Wafer thinning patch device for preventing crack pieces

Abstract

The utility model discloses a kind of wafer thinning patch devices of anti-splitting piece, comprising: positioning fixture, its top surface central position is set positioning groove, wafer is embedded and adhered in positioning groove;Lower pressing seat, it is driven to lift and is arranged above positioning fixture, its bottom array is set several suction cups, suction cup is positioned in lifting inner plate, lifting inner plate is slidably sealed and arranged in the bottom of movable cavity opened in lower pressing seat bottom, the bottom edge of movable cavity is set and extends to the limiting boss of lifting inner plate inner side, movable cavity is communicated first joint by communicating port, and first joint is connected with the gas supply end of external gas supply mechanism. The utility model can solve the problem that wafer is prone to side shift when existing patch device presses wafer, which leads to collision and friction between wafer and pressing structure, substrate, and the pressing force of pressing structure directly pressing wafer cannot be stably controlled, so that wafer is prone to splitting.

Description

Technical Field

[0001] This utility model relates to the field of chip mounting device technology, specifically a chip mounting device for wafer thinning to prevent chip cracking. Background Technology

[0002] In wafer thinning and other processing steps, wafers need to be bonded to a substrate using a chip mounting process to ensure proper positioning and stable processing quality. During the chip mounting process, the wafer is bonded to a glass or ceramic substrate of a certain thickness using an adhesive to facilitate the thinning process. During this process, the wafer needs to be pressed down to ensure it is fully adhered to the adhesive.

[0003] In existing chip mounting devices, when pressing down on the wafer, factors such as the flow of adhesive can cause the wafer to shift laterally, resulting in collisions and friction between the wafer and the pressing structure and the substrate. Furthermore, the pressing structure directly presses down on the wafer, making it difficult to control the pressure, which can easily cause the wafer to crack. Utility Model Content

[0004] The purpose of this invention is to provide a wafer thinning device that prevents wafer cracking by addressing the problems of wafer displacement during wafer pressing in existing chip mounting devices, which leads to collisions and friction between the wafer and the pressing structure and the substrate, and the inability to stably control the pressure on the wafer when the pressing structure directly presses it down.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: a wafer thinning and bonding device for anti-crack wafers, comprising:

[0006] A positioning fixture has a positioning groove in the center of its top surface, and a wafer is embedded and bonded in the positioning groove.

[0007] The lower pressure seat is driven to rise and is positioned above the positioning fixture. Several suction cups are arranged in an array at its bottom. The suction cups are positioned on the lifting inner plate. The lifting inner plate is slidably and sealed at the bottom of the movable cavity opened at the bottom of the lower pressure seat. The bottom edge of the movable cavity is provided with a limiting boss extending to the inner side of the lifting inner plate. The movable cavity is connected to the first connector through a communication port. The first connector is connected to the air supply end of the external air supply mechanism.

[0008] As a further description of the above technical solution:

[0009] The lower pressure seat is connected to the drive mechanism, which includes a bracket, a positioning seat, and a lifting drive device. The bracket is positioned on the side of the positioning fixture, and the positioning seat is arranged on it. The lifting drive device is installed on the positioning seat, and its telescopic shaft is connected to the lower pressure seat.

[0010] As a further description of the above technical solution:

[0011] The sidewall of the movable cavity extends vertically and is provided with several guide bars at circumferential intervals. The notches on the side of the lifting inner plate are tightly joined and slidably connected to the guide bars.

[0012] As a further description of the above technical solution:

[0013] The side of the active cavity extends into a first exhaust channel, the outer end of which is connected to a pressure relief valve, which is located within the countersunk structure on the bottom surface of the lower pressure seat.

[0014] As a further description of the above technical solution:

[0015] The positioning fixture is provided with a flow passage on the outside of the positioning groove. The flow passage is connected to the second connector through the second exhaust passage. The second connector is connected to the return end of the air supply mechanism.

[0016] As a further description of the above technical solution:

[0017] Several heating devices are arranged inside the flow channel.

[0018] In summary, by adopting the above technical solution, this utility model has the following advantages over the prior art:

[0019] Beneficial effects:

[0020] 1. The chip mounting device of this utility model uses a suction cup to adsorb and limit the wafer, preventing it from shifting laterally and being squeezed by the positioning groove when it is pressed down. When the pressing seat presses down, the lifting inner plate moves up along the movable cavity, and the air pressure in the movable cavity increases, so that the downward pressure on the wafer gradually increases. This achieves docking buffering and stable change of downward pressure, avoiding damage to the wafer and causing it to crack. Moreover, the wafer surface is subjected to uniform force, ensuring the flatness of the chip mounting.

[0021] 2. The heating equipment heats the adhesive used for bonding the wafers in the positioning slot to quickly set it. When the inner lifting plate rises, the air pressure in the first exhaust channel is greater than the threshold set by the pressure relief valve, so that the airflow is sprayed from the pressure relief valve to the flow channel, thus ensuring the uniformity of the internal temperature distribution, so as to ensure the bonding and setting of the adhesive and wafers in the positioning slot and the bonding efficiency of the wafers. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of a wafer thinning device for preventing cracking.

[0024] Figure 2 This is a partial cross-sectional view of a wafer thinning and patching device for preventing cracking.

[0025] Figure 3 This is a diagram showing the usage status of the positioning fixture and the lower pressure seat in a wafer thinning device for preventing cracking.

[0026] Legend:

[0027] 1. Positioning fixture; 2. Positioning groove; 3. Lower pressure seat; 4. Suction cup; 5. Lifting inner plate; 6. Movable cavity; 7. Limiting boss; 8. Connecting port; 9. First connector; 10. Bracket; 11. Positioning seat; 12. Lifting drive device; 13. Guide bar; 14. First exhaust channel; 15. Countersunk structure; 16. Pressure relief valve; 17. Flow channel; 18. Heating device; 19. Second exhaust channel; 20. Second connector; 100. Wafer. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0029] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0030] Please see Figure 1-3 This utility model provides a technical solution: a wafer thinning and bonding device for anti-crack wafers, comprising:

[0031] Positioning fixture 1, with a positioning groove 2 provided in the center of its top surface, into which wafer 100 is embedded and bonded;

[0032] The lower pressure seat 3, driven to rise and fall, is positioned above the positioning fixture 1. Several suction cups 4 are arrayed at its bottom, positioned on the lifting inner plate 5. The lifting inner plate 5 is slidably and sealingly disposed at the bottom of the movable cavity 6 opened at the bottom of the lower pressure seat 3. A limiting protrusion 7 extending to the inner side of the lifting inner plate 5 is provided at the bottom edge of the movable cavity 6. The movable cavity 6 is connected to a first connector 9 via a connecting port 8. The first connector 9 is connected to the air supply end of an external air supply mechanism. The air supply mechanism is existing technology and includes an air pump and a pressure regulator. Parameters are set via the pressure regulator. During operation, the air pump pressurizes air and pumps it into the movable cavity 6 to create positive pressure. The specific structure of the air supply mechanism will not be described in detail here.

[0033] The lower pressure seat 3 is connected to the drive mechanism, which includes a bracket 10, a positioning seat 11, and a lifting drive device 12. The bracket 10 is positioned on the side of the positioning fixture 1, and the positioning seat 11 is arranged on it. The lifting drive device 12 is installed on the positioning seat 11, and its telescopic shaft is connected to the lower pressure seat 3. The lifting drive device 12 can be an electric cylinder, a pneumatic cylinder, a hydraulic cylinder, or other drive devices.

[0034] The sidewall of the movable cavity 6 extends vertically and is provided with several guide bars 13 spaced circumferentially. The notches on the side of the lifting inner plate 5 are tightly joined and slidably connected to the guide bars 13. This improves the stability of the lifting movement of the lifting inner plate 5.

[0035] The movable cavity 6 has a first exhaust channel 14 extending from its side. The outer end of the first exhaust channel 14 connects to a pressure relief valve 16, which is located within the countersunk structure 15 on the bottom surface of the lower pressure seat 3. The positioning fixture 1 has a flow channel 17 on the outside of the positioning groove 2. The flow channel 17 connects to a second connector 20 via a second exhaust channel 19. The second connector 20 connects to the return end of the air supply mechanism. Several heating devices 18 are arranged within the flow channel 17. The pressure relief valve 16 is a prior art solenoid valve. By setting a pressure threshold, when the pressure in the first exhaust channel 14 exceeds the threshold, airflow will be ejected from the pressure relief valve 16 and flow into the flow channel 17. The heating devices 18 are also prior art and will not be described in detail here.

[0036] The working principle of the wafer thinning device for anti-crack wafers in this embodiment includes: During use, the wafer 100 is initially bonded to the positioning groove 2; the air supply mechanism presses against the movable cavity 6, causing the lifting inner plate 5 to be pushed onto the limiting boss 7; the drive mechanism drives the lower pressure seat 3 to press against the wafer 100; the suction cup 4 adsorbs and limits it, preventing lateral displacement and compression with the positioning groove 2 during downward pressure; the lifting inner plate 5 moves upward along the movable cavity 6, increasing the air pressure inside the movable cavity 6, thus gradually increasing the downward pressure on the wafer 100, thereby achieving… The current connection buffer and downward pressure change smoothly to avoid damage to wafer 100, and the force on the wafer 100 board surface is uniform to ensure the flatness of its mounting. The heating device 18 heats the adhesive in the positioning groove 2 to quickly set it. When the lifting inner board 5 rises, the air pressure in the first exhaust channel 14 is greater than the threshold set by the pressure relief valve 16, so that the airflow is sprayed from the pressure relief valve 16 to the flow channel 17, thus ensuring the uniformity of the internal temperature distribution, so as to ensure the bonding and setting efficiency of the adhesive in the positioning groove 2 and the wafer 100, and the mounting efficiency. Specifically, as follows: Figure 3 As shown in the figure, the arrows indicate the direction of internal airflow or the movement direction of the lifting inner plate 5 during device use. After the chip is mounted, the lower pressure seat 3 moves upward, and the suction cup 4 detaches from the wafer 100, allowing for subsequent processing.

[0037] In summary, due to the adoption of the above technical solution, the wafer thinning and mounting device for anti-crack wafers in this embodiment has the following advantages compared with the prior art:

[0038] 1. The chip mounting device of this utility model uses a suction cup to adsorb and limit the wafer, preventing it from shifting laterally and being squeezed by the positioning groove when it is pressed down. When the pressing seat presses down, the lifting inner plate moves up along the movable cavity, and the air pressure in the movable cavity increases, so that the downward pressure on the wafer gradually increases. This achieves docking buffering and stable change of downward pressure, avoiding damage to the wafer and causing it to crack. Moreover, the wafer surface is subjected to uniform force, ensuring the flatness of the chip mounting.

[0039] 2. The heating equipment heats the adhesive used for bonding the wafers in the positioning slot to quickly set it. When the inner lifting plate rises, the air pressure in the first exhaust channel is greater than the threshold set by the pressure relief valve, so that the airflow is sprayed from the pressure relief valve to the flow channel, thus ensuring the uniformity of the internal temperature distribution, so as to ensure the bonding and setting of the adhesive and wafers in the positioning slot and the bonding efficiency of the wafers.

[0040] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A wafer thinning and mounting device for anti-crack wafers, characterized in that, include: A positioning fixture has a positioning groove in the center of its top surface, and a wafer is embedded and bonded in the positioning groove. The lower pressure seat is driven to rise and is positioned above the positioning fixture. Several suction cups are arranged in an array at its bottom. The suction cups are positioned on the lifting inner plate. The lifting inner plate is slidably and sealed at the bottom of the movable cavity opened at the bottom of the lower pressure seat. The bottom edge of the movable cavity is provided with a limiting boss extending to the inner side of the lifting inner plate. The movable cavity is connected to the first connector through a communication port. The first connector is connected to the air supply end of the external air supply mechanism. The sidewall of the movable cavity extends vertically and is provided with several guide bars at circumferential intervals. The notches on the side of the lifting inner plate are tightly joined and slidably connected to the guide bars.

2. The wafer thinning device for anti-crack wafers according to claim 1, characterized in that, The lower pressure seat is connected to the drive mechanism, which includes a bracket, a positioning seat, and a lifting drive device. The bracket is positioned on the side of the positioning fixture, and the positioning seat is arranged on it. The lifting drive device is installed on the positioning seat, and its telescopic shaft is connected to the lower pressure seat.

3. The wafer thinning device for anti-crack wafers according to claim 1, characterized in that, The side of the active cavity extends into a first exhaust channel, the outer end of which is connected to a pressure relief valve, which is located within the countersunk structure on the bottom surface of the lower pressure seat.

4. The wafer thinning device for anti-crack wafers according to claim 1, characterized in that, The positioning fixture is provided with a flow passage on the outside of the positioning groove. The flow passage is connected to the second connector through the second exhaust passage. The second connector is connected to the return end of the air supply mechanism.

5. The wafer thinning device for anti-crack wafers according to claim 4, characterized in that, Several heating devices are arranged inside the flow channel.

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