Packaging structure and electronic equipment
By designing staggered sound holes and airflow channels in the microphone packaging structure, the damage of strong airflow to the MEMS chip diaphragm is reduced, improving the microphone's lifespan and low-frequency sound capture capability, making it suitable for scenarios requiring airflow resistance.
CN224290062UActive Publication Date: 2026-05-26GOERTEK MICROELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202520879883.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-06
- Publication Date
- 2026-05-26
- Estimated Expiration
- 2035-05-06
AI Technical Summary
Technical Problem
In strong airflow environments, the diaphragm of MEMS chips is easily damaged by the direct action of airflow, resulting in a reduced lifespan for microphone products.
Method used
Design a packaging structure in which a first acoustic hole and a second acoustic hole are set on the substrate and are staggered, and an airflow channel is connected between the two inside the substrate, so that the airflow passes through the airflow channel before reaching the diaphragm of the MEMS chip. The airflow intensity is reduced by the design of the airflow channel.
Benefits of technology
It reduces the risk of diaphragm rupture, increases the lifespan of microphone products, and enhances the ability to capture low-frequency sound signals and temperature sensitivity.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model discloses a packaging structure and electronic equipment. The packaging structure comprises a substrate and an MEMS (Micro Electro Mechanical System) chip, the substrate is provided with a first surface and a second surface which are opposite to each other, the first surface and the second surface are respectively provided with a first sound hole and a second sound hole which are staggered from each other, and an airflow channel communicated with the first sound hole and the second sound hole is arranged in the substrate; the projection of the airflow channel on the first surface exceeds the outer edge of the first sound hole, and / or the projection of the airflow channel on the second surface exceeds the outer edge of the second sound hole. The MEMS chip is arranged on the first surface of the substrate, and a vibrating diaphragm of the MEMS chip is opposite to the first sound hole.
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