Display module and electronic equipment

Abstract

The utility model discloses a display module and electronic equipment. The display module comprises a display layer, a supporting layer and a circuit board which are sequentially stacked, the display layer comprises a display area, a non-display area and a bending area, the non-display area surrounds the display area, and the non-display area is connected with the circuit board through the bending area; the non-display area is provided with a first identifier for determining the relative position of the circuit board and the display layer; the first identification is located on the side, close to the supporting layer, of the non-display area, the supporting layer is provided with a through hole used for exposing the first identification, and the through hole is spaced from the peripheral face, away from the display area, of the non-display area. In the scheme, due to the fact that the through hole is spaced from the peripheral face of the non-display area, the supporting layer does not form a cantilever beam structure around the through hole, and the reliability of connection between the supporting layer and the display layer near the through hole can be improved. In the falling or warm stamping process of the display module, the display layer is not prone to generating black spots, and poor display is avoided.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and an electronic device. Background Art

[0002] During the display module manufacturing process, the display layer is connected to the circuit board, which is then stacked on a support layer. The connection area between the display layer and the circuit board needs to be folded so that the circuit board is flipped over to the side of the support layer facing away from the display layer. During this folding process, the circuit board must be precisely flipped to the desired position to prevent any negative impacts on the display module due to inaccurate positioning of the flipped circuit board.

[0003] A mark is provided on the display layer, and the relative position of the circuit board and the display layer after flipping can be determined through the mark. The supporting layer needs to be provided with a notch for revealing the mark. The mark is presented by utilizing the notch on the supporting layer to facilitate the position recognition device to grasp the position of the mark.

[0004] Currently, due to the setting of the notch on the support, the connection between the support layer and the display layer near the notch is not reliable, black spots are easily formed on the display layer, and the display layer is easily separated from the support layer. Utility Model Content

[0005] The embodiments of the present application provide a display module and an electronic device with a strong connection between a display layer and a support layer and high reliability.

[0006] In the first aspect, the present application provides a display module, which includes a display layer, a support layer and a circuit board stacked in sequence; the display layer includes a display area, a non-display area and a bending area, the non-display area surrounds the display area, and the non-display area is connected to the circuit board through the bending area; the non-display area has a first marker for determining the relative position of the circuit board and the display layer; the first marker is located on a side of the non-display area close to the supporting layer, and the supporting layer has a through hole for revealing the first marker, and the through hole is spaced from the outer peripheral surface of the non-display area away from the display area.

[0007] In this solution, because the through-hole is spaced from the outer periphery of the non-display area, the support layer does not form a cantilever beam structure around the through-hole, which helps improve the connection reliability between the support layer and the display layer near the through-hole. This also reduces the risk of black spots and display defects on the display layer during drops or temperature shocks.

[0008] In conjunction with the first aspect, in one feasible implementation, the minimum spacing between the inner wall of the through hole and the outer surface of the support layer is 0.15mm-0.3mm. This improves the strength of the support layer from the inner wall of the through hole to the outer surface of the support layer without increasing the area of the non-display area. The non-display area is a narrow border of the display layer, and the non-display area should not occupy too much area of the display layer. If the minimum spacing between the inner wall of the through hole and the outer surface of the support layer is too small (e.g., less than 0.15mm), the strength of the support layer between the inner wall of the through hole and the outer surface will be relatively low, making it prone to fracture. If the minimum distance between the inner wall of the through hole and the outer surface of the supporting layer is too large (such as greater than 0.3mm), the inner wall of the through hole in the supporting layer and part of the outer surface of the supporting layer need to cover the non-display area, and the distance from the display area to the outer surface of the non-display area also needs to be increased synchronously, which is bound to increase the area of the non-display area, making the ratio of the area of the display area to the area of the non-display area smaller. When the sum of the areas of the display area and the non-display area is constant, the area of the display area is reduced, which damages the display effect of the display module.

[0009] In combination with the first aspect, in a feasible implementation manner, an outer peripheral surface of the support layer close to the through hole has a protrusion extending in a direction away from the through hole.

[0010] In combination with the first aspect, in a feasible implementation, the through hole is one of circular, square, and elliptical.

[0011] In combination with the first aspect, in a feasible implementation, the through hole is filled with a transparent colloid, the transparent colloid connects the non-display area and the supporting layer, and the strength of the supporting layer near the through hole can be enhanced by the transparent colloid.

[0012] In combination with the first aspect, in a feasible implementation, the transparent colloid at least partially covers the side of the support layer away from the display layer to enhance the connection strength between the transparent colloid and the support layer, and further improve the structural strength of the support layer near the through hole.

[0013] In a second aspect, the present application provides a display module, comprising a display layer, a support layer, and a circuit board stacked in sequence;

[0014] The display layer includes a display area, a non-display area and a bending area. The non-display area surrounds the display area and is connected to the circuit board through the bending area. The outer peripheral surface of the non-display area is provided with an outward expansion area extending away from the display area. The supporting layer does not cover the outward expansion area. The outward expansion area has a first marker for determining the relative position of the circuit board and the display layer. The first marker is located on a side of the outward expansion area close to the supporting layer.

[0015] In this application, a first mark is set in the outward expansion area, and the outward expansion area extends from the outer peripheral surface of the non-display area in a direction away from the display area. The outward expansion area is not covered by the supporting layer, and the supporting layer does not need to be provided with a through hole to expose the first mark, thereby eliminating the hidden danger of reducing the connection strength between the supporting layer and the display layer due to the presence of the through hole.

[0016] In conjunction with the second aspect, in one feasible implementation, the outer periphery of the outer expansion area protrudes from the non-display area by a dimension of 0.3 mm to 0.5 mm, which facilitates forming the first mark in the outer expansion area while taking into account the strength requirements of the outer expansion area. The outer periphery of the outer expansion area protruding from the non-display area should not be too small. If the outer periphery of the outer expansion area protruding from the non-display area is too small (e.g., less than 0.33 mm), the process difficulty of forming the first mark in the outer expansion area will increase. If the outer periphery of the outer expansion area protrudes from the non-display area by a dimension too large (e.g., greater than 0.5 mm), the overall strength of the outer expansion area will be too low.

[0017] In combination with the second aspect, in a feasible implementation, the bending area protrudes from the outer peripheral surface of the non-display area, and the size of the outward expansion area protruding from the outer peripheral surface of the non-display area is less than or equal to the size of the bending area protruding from the outer peripheral surface of the non-display area.

[0018] In the third aspect, the present application provides a display module, which includes a display layer, a support layer and a circuit board stacked in sequence; the display layer includes a display area, a non-display area and a bending area, the non-display area surrounds the display area, and the non-display area is connected to the circuit board through the bending area; the non-display area has a first mark, and the support layer has a second mark on the side facing away from the display layer, and in the thickness direction of the display module, the projection of the first mark overlaps with the projection of the second mark, and the second mark is used to determine the relative position of the circuit board and the display layer.

[0019] In this solution, since the second mark overlapping the first mark is provided on the support layer, the support layer does not need to be provided with a through hole, thereby eliminating the negative impact on the connection strength between the display layer and the support layer caused by the presence of the through hole.

[0020] In a fourth aspect, the present application provides a display module, which includes a display layer, a support layer and a circuit board stacked in sequence; the display layer includes a display area, a non-display area and a bending area, the non-display area surrounds the display area, and the non-display area is connected to the circuit board through the bending area; the non-display area has a first mark for determining the relative position of the circuit board and the display layer; the first mark is located on the side of the non-display area close to the supporting layer, and the supporting layer has a through hole formed inwardly from the outer peripheral surface of the supporting layer, and the through hole is used to reveal the first mark, and the through hole is filled with a transparent colloid, and the transparent colloid connects the display layer and the supporting layer.

[0021] In this solution, transparent colloid is filled in the through hole so that the transparent colloid connects the display layer and the support layer, which can improve the connection reliability between the display layer and the support layer, thereby making it less likely for black spots to appear on the display layer and making it less likely for the display layer to separate from the support layer.

[0022] In combination with the fourth aspect, in a feasible implementation, the transparent colloid at least partially covers the side of the support layer away from the display layer to enhance the connection strength between the transparent colloid and the support layer, and further improve the structural strength of the support layer near the through hole.

[0023] In combination with the fourth aspect, in a feasible implementation, the transparent colloid is connected to the display layer along one side in the thickness direction of the display module, the transparent colloid spans the through hole, and both ends of the transparent colloid spanning the through hole cover the side of the supporting layer facing away from the display layer.

[0024] In this solution, both ends of the transparent colloid cover the support layer, so that the force applied to the transparent colloid and the support layer is more uniform when connected, which can reduce stress concentration and thus improve the connection reliability of the transparent colloid connecting the display layer and the support layer.

[0025] In a fifth aspect, the present application provides an electronic device, comprising a housing assembly and a display module as described in the first aspect, the second aspect, the third aspect or the fourth aspect, wherein the housing assembly is connected to the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A side view of a display module provided in one embodiment of the present application;

[0027] Figure 2 A bottom view of a connection between a display layer and a circuit board provided in one embodiment of the present application;

[0028] Figure 3 A bottom view of a display module provided in one embodiment of the present application;

[0029] Figure 4 A bottom view of another display module provided in one embodiment of the present application;

[0030] Figure 5 A bottom view of another display module provided in one embodiment of the present application;

[0031] Figure 6 A bottom view showing another connection between a display layer and a circuit board provided in an embodiment of the present application;

[0032] Figure 7 A bottom view of another display module provided in one embodiment of the present application;

[0033] Figure 8 A bottom view of another display module provided in one embodiment of the present application;

[0034] Figure 9 A bottom view of another display module provided by an embodiment of the present application.

[0035] Description of reference numerals:

[0036] 100, display layer; 110, display area; 120, non-display area; 130, bending area; 140, first identification; 150, expansion area; 200, support layer; 210, protrusion; 220, through hole; 230, transparent colloid; 240, second identification; 300, circuit board; 310, position mark. DETAILED DESCRIPTION

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0038] The present application provides an electronic device, comprising a housing assembly and a display module, wherein the display module is connected to the housing assembly. The electronic device may be a straight-screen mobile phone, a curved-screen mobile phone, or a foldable mobile phone.

[0039] Example 1

[0040] See Figure 1 The display module includes a display layer 100 (panel), a support layer 200 (Bracket, BKT), and a circuit board 300, which are stacked in sequence. The support layer 200 is located between the circuit board 300 and the display layer 100 and supports the display layer 100. The support layer 200 may be a bamboo book structure. The circuit board 300 may be a flexible printed circuit (FPC).

[0041] See Figure 2The display layer 100 includes a display area 110, a non-display area 120 and a bending area 130, and the non-display area 120 surrounds the display area 110. The display area 110 displays a picture when the pixels are lit, and the non-display area 120 does not display a picture. The non-display area 120 surrounds the display area 110, and the periphery of the display area 110 is connected to the inner periphery of the non-display area 120. The bending area 130 also does not display a picture. The bending area 130 is located on one side of the non-display area 120 and is connected to the non-display area 120. The non-display area 120 can be roughly rectangular, and the bending area 130 can be located on one side of the non-display area 120 in the length direction, or on one side of the non-display area 120 in the width direction. The display layer 100 can be a flexible screen, and the display layer 100 can be an organic light emitting diode (OLED), and the bending area 130 can be bent and deformed.

[0042] For ease of understanding, the length direction of the non-display area 120 is defined as the X-axis direction, and the width direction of the non-display area 120 is defined as the Y-axis direction.

[0043] Taking the bending area 130 located on one side of the non-display area 120 in the length direction as an example, the size of the bending area 130 along the Y-axis direction is smaller than the size of the non-display area 120 along the Y-axis direction, and the bending area 130 domain is connected between the two sides of the non-display area 120 along the Y-axis direction.

[0044] The non-display area 120 is connected to the circuit board 300 via the bending area 130. The non-display area 120 has a first marker 140 for determining the relative position of the circuit board 300 and the display layer 100. The first marker 140 is located at one end of the non-display area 120 closest to the bending area 130 and is spaced apart from the bending area 130 along the Y-axis. When the bending area 130 is bent to fold the circuit board 300 onto the side of the support layer 200 facing away from the display layer 100, the bending area 130 or the circuit board 300 does not obstruct the first marker 140 along the thickness of the display module.

[0045] See Figure 3 The first logo 140 is located on a side of the non-display area 120 close to the support layer 200. The support layer 200 has a through hole 220 for revealing the first logo 140. The through hole 220 is spaced apart from the outer peripheral surface of the non-display area 120 away from the display area 110. When the through hole 220 is provided on the support layer 200, the through hole 220 is formed directly opposite the first logo 140. The through hole 220 is used to reveal the first logo 140, so that the first logo 140 is not blocked by the support layer 200.

[0046] In the thickness direction of the display module, the outer peripheral surface of the supporting layer 200 is flush with the outer peripheral surface of the non-display layer 100. A through hole 220 is provided in the supporting layer 200 for exposing the first mark 140. The through hole 220 can expose the first mark 140. The first mark 140 can be presented in the through hole 220, which makes it convenient for the position identification device to grasp the first mark 140 and facilitate the accurate positioning of the circuit board 300.

[0047] In the embodiment provided herein, the circuit board 300 also has a position mark 310. After the circuit board 300 is folded to the side of the support layer 200 facing away from the display layer 100, the position recognition device obtains the location of the first marker 140 and the location of the position mark 310, thereby determining the deviation between the actual position of the circuit board 300 and the originally set position. Specifically, when comparing the location of the position mark 310 with the location of the first marker 140, the position recognition device can determine the distance Y1 between the position mark 310 and the first marker 140 in the Y-axis direction, and can also determine the distance X1 between the position mark 310 and the first marker 140 in the X-axis direction. Based on X1 and Y1, the position recognition device can determine whether the circuit board 300 has reached the originally set position after being folded.

[0048] It should be noted that two spaced-apart first identifiers 140 can be set in the non-display area 120, and two spaced-apart position marks 310 are set on the circuit board 300. The two first identifiers 140 correspond to the two position marks 310 respectively. The position identification device can accurately determine whether the circuit board 300 reaches the originally set position after flipping by comparing the positions of the two first identifiers 140 and the two position marks 310.

[0049] In the embodiment provided herein, since the through-hole 220 is spaced apart from the outer periphery of the non-display area 120, the support layer 200 does not form a cantilever beam structure around the through-hole 220, thereby improving the reliability of the connection between the support layer 200 and the display layer 100 near the through-hole 220. When the display module is dropped or subjected to temperature shock, the display layer 100 is less likely to produce black spots and display defects.

[0050] The minimum spacing between the inner wall of the through-hole 220 and the outer surface of the support layer 200 is 0.15 mm to 0.3 mm. This improves the strength of the support layer 200 between the inner wall of the through-hole 220 and the outer surface of the support layer 200 without increasing the area of the non-display area 120. It should be noted that the non-display area 120 is a narrow border of the display layer 100 and should not occupy too much area of the display layer 100. If the minimum spacing between the inner wall of the through-hole 220 and the outer surface of the support layer 200 is too small (e.g., less than 0.15 mm), the strength of the area of the support layer 200 between the inner wall of the through-hole 220 and the outer surface will be relatively low, making it prone to fracture. If the minimum distance between the inner wall of the through hole 220 and the outer surface of the supporting layer 200 is too large (such as greater than 0.3 mm), the inner wall of the through hole 220 in the supporting layer 200 and part of the outer surface of the supporting layer 200 need to cover the non-display area 120, and the distance from the display area 110 to the outer surface of the non-display area 120 also needs to be increased synchronously, which is bound to increase the area of the non-display area 120, making the ratio of the area of the display area 110 to the area of the non-display area 120 smaller. When the sum of the areas of the display area 110 and the non-display area 120 is constant, the area of the display area 110 is reduced, which damages the display effect of the display module.

[0051] See Figure 4 To increase the minimum distance between the inner wall of through-hole 220 and the outer circumference of support layer 200, the outer circumference of support layer 200 near through-hole 220 has a protrusion 210 extending away from through-hole 220. The provision of protrusion 210 enhances the structural strength of support layer 200, making the structure between the inner wall of through-hole 220 and the outer circumference of support layer 200 less susceptible to fracture. Through-hole 220 is one of circular, square, and elliptical shapes. Through-hole 220 can be any closed shape, and this application does not limit the specific shape of through-hole 220.

[0052] The bending area protrudes from the outer peripheral surface of the support layer 200 , and the size of the protrusion 210 protruding from the outer peripheral surface of the support layer 200 is smaller than the size of the bending area protruding from the outer peripheral surface of the support layer 200 .

[0053] After the bending zone 130 is folded, part of the bending zone 130 protrudes from the outer peripheral surface of the supporting layer 200. When the display module is installed on the shell assembly of the electronic device, the size of the shell assembly needs to be larger than the size of the supporting layer 200 to adapt to the structure of the bending zone 130 protruding from the supporting layer 200. If the size of the protrusion 210 protruding from the outer peripheral surface of the supporting layer 200 is larger than the size of the protrusion 210 of the bending zone 130 on the outer peripheral surface of the supporting layer 200, a larger shell assembly is required to adapt to the protrusion 210, which will reduce the space utilization of the shell assembly and damage the compactness of the electronic device.

[0054] See Figure 5The through hole 220 is filled with a transparent colloid 230, which connects the non-display area 120 and the support layer 200. The transparent colloid 230 can enhance the strength of the support layer 200 near the through hole 220. The transparent colloid 230 can be an ultraviolet curing glue (UV glue).

[0055] The transparent colloid 230 at least partially covers the side of the support layer 200 away from the display layer 100 to enhance the connection strength between the transparent colloid 230 and the support layer 200 and further improve the structural strength of the support layer 200 near the through hole 220 .

[0056] Example 2

[0057] See Figure 6 and Figure 7 The difference between this embodiment and embodiment 1 is that the outer peripheral surface of the non-display area 120 is provided with an expansion area 150 extending away from the display area 110, the support layer 200 does not cover the expansion area 150, and the expansion area 150 has a first mark 140 for determining the relative position of the circuit board 300 and the display layer 100; the first mark 140 is located on the side of the expansion area 150 close to the support layer 200.

[0058] Compared with Example 1, Example 2 does not have the through hole 220 in the support layer 200 of Example 2. This eliminates the potential risk of reducing the connection strength between the support layer 200 and the display layer 100 due to the presence of the through hole 220.

[0059] Since the support layer 200 does not cover the flared area 150, the device that can bend the bending area 130 can easily grasp the position of the first mark 140. The flared area 150 can be roughly semicircular. The outer circular flared area 150 structure can reduce stress concentration and improve the overall structural strength of the flared area 150.

[0060] The outer expansion area 150 protrudes from the outer periphery of the non-display area 120 by 0.3 mm to 0.5 mm, which facilitates the formation of the first mark 140 in the outer expansion area 150 while taking into account the strength requirements of the outer expansion area 150 .

[0061] The dimension of the outer peripheral surface of the expansion area 150 protruding from the non-display area 120 should not be too small. If the dimension of the outer peripheral surface of the expansion area 150 protruding from the non-display area 120 is too small (such as less than 0.33 mm), the process difficulty of forming the first mark 140 in the expansion area 150 will increase. If the dimension of the outer peripheral surface of the expansion area 150 protruding from the non-display area 120 is too large (such as greater than 0.5 mm), the overall strength of the expansion area 150 will be too low. When the display module is dropped or subjected to temperature shock, black spots are likely to appear on the display layer 100 near the expansion area 150, or the display layer 100 is likely to separate from the support layer 200 near the expansion area 150.

[0062] The bending region 130 protrudes from the outer periphery of the non-display region 120, and the outer expansion region 150 protrudes from the outer periphery of the non-display region 120 by a dimension that is less than or equal to the dimension of the protrusion 210 of the bending region 130 from the outer periphery of the non-display region 120. This allows the outer expansion region 150 to not occupy additional space in the housing assembly of the electronic device, wherein the display module is mounted in the housing assembly.

[0063] After the bending area 130 is folded, part of the bending area protrudes from the outer peripheral surface of the non-display area 120. When the display module is installed on the shell assembly of the electronic device, the size of the shell assembly needs to be larger than the size of the non-display layer 100 to adapt to the structure of the bending area protruding from the non-display area 120. If the size of the outward expansion area 150 protruding from the outer peripheral surface of the non-display area 120 is larger than the size of the protrusion 210 of the bending area 130 on the outer peripheral surface of the non-display area 120, a larger shell assembly is required to adapt to the outward expansion area 150, which will reduce the space utilization of the shell assembly and damage the compactness of the electronic device.

[0064] Example 3

[0065] In embodiment 3, the structure of the display layer can be the same as that of the display layer in embodiment 1, which can be seen in FIG. Figure 2 The non-display area 120 has a first marker 140, which can be set on the side of the non-display area 120 close to the supporting layer 200. The side of the supporting layer 200 facing away from the display layer 100 has a second marker 240. In the thickness direction of the display module, the projection of the first marker 140 overlaps with the projection of the second marker 240. The second marker 240 is used to determine the relative position of the circuit board 300 and the display layer 100.

[0066] See Figure 8 In the display module of Example 3, the through hole 220 set on the supporting layer 200 is cancelled, and a second mark 240 is set on the side of the supporting layer 200 facing away from the display layer 100. The position recognition device obtains the position of the first mark 140 by grasping the position of the second mark 240. The position recognition device can determine the relative position of the circuit board 300 and the display layer 100 based on the relative position of the first mark 140 and the circuit board 300.

[0067] Since the second mark 240 overlapping the first mark 140 is provided on the support layer 200 , the support layer 200 does not need to be provided with the through hole 220 , thereby eliminating the negative impact on the connection strength between the display layer 100 and the support layer 200 caused by the through hole 220 .

[0068] Specifically, the circuit board 300 also has a position mark 310. After the circuit board 300 is folded to the side of the support layer 200 facing away from the display layer 100, the position recognition device obtains the location of the second marker 240 and the location of the position mark 310, thereby determining the deviation between the actual position of the circuit board 300 and the originally set position. Specifically, when comparing the location of the position mark 310 with the location of the second marker 240, the position recognition device can determine the distance Y1 between the position mark 310 and the second marker 240 in the Y-axis direction, and can also determine the distance X1 between the position mark 310 and the second marker 240 in the X-axis direction. Because the projection of the second marker 240 and the projection of the first marker 140 overlap in the thickness direction of the display module, the distance Y1 between the position mark 310 and the first marker 140 in the Y-axis direction and the distance X1 between the position mark 310 and the first marker 140 in the X-axis direction can be obtained. Based on X1 and Y1, the position recognition device can determine whether the circuit board 300 has reached the originally set position after being folded.

[0069] It should be noted that the non-display area 120 may be provided with two first marks 140 spaced apart from each other, and the support layer 200 is provided with two second marks 240 corresponding to the two first marks 140 respectively.

[0070] Two spaced-apart position marks 310 are provided on the circuit board 300, and the two second identifiers 240 correspond to the two position marks 310 respectively. The position identification device obtains the relative positions of the two first identifiers 140 and the two position marks 310 by comparing the positions of the two second identifiers 240 and the two position marks 310, and can further accurately determine whether the circuit board 300 reaches the originally set position after being flipped.

[0071] Example 4

[0072] In embodiment 4, the structure of the display layer may be the same as that of the display layer in embodiment 1, as can be seen in FIG. Figure 2 , the first mark 140 is located on a side of the non-display area 120 close to the supporting layer 200 .

[0073] See Figure 9 The support layer 200 has a through hole 220 formed inwardly from the outer peripheral surface of the support layer 200 . The through hole 220 is used to reveal the first logo 140 . The through hole 220 is filled with a transparent colloid 230 . The transparent colloid 230 connects the display layer 100 and the support layer 200 .

[0074] In this embodiment, the through hole 220 can be easily processed and formed. In Example 1, since it is necessary to provide a through hole 220 that is closed on all sides on the support layer 200, it is necessary to consider the minimum size of the inner wall of the through hole 220 and the outer peripheral surface of the support layer 200 during processing. If the minimum size of the inner wall of the through hole 220 and the outer peripheral surface of the support layer 200 is too small, the structure between the inner wall of the through hole 220 and the outer peripheral surface of the support layer 200 in the support layer 200 is easily broken, and thus the processing is more difficult.

[0075] In the embodiment, since the through hole 220 is not a closed-circumference pattern, the difficulty of processing and forming the through hole 220 is greatly reduced. In this embodiment, the through hole 220 is filled with a transparent colloid 230, so that the transparent colloid 230 connects the display layer 100 and the support layer, which can improve the connection reliability between the display layer 100 and the support layer, thereby reducing the occurrence of black spots on the display layer 100 and preventing the display layer 100 from separating from the support layer 200.

[0076] The transparent colloid 230 at least partially covers the side of the support layer 200 away from the display layer 100 to enhance the connection strength between the transparent colloid 230 and the support layer 200 and further improve the structural strength of the support layer 200 near the through hole 220 .

[0077] In the present application, the transparent colloid 230 is connected to the display layer 100 along one side of the display module in the thickness direction. The transparent colloid 230 spans the through-hole 220, and both ends of the transparent colloid 230 spanning the through-hole 220 cover the side of the support layer 200 facing away from the display layer 100. Both ends of the transparent colloid 230 cover the support layer 200, making the force applied to the transparent colloid 230 and the support layer 200 more uniform, reducing stress concentration, and thereby improving the reliability of the connection between the transparent colloid 230 and the display layer 100 and the support layer 200. For example, in which the support layer 200 is recessed in the X-axis direction from the outer peripheral surface of the support layer 200 to form the through-hole 220, the two ends of the transparent colloid 230 extending along the Y-axis respectively cover the support layer 200, and the transparent colloid 230 at least blocks the opening of the through-hole 220. By using the transparent colloid 230 to block the opening of the through hole 220 , the connection reliability between the support layer 200 and the display layer 100 can be improved.

[0078] The through hole 220 may be semicircular, square, or the like. In the Y-axis direction, the size of the transparent colloid 230 covering the support layer 200 at one end may be 0.1 mm to 0.3 mm, and the size of the transparent colloid 230 covering the support layer 200 at the other end may be 0.1 mm to 0.3 mm. If the size of the transparent colloid 230 covering the support layer 200 at both ends is too small (less than 0.1 mm), the connection reliability between the transparent colloid 230 and the support layer 200 may be difficult to ensure, and the transparent colloid 230 may easily fall off the support layer 200. If the size of the transparent colloid 230 covering the support layer 200 at both ends is too small (greater than 0.3 mm), it may be more difficult to evenly cover the transparent colloid 230 on the support layer 200.

[0079] It should be understood that expressions such as "include" and "may include" used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "include" and / or "have" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components, or combinations thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0080] In addition, in this application, the expression "and / or" includes any and all combinations of the associated listed words. For example, the expression "A and / or B" may include A, may include B, or may include both A and B.

[0081] In this application, expressions including ordinal numbers such as "first" and "second" may modify various elements. However, such elements are not limited by the above expressions. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used to distinguish one element from other elements. For example, a first user device and a second user device indicate different user devices, even though the first user device and the second user device are both user devices. Similarly, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0082] When a component is referred to as being "connected" or "accessed" to another component, it should be understood that the component is not only directly connected to or accessed to the other component, but also that another component may exist between the component and the other component. On the other hand, when a component is referred to as being "directly connected to" or "directly accessed" to another component, it should be understood that no component exists between them.

[0083] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A display module, characterized in that: It includes a display layer, a support layer and a circuit board stacked in sequence; The display layer includes a display area, a non-display area, and a bending area, wherein the non-display area surrounds the display area and is connected to the circuit board via the bending area; the non-display area has a first mark for determining the relative position of the circuit board and the display layer; The first mark is located on a side of the non-display area close to the supporting layer. The supporting layer has a through hole for exposing the first mark. The through hole is spaced apart from an outer peripheral surface of the non-display area away from the display area.

2. The display module according to claim 1, wherein: The minimum distance between the inner wall of the through hole and the outer peripheral surface of the support layer is 0.15 mm to 0.3 mm.

3. The display module according to claim 1 or 2, wherein: An outer peripheral surface of the support layer close to the through hole has a protrusion extending in a direction away from the through hole.

4. The display module according to claim 1, wherein: The through hole is in a shape of a circle, a square or an ellipse.

5. The display module according to claim 1, wherein: The through hole is filled with a transparent colloid, and the transparent colloid connects the non-display area and the supporting layer.

6. The display module according to claim 5, wherein: The transparent colloid at least partially covers a side of the supporting layer away from the display layer.

7. A display module, characterized in that: It includes a display layer, a support layer and a circuit board stacked in sequence; The display layer includes a display area, a non-display area and a bending area. The non-display area surrounds the display area and is connected to the circuit board through the bending area. The outer peripheral surface of the non-display area is provided with an outward expansion area extending away from the display area. The supporting layer does not cover the outward expansion area. The outward expansion area has a first marker for determining the relative position of the circuit board and the display layer. The first marker is located on a side of the outward expansion area close to the supporting layer.

8. The display module according to claim 7, wherein: The outer periphery of the expanded area protruding from the non-display area has a size of 0.3 mm to 0.5 mm.

9. The display module according to claim 7 or 8, wherein: The bending area protrudes from the outer peripheral surface of the non-display area, and a dimension of the outward expansion area protruding from the outer peripheral surface of the non-display area is less than or equal to a dimension of the bending area protruding from the outer peripheral surface of the non-display area.

10. A display module, characterized in that: It includes a display layer, a support layer and a circuit board stacked in sequence; The display layer includes a display area, a non-display area and a bending area, the non-display area surrounds the display area, and the non-display area is connected to the circuit board through the bending area; The non-display area has a first mark, and the support layer has a second mark on the side facing away from the display layer. In the thickness direction of the display module, the projection of the first mark overlaps with the projection of the second mark, and the second mark is used to determine the relative position of the circuit board and the display layer.

11. A display module, characterized in that: It includes a display layer, a support layer and a circuit board stacked in sequence; The display layer includes a display area, a non-display area, and a bending area, wherein the non-display area surrounds the display area and is connected to the circuit board via the bending area; the non-display area has a first mark for determining the relative position of the circuit board and the display layer; The first logo is located on a side of the non-display area close to the supporting layer. The supporting layer has a through hole formed inwardly from the outer peripheral surface of the supporting layer. The through hole is used to reveal the first logo. The through hole is filled with a transparent colloid, and the transparent colloid connects the display layer and the supporting layer.

12. The display module according to claim 11, wherein: The transparent colloid at least partially covers a side of the supporting layer away from the display layer.

13. The display module according to claim 11, wherein: The transparent colloid is connected to the display layer along one side of the display module in the thickness direction, spans the through hole, and both ends of the transparent colloid spanning the through hole cover the side of the support layer facing away from the display layer.

14. An electronic device, characterized in that: It comprises a shell component and a display module according to any one of claims 1 to 13, wherein the shell component is connected to the display module.

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