Method for cutting a workpiece using a laser beam and laser cutting machine

DE102025101931A1Undetermined Publication Date: 2026-07-23TRUMPF WERKZEUGMASCHINEN GMBH & CO KG
View PDF 4 Cites 0 Cited by

Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
TRUMPF WERKZEUGMASCHINEN GMBH & CO KG
Filing Date
2025-01-21
Publication Date
2026-07-23

Smart Images

  • Figure 00000000_0000_ABST
    Figure 00000000_0000_ABST
Patent Text Reader

Abstract

A method for cutting a workpiece (12) using a laser beam (14). The laser beam (14) has a first beam region (28) and a second beam region (30). The second beam region (30) surrounds the first beam region (28). The method comprises: providing the laser beam (14), wherein the intensity of the second beam region (30) has a value in the range of 1% to 7%, in particular 3% to 5%, of the intensity of the first beam region (28); and cutting the workpiece (12) using the laser beam (14) by guiding the laser beam (14) over the workpiece (12).
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Beam distribution for laser processing

    DE102016105214A1

  • Processing device for laser processing of a workpiece, method for laser processing of a workpiece

    DE102019125103A1

  • Technique for rounding a workpiece edge

    DE102022128170A1

  • Twin beam laser processing equipment for welding, cutting, drilling or coating metallic or non-metallic materials comprises a light source, a fiber laser located in an optical fiber and a common light and laser radiation focusing device

    DE19859243A1