Photosensitive resin composition and preparation method thereof

By employing a rigid-flexible synergistic design of polyimide and polyurethane acrylate and a specific process flow, an interpenetrating polymer network is formed, resolving the contradiction between flexibility and heat resistance in photosensitive resin compositions, making them suitable for high-end electronic devices.

CN122331206APending Publication Date: 2026-07-03YANCHENG AIKEN TECH CO LTD
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Patent Information

Application Number
CN202610540037.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-04-22
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

Existing photosensitive resin compositions present a contradiction between mechanical properties and thermal stability, making it difficult to balance flexibility and heat resistance, thus failing to meet the application requirements of high-end electronic devices.

Method used

The design employs a rigid-flexible synergistic approach of polyimide and polyurethane acrylate, combined with epoxy resin to enhance interfacial adhesion. Through a process involving high-temperature dissolution, medium-temperature mixing, fineness control, and segmented curing, an interpenetrating polymer network structure is formed.

Benefits of technology

Without sacrificing photosensitivity and flame retardancy, it achieves simultaneous improvement in mechanical flexibility and thermal stability, making it suitable for flexible circuit boards and foldable display devices.

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Abstract

The invention discloses a photosensitive resin composition and a preparation method thereof, and particularly relates to the technical field of electronic chemicals. The composition is composed of photosensitive resin, a photoinitiator, a filler, a flame retardant and an auxiliary agent aiming at the problem that the traditional photosensitive resin is difficult to consider both bending performance and heat resistance at the same time. The core is that polyimide and urethane acrylate are used for rigid-flexible collaborative design, and epoxy resin is combined to enhance the interface adhesion. During preparation, the technological processes of high-temperature dissolution, medium-temperature mixing, fineness control and segmented curing are adopted. Tests show that the adhesive force of the prepared resin composition reaches 5B level, the flame retardant rating is V-0, the thermal deformation temperature reaches up to 185 DEG C, and the bending resistance is more than 10000 times. According to the invention, on the premise of not sacrificing the photosensitive sensitivity, the mechanical flexibility and the thermal stability are synchronously improved, and the method has remarkable advancement and is particularly suitable for the fields of flexible electronics and high-end packaging.
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