Transparent conductive circuit, touch module, display screen, antenna module and electronic device

Abstract

A transparent conductive circuit, a touch module, a display screen, an antenna module, and an electronic device are disclosed. The transparent conductive circuit includes a transparent substrate and a grid. The transparent substrate supports the grid, which transmits electrical signals. The front side of the transparent substrate has multiple staggered grooves. The grid includes multiple staggered conductive elements, each disposed in a groove. A conductive layer covers the two sidewalls and the bottom wall of the groove, and is connected to conductive blocks, partially covering the conductive blocks. Each conductive element in the grid includes a conductive layer and conductive blocks. The conductive blocks connect a first part and a second part, and are also connected to the surface of a third part facing away from the bottom wall of the groove. The conductive layer partially surrounds the conductive blocks, which makes the conductivity of the grid more stable. The conductive elements can have a large aspect ratio, which allows the grid to have a lower sheet resistance while maintaining a certain light transmittance, thereby improving the conductivity of the transparent conductive circuit.

Description

Technical Field

[0001] This application relates to the field of transparent conductive technology, and in particular to a transparent conductive circuit, a touch module, a display screen, an antenna module, and an electronic device. Background Technology

[0002] Transparent conductive circuits are widely used in photoelectric conversion, information display, and solid-state lighting due to their inherent light transmittance. Current transparent conductive circuits often incorporate a grid pattern. To achieve visual invisibility of the grid, it needs high light transmittance; the higher the transmittance, the better the visual effect of its invisibility. The sheet resistance of the grid determines the conductivity of the transparent conductive circuit; the lower the sheet resistance, the better the conductivity. Currently, it is difficult to simultaneously achieve high light transmittance and low sheet resistance in transparent conductive circuits. Summary of the Invention

[0003] This application provides a transparent conductive circuit with high mesh transmittance and low sheet resistance, a touch module, a display screen, an antenna module, and an electronic device.

[0004] In a first aspect, this application provides a transparent conductive circuit, which includes a transparent substrate and a mesh. The transparent substrate is used to support the mesh, and the mesh is used to transmit electrical signals. The front side of the transparent substrate is provided with a plurality of staggered grooves. The mesh includes a plurality of staggered conductive elements, each of which is disposed in a respective groove. Each conductive element includes a conductive layer and a conductive block. The conductive layer includes a first part, a second part, and a third part. The first part and the second part respectively cover two sidewalls of the groove, and the third part covers the bottom wall of the groove. The third part is connected between the first part and the second part. The conductive block is disposed on the surface of the third part facing away from the bottom wall of the groove, and the conductive block is connected between the first part and the second part.

[0005] In this design, the conductive components in the mesh include a conductive layer and conductive blocks. The conductive blocks connect the first and second parts, and are also connected to the surface of the third part facing away from the trench bottom wall. The conductive layer partially surrounds the conductive blocks, which makes the conductivity of the mesh more stable. The conductive components can have a large aspect ratio, which allows the mesh to have a lower sheet resistance while maintaining a certain light transmittance, thereby improving the conductivity of the transparent conductive circuit.

[0006] In conjunction with the first aspect, in one feasible implementation, the conductive layer and the conductive block are formed using different processes. The conductive component includes a conductive layer and a conductive block formed using different processes. When forming the conductive component, the gaps present during the forming process are relatively small, which can improve the conductivity of the mesh. The sheet resistance of the mesh is relatively small, thereby improving the conductivity of the transparent conductive circuit.

[0007] In conjunction with the first aspect, in one feasible implementation, the conductive layer is formed by chemical plating, physical vapor deposition, coating, or spraying, and the conductive block is formed by electroplating. The first, second, and third parts constitute a generally U-shaped structure. The conductive block grows from the first part toward the second part, and also from the second part toward the first part. Furthermore, the conductive block grows from the third part away from the bottom wall of the groove, resulting in better growth of the conductive block and reducing the likelihood of voids. In the thickness direction of the transparent conductive circuit, the conductive block grows away from the bottom wall of the groove, allowing it to grow along the first and second parts. This results in a larger growth size of the conductive block in the thickness direction of the transparent conductive circuit, improving the aspect ratio of the conductive component and enabling the mesh to have high light transmittance while having low sheet resistance.

[0008] In conjunction with the first aspect, in one feasible implementation, the conductive element has a dimension of h in the thickness direction of the transparent conductive circuit, and a width dimension of w, where 20 ≥ h / w ≥ 1.5. The conductive element in the mesh has a large aspect ratio, which allows the mesh to have a low sheet resistance while maintaining a certain light transmittance.

[0009] In conjunction with the first aspect, in one feasible implementation, 10 ≥ h / w ≥ 1.5.

[0010] In conjunction with the first aspect, in one feasible implementation, the dimension of the conductive element in the thickness direction of the transparent conductive circuit is between 0.5μm and 30μm, and the width dimension of the conductive element is between 0.2μm and 8μm.

[0011] In conjunction with the first aspect, in one feasible implementation, the line spacing between every two adjacent conductive elements arranged at intervals in the grid is d, and the width dimension of each conductive element is w, where 2% ≤ w / d ≤ 20%. This enables the grid to have higher light transmittance and improves the grid's visibility.

[0012] In conjunction with the first aspect, in one feasible implementation, the line spacing between every two adjacent conductive elements arranged at intervals in the grid is between 30 μm and 600 μm.

[0013] In conjunction with the first aspect, in one feasible implementation, the thickness of the conductive layer is between 0.02 μm and 2 μm.

[0014] In conjunction with the first aspect, in one feasible implementation, the thickness dimension of the transparent conductive circuit of the conductive block is between 0.2μm and 30μm, thereby improving the aspect ratio of the conductive component.

[0015] In conjunction with the first aspect, in one feasible implementation, the conductive layer comprises at least one of a metal, a metal oxide, and an organic conductive material. The conductive layer is capable of conducting electricity, and conductive blocks can be electroplated onto the conductive layer to form conductive blocks.

[0016] In conjunction with the first aspect, in one feasible implementation, the conductive block comprises at least one of a metal, a metal oxide, and an organic conductive material. The conductive block is capable of conducting electricity, thereby improving the conductive stability of the mesh.

[0017] In conjunction with the first aspect, in one feasible implementation, the conductive element further includes a decorative layer. In the thickness direction of the transparent conductive circuit, the decorative layer covers the side of the conductive block away from the third part. The reflectivity of the decorative layer is less than that of the conductive block, which can reduce the reflectivity of the grid and improve the visibility of the grid.

[0018] In conjunction with the first aspect, in one feasible implementation, the dimension of the decorative layer in the thickness direction of the transparent conductive circuit is between 0.05 μm and 5 μm.

[0019] In conjunction with the first aspect, in one feasible implementation, the decorative layer comprises at least one of a metal, a metal oxide, a metal sulfide, a metal selenide, and a metal fluoride.

[0020] In conjunction with the first aspect, in one feasible implementation, the transparent conductive circuit further includes a substrate for supporting the transparent substrate, the substrate being connected to a surface opposite to the front side of the transparent substrate. Supporting the transparent substrate with the substrate facilitates the creation of multiple staggered grooves on the transparent substrate, forming a grid within the multiple staggered grooves.

[0021] Secondly, a method for manufacturing a transparent conductive circuit, the method comprising:

[0022] Provide transparent substrates;

[0023] Multiple staggered grooves are formed on the front side of the transparent substrate;

[0024] A grid is formed in a plurality of staggered trenches. The grid includes a plurality of staggered conductive elements, each of which is disposed in a respective trench. Each conductive element includes a conductive layer and a conductive block. The conductive layer includes a first part, a second part, and a third part. The first part and the second part respectively cover two sidewalls of the trench, and the third part covers the bottom wall of the trench. The third part is connected between the first part and the second part. The conductive block is disposed on the surface of the third part facing away from the bottom wall of the trench and is connected between the first part and the second part.

[0025] In conjunction with the second aspect, in one feasible implementation, a grid is formed in a plurality of staggered trenches, including: forming a conductive layer in each trench by electroless plating, physical vapor deposition, brushing or spraying, wherein the conductive layer covers the bottom wall and two sidewalls of the trench.

[0026] Electroplating is performed on the conductive layer to form a conductive block.

[0027] Thirdly, this application provides a touch module, which includes the transparent conductive circuit described in the first aspect.

[0028] Fourthly, this application provides a display screen, the display screen including the transparent conductive circuit as described in the first aspect or the touch module as described in the second aspect.

[0029] Fifthly, this application provides an antenna module, which includes the transparent conductive circuit described in the first aspect.

[0030] In a sixth aspect, this application provides an electronic device, which includes a transparent conductive circuit as described in the first aspect, a touch module as described in the second aspect, a display screen as described in the third aspect, or an antenna module as described in the fourth aspect.

[0031] In conjunction with the sixth aspect, in one feasible implementation, the electronic device includes a body, a back cover, and a transparent conductive circuit. The back cover is connected to the body, and the transparent conductive circuit is attached to the back cover. The transparent conductive circuit can be separate from the back cover; specifically, it can be attached to the surface of the back cover facing away from the body. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0033] Figure 1 This is a schematic diagram of the structure of an electronic device provided in one embodiment of this application;

[0034] Figure 2 This is a schematic diagram of the structure of a display screen provided in one embodiment of this application;

[0035] Figure 3 This is a schematic diagram of the structure of a transparent substrate provided in one embodiment of this application;

[0036] Figure 4 This is a schematic diagram of a mesh structure provided in one embodiment of this application;

[0037] Figure 5 This is a schematic diagram of the structure of another electronic device provided in one embodiment of this application;

[0038] Figure 6 This is a schematic diagram of the structure of another display screen provided in one embodiment of this application;

[0039] Figure 7 A schematic diagram of FIB characterization of a transparent conductive circuit provided in an embodiment of this application;

[0040] Figure 8 A schematic diagram of EDS analysis results for a transparent conductive circuit provided in an embodiment of this application;

[0041] Figure 9 A schematic diagram illustrating another EDS analysis effect of a transparent conductive circuit provided in an embodiment of this application;

[0042] Figure 10 This is a schematic diagram of another transparent conductive circuit provided in an embodiment of this application;

[0043] Figure 11 This is a schematic diagram of another mesh structure provided in one embodiment of this application;

[0044] Figure 12 This is a schematic diagram of another mesh structure provided in an embodiment of this application;

[0045] Figure 13 This is a schematic diagram of another mesh structure provided in an embodiment of this application;

[0046] Figure 14 This is a schematic diagram of another mesh structure provided in an embodiment of this application;

[0047] Figure 15 This is a schematic diagram of another type of mesh structure provided in an embodiment of this application.

[0048] Explanation of reference numerals in the attached figures:

[0049] 1000, Electronic device; 100, Body; 200, Back cover; 210, Antenna module; 300, Display screen; 10, Mesh; 10a, Conductive component; 11, Conductive layer; 11a, First part; 11b, Second part; 11c, Third part; 12, Conductive block; 13, Decorative layer; 20, Transparent substrate; 21, Groove; 30, Base. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0051] This application provides an electronic device, which may be a mobile phone, tablet computer, laptop computer, watch, smart helmet, smart glasses, etc.

[0052] Please see Figure 1 and Figure 2 The electronic device 1000 may include a body 100, a back cover 200, and a display screen 300, with the back cover 200 and the display screen 300 respectively disposed on opposite sides of the body 100. The display screen 300 may include a touch module, which includes a transparent conductive circuit that can serve as the touch electrode of the touch module. When a user uses the electronic device 1000, touching the touch electrode on the display screen 300 causes a change in the current at the touch location, thus determining the location of the touch. For example, when a user needs the electronic device 1000 to display images from a photo album, the user can click the album icon on the display screen 300. The electronic device 1000 uses the transparent conductive circuit to determine the location of the clicked icon on the display screen 300, and then opens the photo album to display the images.

[0053] The back cover 200 or the body 100 may be equipped with an antenna module 210. The antenna module 210 may include a transparent conductive circuit, which can serve as a radiator for the antenna module 210. The antenna module 210 can radiate wireless signals using the transparent conductive circuit.

[0054] In some embodiments, the transparent conductive circuit can be integrated into the back cover 200 or the display screen 300 of the electronic device 1000. For example, the back cover 200 includes a first layer, a transparent conductive circuit, and a second layer, with the transparent conductive circuit disposed between the first and second layers. The transparent conductive circuit can be a transparent circuit film. As another example, the display screen 300 includes a protective layer, a transparent conductive circuit, and a display layer, with the transparent conductive circuit disposed between the protective layer and the display layer. The transparent conductive circuit can be used as a touch module or part of a touch module of the display screen 300.

[0055] In some embodiments, the electronic device 1000 may include a body 100, a back cover 200, and a transparent conductive circuit. The transparent conductive circuit may be a transparent conductive film. The back cover 200 is connected to the body 100, and the transparent conductive circuit is attached to the back cover 200.

[0056] Please see Figure 3 and Figure 4The transparent conductive circuit can be a transparent circuit film. Specifically, the transparent conductive circuit includes a transparent substrate 20 and a mesh 10. The front side of the transparent substrate 20 is provided with a plurality of staggered grooves 21. The transparent substrate 20 may include one or more of glass, polymer plastic sheet, polymer plastic film material, and transparent film layer formed by curing transparent resin. Polymer plastic sheets include one or more of the following: polycarbonate (PC), polymethylmethacrylate (PMMA), polyvinyl chloride (PVC), polystyrene (PS), acrylonitrile-butadiene-styrene copolymer (ABS), polyethylene glycol terephthalate (PET), polyethylene 2,6-naphthalene-2,6-dicarboxylate (PEN), cycloolefin polymer (COP), polypropylene (PP), and clear polyimide (CPI). Polymer plastic film materials include one or more of polycarbonate (PC), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC), polystyrene (PS), acrylonitrile-butadiene-styrene copolymer (ABS), polyethylene glycol terephthalate (PET), polyethylene 2,6-naphthalene-2,6-dicarboxylate (PEN), cycloolefin polymers (COP), polypropylene (PP), and clear polyimide (CPI). Transparent film layers formed by curing transparent resins include one or more of acrylates, epoxy resins, polyurethanes, and polyesters.

[0057] Please refer to the embodiments provided in this application. Figure 5 and Figure 6The grid 10 is conductive and can be embedded in multiple staggered grooves 21 in the transparent substrate 20. The transparent conductive circuit can be set in the back cover 200 as an antenna module, or it can be set in the display screen 300 as a touch module.

[0058] The grid 10 includes multiple staggered conductive elements 10a, each conductive element 10a being disposed in a respective trench 21. Each conductive element 10a includes a conductive layer 11 and a conductive block 12. The conductive layer 11 includes a first portion 11a, a second portion 11b, and a third portion 11c. The first portion 11a and the second portion 11b respectively cover the two sidewalls of the trench 21, and the third portion 11c covers the bottom wall of the trench 21, connecting the first portion 11a and the second portion 11b. The conductive block 12 is disposed on the surface of the third portion 11c facing away from the bottom wall of the trench 21, and is connected between the first portion 11a and the second portion 11b. The conductive layer 11 and the conductive block 12 are formed using different processes. Both the conductive layer 11 and the conductive block 12 are conductive. The conductive layer 11 and the conductive block 12 can be made of the same material or different materials.

[0059] The conductive layer 11 comprises at least one of a metal, a metal oxide, and an organic conductive material. The conductive block 12 comprises at least one of a metal, a metal oxide, and an organic conductive material.

[0060] Specifically, the conductive layer 11 may include at least one of Au, Ag, Cu, Pt, Al, Ni, Sn, Fe, Zn, Co, W, Ti, Mg, Cr, ITO, ATO, conductive carbon paste, and carbon nanotubes. The conductive block 12 may also include other metals, alloys, metal oxides, or other organic conductive materials.

[0061] The conductive component 10a also includes a decorative layer 13. In the thickness direction of the transparent conductive circuit, the decorative layer 13 covers the side of the conductive block 12 away from the third part 11c. The reflectivity of the decorative layer 13 is less than that of the conductive block 12. The material of the decorative layer 13 can be the same as that of the conductive block 12, or the material of the decorative layer 13 can be different from that of the conductive block 12.

[0062] Decorative layer 13 includes at least one of metal, metal oxide, metal sulfide, metal selenide, and metal fluoride. Decorative layer 13 may include one or more of Au, Ag, Cu, Pt, Al, Ni, Sn, Fe, Zn, Co, W, Ti, Mg, and Cr, and may contain an alloy of one or more of Au, Ag, Cu, Pt, Al, Ni, Sn, Fe, Zn, Co, W, Ti, Mg, and Cr. Decorative layer 13 may include an ink composed of organic polymer materials.

[0063] It should be noted that, because the conductive layer 11 and the conductive block 12 are formed using different processes, even if the conductive layer 11 and the conductive block 12 are made of the same material, they still have a clear boundary. For an example, please refer to [link to example]. Figure 7 By analyzing the transparent conductive circuit through slicing and FIB (Focused Ion Beam) testing, the boundary between the conductive layer 11 and the conductive block 12 can be determined. In other words, within the transparent conductive circuit, it is possible to detect where the conductive layer 11 is and where the conductive block 12 is. If the materials of the conductive layer 11 and the conductive block 12 are different, please refer to [link to relevant documentation]. Figure 8 and Figure 9 Material elements can be tested and analyzed using methods such as EDS (Energy Dispersive X-ray Spectroscopy), thereby determining the boundary between conductive layer 11 and conductive block 12. In other words, in a transparent conductive circuit, EDS can detect where conductive layer 11 is and where conductive block 12 is.

[0064] In this application, the conductive element 10a includes a conductive layer 11 and a conductive block 12 formed by different processes. When the conductive element 10a is formed, the gaps in the conductive element 10a during the forming process will be relatively small, which can improve the conductivity of the grid 10. The sheet resistance of the grid 10 will be relatively small, thereby improving the conductivity of the transparent conductive circuit.

[0065] In the transparent conductive circuit provided in this application, see further details. Figure 5 and Figure 6The conductive layer 11 can be formed by electroless plating, physical vapor deposition (PVD), coating, or spraying, while the conductive block 12 can be formed by electroplating. In some embodiments, after forming a groove on the transparent substrate 20, the transparent substrate 20 can be immersed in a solution to achieve electroless plating to generate the conductive layer 11. The metal or alloy formed by electroless plating covers the inner surface of the groove and the front surface of the transparent substrate 20. The metal or alloy on the front surface of the transparent substrate 20 is removed to form a conductive layer 11 comprising at least a first portion 11a, a second portion 11b, and a third portion 11c. Then, the conductive block 12 is formed by electroplating on the conductive layer 11. Since the conductive layer 11 is conductive, when the conductive block 12 is electroplated on the conductive layer 11, the first part 11a, the second part 11b, and the third part 11c form a roughly U-shaped structure. The conductive block 12 grows from the first part 11a toward the second part 11b, and also from the second part 11b toward the first part 11a. The conductive block 12 also grows from the third part 11c away from the bottom wall of the groove. This results in better growth of the conductive block 12 and reduces the likelihood of gaps. In the thickness direction of the transparent conductive circuit, the conductive block 12 grows away from the bottom wall of the groove. The conductive block 12 can grow along the first part 11a and the second part 11b, resulting in a larger growth size of the conductive block 12 in the thickness direction of the transparent conductive circuit. This improves the aspect ratio of the conductive component 10a, enabling the mesh 10 to have high light transmittance while having low sheet resistance.

[0066] The aspect ratio of the conductive element 10a refers to the ratio of the dimension of the conductive element 10a in the thickness direction to the dimension of the conductive element 10a in the width direction within the transparent conductive circuit.

[0067] The aspect ratio of conductive component 10a satisfies Formula 1:

[0068]

[0069] The transmittance of grid 10 satisfies formula 2:

[0070]

[0071] The sheet resistance of grid 10 satisfies formula 3:

[0072]

[0073] Where r is the aspect ratio of the conductive element 10a, h is the dimension of the conductive element 10a in the thickness direction of the transparent conductive circuit, w is the width dimension of the conductive element 10a, T is the light transmittance of the grid 10, d is the line spacing between adjacent conductive elements 10a in the grid 10, d is the sum of the spacing between two adjacent conductive elements 10a and the width dimension of one conductive element 10a, and ρ is the resistivity of the conductive element 10a.

[0074] Formula 2 shows that the light transmittance of grid 10 is related to the line spacing and width of adjacent conductive elements 10a in grid 10. If the width of conductive element 10a and the line spacing of adjacent conductive elements 10a in grid 10 remain unchanged, the light transmittance of grid 10 remains unchanged. Therefore, increasing the size of conductive element 10a in the thickness direction of the transparent conductive circuit can reduce the sheet resistance of grid 10. In this application, a conductive layer 11 is formed by chemical plating, and then a conductive block 12 is electroplated on the conductive layer 11. The conductive block 12 grows in a direction away from the bottom wall of the groove. The conductive block 12 can grow along the first part 11a and the second part 11b, thus increasing the growth size of the conductive block 12 in the thickness direction of the transparent conductive circuit, thereby reducing the sheet resistance of grid 10.

[0075] From Formula 2, it can be seen that the smaller the width of the conductive element 10a, the greater the light transmittance of the grid 10.

[0076] From Formula 3, it can be seen that the smaller the width of the conductive element 10a, the smaller the sheet resistance of the grid 10.

[0077] Changing the width of the conductive element 10a often only satisfies one of the requirements of high light transmittance or low sheet resistance of the grid 10. It is difficult to achieve both high light transmittance and low sheet resistance simultaneously. If the line spacing between adjacent conductive elements 10a in the grid 10 is increased, and the width of the conductive element 10a is also increased to achieve both high light transmittance and low sheet resistance, the area occupied by the grid 10 will be relatively large, and the energy density of the grid 10 will be low.

[0078] To ensure that the grid 10 has a sufficiently high light transmittance and a low sheet resistance, this can be achieved by increasing the aspect ratio of the conductive element 10a.

[0079] In the transparent conductive circuit provided in this application, 20 ≥ h / w ≥ 1.5, and the aspect ratio of the conductive element 10a is in the range of [1.5, 20]. This allows the grid 10 to have a low sheet resistance while maintaining a certain light transmittance. For example, the aspect ratio of the conductive element 10a can be 1.5, 15, or 20, enabling the light transmittance of the grid 10 to be greater than 80% and the sheet resistance of the grid 10 to be less than 0.1 Ω / sq. In some embodiments, 10 ≥ h / w ≥ 1.5, and the aspect ratio of the conductive element 10a can be 5 or 10.

[0080] In the embodiments provided in this application, 2% ≤ w / d ≤ 20%. By controlling w / d within [2% to 20%], the grid 10 can have a high light transmittance. For example, w / d can be 2%, 10%, or 20%, which can make the light transmittance of the grid 10 greater than 80%. In some embodiments, the light transmittance of the grid 10 can be greater than 85%. It should be noted that the higher the light transmittance of the grid 10, the better the visibility of the grid 10.

[0081] In the embodiments provided in this application, the dimension of the conductive element 10a in the thickness direction of the transparent conductive circuit is between 0.5 μm and 30 μm, and the width dimension of the conductive element 10a is between 0.2 μm and 8 μm. If the dimension of the conductive element 10a in the thickness direction of the transparent conductive circuit is less than 0.5 μm, the processing difficulty of the conductive element 10a is high, the processing cost is high, and it is difficult to control the sheet resistance of the grid 10 to be less than 0.1 Ω / sq. If the dimension of the conductive element 10a in the thickness direction of the transparent conductive circuit is greater than 30 μm, the processing difficulty of the conductive element 10a is high, and it is difficult to form a conductive element 10a with a thickness greater than 30 μm in the thickness direction of the transparent conductive circuit through chemical plating or electroplating processes. In some embodiments, the dimension of the conductive element 10a in the thickness direction of the transparent conductive circuit is between 2 μm and 6 μm. For example, the conductive element 10a can have a thickness of 15 μm in the transparent conductive circuit and a width of 4 μm. Controlling the thickness of the conductive element 10a to 15 μm and the width to 4 μm is easy to achieve in terms of process (by forming a conductive layer in the groove and then electroplating a conductive block on the conductive layer to form the conductive element 10a). It also allows the aspect ratio of the conductive element 10a to be controlled to 3.75, so that the light transmittance of the grid 10 can be greater than 80% and the sheet resistance of the grid 10 can be less than 0.1 Ω / sq.

[0082] In the embodiments provided in this application, the thickness of the conductive layer 11 is between 0.02 μm and 2 μm. Specifically, in the width direction of the conductive element 10a, the thickness of the first portion 11a is between 0.02 μm and 2 μm, and the thickness of the second portion 11b is between 0.02 μm and 2 μm. In the depth direction (thickness direction of the transparent conductive circuit) of the conductive element 10a, the thickness of the third portion 11c is between 0.02 μm and 2 μm. Specifically, when the conductive layer 11 is formed in the trench 21 by chemical plating, the thickness of the conductive layer 11 can be 0.05 μm, 1 μm, or 1.5 μm, etc.

[0083] The conductive block 12 has a thickness dimension in the transparent conductive circuit direction between 0.2 μm and 30 μm, and is formed on the conductive layer 11 by an electroplating process. In some embodiments, the conductive block 12 has a thickness dimension in the transparent conductive circuit direction between 3 μm and 15 μm. For example, the conductive block 12 can have a thickness dimension in the transparent conductive circuit direction of 14 μm.

[0084] In the embodiments provided in this application, the line spacing between any two adjacent conductive elements 10a arranged at intervals in the grid 10 is between 30μm and 600μm. For example, the line spacing between any two adjacent conductive elements 10a arranged at intervals in the grid 10 can be 200μm, and the width of the conductive element 10a can be 5μm. By controlling the w / d ratio to 2.5%, the grid can maintain a high light transmittance, such as a light transmittance greater than 85%.

[0085] In the embodiments provided in this application, the dimension of the decorative layer 13 in the thickness direction of the transparent conductive circuit is between 0.05 μm and 5 μm. The decorative layer 13 can be an oxide layer formed by oxidizing a portion of the conductive block 12 or a sulfur layer formed by sulfurizing a portion of the conductive block 12. The dimension of the decorative layer 13 in the thickness direction of the transparent conductive circuit can be 0.05 μm, 0.1 μm, 1 μm, 2 μm, or 5 μm, etc.

[0086] In some embodiments, the transparent conductive circuit further includes a substrate 30, which supports the transparent substrate 20. The substrate 30 can be glass, and its surfaces are connected to the front and back surfaces of the transparent substrate 20. Specifically, when forming the transparent conductive circuit, a transparent curing adhesive is coated on the substrate 30, using the transparent curing adhesive as the transparent substrate 20. The transparent curing adhesive can be a UV glue (UV adhesive). Then, a groove 21 is formed on the front surface of the transparent substrate 20 by mold pressing. The width of the pressed groove 21 can be 2μm-6μm, and the depth of the groove 21 can be 3μm-15μm. A conductive layer 11 is formed on the transparent substrate 20 by chemical plating. The conductive layer 11 can be a 0.05μm copper layer or a 0.05μm tin layer. The conductive layer 11 can also be Au, Ag, Pt, Al, Ni, Fe, Co, W, Ti, Mg, Cr, etc. Conductive blocks 12 are then formed on the conductive layer 11 through electroplating. Afterwards, the exposed conductive layer 11 on the transparent substrate 20 is removed by etching, leaving only the conductive layer 11 located in the trench 21. The conductive blocks 12 can be metals such as Cu, Au, Ag, Pt, Al, Ni, Sn, Fe, Co, W, Ti, Mg, and Cr. To reduce the reflectivity of the conductive element 10a, the surface of the conductive block 12 facing away from the third part 11c can be oxidized or sulfided to form a decorative layer 13. The dimension of the decorative layer 13 in the thickness direction of the transparent conductive circuit can be 0.1 μm. The width of the conductive element 10a in the grid 10 is 2 μm-6 μm. The aspect ratio of the conductive element 10a in the grid 10 is greater than or equal to 1.5. The process described enables the transparent conductive circuit to have a sheet resistance of less than or equal to 0.1 Ω / sq and a light transmittance of greater than or equal to 85%.

[0087] In some embodiments, see Figure 10Using transparent glass as the transparent substrate 20, interlaced grooves 21 are formed on the front side of the glass by laser engraving to create the entire grid 10. The grid 10 is then embedded into the grooves 21 of the glass. During the fabrication of the grid 10, temporary interlaced grooves 21 can be formed on other substrates. A conductive layer 11 is deposited on the substrate by chemical plating. The conductive layer 11 can be a 0.05μm copper layer or a 0.05μm tin layer. The conductive layer 11 can also be Au, Ag, Pt, Al, Ni, Fe, Co, W, Ti, Mg, Cr, etc. Conductive blocks 12 are then electroplated onto the conductive layer 11 to form conductive blocks 12. Excess conductive layer 11 on the substrate is removed, leaving only the conductive layer 11 located within the temporary grooves 21. The conductive blocks 12 can be metals such as Cu, Au, Ag, Pt, Al, Ni, Sn, Fe, Co, W, Ti, Mg, Cr, etc. An oxidized or sulfided conductive block 12 is placed on the surface facing away from the third portion 11c to form a decorative layer 13. The decorative layer 13 has a thickness dimension of 0.1 μm in the thickness direction of the transparent conductive circuit. A grid 10 located in a plurality of temporary trenches 21 is fabricated. The width dimension of the conductive element 10a in the grid 10 is 2 μm-6 μm, and the aspect ratio of the conductive element 10a in the grid 10 is greater than or equal to 1.5. The fabricated grid 10 is transferred into the trenches 21 of the transparent glass to realize the fabrication of the transparent conductive circuit. The process produces a transparent conductive circuit in which the sheet resistance of the grid 10 in the transparent conductive circuit is less than or equal to 0.1 Ω / sq, and the light transmittance of the grid 10 is greater than or equal to 87%.

[0088] Please see in this application. Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 The shape of the grid 10 can be a rhombus grid 10, a square grid 10, a triangular grid 10, a regular hexagonal grid 10, or an irregular grid 10. The conductive elements 10a in the grid 10 are interconnected in an interlaced manner. This application does not limit the specific shape of the grid 10.

[0089] The terms "first," "second," "third," "fourth," and various numerical designations used herein are merely for descriptive convenience and are not intended to limit the scope of this application.

[0090] It should be understood that in the various embodiments of this application, the order of the above-mentioned processes does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0091] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A transparent conductive circuit, characterized by, include: A transparent substrate, wherein the front side of the transparent substrate is provided with a plurality of staggered grooves; The grid includes multiple staggered conductive elements, each of which is disposed in a trench. Each conductive element includes a conductive layer and a conductive block. The conductive layer includes a first part, a second part, and a third part. The first part and the second part cover two sidewalls of the trench, respectively, and the third part covers the bottom wall of the trench. The third part is connected between the first part and the second part. The conductive block is disposed on the surface of the third part facing away from the bottom wall of the trench and is connected between the first part and the second part.

2. The transparent conductive circuit of claim 1, wherein, The conductive layer and the conductive block are formed by different processes.

3. The transparent conductive circuit of claim 2, wherein, The conductive layer is formed by chemical plating, physical vapor deposition, coating or spraying, and the conductive block is formed by electroplating.

4. The transparent conductive circuit as described in claim 1, characterized in that, The conductive element has a dimension h in the thickness direction of the transparent conductive circuit and a width w, where 20 ≥ h / w ≥ 1.

5.

5. The transparent conductive circuit as described in claim 4, characterized in that, 10 ≥ h / w ≥ 1.

5.

6. The transparent conductive circuit according to any one of claims 1-5, characterized in that, The conductive element has a thickness dimension between 0.5μm and 30μm in the thickness direction of the transparent conductive circuit, and the width dimension of the conductive element is between 0.2μm and 8μm.

7. The transparent conductive circuit according to any one of claims 1-6, characterized in that, The line spacing between any two adjacent conductive elements in the grid is d, and the width of each conductive element is w, where 2% ≤ w / d ≤ 20%.

8. The transparent conductive circuit as described in claim 7, characterized in that, The line spacing between any two adjacent conductive elements arranged in the grid is between 30μm and 600μm.

9. The transparent conductive circuit according to any one of claims 1-8, characterized in that, The thickness of the conductive layer is between 0.02 μm and 2 μm.

10. The transparent conductive circuit according to any one of claims 1-9, characterized in that, The thickness dimension of the transparent conductive circuit of the conductive block is between 0.2 μm and 30 μm.

11. The transparent conductive circuit according to any one of claims 1-10, characterized in that, The conductive layer includes at least one of a metal, a metal oxide, or an organic conductive material.

12. The transparent conductive circuit according to any one of claims 1-11, characterized in that, The conductive block includes at least one of metal, metal oxide, and organic conductive material.

13. The transparent conductive circuit according to any one of claims 1-12, characterized in that, The conductive element further includes a decorative layer. In the thickness direction of the transparent conductive circuit, the decorative layer covers the side of the conductive block away from the third part, and the reflectivity of the decorative layer is less than that of the conductive block.

14. The transparent conductive circuit as described in claim 13, characterized in that, The decorative layer has a dimension between 0.05 μm and 5 μm in the thickness direction of the transparent conductive circuit.

15. The transparent conductive circuit as described in claim 13, characterized in that, The decorative layer includes at least one of metal, metal oxide, metal sulfide, metal selenide, and metal fluoride.

16. The transparent conductive circuit according to any one of claims 1-15, characterized in that, It also includes a base for supporting the transparent substrate, the base being connected to the opposite surface of the front of the transparent substrate.

17. A touch module, characterized in that, The touch module includes the transparent conductive circuit as described in any one of claims 1-16.

18. A display screen, characterized in that, The display screen includes a transparent conductive circuit as described in any one of claims 1-16 or a touch module as described in claim 17.

19. An antenna module, characterized in that, The antenna module includes the transparent conductive circuit as described in any one of claims 1-16.

20. An electronic device, characterized in that, The electronic device includes a transparent conductive circuit as described in any one of claims 1-16, a touch module as described in claim 17, a display screen as described in claim 18, or an antenna module as described in claim 19.

21. The electronic device as claimed in claim 20, characterized in that, The electronic device includes a body, a back cover, and a transparent conductive circuit. The back cover is connected to the body, and the transparent conductive circuit is attached to the back cover.

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