An end cap type tantalum capacitor packaging process and an end cap type tantalum capacitor

Abstract

This invention discloses a cap-type tantalum capacitor packaging process and the cap-type tantalum capacitor itself. The packaging process includes the following steps: S1: tantalum core bonding; S2: moisture-proof treatment; S3: encapsulation; S4: overflow treatment; S5: cathode lead-out; S6: anode lead-out; S7: end treatment. The tantalum capacitor is manufactured using the cap-type tantalum capacitor packaging process. The tantalum capacitor has a dual-core parallel structure, including two tantalum cores with tantalum wires inserted inside. A bonding silver paste is placed between the two tantalum cores. An anode lead-out is located at the top of each tantalum core, and a cathode lead-out is located at the bottom. Resin is placed between the two tantalum cores and the anode lead-out. A graphite layer is placed on the bottom and four sides of each tantalum core. This invention uses vibration-induced silver paste impregnation instead of traditional manual coating and bonding. Vibration ensures the silver paste fully fills the gaps between the two cores, completely eliminating defects such as pits and bubbles caused by manual operation, resulting in a smooth and flawless outer surface of the dual cores. This invention solves the problem of bulging and cracking of the encapsulation layer by constructing a pre-existing moisture barrier.

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