LED backlight structure and backlight device
By setting up spacer copper layer and reflective layer in the LED backlight structure, combining the pad and protective adhesive layer to raise the problem of substrate light absorption and welding design, the brightness and welding stability of the backlight module are improved, and the Higher reflectivity and uniform light effect.
Patent Information
- Application Number
- CN202323659357.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2033-12-29
AI Technical Summary
In traditional LED backlight structures, low reflectivity of the substrate leads to loss of brightness of the LED luminescent chip, and welding design leads to exposure of the substrate, affecting brightness and welding yield.
The design includes a copper layer and a window spaced on the substrate, a first reflective layer is provided in the window, a padding pad is located on both sides of the window to electrically connect the light emitting chip, and a second reflective layer and protective glue are provided on the copper layer. layer to improve reflectivity and uniformity.
The overall brightness and welding stability of the backlight module are improved, the substrate is avoided, and the high reflectivity and uniform light efficiency are ensured.
Smart Images
Figure CN222339936U_ABST
Abstract
Description
[Technical field]
[0001] The utility model relates to the technical field of display equipment, in particular to an LED backlight structure and a backlight device. [Background technology]
[0002] At present, the traditional LED backplane display technology is becoming more and more mature, but there are still some problems to be solved. For example, the PCB substrate of the traditional LED backlight panel has low reflectivity and obvious light absorption. In order to solve such problems, a high-reflectivity reflective layer of a certain thickness will be made on the PCB surface to avoid light absorption by the substrate and improve the brightness of the backlight module. In order to solder LED chips on such light boards and improve the soldering yield, it is usually necessary to open windows between the pads. However, the through-window design will cause gaps between the pads to expose the substrate, causing the light from the LED chip to be absorbed by the substrate, resulting in brightness loss. [Contents of the utility model]
[0003] In order to solve the problem that the light emitted by the existing LED backlight structure is easily absorbed by the substrate and the brightness of the light emitting chip is lost, the utility model provides an LED backlight structure and a backlight device.
[0004] The solution to the technical problem of the utility model is to provide an LED backlight structure, which includes a substrate, a plurality of copper wire layers arranged on the substrate at intervals, the interval area between two adjacent copper wire layers is a through window, a first reflective layer is arranged in the through window, and a raised pad is respectively arranged on both side edges along the length direction of each copper wire layer, and the two raised pads located on both sides of the through window away from the surface of the substrate are also electrically connected to a light-emitting chip.
[0005] Preferably, a vertical distance between a surface of the elevated pad away from the substrate and the substrate is greater than or equal to a vertical distance between a surface of the first reflective layer away from the substrate and the substrate.
[0006] Preferably, a vertical distance between a surface of the elevated pad away from the substrate and a surface of the copper layer away from the substrate is 20-50 um.
[0007] Preferably, a second reflective layer is further provided on the surface of the copper wire layer away from the substrate, and a plane where the surface of the second reflective layer away from the substrate is located is coplanar with a plane where the surface of the first reflective layer away from the substrate is located.
[0008] Preferably, a plane where a surface of the first reflective layer away from the substrate is located, a plane where a surface of the elevated pad away from the substrate is located, and a plane where a surface of the light-emitting chip close to the substrate is located are parallel to each other.
[0009] Preferably, a gap is left between a surface of the light emitting chip close to the substrate and a surface of the first reflective layer away from the substrate.
[0010] Preferably, a protective adhesive layer is further provided on a side of the copper wire layer away from the substrate, and the protective adhesive layer completely covers the light-emitting chip.
[0011] Preferably, a reflective film layer is further provided on a surface of the protective adhesive layer away from the substrate.
[0012] Preferably, the center point of the reflective film layer and the geometric center of the corresponding light-emitting chip are located on the same central axis.
[0013] The utility model also provides a backlight device, comprising a carrying device and the above-mentioned LED backlight structure arranged on the carrying device.
[0014] Compared with the prior art, the LED backlight structure and backlight device of the present invention have the following advantages:
[0015] 1. The LED backlight structure of the utility model includes a substrate, a plurality of copper wire layers arranged on the substrate at intervals, the interval area between two adjacent copper wire layers is a through window, a first reflective layer is arranged in the through window, and a raised pad is respectively arranged on both sides of each copper wire layer along the length direction, and the two raised pads located on both sides of the through window are also electrically connected to the surface of the substrate away from the substrate; the raised pads are arranged on the copper wire layers, and the vertical space of the through window is increased without affecting the welding yield, so that the first reflective layer with high reflectivity is conveniently arranged in the through window, so that the substrate will not be exposed, and there will be no phenomenon of substrate absorption. At the same time, the high reflectivity of the first reflective layer will also allow the light emitted from the bottom of the light-emitting chip to be reflected by the first reflective layer and reused, thereby improving the overall brightness of the light board. In theory, the higher the height of the reflective layer, the higher the reflectivity will be, thereby realizing a backlight module with higher light efficiency.
[0016] 2. The vertical distance between the surface of the elevated pad away from the substrate and the substrate of the LED backlight structure of the present invention is greater than or equal to the vertical distance between the surface of the first reflective layer away from the substrate and the substrate; the elevated pad is higher than the first reflective layer to ensure complete welding, good electrical connection, and improve process stability.
[0017] 3. The vertical distance between the surface of the elevated pad away from the substrate and the surface of the copper layer away from the substrate of the LED backlight structure of the present invention is 20-50um; setting a suitable height of the elevated pad also limits the height of the first reflective layer, so that the first reflective layer has a higher reflectivity while preventing the overall backlight panel from reflecting too complicatedly due to an overly thick hierarchical structure, thereby improving the overall brightness of the light board.
[0018] 4. The surface of the copper layer of the LED backlight structure of the present invention is further provided with a second reflective layer away from the substrate, and the plane where the surface of the second reflective layer away from the substrate is located is the same plane as the plane where the surface of the first reflective layer away from the substrate is located; the second reflective layer is provided to more comprehensively and completely reflect the light emitted by the light-emitting chip in order to improve the overall brightness, and at the same time, the heights of the first reflective layer and the second reflective layer are roughly the same in order to balance the overall brightness after reflection, so that the light emission is more uniform.
[0019] 5. The plane where the surface of the first reflective layer of the LED backlight structure of the present invention is located away from the substrate, the plane where the surface of the elevated pad is located away from the substrate, and the plane where the surface of the light-emitting chip is located close to the substrate are parallel to each other; the plane of the elevated pad is parallel to the light-emitting plane to ensure that the light-emitting chip emits light perpendicular to the substrate and emits light more evenly, and the plane of the first reflective layer is parallel to the light-emitting chip to reflect light more evenly and improve the uniform light effect.
[0020] 6. A gap is left between the surface of the light-emitting chip close to the substrate and the surface of the first reflective layer away from the substrate in the LED backlight structure of the present invention; the first reflective layer does not contact the bottom of the light-emitting chip, thereby improving the welding yield and increasing the process stability.
[0021] 7. The copper layer of the LED backlight structure of the present invention is further provided with a protective adhesive layer on the side away from the substrate, and the protective adhesive layer completely covers the light-emitting chip; the protective adhesive layer can protect the light-emitting chip while improving the uniform light display effect.
[0022] 8. The protective adhesive layer of the LED backlight structure of the present invention is also provided with a reflective film layer on the side of the surface away from the substrate; the reflective film layer changes the light-emitting chip on the backlight module from point light emission to surface light emission.
[0023] 9. The center point of the reflective film layer of the LED backlight structure of the present invention and the geometric center of the corresponding light-emitting chip are on the same central axis; this is to ensure that the light transmitted through the reflective film layer is surface light that diffuses from the center to the outside, and the center brightness is the highest, thereby improving the display effect.
[0024] 10. The utility model also provides a backlight device, which has the same beneficial effects as the above-mentioned LED backlight structure, and will not be described in detail here.
Brief Description of the Drawings
[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0026] Figure 1 It is a schematic cross-sectional structure diagram of the LED backlight structure provided by the first embodiment of the utility model.
[0027] Figure 2 yes Figure 1 A is an enlarged view of the middle image.
[0028] Figure 3 It is a schematic diagram of a backlight device provided by the second embodiment of the utility model.
[0029] Description of the accompanying drawings:
[0030] 1. LED backlight structure; 2. Backlight device;
[0031] 10. Substrate; 11. Wire copper layer; 12. Through window; 13. First reflective layer; 14. Elevated pad; 15. Light-emitting chip; 16. Protective adhesive layer; 17. Reflective film layer; 18. Gap; 19. Second reflective layer; 20. Carrying device;
[0032] 150. Electrode. [Specific implementation method]
[0033] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0034] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0035] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.
[0036] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.
[0037] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0038] Please refer to Figure 1 The LED backlight structure 1 provided by the first embodiment of the utility model includes a substrate 10, a plurality of copper wire layers 11 arranged on the substrate 10 at intervals, the interval area between two adjacent copper wire layers 11 is a through window 12, a first reflective layer 13 is arranged in the through window 12, and a raised pad 14 is respectively arranged on both sides of each copper wire layer 11 along the length direction, and the two raised pads 14 located on both sides of the through window 12 are also electrically connected to the surface of the substrate 10 away from the light-emitting chip 15; the raised pads 14 are arranged on the copper wire layers 11, and the vertical space of the through window 12 is increased without affecting the welding yield, so that the first reflective layer 13 with high reflectivity is conveniently arranged in the through window 12, so that the substrate 10 will not be exposed, and there will be no phenomenon of light absorption by the substrate 10. At the same time, the high reflectivity of the first reflective layer 13 will also allow the light emitted from the bottom of the light-emitting chip 15 to be reflected by the first reflective layer 13 and reused, thereby improving the overall brightness of the light board, and the higher the height of the reflective layer, the higher the reflectivity will be in theory, so as to achieve a backlight module with higher light efficiency.
[0039] For details, please refer to Figure 1 and Figure 2 The light emitting chip 15 is formed by welding the electrode 150 to the raised pad 14 to achieve electrical connection.
[0040] Optionally, the method for manufacturing the raised pad 14 includes but is not limited to: copper deposition process, copper plating process, screen printing process, steel mesh printing process, tin spraying process and other processes that can form a flat welding plane; the materials for manufacturing the raised pad 14 include but are not limited to: copper, silver, tin and other single metals or alloys that can form a stable conductive connection with the copper wire; the pad design size and shape can be arbitrarily changed; preferably, the pad design should be consistent with the chip design size.
[0041] Optionally, in some embodiments, the line copper layer 11 and the elevated pad 14 may be made of the same material and formed integrally.
[0042] Furthermore, please combine Figure 2 , the pad 14 is raised away from the vertical distance L between the surface of the substrate 10 and the substrate 10 (such as Figure 2 The L shown in FIG. 1 is greater than or equal to the vertical distance l between the surface of the first reflective layer 13 away from the substrate 10 and the substrate 10 (as shown in FIG. Figure 2 The pad 14 is raised above the first reflective layer 13 to ensure complete welding, good electrical connection and improved process stability.
[0043] Furthermore, the vertical distance L1 (eg, Figure 2 L1) shown in is 20-50um; setting a suitable height of the pad 14 also limits the height of the first reflective layer 13, so that the first reflective layer 13 has a higher reflectivity while preventing the overall backlight panel from reflecting too complicatedly due to an overly thick hierarchical structure, thereby improving the overall brightness of the light board.
[0044] Specifically, under the premise of the height of the first reflective layer 13 defined in this embodiment, if the thickness of the reflective layer is increased, the solder resist reflectivity can be improved, thereby improving the module brightness. At this time, this design can increase process stability.
[0045] For further information, please refer to Figure 1 and Figure 2 The surface of the copper layer 11 of the LED backlight structure 1 provided in the first embodiment of the present invention is further provided with a second reflective layer 19, and the plane where the surface of the second reflective layer 19 away from the substrate 10 is located is the same plane as the plane where the surface of the first reflective layer 13 away from the substrate 10 is located; the second reflective layer 19 is provided to more comprehensively and completely reflect the light emitted from the side of the light-emitting chip 15, so as to improve the overall brightness, and at the same time, the heights of the first reflective layer 13 and the second reflective layer 19 are roughly the same in order to balance the overall brightness after reflection, so as to make the light emission more uniform.
[0046] Optionally, the materials used to make the first reflective layer 13 and the second reflective layer 19 include but are not limited to: white oil, white film and other materials that can form a high-reflectivity solder resist layer; preferably, the reflectivity of the solder resist material should be 87-92% and must be higher than the reflectivity of the PCB substrate.
[0047] Optionally, the first reflective layer 13 and the second reflective layer 19 are not limited in size or shape except for their overall height.
[0048] For further information, please refer to Figure 2The plane where the surface of the first reflective layer 13 away from the substrate 10 is located, the plane where the surface of the elevated pad 14 away from the substrate 10 is located, and the plane where the surface of the light-emitting chip 15 close to the substrate 10 is located are parallel to each other; the plane of the elevated pad 14 is parallel to the light-emitting plane to ensure that the light-emitting chip 15 emits light perpendicular to the substrate and emits light more evenly. The plane of the first reflective layer 13 is parallel to the light-emitting chip 15 to reflect light more evenly and improve the uniform light effect.
[0049] For further information, please refer to Figure 1 and Figure 2 A gap 18 is left between the surface of the light emitting chip 15 close to the substrate 10 and the surface of the first reflective layer 13 away from the substrate 10; the first reflective layer 13 does not contact the bottom of the light emitting chip 15, thereby improving the welding yield and increasing the process stability.
[0050] For further information, please refer to Figure 1 A protective adhesive layer 16 is further provided on the side of the copper layer 11 away from the substrate 10 , and the protective adhesive layer 16 completely covers the light emitting chip 15 ; the protective adhesive layer 16 can protect the light emitting chip 15 while improving the uniform light display effect.
[0051] Optionally, the encapsulation colloid manufacturing process includes but is not limited to a molding process, a dispensing process, a laminating process, and other manufacturing processes that can form a complete plane.
[0052] Optionally, the protective adhesive layer 16 may be a transparent material layer, a semi-transparent material layer, a fluorescent adhesive layer, or a combination of several of the above materials; the above material selection is determined according to specific requirements and is not limited here.
[0053] Furthermore, a reflective film layer 17 is provided on a surface of the protective adhesive layer 16 away from the substrate 10 ; the reflective film layer 17 changes the light emitting chip 15 on the backlight module from point light emission to surface light emission.
[0054] Optionally, the manufacturing process of the reflective film layer 17 includes but is not limited to printing process, spraying process, deposition process, photolithography and development process and other processes that can form a reflective structure; the manufacturing materials include but are not limited to white oil, metal and other materials with light reflection function.
[0055] Furthermore, the center point of the reflective film layer 17 and the geometric center of the corresponding light-emitting chip 15 are on the same central axis, so as to ensure that the light transmitted by the reflective film layer 17 is surface light that diffuses outward from the center, and the brightness in the center is the highest, thereby improving the display effect.
[0056] Please refer to Figure 3The second embodiment of the utility model further provides a backlight device 2, including a carrying device 20 and the LED backlight structure 1 as described above, which is arranged on the carrying device 20; it has the same beneficial effects as the above-mentioned LED backlight structure 1, which will not be described in detail here.
[0057] Optionally, the backlight device 2 can be applied to 3C electronic products and their accessories such as mobile phones and mobile phone cases, or to the surface of home appliances, automobiles and other products, or to smart pens and smart wearable products; according to different application scenarios, the setting method and setting quantity of the LED backlight structure 1 on the supporting device 20 may not be limited.
[0058] Optionally, the LED backlight structure 1 provided by the present invention may also be used in various lighting fixtures and display devices, which is not limited here.
[0059] Compared with the prior art, the LED backlight structure and backlight device of the present invention have the following advantages:
[0060] 1. The LED backlight structure of the utility model includes a substrate, a plurality of copper wire layers arranged on the substrate at intervals, the interval area between two adjacent copper wire layers is a through window, a first reflective layer is arranged in the through window, and a raised pad is respectively arranged on both side edges along the length direction of each copper wire layer, and the two raised pads located on both sides of the through window are also electrically connected to the surface of the substrate away from the substrate; the raised pads are arranged on the copper wire layers, and the vertical space of the through window is increased without affecting the welding yield, so that the first reflective layer with high reflectivity is conveniently arranged in the through window, so that the substrate will not be exposed, and there will be no phenomenon of substrate absorption. At the same time, the high reflectivity of the first reflective layer will also allow the light emitted from the bottom of the light-emitting chip to be reflected by the first reflective layer and reused, thereby improving the overall brightness of the light board. In theory, the higher the height of the reflective layer, the higher the reflectivity will be, thereby realizing a backlight module with higher light efficiency.
[0061] 2. The vertical distance between the surface of the elevated pad away from the substrate and the substrate of the LED backlight structure of the present invention is greater than or equal to the vertical distance between the surface of the first reflective layer away from the substrate and the substrate; the elevated pad is higher than the first reflective layer to ensure complete welding, good electrical connection, and improve process stability.
[0062] 3. The vertical distance between the surface of the elevated pad away from the substrate and the surface of the copper layer away from the substrate of the LED backlight structure of the present invention is 20-50um; setting a suitable height of the elevated pad also limits the height of the first reflective layer, so that the first reflective layer has a higher reflectivity while preventing the overall backlight panel from reflecting too complicatedly due to an overly thick hierarchical structure, thereby improving the overall brightness of the light board.
[0063] 4. The surface of the copper layer of the LED backlight structure of the present invention is further provided with a second reflective layer away from the substrate, and the plane where the surface of the second reflective layer away from the substrate is located is the same plane as the plane where the surface of the first reflective layer away from the substrate is located; the second reflective layer is provided to more comprehensively and completely reflect the light emitted by the light-emitting chip in order to improve the overall brightness, and at the same time, the heights of the first reflective layer and the second reflective layer are roughly the same in order to balance the overall brightness after reflection, so that the light emission is more uniform.
[0064] 5. The plane where the surface of the first reflective layer of the LED backlight structure of the present invention is located away from the substrate, the plane where the surface of the elevated pad is located away from the substrate, and the plane where the surface of the light-emitting chip is located close to the substrate are parallel to each other; the plane of the elevated pad is parallel to the light-emitting plane to ensure that the light-emitting chip emits light perpendicular to the substrate and emits light more evenly, and the plane of the first reflective layer is parallel to the light-emitting chip to reflect light more evenly and improve the uniform light effect.
[0065] 6. A gap is left between the surface of the light-emitting chip close to the substrate and the surface of the first reflective layer away from the substrate in the LED backlight structure of the present invention; the first reflective layer does not contact the bottom of the light-emitting chip, thereby improving the welding yield and increasing the process stability.
[0066] 7. The copper layer of the LED backlight structure of the present invention is further provided with a protective adhesive layer on the side away from the substrate, and the protective adhesive layer completely covers the light-emitting chip; the protective adhesive layer can protect the light-emitting chip while improving the uniform light display effect.
[0067] 8. The protective adhesive layer of the LED backlight structure of the present invention is also provided with a reflective film layer on the side of the surface away from the substrate; the reflective film layer changes the light-emitting chip on the backlight module from point light emission to surface light emission.
[0068] 9. The center point of the reflective film layer of the LED backlight structure of the present invention and the geometric center of the corresponding light-emitting chip are on the same central axis; this is to ensure that the light transmitted through the reflective film layer is surface light that diffuses from the center to the outside, and the center brightness is the highest, thereby improving the display effect.
[0069] 10. The utility model also provides a backlight device, which has the same beneficial effects as the above-mentioned LED backlight structure, and will not be described in detail here.
[0070] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.
Claims
1. An LED backlight structure, characterized in that: The LED backlight structure includes a substrate, a plurality of copper wire layers arranged on the substrate at intervals, the interval area between two adjacent copper wire layers is a through window, a first reflective layer is arranged in the through window, and raised pads are respectively arranged on both side edges along the length direction of each copper wire layer, and the two raised pads located on both sides of the through window away from the surface of the substrate are also electrically connected to a light-emitting chip.
2. The LED backlight structure according to claim 1, characterized in that: A vertical distance between a surface of the elevated pad away from the substrate and the substrate is greater than or equal to a vertical distance between a surface of the first reflective layer away from the substrate and the substrate.
3. The LED backlight structure according to claim 1, characterized in that: The vertical distance between the surface of the elevated pad away from the substrate and the surface of the copper layer away from the substrate is 20-50 um.
4. The LED backlight structure according to claim 1, characterized in that: A second reflective layer is further disposed on the surface of the copper wire layer away from the substrate, and a plane where the surface of the second reflective layer away from the substrate is located is the same plane as a plane where the surface of the first reflective layer away from the substrate is located.
5. The LED backlight structure according to claim 1, characterized in that: The plane where the surface of the first reflective layer away from the substrate is located, the plane where the surface of the elevated pad away from the substrate is located, and the plane where the surface of the light emitting chip close to the substrate is located are parallel to each other.
6. The LED backlight structure according to claim 1, characterized in that: A gap is left between a surface of the light emitting chip close to the substrate and a surface of the first reflective layer away from the substrate.
7. The LED backlight structure according to claim 1, characterized in that: A protective adhesive layer is also provided on the side of the copper wire layer away from the substrate, and the protective adhesive layer completely covers the light-emitting chip.
8. The LED backlight structure according to claim 7, characterized in that: A reflective film layer is also provided on a surface of the protective adhesive layer away from the substrate.
9. The LED backlight structure according to claim 8, characterized in that: The center point of the reflective film layer and the geometric center of the corresponding light-emitting chip are located on the same central axis.
10. A backlight device, characterized in that: It comprises a carrying device and an LED backlight structure as claimed in any one of claims 1 to 9 arranged on the carrying device.