Battery module controller and battery pack

Abstract

The utility model relates to the technical field of electric vehicles, in particular to a battery module controller and a battery pack. The battery module controller comprises a flexible circuit board and a battery cell monitoring controller; the battery cell monitoring controller comprises a printed circuit board and an analog front-end chip integrated on the printed circuit board; the flexible circuit board is connected with the printed circuit board, and the flexible circuit board is used for collecting temperature information and voltage information of the battery module and transmitting the collected temperature information and voltage information to the analog front-end chip for processing through the printed circuit board. According to the battery module controller and the battery pack, the problems that in a CMC system layout in an existing scheme, the whole CMC occupies a large space, the surface utilization rate of a PCB is not high, production waste is too much, and the weight of the PCB is large are solved.

Description

Technical Field

[0001] This application relates to the field of electric vehicle technology, and in particular to a battery module controller and battery pack. Background Technology

[0002] The CMC (Cell Module Controller) is a crucial component of the battery management system, capable of collecting data on individual lithium-ion battery cell voltages, module temperature, and performing basic equalization functions. Current CMC solutions integrate an AFE (Analog Front End) chip. The CMC processes the collected voltage and temperature signals through the AFE chip before outputting them to the BMU (Battery Management Unit). Currently, highly integrated module structures are a trend in commercial vehicle applications, which improves battery pack space utilization and energy density. However, this inevitably presents challenges to CMC layout, including space constraints and high costs, especially for large-scale, highly integrated module structures.

[0003] The mainstream layout for current CMC (Content Management Console) systems involves placing a CMC, almost the same size as the module, on top of the entire module. The 4-layer PCB (Printed Circuit Board) itself is 2mm thick. Considering the height of connectors and components on the PCB surface, the overall height of the CMC is approximately 10mm. However, this approach results in a large CMC footprint, which cannot meet the requirements of highly integrated modules. Furthermore, this approach often leads to low PCB surface utilization, excessive production waste, and the PCB's weight is significant. During vibration testing and long-term vehicle operation, localized stress concentration may cause damage to the PCB and its surface components, posing a considerable risk. Utility Model Content

[0004] The purpose of this application is to provide a battery module controller and battery pack, thereby solving the problems of large space occupied by the entire CMC in the existing CMC system layout, low PCB surface utilization, excessive production waste, and large PCB weight.

[0005] According to a first aspect of this application, a battery module controller is provided, the battery module controller including a flexible circuit board and a cell monitoring controller; the cell monitoring controller includes a printed circuit board and an analog front-end chip integrated on the printed circuit board; the flexible circuit board is connected to the printed circuit board, the flexible circuit board is used to collect temperature information and voltage information of the battery module, and transmit the collected temperature information and voltage information to the analog front-end chip for processing via the printed circuit board.

[0006] In any of the above technical solutions, the flexible circuit board further includes a flexible board body, multiple module thermistors, and multiple connecting pieces; the flexible board body is provided with a temperature acquisition line and a voltage acquisition line, the multiple module thermistors are connected to the temperature acquisition line to acquire the temperature information of the battery module; the multiple connecting pieces are connected to the voltage acquisition line to acquire the voltage information of the battery module.

[0007] In any of the above technical solutions, the plurality of module thermistors and the plurality of connecting pieces are further disposed on the edge of the flexible plate body.

[0008] In any of the above technical solutions, the flexible circuit board further includes a plurality of flexible cantilever arms, which are arranged along the edge of the flexible board body; the plurality of module thermistors correspond one-to-one with the plurality of flexible cantilever arms, and the plurality of module thermistors are respectively arranged on the plurality of flexible cantilever arms.

[0009] In any of the above technical solutions, the flexible circuit board further includes a plurality of flexible cantilever arms, which are arranged along the edge of the flexible board body; the plurality of connecting pieces correspond one-to-one with the plurality of flexible cantilever arms, and the plurality of connecting pieces are respectively arranged on the plurality of flexible cantilever arms.

[0010] In any of the above technical solutions, the cell monitoring controller further includes an onboard thermistor integrated on the printed circuit board, which is used to collect temperature information of the printed circuit board.

[0011] In any of the above technical solutions, the flexible plate body further includes a length direction, and the flexible plate body has a plurality of spaced through holes along the length direction.

[0012] In any of the above technical solutions, the flexible board body and the printed circuit board are further connected by a connector.

[0013] According to a second aspect of this application, a battery pack is provided, including a battery module controller as described above.

[0014] In any of the above technical solutions, the battery pack further includes the battery module; the plurality of module thermistors are all connected to the battery module to collect temperature information at different locations of the battery module; the plurality of connecting pieces are respectively connected to the plurality of cells of the battery module to collect voltage information of the plurality of cells respectively.

[0015] In any of the above technical solutions, the battery pack further includes two busbars; the multiple cells of the battery module are connected by the two busbars, the two busbars are respectively disposed on both sides of the flexible plate body, and the multiple connecting pieces are respectively welded to the two busbars.

[0016] In any of the above technical solutions, the battery pack further includes an isolation plate; the isolation plate is disposed between the battery module and the flexible circuit board; the cell monitoring controller is fixed to the isolation plate by screws, and the cell monitoring controller is disposed on the side of the flexible circuit board opposite to the isolation plate.

[0017] The battery module controller (CMC structure) of this application includes a flexible circuit board and a cell monitoring controller (CSC). The cell monitoring controller includes a printed circuit board and an analog front-end chip (AFE chip) integrated on the printed circuit board. The flexible circuit board is connected to the printed circuit board and can collect temperature and voltage information of the battery module. The collected temperature and voltage information is transmitted to the analog front-end chip for processing via the printed circuit board.

[0018] Based on the above technical features, the beneficial effects of this application are as follows:

[0019] This application replaces the existing CMC (Cell Monitoring and Control System) which is composed of a single PCB board with a layout combining a flexible printed circuit board (FPC) and a cell monitoring and control system (CSC). This application arranges the acquisition circuitry for collecting temperature and voltage information from the battery module on the flexible printed circuit board, thus reducing the thickness of the CMC. Furthermore, by replacing the printed circuit board with a flexible printed circuit board for the temperature and voltage information acquisition circuitry, the thickness of the flexible printed circuit board can also be reduced due to its characteristics. Therefore, compared to the existing CMC composed of a single PCB board, this application's layout combining FPC and CSC occupies less space and meets the requirements of highly integrated modules. In addition, compared to the existing PCB, the FPC in this application has lower manufacturing costs, produces less waste, and is lighter, more vibration-resistant, and less prone to damage, thus improving the stability of the entire system.

[0020] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the structure of a battery module controller according to an embodiment of this application is shown;

[0023] Figure 2 A schematic diagram of the structure of a cell monitoring controller according to an embodiment of this application is shown;

[0024] Figure 3 A schematic diagram of the structure of a flexible circuit board according to an embodiment of this application is shown.

[0025] Icons: 100-Flexible circuit board; 110-Flexible board body; 120-Module thermistor; 130-Connecting piece; 140-Through hole; 150-First connector; 160-Flexible cantilever; 200-Cell monitoring controller; 210-Printed circuit board; 220-Daisy connector; 230-Onboard thermistor; 240-Mounting hole; 250-Second connector; 300-Isolation plate; L-Length direction. Detailed Implementation

[0026] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0027] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.

[0028] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.

[0029] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0030] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0031] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.

[0032] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0033] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0034] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.

[0035] Prior to this application, the mainstream layout of existing CMC systems involved placing a CMC, almost the same size as the module, on top of the entire module. The 4-layer PCB itself is 2mm thick, and considering the height of connectors and components on the PCB surface, the overall CMC height is approximately 10mm. However, this approach results in a large CMC footprint, which cannot meet the requirements of highly integrated modules. Furthermore, this approach often leads to low PCB surface utilization, excessive production waste, and a heavy PCB itself. During vibration testing and long-term vehicle operation, localized stress concentration may cause damage to the PCB and its surface components, posing a significant risk.

[0036] In view of this, the first aspect of this application provides a battery module controller, thereby solving the technical problems existing in the CMC system layout of the prior art. See below for reference. Figures 1 to 3 This application describes a battery module controller according to some embodiments.

[0037] like Figure 1 As shown, the battery module controller (CMC) of this application includes a flexible circuit board 100 and a cell supervisory controller (CSC). The cell supervisory controller 200 includes a printed circuit board 210 and an analog front-end chip (AFE chip) integrated on the printed circuit board 210. The flexible circuit board 100 is connected to the printed circuit board 210. The flexible circuit board 100 can collect the temperature and voltage information of the battery module and transmit the collected temperature and voltage information to the analog front-end chip for processing via the printed circuit board 210.

[0038] This application replaces the existing CMC (cell monitoring and controller) which is composed of a single PCB board with a layout combining a flexible printed circuit board (FPC) 100 and a cell monitoring and controller (CSC). This application arranges the acquisition circuitry for collecting temperature and voltage information of the battery module on the flexible printed circuit board 100, thus reducing the thickness of the cell monitoring and controller 200 (printed circuit board 210). Furthermore, by replacing the printed circuit board 210 with the flexible printed circuit board 100, the thickness of the flexible printed circuit board 100 can also be reduced due to its characteristics. Therefore, compared to the existing CMC composed of a single PCB board, the layout of this application using an FPC and CSC combination occupies less space and can meet the requirements of highly integrated modules. In addition, compared to the PCB in the prior art, the FPC in this application has lower manufacturing costs, less production waste, and is lighter, more vibration-resistant, and less prone to damage, thus improving the stability of the entire system.

[0039] In the embodiments of this application, such as Figure 1 and Figure 3 As shown, the flexible circuit board 100 includes a flexible board body 110, multiple module thermistors 120, and multiple connecting pieces 130. The flexible board body 110 is provided with temperature acquisition lines and voltage acquisition lines. The multiple module thermistors 120 are connected to the temperature acquisition lines to acquire temperature information of the battery module; the multiple connecting pieces 130 are connected to the voltage acquisition lines to acquire voltage information of the battery module.

[0040] In this embodiment, the number and position of multiple module thermistors 120 (NTC) and multiple connecting pieces 130 (e.g., nickel plates) can be designed according to the actual battery module.

[0041] For example, the number and position of multiple module thermistors 120 can be designed according to the actual temperature field distribution inside the battery module. When the battery module controller is installed, the multiple module thermistors 120 of the battery module controller should be in close contact with the aluminum shell surface of the battery cell to collect temperature information at different locations of the battery module. Figure 1 and Figure 3 An example of 10 module thermistors 120 is illustrated. These 10 module thermistors 120 can be distributed on the surface of a battery module composed of 18 strings of cells, enabling accurate monitoring of the surface temperature of the battery module and facilitating thermal management and thermal runaway control of the battery module.

[0042] For example, the number and position of the multiple connecting pieces 130 can be designed according to the distribution of multiple cells in the actual battery module. When the battery module controller is installed, the multiple connecting pieces 130 of the battery module controller should be used to connect to the multiple cells of the battery module respectively, so as to collect the voltage information of the multiple cells respectively. Figure 1 and Figure 3 An example of 18 connecting pieces 130 is shown. The 18 connecting pieces 130 can be connected to 18 strings of battery cells respectively (each connecting piece 130 is connected to the positive and negative terminals of the battery cell) to realize the acquisition of battery cell voltage signals.

[0043] In the embodiments of this application, preferably, such as Figure 1 and Figure 3 As shown, multiple module thermistors 120 and multiple connecting pieces 130 are all disposed on the edge of the flexible plate body 110. This facilitates the connection of the multiple module thermistors 120 and multiple connecting pieces 130 to the battery module.

[0044] In the embodiments of this application, further, as shown... Figure 1 and Figure 3 As shown, the flexible circuit board 100 also includes multiple flexible cantilever arms 160, which are arranged along the edge of the flexible board body 110. Multiple module thermistors 120 correspond one-to-one with the multiple flexible cantilever arms 160, and are respectively disposed on the multiple flexible cantilever arms 160. In this embodiment, the flexible board body 110 and the multiple flexible cantilever arms 160 can be formed into an integral structure. The flexible cantilever arm 160 structure can effectively counteract the expansion force generated by the battery cell during use, thus protecting the flexible circuit board 100.

[0045] Similarly, the flexible circuit board 100 may also include multiple flexible cantilever arms for mounting the connecting pieces 130, and these flexible cantilever arms are also disposed along the edge of the flexible board body 110 (not shown in the figure). Each connecting piece 130 corresponds one-to-one with a flexible cantilever arm, and the connecting pieces 130 are respectively disposed on the flexible cantilever arms. In this embodiment, the flexible board body 110 and the multiple flexible cantilever arms can be formed as an integral structure. The flexible cantilever structure can reduce stress concentration at the welding points of the connecting pieces 130, protecting the flexible circuit board 100 from tearing.

[0046] In addition, it is worth mentioning that the existing technology involves soldering the entire PCB to the battery module (bus) with nickel strips, which has the drawback of being non-removable. Once the CMC is damaged, the entire battery module often needs to be discarded.

[0047] In view of this, in order to solve the above-mentioned technical problems, in the embodiments of this application, such as Figure 2 As shown, a second connector 250 is provided on one side of the printed circuit board 210. (As indicated...) Figure 3As shown, a first connector 150 is provided on one side of the flexible board body 110. Figure 1 As shown, the flexible board body 110 and the printed circuit board 210 are connected by a connector.

[0048] When the battery controller of this application is connected and installed with the battery module, the connecting piece 130 on the edge of the flexible board body 110 is soldered to the battery module (bus). The printed circuit board 210 is only connected to the flexible board body 110 via a connector. In this way, when the printed circuit board 210 is damaged (the flexible board body 110 is generally not damaged), the printed circuit board 210 can be directly disassembled, avoiding the difficulty of having to discard the entire battery module after the printed circuit board 210 is damaged, and greatly reducing costs.

[0049] In this embodiment, both the printed circuit board 210 and the flexible board body 110 have a thickness direction, and the printed circuit board 210 and the flexible board body 110 are connected in the thickness direction by a connector. This layout occupies little space and can meet the requirements of highly integrated modules.

[0050] In the embodiments of this application, further, as shown... Figure 1 As shown, the cell monitoring controller 200 also includes an onboard thermistor 230 integrated on the printed circuit board 210. The onboard thermistor 230 is used to collect the temperature information of the printed circuit board 210 itself, and can accurately monitor the temperature of the printed circuit board 210 itself.

[0051] A battery pack is provided according to a second aspect of this application, including a battery module controller as described above. In embodiments of this application, the battery pack further includes a battery module, an isolation plate 300, and two busbars.

[0052] like Figure 1 As shown, the separator 300 is disposed between the battery module and the flexible circuit board 100, and the cell monitoring controller 200 is fixed to the separator 300 by screws. Figure 1 The mounting holes 240 for screw installation are shown, and the cell monitoring controller 200 is located on the side of the flexible circuit board 100 away from the isolation plate 300. Multiple cells of the battery module are connected by two busbars (busbars are not shown in the figure). The two busbars are respectively located on opposite sides of the flexible board body 110 along the length direction L. Multiple connecting pieces 130 are divided into two groups. The two groups of connecting pieces 130 are respectively located on opposite sides of the flexible board body 110 along the length direction L. The two groups of connecting pieces 130 are respectively welded to the two busbars.

[0053] During the manufacturing and installation of the battery module controller in this application: upon receiving the entire flexible circuit board 100, a through hole 140 is pre-punched in the middle of the flexible board body 110 (as an example, multiple spaced through holes are pre-punched along the length L of the flexible board body). This provides space for the explosion-proof valve to vent, reducing damage caused by heat diffusion. Multiple connecting pieces 130 are laser-welded to two busbars, allowing the flexible circuit board 100 to be stably fixed on the isolation plate 300 and to acquire the cell voltage signal. The cell monitoring controller 200 is fixed to the isolation plate 300 with screws and pressed against the upper end of the flexible circuit board 100. This layout occupies little space and meets the requirements of highly integrated modules. Moreover, when the cell monitoring controller 200 is damaged, it can be directly disassembled without damaging the entire battery module. Compared with existing technologies, this avoids the difficulty of discarding the entire battery module after CMC damage, greatly reducing costs.

[0054] In embodiments of this application, the battery pack further includes a battery management unit (BMU). For example... Figure 1 As shown, the cell monitoring controller 200 also includes a daisy-chain connector 220 integrated on the printed circuit board 210. The analog front-end chip processes the received temperature and voltage information and outputs it to the battery management unit for processing via the daisy-chain connector 220.

[0055] Specifically, multiple module thermistors 120 and multiple connecting pieces 130 collect temperature / voltage signals, which are then transmitted through the temperature / voltage acquisition lines of the flexible board body 110, via the first connector 150 and the second connector 250, and finally converged on the printed circuit board 210 of the cell monitoring controller 200. After A / D conversion and filtering by the analog front-end chip, the signals are output to the battery management unit via the daisy-chain connector 220. When the cell voltage difference is large, the cell monitoring controller 200 can also support passive balancing, converting excess electrical energy in the cell into heat energy through balancing resistors, ultimately improving cell consistency.

[0056] In summary, this application replaces the existing CMC (cell monitoring and controller) which is composed of a single PCB board with a layout combining a flexible printed circuit board 100 (FPC) and a cell monitoring and controller 200 (CSC). This application arranges the acquisition circuitry for collecting temperature and voltage information of the battery module on the flexible printed circuit board 100, thus reducing the thickness of the cell monitoring and controller 200 (printed circuit board 210). Furthermore, by replacing the printed circuit board 210 with the flexible printed circuit board 100, the thickness of the flexible printed circuit board 100 can also be reduced due to its characteristics. Therefore, the layout combining FPC and CSC in this application occupies less space compared to the existing CMC composed of a single PCB board, meeting the requirements of highly integrated modules. In addition, the FPC in this application has lower manufacturing costs and less production waste compared to the PCB in the prior art. Moreover, the FPC itself is lightweight, has stronger vibration resistance, reduces stress concentration at the solder joint between the PCB board and the nickel sheet, lowers the risk of nickel sheet breakage, and improves the stability of the entire system.

[0057] In summary, this application transmits the voltage / temperature signals collected by the FPC to the AFE chip on the CSC via a board-to-board connector. After signal processing, the signals are output to the BMU. The CMC of this application can perform basic functions such as equalization, collecting cell voltage and battery module temperature, and can communicate normally with the BMU. Ultimately, the CMC, composed of a thin and light FPC and a CSC with connectors, improves the stability of the entire system, reduces system costs, and enables multiple disassemblies of the CSC, avoiding the difficulty of discarding the entire module after CSC damage.

[0058] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the scope of the technology disclosed in this application, or make equivalent substitutions for some of the technical features. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application.

Claims

1. A battery module controller, characterized in that, The battery module controller includes a flexible circuit board (100) and a cell monitoring controller (200); The cell monitoring controller (200) includes a printed circuit board (210) and an analog front-end chip integrated on the printed circuit board (210); The flexible circuit board (100) is connected to the printed circuit board (210). The flexible circuit board (100) is used to collect temperature and voltage information of the battery module and transmit the collected temperature and voltage information to the analog front-end chip for processing via the printed circuit board (210).

2. The battery module controller according to claim 1, characterized in that, The flexible circuit board (100) includes a flexible board body (110), multiple module thermistors (120) and multiple connecting pieces (130); The flexible plate body (110) is provided with temperature acquisition lines and voltage acquisition lines. The multiple module thermistors (120) are connected to the temperature acquisition lines to collect the temperature information of the battery module. The plurality of connecting pieces (130) are connected to the voltage acquisition line for acquiring the voltage information of the battery module.

3. The battery module controller according to claim 2, characterized in that, The plurality of module thermistors (120) and the plurality of connecting pieces (130) are all disposed on the edge of the flexible plate body (110).

4. The battery module controller according to claim 2, characterized in that, The flexible circuit board (100) also includes a plurality of flexible cantilever arms (160), which are arranged along the edge of the flexible board body (110); The plurality of module thermistors (120) correspond one-to-one with the plurality of flexible cantilever arms (160), and the plurality of module thermistors (120) are respectively disposed on the plurality of flexible cantilever arms (160).

5. The battery module controller according to claim 2, characterized in that, The flexible circuit board (100) also includes a plurality of flexible cantilever arms (160), which are arranged along the edge of the flexible board body (110); The plurality of connecting pieces (130) correspond one-to-one with the plurality of flexible cantilever (160), and the plurality of connecting pieces (130) are respectively disposed on the plurality of flexible cantilever (160).

6. The battery module controller according to claim 2, characterized in that, The cell monitoring controller (200) also includes an onboard thermistor (230) integrated on the printed circuit board (210), which is used to collect temperature information of the printed circuit board (210).

7. The battery module controller according to claim 2, characterized in that, The flexible plate body (110) has a length direction (L), and the flexible plate body (110) has a plurality of spaced through holes (140) along the length direction (L).

8. The battery module controller according to claim 2, characterized in that, The flexible board body (110) and the printed circuit board (210) are connected by a connector.

9. A battery pack, characterized in that, Includes the battery module controller as described in any one of claims 2-8; The battery pack also includes the battery module; The multiple module thermistors (120) are all connected to the battery module to collect temperature information at different locations of the battery module; the multiple connecting pieces (130) are respectively connected to multiple cells of the battery module to collect voltage information of the multiple cells respectively.

10. The battery pack according to claim 9, characterized in that, The battery pack also includes two busbars; The multiple cells of the battery module are connected by two busbars, which are respectively disposed on both sides of the flexible plate body (110), and the multiple connecting pieces (130) are respectively welded to the two busbars.

11. The battery pack according to claim 9, characterized in that, The battery pack also includes an isolation plate (300); The isolation plate (300) is disposed between the battery module and the flexible circuit board (100); the cell monitoring controller (200) is fixed to the isolation plate (300) by screws, and the cell monitoring controller (200) is disposed on the side of the flexible circuit board (100) opposite to the isolation plate (300).

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