Fixed electrode and capacitance diaphragm vacuum gauge

Abstract

This application provides a fixed electrode and a capacitive thin-film vacuum gauge. The fixed electrode is formed by setting an inner ring plating layer and an outer ring plating layer on the substrate surface, and setting an isolation plating layer between the two and / or outside the outer ring plating layer, so that the inner ring plating layer, the outer ring plating layer and the isolation plating layer form a partitioned arrangement structure on the substrate surface. The isolation plating layer is electrically connected to the ground terminal, which can form a stable electric field shielding boundary between the inner ring plating layer and the outer ring plating layer, thereby limiting the propagation path of the electric field in the edge region and reducing the electric field coupling effect between the inner ring plating layer and the outer ring plating layer. On this basis, when the metal diaphragm undergoes elastic deformation as a variable electrode and causes capacitance change, the additional capacitance interference introduced by electric field coupling can be reduced, the independence of the capacitance measurement signals corresponding to the inner ring plating layer and the outer ring plating layer can be improved, thereby improving the stability and consistency of capacitance measurement.

Description

Technical Field

[0001] This application relates to the field of vacuum measurement technology, and in particular to a fixed electrode and capacitive thin-film vacuum gauge. Background Technology

[0002] A capacitive thin-film vacuum gauge is a vacuum detection device that measures pressure based on the principle of capacitance change. It has advantages such as high measurement accuracy, good long-term stability, and insensitivity to different types of gases. It has been widely used in semiconductor manufacturing equipment, vacuum coating equipment, and scientific research testing.

[0003] In the prior art, capacitive thin-film vacuum gauges typically include a sensor structure and a signal detection circuit. The sensor structure is used to convert pressure signals into capacitive signals, and the circuit performs detection and calculation to achieve the measurement of vacuum pressure.

[0004] The sensor structure of existing capacitive thin-film vacuum gauges typically includes: a flexible metal diaphragm disposed within a sensor cavity, dividing the cavity into a measuring chamber and a reference chamber, wherein the reference chamber is usually pre-evacuated to a high vacuum state; the metal diaphragm serves as a variable electrode, forming a parallel-plate capacitor structure together with a fixed electrode disposed on one side thereof. When a pressure difference exists between the measuring chamber and the reference chamber, the metal diaphragm undergoes elastic deformation, causing a change in the distance between it and the fixed electrode, thereby resulting in a change in capacitance. The corresponding pressure value can be obtained by detecting the change in capacitance.

[0005] Furthermore, some existing capacitive thin-film vacuum gauges employ a dual-electrode structure, where the metal plating of the fixed electrode is configured as a double-ring structure with an inner and outer ring plating. The inner and outer ring platings each form an independent capacitance unit with the metal diaphragm to achieve differential capacitance measurement. In this structure, the inner and outer ring platings are typically electrically isolated from each other through a gap or insulating structure.

[0006] However, in practical applications, due to the small spacing between the inner and outer coating layers and the electric field coupling between each coating layer and the metal diaphragm, a non-ideal electric field distribution may be formed in the electrode edge region, causing a certain degree of mutual influence between different capacitor units, which adversely affects the stability and consistency of the capacitance measurement signal, especially under low-pressure and small pressure change conditions. Summary of the Invention

[0007] The technical problem to be solved by this application is to provide a fixed electrode and capacitor film vacuum gauge to solve the problem of capacitance measurement interference caused by edge electric field coupling between the inner and outer ring coatings in the existing dual electrode capacitor film vacuum gauge, which in turn affects the measurement stability.

[0008] To address the aforementioned technical problems, in a first aspect, this application provides a fixed electrode, comprising: substrate; An inner ring plating layer is disposed on the surface of the substrate; An outer ring plating layer is disposed on the surface of the substrate and located outside the inner ring plating layer; An isolation coating is disposed on the surface of the substrate and located between the inner ring coating and the outer ring coating, and / or disposed on the outside of the outer ring coating; The isolation coating is electrically connected to the grounding terminal and is used to shield and isolate the edge electric field between the inner and outer ring coatings.

[0009] Optionally, the isolation coating separates the substrate surface into a first coating region and a second coating region; The inner ring plating layer is disposed within the first plating layer area, and the outer ring plating layer is disposed within the second plating layer area.

[0010] Optionally, the second coating region extends circumferentially along the first coating region.

[0011] Optionally, the isolation coating includes: A first isolation coating is disposed between the inner ring coating and the outer ring coating, and extends circumferentially along the inner ring coating to enclose and form the first coating area. The second isolation coating is disposed on the outside of the outer ring coating and extends circumferentially along the outer ring coating, and the first isolation coating and the second isolation coating surround to form the second coating area.

[0012] Optionally, the first isolation coating and the second isolation coating are electrically connected to the grounding terminal.

[0013] Optionally, the insulating coating further includes: The connecting part has one end connected to the first isolation coating and the other end connected to the second isolation coating, so that the first isolation coating and the second isolation coating are electrically connected.

[0014] Optionally, the first isolation coating is spaced apart from the inner ring coating; the first isolation coating is spaced apart from the inner edge of the outer ring coating. The second isolation coating is spaced apart from the outer ring coating.

[0015] Optionally, the first coating area and the second coating area are arranged side by side.

[0016] Optionally, the isolation coating includes: A first isolation coating is disposed on the surface of the substrate and is in the form of a ring structure; A second isolation coating is disposed inside the first isolation coating and extends radially along the first isolation coating. Both ends of the second isolation coating in the length direction are connected to the first isolation coating, so as to divide the area inside the first isolation coating into the first coating area and the second coating area.

[0017] The beneficial effects of this application are that, compared with the prior art, the fixed electrode provided in this application forms a partitioned arrangement structure on the substrate surface by setting an inner ring plating layer and an outer ring plating layer on the substrate surface, and setting an isolation plating layer between the two and / or outside the outer ring plating layer. The isolation plating layer is electrically connected to the grounding terminal, which can form a stable electric field shielding boundary between the inner and outer ring plating layers, limiting the propagation path of the electric field in the edge region, thereby weakening the electric field coupling effect between the inner and outer ring plating layers. Based on this, during the process of the metal diaphragm undergoing elastic deformation as a variable electrode and causing capacitance changes, the additional capacitance interference introduced by electric field coupling can be reduced, improving the independence of the capacitance measurement signals corresponding to the inner and outer ring plating layers, and thus improving the stability and consistency of capacitance measurement.

[0018] In a second aspect, this application provides a capacitive thin-film vacuum gauge, comprising: The housing has an internal cavity, and the housing has an interface that communicates with the cavity; A variable electrode is disposed within the cavity, dividing the cavity into a measurement cavity and a reference cavity. The measurement cavity is located on the side of the variable electrode facing the interface and is in communication with the interface. The reference cavity is located on the side of the variable electrode away from the interface. A fixed electrode is disposed within the reference cavity, wherein the fixed electrode is any of the fixed electrodes described above.

[0019] The beneficial effects of this application are that, compared with the prior art, the capacitance film vacuum gauge provided by this application includes the aforementioned fixed electrode. The fixed electrode is formed by setting an inner ring plating layer and an outer ring plating layer on the substrate surface, and setting an isolation plating layer between the two and / or outside the outer ring plating layer, so that the inner ring plating layer, the outer ring plating layer and the isolation plating layer form a partitioned arrangement structure on the substrate surface. The isolation plating layer is electrically connected to the ground terminal, which can form a stable electric field shielding boundary between the inner ring plating layer and the outer ring plating layer, so that the propagation path of the electric field in the edge region is limited, thereby reducing the electric field coupling effect between the inner ring plating layer and the outer ring plating layer. On this basis, during the process of the metal diaphragm undergoing elastic deformation as a variable electrode and causing capacitance change, the additional capacitance interference introduced by electric field coupling can be reduced, the independence of the capacitance measurement signals corresponding to the inner ring plating layer and the outer ring plating layer is improved, thereby improving the stability and consistency of capacitance measurement. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the capacitive thin-film vacuum gauge provided in this application; Figure 2 This is a schematic diagram of the structure of the variable electrode for measuring vacuum in this application; Figure 3 This is a schematic diagram of the structure of the fixed electrode provided in this application; Figure 4 This is a schematic diagram of the structure of the isolation coating in another embodiment of this application; Figure 5 This is a schematic diagram of the structure of the isolation coating in another embodiment of this application; Figure 6 This is a schematic diagram of the structure of the isolation coating in another embodiment of this application; Figure 7 This is a schematic diagram of the structure of the isolation coating in another embodiment of this application; Figure 8 This is a schematic diagram of the structure of the isolation coating in another embodiment of this application.

[0021] Explanation of reference numerals in the attached figures: 10. Substrate; 11. First plating area; 12. Second plating area; 20. Inner ring plating; 21. Protrusion; 30. Outer ring plating; 40. Isolation plating; 41. First isolation plating; 42. Second isolation plating; 43. Connecting part; 44. Clearance space; 50. Housing; 51. Cavity; 511. Measuring cavity; 512. Reference cavity; 52. Interface; 60. Variable electrode. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this application pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.

[0023] Furthermore, it should be understood that the orientations or positional relationships indicated by terms such as "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" in this document are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The terms "first" and "second" in this document are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0024] To solve the aforementioned technical problems, in a first aspect, this application provides a fixed electrode, such as... Figure 3 As shown, it includes a substrate 10, an inner ring plating layer 20, an outer ring plating layer 30, and an isolation plating layer 40.

[0025] The inner ring plating layer 20 is disposed on the surface of the substrate 10, and the outer ring plating layer 30 is disposed on the surface of the substrate 10 and located outside the inner ring plating layer 20.

[0026] An isolation plating layer 40 is disposed on the surface of the substrate 10 and is located between the inner ring plating layer 20 and the outer ring plating layer 30, and / or disposed on the outside of the outer ring plating layer 30. This separates the inner ring plating layer 20 and the outer ring plating layer 30, so that the three are spaced apart from each other on the surface of the substrate 10.

[0027] The isolation coating 40 is used for grounding, so that the isolation coating 40 is in a ground potential state. The inner ring coating 20 and the outer ring coating 30 are respectively independent electrode areas, forming a corresponding capacitance measurement relationship with the variable electrode 60 (metal diaphragm).

[0028] Since the isolation coating 40 is located between the inner ring coating 20 and the outer ring coating 30, and the isolation coating 40 is grounded, it can shield and isolate the edge electric field between the inner ring coating 20 and the outer ring coating 30, thereby limiting the electric field distribution in the edge area and reducing the electric field coupling between the inner ring coating 20 and the outer ring coating 30.

[0029] When the variable electrode 60 undergoes elastic deformation under pressure, the inner ring plating layer 20 and the outer ring plating layer 30 respectively form corresponding capacitance changes with the metal diaphragm. Since the isolation plating layer 40 isolates the edge electric field, it can reduce the influence of additional capacitance introduced by electric field coupling between the inner ring plating layer 20 and the outer ring plating layer 30, thereby reducing the mutual interference between corresponding capacitance units, improving the independence of the capacitance measurement signal, and improving the stability and consistency of capacitance measurement.

[0030] Compared with the prior art, the fixed electrode provided in this application forms a partitioned arrangement structure on the surface of the substrate 10 by setting an inner ring plating layer 20 and an outer ring plating layer 30 on the surface of the substrate 10, and setting an isolation plating layer 40 between the two and / or outside the outer ring plating layer 30. The isolation plating layer 40 is electrically connected to the ground terminal, which can form a stable electric field shielding boundary between the inner ring plating layer 20 and the outer ring plating layer 30, so that the propagation path of the electric field in the edge region is limited, thereby reducing the electric field coupling effect between the inner ring plating layer 20 and the outer ring plating layer 30. On this basis, when the metal diaphragm as the variable electrode 60 undergoes elastic deformation and causes capacitance change, the additional capacitance interference introduced by electric field coupling can be reduced, the independence of the capacitance measurement signals corresponding to the inner ring plating layer 20 and the outer ring plating layer 30 is improved, thereby improving the stability and consistency of capacitance measurement.

[0031] In one embodiment of this application, the isolation coating 40 is located between the inner ring coating 20 and the outer ring coating 30.

[0032] In another embodiment of this application, the isolation coating 40 is located between the inner ring coating 20 and the outer ring coating 30, and is disposed on the outside of the outer ring coating 30.

[0033] In some embodiments of this application, such as Figures 4 to 8 As shown, the isolation coating 40 divides the surface of the substrate 10 into a first coating region 11 and a second coating region 12. The inner ring coating 20 is disposed in the first coating region 11, and the outer ring coating 30 is disposed in the second coating region 12, so that the inner ring coating 20 and the outer ring coating 30 are respectively located in different regions defined by the isolation coating 40.

[0034] Specifically, since the isolation plating layer 40 divides the surface of the substrate 10 into a first plating region 11 and a second plating region 12, an isolation boundary is formed between the inner ring plating layer 20 and the outer ring plating layer 30, allowing the inner ring plating layer 20 and the outer ring plating layer 30 to be independently distributed on the surface of the substrate 10. Furthermore, after the isolation plating layer 40 is grounded, the edge region between the inner ring plating layer 20 and the outer ring plating layer 30 can be isolated, reducing the spread of the edge electric field to adjacent plating regions, thereby reducing the electric field coupling effect between the inner ring plating layer 20 and the outer ring plating layer 30.

[0035] When the inner ring plating layer 20 and the outer ring plating layer 30 form corresponding capacitor units with the variable electrode 60, the mutual interference between different capacitor units can be reduced because the different plating areas are separated by the isolation plating layer 40, making the capacitance change of each capacitor unit more independent, which is conducive to improving the stability and consistency of capacitance measurement results.

[0036] In some embodiments of this application, the second coating region 12 extends circumferentially along the first coating region 11.

[0037] Specifically, the first plating region 11 and the second plating region 12 form an inner-outer corresponding distribution relationship on the surface of the substrate 10, so that the inner ring plating layer 20 disposed in the first plating region 11 and the outer ring plating layer 30 disposed in the second plating region 12 form a corresponding spacing structure in the circumferential direction. Since the isolation plating layer 40 is located between the first plating region 11 and the second plating region 12, an isolation boundary can be formed between the inner ring plating layer 20 and the outer ring plating layer 30 to limit the extension of the edge region electric field to the adjacent region. When the inner ring plating layer 20 and the outer ring plating layer 30 respectively form corresponding capacitor units with the variable electrode 60, after the edge region electric field is restricted, the electric field coupling effect caused by the edge electric field extension between the inner ring plating layer 20 and the outer ring plating layer 30 can be reduced, thereby reducing the mutual interference between different capacitor units, so that the capacitance changes corresponding to the inner ring plating layer 20 and the outer ring plating layer 30 remain relatively independent, which is beneficial to improving the stability and consistency of the capacitance measurement signal.

[0038] In some embodiments of the application, the isolation coating 40 includes a first isolation coating 41 and a second isolation coating 42.

[0039] For details, please refer to Figures 4 to 6 A first isolation coating 41 is disposed between the inner ring coating 20 and the outer ring coating 30, and extends circumferentially along the inner ring coating 20 to form a first coating area 11. A second isolation coating 42 is disposed outside the outer ring coating 30 and extends circumferentially along the outer ring coating 30. The second isolation coating 42 and the first isolation coating 41 together form a second coating area 12, such that the outer ring coating 30 is located between the first isolation coating 41 and the second isolation coating 42.

[0040] The first isolation coating 41 separates the edge region between the inner ring coating 20 and the outer ring coating 30, and the second isolation coating 42 isolates the outer region of the outer ring coating 30, thus forming corresponding isolation boundaries between the inner and outer regions of the outer ring coating 30. Since the first isolation coating 41 and the second isolation coating 42 are located on both sides of the outer ring coating 30, the electric field in the edge region can be limited to extend to adjacent regions, reducing the electric field coupling effects between the outer ring coating 30 and the inner ring coating 20, as well as between the outer regions.

[0041] In some embodiments of this application, the first isolation coating 41 and the second isolation coating 42 are electrically connected to the grounding terminal, respectively.

[0042] Specifically, since the first isolation coating 41 is disposed between the inner ring coating 20 and the outer ring coating 30, and the second isolation coating 42 is disposed on the outside of the outer ring coating 30, after the first isolation coating 41 and the second isolation coating 42 are electrically connected to the grounding terminal, corresponding grounding isolation boundaries can be formed in the inner and outer regions of the outer ring coating 30, respectively, so as to limit the electric field of the edge region from extending to the adjacent region.

[0043] In some embodiments of this application, please refer to Figures 4 to 6 The isolation coating 40 also includes a connecting portion 43. One end of the connecting portion 43 is connected to the first isolation coating 41, and the other end is connected to the second isolation coating 42, so that the first isolation coating 41 and the second isolation coating 42 are electrically connected, so that the first isolation coating 41 and the second isolation coating 42 are electrically connected to the grounding terminal through the same grounding point.

[0044] One end of the connecting portion 43 is connected to the first isolation plating layer 41, and the other end is connected to the second isolation plating layer 42. This allows the first isolation plating layer 41 and the second isolation plating layer 42 to form a conductive structure on the surface of the substrate 10. This enables the first isolation plating layer 41 located between the inner ring plating layer 20 and the outer ring plating layer 30, and the second isolation plating layer 42 located outside the outer ring plating layer 30, to jointly form a grounding isolation structure. Compared to having separate grounding points for the first isolation plating layer 41 and the second isolation plating layer 42, this reduces the number of grounding connection structures on the surface of the substrate 10, making the grounding path of the isolation plating layer 40 more concentrated.

[0045] In one embodiment of this application, please refer to Figure 4 The inner ring plating layer 20 has a circular structure, and the first isolation plating layer 41 is annular and surrounds the outer side of the inner ring plating layer 20. The outer ring plating layer 30 has an annular structure and a radially extending notch. The second isolation plating layer 42 has an annular structure and surrounds the outer side of the outer ring plating layer 30, and the second isolation plating layer 42 is coaxially arranged with the first isolation plating layer 41. The connecting portion 43 is located within the notch to achieve electrical connection between the first isolation plating layer 41 and the second isolation plating layer 42.

[0046] In another embodiment of this application, please refer to Figure 5 The inner ring plating layer 20 has a semi-circular structure, and the first isolation plating layer 41 is annular and arranged around the outside of the inner ring plating layer 20. The outer ring plating layer 30 has a semi-annular structure, and the second isolation plating layer 42 has an annular structure and is arranged outside the outer ring plating layer 30. The second isolation plating layer 42 and the first isolation plating layer 41 are coaxially arranged. The inner ring plating layer 20 and the outer ring plating layer 30 are located on both sides of the central axis of the second isolation plating layer 42 and the first isolation plating layer 41, respectively. The connecting part 43 is located within the second plating area 12 and is offset from the outer ring plating layer 30 to achieve electrical connection between the first isolation plating layer 41 and the second isolation plating layer 42.

[0047] In one embodiment of this application, please refer to Figure 6 The inner ring plating layer 20 has a circular structure, and the first isolation plating layer 41 is semi-circular and disposed on the outside of the inner ring plating layer 20. The outer ring plating layer 30 has a semi-circular structure, and the second isolation plating layer 42 has a semi-circular structure and is disposed on the outside of the outer ring plating layer 30, and the second isolation plating layer 42 is coaxially disposed with the first isolation plating layer 41. The connecting portion 43 is located at both ends of the first isolation plating layer 41, that is, the two ends of the first isolation plating layer 41 are connected to the two ends of the second isolation plating layer 42 through the connecting portion 43, so as to form an open first plating area 11 on the outside of the first isolation plating layer 41, and a closed second plating area 12 between the first isolation plating layer 41 and the second isolation plating layer 42, while realizing the electrical connection between the first isolation plating layer 41 and the second isolation plating layer 42.

[0048] In some embodiments of this application, please refer to Figures 7 to 8 The first plating region 11 and the second plating region 12 are arranged side by side so that the first plating region 11 and the second plating region 12 are distributed adjacently on the surface of the substrate 10 in the circumferential direction.

[0049] Specifically, the first plating region 11 and the second plating region 12 are arranged side by side, which allows the inner ring plating layer 20 in the first plating region 11 and the outer ring plating layer 30 in the second plating region 12 to form corresponding spacing structures on the surface of the substrate 10. The isolation plating layer 40 located between the two forms a region separation boundary, thereby limiting the extension of the electric field of the edge region to the adjacent plating region.

[0050] In some embodiments of this application, the isolation coating 40 includes a first isolation coating 41 and a second isolation coating 42.

[0051] The first isolation plating layer 41 is disposed on the surface of the substrate 10 and has a ring-shaped structure. The second isolation plating layer 42 is disposed inside the first isolation plating layer 41 and extends radially along the first isolation plating layer 41. Both ends of the second isolation plating layer 42 are connected to the first isolation plating layer 41 in the length direction, thereby dividing the area within the first isolation plating layer 41 to form a first plating region 11 and a second plating region 12. At the same time, both ends of the second isolation plating layer 42 are connected to the first isolation plating layer 41, realizing the electrical connection between the second isolation plating layer 42 and the first isolation plating layer 41.

[0052] Specifically, the first isolation coating 41 can form an annular isolation boundary on the surface of the substrate 10, and the second isolation coating 42 can further divide the internal region of the first isolation coating 41, so that the first coating region 11 and the second coating region 12 are located on both sides of the second isolation coating 42. Since the two ends of the second isolation coating 42 are respectively connected to the first isolation coating 41, the first isolation coating 41 and the second isolation coating 42 can form a connected isolation structure on the surface of the substrate 10, thereby separating the edge regions between different coating regions.

[0053] When the inner ring plating layer 20 in the first plating region 11 and the outer ring plating layer 30 in the second plating region 12 form corresponding capacitor units with the variable electrode 60, the first isolation plating layer 41 and the second isolation plating layer 42 can block the electric field in the edge region to limit the extension of the edge electric field to the adjacent region, reduce the electric field coupling effect between different capacitor units caused by the extension of the edge electric field, and keep the capacitance change of the corresponding capacitor unit relatively independent, thereby improving the stability and consistency of the capacitance measurement signal.

[0054] In one embodiment of this application, please refer to Figure 7 The first plating region 11 and the second plating region 12 are symmetrically arranged about the second isolation plating layer 42. The inner ring plating layer 20 is disposed in the first plating region 11, and the outer ring plating layer 30 is disposed in the second plating region 12. The inner ring plating layer 20 and the outer ring plating layer 30 are semi-circular structures and are arranged circumferentially along the surface of the substrate 10 with the same center as the reference, so that the inner ring plating layer 20 and the outer ring plating layer 30 are non-continuous ring structures in the circumferential direction. The radius of curvature of the inner ring plating layer 20 is smaller than the radius of curvature of the outer ring plating layer 30.

[0055] In one embodiment of this application, please refer to Figure 8 The first plating region 11 and the second plating region 12 are located on both sides of the second isolation plating layer 42. The middle part of the second isolation plating layer 42 is bent towards the second plating region 12 to form a clearance space 44. The inner ring plating layer 20 is disposed in the first plating region 11, and the outer ring plating layer 30 is disposed in the second plating region 12. The inner ring plating layer 20 is semi-circular and has a laterally extending sidewall structure in the radial direction. A protrusion 21 is provided on the sidewall, and the protrusion 21 is accommodated in the clearance space 44 so that the inner ring plating layer 20 and the second isolation plating layer 42 form a partial clearance fit relationship. The outer ring plating layer 30 is set as a semi-annular structure, arranged radially spaced from the inner ring plating layer 20, and matched with the second plating region 12.

[0056] In some examples of this application, the first isolation plating layer 41 is spaced apart from the inner ring plating layer 20; the first isolation plating layer 41 is spaced apart from the inner edge of the outer ring plating layer 30; and the second isolation plating layer 42 is spaced apart from the outer ring plating layer 30, so that each plating layer maintains a preset spacing distribution on the surface of the substrate 10.

[0057] Specifically, spatial isolation regions are formed between the first isolation plating layer 41 and the inner ring plating layer 20, and between the first isolation plating layer 41 and the inner region of the outer ring plating layer 30. Simultaneously, a corresponding spacing region is formed between the second isolation plating layer 42 and the outer ring plating layer 30, resulting in each plating layer being arranged independently on the surface of the substrate 10. Using this technical solution, the inner ring plating layer 20 and the outer ring plating layer 30 are separated by the first isolation plating layer 41, and the inner and outer sides of the outer ring plating layer 30 are defined by different isolation plating layers 40, thereby restricting the electric field path in the edge region and reducing the mutual influence of electric fields between different plating layer regions.

[0058] In a second aspect, this application provides a capacitive thin-film vacuum gauge; please refer to [link to relevant documentation]. Figures 1 to 3 It includes a housing 50, a variable electrode 60, and a fixed electrode.

[0059] Specifically, the housing 50 has a cavity 51 inside and an interface 52 on the housing 50. The interface 52 is connected to the cavity 51 and is used to connect to the cavity being tested.

[0060] The variable electrode 60 is a metal diaphragm and is disposed in the cavity 51 to divide the cavity 51 into a measuring cavity 511 and a reference cavity 512. The measuring cavity 511 is located on the side of the variable electrode 60 facing the interface 52 and is connected to the interface 52. The reference cavity 512 is located on the side of the variable electrode 60 away from the interface 52. During the measurement process, the variable electrode 60 undergoes elastic deformation with the pressure difference between the two sides to generate a change in capacitance.

[0061] A fixed electrode is disposed within the reference cavity 512, wherein the fixed electrode is a fixed electrode structure as described in any of the preceding embodiments, and is used to form a capacitance detection structure together with the variable electrode 60.

[0062] In some embodiments of this application, the isolation plating layer 40 in the fixed electrode is electrically connected to the housing 50, and the housing 50 is electrically connected to the grounding terminal, so that the isolation plating layer 40 in the fixed electrode forms a conductive connection with the grounding terminal through the housing 50.

[0063] By maintaining the isolation coating 40 in the fixed electrode electrically connected to the housing 50 during operation, and with the housing 50 uniformly introducing a ground potential, the fixed electrode as a whole is kept at a stable potential reference, thereby reducing the influence of the external electromagnetic environment on the electrical signal of the fixed electrode. Simultaneously, since the isolation coating 40 in the fixed electrode is electrically connected to the housing 50, the grounding path of the fixed electrode is simplified, allowing it to be uniformly grounded through the housing 50. This improves the electrical stability of the capacitance detection structure and reduces measurement fluctuations caused by local potential inconsistencies, thus contributing to improved measurement stability and consistency of the capacitance thin-film vacuum gauge.

[0064] Compared with the prior art, the capacitive thin-film vacuum gauge provided in this application includes the aforementioned fixed electrode. The fixed electrode is formed by setting an inner ring plating layer 20 and an outer ring plating layer 30 on the surface of the substrate 10, and setting an isolation plating layer 40 between the two and / or outside the outer ring plating layer 30, so that the inner ring plating layer 20, the outer ring plating layer 30 and the isolation plating layer 40 form a partitioned arrangement structure on the surface of the substrate 10. The isolation plating layer 40 is electrically connected to the ground terminal, which can form a stable electric field shielding boundary between the inner ring plating layer 20 and the outer ring plating layer 30, so that the propagation path of the electric field in the edge region is limited, thereby reducing the electric field coupling effect between the inner ring plating layer 20 and the outer ring plating layer 30. On this basis, when the metal diaphragm as the variable electrode 60 undergoes elastic deformation and causes capacitance change, the additional capacitance interference introduced by electric field coupling can be reduced, thereby improving the independence of the capacitance measurement signals corresponding to the inner ring plating layer 20 and the outer ring plating layer 30, and thus improving the stability and consistency of capacitance measurement.

[0065] The above are merely specific embodiments of this application, but the protection scope of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the scope of the claims.

Claims

1. A fixed electrode, characterized in that, include: substrate; An inner ring plating layer is disposed on the surface of the substrate; An outer ring plating layer is disposed on the surface of the substrate and located outside the inner ring plating layer; An isolation coating is disposed on the surface of the substrate and located between the inner ring coating and the outer ring coating, and / or disposed on the outside of the outer ring coating; The isolation coating is electrically connected to the grounding terminal and is used to shield and isolate the edge electric field between the inner and outer ring coatings.

2. The fixed electrode according to claim 1, characterized in that, The isolation coating separates the substrate surface into a first coating region and a second coating region; The inner ring plating layer is disposed within the first plating layer area, and the outer ring plating layer is disposed within the second plating layer area.

3. The fixed electrode according to claim 2, characterized in that, The second coating region extends circumferentially along the first coating region.

4. The fixed electrode according to claim 3, characterized in that, The isolation coating includes: A first isolation coating is disposed between the inner ring coating and the outer ring coating, and extends circumferentially along the inner ring coating to enclose and form the first coating area. The second isolation coating is disposed on the outside of the outer ring coating and extends circumferentially along the outer ring coating, and the first isolation coating and the second isolation coating surround to form the second coating area.

5. The fixed electrode according to claim 4, characterized in that, The first isolation coating and the second isolation coating are respectively electrically connected to the grounding terminal.

6. The fixed electrode according to claim 4, characterized in that, The isolation coating also includes: The connecting part has one end connected to the first isolation coating and the other end connected to the second isolation coating, so that the first isolation coating and the second isolation coating are electrically connected.

7. The fixed electrode according to claim 4, characterized in that, The first isolation coating is spaced apart from the inner ring coating; the first isolation coating is spaced apart from the inner edge of the outer ring coating. The second isolation coating is spaced apart from the outer ring coating.

8. The fixed electrode according to claim 2, characterized in that, The first coating area and the second coating area are arranged side by side.

9. The fixed electrode according to claim 8, characterized in that, The isolation coating includes: A first isolation coating is disposed on the surface of the substrate and is in the form of a ring structure; A second isolation coating is disposed inside the first isolation coating and extends radially along the first isolation coating. Both ends of the second isolation coating in the length direction are connected to the first isolation coating, so as to divide the area inside the first isolation coating into the first coating area and the second coating area.

10. A capacitive thin-film vacuum gauge, characterized in that, include: The housing has an internal cavity, and the housing has an interface that communicates with the cavity; A variable electrode is disposed within the cavity, dividing the cavity into a measurement cavity and a reference cavity. The measurement cavity is located on the side of the variable electrode facing the interface and is in communication with the interface. The reference cavity is located on the side of the variable electrode away from the interface. A fixed electrode is disposed within the reference cavity, wherein the fixed electrode is the fixed electrode as described in any one of claims 1-9.

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