A whole piece device and automatic loading and unloading machine
By combining positioning wheels and pressure sensors in the wafer assembly, the problem of precise control of clamping force in traditional wafer assemblies is solved, enabling stable silicon wafer transport and efficient production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TONGWEI SOLAR (PENGSHAN) CO LTD
- Filing Date
- 2025-07-02
- Publication Date
- 2026-07-24
AI Technical Summary
Traditional wafer clamping mechanisms have difficulty in precisely controlling the clamping force, which can lead to wafer breakage or chipping, affecting wafer yield and production efficiency. Furthermore, wear and tear can generate dust and cause positioning errors.
The device employs a whole-wafer assembly, which uses a first positioning wheel in conjunction with a pressure sensor to monitor and control the pressure on the silicon wafer in real time, ensuring the stability and precise positioning of the silicon wafer during transport.
It effectively avoids silicon wafer breakage or chipping, reduces fragmentation costs, improves silicon wafer production yield and overall production efficiency, and ensures the integrity of the silicon wafer transport process and the operating rhythm of the wafer loading and unloading machine.
Smart Images
Figure CN224556242U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photovoltaic technology, and in particular to a whole-cell assembly device and an automatic cell loading and unloading machine. Background Technology
[0002] Automatic wafer loading and unloading machines are typical automated equipment in the photovoltaic manufacturing industry. They are used before and after the PECVD (Plasma-Enhanced Chemical Vapor Deposition) process in solar silicon wafer production to automatically load silicon wafers between graphite boats and wafer baskets. During the transport of silicon wafers on the conveyor belt, each wafer needs to be processed to prevent misalignment and blockage. However, current traditional wafer processing mechanisms struggle to precisely control the clamping force, easily causing wafer breakage or edge chipping, increasing fragmentation costs. Dust generated from wear and tear on the wafer processing mechanism, along with positioning deviations, affect wafer yield, hindering production efficiency and product quality. Utility Model Content
[0003] This application discloses a wafer assembly device and an automatic wafer loading and unloading machine, which can effectively prevent silicon wafers from being crushed or chipped due to excessive pressure, and avoid damage such as abrasion and misalignment of silicon wafers caused by improper coordination between the belt conveyor and the positioning wheel, thereby effectively improving the yield of silicon wafer production and the overall production efficiency.
[0004] To achieve the above objectives, this application discloses a wafer aligning device for adjusting the position of silicon wafers on the conveyor belt of an automatic wafer loading and unloading machine, wherein the automatic wafer loading and unloading machine includes a frame, and the wafer aligning device includes:
[0005] The integral assembly includes a first integral unit, the first integral unit comprising:
[0006] A first mounting base is slidably disposed on the frame along the width direction of the belt line and located on one side of the belt line along the belt line conveying direction;
[0007] A second mounting base is movably disposed on the first mounting base along the width direction of the belt line;
[0008] A first positioning wheel is rotatably mounted on the second mounting base, and the first positioning wheel is used to rotate and abut against the silicon wafer;
[0009] A first pressure sensor is used to fix the first pressure sensor on the frame. The test end of the first pressure sensor is connected to the second mounting base. The first pressure sensor is used to detect the pressure generated when the first positioning wheel contacts the silicon wafer.
[0010] A controller, electrically connected to the first pressure sensor, is used to control the working state of the automatic loading and unloading machine based on the pressure detected by the first pressure sensor.
[0011] In one possible implementation, the first mounting base is provided with a first guide hole that extends through the first mounting base along the width direction of the belt line.
[0012] The second mounting base includes:
[0013] A first base, wherein the first positioning wheel is rotatably mounted on the first base;
[0014] The first connecting part extends along the width direction of the belt and is movably inserted into the first guide hole. One end of the first connecting part is connected to the first base, and the other end of the first connecting part is connected to the first pressure sensor.
[0015] In one possible implementation, the first integral unit further includes a first elastic reset member disposed between the first mounting base and the second mounting base, the first elastic reset member being used to provide an elastic reset force to the first positioning wheel in the direction of the belt line.
[0016] In one possible implementation, the first elastic reset member includes a first spring sleeved on the first connecting portion, one end of the first spring abutting against the first mounting base, and the other end of the first spring abutting against the second mounting base.
[0017] In one possible implementation, the first connecting part includes a first screw, both ends of which are respectively provided with external threads. The first base is provided with a threaded hole on one side facing the first screw. The external thread at one end of the first screw is threadedly connected to the threaded hole of the first base. The other end of the first screw is screwed with a first nut, which abuts against the first mounting seat.
[0018] In one possible implementation, the first mounting base is further provided with a first positioning hole in the vertical direction, the first positioning hole penetrating the first mounting base along the width direction of the belt line;
[0019] The second mounting base also includes a first positioning pin, which extends along the width direction of the belt and passes through the first positioning hole. One end of the first positioning pin is connected to the second mounting base, and the other end of the first positioning pin is provided with a first stop portion, which abuts against the first mounting base along the width direction of the belt.
[0020] In one possible implementation, the first positioning pin includes two pins, which are disposed on both sides of the first connecting portion and are symmetrically arranged with respect to the first connecting portion.
[0021] In one possible implementation, the first pressure sensor is a piezoresistive pressure sensor.
[0022] In one possible implementation, the monolithic assembly further includes a second monolithic unit, the second monolithic unit comprising:
[0023] The third mounting base is slidably disposed on the frame along the width direction of the belt line and is located on the other side of the belt line along the belt line conveying direction;
[0024] The fourth mounting base is movably mounted on the third mounting base along the width direction of the belt line;
[0025] The second positioning wheel is rotatably mounted on the fourth mounting base. The second positioning wheel is used to rotate and abut against the silicon wafer. The second positioning wheel and the first positioning wheel are arranged opposite to each other along the width direction of the belt line.
[0026] The second pressure sensor is fixed on the frame, and its test end is connected to the fourth mounting base. The second pressure sensor is used to detect the pressure generated when the second positioning wheel contacts the silicon wafer. The controller is also electrically connected to the second pressure sensor and is used to control the working state of the automatic wafer loading and unloading machine according to the pressure detected by the second pressure sensor.
[0027] This application also discloses an automatic wafer loading and unloading machine, including a frame, a belt conveyor and a wafer assembly device, wherein the belt conveyor is disposed on the frame and is used to transport silicon wafers, and the wafer assembly device is any of the wafer assembly devices described above.
[0028] Compared with the prior art, the beneficial effects of this application are as follows:
[0029] In the wafer assembly and automatic wafer loading / unloading machine provided in this application, the first mounting base can slide along the width direction of the conveyor belt to adjust its position, and the second mounting base is movably mounted on the first mounting base along the width direction of the conveyor belt to ensure good contact between the first positioning wheel and the silicon wafer. The first positioning wheel is rotatably mounted on the second mounting base and can guide the silicon wafer to a suitable position by its own rotation and friction with the silicon wafer. A first pressure sensor is fixed on the frame, and its test end is connected to the second mounting base to detect the pressure generated when the first positioning wheel contacts the silicon wafer. The controller is electrically connected to the first pressure sensor and controls the working state of the automatic wafer loading / unloading machine according to the pressure detected by the first pressure sensor.
[0030] Therefore, the controller can adjust the working status of the automatic wafer loading and unloading machine in a timely manner based on the pressure data monitored in real time by the first pressure sensor. Precise pressure control can effectively prevent the silicon wafers from being crushed or chipped due to excessive pressure, reducing the cost of silicon wafer fragments. At the same time, the controller can cooperate with the conveyor belt through the real-time monitoring of the first pressure sensor to avoid damage such as abrasion and misalignment of silicon wafers caused by improper coordination between the conveyor belt and the positioning wheel. This not only ensures the integrity of the silicon wafers during the transportation process, but also optimizes the operating rhythm of the wafer loading and unloading machine, effectively improving the silicon wafer production yield and overall production efficiency. Attached Figure Description
[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0032] Figure 1 This is a schematic diagram of the structure of the whole device when it is not in contact with the silicon wafer, as provided in an embodiment of the present invention;
[0033] Figure 2 A schematic diagram of the structure of the whole device in contact with a silicon wafer provided in an embodiment of this utility model;
[0034] Figure 3 A schematic diagram of the structure of the first integral unit of the integral device provided in this embodiment of the utility model;
[0035] Figure 4 This is a partial structural diagram of the first integral unit of an integral device provided in an embodiment of the present utility model.
[0036] Explanation of reference numerals in the attached figures:
[0037] 10-Complete assembly; 11-First complete unit; 111-First mounting base; 112-Second mounting base; 1121-First base; 1122-First connecting part; 11221-First screw; 11222-First nut; 1123-First positioning pin; 11231-First stop; 113-First positioning wheel; 114-First pressure sensor; 115-First elastic reset element; 1151-First spring; 12-Second complete unit; 121-Third mounting base; 122-Fourth mounting base; 123-Second positioning wheel; 124-Second pressure sensor;
[0038] 20-Silicon wafer;
[0039] 30 - Belt Conveyor Detailed Implementation
[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0041] In this application, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0042] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.
[0043] Automatic wafer loading and unloading machines are typical automated equipment in the photovoltaic manufacturing industry. They are used before and after the PECVD (Plasma-Enhanced Chemical Vapor Deposition) process in solar silicon wafer production to automatically load silicon wafers between graphite boats and wafer baskets. During the transport of silicon wafers on the conveyor belt, each wafer needs to be processed to prevent misalignment and blockage. However, current traditional wafer processing mechanisms struggle to precisely control the clamping force, easily causing wafer breakage or edge chipping, increasing fragmentation costs. Dust generated from wear and tear on the wafer processing mechanism, along with positioning deviations, affect wafer yield, hindering production efficiency and product quality.
[0044] In view of this, some embodiments of this application provide a wafer loading and unloading device and an automatic wafer loading and unloading machine. The second mounting base equipped with the first positioning wheel is movably connected to the first mounting base, and the test end of the first pressure sensor is connected to the second mounting base. The controller controls the working state of the automatic wafer loading and unloading machine according to the pressure detected by the first pressure sensor. This can effectively avoid the situation where the silicon wafer is crushed or chipped due to excessive pressure, and avoid damage such as abrasion and misalignment of the silicon wafer caused by improper coordination between the belt and the positioning wheel. This effectively improves the silicon wafer production yield and overall production efficiency.
[0045] The present application will be described in detail below through specific embodiments:
[0046] The complete device in the embodiments of this application, such as Figures 1-4 As shown, a wafer assembly device is used to adjust the position of silicon wafers 20 on the belt conveyor 30 of an automatic wafer loading and unloading machine, which includes a frame.
[0047] The wafer assembly includes a wafer assembly 10 and a controller. The wafer assembly 10 includes a first wafer unit 11, which includes a first mounting base 111, a second mounting base 112, a first positioning wheel 113, and a first pressure sensor 114. The first mounting base 111 is slidably mounted on the frame along the width direction of the belt conveyor 30 and is located on one side of the belt conveyor 30 along the conveying direction of the belt conveyor 30. The second mounting base 112 is movably mounted on the first mounting base 111 along the width direction of the belt conveyor 30. The first positioning wheel 113 is rotatably mounted on the second mounting base 112 and is used to rotate and abut against the silicon wafer 20. The first pressure sensor 114 is fixed on the frame, and its test end is connected to the second mounting base 112. The first pressure sensor 114 is used to detect the pressure generated when the first positioning wheel 113 contacts the silicon wafer 20. The controller is electrically connected to the first pressure sensor 114 and is used to control the working state of the automatic wafer loading and unloading machine according to the pressure detected by the first pressure sensor 114.
[0048] In the wafer assembly device provided in this embodiment, a first mounting base 111 is slidably mounted on the frame along the width direction of the belt conveyor 30 and is located on one side of the belt conveyor 30 along the belt conveying direction, adjusting its position in the width direction of the belt conveyor 30. A second mounting base 112 is movably mounted on the first mounting base 111 along the width direction of the belt conveyor 30, so that the second mounting base 112 serves as the mounting carrier for the first positioning wheel 113, better adapting to changes in the position and orientation of the silicon wafer 20 and ensuring good contact between the first positioning wheel 113 and the silicon wafer 20. The first positioning wheel 113 is rotatably mounted on the second mounting base 112, and can guide the silicon wafer 20 to a suitable position by utilizing its own rotation and friction with the silicon wafer 20. A first pressure sensor 114 is fixed on the frame, and its test end is connected to the second mounting base 112 to detect the pressure generated when the first positioning wheel 113 contacts the silicon wafer 20. The controller is electrically connected to the first pressure sensor 114 and controls the working state of the automatic wafer loading and unloading machine according to the pressure detected by the first pressure sensor 114.
[0049] For example, when the silicon wafer 20 is conveyed to the wafer assembly position, the first mounting base 111 drives the first positioning wheel 113 on the second mounting base 112 to contact the silicon wafer 20. The pressure between the first positioning wheel 113 and the silicon wafer 20 is transmitted through the second mounting base 112 to the test end of the first pressure sensor 114. The first pressure sensor 114 converts the pressure signal into an electrical signal output. After receiving the electrical signal from the first pressure sensor 114, the controller can determine whether the pressure value detected by the first pressure sensor 114 exceeds the first preset pressure. If it exceeds the first preset pressure, it indicates that the pressure is too high, and the controller can issue an alarm message to prompt relevant personnel to handle the situation and prevent the silicon wafer 20 from being damaged by excessive pressure. The controller can also determine whether the first pressure sensor 114 is below the second preset pressure after the wafer assembly is completed. If it is below the second preset pressure, it means that the first positioning wheel 113 will not affect the silicon wafer 20. At this time, the controller controls the automatic wafer loading and unloading machine to be in normal working condition, and the conveyor belt 30 of the automatic wafer loading and unloading machine starts to continue conveying the silicon wafer 20 to the next process.
[0050] In this way, the controller can adjust the working status of the automatic wafer loading and unloading machine in a timely manner based on the pressure data monitored in real time by the first pressure sensor 114. Precise pressure control can effectively prevent the silicon wafer 20 from being crushed or chipped due to excessive pressure, reducing the cost of silicon wafer 20 fragments. At the same time, the controller can cooperate with the belt conveyor 30 through the real-time monitoring of the first pressure sensor 114 to avoid damage such as scratches and misalignment of the silicon wafer 20 caused by improper coordination between the belt conveyor 30 and the positioning wheel. This not only ensures the integrity of the silicon wafer 20 during the transmission process, but also optimizes the operating rhythm of the wafer loading and unloading machine, effectively improving the production yield of silicon wafer 20 and the overall production efficiency.
[0051] In the diagram, the X direction is the conveying direction of the belt 30, and the Y direction is the width direction of the belt 30 (i.e., perpendicular to the conveying direction of the belt 30).
[0052] In one possible implementation, the first mounting base 111 is provided with a first guide hole, which extends through the first mounting base 111 along the width direction of the belt line 30.
[0053] like Figure 4 As shown, the second mounting base 112 includes a first base 1121 and a first connecting part 1122. The first positioning wheel 113 is rotatably disposed on the first base 1121. The first connecting part 1122 extends along the width direction of the belt line 30 and is movably inserted into the first guide hole. One end of the first connecting part 1122 is connected to the first base 1121, and the other end of the first connecting part 1122 is connected to the first pressure sensor 114.
[0054] The first guide hole provides precise guidance for the first connecting part 1122 of the second mounting base 112, so that the second mounting base 112 can only move along the width direction of the belt line 30. This ensures that the first positioning wheel 113 always stays in the correct direction during the process of contacting the silicon wafer 20 and adjusting the position of the silicon wafer 20, thereby improving the accuracy of the position adjustment of the silicon wafer 20.
[0055] Meanwhile, the first connecting part 1122 ensures that the pressure generated when the first positioning wheel 113 contacts the silicon wafer 20 can be effectively transmitted to the first pressure sensor 114, ensuring the accuracy and reliability of pressure detection. This connection method between the first mounting base 111 and the second mounting base 112 enhances the stability of the entire structure. The constraint effect of the first guide hole on the first connecting part 1122 prevents the second mounting base 112 from shaking or shifting during movement, ensuring the stability of the first positioning wheel 113 when in contact with the silicon wafer 20, thereby improving the effect of silicon wafer 20 position adjustment.
[0056] In some embodiments, such as Figure 3 and Figure 4 As shown, the first integral unit 11 also includes a first elastic reset member 115, which is disposed between the first mounting base 111 and the second mounting base 112. The first elastic reset member 115 is used to provide an elastic reset force to the first positioning wheel 113 in the direction of the belt line 30.
[0057] The first elastic reset member 115 can automatically adjust the contact pressure between the first positioning wheel 113 and the silicon wafer 20 according to the actual position and surface condition of the silicon wafer 20. The elastic deformation of the first elastic reset member 115 can buffer the impact force between the first positioning wheel 113 and the silicon wafer 20, avoiding the silicon wafer 20 from chipping or breaking due to excessive pressure. At the same time, it ensures that the first positioning wheel 113 and the silicon wafer 20 always maintain effective contact, reducing rigid collisions between the first positioning wheel 113, the second mounting base 112 and other components during contact and adjustment with the silicon wafer 20. The elastic reset force ensures that the first positioning wheel 113 always maintains a stable force on the silicon wafer 20 when adjusting its position, ensuring that the silicon wafer 20 can be accurately adjusted to the target position, thus improving the stability and accuracy of the silicon wafer 20 positioning.
[0058] Specifically, such as Figure 3 and Figure 4 As shown, the first elastic reset member 115 includes a first spring 1151 sleeved on the first connecting part 1122. One end of the first spring 1151 abuts against the first mounting base 111, and the other end of the first spring 1151 abuts against the second mounting base 112.
[0059] The first spring 1151 is used as the first elastic reset member 115. Since the spring is sleeved on the first connecting part 1122, the contact method with the first mounting base 111 and the second mounting base 112 is simple, which also reduces the manufacturing cost of the whole device and facilitates installation and maintenance. The spring can provide a stable and predictable elastic reset force, ensuring the stability and consistency of the contact pressure between the first positioning wheel 113 and the silicon wafer 20, which helps to achieve precise adjustment of the position of the silicon wafer 20.
[0060] In some embodiments, such as Figure 3 and Figure 4 As shown, the first connecting part 1122 includes a first screw 11221. Both ends of the first screw 11221 are respectively provided with external threads. The first base 1121 is provided with a threaded hole on the side facing the first screw 11221. The external thread at one end of the first screw 11221 is threadedly connected to the threaded hole of the first base 1121. The other end of the first screw 11221 is screwed with a first nut 11222. The first nut 11222 abuts against the first mounting seat 111.
[0061] The threaded connection simplifies the installation and disassembly of the first screw 11221 and the first base 1121. During assembly, simply screwing the first screw 11221 into the threaded hole of the first base 1121 completes the connection. Furthermore, by rotating the first nut 11222, the first screw 11221 can be moved along its length, allowing for precise fine-tuning of the position of the second mounting base 112. In practical applications, silicon wafers 20 of different specifications may require different positioning positions. This adjustable structure can meet the positioning requirements of various silicon wafers 20, improving the versatility and adaptability of the entire device.
[0062] Furthermore, in some embodiments, the first mounting base 111 is also provided with a first positioning hole, which extends through the first mounting base 111 along the width direction of the belt line 30.
[0063] like Figure 3 and Figure 4 As shown, the second mounting base 112 also includes a first positioning pin 1123. The first positioning pin 1123 extends along the width direction of the belt line 30 and passes through the first positioning hole. One end of the first positioning pin 1123 is connected to the second mounting base 112, and the other end of the first positioning pin 1123 is provided with a first stop portion 11231. The first stop portion 11231 abuts against the first mounting base 111 along the width direction of the belt line 30.
[0064] The cooperation between the first positioning hole and the first positioning pin 1123 improves the movement accuracy of the second mounting base 112 in the width direction of the belt 30. When adjusting the position of the silicon wafer 20, it can more accurately control the contact position and force between the first positioning wheel 113 and the silicon wafer 20, thereby improving the accuracy of the silicon wafer 20 position adjustment and reducing the problem of silicon wafer 20 offset or damage caused by inaccurate positioning.
[0065] Furthermore, the first stop 11231 effectively prevents the first positioning pin 1123 from dislodging from the first positioning hole, enhancing the stability of the entire structure. During equipment operation, even under vibration or external impact, the second mounting base 112 can maintain a stable movement under the constraint of the first positioning pin 1123 and the first positioning hole, ensuring that the first positioning wheel 113 can always reliably contact the silicon wafer 20 and adjust its position.
[0066] Specifically, such as Figure 1 and Figure 2 As shown, there are two first positioning pins 1123, which are located on both sides of the first connecting portion 1122 and are symmetrically arranged with respect to the first connecting portion 1122.
[0067] Two first positioning pins 1123 are symmetrically arranged on both sides of the first connecting part 1122, which enhances the stability of the second mounting base 112 relative to the first mounting base 111, can more accurately limit the movement direction of the second mounting base 112, reduce deviation and shaking during movement, improve the accuracy of silicon wafer 20 position adjustment, and help ensure the transmission quality of silicon wafer 20 on the belt conveyor 30.
[0068] In one possible implementation, the first pressure sensor 114 is a piezoresistive pressure sensor.
[0069] Piezoresistive pressure sensors operate based on the piezoresistive effect, accurately converting pressure changes into resistance changes, which are then converted into electrical signals by a circuit. This gives them high measurement accuracy, enabling them to accurately detect minute pressure changes when the first positioning wheel 113 contacts the silicon wafer 20, providing the controller with precise pressure data for accurate control of the automatic wafer loading and unloading machine's operating status.
[0070] In other embodiments, the first pressure sensor 114 may also be a capacitive pressure sensor, a strain gauge pressure sensor, or a Hall effect pressure sensor, etc., and this application does not limit it.
[0071] In some embodiments, the integral assembly 10 further includes a second integral unit 12, the second integral unit 12 including a third mounting base 121, the third mounting base 121 being slidably disposed on the frame along the width direction of the belt 30 and located on the other side of the belt 30 along the conveying direction of the belt 30.
[0072] The second unit 12 also includes a fourth mounting base 122, which is movably mounted on the third mounting base 121 along the width direction of the belt line 30.
[0073] The second integral unit 12 also includes a second positioning wheel 123, which is rotatably mounted on the fourth mounting base 122. The second positioning wheel 123 is used to rotate and abut against the silicon wafer 20. The second positioning wheel 123 and the first positioning wheel 113 are arranged opposite to each other along the width direction of the belt line 30.
[0074] The second wafer unit 12 also includes a second pressure sensor 124, which is fixed on the frame. The test end of the second pressure sensor 124 is connected to the fourth mounting base 122. The second pressure sensor 124 is used to detect the pressure generated when the second positioning wheel 123 contacts the silicon wafer 20. The controller is also electrically connected to the second pressure sensor 124 and is used to control the working state of the automatic wafer loading and unloading machine according to the pressure detected by the second pressure sensor 124.
[0075] By setting opposing first positioning wheels 113 and second positioning wheels 123 on both sides of the conveyor belt 30, the silicon wafer 20 can be positioned and adjusted simultaneously from two directions. This effectively prevents the silicon wafer 20 from deviating or tilting on the conveyor belt 30, greatly improving the positioning accuracy of the silicon wafer 20 and ensuring its accurate position during transport. The second pressure sensor 124 allows the controller to monitor the pressure when the second positioning wheel 123 contacts the silicon wafer 20 in real time. Combined with the detection data from the first pressure sensor 114, the controller can comprehensively understand the force on both sides of the silicon wafer 20, thereby more accurately controlling the working state of the automatic wafer loading and unloading machine and further improving the quality and production efficiency of the silicon wafer 20.
[0076] In some embodiments, such as Figure 1 and Figure 2As shown, the first wafer unit 11 includes multiple second mounting bases 112, first positioning wheels 113, and first pressure sensors 114. Multiple second mounting bases 112 are spaced apart along the conveying direction of the belt conveyor 30. Multiple sensors are rotatably mounted on corresponding second mounting bases 112. The test ends of multiple first pressure sensors 114 are connected to corresponding second mounting bases 112. These multiple first pressure sensors 114 are used to detect the pressure at different contact points between the multiple first positioning wheels 113 and the silicon wafer 20. The second wafer unit 12 is similarly configured to further improve the detection accuracy of the silicon wafer 20.
[0077] This application also discloses an automatic loading and unloading machine, including a frame, a belt conveyor 30, and a sheet-forming device. The belt conveyor 30 is disposed on the frame. The sheet-forming device in the automatic loading and unloading machine is the sheet-forming device described above. Therefore, the automatic loading and unloading machine in this embodiment has roughly the same technical effect as the sheet-forming device described above. Since the technical effect of the sheet-forming device has been fully explained, it will not be repeated here.
[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A wafer handling device for adjusting the position of silicon wafers on a conveyor belt of an automatic wafer loading and unloading machine, the automatic wafer loading and unloading machine comprising a frame, characterized in that, The entire device includes: The integral assembly includes a first integral unit, the first integral unit comprising: A first mounting base is slidably disposed on the frame along the width direction of the belt line and located on one side of the belt line along the belt line conveying direction; A second mounting base is movably disposed on the first mounting base along the width direction of the belt line; A first positioning wheel is rotatably mounted on the second mounting base, and the first positioning wheel is used to rotate and abut against the silicon wafer; A first pressure sensor is used to fix the first pressure sensor on the frame. The test end of the first pressure sensor is connected to the second mounting base. The first pressure sensor is used to detect the pressure generated when the first positioning wheel contacts the silicon wafer. A controller, electrically connected to the first pressure sensor, is used to control the working state of the automatic loading and unloading machine based on the pressure detected by the first pressure sensor.
2. The integral device according to claim 1, characterized in that, The first mounting base is provided with a first guide hole, which extends through the first mounting base along the width direction of the belt line; The second mounting base includes: A first base, wherein the first positioning wheel is rotatably mounted on the first base; The first connecting part extends along the width direction of the belt and is movably inserted into the first guide hole. One end of the first connecting part is connected to the first base, and the other end of the first connecting part is connected to the first pressure sensor.
3. The integral device according to claim 2, characterized in that, The first integral unit further includes a first elastic reset member, which is disposed between the first mounting base and the second mounting base. The first elastic reset member is used to provide an elastic reset force to the first positioning wheel in the direction of the belt line.
4. The integral device according to claim 3, characterized in that, The first elastic reset member includes a first spring sleeved on the first connecting portion, one end of the first spring abutting against the first mounting base, and the other end of the first spring abutting against the second mounting base.
5. The integral device according to claim 3, characterized in that, The first connecting part includes a first screw, both ends of which are provided with external threads. The first base body is provided with a threaded hole on one side facing the first screw. The external thread at one end of the first screw is threadedly connected to the threaded hole of the first base body. The other end of the first screw is screwed with a first nut, which abuts against the first mounting base.
6. The integral device according to claim 2, characterized in that, The first mounting base is also provided with a first positioning hole, which extends through the first mounting base along the width direction of the belt line; The second mounting base also includes a first positioning pin, which extends along the width direction of the belt and passes through the first positioning hole. One end of the first positioning pin is connected to the second mounting base, and the other end of the first positioning pin is provided with a first stop portion, which abuts against the first mounting base along the width direction of the belt.
7. The integral device according to claim 6, characterized in that, The first positioning pin includes two pins, which are disposed on both sides of the first connecting portion and are symmetrically arranged with respect to the first connecting portion.
8. The integral device according to claim 1, characterized in that, The first pressure sensor is a piezoresistive pressure sensor.
9. The integral device according to any one of claims 1-8, characterized in that, The integral assembly further includes a second integral unit, the second integral unit comprising: The third mounting base is slidably disposed on the frame along the width direction of the belt line and is located on the other side of the belt line along the belt line conveying direction; The fourth mounting base is movably mounted on the third mounting base along the width direction of the belt line; The second positioning wheel is rotatably mounted on the fourth mounting base. The second positioning wheel is used to rotate and abut against the silicon wafer. The second positioning wheel and the first positioning wheel are arranged opposite to each other along the width direction of the belt line. The second pressure sensor is fixed on the frame, and its test end is connected to the fourth mounting base. The second pressure sensor is used to detect the pressure generated when the second positioning wheel contacts the silicon wafer. The controller is also electrically connected to the second pressure sensor and is used to control the working state of the automatic wafer loading and unloading machine according to the pressure detected by the second pressure sensor.
10. An automatic loading and unloading machine, characterized in that, The device includes a frame, a conveyor belt, and a wafer assembly assembly, wherein the conveyor belt is disposed on the frame and is used to transport silicon wafers, and the wafer assembly assembly is the wafer assembly assembly as described in any one of claims 1 to 9.