PCB acid etching waste liquid recycling device
By treating PCB acidic etching solution with electrolysis and electrodeposition technology, the problems of high cost and low efficiency of existing equipment are solved, and the efficient recycling of etching solution and copper recovery are realized, thereby reducing operating costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 昆山华拓环保科技有限公司
- Filing Date
- 2025-06-27
- Publication Date
- 2026-07-10
AI Technical Summary
Existing PCB acid etching solution recovery devices generally adopt chemical recovery and recycling technology, which results in high operating costs and low electrolysis efficiency in some equipment, affecting the effective recovery of copper.
Electrolysis and electrodeposition technologies are employed. The etching solution is treated in an electrolysis chamber and an electrodeposition chamber. Copper ions are reduced by electrolysis using an electrolysis cathode and an anode, and excess copper ions are recovered using an electrodeposition cathode and an anode. Combined with a servo motor-driven rotating frame and a scraper to remove deposits, the copper recovery efficiency is improved.
This reduces operating costs, ensures the reuse of etching solution and the recovery of copper, improves electrolysis efficiency, and achieves efficient recycling of etching solution.
Smart Images

Figure CN224478146U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of etching solution recycling technology, specifically to a PCB acid etching waste liquid recycling device. Background Technology
[0002] Acid etching is a critical step in PCB manufacturing, using acidic solutions to remove unwanted copper foil. Etching wastewater contains copper ions and etchant, and must be properly treated to reduce environmental pollution. Treatment methods include electrolysis, chemical precipitation, and ion exchange, which can recover valuable metals.
[0003] Currently, the etching solution recycling devices widely used in the market generally tend to adopt a chemical recycling technology path, which requires the input of a large amount of chemical reagents during operation, resulting in a significant increase in operating costs. At the same time, due to the limitations of the technology or equipment itself, the efficiency of the electrolysis process of some devices is not ideal, which directly affects the effective recovery of copper by the device. Therefore, this utility model proposes a PCB acid etching waste liquid recycling device to solve the above problems. Utility Model Content
[0004] To address the aforementioned technical problems, a PCB acid etching waste liquid recycling device is provided. This technical solution solves the problem mentioned in the background art. Currently widely used etching liquid recycling devices on the market generally tend to adopt a chemical recycling technology path, which requires the input of a large amount of chemical reagents during operation, resulting in a significant increase in operating costs. At the same time, due to the limitations of the technology or equipment itself, the efficiency of the electrolysis process of some devices is not ideal, which directly affects the effective recovery of copper by the device.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0006] A PCB acid etching waste liquid recycling device includes a buffer tank. An electrolysis chamber and an electrodeposition chamber are fixedly connected to the lower surface of the buffer tank. A delivery pump is fixedly installed on the left side of the electrodeposition chamber. The input end of the delivery pump is connected to a drain pipe and passes through the interior of the electrolysis chamber. The output end of the delivery pump is connected to a delivery pipe and passes through the interior of the electrodeposition chamber. Multiple servo motors are fixedly installed on the lower inner wall of the buffer tank. The output end of each servo motor passes through the interior of the buffer tank and is fixedly connected to a rotating frame. Electrodeposition cathodes are rotatably connected to the upper and lower sides of the inner wall of the rotating frame. A support shaft is rotatably connected to the bottom end of the rotating frame. The upper and lower ends of the support shaft are fixedly connected to the bottom end of the electrodeposition cathode and the upper side of the inner wall of the electrodeposition chamber, respectively. A scraper is fixedly connected to the inner wall of the rotating frame and is disposed on the outer surface of the electrodeposition cathode.
[0007] Preferably, a cover plate is fixedly connected to the upper side of the buffer box, and an input pump is fixedly installed on the upper surface of the cover plate.
[0008] Preferably, the output end of the input pump is connected to a delivery pipe that extends through the inside of the cover plate, and a servo pump is fixedly installed on the left side of the electrolysis chamber.
[0009] Preferably, the input end of the servo pump is connected to an input pipe that extends through the interior of the buffer box, and a filter head is fitted onto the left end of the input pipe.
[0010] Preferably, the output end of the servo pump is connected to an output pipe that extends through the interior of the electrolysis chamber, and multiple fixed supports are fixedly connected inside the electrolysis chamber.
[0011] Preferably, the outer surfaces of the plurality of fixed supports are respectively provided with electrolytic cathodes and electrolytic anodes, and the interior of the electrolysis chamber is provided with a cation permeation membrane.
[0012] Preferably, a filter head is sleeved on the right end of the drainage tube, and multiple fixed supports are fixedly connected to the rear side of the inner wall of the electrodeposition chamber, with electrodeposition anodes provided on the inner walls of the multiple fixed supports.
[0013] Preferably, a filter plate is fixedly connected to the left side of the inner wall of the buffer box, and a partition is fixedly connected to the bottom end of the filter plate.
[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0015] In this invention, the oxidizing power of copper ions is reduced by electrolysis to ensure that the etching solution can continue to be used. Then, excess copper ions in the etching solution are recovered by electrodeposition cathode and electrodeposition anode. This process ensures the effectiveness of the etching solution while recovering copper ions, reducing costs, and thus ensuring that the etching solution can be reused while reducing costs and increasing efficiency. Attached Figure Description
[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0017] Figure 2 This is a schematic diagram of the internal structure of the buffer box in this utility model;
[0018] Figure 3 This is a schematic diagram of the internal structure of the electrolysis chamber in this utility model;
[0019] Figure 4 This is a schematic diagram of the internal structure of the electrodeposition chamber in this utility model;
[0020] Figure 5 This is an exploded view of the rotating frame in this utility model.
[0021] The numbers on the map are:
[0022] 1. Buffer tank; 2. Cover plate; 3. Electrolysis chamber; 4. Electrodeposition chamber; 5. Input pump; 6. Delivery pipe; 7. Filter plate; 8. Support shaft; 9. Partition plate; 10. Servo pump; 11. Input pipe; 12. Output pipe; 13. Electrolysis cathode; 14. Electrolysis anode; 15. Fixed bracket; 16. Drainage pipe; 17. Delivery pump; 18. Infusion pipe; 19. Filter head; 20. Electrodeposition anode; 21. Servo motor; 22. Rotating frame; 23. Electrodeposition cathode; 24. Scraper; 25. Cation permeation membrane. Detailed Implementation
[0023] The following description is intended to disclose the present invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.
[0024] Reference Figures 1-5 As shown, a PCB acid etching waste liquid recycling device includes a buffer tank 1. An electrolysis chamber 3 and an electrodeposition chamber 4 are fixedly connected to the lower surface of the buffer tank 1. A delivery pump 17 is fixedly installed on the left side of the electrodeposition chamber 4. The input end of the delivery pump 17 is connected to a drain pipe 16 and passes through the interior of the electrolysis chamber 3. The output end of the delivery pump 17 is connected to a delivery pipe 18 and passes through the interior of the electrodeposition chamber 4. Multiple servo motors 21 are fixedly installed on the lower side of the inner wall of the buffer tank 1. The output end of each servo motor 21 passes through the interior of the buffer tank 1 and is fixedly connected to a rotating frame 22. Electrodeposition cathodes 23 are rotatably connected to the upper and lower sides of the inner wall of the rotating frame 22. A support shaft 8 is rotatably connected to the bottom end of the rotating frame 22. The upper and lower ends of the support shaft 8 are fixedly connected to the bottom end of the electrodeposition cathode 23 and the upper side of the inner wall of the electrodeposition chamber 4, respectively. A scraper 24 is fixedly connected to the inner wall of the rotating frame 22 and is disposed on the outer surface of the electrodeposition cathode 23.
[0025] Specifically, liquid is drawn from the inside of the electrolysis chamber 3 through the delivery pump 17 and the drainage pipe 16, and then sent into the inside of the electrodeposition chamber 4 through the liquid delivery pipe 18. Excess copper ions in the liquid are ionized and recovered by the electrodeposition cathode 23 and electrodeposition anode 20 inside the electrodeposition chamber 4. At the same time, the rotating frame 22 outside the electrodeposition cathode 23 is rotated by the servo motor 21 installed inside the buffer tank 1. The rotating frame 22 is supported by the lower support shaft 8 and the electrodeposition cathode 23 is fixed to prevent the electrodeposition cathode 23 from rotating along with the scraper 24 when scraping off the deposits on the surface of the electrodeposition cathode 23. This causes the multiple scrapers 24 inside the rotating frame 22 to rotate around the outer wall of the electrodeposition cathode 23, thereby scraping off the copper attached to the outer surface of the electrodeposition cathode 23. This ensures the efficiency of the electrodeposition cathode 23 and allows for copper recovery. Liquid containing copper particles is drawn out through a pipe installed on one side for easy copper recovery and recycling of the etching solution, thereby saving materials.
[0026] Reference Figures 1-3 As shown, a cover plate 2 is fixedly connected to the upper side of the buffer tank 1, and an input pump 5 is fixedly installed on the upper surface of the cover plate 2. The output end of the input pump 5 is connected to a delivery pipe 6 and passes through the inside of the cover plate 2. A servo pump 10 is fixedly installed on the left side of the electrolysis chamber 3. The input end of the servo pump 10 is connected to an input pipe 11 and passes through the inside of the buffer tank 1. A filter head 19 is sleeved on the left end of the input pipe 11. The output end of the servo pump 10 is connected to an output pipe 12 and passes through the inside of the electrolysis chamber 3. Multiple fixed supports 15 are fixedly connected inside the electrolysis chamber 3. Electrolytic cathodes 13 and electrolytic anodes 14 are respectively provided on the outer surfaces of the multiple fixed supports 15. A cation permeation membrane 25 is provided inside the electrolysis chamber 3. A filter head 19 is sleeved on the right end of the drainage pipe 16. Multiple fixed supports 15 are fixedly connected to the rear side of the inner wall of the electrodeposition chamber 4. Electrodeposition anodes 20 are provided on the inner walls of the multiple fixed supports 15. A filter plate 7 is fixedly connected to the left side of the inner wall of the buffer tank 1. A partition plate 9 is fixedly connected to the bottom end of the filter plate 7.
[0027] Specifically, the buffer tank 1 is sealed by the cover plate 2, which simultaneously supports the operation of the upper input pump 5. The input pump 5 transports the waste liquid, and the waste liquid undergoes preliminary filtration through the internal filter plate 7 to ensure that impurities do not damage the waste liquid during subsequent treatment and affect efficiency. Simultaneously, the liquid precipitates in the buffer tank 1. Then, the precipitate is extracted from the buffer tank 1 by the servo pump 10 installed on one side of the electrolysis chamber 3 through the input pipe 11. The precipitate is then filtered again through the filter head 19 at the front end of the input pipe 11, and finally sent into the electrolysis chamber 3 through the output pipe 12. Meanwhile, the solids inside the electrolysis chamber 3... A fixed cation permeation membrane 25 divides the electrolysis chamber 3 into an anode chamber and a cathode chamber. Liquid is sent into the anode chamber through the output pipe 12. Then, the liquid is electrolyzed by the electrolytic anode 14 fixed inside the anode chamber and the electrolytic cathode 13 fixed inside the cathode chamber by the fixed support 15, thereby restoring the oxidation capacity of copper ions and allowing the etching solution to continue to be used. At the same time, the cation permeation membrane 25 can block the anode chamber from the cathode chamber, preventing copper ions from entering the cathode chamber, while allowing hydrogen ions to enter the cathode chamber, generate hydrogen gas through electrolysis, and lead it out through the pipe, thereby ensuring that the etching solution can be recycled.
[0028] Working principle: During use, the position of the device can be easily adjusted by the trolley on the lower side. At the same time, the etched waste liquid pipeline is connected to the input end of the input pump 5. The waste liquid is sent into the buffer tank 1 through the input pump 5. The waste liquid is initially filtered and settled through the filter plate 7 to remove impurities in the waste liquid.
[0029] Subsequently, the precipitate inside the buffer tank 1 is extracted through the servo pump 10 and the input pipe 11. At the same time, the liquid is filtered again through the filter head 19 installed on the input pipe 11, so as to minimize the impact of impurities in the liquid on electrolysis and prevent impurities from clogging the cation permeation membrane 25. The electrolysis chamber 3 is divided into an anode chamber and a cathode chamber through the cation permeation membrane 25. The liquid is sent into the anode chamber through the output pipe 12. The copper oxide in the liquid is electrolyzed and regenerated through the electrolytic anode 14 inside the anode chamber, thereby restoring the oxidation etching ability of the etching solution. The cation permeation membrane 25 installed in the middle of the electrolysis chamber 3 blocks the copper ions in the anode chamber while allowing hydrogen ions to move, thereby restoring the etching ability of the etching solution.
[0030] After electrolysis, the liquid is pumped out by the delivery pump 17 and filtered again by the filter head 19 installed on the drainage pipe 16. Then, it is sent into the interior of the electrodeposition chamber 4 through the delivery pipe 18. Then, the electrodeposition cathode 23 and electrodeposition anode 20 inside the electrodeposition chamber 4 operate to recover excess copper ions in the liquid, thereby recovering copper while ensuring the effect of the etching solution.
[0031] The rotating frame 22 is driven to rotate by the servo motor 21 at the upper end of the rotating frame 22. At the same time, the copper generated by electrolysis on the surface of the electrodeposited cathode 23 is scraped off by the scraper 24 installed on the rotating frame 22. While recovering the copper, the contact area between the electrodeposited cathode 23 and the liquid can be ensured, thereby ensuring the electrolysis efficiency. Then, the etching solution is discharged through the pipeline for chemical treatment to further improve the effect of the etching solution.
[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A PCB acid etching waste liquid recycling device, characterized in that, The system includes a buffer tank (1), on the lower surface of which an electrolysis chamber (3) and an electrodeposition chamber (4) are fixedly connected. A delivery pump (17) is fixedly installed on the left side of the electrodeposition chamber (4). The input end of the delivery pump (17) is connected to a drain pipe (16) and extends through the interior of the electrolysis chamber (3). The output end of the delivery pump (17) is connected to a delivery pipe (18) and extends through the interior of the electrodeposition chamber (4). Multiple servo motors (21) are fixedly installed on the lower inner wall of the buffer tank (1). Each servo motor (21) has an output... The outlet is connected through the inside of the buffer box (1) and fixedly connected to a rotating frame (22). The upper and lower sides of the inner wall of the rotating frame (22) are rotatably connected to the electrodeposition cathode (23). The bottom end of the rotating frame (22) is rotatably connected to a support shaft (8). The upper and lower ends of the support shaft (8) are respectively fixedly connected to the bottom end of the electrodeposition cathode (23) and the upper side of the inner wall of the electrodeposition chamber (4). The inner wall of the rotating frame (22) is fixedly connected to a scraper (24), and the scraper (24) is disposed on the outer surface of the electrodeposition cathode (23).
2. The PCB acid etching waste liquid recycling device according to claim 1, characterized in that: A cover plate (2) is fixedly connected to the upper side of the buffer box (1), and an input pump (5) is fixedly installed on the upper surface of the cover plate (2).
3. The PCB acid etching waste liquid recycling device according to claim 2, characterized in that: The output end of the input pump (5) is connected to the delivery pipe (6) and passes through the inside of the cover plate (2). A servo pump (10) is fixedly installed on the left side of the electrolysis chamber (3).
4. The PCB acid etching waste liquid recycling device according to claim 3, characterized in that: The input end of the servo pump (10) is connected to an input pipe (11) and is connected through the inside of the buffer box (1). A filter head (19) is sleeved on the left end of the input pipe (11).
5. The PCB acid etching waste liquid recycling device according to claim 4, characterized in that: The output end of the servo pump (10) is connected to an output pipe (12) and passes through the interior of the electrolysis chamber (3). Multiple fixed supports (15) are fixedly connected inside the electrolysis chamber (3).
6. The PCB acid etching waste liquid recycling device according to claim 5, characterized in that: The outer surfaces of the plurality of fixed supports (15) are respectively provided with electrolytic cathodes (13) and electrolytic anodes (14), and the interior of the electrolysis chamber (3) is provided with a cation permeation membrane (25).
7. The PCB acid etching waste liquid recycling device according to claim 6, characterized in that: The right end of the drainage tube (16) is fitted with a filter head (19), and multiple fixed supports (15) are fixedly connected to the rear side of the inner wall of the electrodeposition chamber (4). The inner walls of the multiple fixed supports (15) are provided with electrodeposition anodes (20).
8. The PCB acid etching waste liquid recycling device according to claim 1, characterized in that: A filter plate (7) is fixedly connected to the left side of the inner wall of the buffer box (1), and a partition plate (9) is fixedly connected to the bottom end of the filter plate (7).