Preparation method of notebook computer module based on series-parallel single-lock narrow and thin plate and notebook computer

Abstract

The present disclosure provides a preparation method of a notebook computer module based on a series-parallel single-lock narrow thin plate and a notebook computer; the preparation method of the notebook computer module based on the series-parallel single-lock narrow thin plate can change the single-lock annular semi-finished product into a quasi-rectangular semi-finished product by performing center screw hole forming treatment and edge cutting treatment on the annular boss of the single-lock annular semi-finished product, then obtains a single-lock base by performing undercutting treatment on the quasi-rectangular semi-finished product, and then assembles the single-lock base on the sub-board body after slotting and punching treatment, so that the middle base table of the single-lock base can be tightly assembled in the mounting groove by glue, and the lower stud can be stably mounted in the matching hole, and finally the single-lock base is firmly locked on the external computer mainboard by the locking screw passing through the threaded hole, thereby realizing high-strength mechanical connection between the circuit sub-board and the computer main body, and reducing the influence of the single-lock base on the structure and electrical function of the circuit sub-board itself.

Description

Technical Field

[0001] This disclosure relates to the technical field of laptop computers, and in particular to a method for fabricating a laptop module based on a serial-parallel single-lock narrow thin plate and a laptop computer. Background Technology

[0002] To balance long battery life and a slim design, ultra-thin laptops typically use a ribbon cable connection structure to connect multiple batteries in series and parallel, thus converging the circuitry of each battery onto a single circuit board. This circuit board is then soldered onto the motherboard using a stacked board structure. To accommodate the internal space of ultra-thin laptops, the circuit board needs to be designed with a narrow, thin board structure. However, due to the limited strength of this structure, the soldering between the circuit board and the motherboard is prone to failure.

[0003] To enhance the connection strength between the circuit board and the motherboard, a locking structure is typically used to secure them together. However, due to space limitations in the narrow and thin board structure, only a single locking socket can usually be installed on the circuit board. This requires the single locking socket to maintain a compact structure while possessing high strength. When the circuit board is mounted on the motherboard via the single locking socket, not only is a high-strength mechanical connection between the circuit board and the motherboard required through locking screws, but the impact of the single locking socket on the circuit board's own structure and electrical functions also needs to be minimized. Summary of the Invention

[0004] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a method for manufacturing a laptop module based on a series-parallel single-locking thin board, which can improve the mechanical connection strength of miniaturized circuit boards and have little impact on the structure and electrical function of the circuit boards themselves.

[0005] The purpose of this disclosure is achieved through the following technical solution: A method for fabricating a laptop module based on a series-parallel single-locking narrow thin plate is provided, for fabricating a laptop module with a series-parallel single-locking narrow thin plate, the laptop module comprising: Mounting frame for mounting at least two batteries; A circuit board, comprising a board body and a single-lock base, wherein the mounting frame and the single-lock base are both mounted on the board body; and, Several components are provided, each of which is soldered onto the circuit board and is electrically connected to each of the batteries via the circuit board. The method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate includes the following steps: An aluminum block is stamped to obtain a single-lock ring semi-finished product; wherein the single-lock ring semi-finished product includes a ring boss and a ring base connected to each other. The annular boss is subjected to a central screw hole forming process, and the single-lock annular semi-finished product is subjected to edge cutting process to obtain a pseudo-rectangular semi-finished product. The imitation rectangular semi-finished product is subjected to bottom cutting to obtain the single lock base; wherein, the single lock base includes an upper boss, a middle bottom platform and a lower stud that are sequentially penetrated by threaded holes; The sub-board body is slotted and drilled to form interconnected mounting grooves and mating holes in sequence on the sub-board body; The sub-plate body and the single-lock base are glued together to make the middle base plate glued and fit into the mounting groove; wherein, the lower stud passes through the mating hole, and the upper boss protrudes from the outside of the sub-plate body; Several of the aforementioned components are electrically connected to the sub-board body through soldering, so that each of the aforementioned components is soldered onto the sub-board body, thereby obtaining the series-parallel single-locking thin-plate laptop module; wherein, the sub-board body is used to electrically connect to each of the aforementioned batteries via a flexible flat cable, and the single-locking base is used to lock onto the external computer motherboard via a locking screw passing through the threaded hole.

[0006] In some embodiments, the stamping process is performed as follows: The aluminum block is flattened and shaped using a stamping die to obtain an irregularly shaped convex disc. The irregularly shaped convex disc is trimmed along its edges using a cutting tool to obtain the single-lock ring semi-finished product.

[0007] In some embodiments, the specific operation of the center screw hole forming process is as follows: The center of the annular boss is punched using a punching die to make the annular boss and the annular base interconnect to form a first through hole. The first through hole is tapped by a tapping machine to form a threaded hole; wherein the threaded hole passes through the annular boss and the annular base in sequence.

[0008] In some embodiments, the drilling and tapping operation specifically includes the following steps: The first through hole is pierced by rotating the tap of the tapping machine to form an internal thread on the hole wall.

[0009] In some embodiments, the edge cutting process is performed as follows: Laser scribing is performed on the annular boss to create cutting lines on both sides of the threaded hole. The single-lock ring semi-finished product is cut along the cutting line to sequentially cut the ring boss and the ring base.

[0010] In some embodiments, the bottom cutting process is performed as follows: The bottom surface of the imitation rectangular semi-finished product is milled around a hole using a milling die to form the lower stud.

[0011] In some embodiments, the specific operations of the grooving and drilling process are as follows: The sub-board body is machined with a blind groove machine to form an mounting groove on the sub-board body. A drilling machine is used to drill a hole in the bottom of the blind groove so that a mating hole is formed on the sub-plate body that communicates with the mounting groove.

[0012] In some embodiments, the specific operations of the adhesive application assembly process are as follows: The adhesive is applied to the insole using a dispensing machine to form an adhesive coating on the side of the insole that is away from the upper boss. The midsole platform is assembled with the mounting groove so that the midsole platform is bonded and fixed in the mounting groove.

[0013] In some embodiments, the specific operations of the welding electrical connection process are as follows: The components are soldered to the sub-board body using a solder bath, so that each component is soldered to the corresponding pad on the sub-board body.

[0014] A laptop computer includes a laptop module based on a series-parallel single-locking narrow thin plate, wherein the laptop module is prepared by the preparation method of the laptop module based on the series-parallel single-locking narrow thin plate in any of the above embodiments.

[0015] Compared with the prior art, this disclosure has at least the following advantages: The above-mentioned method for manufacturing a laptop module based on a series-parallel single-lock thin board involves shaping the annular boss of the single-lock annular semi-finished product with a central screw hole and cutting the edges to transform it into a pseudo-rectangular semi-finished product. Then, the pseudo-rectangular semi-finished product is bottom-cut to obtain the single-lock base. The single-lock base is then glued to the slotted and drilled sub-board body, allowing the central base of the single-lock base to be tightly fitted into the mounting groove with glue. The lower stud can be stably installed in the mating hole. Finally, the single-lock base is securely locked to the external computer motherboard by a locking screw passing through the threaded hole. This enables a high-strength mechanical connection between the circuit sub-board and the computer body, and reduces the impact of the single-lock base on the circuit sub-board's own structure and electrical functions. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic flowchart of a method for fabricating a laptop module based on a serial-parallel single-lock narrow thin plate according to an embodiment of the present disclosure; Figure 2 This is a schematic diagram of the structure of a laptop module with a serial-parallel single-locking thin plate according to another embodiment of the present disclosure; Figure 3 for Figure 2 The enlarged view shown at point A in the middle; Figure 4 for Figure 2 A cross-sectional view of a laptop module with a series-parallel single-lock narrow thin plate shown; Figure 5 for Figure 2 Bottom view of the single-lock base in the laptop module shown; Figure 6 This is a schematic diagram of the structure of a laptop module with a serial-parallel single-locked thin plate according to another embodiment of the present disclosure; Figure 7 for Figure 2 The diagram shows a three-dimensional structure of a laptop module with a series-parallel single-locking thin plate. Figure 8 for Figure 2 The image shows a physical diagram of the circuit board in the laptop module. Figure 9 for Figure 2 The image shown is a physical diagram of a laptop module with a series-parallel single-locking thin plate.

[0018] Figure label: 100. Mounting frame; 110. Battery; 200. Circuit board; 210. Board body; 201. Mounting slot; 2011. Protruding fastener; 202. Mating hole; 203. Solder pad; 220. Single-lock base; 2210. Upper boss; 2220. Middle base; 2221. Side bayonet; 2222. Honeycomb receiving groove; 2223. Flange; 2230. Lower stud; 2201. Threaded hole; 2202. Glue overflow gap; 300. Components. Detailed Implementation

[0019] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] This disclosure provides a method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate. The method is used to prepare a laptop module with a series-parallel single-lock narrow thin plate. Specifically, the aforementioned laptop module with a series-parallel single-lock narrow thin plate includes a mounting frame, a circuit board, and several components. The mounting frame is used to mount at least two batteries; the circuit board includes a board body and a single-lock base, both of which are mounted on the board body; each component is soldered onto the circuit board, and each component is electrically connected to each battery through the circuit board.

[0023] The aforementioned method for manufacturing a laptop module based on a series-parallel single-lock thin plate includes: stamping an aluminum block to obtain a single-lock annular semi-finished product; wherein the single-lock annular semi-finished product includes a connected annular boss and an annular base; forming a central screw hole in the annular boss; edge-cutting the single-lock annular semi-finished product to obtain a pseudo-rectangular semi-finished product; bottom-cutting the pseudo-rectangular semi-finished product to obtain a single-lock base; wherein the single-lock base includes an upper boss, a middle base, and a lower stud that are sequentially penetrated by threaded holes; and slotting and drilling the sub-board body to obtain... The sub-board body is sequentially formed with interconnected mounting slots and mating holes; the sub-board body and the single-lock base are glued together to ensure the bottom plate is glued and fits into the mounting slot; the lower stud passes through the mating hole, and the upper boss protrudes outside the sub-board body; several components are soldered to the sub-board body to ensure that each component is soldered onto the sub-board body, resulting in a series-parallel single-lock thin-plate laptop module; the sub-board body is used to connect to each battery via a flexible flat cable, and the single-lock base is used to lock onto the external computer motherboard via a locking screw passing through a threaded hole.

[0024] It is understandable that by forming the center screw hole and cutting the edges of the annular boss of the single-lock ring semi-finished product, the single-lock ring semi-finished product can be transformed into a pseudo-rectangular semi-finished product. Then, by cutting the bottom of the pseudo-rectangular semi-finished product, a single-lock base is obtained. By applying glue to the single-lock base and assembling it onto the slotted and drilled sub-board body, the center base of the single-lock base can be tightly assembled into the mounting groove with glue, and the lower stud can be stably installed in the mating hole. Finally, by passing the locking screw through the threaded hole, the single-lock base is securely locked onto the external computer motherboard. This enables a high-strength mechanical connection between the circuit sub-board and the computer body, and reduces the impact of the single-lock base on the circuit sub-board's own structure and electrical function.

[0025] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments: Please see Figures 1 to 3 An embodiment of the method for fabricating a laptop module based on a series-parallel single-lock narrow thin board is disclosed. Specifically, the laptop module based on the series-parallel single-lock narrow thin board includes a mounting frame 100, a circuit sub-board 200, and several components 300. The mounting frame 100 is used to mount at least two batteries 110. The circuit sub-board 200 includes a sub-board body 210 and a single-lock base 220. Both the mounting frame 100 and the single-lock base 220 are mounted on the sub-board body 210. Each component 300 is soldered onto the circuit sub-board 200, and each component 300 is electrically connected to each battery 110 through the circuit sub-board 200. The aforementioned laptop module based on the series-parallel single-lock narrow thin board can be fabricated using the following method.

[0026] Please see Figure 1 The above-mentioned method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate includes some or all of the following steps.

[0027] SI: The aluminum block is stamped to form a single-lock ring semi-finished product; wherein, the single-lock ring semi-finished product includes a ring boss and a ring base connected together. In this embodiment, the aluminum block is stamped and formed by using a stamping die to extrude and form an annular boss and an annular base on the aluminum block. The annular boss and the annular base are integrally formed, and the area of ​​the annular base is larger than the area of ​​the annular boss.

[0028] SII: The annular boss is formed by forming a central screw hole, and the single-lock annular semi-finished product is edge-cut to obtain a pseudo-rectangular semi-finished product; In this embodiment, after the aluminum block is stamped, the annular boss is formed with a central threaded hole. That is, a punching die is used to align with the center of the annular boss, and a first through hole is formed in the center of the annular boss. The first through hole passes through the annular boss and the annular base in sequence. A tapping machine is used to tap the inner wall of the first through hole, thereby cutting an internal thread on the hole wall of the first through hole. Then, the annular base and the annular boss are edge-cut. That is, the annular base and the annular boss are cut with an edge-cutting die, so that the annular base and the annular boss become similar to a rectangle, so as to obtain a semi-rectangular semi-finished product.

[0029] SIII: The imitation rectangular semi-finished product is subjected to bottom cutting to obtain a single lock base 220; wherein, the single lock base 220 includes an upper boss 2210, a middle bottom platform 2220 and a lower stud 2230 that are sequentially penetrated by a threaded hole 2201; Please see Figure 4 In this embodiment, after obtaining the pseudo-rectangular semi-finished product by cutting, the pseudo-rectangular semi-finished product undergoes bottom cutting processing. That is, the bottom surface of the pseudo-rectangular semi-finished product is cut using a milling die. Specifically, the milling die cuts the annular base away from the annular boss on one side, forming a lower stud 2230 on the side away from the annular boss. The upper boss 2210 is obtained by cutting the edge of the annular boss, and a middle base 2220 is formed between the upper boss 2210 and the lower stud 2230. Specifically, the cutting position of the milling die corresponds to the outer periphery of the threaded hole 2201, so that the threaded hole 2201 can sequentially penetrate the upper boss 2210, the middle base 2220, and the lower stud 2230, thereby forming a single-locking base 220 from the pseudo-rectangular semi-finished product.

[0030] SIV: The sub-board body 210 is slotted and drilled so that the sub-board body 210 is sequentially formed with interconnected mounting grooves 201 and mating holes 202. Please see Figure 4 In this embodiment, after the sub-board body 210 is cut into a single-lock base 220, the sub-board body 210 is slotted and drilled. Specifically, a blind groove is first cut on one side of the sub-board body 210 using a milling machine, and then a through hole is drilled at the bottom of the blind groove using a drilling machine. This forms an installation groove 201 at the position corresponding to the blind groove and a mating hole 202 at the position corresponding to the through hole. By using step-by-step slotting and drilling, the pressure on the sub-board body 210 during the single slotting and drilling process can be reduced, thereby reducing the possibility of the sub-board body 210 breaking due to excessive force.

[0031] SV: Apply glue to the sub-plate body 210 and the single lock base 220 for assembly, so that the middle base 2220 is glued and fits into the mounting groove 201; wherein, the lower stud 2230 passes through the mating hole 202, and the upper boss 2210 protrudes outside the sub-plate body 210. Please see Figure 3 and Figure 4 In this embodiment, after the mounting groove 201 and mating hole 202 are formed on the sub-plate body 210, the sub-plate body 210 and the single lock base 220 are assembled by applying glue. That is, glue is applied to the middle base 2220, and then the middle base 2220 is installed in the mounting groove 201. The lower stud 2230 is aligned with the mating hole 202, and the lower stud 2230 of the single lock base 220 is adjusted so that it passes through the mating hole 202. After the glue cures, the middle base 2220 can be tightly assembled in the mounting groove 201, and the lower stud 2230 can be stably installed in the mating hole 202. In this way, the upper boss 2210 can stably protrude from the outer surface of the sub-plate body 210.

[0032] SVI: Several components 300 are soldered and electrically connected to the sub-board body 210 so that each component 300 is soldered onto the sub-board body 210, resulting in a series-parallel single-locking thin-plate laptop module; wherein, the sub-board body 210 is used to be electrically connected to each battery 110 via a flexible flat cable, and the single-locking base 220 is used to be locked onto the external computer motherboard by a locking screw passing through the threaded hole 2201.

[0033] Please see Figure 2 and Figure 4In this embodiment, after the single-lock base 220 is securely assembled to the sub-board body 210, several components 300 are electrically connected to the sub-board body 210 by welding. One end of the flexible flat cable is welded to the electrode of each battery 110, and the other end of the flexible flat cable is welded to the sub-board body 210. This allows each battery 110 to be electrically connected to the sub-board body 210. Then, the single-lock base 220 is securely locked to the external computer motherboard by passing a locking screw through the threaded hole 2201. This enables a high-strength mechanical connection between the circuit sub-board 200 and the computer body, and reduces the impact of the single-lock base 220 on the structure and electrical function of the circuit sub-board 200 itself.

[0034] It is understandable that by performing center screw hole forming and edge cutting on the annular boss of the single-lock annular semi-finished product, the single-lock annular semi-finished product can be transformed into a pseudo-rectangular semi-finished product. Then, by performing bottom cutting on the pseudo-rectangular semi-finished product, a single-lock base 220 is obtained. By applying glue to the single-lock base 220 and assembling it onto the slotted and drilled sub-board body 210, the center base 2220 of the single-lock base 220 can be tightly assembled into the mounting groove 201 with glue, and the lower stud 2230 can be stably installed in the mating hole 202. Finally, by passing the locking screw through the threaded hole 2201, the single-lock base 220 is securely locked onto the external computer motherboard. This enables a high-strength mechanical connection between the circuit sub-board 200 and the computer body, and reduces the impact of the single-lock base 220 on the structure and electrical function of the circuit sub-board 200 itself.

[0035] In some embodiments, the specific operations of the stamping process are as follows: The aluminum block is flattened and shaped using a stamping die to obtain an irregularly shaped convex disc. In this embodiment, the aluminum block is flattened and shaped by a stamping die, which can flatten the aluminum block into an irregular convex body. The irregular convex body includes an upper boss and a lower bottom platform connected to each other. The upper boss is shaped by a groove on the stamping die, and the lower bottom platform is formed by the aluminum block extending outwards.

[0036] The irregularly shaped convex disc is trimmed along its edges using a cutting tool to obtain a single-lock ring semi-finished product.

[0037] In this embodiment, the irregularly shaped convex disc is trimmed by a cutting tool, that is, the edge of the irregularly shaped convex disc is cut by the cutting tool. In other words, the cutting tool is a ring cutting tool. The upper convex platform is cut by the ring cutting tool to obtain the ring convex platform. The lower bottom platform is cut by the ring cutting tool to obtain the ring bottom platform, thereby obtaining a single-lock ring semi-finished product.

[0038] It is understandable that flattening an aluminum block with a stamping die can quickly form an irregularly shaped convex disc. Then, cutting the edge of the irregularly shaped convex disc with a ring cutter can trim the edge of the irregularly shaped convex disc into an arc shape, thereby enabling the irregularly shaped convex disc to be quickly cut into a single-lock ring semi-finished product.

[0039] In some embodiments, the specific operation of the center screw hole forming process is as follows: The center of the annular boss is punched using a punching die to form a first through hole, so that the annular boss and the annular base are interconnected. In this embodiment, after the single-lock ring semi-finished product is stamped, a punching die is used to punch a hole in the center of the ring boss, so that the ring boss and the ring base can communicate with each other to form a first through hole.

[0040] The first through hole is tapped by a tapping machine to form a threaded hole 2201; wherein the threaded hole 2201 passes through the annular boss and the annular base in sequence.

[0041] In this embodiment, after the first through hole is punched on the single-lock ring semi-finished product, the hole wall of the first through hole is tapped by a tapping machine, so that an internal thread can be formed on the hole wall of the first through hole by the tapping machine, thereby turning the first through hole into a threaded hole 2201.

[0042] It is understandable that after the single-lock ring semi-finished product is stamped, a first through hole is first punched on the single-lock ring semi-finished product, and then an internal thread is formed on the hole wall of the first through hole by a tapping machine, thereby forming a threaded hole 2201 that penetrates the ring boss and the ring base.

[0043] In some embodiments, the drilling and tapping operation specifically includes the following steps: The first through hole is pierced by rotating the tap of the tapping machine to form an internal thread on the hole wall.

[0044] It is understandable that after the first through hole is punched on the single-lock ring semi-finished product, the tap of the tapping machine is used to rotate and pierce the first through hole. That is, by turning the tap, an internal thread is formed on the hole wall of the first through hole. The tap can cooperate with the internal thread and pass through the entire first through hole under the action of turning, so that the first through hole is processed into a threaded hole 2201.

[0045] In some embodiments, the edge cutting process is performed as follows: Laser scribing is performed on the side of the annular boss to create cutting lines on both sides of the threaded hole 2201 on the annular boss. In this embodiment, after the aluminum block is stamped, the annular boss is scribing the hole side with a laser. Two cutting lines can be drawn on the annular boss by the laser. Each cutting line is distributed on one side of the threaded hole 2201, and the two cutting lines are positioned opposite each other. Specifically, the threaded hole 2201 is located between the two cutting lines.

[0046] The single-lock ring semi-finished product is cut along the cutting line to sequentially cut the ring boss and the ring base.

[0047] In this embodiment, after the cutting line is cut on the annular boss, the single-lock annular semi-finished product is cut along the cutting line by the cutter. The opposite two sides of the annular boss and the opposite two sides of the annular base are cut into straight edges in sequence, so that the single-lock annular semi-finished product becomes similar to a rectangle shape, so as to obtain a pseudo-rectangular semi-finished product.

[0048] It is understandable that by cutting a cutting line on the annular boss and cutting the single-lock annular semi-finished product along the cutting line, the edges of the resulting imitation rectangular semi-finished product can be made straighter, which is convenient for subsequent assembly of the single-lock base 220.

[0049] In some embodiments, the bottom cutting process is performed as follows: The bottom surface of the imitation rectangular semi-finished product is milled around a hole using a milling die to form the lower stud 2230.

[0050] It is understandable that after cutting the imitation rectangular semi-finished product, the bottom surface of the imitation rectangular semi-finished product is milled around the hole using a milling die. That is, the milling die is used to mill around the outer periphery of the threaded hole 2201 on the side of the annular bottom platform on the imitation rectangular semi-finished product that is opposite to the annular boss. This can form the lower stud 2230, through which the threaded hole 2201 passes in sequence, including the upper boss 2210, the middle bottom platform 2220, and the lower stud 2230.

[0051] Please see Figure 4 In some embodiments, the specific operations of the grooving and drilling process are as follows: The sub-board body 210 is machined with a blind slotting operation to form an installation slot 201 on the sub-board body 210. A drilling machine is used to drill a hole at the bottom of the blind slot so that a mating hole 202 is formed on the sub-plate body 210 that communicates with the mounting slot 201.

[0052] It is understandable that after the sub-board body 210 is cut into a single-lock base 220, a blind groove is first opened on one side of the sub-board body 210 by a milling machine, and then a through hole is drilled at the bottom of the blind groove by a drilling machine, so that an installation groove 201 is formed at the position corresponding to the blind groove, and a mating hole 202 is formed at the position corresponding to the through hole. The step-by-step grooving and drilling can reduce the pressure on the sub-board body 210 during the single opening of the groove and hole, so as to reduce the occurrence of the sub-board body 210 breaking due to excessive force.

[0053] Please see Figure 4 In some embodiments, the specific operations of the adhesive application assembly process are as follows: The adhesive is applied to the midsole platform 2220 using a dispensing machine, so that an adhesive coating is formed on the side of the midsole platform 2220 that is opposite to the upper boss 2210. The midsole platform 2220 and the mounting groove 201 are assembled so that the midsole platform 2220 is bonded and fixed in the mounting groove 201.

[0054] It is understood that after the mounting groove 201 and mating hole 202 are opened on the sub-plate body 210, glue is applied to the middle base 2220, and then the middle base 2220 is installed in the mounting groove 201. The lower stud 2230 is aligned with the mating hole 202, and the lower stud 2230 of the single lock base 220 is adjusted so that it passes through the mating hole 202. After the glue cures, the middle base 2220 can be tightly bonded and fixed in the mounting groove 201, and the lower stud 2230 can be stably installed in the mating hole 202.

[0055] Typically, because the sub-plate body 210 generates a lot of heat during operation, the adhesive between the midsole platform 2220 and the mounting groove 201 will age during long-term heating. This will cause the midsole platform 2220 to loosen in the mounting groove 201, and reduce the mechanical durability between the midsole platform 2220 and the mounting groove 201.

[0056] Please see Figure 4 To improve the mechanical durability between the midsole platform 2220 and the mounting groove 201, in some embodiments, a protruding fastener 2011 is formed at the bottom of the mounting groove 201, and the protruding fastener 2011 forms a 45-degree angle with the side wall of the mounting groove 201; the midsole platform 2220 has a side latch 2221 on its side, and the side latch 2221 forms a 45-degree angle with one side wall of the midsole platform 2220; the protruding fastener 2011 is embedded in the side latch 2221, and an overflow gap 2202 is formed between the other side wall of the midsole platform 2220 and the corresponding side wall of the mounting groove 201; Before the glue application and assembly process, the following steps are also included: The bottom of the mounting groove 201 is milled with a milling cutter to form a protruding fastener 2011; Grooving is performed on the side wall of the midsole platform 2220 using a cutting tool to obtain the side bayonet 2221; The assembly operation of the base plate 2220 and the mounting slot 201 includes the following steps: The middle base 2220 is accommodated by the mounting slot 201 so that the middle base 2220 fits into the mounting slot 201. The midsole platform 2220 is slid-pushed into the groove so that the protruding fastener 2011 is embedded in the side slot 2221, and an overflow gap 2202 is formed between the other side wall of the midsole platform 2220 and the corresponding side wall of the mounting groove 201.

[0057] It is understandable that, since the protruding fastener 2011 formed at the bottom of the mounting groove 201 is inclined at a 45-degree angle, the midsole platform 2220 can slide within the mounting groove 201 by sliding it within the groove. This allows the protruding fastener 2011 to be embedded in the side slot 2221 on the side of the midsole platform 2220, forming an interlocking structure. This interlocking structure can simultaneously resist lateral shear force and longitudinal tensile force, providing additional restraint after the adhesive ages. Furthermore, an overflow gap 2202 is formed between the other side wall of the midsole platform 2220 and the corresponding side wall of the mounting groove 201, which can be used to accommodate excess adhesive and reduce adhesive waste.

[0058] Typically, during the process of pushing the midsole platform 2220, the adhesive applied to the midsole platform 2220 is easily scraped off during the movement, which leads to a decrease in the amount of adhesive between the midsole platform 2220 and the bottom of the mounting groove 201, ultimately affecting the mechanical stability between the midsole platform 2220 and the mounting groove 201.

[0059] Please see Figure 4 and Figure 5 In order to reduce the smudging of the adhesive on the midsole platform 2220, in some embodiments, the midsole platform 2220 has a honeycomb-shaped receiving groove 2222 on the side opposite to the upper boss 2210. Between the steps of bottom cutting of the imitation rectangular semi-finished product and slotting and drilling of the sub-plate body 210, the following steps are also included: The bottom platform 2220 is subjected to a concave-convex surface treatment on the side opposite to the upper boss 2210 to form a honeycomb-shaped receiving groove 2222.

[0060] It is understood that by performing a concave-convex surface treatment on the side of the midsole 2220 opposite to the upper boss 2210, a honeycomb-shaped receiving groove 2222 can be formed on the side of the midsole 2220 opposite to the upper boss 2210. The honeycomb-shaped receiving groove 2222 can accommodate the glue, thereby reducing the scraping loss of the glue during the movement of the midsole 2220, and improving the mechanical stability between the midsole 2220 and the mounting groove 201.

[0061] Typically, laptop modules with series-parallel single-locking thin boards need to be frequently moved during the production process. Since excess glue is contained in the glue overflow gap 2202, the excess glue is easy to spill out from the glue overflow gap 2202 during the moving process and contaminate the surface of the sub-board body 210. The glue is easy to adhere to the circuit on the surface of the sub-board body 210, reducing the electrical function of the sub-board body 210.

[0062] Please see Figure 6 To reduce adhesive contamination on the surface of the sub-plate body 210, in some embodiments, a flange 2223 is formed around the outer periphery of the bottom platform 2220. The flange 2223 is pressed and fixed to the end face of the mounting groove 201, and the flange 2223 covers the overflow gap 2202. A solder pad 203 is formed on the end face of the mounting groove 201 on the sub-plate body 210, and the solder pad 203 is sealed and welded to the flange 2223. Before applying adhesive to assemble the sub-plate body 210 and the single lock base 220, the following steps are also included: The periphery of the bottom platform 2220 is ground using a milling die to form a flange 2223. Between the in-groove sliding process of the middle base platform 2220 and the welding and electrical connection process of several components 300 and the sub-board body 210, the following steps are also included: The solder pad 203 and the flange 2223 are sealed by welding to press and fix the flange 2223 to the end face of the mounting groove 201. In this embodiment, the solder pad 203 and the flange 2223 are connected by soldering.

[0063] It is understandable that by pressing and fixing the flange 2223 formed around the outer periphery of the base plate 2220 onto the groove end face of the mounting groove 201, the flange 2223 can cover the top of the overflow gap 2202. Furthermore, by sealing and welding the flange 2223 to the groove end face of the mounting groove 201, a tight connection can be formed between the flange 2223 and the groove end face of the mounting groove 201. This can reduce the amount of glue overflowing from the overflow gap 2202, thereby reducing the contamination of the sub-plate body 210 surface by the glue.

[0064] In some embodiments, the specific operations of the welding electrical connection process are as follows: Several components 300 are soldered to the sub-board body 210 by means of a solder pot, so that each component 300 is soldered to the corresponding pad 203 of the sub-board body 210.

[0065] It is understandable that after the single-lock base 220 is securely assembled to the sub-board body 210, several components 300 are soldered to the sub-board body 210 through a solder pot. The solder pot can batch solder several components 300 to the sub-board body 210 at one time, thereby improving the soldering efficiency.

[0066] Please see Figures 1 to 9 This disclosure also provides a laptop computer including a laptop module with a series-parallel single-locking narrow thin plate, which is prepared by the preparation method of the laptop module based on the series-parallel single-locking narrow thin plate in any of the above embodiments. It is understood that by applying the laptop module based on the serial-parallel single-locking thin plate of the present disclosure to a laptop computer, several components 300 are electrically connected to the sub-board body 210 by welding. One end of the flexible flat cable is welded to the electrode of each battery 110, and the other end of the flexible flat cable is welded to the sub-board body 210 by welding. This allows each battery 110 to be electrically connected to the sub-board body 210. Then, the single-locking base 220 is securely locked to the external computer motherboard by a locking screw passing through the threaded hole 2201. This enables a high-strength mechanical connection between the circuit sub-board 200 and the computer body, and reduces the impact of the single-locking base 220 on the structure and electrical function of the circuit sub-board 200 itself.

[0067] Compared with the prior art, this disclosure has at least the following advantages: The above-described method for manufacturing a laptop module based on a series-parallel single-lock thin plate involves shaping the annular boss of the single-lock annular semi-finished product with a central screw hole and cutting the edges to transform it into a pseudo-rectangular semi-finished product. Then, the pseudo-rectangular semi-finished product is bottom-cut to obtain a single-lock base 220. The single-lock base 220 is then glued to the slotted and drilled sub-board body 210, allowing the central base 2220 of the single-lock base 220 to be tightly fitted into the mounting groove 201. The lower stud 2230 is stably installed in the mating hole 202. Finally, a locking screw passes through the threaded hole 2201 to securely lock the single-lock base 220 onto the external computer motherboard. This enables a high-strength mechanical connection between the circuit sub-board 200 and the computer body, and reduces the impact of the single-lock base 220 on the structure and electrical function of the circuit sub-board 200.

[0068] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate, characterized in that, The laptop module with serial-parallel single-locking narrow and thin boards includes: Mounting frame for mounting at least two batteries; A circuit board, comprising a board body and a single-lock base, wherein the mounting frame and the single-lock base are both mounted on the board body; and, Several components are provided, each of which is soldered onto the circuit board and is electrically connected to each of the batteries via the circuit board. The method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate includes the following steps: An aluminum block is stamped to obtain a single-lock ring semi-finished product; wherein the single-lock ring semi-finished product includes a ring boss and a ring base connected to each other. The annular boss is subjected to a central screw hole forming process, and the single-lock annular semi-finished product is subjected to edge cutting process to obtain a pseudo-rectangular semi-finished product. The imitation rectangular semi-finished product is subjected to bottom cutting to obtain the single lock base; wherein, the single lock base includes an upper boss, a middle bottom platform and a lower stud that are sequentially penetrated by threaded holes; The sub-board body is slotted and drilled to form interconnected mounting grooves and mating holes in sequence on the sub-board body; The sub-plate body and the single-lock base are glued together to make the middle base plate glued and fit into the mounting groove; wherein, the lower stud passes through the mating hole, and the upper boss protrudes from the outside of the sub-plate body; Several of the aforementioned components are electrically connected to the sub-board body through soldering, so that each of the aforementioned components is soldered onto the sub-board body, thereby obtaining the series-parallel single-locking thin-plate laptop module; wherein, the sub-board body is used to electrically connect to each of the aforementioned batteries via a flexible flat cable, and the single-locking base is used to lock onto the external computer motherboard via a locking screw passing through the threaded hole.

2. The method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate according to claim 1, characterized in that, The specific operations of the stamping process are as follows: The aluminum block is flattened and shaped using a stamping die to obtain an irregularly shaped convex disc. The irregularly shaped convex disc is trimmed along its edges using a cutting tool to obtain the single-lock ring semi-finished product.

3. The method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate according to claim 1, characterized in that, The specific steps for forming the central screw hole are as follows: The center of the annular boss is punched using a punching die to make the annular boss and the annular base interconnect to form a first through hole. The first through hole is tapped by a tapping machine to form a threaded hole; wherein the threaded hole passes through the annular boss and the annular base in sequence.

4. The method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate according to claim 3, characterized in that, The drilling and tapping operation specifically includes the following steps: The first through hole is pierced by rotating the tap of the tapping machine to form an internal thread on the hole wall.

5. The method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate according to claim 1, characterized in that, The specific operations for the edge cutting process are as follows: Laser scribing is performed on the annular boss to create cutting lines on both sides of the threaded hole. The single-lock ring semi-finished product is cut along the cutting line to sequentially cut the ring boss and the ring base.

6. The method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate according to claim 1, characterized in that, The specific operations for the bottom cutting process are as follows: The bottom surface of the imitation rectangular semi-finished product is milled around a hole using a milling die to form the lower stud.

7. The method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate according to claim 1, characterized in that, The specific steps for the grooving and drilling process are as follows: The sub-board body is machined with a blind groove machine to form an mounting groove on the sub-board body. A drilling machine is used to drill a hole in the bottom of the blind groove so that a mating hole is formed on the sub-plate body that communicates with the mounting groove.

8. The method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate according to claim 1, characterized in that, The specific steps for the adhesive application and assembly process are as follows: The adhesive is applied to the insole using a dispensing machine to form an adhesive coating on the side of the insole that is away from the upper boss. The midsole platform is assembled with the mounting groove so that the midsole platform is bonded and fixed in the mounting groove.

9. The method for fabricating a laptop module based on a series-parallel single-lock narrow thin plate according to claim 1, characterized in that, The specific operation of the welding electric connection process is as follows: The components are soldered to the sub-board body using a solder bath, so that each component is soldered to the corresponding pad on the sub-board body.

10. A laptop computer, characterized in that, The laptop module includes a series-parallel single-lock narrow thin plate, which is prepared by the preparation method of the laptop module based on the series-parallel single-lock narrow thin plate as described in any one of claims 1 to 9.

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