A needle switching mechanism

CN224734141UActive Publication Date: 2026-09-08SHENZHEN ZHUOXING ADVANCED PACKAGING TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202521892447.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-03
Publication Date
2026-09-08
Estimated Expiration
2035-09-03

AI Technical Summary

Technical Problem

[0003]现有的晶圆贴片设备中,对不同类型的晶圆进行贴片时,需要采用不同类型的顶针,现有的贴片机更换顶针时拆装困难,费时费力,严重影响了贴片效率

Benefits of technology

[0016] The beneficial effects of this utility model are as follows: This utility model uses the ejector pin X-axis module and the ejector pin Y-axis module to drive one of the ejector pins in the ejector pin assembly to move to the working position. The ejector pin lifting module drives the ejector pin to move upward to lift the wafer, which is convenient for picking up the wafer for placement. Then, when different types of wafer placement require switching ejector pins, the ejector pin X-axis module drives the ejector pin assembly to move so that another ejector pin is placed directly above the ejector pin lifting module, thereby realizing the ejector pin switching work and improving placement efficiency.

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Abstract

This utility model discloses a pin switching mechanism, including a pin assembly, a pin lifting module, a pin X-axis module, and a pin Y-axis module. The pin assembly is disposed at the drive end of the pin X-axis module, and the pin X-axis module and the pin lifting module are disposed at the drive end of the pin Y-axis module. The pin assembly includes multiple pins. The pin X-axis module is used to drive the pin assembly to move along the X-axis direction so that one of the pins is directly above the pin lifting module. The pin lifting module is used to drive the pin directly above it to move upward. This pin switching mechanism can quickly switch the corresponding pins when placing different types of wafers without stopping the machine for assembly and disassembly, greatly improving placement efficiency.
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Description

Technical Field

[0001] This utility model relates to the field of chip mounter technology, specifically to a pin switching mechanism. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon seed crystals, and then slowly pulled out to form cylindrical single-crystal silicon. After grinding, polishing, and slicing, the silicon ingot is formed into a silicon wafer. Wafer mounting technology is widely used in semiconductor manufacturing, especially in integrated circuit chip packaging. Its purpose is to protect, fix, or enhance the mechanical strength of the wafer during the wafer manufacturing process through mounting or bonding.

[0003] In existing wafer mounting equipment, different types of ejector pins are required when mounting different types of wafers. Changing ejector pins in existing machines is difficult, time-consuming, and labor-intensive, which seriously affects the mounting efficiency. Utility Model Content

[0004] To overcome the shortcomings of the existing technology, this utility model provides a pin switching mechanism that can quickly switch the corresponding pins when placing different types of wafers without stopping the machine for disassembly and assembly, thus greatly improving the placement efficiency.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A pin switching mechanism includes a pin assembly, a pin lifting module, a pin X-axis module, and a pin Y-axis module. The pin assembly is disposed at the drive end of the pin X-axis module, and the pin X-axis module and the pin lifting module are disposed at the drive end of the pin Y-axis module. The pin assembly includes a plurality of pins. The pin X-axis module is used to drive the pin assembly to move along the X-axis direction so that one of the pins is located directly above the pin lifting module. The pin lifting module is used to drive the pin located directly above it to move upward.

[0007] As a further improvement to the above technical solution, the ejector pin assembly further includes an ejector pin fixing plate and a plurality of ejector pin seats arranged along the X-axis direction. The plurality of ejector pin seats are slidably connected to the ejector pin fixing plate along the Z-axis direction, and the plurality of ejector pins are respectively mounted on the plurality of ejector pin seats.

[0008] As a further improvement to the above technical solution, a first linear guide rail is provided between the ejector pin seat and the ejector pin fixing plate. The first linear guide rail includes a first slide rail disposed on the ejector pin fixing plate and a first slider disposed on the ejector pin seat.

[0009] As a further improvement to the above technical solution, the ejector pin lifting module includes a Z-axis base, a Z-axis drive, and an adsorption assembly. The Z-axis base is disposed on the ejector pin X-axis base plate of the ejector pin X-axis module, the Z-axis drive is disposed on the Z-axis base, and the adsorption assembly is disposed on the drive end of the Z-axis drive. The Z-axis drive is used to drive the adsorption assembly to rise and fall.

[0010] As a further improvement to the above technical solution, the adsorption assembly includes an adsorption base, a first magnetic suction component, and a second magnetic suction component. The adsorption base is connected to the driving end of the Z-axis drive component and is slidably connected to the Z-axis base in the Z-axis direction. The first magnetic suction component is installed on the adsorption base, and the second magnetic suction component is disposed at the bottom of the ejector pin seat. The second magnetic suction component is magnetically connected to the first magnetic suction component.

[0011] As a further improvement to the above technical solution, the first magnetic suction component is a magnet, the adsorption base is provided with a receiving groove for fixing the magnet, the second magnetic suction component is an armature plate, and the bottom of the ejector pin seat is provided with a fixing groove for fixing the armature plate.

[0012] As a further improvement to the above technical solution, the adsorption assembly further includes two rolling wheels, which are disposed on both sides of the magnet, with the top of the rolling wheels higher than the top of the magnet, and the rolling wheels are in rolling connection with the armature plate.

[0013] As a further improvement to the above technical solution, the driving end of the Z-axis drive is provided with a connecting seat, the adsorption base is fixedly connected to the connecting seat, and the connecting seat and the Z-axis base are slidably connected along the Z-axis direction by a second linear guide rail. The second linear guide rail includes a second slide rail disposed on the Z-axis base and a second slider disposed on the connecting seat.

[0014] As a further improvement to the above technical solution, the ejector pin X-axis module includes an ejector pin X-axis base plate, an ejector pin X-axis movable seat, an ejector pin X-axis linear guide rail, and an ejector pin X-axis drive component. The ejector pin X-axis movable seat is slidably connected to the X-axis base plate via the ejector pin X-axis linear guide rail. The ejector pin X-axis drive component is mounted on the ejector pin X-axis base plate. The ejector pin X-axis movable seat is connected to the drive end of the ejector pin X-axis drive component. The ejector pin X-axis drive component is used to drive the ejector pin X-axis movable seat to move along the X-axis direction. The ejector pin fixing plate is fixedly connected to the ejector pin X-axis movable seat.

[0015] As a further improvement to the above technical solution, the ejector pin Y-axis module includes an ejector pin Y-axis base plate, an ejector pin Y-axis linear guide rail, and an ejector pin Y-axis drive component. The ejector pin Y-axis drive component is mounted on the ejector pin Y-axis base plate. The ejector pin X-axis base plate is slidably connected to the ejector pin Y-axis base plate through the ejector pin Y-axis linear guide rail. The ejector pin X-axis base plate is connected to the drive end of the ejector pin Y-axis drive component. The ejector pin Y-axis drive component is used to drive the ejector pin X-axis base plate to move along the Y-axis direction.

[0016] The beneficial effects of this utility model are as follows: This utility model uses the ejector pin X-axis module and the ejector pin Y-axis module to drive one of the ejector pins in the ejector pin assembly to move to the working position. The ejector pin lifting module drives the ejector pin to move upward to lift the wafer, which is convenient for picking up the wafer for placement. Then, when different types of wafer placement require switching ejector pins, the ejector pin X-axis module drives the ejector pin assembly to move so that another ejector pin is placed directly above the ejector pin lifting module, thereby realizing the ejector pin switching work and improving placement efficiency. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is an isometric view of a pin switching mechanism according to an embodiment of the present invention in one direction;

[0019] Figure 2 This is an isometric view of a pin switching mechanism according to an embodiment of the present invention from another direction;

[0020] Figure 3 This is a front view of a pin switching mechanism according to an embodiment of the present invention;

[0021] Figure 4 This is a cross-sectional view of the adsorption component in a pin switching mechanism according to an embodiment of this utility model.

[0022] Reference numerals: 101, ejector pin; 102, ejector pin seat; 103, ejector pin fixing plate; 104, first linear guide rail; 201, Z-axis drive component; 202, Z-axis base; 203, connecting seat; 204, second linear guide rail; 205, adsorption base; 206, rolling wheel; 207, magnet; 208, armature plate; 301, ejector pin X-axis moving part seat; 302, ejector pin X-axis linear guide rail; 303, ejector pin X-axis base plate; 304, ejector pin X-axis drive component; 401, ejector pin Y-axis base plate; 402, ejector pin Y-axis linear guide rail; 403, ejector pin Y-axis drive component; 404, mechanism base. Detailed Implementation

[0023] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / connections involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. For example, fixed connections / fixed installations can use screw connections, bolt connections, pin connections, key connections, adhesive connections, mortise and tenon connections, welding, riveting, etc., as needed. For detachable connections, screw connections, bolt connections, threaded connections, snap-fit ​​connections, mortise and tenon connections, Velcro connections, etc., can be used as needed. The various technical features in this utility model can be combined interactively without contradicting each other.

[0024] Reference Figures 1-3 This utility model provides a pin switching mechanism, including a pin assembly, a pin lifting module, a pin X-axis module, and a pin Y-axis module. The pin assembly is disposed at the drive end of the pin X-axis module, and the pin X-axis module can drive the pin assembly to move along the X-axis direction. The pin X-axis module and the pin lifting module are disposed at the drive end of the pin Y-axis module, and the pin Y-axis module can drive the pin assembly and the pin lifting module to move synchronously along the Y-axis direction. The pin assembly includes a plurality of pins 101. The pin X-axis module is used to drive the pin assembly to move along the X-axis direction so that one of the pins 101 is located directly above the pin lifting module. The pin lifting module is used to drive the pin 101 located directly above it to move upward, thereby lifting the wafer for easy placement.

[0025] Specifically, refer to Figures 1-3 The ejector pin assembly includes an ejector pin fixing plate 103, a plurality of ejector pin seats 102 arranged along the X-axis direction, and ejector pins 101 mounted on the ejector pin seats 102. The plurality of ejector pin seats 102 are slidably connected to the ejector pin fixing plate 103 along the Z-axis direction by a first linear guide rail 104. Specifically, the first linear guide rail 104 includes a first slide rail disposed on the ejector pin fixing plate 103 and a first slider disposed on the ejector pin seat 102.

[0026] In this embodiment, there are two ejector pins 101, ejector pin holders 102, and first linear guide rails 104. The two ejector pins 101 are of different models, and the two ejector pin holders 102 can move independently along the Z-axis. Thus, when the ejector pin X-axis module drives the ejector pin assembly to move along the X-axis, the ejector pins 101 can be switched, allowing one ejector pin 101 to be in the working position, i.e., directly above the ejector pin lifting module. The ejector pin lifting module can then drive this ejector pin 101 upwards to lift the wafer, enabling the next placement operation.

[0027] In this embodiment, refer to Figures 1-3 The ejector pin lifting module includes a Z-axis base 202, a Z-axis drive component 201 disposed on the Z-axis base 202, and an adsorption assembly disposed at the drive end of the Z-axis drive component 201. The Z-axis drive component 201 is used to drive the adsorption assembly to rise and fall. The Z-axis base 202 is disposed at the drive end of the ejector pin X-axis module. (Refer to...) Figure 4 The adsorption assembly includes a connecting seat 203, a second linear guide rail 204, an adsorption base 205, a first magnetic attractor, a second magnetic attractor, and a rolling wheel 206. The connecting seat 203 is slidably connected to the Z-axis base 202 along the Z-axis direction via the second linear guide rail 204. The second linear guide rail 204 includes a second slide rail disposed on the Z-axis base 202 and a second slider disposed on the connecting seat 203. The connecting seat 203 is connected to the driving end of the Z-axis drive component 201. The adsorption base 205 is fixedly connected to the connecting seat 203. The first magnetic attractor and the rolling wheel 206 are mounted on the adsorption base 205. There are two rolling wheels 206 disposed on both sides of the first magnetic attractor, and the top of the rolling wheel 206 is higher than the top of the first magnetic attractor. The second magnetic attractor is disposed at the bottom of the pin seat 102, and there is an attraction between the second magnetic attractor and the first magnetic attractor. Here, the first magnetic attractor is a magnet 207, and the adsorption base 205 is provided with a receiving groove for fixing the magnet 207. The second magnetic attractor is an armature plate 208, and the bottom of the ejector pin seat 102 is provided with a fixing groove for fixing the armature plate 208. The rolling wheel 206 is rotatably connected to the bottom of the armature plate 208.

[0028] It can be understood that when the Z-axis drive 201 operates to drive the connecting seat 203 to move upward, the magnet 207 approaches the armature plate 208, and the attraction between the two fixes the ejector pin seat 102 to the drive end of the Z-axis drive 201, thereby improving the stability of the Z-axis drive 201 driving the ejector pin 101 to rise and fall. When the Z-axis drive 201 operates to drive the connecting seat 203 to move downward, the adsorption base 205 is blocked by the limiting block provided on the ejector pin fixing plate 103 when it descends to the initial position, and cannot continue to move downward, while the magnet 207 continues to move downward with the Z-axis drive 201 until the distance between the magnet 207 and the armature plate 208 is large enough to reduce or eliminate the attraction between them. At this time, the ejector pin X-axis module can drive the adsorption assembly to move along the X-axis direction to switch the ejector pin 101.

[0029] In addition, since the top of the rolling wheel 206 is higher than the top of the magnet 207, there is a gap between the magnet 207 and the armature plate 208 and they are not in direct contact. The rolling wheel 206 is in rolling connection with the bottom of the armature plate 208. This allows for fine adjustment of the position of the ejector pin 101 by moving the ejector pin assembly through the ejector pin X-axis module when the ejector pin 101 is lifted.

[0030] In this embodiment, refer to Figure 1 and Figure 3 The ejector pin X-axis module includes an ejector pin X-axis base plate 303, an ejector pin X-axis movable seat 301, an ejector pin X-axis linear guide rail 302, and an ejector pin X-axis drive component 304. The ejector pin X-axis movable seat 301 is slidably connected to the ejector pin X-axis base plate 303 via the ejector pin X-axis linear guide rail 302. The ejector pin X-axis drive component 304 is mounted on the ejector pin X-axis base plate 303. The ejector pin X-axis movable seat 301 is connected to the drive end of the ejector pin X-axis drive component 304. The ejector pin X-axis drive component 304 is used to drive the ejector pin X-axis movable seat 301 to move along the X-axis direction. The ejector pin fixing plate 103 is fixedly connected to the ejector pin X-axis movable seat 301. The Z-axis base 202 is fixedly connected to the ejector pin X-axis base plate 303. The ejector pin X-axis drive 304 is activated to drive the ejector pin X-axis moving base 301 to slide on the ejector pin X-axis linear guide 302, thereby adjusting the position of the ejector pin assembly in the X-axis direction.

[0031] The ejector pin Y-axis module includes an ejector pin Y-axis base plate 401, an ejector pin Y-axis linear guide rail 402, and an ejector pin Y-axis drive component 403. The ejector pin Y-axis drive component 403 is mounted on the ejector pin Y-axis base plate 401, which is mounted on the mechanism base 404 of the pick-and-place machine. The ejector pin X-axis base plate 303 is slidably connected to the ejector pin Y-axis base plate 401 via the ejector pin Y-axis linear guide rail 402. The ejector pin X-axis base plate 303 is connected to the drive end of the ejector pin Y-axis drive component 403, which drives the ejector pin X-axis base plate 303 to move along the Y-axis direction. Activating the ejector pin Y-axis drive component 403 causes the ejector pin X-axis base plate 303 to slide on the ejector pin Y-axis linear guide rail 402, thereby adjusting the position of the ejector pin assembly in the Y-axis direction.

[0032] In this invention, the Z-axis drive component 201 and the ejector pin Y-axis drive component 403 are voice coil motors, and the ejector pin X-axis drive component 304 is a linear motor, all of which can drive the object to make linear motion. Of course, linear modules such as lead screws and electric telescopic rods can also be used.

[0033] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A pin switching mechanism, characterized in that: The device includes an ejector pin assembly, an ejector pin lifting module, an ejector pin X-axis module, and an ejector pin Y-axis module. The ejector pin assembly is disposed at the drive end of the ejector pin X-axis module, and the ejector pin X-axis module and the ejector pin lifting module are disposed at the drive end of the ejector pin Y-axis module. The ejector pin assembly includes multiple ejector pins. The ejector pin X-axis module is used to drive the ejector pin assembly to move along the X-axis direction so that one of the ejector pins is located directly above the ejector pin lifting module. The ejector pin lifting module is used to drive the ejector pin located directly above it to move upward.

2. The ejector pin switching mechanism according to claim 1, characterized in that: The ejector pin assembly further includes an ejector pin fixing plate and a plurality of ejector pin seats arranged along the X-axis direction. The plurality of ejector pin seats are slidably connected to the ejector pin fixing plate along the Z-axis direction, and the plurality of ejector pins are respectively mounted on the plurality of ejector pin seats.

3. The ejector pin switching mechanism according to claim 2, characterized in that: A first linear guide rail is provided between the ejector pin seat and the ejector pin fixing plate. The first linear guide rail includes a first slide rail disposed on the ejector pin fixing plate and a first slider disposed on the ejector pin seat.

4. The ejector pin switching mechanism according to claim 2, characterized in that: The ejector pin lifting module includes a Z-axis base, a Z-axis drive, and an adsorption assembly. The Z-axis base is disposed on the ejector pin X-axis base plate of the ejector pin X-axis module. The Z-axis drive is disposed on the Z-axis base. The adsorption assembly is disposed on the drive end of the Z-axis drive. The Z-axis drive is used to drive the adsorption assembly to lift and lower.

5. The ejector pin switching mechanism according to claim 4, characterized in that: The adsorption assembly includes an adsorption base, a first magnetic suction component, and a second magnetic suction component. The adsorption base is connected to the driving end of the Z-axis drive component and is slidably connected to the Z-axis base in the Z-axis direction. The first magnetic suction component is installed on the adsorption base, and the second magnetic suction component is disposed at the bottom of the ejector pin seat. The second magnetic suction component is magnetically connected to the first magnetic suction component.

6. The ejector pin switching mechanism according to claim 5, characterized in that: The first magnetic component is a magnet, and the adsorption base is provided with a receiving groove for fixing the magnet. The second magnetic component is an armature plate, and the bottom of the ejector pin seat is provided with a fixing groove for fixing the armature plate.

7. The ejector pin switching mechanism according to claim 6, characterized in that: The adsorption assembly also includes two rolling wheels, which are disposed on both sides of the magnet, with the top of the rolling wheels higher than the top of the magnet, and the rolling wheels are in rolling connection with the armature plate.

8. The ejector pin switching mechanism according to claim 5, characterized in that: The driving end of the Z-axis drive is provided with a connecting seat, and the adsorption base is fixedly connected to the connecting seat. The connecting seat and the Z-axis base are slidably connected along the Z-axis direction by a second linear guide rail. The second linear guide rail includes a second slide rail disposed on the Z-axis base and a second slider disposed on the connecting seat.

9. A pin switching mechanism according to claim 2, characterized in that: The ejector pin X-axis module includes an ejector pin X-axis base plate, an ejector pin X-axis movable base, an ejector pin X-axis linear guide rail, and an ejector pin X-axis drive component. The ejector pin X-axis movable base is slidably connected to the X-axis base plate via the ejector pin X-axis linear guide rail. The ejector pin X-axis drive component is mounted on the ejector pin X-axis base plate. The ejector pin X-axis movable base is connected to the drive end of the ejector pin X-axis drive component. The ejector pin X-axis drive component is used to drive the ejector pin X-axis movable base to move along the X-axis direction. The ejector pin fixing plate is fixedly connected to the ejector pin X-axis movable base.

10. A pin switching mechanism according to claim 9, characterized in that: The ejector pin Y-axis module includes an ejector pin Y-axis base plate, an ejector pin Y-axis linear guide rail, and an ejector pin Y-axis drive component. The ejector pin Y-axis drive component is mounted on the ejector pin Y-axis base plate. The ejector pin X-axis base plate is slidably connected to the ejector pin Y-axis base plate through the ejector pin Y-axis linear guide rail. The ejector pin X-axis base plate is connected to the drive end of the ejector pin Y-axis drive component. The ejector pin Y-axis drive component is used to drive the ejector pin X-axis base plate to move along the Y-axis direction.