A thin film having a multi-level microstructure surface and a preparation method and application thereof

By constructing multi-level microstructures on the surface of thin films through a stretching flow curing process, the problems of complex construction and difficulty in large-scale fabrication of existing thin film microstructures are solved, realizing efficient and simple thin film fabrication, which is suitable for fields such as flexible sensors.

CN122282159APending Publication Date: 2026-06-26CHENGDU UNIV OF INFORMATION TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHENGDU UNIV OF INFORMATION TECH
Filing Date
2026-03-23
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing methods for constructing thin film microstructures suffer from problems such as complex processes, high costs, environmental unfriendliness, and difficulty in large-scale fabrication, and lack efficient and simple solutions.

Method used

The process employs a stretch flow curing technique to prepare a composite conductive material slurry and then use a pull-up template to form a multi-level microstructure on the slurry. This is combined with photocuring or thermal curing for fixation, ultimately forming a multi-level microstructure surface film.

Benefits of technology

It simplifies the process flow, reduces equipment complexity and operational difficulty, improves preparation efficiency, is suitable for rapid prototype verification and small-batch production, has good repeatability and consistency, and is applicable to fields such as flexible sensors.

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Abstract

This invention discloses a thin film with a multi-level microstructure surface, its preparation method, and its applications, belonging to the field of thin film microstructure construction technology. This invention is the first to apply the dynamic behavior of fluids during stretching motion to the construction of multi-level microstructures on a thin film surface. Compared to traditional microfabrication techniques, the stretch flow curing method's most significant advantage lies in its extremely simplified process flow and high flexibility. The entire preparation process includes only two key stages—stretch flow molding and curing—significantly reducing equipment complexity and operational difficulty. The stretch flow curing method not only provides a novel, efficient, and low-cost solution for surface microstructure fabrication but also demonstrates broad application potential in functional thin films, flexible electronics, optical coatings, biointerfaces, and microfluidic devices.
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