. hot ;

[0019] S2. The user sets the target temperature T through the control panel of the main control module. target and temperature alarm threshold T alarm ;

[0020] S3, the main control module compares T surface With T target If T surface >T target If T surface <T target， Then it enters heating mode; if |T surface -T target If the temperature is less than or equal to the set temperature, the current state will be maintained or the system will enter standby mode.

[0021] S4. In cooling or heating mode, the main control module starts the water pump and the semiconductor cooling / heating module. The temperature-controlled circulating working fluid flows through the flexible double S-shaped temperature equalization channel and exchanges heat with the target surface through the heat-conducting medium layer.

[0022] S5. During the heat exchange process, the main control module synchronously executes graded heat dissipation control: real-time acquisition of T hot And compare it with the preset thresholds T1 and T2, and control the cooling fan to be in the off state, the first speed P1 or the second speed P2 state according to the comparison result;

[0023] S6, the main control module continuously compares T surface With T alarm If T surface Greater than T alarm If this is triggered, a miniature buzzer will sound an alarm.

[0024] In the aforementioned intelligent cooling patch control method, in step S4, the main control module uses a proportional-integral control algorithm to perform closed-loop temperature control, and the main control chip calculates the temperature deviation e(k)=T once per second. surface (k)-T target And the integral term of the deviation Σe(j), the control output u(k)=K p *e(k)+Ki*Σe(j), where K p and K iThe control output u(k), which is a tuned control parameter, is mapped to a coordinated adjustment command for the operating current of the semiconductor cooling / heating module and the speed of the water pump.

[0025] The above-mentioned intelligent cooling patch control method, wherein in step S5, the graded heat dissipation control method is: when T hot When T1 is less than or equal to 1, the cooling fan is turned off, and passive cooling is achieved by relying on the natural convection between the heat dissipation fin array and the surrounding air, as well as the "chimney effect" formed from the air inlet on the side of the casing to the air outlet on the top; when T1 is less than or equal to 1, the cooling fan is turned off, and passive cooling is achieved by relying on the natural convection between the heat dissipation fin array and the surrounding air, as well as the "chimney effect" formed by the air inlet on the side of the casing to the air outlet on the top. <T hot When T ≤ T2, the cooling fan is controlled to run at a first preset speed P1; when T hot At time T2, the cooling fan is controlled to run at a second preset speed P2. At this time, the high-speed airflow generated by the fan enhances the suction effect on the surface of the heat sink fins according to Bernoulli's principle, thereby improving the forced convection cooling efficiency.

[0026] Compared with the prior art, the present invention has the following advantages:

[0027] This invention employs a multi-layered composite flexible structure and a thermally conductive medium layer with high deformation capacity, enabling the attachment unit to closely conform to irregular curved surfaces such as the forehead of the human body, eliminating local gaps, achieving "zero-distance" contact, and effectively improving heat conduction efficiency and wearing comfort.

[0028] This invention employs an S-shaped uniform temperature flow channel, which effectively solves the problem of coolant temperature rise along the flow path by enhancing convective heat transfer and reducing flow resistance. Combined with a large-area covered flow channel layout, a highly uniform temperature field is established in the attached area, eliminating the "hot spot" phenomenon.

[0029] This invention employs a graded intelligent heat dissipation control mechanism with real-time feedback of hot-end temperature. Under low heat loads, it achieves silent operation (<25dB) solely through natural heat dissipation via the "chimney effect," while automatically activating the fan for forced cooling under high heat loads. This achieves an optimal balance between quiet operation and heat dissipation efficiency, significantly reducing energy consumption under low loads. Furthermore, placing the water pump within the storage tank further enhances the quiet operation.

[0030] The modular design of this invention makes the device not only suitable for human body heating care, but also expandable to multiple scenarios such as car seat temperature control, rapid beverage cooling, local cold compress for sports rehabilitation, and heat dissipation of electronic devices by changing or adapting different attachment unit interfaces, thus possessing high versatility and adaptability. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 This is a schematic diagram of the overall structure of the temperature control host of the present invention. Figure 1 ;

[0033] Figure 3 This is a schematic diagram of the overall structure of the temperature control host of the present invention. Figure 2 ;

[0034] Figure 4 This is a schematic diagram of the internal structure of the temperature control unit of the present invention. Figure 1 ;

[0035] Figure 5 This is a schematic diagram of the internal structure of the temperature control unit of the present invention. Figure 2 ;

[0036] Figure 6 This is a schematic diagram of the structure of the flexible patch of the present invention; Figure 7 This is a schematic diagram of the electrical structure of the present invention.

[0037] List of reference numerals in the attached diagram:

[0038] 1. Temperature control unit; 11. Housing; 111. Air inlet; 112. Observation window; 113. Heat dissipation vent; 114. Airflow guiding structure; 12. Control panel; 121. Miniature buzzer; 13. Water pump; 14. First temperature sensor; 15. Cooling fan; 16. Heat spreader; 17. Liquid storage tank; 18. Heat dissipation fin array; 19. Semiconductor cooling plate.

[0039] 2. Flexible adhesive, 21. Upper adhesive, 22. Dual-channel S-shaped temperature equalization flow channel, 23. Lower adhesive, 24. Second temperature sensor. Detailed Implementation

[0040] To further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the specific embodiments according to the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0041] Please see Figure 1-7 This invention provides a smart cooling patch, comprising:

[0042] The temperature control host 1 includes a housing 11, a water circulation module, a semiconductor cooling / heating module, a heat dissipation module, and a main control module disposed inside the housing 11. The water circulation module includes a water pump 13, a storage tank 17, and connecting pipes. The outlet of the water pump 13 is connected to the inlet of the flow channel of the flexible patch 2 via the connecting pipes, and the outlet of the flow channel of the flexible patch 2 is connected to the storage tank 17 via pipes, forming a closed loop. The hot end of the semiconductor cooling / heating module is tightly coupled to the heat dissipation module. The heat dissipation module includes a heat dissipation port 113, a heat spreader 16, a heat dissipation fin array 18, a cooling fan 15, and a first temperature sensor 14. The heat dissipation port 113 is disposed on the top of the housing 11. The heat spreader 16 is in direct contact with the hot end of the semiconductor cooling / heating module. The heat dissipation fin array 18 is vertically attached to the heat spreader 16. The cooling fan 15 is disposed on the upper part of the storage tank 17 and coaxial with the heat dissipation port 113. The first temperature sensor 14 is disposed on the surface of the heat spreader 16 for monitoring the temperature of the hot end.

[0043] The flexible adhesive tape comprises, from the outside in, a waterproof layer, a thermal insulation layer, a water channel fixing layer, a dual S-shaped uniform temperature flow channel, a thermally conductive medium layer, and a contact layer, stacked sequentially. The dual S-shaped uniform temperature flow channel consists of two mirror-symmetrically distributed S-shaped channels. The inlet and outlet ends of the dual S-shaped uniform temperature flow channel are connected to the water circulation module of the temperature control host unit through a manifold. The thermally conductive medium layer is a paste or gel-like material with high thermal conductivity and high deformation capacity, filled between the dual S-shaped uniform temperature flow channel and the contact layer. A second temperature sensor is also integrated within the flexible adhesive tape.

[0044] The first temperature sensor 14, the second temperature sensor 24, the semiconductor cooling / heating module, the water pump 13, and the cooling fan 14 are all electrically connected to the main control module.

[0045] In the above-mentioned intelligent cooling patch and control method, the outer shell 11 of the temperature control host 1 is made of high temperature resistant and flame retardant ABS material, and the internal layout adopts a modular partition design. The water circulation module and the electrical control part are physically isolated by a waterproof partition to prevent short circuit risk caused by liquid leakage. The layer structure of the flexible patch 2 is integrally formed by a precision hot pressing composite process to ensure that there are no bubbles or delamination between the layers, and to ensure the integrity of the overall structure and the continuity of the heat conduction path.

[0046] Furthermore, in designing the composite structure of the flexible patch 2, the upper patch 21 is made of polyurethane material to provide an external environment isolation function and prevent sweat or external liquids from penetrating the internal structure, while the lower patch 22 is made of skin-friendly silicone with good biocompatibility to improve wearing comfort and skin compatibility.

[0047] In the aforementioned intelligent cooling patch and control method, the cross-section of the dual-path S-shaped heat equalization channel 22 is flattened round or rectangular, with a width-to-height ratio of 1.5 to 3:1. The continuous bending structure induces a secondary flow effect in the coolant during flow, effectively increasing the Nusselt number (Nu) compared to a straight pipe of the same length. In this embodiment, experimental measurements show an increase of 15% to 30%, enhancing convective heat transfer performance. In actual use, the aforementioned secondary flow effect originates from the lateral velocity component generated by centrifugal force at the bend, thus superimposing vortex motion in the mainstream direction, effectively disrupting the boundary layer and enhancing heat exchange near the wall. The projection of the dual-path S-shaped heat equalization channel 22 on the plane covers more than 80% of the effective contact area of ​​the flexible patch 2, ensuring large-area temperature uniformity. Furthermore, the Nusselt number increase ratio is: =

[0048] in, For S-shaped flow channels, Nusselt number, For straight pipe channels of the same length, the Nusselt number measured in this embodiment is... [15%, 30%].

[0049] Preferably, the bending angle of the dual-path S-shaped uniform temperature flow channel 22 is controlled at 90~150°, and a local diameter expansion section is set in each bend area, with the diameter increased by 10~15%, to alleviate local pressure loss and promote vortex generation.

[0050] In the aforementioned intelligent cooling patch and control method, when the heat dissipation module performs hierarchical intelligent control, the main control module executes a preset program to set a first temperature threshold T1 and a second temperature threshold T2, satisfying T2>T1. When the first temperature sensor detects the temperature T of the heat dissipation plate... hot When T1 is less than or equal to T1, the main control module shuts down the cooling fan; when T1 is less than or equal to T1, the main control module shuts down the cooling fan. <T hot When T < T2, control the cooling fan to run at the first preset speed P1; when T < T2, control the cooling fan to run at the first preset speed P1. hot At time T2, the cooling fan is controlled to run at a second preset speed P2. T1 and T2 are dynamically adjusted based on the rated power of the semiconductor cooling / heating module and the real-time ambient temperature to achieve adaptive adjustment of the heat dissipation response.

[0051] Preferably, the main control module is equipped with an ambient temperature compensation model. For every 1°C increase in ambient temperature, T1 and T2 are adjusted upward by 0.3~0.6°C respectively to prevent premature triggering of high-speed heat dissipation under high temperature conditions. The P1 speed is set to 40~60% of the rated maximum speed, and P2 is set to 85~100% to achieve a balanced adjustment of noise and heat dissipation efficiency.

[0052] In the aforementioned intelligent cooling patch and control method, when configured with high-efficiency heat exchange and drive components, the semiconductor cooling plate 19 of the semiconductor cooling / heating module directly contacts the liquid in the storage tank 17 to achieve optimal heat transfer efficiency. The water pump 13 is a brushless DC magnetic drive pump with a flow rate of 100~300mL / min, supporting on-demand liquid supply. The water pump 13 is fitted with a shock-absorbing sleeve and is submerged within the storage tank 17, thereby minimizing pump noise.

[0053] In the aforementioned intelligent cooling patch and its control method, the main control module employs a proportional-integral control algorithm for closed-loop temperature control. The main control module uses the surface temperature T fed back by the second temperature sensor as the basis for temperature control. surface With the user-set target temperature T target The deviation ΔT between the two is dynamically adjusted by a proportional-integral control algorithm to control the operating current of the semiconductor cooling / heating module and the speed of the water pump. When |ΔT|≤0.5℃ for more than 30 seconds, the system switches to a low-power standby monitoring mode to maintain basic sensing capabilities.

[0054] Preferably, the sampling period of the proportional-integral control algorithm is set to 1 second, K p The initial value of the parameter is set to 2.5, K. i Set to 0.05, and fine-tune online according to the actual temperature control response curve; in addition, the system is also equipped with an anti-integral saturation mechanism, which pauses the accumulation of integral terms when the control output reaches the upper or lower limit to avoid overshoot.

[0055] In the aforementioned intelligent cooling patch and control method, when executing the intelligent cooling patch control process, the system initializes after power-on, the flexible patch 2 is attached to the target surface, and the second temperature sensor 24 continuously collects the surface temperature T. surface The first temperature sensor 21 synchronously monitors the temperature T of the heat dissipation vapor chamber. hot Users can set the target temperature T through the human-computer interaction interface. target and alarm threshold T alarm The control chip of the main control module is relatively T surface With T target If T surface >T target Then the cooling mode will be activated, if Ts urface <T target Then it enters heating mode. If |T surface -T target If the temperature is ≤0.5℃, the current state will be maintained or standby mode will be entered. In cooling or heating mode, water pump 13 and semiconductor cooling / heating module will be activated. The temperature-controlled working fluid will flow through dual S-shaped temperature equalization channels 22 and exchange heat with the human body surface through the heat-conducting medium layer. During the process, the main control module will simultaneously execute graded heat dissipation control and monitor the temperature in real time. hotThe operation status of cooling fan 15 is adjusted accordingly by comparing it with T1 and T2.

[0056] Preferably, the human-machine interface of the control panel 12 adopts capacitive touch buttons and an OLED display screen, and the displayed content includes real-time temperature, target temperature, operating mode, battery level and system status icons; in addition, a miniature buzzer 121 is also provided at the OLED display screen, which can sound an alarm.

[0057] In the aforementioned intelligent cooling patch and control method, when deepening the proportional-integral control logic, during temperature control, the main control module samples the temperature deviation e(k)=T once per second. surface (k)-T target And calculate its integral term Σe(j). Control output u(k) = K p *e(k)+K i *Σe(j), where K p and K i The tunable control parameters are used to map the control output u(k) into a coordinated adjustment command for the operating current of the semiconductor cooling / heating module and the speed of the water pump, thereby achieving precise temperature control.

[0058] Preferably, the control module performs a moving average filtering process on the temperature sample value to eliminate misjudgments caused by instantaneous interference. The control output u(k) is converted into a PWM duty cycle signal through a nonlinear mapping function, which drives the H-bridge circuit of the semiconductor cooling / heating module and the water pump motor driver respectively to achieve continuous and smooth adjustment.

[0059] In the aforementioned intelligent cooling patch and control method, when T hot When T1 is less than or equal to 1, the cooling fan 15 is turned off, and passive heat dissipation is achieved by the natural convection between the array of heat dissipation fins 18 and the surrounding air, as well as the "chimney effect" formed by the air inlet 111 on the side of the casing and the heat dissipation vent 113 on the top. Furthermore, a guide structure 114 is provided at the heat dissipation vent to further promote the "chimney effect" and improve the heat dissipation effect. When T1 is less than or equal to 1, the cooling fan 15 is turned off, and passive heat dissipation is achieved by the natural convection between the array of heat dissipation fins 18 and the surrounding air, as well as the "chimney effect" formed by the air inlet 111 on the side of the casing and the heat dissipation vent 113 on the top. A guide structure 114 is also provided at the heat <T hot When T < T2, start cooling fan 15 and run it at the first speed P1; when T < T < T2, start cooling fan 15 and run it at the first speed P1. hot At time T2, the cooling fan 15 is controlled to run at the second speed P2. The high-speed airflow utilizes Bernoulli's principle to enhance the suction effect on the surface of the heat dissipation fin array 18, significantly improving the forced convection cooling efficiency.

[0060] Preferably, the cooling fan 15 adopts an axial flow design with 9 blades and a tilt angle of 35°. It is equipped with a rubber shock-absorbing pad between the two heat dissipation fin arrays 18 to reduce vibration transmission, and the heat dissipation port 113 is equipped with a grille to prevent foreign objects from entering.

[0061] In the aforementioned intelligent cooling patch and control method, when expanding the target temperature setting mode and system energy saving, an automatic mode option is designed in the user setting process. The main control module dynamically calculates the optimal T based on ambient temperature sensor data. target When the flexible patch 2 is detected to be unused, it enters an ultra-low power standby or a complete power-off state. When it is detected to be in use again, the system will wake up and restore the temperature control function.

[0062] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A smart cooling patch, characterized in that, include: A temperature control unit includes a housing, a water circulation module, a semiconductor cooling / heating module, a heat dissipation module, and a main control module disposed inside the housing. The water circulation module includes a water pump, a storage tank, and connecting pipes. The outlet of the water pump is connected to the inlet of a flexible adhesive channel via the connecting pipes, and the outlet of the flexible adhesive channel is connected to the storage tank via pipes, forming a closed loop. The hot end of the semiconductor cooling / heating module is tightly coupled to the heat dissipation module. The heat dissipation module includes a heat dissipation vent, a heat spreader, a heat dissipation fin array, a cooling fan, and a first temperature sensor. The heat dissipation vent is located on the top of the housing. The heat spreader is in direct contact with the hot end of the semiconductor cooling / heating module. The heat dissipation fin array is vertically attached to the heat spreader. The cooling fan is located on the upper part of the storage tank and is coaxial with the heat dissipation vent. The first temperature sensor is located on the surface of the heat spreader for monitoring the temperature of the hot end. The flexible adhesive tape includes an upper adhesive tape, a dual S-shaped temperature equalization channel, a lower adhesive tape, and a second temperature sensor. The dual S-shaped temperature equalization channel consists of two S-shaped channels that are distributed in a mirror image. The inlet and outlet ends of the dual S-shaped temperature equalization channel are connected to the water circulation module of the temperature control host unit through a manifold. The dual S-shaped temperature equalization channel is located between the upper adhesive tape and the lower adhesive tape, and the second temperature sensor is also integrated between the upper adhesive tape and the lower adhesive tape. The first temperature sensor, the second temperature sensor, the semiconductor cooling / heating module, the water pump, and the cooling fan are all electrically connected to the main control module.

2. The intelligent cooling patch according to claim 1, characterized in that, The main control module includes a main control chip, a power management unit, a drive circuit, a control panel, and a miniature buzzer. The power management unit, drive circuit, and control panel are electrically connected to the ports of the main control chip. The control panel and miniature buzzer are fixedly installed through the outer casing.

3. The intelligent cooling patch according to claim 1, characterized in that, The semiconductor cooling / heating module includes a semiconductor cooling plate, the cold end of which is disposed on the inner wall of the liquid storage tank, and the hot end of which is attached to the heat spreader.

4. The intelligent cooling patch according to claim 1, characterized in that, The storage tank is made of transparent material, and an observation window is provided at the position where the outer shell fits into the storage tank. The water pump is submerged inside the storage tank.

5. The intelligent cooling patch according to claim 1, characterized in that, The heat dissipation vent is also equipped with a flow guiding structure.

6. The intelligent cooling patch according to claim 1, characterized in that, The upper layer has a waterproof layer, and the lower layer is made of a skin-friendly material with good biocompatibility.

7. A method for controlling an intelligent cooling patch, characterized in that, Includes the following steps: S1. The system is powered on and initialized. The flexible attachment unit is attached to the target surface, and the second temperature sensor begins to continuously monitor the surface temperature T. surface The first temperature sensor monitors the temperature T of the heat dissipation vapor chamber. hot ; S2. The user sets the target temperature T through the control panel of the main control module. target and temperature alarm threshold T alarm ; S3, the main control module compares T surface With T target If T surface >T target If T surface <T target If |T surface -T target If the temperature is less than or equal to the set temperature, the current state will be maintained or the system will enter standby mode. S4. In cooling or heating mode, the main control module starts the water pump and the semiconductor cooling / heating module. The temperature-controlled circulating working fluid flows through the flexible double S-shaped temperature equalization channel and exchanges heat with the target surface through the heat-conducting medium layer. S5. During the heat exchange process, the main control module synchronously executes graded heat dissipation control: real-time acquisition of T hot And compare it with the preset thresholds T1 and T2, and control the cooling fan to be in the off state, the first speed P1 or the second speed P2 state according to the comparison result; S6, the main control module continuously compares T surface With T alarm If T surface Greater than T alarm If this is triggered, a miniature buzzer will sound an alarm.

8. The intelligent cooling patch control method according to claim 7, characterized in that, In step S4, the main control module uses a proportional-integral control algorithm to perform closed-loop temperature control, and the main control chip calculates the temperature deviation e(k)=T once per second. surface (k)-T target And the integral term of the deviation Σe(j), the control output u(k)=K p *e(k)+Ki*Σe(j), where K p and K i The control output u(k), which is a tuned control parameter, is mapped to a coordinated adjustment command for the operating current of the semiconductor cooling / heating module and the speed of the water pump.

9. The intelligent cooling patch control method according to claim 7, characterized in that, In step S5, the graded heat dissipation control method is as follows: when T hot When T1 is less than or equal to 1, the cooling fan is turned off, and passive cooling is achieved by relying on the natural convection between the heat dissipation fin array and the surrounding air, as well as the "chimney effect" formed from the air inlet on the side of the casing to the air outlet on the top; when T1 is less than or equal to 1, the cooling fan is turned off, and passive cooling is achieved by relying on the natural convection between the heat dissipation fin array and the surrounding air, as well as the "chimney effect" formed by the air inlet on the side of the casing to the air outlet on the top. <T hot When T ≤ T2, the cooling fan is controlled to run at a first preset speed P1; when T hot At time T2, the cooling fan is controlled to run at a second preset speed P2. At this time, the high-speed airflow generated by the fan enhances the suction effect on the surface of the heat sink fins according to Bernoulli's principle, thereby improving the forced convection cooling efficiency.

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