Water guide laser deep hole active slagging method and device based on pulse modulation water pressure

Abstract

This application discloses a method and apparatus for active slag removal in water-guided laser deep hole machining based on pulse-modulated water pressure, relating to the field of water-guided laser machining technology. It includes: setting a base pressure for water-guided laser deep hole machining; applying a periodic modulation signal to a high-pressure water supply system based on the set base pressure, causing the water jet output pressure to periodically pulsate near the base pressure with an initial pulse frequency and modulation amplitude, thereby creating a pumping force for slag removal within the machined hole; during the water-guided laser deep hole machining process, utilizing the high-pressure scouring and low-pressure backflow pumping effect generated by the water jet output pressure to remove accumulated water and molten slag from the bottom of the machined hole; acquiring the current machining depth in real time, and adjusting the pulse frequency of the periodic modulation signal based on a preset mapping relationship between the machining depth and the pulse frequency, so that the pumping effect matches the current hole depth. This solves the problems of existing slag removal methods, such as complex hardware, poor depth adaptability, and limited deep hole machining effects.

Description

Technical Field

[0001] This application relates to the field of water-guided laser processing technology, and in particular to a water-guided laser deep hole active slag removal method and device based on pulse-modulated water pressure. Background Technology

[0002] Water-guided laser processing couples a laser into a high-pressure fine water jet, utilizing the total reflection effect of the laser at the water-air interface to achieve long-distance transmission. It can cool the workpiece while removing molten slag, and has the advantages of high precision and low thermal damage. It is widely used in drilling and precision cutting.

[0003] In machining holes with a large depth-to-diameter ratio, the narrow channel restricts the flow of water and slag, making it difficult to remove. This disrupts the laminar flow of the water jet and the conditions for total laser reflection, leading to decreased machining efficiency and reduced precision. Existing slag removal methods rely on gravity, negative pressure, or external air blowing, which are passive slag removal approaches.

[0004] However, the slag removal driving force of the existing slag removal method decreases rapidly with the increase of hole depth, making it difficult to act on the bottom of the hole. In addition, it requires the addition of hardware such as air passage and negative pressure, making the system complex, the modification cost high, and the deep hole processing effect limited. Summary of the Invention

[0005] In order to overcome the above-mentioned defects of the prior art, this application provides a water-guided laser deep hole active slag removal method based on pulse-modulated water pressure to solve the problems existing in the background art.

[0006] This application provides a method for active slag removal in water-guided laser deep hole machining based on pulse-modulated water pressure, comprising: setting a base pressure for water-guided laser deep hole machining; applying a periodic modulation signal to a high-pressure water supply system based on the set base pressure, causing the water jet output pressure to periodically pulsate near the base pressure with an initial pulse frequency and modulation amplitude, thereby forming a pumping slag removal driving force within the machined hole; during the water-guided laser deep hole machining process, utilizing the pumping effect of high-pressure scouring and low-pressure back suction generated by the water jet output pressure to remove accumulated water and molten slag from the bottom of the machined hole; acquiring the current machining depth in real time, and adjusting the pulse frequency of the periodic modulation signal based on a preset mapping relationship between the machining depth and the pulse frequency, so that the pumping effect matches the current depth of the machined hole.

[0007] In one possible implementation, the pump suction and slag discharge driving force is quantitatively characterized by the pump suction pressure difference, and the expression for the pump suction and slag discharge driving force is: ;in, The pressure difference between the high-pressure scouring generated by the water jet inside the hole and the low-pressure backflow is the pressure difference between the two. For modulation amplitude, The base pressure is used as the base pressure. The pressure difference between the high-pressure flushing and low-pressure back suction generated by the water jet in the hole is compared with the preset minimum slag discharge pressure difference. When the pressure difference is less than the preset minimum slag discharge pressure difference, it is determined that the slag discharge capacity is insufficient and the modulation amplitude is increased. When the pressure difference is greater than or equal to the minimum slag discharge pressure difference, it is determined that the slag discharge capacity is sufficient and the current modulation amplitude remains unchanged.

[0008] In one possible implementation, based on the characteristic that the inertia of the fluid inside the hole increases with depth, a preset mapping relationship between the machining depth and the pulse frequency is established: ;in, The pulse frequency, The slag discharge dynamic coefficient is related to pore size and fluid properties. For processing depth, This is the orifice effect compensation constant.

[0009] In one possible implementation, the modulation amplitude is 5% to 15% of the base voltage, and the expression for the modulation amplitude is: ;in, For modulation amplitude, This is the base pressure.

[0010] In one possible implementation, the waveform of the periodic modulation signal is a sine wave, a square wave, or a sawtooth wave; using a sine wave can reduce water jet disturbance; using a square wave can increase instantaneous impact force.

[0011] In one possible implementation, when the waveform of the periodic modulation signal is a square wave, the duty cycle is 40% to 60%.

[0012] In one possible implementation, before applying a periodic modulation signal to the high-pressure water supply system, the method further includes: controlling the high-pressure water supply system to operate at a constant base pressure and collecting the backscattered light intensity signal of the water jet; obtaining the fluctuation standard deviation of the backscattered light intensity signal and determining whether the fluctuation standard deviation is less than a preset threshold; if the fluctuation standard deviation is greater than or equal to the preset threshold, determining that the coupling is unstable, and continuing to operate at a constant base pressure until the coupling is stable; if the fluctuation standard deviation is less than the preset threshold, determining that the coupling is stable, and at this time applying a periodic modulation signal to the high-pressure water supply system.

[0013] In one possible implementation, a closed-loop monitoring step for slag discharge status is also included; the closed-loop monitoring step for slag discharge status includes: real-time monitoring of slag discharge status through an acoustic emission sensor or an orifice flow sensor; when slag discharge is detected to be obstructed, the modulation amplitude is increased based on the expression of the pump suction slag discharge driving force to enhance the pump suction slag discharge capability.

[0014] In one possible implementation, a processing completion judgment step is also included. The processing completion judgment step includes: real-time monitoring of the processing depth and the orifice return water flow during the processing, and determining that the processing is completed when any of the following conditions are met: the current processing depth reaches the preset target depth; the orifice return water flow shows an instantaneous change indicating that the workpiece has been penetrated, and the flow change amplitude exceeds the preset flow threshold; when processing is determined to be completed, the laser output is stopped and the high-pressure water supply system is turned off.

[0015] This application also provides a water-guided laser deep hole active slag removal device based on pulse-modulated water pressure, comprising: a setting module for setting the base pressure for water-guided laser deep hole processing; a driving force generation module for applying a periodic modulation signal to a high-pressure water supply system based on the set base pressure, so that the water jet output pressure periodically pulsates near the base pressure with an initial pulse frequency and modulation amplitude, thereby forming a pump suction slag removal driving force in the processed hole; a slag removal module for using the high-pressure scouring and low-pressure back suction pumping effect generated by the water jet output pressure to remove the accumulated water and molten slag at the bottom of the processed hole during the water-guided laser deep hole processing; and an adjustment module for acquiring the current processing depth in real time and adjusting the pulse frequency of the periodic modulation signal based on a preset mapping relationship between the processing depth and the pulse frequency, so that the pumping effect matches the current hole depth.

[0016] The beneficial effects of this application are as follows: By applying periodic water pressure pulses on a constant base pressure, this application directly forms a pumping effect of high-pressure flushing and low-pressure back suction within the machined hole. The slag removal driving force can directly act on the bottom of the hole and no longer rapidly decreases with increasing hole depth, significantly improving the slag removal capacity and stability during the machining of holes with large depth-to-diameter ratios. At the same time, this method achieves active slag removal only by software-modulating water pressure, without the need for additional hardware such as air circuits and negative pressure devices. The system structure is simple and the modification cost is low, effectively solving the problems of complex hardware, poor depth adaptability, and limited deep hole machining effect of existing slag removal methods. Attached Figure Description

[0017] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 The flowchart illustrates a water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure, provided in this application embodiment.

[0019] Figure 2 This is a schematic diagram of a water-guided laser deep-hole active slag removal device based on pulse-modulated water pressure, provided as an embodiment of this application.

[0020] Figure 3 This is a schematic diagram of a water-guided laser deep-hole active slag removal server based on pulse-modulated water pressure, provided as an embodiment of this application. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0022] This application provides a water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure, such as... Figure 1 As shown, the method includes steps S101 to S104. Wherein, Figure 1 This is merely one execution order shown in the embodiments of this application, and does not represent the only execution order of a water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure. Where the final result can be achieved, Figure 1 The steps shown can be performed in parallel or in reverse order.

[0023] S101: Set the base pressure for water-guided laser deep hole machining.

[0024] Specifically, the base pressure setting must simultaneously meet the requirements of stable water jet transmission and workpiece material removal. Its value is determined based on the material of the workpiece, the aperture specification, and the water jet transmission requirements. For example, the base pressure for processing carbon fiber composite materials can be 30MPa, and the base pressure for processing high-temperature alloys can be 40MPa.

[0025] S102: Based on the set base pressure, a periodic modulation signal is applied to the high-pressure water supply system, so that the water jet output pressure pulsates periodically near the base pressure with the initial pulse frequency and modulation amplitude, so as to form a pump suction and slag discharge driving force in the machining hole.

[0026] Specifically, the area near the base pressure is defined as the pressure fluctuation range within... Within the interval. Among them, For modulation amplitude, This is the base pressure.

[0027] Before applying periodic modulation signals to the high-pressure water supply system, the following steps are also included.

[0028] The high-pressure water supply system is controlled to operate at a constant base pressure, and the backscattered light intensity signal of the water jet is collected.

[0029] Obtain the standard deviation of the backscattered light intensity signal and determine whether the standard deviation of the fluctuation is less than a preset threshold.

[0030] If the standard deviation of the fluctuation is greater than or equal to the preset threshold, the coupling is determined to be unstable, and the operation continues at a constant base pressure until the coupling is stable.

[0031] If the standard deviation of the fluctuation is less than the preset threshold, the coupling is determined to be stable, and a periodic modulation signal is then applied to the high-pressure water supply system.

[0032] Specifically, the backscattered light intensity signal at the end of the water jet is acquired using a photoelectric sensor installed near the coupling cavity. This signal is then used for continuously acquired data. One light intensity sampling point ( ), calculate the standard deviation of the backscattered light intensity signal fluctuation: .in, The standard deviation of the backscattered light intensity signal is given. For the first The instantaneous light intensity value at each light intensity sampling point. for The average light intensity of each light intensity sampling point This represents the total number of light intensity sampling points.

[0033] Specifically, the preset threshold can be: .in, This is a preset threshold. When This indicates that the water jet surface is smooth, the total reflection interface is stable, and the laser coupling state is good. Applying a periodic modulation signal to the high-pressure water supply system effectively avoids the introduction of pulse disturbances that could lead to initial processing failure when the coupling is not stable.

[0034] The driving force for pump suction and slag discharge is quantitatively characterized by the pump suction pressure difference, and the expression for the driving force for pump suction and slag discharge is: .in, The pressure difference between the high-pressure scouring generated by the water jet inside the hole and the low-pressure backflow is the pressure difference between the two. For modulation amplitude, This is the base pressure.

[0035] Specifically, in this application, the pressure during the high-pressure scouring stage is... The pressure in this application during the low-pressure back-suction stage is... .

[0036] Specifically, the derivation process of the expression for the pump suction and slag discharge driving force is as follows: .in, This represents the high pressure value during the periodic pulsation of the water jet. This represents the low-pressure value of the periodic pulsation of the water jet.

[0037] The pressure difference between the high-pressure flushing and low-pressure back suction generated by the water jet in the hole is compared with the preset minimum slag discharge pressure difference.

[0038] Specifically, the preset minimum slag discharge pressure difference must meet the following requirements: in, The preset minimum slag discharge pressure difference, The yield shear stress of the molten slag. The diameter of the machined hole, The machining depth is the depth of the machined hole.

[0039] Furthermore, substitute in typical processing parameters ( , , The preset minimum slag discharge pressure difference can be calculated. It needs to be greater than 8MPa.

[0040] When the pressure difference is less than the preset minimum slag discharge pressure difference, it is determined that the slag discharge capacity is insufficient, and the modulation amplitude is increased.

[0041] When the pressure difference is greater than or equal to the minimum slag discharge pressure difference, the slag discharge capacity is determined to be sufficient, and the current modulation range is kept unchanged.

[0042] The modulation amplitude is 5% to 15% of the base voltage, and the expression for the modulation amplitude is: .in, For modulation amplitude, This is the base pressure.

[0043] Specifically, the lower limit of the modulation amplitude is determined as follows: to ensure that the pump suction pressure difference can reliably overcome the resistance of slag accumulation at the bottom of the hole and to avoid slag discharge failure due to fluctuations in operating conditions, a safety margin is reserved based on the theoretical calculation value. When the base pressure is taken as 30MPa, .in, This is the lower limit of the modulation amplitude.

[0044] Furthermore, the upper limit of the modulation amplitude is determined based on the following: according to fluid stability theory, the critical pressure fluctuation amplitude for maintaining laminar flow in a water jet is approximately 15% to 20% of the base pressure. To ensure processing margin, this application sets the upper limit of the modulation amplitude at 15%, i.e. Within this range, the water jet can maintain a stable laminar flow state, and the conditions for total internal reflection of the laser transmission are not disrupted.

[0045] The waveform of a periodically modulated signal is a sine wave, a square wave, or a sawtooth wave.

[0046] Using a sine wave can reduce water jet disturbance. Using a square wave can increase instantaneous impact force.

[0047] When the waveform of the periodic modulation signal is a square wave, the duty cycle is 40% to 60%.

[0048] Specifically, sinusoidal waves exhibit gentle pressure changes, minimizing instantaneous disturbances to the water jet. This effectively reduces water jet disturbance and ensures water jet stability, making them suitable for precision machining, thin-walled part machining, or applications with strict requirements for the heat-affected zone. Square waves have steep pressure rise and fall edges, generating instantaneous high-pressure impacts and rapid pressure release. This significantly enhances instantaneous impact force and improves slag removal capabilities, making them suitable for rough machining, machining of high-viscosity molten slag materials (such as high-temperature alloys), and deep blind hole machining. Sawtooth waves combine a certain degree of impact with gentle backflow, allowing for enhanced flushing or backflow processes depending on the sawtooth direction (fast rise and slow fall or slow rise and fast fall). This makes them suitable for machining applications with specific process requirements.

[0049] Furthermore, when a square wave is used as the modulation signal, the duty cycle ranges from 40% to 60%. The design is based on the following: according to the momentum theorem, the impulse generated during the high-pressure stage must be greater than the critical impulse required for slag stripping; simultaneously, the duration of the low-pressure stage must ensure that the stripped debris and accumulated water can be fully discharged from the orifice. Under typical operating conditions, the duty cycle range satisfying these conditions is 40% to 60%, with an optimal value of approximately 50%.

[0050] S103: In the process of water-guided laser deep hole machining, the high-pressure flushing and low-pressure back suction generated by the water jet output pressure are used to remove the accumulated water and slag at the bottom of the machined hole.

[0051] Specifically, in the process of water-guided laser deep hole machining, the periodically pulsating water jet will form a periodic high-pressure scouring and low-pressure back suction effect inside the machining hole, thereby generating a pumping effect. Driven by this pumping effect, the water and slag at the bottom of the machining hole are actively transported upward and smoothly discharged through the hole opening, avoiding the disruption of the laminar flow state of the water jet and the laser total reflection transmission conditions due to water blockage and slag accumulation inside the hole, thus ensuring the stable and efficient operation of the machining process.

[0052] S104: Real-time acquisition of the current machining depth, and based on the preset mapping relationship between machining depth and pulse frequency, adjustment of the pulse frequency of the periodic modulation signal to match the pumping effect with the depth of the current machined hole.

[0053] Specifically, the fluid inside a deep hole can be considered a one-dimensional variable-mass damped system. As the machining depth increases, the mass of the fluid participating in the oscillation inside the hole increases, the fluid inertial time constant increases accordingly, and the water flow response slows down. To avoid response saturation due to fluid inertia and to ensure that the pulsed water pressure can complete a full flushing-suction cycle, so that the pumping effect dynamically adapts to the hole depth, the pulse frequency needs to decrease as the hole depth increases.

[0054] Based on the characteristic that the inertia of the fluid inside the hole increases with depth, a preset mapping relationship between machining depth and pulse frequency is established: .in, The pulse frequency, The slag discharge dynamic coefficient is related to pore size and fluid properties. For processing depth, This is the orifice effect compensation constant.

[0055] Specifically, the slag discharge dynamic coefficient related to pore size and fluid properties The value is 45 mm·Hz, which is the orifice effect compensation constant. The value is 1.5mm.

[0056] This application also includes a closed-loop monitoring step for slag discharge status. The closed-loop monitoring step for slag discharge status includes the following:

[0057] The slag discharge status is monitored in real time using acoustic emission sensors or orifice flow sensors.

[0058] When poor slag discharge is detected, the modulation amplitude is increased based on the expression of the pump suction slag discharge driving force to enhance the pump suction slag discharge capability.

[0059] Specifically, the acoustic emission sensor can collect the processing acoustic signal. When the slag discharge is smooth, the main frequency of the acoustic signal is concentrated in the low frequency range of 5 to 10 kHz. When the water in the hole is blocked and the slag discharge is not smooth, the energy of the high frequency component greater than 20 kHz will increase significantly. The orifice flow sensor can identify the blockage state by the sudden change in the return water flow.

[0060] This application also includes a step for determining whether processing is complete.

[0061] The steps for determining whether processing is complete include the following.

[0062] During the processing, the processing depth and the return water flow rate at the orifice are monitored in real time. The processing is considered complete when any of the following conditions are met.

[0063] 1. The current processing depth has reached the preset target depth.

[0064] 2. The return water flow at the orifice shows a sudden change indicating that the workpiece has been penetrated, and the magnitude of the change in flow exceeds the preset flow threshold.

[0065] When the processing is deemed complete, the laser output is stopped and the high-pressure water supply system is shut off.

[0066] For example, when the Z-axis grating ruler shows that the processing depth has reached the preset target depth of 15mm, the orifice flow sensor detects that the return water flow rate suddenly increases from 2.1mL / s to 2.8mL / s within 0.1 seconds, with a flow rate change of 33%, exceeding the preset flow rate threshold (20%), and the processing is determined to be complete.

[0067] Furthermore, in the constant water pressure mode, slag removal relies solely on the initial momentum diffusion of the water jet, and its slag removal efficiency decreases rapidly with a quadratic relationship as the processing depth increases. However, in the pulsed water pressure mode of this application, the pressure difference... As an active driving force acting independently at the bottom of the hole, the slag removal efficiency decreases slowly only with the processing depth.

[0068] This application also provides a water-guided laser deep-hole active slag removal device 200 based on pulse-modulated water pressure, such as... Figure 2 As shown, the device includes: a setting module 201, a driving force generating module 202, a slag discharge module 203, and an adjustment module 204.

[0069] The setting module 201 is used to set the base pressure for water-guided laser deep hole machining.

[0070] The driving force module 202 is used to apply a periodic modulation signal to the high-pressure water supply system based on the set base pressure, so that the water jet output pressure pulsates periodically near the base pressure with an initial pulse frequency and modulation amplitude, so as to form a pump suction and slag discharge driving force in the machining hole.

[0071] The slag removal module 203 is used in the process of water-guided laser deep hole machining to remove the accumulated water and molten slag at the bottom of the machined hole by utilizing the high pressure flushing and low pressure back suction effect generated by the output pressure of the water jet.

[0072] The adjustment module 204 is used to obtain the current processing depth in real time, and adjust the pulse frequency of the periodic modulation signal based on the preset mapping relationship between processing depth and pulse frequency, so that the pumping effect matches the current processing hole depth.

[0073] Some modules in the apparatus described in this application can be described in the general context of computer-executable instructions that are executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, classes, etc., that perform a specific task or implement a specific abstract data type. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0074] The apparatus or module described in the above embodiments can be implemented by a computer chip or physical entity, or by a product with a certain function. For ease of description, the above apparatus is described by dividing it into various modules according to their functions. When implementing the embodiments of this application, the functions of each module can be implemented in one or more software and / or hardware. Of course, a module that implements a certain function can also be implemented by combining multiple sub-modules or sub-units.

[0075] like Figure 3As shown in the figure, this application embodiment also provides a water-guided laser deep hole active slag removal server based on pulse-modulated water pressure, including a memory 301 and a processor 302; the memory 301 is used to store computer-executable instructions; the processor 302 is used to execute computer-executable instructions to realize the water-guided laser deep hole active slag removal method based on pulse-modulated water pressure described above in this application embodiment.

[0076] This application also provides a computer-readable storage medium storing executable instructions. When a computer executes the executable instructions, it can implement the above-described water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure as described in this application.

[0077] The above embodiments are only for illustrating the technical concept and features of this application. Their purpose is to enable those skilled in the art to understand the content of this application and implement it. They should not be used to limit the scope of protection of this application. All equivalent changes or modifications made in accordance with the spirit and essence of this application should be covered within the scope of protection of this application.

Claims

1. A water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure, characterized in that, include: Set the base pressure for water-guided laser deep hole machining; Based on the set base pressure, a periodic modulation signal is applied to the high-pressure water supply system, causing the water jet output pressure to pulsate periodically near the base pressure with the initial pulse frequency and modulation amplitude, so as to form a pump suction and slag discharge driving force in the machining hole. In the process of water-guided laser deep hole machining, the high-pressure flushing and low-pressure back suction generated by the output pressure of the water jet are used to remove the accumulated water and slag at the bottom of the machined hole. The current machining depth is acquired in real time, and the pulse frequency of the periodic modulation signal is adjusted based on the preset mapping relationship between machining depth and pulse frequency to match the pumping effect with the current machining hole depth.

2. The water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure according to claim 1, characterized in that, The driving force for pump suction and slag discharge is quantitatively characterized by the pump suction pressure difference, and the expression for the driving force for pump suction and slag discharge is: ;in, The pressure difference between the high-pressure scouring generated by the water jet inside the hole and the low-pressure backflow is the pressure difference between the two. For modulation amplitude, Base pressure; The pressure difference between the high-pressure flushing and low-pressure back suction generated by the water jet in the hole is compared with the preset minimum slag discharge pressure difference. When the pressure difference is less than the preset minimum slag discharge pressure difference, it is determined that the slag discharge capacity is insufficient, and the modulation amplitude is increased. When the pressure difference is greater than or equal to the minimum slag discharge pressure difference, the slag discharge capacity is determined to be sufficient, and the current modulation range is kept unchanged.

3. The water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure according to claim 1, characterized in that, Based on the characteristic that the inertia of the fluid inside the hole increases with depth, a preset mapping relationship between machining depth and pulse frequency is established: ;in, The pulse frequency, The slag discharge dynamic coefficient is related to pore size and fluid properties. For processing depth, This is the orifice effect compensation constant.

4. The water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure according to claim 1, characterized in that, The modulation amplitude is 5% to 15% of the base voltage, and the expression for the modulation amplitude is: ;in, For modulation amplitude, This is the base pressure.

5. The water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure according to claim 1, characterized in that, The waveform of the periodic modulation signal is a sine wave, a square wave, or a sawtooth wave; Using a sine wave can reduce water jet disturbance; Using a square wave can increase the instantaneous impact force.

6. The water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure according to claim 1, characterized in that, When the waveform of the periodic modulation signal is a square wave, the duty cycle is 40% to 60%.

7. The water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure according to claim 1, characterized in that, Before applying periodic modulation signals to the high-pressure water supply system, the following steps are also included: Control the high-pressure water supply system to operate at a constant base pressure and collect the backscattered light intensity signal of the water jet; Obtain the standard deviation of the backscattered light intensity signal and determine whether the standard deviation of the fluctuation is less than a preset threshold. If the standard deviation of the fluctuation is greater than or equal to the preset threshold, the coupling is determined to be unstable, and the operation continues at a constant base pressure until the coupling is stable. If the standard deviation of the fluctuation is less than the preset threshold, the coupling is determined to be stable, and a periodic modulation signal is then applied to the high-pressure water supply system.

8. The water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure according to claim 2, characterized in that, It also includes a closed-loop monitoring step for slag discharge status; The closed-loop monitoring steps for slag discharge status include: The slag discharge status is monitored in real time using acoustic emission sensors or orifice flow sensors. When poor slag discharge is detected, the modulation amplitude is increased based on the expression of the pump suction slag discharge driving force to enhance the pump suction slag discharge capability.

9. The water-guided laser deep-hole active slag removal method based on pulse-modulated water pressure according to claim 1, characterized in that, It also includes a step for determining whether processing is complete; The steps for determining whether processing is complete include: During the processing, the processing depth and the return water flow rate at the orifice are monitored in real time. The processing is considered complete when any of the following conditions are met. The current processing depth has reached the preset target depth; The return water flow rate at the orifice shows a sudden change indicating that the workpiece has been penetrated, and the magnitude of the change in flow rate exceeds the preset flow rate threshold. When the processing is deemed complete, the laser output is stopped and the high-pressure water supply system is shut off.

10. A water-guided laser deep-hole active slag removal device based on pulse-modulated water pressure, characterized in that, The device performs the method as described in any one of claims 1 to 9, including: The setting module is used to set the base pressure for water-guided laser deep hole machining; A driving force module is formed to apply a periodic modulation signal to the high-pressure water supply system based on the set base pressure, so that the water jet output pressure pulsates periodically near the base pressure with an initial pulse frequency and modulation amplitude, so as to form a pump suction and slag discharge driving force in the machining hole. The slag removal module is used in the process of water-guided laser deep hole machining to remove the accumulated water and molten slag at the bottom of the machined hole by utilizing the high pressure flushing and low pressure back suction effect generated by the output pressure of the water jet. The adjustment module is used to obtain the current machining depth in real time and adjust the pulse frequency of the periodic modulation signal based on the preset mapping relationship between machining depth and pulse frequency, so that the pumping effect matches the depth of the current machined hole.

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