Component packaging and soldering system and method

Abstract

This invention discloses a component packaging and welding system and method. The system includes a first acquisition module that collects optical data of the welding area; a second acquisition module that collects gas data of the welding area; a third acquisition module that collects negative pressure stress data at each preset solder joint within the welding area; a data processing module that is communicatively connected to the first, second, and third acquisition modules, and is configured to preprocess the optical and gas data to obtain a first mapping between the two, and is also configured to preprocess the gas data to obtain a second mapping between the two; a signal generation module that is configured to determine the state parameters of a solder joint and its adjacent solder joints in the welding area based on the first and second mappings, and generate a control signal based on the state parameters; and an execution module that executes the control signal to adjust the gas output parameters so that the state parameters of each solder joint reach the target value.

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