Aerosol generator and its heating module

Abstract

The present invention provides an aerosol generator and its heating module that can reduce the impact on the service life caused by condensed aerosols inside the device. [Solution] The heating module includes a holder body (1) and a heating element (2), the heating element (2) being inserted into the holder body (1) and having a first end (23) extending from the holder body (1), a path (13) for inserting the heating element (2) being provided inside the holder body (1), the path (13) penetrating the holder body (1), and a sealing member being provided inside the path (13) that surrounds the outside of the heating element (2) and at least a part of it is in contact with the heating element (2), the heating module further includes a protrusion (14) provided on the outer circumference of the holder body (1), the protrusion (14) being provided with a groove (141) whose opening is oriented opposite to the side where the path (13) is located, and a sealing ring (142) being provided inside the groove (141) that surrounds the outside of the groove (141).

Description

Technical Field

[0001] The present invention relates to the field of atomization, and more specifically, to an aerosol generating device and its heating module.

Background Art

[0002] A non-combustion / heating type atomization device is an aerosol generating device that forms an inhalable aerosol by heating an aerosol generation substrate in a low-temperature non-combustion / heating manner. In the prior art, a heating element is installed inside the casing of the aerosol generating device. Most of the aerosol generated by heating the aerosol generation substrate by the heating element is carried out of the device by being inhaled into the user's mouth. However, a small portion of the aerosol condenses inside the device to become liquid and easily flows into the area of the power supply or the motherboard, corroding the power supply or the motherboard and affecting the service life of the aerosol generating device.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The technical problem to be solved by the present invention is to provide an aerosol generating device and its heating module to address the above-mentioned drawbacks in the prior art.

Means for Solving the Problems

[0004] The technical solution adopted by the present invention to solve the technical problem is as follows.

[0005] That is, it constitutes a heating module including a holder body and a heating element for heating an aerosol generation substrate. The heating element is inserted into the holder body, and the first end extends out of the holder body.

[0006] A path for inserting the heating element is provided inside the holder. The path penetrates the holder. A sealing member is provided inside the path that surrounds the outside of the heating element and at least a portion of it is in contact with the heating element.

[0007] Preferably, the heating module further includes a flange provided at a second end of the heating element opposite to the first end for securing the heating element within the holder.

[0008] Preferably, the path includes a first chamber for housing and securing the flange, and a second chamber connected to one side of the first chamber. The second chamber is closer to the first end of the heating element than the first chamber.

[0009] The sealing member includes a first sealing member provided in the second chamber and in contact with the heating element.

[0010] Preferably, the path further includes a first through-hole connected to the second chamber through which the heating element is inserted. The first through-hole is closer to the first end of the heating element than the second chamber.

[0011] The cross-sections of the first chamber, the second chamber, and the first through-hole become progressively smaller.

[0012] Preferably, a pad is provided on the heating element between the first end of the heating element and the flange, and in close proximity to the flange. The pad is located in the second chamber and is surrounded by and in contact with the first sealing member.

[0013] Preferably, the pad is provided with an insulating layer for insulating and protecting the pad.

[0014] Preferably, the heating module further includes an electrode lead wire, one end of which is connected to the pad. The flange is provided with an electrode lead wire through-hole for inserting and securing the electrode lead wire. One end of the electrode lead wire that is separated from the pad passes through the electrode lead wire through-hole in the flange.

[0015] Preferably, the first sealing member includes an adhesive sealing member formed by filling the second chamber with a liquid adhesive, surrounding the heating element, and allowing it to solidify.

[0016] Preferably, the first sealing member includes a silicone sealing member formed by spray-coating liquid silicone to fill the second chamber, surrounding the heating element, and allowing it to solidify.

[0017] Preferably, the path further includes a second through-hole connected to the first chamber, through which the second end of the heating element protrudes. The second through-hole is closer to the second end of the heating element than the first chamber.

[0018] The cross-sections of the first chamber, the second through-hole, and the heating element are progressively smaller.

[0019] Preferably, the sealing member includes a second sealing member provided in the first chamber and in contact with the flange.

[0020] Preferably, the second sealing member is provided between one end of the flange adjacent to the second through hole and the holder body, and surrounds the outside of the heating element.

[0021] Preferably, the second sealing member contains 3M adhesive.

[0022] Preferably, the heating module further includes a projection provided on the outer circumference of the holder body. The projection is provided with a groove whose opening is oriented opposite to the side where the path is located. A sealing ring is provided within the groove, surrounding the outside of the groove.

[0023] Preferably, the holder body includes a holder and a holder base removably attached to the holder. A first sub-path is provided in the holder, and a second sub-path is provided in the holder base. The first sub-path and the second sub-path communicate with each other to form the path.

[0024] Preferably, an engagement structure is provided between the holder and the holder base. The engagement structure includes an engagement port provided on one of the holder and the holder base and an engagement portion provided on the other.

[0025] Preferably, the heating element includes a cylindrical main body and a conical head portion provided at a first end of the cylindrical main body.

[0026] The present invention further constitutes an aerosol generating device including the heating module described in any of the above.

Effects of the Invention

[0027] By implementing the aerosol generating device and its heating module of the present invention, the following beneficial effects are obtained.

[0028] The first end of the heating element is inserted into the aerosol generating substrate from the bottom end of the aerosol generating substrate and into the aerosol generating substrate, and aerosol can be generated by heating the aerosol generating substrate. The sealing member seals the gap between the heating element and the holder body so that aerosol does not flow out of the holder body through the holder body to the outside. Thereby, the flow of the aerosol is blocked, and the purpose of preventing the corrosion of the power supply or the motherboard by preventing the aerosol from entering the area of the power supply or the motherboard is achieved. This is convenient for extending the service life of the aerosol generating device.

[0029] Hereinafter, the present invention will be further described in combination with the drawings and examples.

Brief Description of the Drawings

[0030] [Figure 1] Figure 1 is a schematic diagram of the three-dimensional structure of the heating module in the first embodiment of the present invention. [Figure 2] Figure 2 is a cross-sectional view of the heating module shown in Figure 1. [Figure 3] Figure 3 is a schematic diagram of the three-dimensional structure of the heating module shown in Figure 1 when disassembled. [Figure 4] Figure 4 is a schematic diagram of the connection structure of the heating element, flange, and electrode lead wires shown in Figure 3. [Figure 5] Figure 5 is a cross-sectional view of the holder body shown in Figure 1 when disassembled. [Figure 6] Figure 6 is a cross-sectional view of the holder body shown in Figure 1. [Figure 7] Figure 7 is a cross-sectional view of a heating module in a second embodiment of the present invention. [Modes for carrying out the invention]

[0031] To ensure a clearer understanding of the object, technical solution, and advantages of the present invention, the present invention will be described in more detail below, with the help of examples and drawings. The schematic embodiments and descriptions of the present invention are for interpretation purposes only and do not limit the present invention.

[0032] The present invention provides an aerosol generator. This aerosol generator is a non-combustion heating device that heats and bakes an aerosol generating substrate, thereby releasing an aerosol extract from the substrate in a non-combustion state for the user to inhale. In some embodiments, the aerosol generating substrate may be a cylindrical solid substance containing aromatic plant leaves. Fragrance or aromatic components may also be added to the plant leaves as needed.

[0033] The aerosol generator includes a casing, a heating module, a power supply, and a motherboard, all of which are located within the casing. The heating module is inserted into an aerosol-generating substrate. When the heating module is energized and generates heat, it transfers heat to the aerosol-generating substrate, thereby heating the substrate and releasing aerosols. The power supply is electrically connected to the heating module and supplies electrical energy to it. These are controlled by switches. The motherboard is used to house the associated main control circuits. In some embodiments, the power supply and motherboard may be located below the heating module, or some components of the power supply and motherboard may be located below the heating module.

[0034] Figures 1 and 2 show a heating module in a first embodiment of the present invention. As shown in Figures 1 and 2, the heating module includes a heating element 2 and a holder body 1. The heating element 2 is used to heat and bake the aerosol-generating substrate. The holder body 1 is used to mount the heating element 2 in order to install it inside the aerosol generator.

[0035] The heating element 2 includes a first end 23 and a second end 24 opposite to the first end 23. As shown in Figure 4, the heating element 2 includes a cylindrical body 21 and a conical head portion 22. The cylindrical body 21 includes a first end 212 corresponding to the first end 23 of the heating element 2 and a second end corresponding to the second end 24 of the heating element 2. The conical head portion 22 is provided at the first end 212 of the body 21.

[0036] The heating element 2 is inserted into the holder body 1. The first end 23 of the heating element 2 extends from the holder body 1. The extended portion of the heating element 2 can be inserted into the aerosol-generating substrate from the bottom end of the aerosol-generating substrate. The conical head portion 22 facilitates the insertion of the heating element 2. In some embodiments, the main body 21 may be in the form of a sheet, and the head portion 22 may be acute-angled. The heating element 2 may be manufactured using a ceramic material. In some embodiments, the heating element 2 may also be manufactured using a material such as metal.

[0037] The holder body 1 includes a first end 15 and a second end 16 opposite to the first end 15. A path 13 for inserting the heating element 2 is provided inside the holder body 1. This path 13 passes through the first end 15 and the second end 16 of the holder body 1. The first end 23 of the heating element 2 extends from the first end 15 of the holder body 1, and the second end 24 of the heating element 2 corresponds to the second end 16 of the holder body 1.

[0038] A sealing member is provided within the path 13. This sealing member surrounds the outside of the heating element 2 and at least a portion of it is in contact with the heating element 2. As can be understood, the sealing member seals the gap between the heating element 2 and the holder body 1 so that aerosols do not pass through the holder body 1 and flow out of the holder body 1. This achieves the objective of preventing corrosion of the power supply or motherboard by blocking the flow of aerosols and preventing them from entering the power supply or motherboard area. This is advantageous for extending the service life of the aerosol generator.

[0039] The heating module further includes a flange 3. The flange 3 is provided on the heating element 2 and is used to fix the heating element 2 within the holder body 1. The flange 3 may be provided on the second end 24 of the heating element 2. The flange 3 may be manufactured from ceramic and sintered to form an integral part with the heating element 2. In some embodiments, the flange 3 may be provided with a central through-hole 31 for inserting and fixing the heating element 2. The central through-hole 31 may be located in the center of the flange 3.

[0040] Combining Figure 6, the path 13 includes a first chamber 1311 for housing and securing the flange 3, and a second chamber 1312 connected to one side of the first chamber 1311. The second chamber 1312 is closer to the first end 23 of the heating element 2 than the first chamber 1311. The sealing member includes a first sealing member 51 provided within the second chamber 1312. The first sealing member 51 is in contact with the heating element 2.

[0041] The path 13 further includes a first through-hole 1111 through which the first end 23 of the heating element 2 is inserted. The first through-hole 1111 is connected to the second chamber 1312. The first through-hole 1111 is also closer to the first end 23 of the heating element 2 than the second chamber 1312. The first through-hole 1111 is cylindrical, and its diameter is equal to or slightly larger than the diameter of the heating element 2. The cross-sections of the first chamber 1311, the second chamber 1312, and the first through-hole 1111 are progressively smaller. This prevents the heating element 2 from coming out of the first end 15 of the holder body 1 via the first through-hole 1111.

[0042] The heating module further includes a pad 211. The pad 211 is provided on the heating element 2. Part or all of the pad 211 may be located between the first end 23 of the heating element 2 and the flange 3, and in close proximity to the flange 3. The pad 211 located within the second chamber 1312 is surrounded and in contact with the first sealing member 51. This prevents corrosion of the pad 211.

[0043] In some embodiments, the pad 211 may be provided with an insulating layer to prevent corrosion of the pad 211 by aerosols by insulating and protecting the pad 211. As can be understood, in embodiments in which the pad 211 is provided with an insulating layer, the first sealing member 51 does not have to surround the pad 211, or it may surround only a part of it. In this case as well, it can similarly exert the effect of preventing corrosion of the pad 211. Naturally, in embodiments in which the first sealing member 51 surrounds and contacts the pad 211 and the pad 211 is provided with an insulating layer, the pad 211 can be protected even better.

[0044] The first sealing member 51 may be an adhesive sealing member formed by filling the second chamber 1312 with a liquid adhesive, surrounding the heating element 2, and allowing it to solidify, or it may be a silicone sealing member formed by spray-coating liquid silicone to fill the second chamber 1312, surrounding the heating element 2, and allowing it to solidify. By providing the first sealing member 51, it is possible to prevent aerosols from flowing into the second chamber 1312 from the first through hole 1111 of the holder body 1 and passing through the holder body 1, and corrosion of the pad 211 is prevented.

[0045] To achieve heating and heat control of the heating element 2, a resistive heating circuit and a resistive temperature measuring circuit are printed on the heating element 2. The resistive heating circuit is made of a conductive paste with a preset resistance and supplies heat to the aerosol-generating substrate by generating heat through resistance when current is applied. The resistive temperature measuring circuit is made of a conductive paste with a preset resistance that is considerably smaller than the preset resistance of the resistive heating circuit. Furthermore, the resistive temperature measuring circuit is made of a resistive material with TCR characteristics and obtains the corresponding temperature by acquiring the resistance value when current is applied. Since the temperature of the resistive temperature measuring circuit represents the temperature of the heating element 2, the heat generation of the resistive heating circuit can be controlled by the temperature of the resistive temperature measuring circuit.

[0046] In some embodiments, when the heating element 2 includes a ceramic substrate, the heating circuit and temperature sensing circuit may be printed onto a ceramic film, and then the ceramic film may be wrapped around the ceramic substrate of the heating element 2 and fired together. In some embodiments, the heating circuit and temperature control circuit may also be formed on the heating element 2 by coating its surface.

[0047] The heating module further includes electrode lead wires 4. One end of the electrode lead wires 4 is connected to a pad 211 and is used to draw out the electrodes of the resistive heating circuit and resistive temperature sensing circuit of the heating element 2, and to connect them to the power supply and motherboard to provide power and control. The electrode lead wires 4 include two heating lead wires for drawing out the electrodes of the resistive heating circuit and two temperature sensing lead wires for drawing out the electrodes of the resistive temperature sensing circuit. As can be seen, the two leads in the heating lead wires and the two leads in the temperature sensing lead wires are used to electrically connect to the positive and negative terminals of the power supply, respectively. In some embodiments, the electrode lead wires 4 may also include three leads, one of which may be shared by the resistive heating circuit and the resistive temperature sensing circuit.

[0048] As shown in Figure 4, the electrode lead wire 4 includes a first lead wire 41, a second lead wire 42, a third lead wire 43, and a fourth lead wire 44, and any two lead wires can constitute a heating lead wire or a temperature measuring lead wire. For the sake of explanation, in this embodiment, the first lead wire 41 and the third lead wire 43 will be described as heating lead wires, and the second lead wire 42 and the fourth lead wire 44 will be described as temperature measuring lead wires.

[0049] To make it clear, the number of pads 211 is the same as the number of electrode lead wires 4. The pads 211 include two heating pads provided in the resistive heating circuit and two temperature sensing pads provided in the resistive temperature sensing circuit. For the sake of explanation, the case in which the pads 211 include a first pad, a second pad, a third pad, and a fourth pad corresponding to the first lead wire 41, a second lead wire 42, a third lead wire 43, and a fourth lead wire 44, respectively, will be described as an example. Each pad 211 can be arranged at uniform intervals along the circumferential direction of the heating element 2.

[0050] The first and second pads may be located between the first end 23 of the heating element 2 and the flange 3, and close to the flange 3. These two pads may also be located at the same horizontal height. The third and fourth pads may be located between the second end 24 of the heating element 2 and the flange 3, and close to the flange 3. This arrangement creates a staggered height configuration for each pad, which is convenient for routing and positioning the lead wires.

[0051] The flange 3 is provided with electrode wire through-holes 32 for inserting and fixing electrode lead wires 4. The number of electrode wire through-holes 32 is the same as the number of pads 211 located between the first end 23 of the heating element 2 and the flange 3, and in close proximity to the flange 3, and corresponds to the position of the pads. As a result, one end of the first lead wire 41 and the second lead wire 42 that is separated from the first and second pads passes through the electrode wire through-holes 32 in the flange 3 and is pulled out. In some embodiments, the number of electrode wire through-holes 32 may be the same as the number of pads 211. That is, one end of the third lead wire 43 and the fourth lead wire 44 passes through the electrode wire through-holes 32 and is welded to the third and fourth pads. This is convenient for strengthening the integration between the third lead wire 43 and the fourth lead wire 44 and the heating element 2.

[0052] The path 13 further includes a second through-hole 1211 through which the second end 24 of the heating element 2 protrudes. The second through-hole 1211 is connected to the first chamber 1311. The second through-hole 1211 is also closer to the second end 24 of the heating element 2 than the first chamber 1311. The cross-sections of the first chamber 1311, the second through-hole 1211, and the heating element 2 are progressively smaller. This prevents the heating element 2 from coming out of the second end 16 of the holder body 1 via the second through-hole 1211 and also makes it convenient to attach the second end 24 of the heating element 2.

[0053] The second through-hole 1211 is cylindrical in shape, and its diameter is greater than the diameter of the heating element 2. The third pad and the fourth pad may be partially or entirely housed within the second through-hole 1211. That is, the second through-hole 1211 provides extra space for welding the third lead wire 43 and the fourth lead wire 44 to the heating element 2, or for housing the third lead wire 43 and the fourth lead wire 44.

[0054] The first lead wire 41 and the second lead wire 42 pass through the electrode wire through hole 32 and then extend out of the second through hole 1211, while the third lead wire 43 and the fourth lead wire 44 have one end that is not connected to the corresponding pad extending out of the second through hole 1211. This allows each lead wire to be connected to the power supply and the motherboard. As can be understood, by providing the first sealing member 51 in the second chamber 1312, aerosols are prevented from flowing into the power supply and motherboard area below. This prevents corrosion of the power supply and motherboard by aerosols.

[0055] Furthermore, combining Figures 3 and 6, the heating module also includes a protrusion 14 provided on the outer circumference of the holder body 1. The protrusion 14 is provided with a groove 141 whose opening is oriented opposite to the side where the path 13 is located. A seal ring 142 is provided inside the groove 141, surrounding the outside of the groove 141. As can be understood, by providing the protrusion 14 and the seal ring 142, it is prevented that aerosols will flow from the first end 23 of the heating element 2 through the outer circumference of the holder body 1 to the bottom of the holder body 1, thereby preventing corrosion of the power supply and motherboard. The seal ring 142 may be a seal ring made of silicone material.

[0056] Furthermore, combining Figures 3 and 5, the holder body 1 includes a holder 11 and a holder base 12 that is removably fitted over the holder 11. The holder 11 is provided with a first subpath 131 that penetrates the holder 11, and the holder base 12 is provided with a second subpath 132 that penetrates the holder base 12. The first subpath 131 and the second subpath 132 are in communication to form a path 13. The holder 11 and the holder base 12 are located at the ends of the holder body 1 where the first end 15 and the second end 16 are located, respectively.

[0057] By combining Figure 6, the holder 11 includes a ceiling wall 111 and a first peripheral wall 112 that surrounds the ceiling wall 111. The first through-hole 1111 is provided in the ceiling wall 111. The first peripheral wall 112 surrounds the holder space, which has a stepped cross-section, and the cross-section in the area close to the ceiling wall 111 is smaller than the cross-section in the area away from the ceiling wall 111. The cross-section in the area away from the ceiling wall 111 is adapted to the flange 3. In addition, the first through-hole 1111 and the holder space communicate to form a first sub-path 131.

[0058] The holder base 12 includes a bottom wall 121 and a second peripheral wall 122 that surrounds the bottom wall 121. The second through hole 1211 is provided in the bottom wall 121. The second peripheral wall 122 is cylindrical and surrounds the holder base space. The second through hole 1211 and the holder base space are in communication, forming a second subpath 132.

[0059] The second peripheral wall 122 is positioned on the outer periphery of the first peripheral wall 112, and the end of the first peripheral wall 112 abuts against the bottom wall 121. As a result, the portion of the holder space adjacent to the ceiling wall 111 and the ceiling wall 111 define the second chamber 1312, and the portion of the holder space space space away from the ceiling wall 111 and the bottom wall 121 define the first chamber 1311.

[0060] A connecting structure is provided between the holder 11 and the holder base 12 to connect them so that they can be removably covered. There may be at least two connecting structures, and they may be provided on the holder 11 and the holder base 12 so as to surround them at uniform intervals.

[0061] Combining Figures 3, 5, and 6, the interlocking structure includes an interlocking opening 1221 provided on the holder base 12 and an interlocking portion 1121 provided on the holder 11. The interlocking opening 1221 may be rectangular parallelepiped and can be formed by opening it in the holder base 12. The interlocking portion 1121 may be protruding. The upper end surface of the interlocking portion 1121 is fitted into the corresponding surface of the interlocking opening 1221. Thus, when the interlocking portion 1121 is interlocked into the interlocking opening 1221, the upper end surface of the interlocking portion 1121 is in close contact with the interlocking opening 1221, thereby achieving the interlocking.

[0062] The height of the engaging portion 1121 is equal to the height of the engaging opening 1221. Alternatively, the height of the engaging portion 1121 is slightly less than the height of the engaging opening 1221. This results in a good engaging effect. In some embodiments, the thickness of the engaging portion 1121 is smaller than the thickness of the engaging opening 1221 to facilitate removal. In some embodiments, the side wall of the engaging portion 1121 is provided with an inclined surface in which the thickness gradually decreases from the ceiling wall 111 towards the bottom wall 121, which is convenient for fitting the holder 11 and the holder base 12 together. In some embodiments, the engaging opening 1221 is provided on the holder 11 and the engaging portion 1121 is provided on the holder base 12.

[0063] The overhang 14 can be installed at one end of the holder 11 corresponding to the ceiling wall 111. Furthermore, the upper end surface of the overhang 14 and the upper end surface of the ceiling wall 111 are flush. In some embodiments, the overhang 14 may also be provided on the holder base 12.

[0064] Furthermore, the flange 3 may be a rectangular parallelepiped with one side forming an arc. In some embodiments, the flange 3 may also have other irregular shapes. As can be seen, providing the flange 3 with an irregular shape facilitates the separation of different lead wires and makes it easier to quickly position the direction during installation. In some embodiments, the flange 3 may also have a cylindrical shape or other regular shape.

[0065] To make it clear, the shape and size of the second chamber 1312, surrounded by the first and second walls 112 and 122 respectively, are adapted to the shape and size of the flange 3. This makes it easier to connect each lead wire to the power supply and motherboard when mounting the heat module inside the casing.

[0066] In some embodiments, the casing of the aerosol generator is provided with mounting grooves for attaching a heating module. The mounting grooves are adapted to the shape of the holder body 1. The power supply and motherboard are located below the mounting grooves. This ensures that when the heating module is housed in the mounting grooves, each lead wire is connected to the power supply and motherboard, and the sealing ring 142 can seal the gap between the protrusion 14 and the mounting grooves. When the heating element 2 generates heat and bakes the aerosol-generating substrate, releasing aerosols, the first sealing member 51 prevents the aerosols from flowing into the power supply and motherboard area through the second through-hole 1211, and the sealing ring 142 prevents the aerosols from flowing into the power supply and motherboard area through the gap between the holder 11 and the mounting grooves. This effectively prevents corrosion of the power supply and motherboard by aerosols.

[0067] When manufacturing the heating module by combining Figures 3 and 4, first, the first lead wire 41 and the second lead wire 42 are inserted and fixed into the electrode wire through-hole 32 of the flange 3. Furthermore, the first lead wire 41 and the second lead wire 42 are welded to the heating element 2 via the first pad and the second pad, respectively. Next, the third lead wire 43 and the fourth lead wire 44 are welded to the heating element 2 via the third pad and the fourth pad, respectively. This forms the assembled heating element.

[0068] The heating element assembly includes a first end corresponding to the first end 23 of the heating element 2 and a second end corresponding to the second end 24 of the heating element 2. The first end of the heating element assembly is inserted through the first subpath 131 of the holder 11 and passes through the first through-hole 1111, and the second end of the heating element assembly is inserted through the second subpath 132 of the holder base 12 and passes through the second through-hole 1211. Then, the engaging portion 1121 of the holder 11 is engaged with the engaging opening 1221 of the holder base 12 so that they correspond to each other, and the installation of the heating module is completed. As can be understood, the above manufacturing steps are just one method for manufacturing the heating module, and this embodiment does not limit the welding order of the lead wires or the installation order of each component.

[0069] Since each lead wire can be made using lead wires of approximately the same length, the extension lengths of the first lead wire 41, second lead wire 42, third lead wire 43, and fourth lead wire 44 are different in the heat-generating assembly. Furthermore, in embodiments where the flange 3 has an irregular shape, it is possible to easily distinguish between different lead wires. As a result, when the heat-generating module is installed in the mounting groove of the casing, each lead wire can be connected to the appropriate connection port on the power supply and motherboard.

[0070] Figure 7 shows a heating module in a second embodiment of the present invention. The differences between this heating module and the first embodiment are as follows: The sealing member includes a second sealing member 52. The second sealing member 52 is provided in the first chamber 1311. Furthermore, the second sealing member 52 is in contact with the flange 3. Specifically, the second sealing member 52 is provided between one end of the flange 3 adjacent to the second through hole 1211 and the holder body 1, surrounding the outside of the heating element 2 and in contact with the flange 3 and the holder body 1.

[0071] In an embodiment in which the holder body 1 includes a holder 11 and a holder base 12 that is removably fitted over the holder 11, as shown in Figure 7, the second sealing member 52 is provided between the flange 3 and the end of the first circumferential wall 112 and the bottom wall 121. The second sealing member 52 seals the gap between the flange 3 and the first circumferential wall 112 and the bottom wall 121, as well as the gap between the first circumferential wall 112 and the bottom wall 121. The second sealing member 52 has an oil-proof and waterproof function. The second sealing member 52 may be a 3M adhesive or may be implemented with 3M double-sided tape. In some embodiments, the second sealing member 52 may also be another back-side adhesive that has a sealing function.

[0072] To make it clear, the second sealing member 52 seals the gap between the flange 3 in the first chamber 1311 and the holder body 1, preventing aerosols from flowing through the first through-hole 1111, the second chamber 1312, and the first chamber 1311 to the power supply and motherboard area through the second through-hole 1211.

[0073] As can be understood, in one embodiment, the first sealing member 51 of the second chamber 1312 and the second sealing member 52 of the first chamber 1311 may be selected and provided, but the sealing effect is better when both are selected and provided at the same time. Also, as can be understood, in an embodiment in which the first sealing member 51 is not provided in the second chamber 1312, an insulating layer is provided on all of the pads 211 in the second chamber 1312.

[0074] To make it clear, in the first and second embodiments, the insulating layer is used to prevent corrosion of the pad 211 by aerosols by insulating and protecting the pad 211. In some embodiments, insulating protection of the pad 211 can be achieved by wrapping the pad 211 with the insulating layer. Specifically, when soldering the lead wire to the corresponding pad 211, the solder passes through the insulating layer and is firmly welded to the corresponding pad 211. The insulating layer may have openings to allow the solder to pass through. In some embodiments, after soldering the lead wire to the corresponding pad 211, the solder and the pad 211 are simultaneously wrapped with the insulating layer. The insulating layer may also simultaneously wrap the lead wire portion of the solder area.

[0075] To ensure that this is understood, the above embodiments merely represent preferred embodiments of the present invention and, although described in a relatively specific and detailed manner, should not be interpreted as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical characteristics and make some modifications and improvements, provided they do not depart from the concept of the present invention, and all of these fall within the scope of protection of the present invention. Therefore, equivalent modifications and additions made within the scope of the claims of the present invention shall all fall within the scope covered by the claims of the present invention. [Explanation of Symbols]

[0076] 1 holder 11 holder 111 Ceiling and Wall 1111 First through hole 112 1st peripheral wall 1121 Connecting part 12 holder base 121 Bottom wall 1211 Second through hole 122 Second peripheral wall 1221 Connection port 13 routes 131 First Subpath 132 Second Subpath 1311 Room 1 1312 Room 2 14 Overhang 141 groove 142 Seal ring 15 1st end 16 2nd end 2 Heating element 21 Main unit 211 pad 212 1st end 22 Head section 23 1st end 24 2nd end 3 flanges 31 Center through hole 32 Electrode wire through hole 4 electrode lead wires 41. First lead wire 42. Second lead wire 43 Third lead wire 44. Fourth lead wire 51 First sealing member 52 Second sealing member

Claims

1. The device comprises a holder body (1) and a heating element (2) for heating an aerosol-generating substrate, wherein the heating element (2) is inserted into the holder body (1) and its first end (23) extends from the holder body (1). A path (13) for inserting the heating element (2) is provided inside the holder body (1), the path (13) penetrates the holder body (1), and a sealing member is provided inside the path (13) that surrounds the outside of the heating element (2) and at least a portion of it is in contact with the heating element (2). The heating module further includes a protrusion (14) provided on the outer circumference of the holder body (1), the protrusion (14) having a groove (141) whose opening is oriented opposite to the side where the path (13) is located, and a sealing ring (142) surrounding the outside of the groove (141) is provided within the groove (141), characterized in that the heating module further includes a protrusion (14) provided on the outer circumference of the holder body (1), the protrusion (14) having a groove (141) with an opening oriented opposite to the side where the path (13) is located, and a sealing ring (142) surrounding the outside of the groove (141).

2. The heating module according to claim 1, further comprising a flange (3) provided at a second end (24) opposite to the first end (23) of the heating element (2) for fixing the heating element (2) within the holder body (1).

3. The path (13) includes a first chamber (1311) for housing and fixing the flange (3), and a second chamber (1312) connected to one side of the first chamber (1311), wherein the second chamber (1312) is closer to the first end (23) of the heating element (2) than the first chamber (1311). The heating module according to claim 2, characterized in that the sealing member includes a first sealing member (51) provided in the second chamber (1312) and in contact with the heating element (2).

4. The aforementioned path (13) further includes a first through-hole (1111) connected to the second chamber (1312) through which the heating element (2) is inserted, and the first through-hole (1111) is closer to the first end (23) of the heating element (2) than the second chamber (1312). The heating module according to claim 3, characterized in that the cross-sections of the first chamber (1311), the second chamber (1312), and the first through-hole (1111) are progressively smaller.

5. The heating module according to claim 3, characterized in that the first sealing member (51) includes an adhesive sealing member formed by filling the second chamber (1312) with a liquid adhesive, surrounding the heating element (2), and allowing it to solidify.

6. The heating module according to claim 3, characterized in that the first sealing member (51) includes a silicone sealing member formed by spray-coating liquid silicone to fill the second chamber (1312), surrounding the heating element (2), and allowing it to solidify.

7. The aforementioned path (13) further includes a second through-hole (1211) connected to the first chamber (1311) and through which the second end (24) of the heating element (2) protrudes, the second through-hole (1211) being closer to the second end (24) of the heating element (2) than the first chamber (1311), The heating module according to claim 3, characterized in that the cross-sections of the first chamber (1311), the second through-hole (1211), and the heating element (2) are progressively smaller.

8. The heating module according to claim 7, characterized in that the sealing member includes a second sealing member (52) provided in the first chamber (1311) and in contact with the flange (3).

9. The heating module according to claim 8, characterized in that the second sealing member (52) is provided between one end of the flange (3) adjacent to the second through hole (1211) and the holder body (1), and surrounds the outside of the heating element (2).

10. The heating module according to claim 8, characterized in that the second sealing member (52) contains 3M adhesive.

11. The heating module according to claim 1, wherein the holder body (1) includes a holder (11) and a holder base (12) that is removably fitted over the holder (11), the holder (11) is provided with a first subpath (131), the holder base (12) is provided with a second subpath (132), and the first subpath (131) and the second subpath (132) are in communication to form the path (13).

12. The heating module according to claim 11, wherein a connection structure is provided between the holder (11) and the holder base (12), and the connection structure includes a connection port (1221) provided on one of the holder (11) and the holder base (12) and a connection portion (1121) provided on the other.

13. The heating module according to claim 1, characterized in that the heating element (2) includes a cylindrical body (21) and a conical head portion (22) provided at the first end (212) of the cylindrical body (21).

14. An aerosol generator characterized by including a heating module according to any one of claims 1 to 13 above.

Images